| submitted | available | document details (if available) | source link |
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| February 09 2019 | April 09 2019 | Microsoft Word - XMR201705BG96NA_Hardware_Design_V1.0_Preliminary_20170428.docx dell Acrobat Distiller 9.0.0 (Windows) |
| various | Users Manual | Users Manual | 2.09 MiB | February 09 2019 / April 09 2019 |
BG Ha G96 rdw 6-NA A re D war Des sign n LTEM Module S Series Rev. BG96-NA A_Hardw are_Desi ign_V1.0 Date:
2017-04 4-28 wwww.quectel.com LTE Module Series BG96-NA Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:
http://www.quectel.com/support/salesupport.aspx For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/techsupport.aspx Or Email to: Support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATIONCONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATIONOF QUECTEL CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2017. All rights reserved. BG96-NA_Hardware_Design Confidential / Released 1 / 64 LTE Module Series BG96-NA Hardware Design About the Document History Revision Date Author Description 1.0 2017-04-28 Allen WANG/
Daryl DU Initial BG96-NA_Hardware_Design Confidential / Released 2 / 64 LTE Module Series BG96-NA Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 3 Table Index ............................................................................................................................................... 5 Figure Index .............................................................................................................................................. 6 1 Introduction ....................................................................................................................................... 7 1.1. Safety Information ................................................................................................................... 8 2 Product Concept ............................................................................................................................. 12 2.1. General Description .............................................................................................................. 12 Key Features ......................................................................................................................... 13 2.2. 2.3. Functional Diagram ............................................................................................................... 14 Evaluation Board ................................................................................................................... 15 2.4. 3.6. 3 Application Interfaces ..................................................................................................................... 16 3.1. General Description .............................................................................................................. 16 Pin Assignment ..................................................................................................................... 17 3.2. 3.3. Pin Description ...................................................................................................................... 18 3.4. Operating Modes .................................................................................................................. 23 3.5. Power Saving ........................................................................................................................ 23 3.5.1. Sleep Mode.................................................................................................................. 23 3.5.1.1. UART Application ............................................................................................... 24 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 24 3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 25 3.5.1.4. USB Application without USB Suspend Function ............................................... 26 3.5.2. Airplane Mode .............................................................................................................. 27 Power Supply ........................................................................................................................ 27 3.6.1. Power Supply Pins ....................................................................................................... 27 3.6.2. Decrease Voltage Drop ................................................................................................ 28 3.6.3. Monitor the Power Supply ............................................................................................ 29 Turn on and off Scenarios ..................................................................................................... 29 3.7.1. Turn on Module Using the PWRKEY ........................................................................... 29 3.7.2. Turn off Module ............................................................................................................ 31 3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 31 3.7.2.2. Turn off Module Using AT Command ................................................................. 31 Reset the Module .................................................................................................................. 31 3.8. 3.9.
(U)SIM Card Interfaces ......................................................................................................... 33 3.10. USB Interface ........................................................................................................................ 35 3.11. UART Interfaces .................................................................................................................... 37 3.12. I2C Interfaces ........................................................................................................................ 39 3.13. Network Status Indication ..................................................................................................... 40 3.14. STATUS ................................................................................................................................ 41 3.15. Behavior of the RI ................................................................................................................. 41 3.7. BG96-NA_Hardware_Design Confidential / Released 3 / 64 LTE Module Series BG96-NA Hardware Design 3.16. USB_BOOT Interface ............................................................................................................ 42 4 GNSS Receiver ................................................................................................................................ 43 4.1. General Description .............................................................................................................. 43 4.2. GNSS Performance .............................................................................................................. 43 Layout Guidelines ................................................................................................................. 44 4.3. 5 Antenna Interfaces .......................................................................................................................... 45 5.1. MainAntenna Interface .......................................................................................................... 45 5.1.1. Pin Definition ................................................................................................................ 45 5.1.2. Operating Frequency ................................................................................................... 45 5.1.3. Reference Design of RF Antenna Interface ................................................................. 45 5.1.4. Reference Design of RF Layout ................................................................................... 46 5.2. GNSS Antenna Interface ....................................................................................................... 48 5.3. Antenna Installation .............................................................................................................. 49 5.3.1. Antenna Requirements ................................................................................................ 49 5.3.2. Recommended RF Connector for Antenna Installation ................................................ 50 6 Electrical, Reliability and Radio Characteristics .......................................................................... 52 Absolute Maximum Ratings .................................................................................................. 52 6.1. 6.2. Power Supply Ratings ........................................................................................................... 52 6.3. Operating Temperature ......................................................................................................... 53 Current Consumption ............................................................................................................ 53 6.4. RF Output Power .................................................................................................................. 54 6.5. 6.6. RF Receiving Sensitivity ....................................................................................................... 54 Electrostatic Discharge ......................................................................................................... 54 6.7. 7 Mechanical Dimensions.................................................................................................................. 55 7.1. Mechanical Dimensions of the Module.................................................................................. 55 Recommended Footprint ....................................................................................................... 57 7.2. 7.3. Design Effect Drawings of the Module .................................................................................. 58 8 Storage, Manufacturing and Packaging ........................................................................................ 59 8.1. Storage ................................................................................................................................. 59 8.2. Manufacturing and Welding .................................................................................................. 60 Packaging ............................................................................................................................. 60 8.3. 9 Appendix A References .................................................................................................................. 61 10 Appendix B GPRS Coding Schemes ............................................................................................. 65 11 Appendix C GPRS Multi-slot Classes ............................................................................................ 66 12 Appendix D EDGE Modulation and Coding Schemes .................................................................. 67 BG96-NA_Hardware_Design Confidential / Released 4 / 64 LTE Module Series BG96-NA Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF BG96-NA MODULE ................................................................................ 12 TABLE 2: KEY FEATURES OF BG96-NA ......................................................................................................... 13 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 18 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 18 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 23 TABLE 6: VBAT AND GND PINS ....................................................................................................................... 28 TABLE 7: PWRKEY PIN DESCRIPTION .......................................................................................................... 29 TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 32 TABLE 9: PIN DEFINITION OF THE (U)SIM CARD INTERFACES ................................................................. 33 TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 35 TABLE 11: PIN DEFINITION OF UART1 INTERFACE ..................................................................................... 37 TABLE 12: PIN DEFINITION OF UART2 INTERFACE ..................................................................................... 37 TABLE 13:LOGIC LEVELS OF DIGITAL I/O ..................................................................................................... 38 TABLE 14: PIN DEFINITION OF I2C INTERFACES ......................................................................................... 39 TABLE 15: PIN DEFINITION OF NETWORK STATUS INDICATOR ................................................................ 40 TABLE 16: WORKING STATE OF THE NETWORK STATUS INDICATOR ...................................................... 40 TABLE 17: PIN DEFINITION OF STATUS ........................................................................................................ 41 TABLE 18: DEFAULT BEHAVIOR OF RI ........................................................................................................... 42 TABLE 19: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 42 TABLE 20: GNSS PERFORMANCE ................................................................................................................. 43 TABLE 21: PIN DEFINITION OF THE RF ANTENNA INTERFACE .................................................................. 45 TABLE 22: MODULE OPERATING FREQUENCIES ........................................................................................ 45 TABLE 23: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 48 TABLE 24: GNSS FREQUENCY ....................................................................................................................... 48 TABLE 25: MAIN ANTENNA REQUIREMENTS................................................................................................ 49 TABLE 26: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 52 TABLE 27: POWER SUPPLY RATINGS ........................................................................................................... 52 TABLE 28: OPERATING TEMPERATURE ........................................................................................................ 53 TABLE 29: CONDUCTED RF OUTPUT POWER ............................................................................................. 54 TABLE 30: BG96-NA CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 54 TABLE 31: RELATED DOCUMENTS ............................................................................................................... 61 TABLE 32: TERMS AND ABBREVIATIONS ...................................................................................................... 61 TABLE 33: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 65 TABLE 34: GPRS MULTI-SLOT CLASSES ...................................................................................................... 66 TABLE 35: EDGE MODULATION AND CODING SCHEMES ........................................................................... 67 BG96-NA_Hardware_Design Confidential / Released 5 / 64 LTE Module Series BG96-NA Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 15 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 17 FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 24 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 25 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 26 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 26 FIGURE 7: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 28 FIGURE 8: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 29 FIGURE 9: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 30 FIGURE 10: TIMING OF TURNING ON MODULE ........................................................................................... 30 FIGURE 11: TIMING OF TURNING OFF MODULE .......................................................................................... 31 FIGURE 12: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 32 FIGURE 13: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 32 FIGURE 14: TIMING OF RESETTING MODULE ............................................................................................. 33 FIGURE 15: REFERENCE CIRCUIT OF (U)SIM CARD INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR ............................................................................................................................................ 34 FIGURE 16: REFERENCE CIRCUIT OF (U)SIM CARD INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR ............................................................................................................................................ 34 FIGURE 17: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 36 FIGURE 18: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 38 FIGURE 19: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 39 FIGURE 20: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 40 FIGURE 21: REFERENCE CIRCUIT OF THE STATUS ................................................................................... 41 FIGURE 22: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 42 FIGURE 23: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 46 FIGURE 24: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 46 FIGURE 25: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 47 FIGURE 26: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND) .................................................................................................................................................. 47 FIGURE 27: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND) .................................................................................................................................................. 47 FIGURE 28: REFERENCE CIRCUIT OF GNSS ANTENNA INTERFACE ........................................................ 49 FIGURE 29: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 50 FIGURE 30: MECHANICALS OF UF.L-LP CONNECTORS ............................................................................. 50 FIGURE 31: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 51 FIGURE 32: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 55 FIGURE 33: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 56 FIGURE 34: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 57 FIGURE 35: TOP VIEW OF THE MODULE ...................................................................................................... 58 FIGURE 36: BOTTOM VIEW OF THE MODULE .............................................................................................. 58 FIGURE 37: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 60 BG96-NA_Hardware_Design Confidential / Released 6 / 64 LTE Module Series BG96-NA Hardware Design 1 Introduction This document defines the BG96-NAmodule and describes its air interface and hardware interface which are connected with your application. This document can help you quickly understand module interface specifications, electrical andmechanical details, etc. Associated with application note and user guide, you can use BG96-NA module to design and set up mobile applications easily. BG96-NA_Hardware_Design Confidential / Released 7 / 64 LTE Module Series BG96-NA Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating BG96-NA module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident.Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals,clinics or other health care facilities. These requests are desinged to prevent possible interference with sensitive medical equipment. Cellular terminals or mobiles operatingover radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid (U)SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres includefuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. BG96-NA_Hardware_Design Confidential / Released 8 / 64 LTE Module Series BG96-NA Hardware Design 1.2 FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-
averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201705BG96NA 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:
LTE Band2:8.00dBi LTE Band4:5.00dBi LTE Band12:8.734dBi LTE Band13:9.173dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 BG96-NA_Hardware_Design Confidential / Released 9 / 64 LTE Module Series BG96-NA Hardware Design If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR201705BG96NA or Contains FCC ID: XMR201705BG96NA must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. BG96-NA_Hardware_Design Confidential / Released 10 / 64 LTE Module Series BG96-NA Hardware Design This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements BG96-NA_Hardware_Design Confidential / Released 11 / 64 LTE Module Series BG96-NA Hardware Design 2 Product Concept 2.1. General Description BG96-NAmodule is anembeddedIoT(LTE CatM1) wireless communication modulewithout receive diversity. It supportsHalf-duplex LTE-FDD wireless communication, whichprovides data connectivity on LTE-FDDnetworks. The following table shows the frequency bands of BG96-NA module. Table 1: Frequency Bands of BG96-NA Module Module LTE Bands GSM Rx-diversity BG96-NA FDD: B2/B4/B12/B13 Not Supported Not Supported GNSS (Optional) GPS, GLONASS,BeiDou/Compass, Galileo, QZSS With a compact profile of 22.5mm 26.5mm 2.3mm, BG96-NA can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. BG96-NA is an SMD type module which can be embedded into application through its 102 LGA pads. BG96-NAsupports internet service protocols like TCP, UDP and PPP. Extended AT commands have been developed for customers to use these internet service protocols easily. BG96-NA_Hardware_Design Confidential / Released 12 / 64 LTE Module Series BG96-NA Hardware Design 2.2. Key Features The following table describes the detailed features of BG96-NA module. Table 2: Key Features of BG96-NA Features Details Power Supply Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Transmitting Power Class 3 (23dBm2.7dB) for LTE-FDD bands LTE Features Internet Protocol Features*
SMS*
Support up to LTE Cat M1 Support 1.08MHz RF bandwidth Support SISO in DL direction Cat M1: Max. 375kbps (DL)/375kbps (UL) Support TCP/UDP/PPP protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default
(U)SIM Interface Support (U)SIM card: 1.8V, 3.0V USB Interface UART Interface AT Commands Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging and firmware upgrade SupportUSB drivers forWindows XP, Windows Vista, Windows 7, Windows 8/8.1, Windows 10, Windows CE 5.0/6.0/7.0*,Linux 2.6/3.x/4.1,Android 4.x/5.x/6.0 UART1:
Used for AT command communication and data transmission Baud rate reach up to 3000000bps; 115200bps by default Support RTS and CTS hardware flow control UART2:
Used for module debugging and log output 115200bps baud rate 3GPP TS 27.007 and 3GPP TS 27.005 AT commands, as well as Quectel enhanced AT commands Network Indication OneNETLIGHT pin for network connectivity status indication BG96-NA_Hardware_Design Confidential / Released 13 / 64 LTE Module Series BG96-NA Hardware Design Antenna Interfaces Physical Characteristics Temperature Range Including main antenna (ANT_MAIN) and GNSS antenna (ANT_GNSS) interfaces Size: 22.5mm 26.5mm2.3mm Weight: 3.1g Operation temperature range: -35C ~ +75C1) Extended temperature range: -40C ~ +85C2) Firmware Upgrade USB interface and DFOTA*
RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain SMS, data transmission, etc. There is no unrecoverable malfunction. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP compliant again. 3. * means under development. 2.3. Functional Diagram The following figure shows a block diagram of BG96-NA and illustrates the major functional parts. Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces BG96-NA_Hardware_Design Confidential / Released 14 / 64 LTE Module Series BG96-NA Hardware Design Figure 1: Functional Diagram NOTE
* means under development. 2.4. Evaluation Board In order to help customers develop applications conveniently with BG96-NA, Quectel supplies theevaluation board (EVB), USB data cable, earphone, antenna and other peripherals to control or test the module. BG96-NA_Hardware_Design Confidential / Released 15 / 64 LTE Module Series BG96-NA Hardware Design 3 Application Interfaces
(U)SIM card interfaces 3.1. General Description BG96-NAis equipped with 62-pin 1.1mm pitch SMT pads plus 40-pin ground pads and reserved pads that can be connected to customers cellular application platform. The subsequent chapters will provide detailed description of interfaces listed below:
Power supply USB interface UART interfaces Network status indication USB_BOOT interface BG96-NA_Hardware_Design Confidential / Released 16 / 64 LTE Module Series BG96-NA Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of the BG96-NA module. Figure 2: Pin Assignment (Top View) NOTES 1. Keep all RESERVEDpins and unused pins unconnected. 2. GND pads should be connected to ground in the design. 3. 4. 1)PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
* means under development. BG96-NA_Hardware_Design Confidential / Released 17 / 64 LTE Module Series BG96-NA Hardware Design 3.3. Pin Description The following tables show the pin definition and description of BG96-NA. Table 3: I/O Parameters Definition Type IO DI DO PI PO AI AO OD Description Bidirectional Digital input Digital output Power input Power output Analog input Analog output Open drain Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description VBAT_BB 32, 33 VBAT_RF 52,53 PI PI VDD_EXT 29 PO Power supply for module baseband part. Power supply for module RF part. Provide 1.8V for external circuit. DC Characteristics Vmax=4.3V Vmin=3.3V Vnorm=3.8V Vmax=4.3V Vmin=3.3V Vnorm=3.8V Vnorm=1.8V IOmax=50mA Comment Power supply for external GPIOs pull up circuits. GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~102 Ground BG96-NA_Hardware_Design Confidential / Released 18 / 64 LTE Module Series BG96-NA Hardware Design Turn on/off Pin Name Pin No. I/O Description PWRKEY 15 RESET_N 17 Status Indication DI DI Turnon/off the module Reset the module Pin Name Pin No. I/O Description STATUS 20 NETLIGHT 21 USB Interface OD DO Indicate the modules operating status. Indicate the modulesnetwor k activity status. Pin Name Pin No. I/O Description USB_VBUS USB_DP 8 9 USB_DM 10
(U)SIM Interface PI USB detection IO IO USB differential data bus (+) USB differential data bus (-) DC Characteristics VIHmax=2.1V VIHmin=1.3V VILmax=0.5V VIHmax=2.1V VIHmin=1.3V VILmax=0.5V Comment The output voltage is0.8V because of thediode drop in theQualcomm chipset. If unused, keep this pin open. DC Characteristics Comment VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep this pin open. VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. DC Characteristics Vmax=5.25V Vmin=3.0V Vnorm=5.0V Compliant with USB 2.0 standard specification. Compliant with USB 2.0 standard specification. Comment Require differential impedance of 90ohm. Require differential impedance of 90ohm. Pin Name Pin No. I/O Description USIM_GND 47 USIM_VDD 43 PO Specified ground for
(U)SIM card Power supply for (U)SIM card DC Characteristics Comment For 1.8V(U)SIM:
Vmax=1.9V Vmin=1.7V Either 1.8V or 3.0V is supported by the module automatically. BG96-NA_Hardware_Design Confidential / Released 19 / 64 LTE Module Series BG96-NA Hardware Design For 3.0V(U)SIM:
Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V (U)SIM:
VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V DC Characteristics VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V 1.8V power domain. If unused, keep it open. Comment 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. USIM_DATA 45 IO Data signal of
(U)SIM card USIM_CLK 46 DO Clock signal of
(U)SIM card USIM_RST 44 DO Reset signal of
(U)SIM card USIM_ PRESENCE 42 DI
(U)SIM card insertion detection UART1 Interface Pin Name Pin No. I/O Description RI DCD RTS 39 38 37 DO Ring indicator DO DI Data carrier detection Request to send BG96-NA_Hardware_Design Confidential / Released 20 / 64 LTE Module Series BG96-NA Hardware Design CTS TXD RXD 36 35 34 DO Clear to send DO Transmit data DI Receive data DTR 30 DI Data terminal ready, sleep mode control. UART2 Interface Pin Name Pin No. I/O Description DBG_TXD 23 DO Transmit data DBG_RXD 22 DI Receive data VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V DC Characteristics VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Pull-up by default. Low level wakes up the module. If unused, keep it open. Comment 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 40 OD I2C_SDA 41 OD RF Interface I2C serial clock. Used for external codec. I2C serial data. Used for external codec. External pull-up resistor is required. 1.8V only. If unused, keep it open. External pull-up resistor is required. 1.8V only. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 60 IO Main antenna interface 50impedance BG96-NA_Hardware_Design Confidential / Released 21 / 64 LTE Module Series BG96-NA Hardware Design ANT_GNSS 49 AI GNSS antenna interface 50impedance If unused, keep it open. Other Pins Pin Name Pin No. I/O Description PSM_IND*
1 DO Power saving mode indicator USB_BOOT 75 DI Force the module to boot from USB port. ADC Interface DC Characteristics VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V Comment 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ADC1 2 ADC0 24 RESERVED Pins AI AI General purpose analog to digital converter General purpose analog to digital converter Voltage range:
0.3V to VBAT_BB If unused, keep it open. Voltage range:
0.3V to VBAT_BB If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment 4~7,11~14,1 6,18,19, 25~28,51,56
,57, 63~66,76~7 8, 83~88, 92~99 RESERVED NOTES Reserved Keep these pins unconnected. 1. Keep all RESERVED pins and unused pins unconnected. 2. * meansunder development. BG96-NA_Hardware_Design Confidential / Released 22 / 64 LTE Module Series BG96-NA Hardware Design 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Idle Data Software is active. The module hasregistered on network, and it is ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network settingand data transfer rate. AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMSand TCP/UDP data from the network normally. A UE may adopt the PSM (Power Saving Mode) for reducing its power consumption. PSM is similar to power-off, but the UE remains registered on the network and there is no need to re-attach or re-establish PDN connections. When the module is successfully entered into the PSM, PSM_IND* outputs a low level. In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. Normal Operation Minimum Functionality Mode Airplane Mode Sleep Mode PSM*
Power Down Mode NOTES In PSM or sleep mode, it is recommended to use UART interface for module connection. USB connection is NOT recommended as it will cause increase in power consumption.
* means under development. 1. 2. 3.5. Power Saving 3.5.1. Sleep Mode BG96-NA is able to reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedure of BG96-NA module. BG96-NA_Hardware_Design Confidential / Released 23 / 64 LTE Module Series BG96-NA Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode. Execute AT+QSCLK=1commandto enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. When BG96-NA has URC to report, RI signal will wake up the host. Refer to Chapter 3.15for details about RI behavior. AP_READY* will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG=apreadycommand for details. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter into sleep mode. Execute AT+QSCLK=1commandto enable the sleep mode. Ensure the DTR is held in high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters into suspended state. BG96-NA_Hardware_Design Confidential / Released 24 / 64 LTE Module Series BG96-NA Hardware Design The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to BG96-NAthrough USB will wake up the module. When BG96-NAhas URC to report, the module will send remote wake-up signals viaUSB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are threepreconditions to let the module enter into the sleep mode. Execute AT+QSCLK=1commandto enable sleep mode. Ensure the DTR is held in high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters into suspended state. The following figure shows the connection between the module and the host. BG96-NA_Hardware_Design Confidential / Released 25 / 64 LTE Module Series BG96-NA Hardware Design Figure 5: Sleep Mode Application with RI Sending data to BG96-NAthrough USB will wake up the module. When BG96-NAhas URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, you should disconnect USB_VBUS with additional control circuit to let the module enter into sleep mode. Execute AT+QSCLK=1commandto enable the sleep mode. Ensure the DTR is held in high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function Switching onthe power switch to supply power to USB_VBUS will wake up the module. BG96-NA_Hardware_Design Confidential / Released 26 / 64 LTE Module Series BG96-NA Hardware Design NOTE 1. Please pay attention to the level match shown in dotted line between the module and the host. Refer to document [1] for more details about BG96-NA power management application.
* means under development. 2. 3.5.2. Airplane Mode When the module enters into airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. Hardware:
W_DISABLE# is pulled up by default.Driving it to low level will let the module enter into airplane mode. Software:
AT+CFUNcommand provides choice of the functionality level. AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG=airplanecontrol command. The command is still under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins BG96-NA provides four VBAT pins for connection with anexternal power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for module RF part. Two VBAT_BB pins for module baseband part. The following table shows the details of VBAT pins and ground pins. BG96-NA_Hardware_Design Confidential / Released 27 / 64 LTE Module Series BG96-NA Hardware Design Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52,53 VBAT_BB 32,33 Power supply for module RF part. Power supply for module baseband part. 3.3 3.3 3.8 3.8 4.3 4.3 3, 31, 48,50, 54, 55,58, 59, 61,62, 67~74, 79~82,89~91, 100~102 GND Ground
-
-
-
V V
-
3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3Vto4.3V. Please make sure that the input voltage will never drop below 3.3V. To decrease voltage drop, a bypass capacitor of about 100F with low ESR should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be used to provide the low ESR. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm, andthe width of VBAT_RF trace should be no less than 2mm.In principle, the longerthe VBAT trace is, the wider it will be. Three ceramic capacitors (100nF, 33pF, 10pF) are recommended to be applied to the VBAT pins. These capacitors should be placed close to the VBAT pins. In addition, in order to get a stable power source, it is suggested that you should use a zener diode of which reverse zener voltage is 5.1V and dissipation power is more than 0.5W. The following figure shows the star structure of the power supply. Figure 7: Star Structure of the Power Supply BG96-NA_Hardware_Design Confidential / Released 28 / 64 LTE Module Series BG96-NA Hardware Design 3.6.3. Monitor the Power Supply AT+CBC command can be usedto monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Turn on and off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: PWRKEY Pin Description Pin Name Pin No. Description DC Characteristics Comment PWRKEY 15 Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is0.8V because of thediode drop in theQualcomm chipset. When BG96-NA is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 100ms. It is recommended to use an open drain/collector driver to control the PWRKEY.After STATUS pin outputting a high level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Figure 8: Turn on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, aTVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shownin the following figure. BG96-NA_Hardware_Design Confidential / Released 29 / 64 LTE Module Series BG96-NA Hardware Design Figure 9: Turn on the Module Using Keystroke The turn on scenario is illustrated in the following figure. Figure 10: Timing of Turning on Module NOTE Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. BG96-NA_Hardware_Design Confidential / Released 30 / 64 LTE Module Series BG96-NA Hardware Design 3.7.2. Turn off Module The following procedures can be used to turn off the module:
Normal power down procedure: Turn off the module using the PWRKEY pin. Normal power down procedure: Turn off the module using AT+QPOWDcommand. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage(the specific time is TBD), the module will execute power-down procedure after the PWRKEY is released. The power-down scenario is illustrated inthe following figure. Figure 11: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWDcommandto turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer todocument [2] for details about AT+QPOWDcommand. 3.8. Reset the Module The RESET_N pin can be used to reset the module.The module can be reset by driving RESET_N to a low level voltage for time between Treset_min and Treset_max. BG96-NA_Hardware_Design Confidential / Released 31 / 64 LTE Module Series BG96-NA Hardware Design Table 8: RESET_N Pin Description Pin Name Pin No. Description DC Characteristics Comment RESET_N 17 Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 12: Reference Circuit of RESET_N by Using Driving Circuit Figure 13: Reference Circuit of RESET_N by Using Button BG96-NA_Hardware_Design Confidential / Released 32 / 64 LTE Module Series BG96-NA Hardware Design The reset scenario is illustrated inthe following figure. Figure 14: Timing of Resetting Module NOTES 1. Use RESET_N only when turning off the module by AT+QPOWDcommand and PWRKEY pin failed. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Card Interfaces The(U)SIM card interface circuitrymeets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and 3.0V (U)SIM cards are supported. Table 9: Pin Definition of the (U)SIMCard Interfaces Pin Name Pin No. I/O Description Comment USIM_VDD USIM_DATA USIM_CLK USIM_RST USIM_ PRESENCE 43 45 46 44 42 PO Power supply for (U)SIM card IO Data signal of (U)SIM card DO Clock signal of (U)SIM card DO Reset signal of (U)SIM card DI
(U)SIM card insertion detection USIM_GND 47 Specified ground for (U)SIM card Either 1.8V or 3.0V is supported by the module automatically. BG96-NA_Hardware_Design Confidential / Released 33 / 64 LTE Module Series BG96-NA Hardware Design level detections andisdisabled by default. Please BG96-NA supports (U)SIM card hot-plug via the USIM_PRESENCEpins. The function supports low level
[2] about and high AT+QSIMDETcommand for details. The following figure shows a reference design for (U)SIM card interface with an 8-pin (U)SIM card connector. to document refer Figure 15: Reference Circuit of (U)SIM Card Interface withan 8-Pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. Areference circuit for (U)SIM card interface with a 6-pin (U)SIM card connector is illustrated inthe following figure. Figure 16: Reference Circuit of (U)SIM Card Interface with a 6-Pin (U)SIM Card Connector BG96-NA_Hardware_Design Confidential / Released 34 / 64 LTE Module Series BG96-NA Hardware Design In order to enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design:
Keep layout of (U)SIM card as close to the module as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them awayfromeach other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVSdiode array which parasitic capacitance should be not more than 50pF. The 22ohmresistors should be added in series between the module and the (U)SIM card so as to suppress EMI spurious transmission and enhanceESD protection. The 33pFcapacitors are used for filtering interference of GSM900.Please note that the
(U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion areapplied, and should be placed close to the (U)SIMcard connector. 3.10. USB Interface BG96-NA contains one integrated Universal Serial Bus (USB) transceiver which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps)modes. The USB interface is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 10: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS USB_DP USB_DM GND 8 9 10 3 PI IO IO Used for detecting the USB connection. Typical 5.0V USB differential data bus (+) USB differential data bus (-) Ground Require differential impedance of 90. Require differential impedance of 90. More details about the USB 2.0 specifications, please visithttp://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in your design. The following figure shows areference circuit of USB interface. BG96-NA_Hardware_Design Confidential / Released 35 / 64 LTE Module Series BG96-NA Hardware Design Figure 17: Reference Circuit of USB Application In order to meet ensurethe integrity of USB data line signal, components R1, R2, R3 and R4 must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply with the following principles. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90ohm. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding onnot only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF. Keep the ESD protection components to the USB connector as close as possible. NOTE BG96-NA module can only be used as a slave device. BG96-NA_Hardware_Design Confidential / Released 36 / 64 LTE Module Series BG96-NA Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the UART1interface andUART2interface. The following are theirfeatures. The UART1 interface supports 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600 and 3000000bpsbaud rates, and the default is 115200bps. This interface is used for data transmission and AT command communication. The UART2interface supports 115200bps baud rate. It is used for module debugging and log output. The following tables show the pin definition of the main and debug UART interfaces. Table 11: Pin Definition of UART1Interface Pin Name Pin No. DTR RXD TXD CTS RTS DCD RI 30 34 35 36 37 38 39 I/O DI DI DO DO DI DO DO Description Comment Sleep mode control 1.8V power domain Receive data 1.8V power domain Transmit data 1.8V power domain Clear to send 1.8V power domain Request to send 1.8V power domain Data carrier detection 1.8V power domain Ring indicator 1.8V power domain Table 12: Pin Definition of UART2Interface Pin Name Pin No. DBG_TXD DBG_RXD 23 22 I/O DO DI Description Comment Transmit data 1.8V power domain Receive data 1.8V power domain BG96-NA_Hardware_Design Confidential / Released 37 / 64 LTE Module Series BG96-NA Hardware Design The logic levels are described in the following table. Table 13:Logic Levels of Digital I/O Parameter VIL VIH VOL VOH Min.
-0.3 1.2 0 1.35 Max. 0.6 2.0 0.45 1.8 Unit V V V V The module provides 1.8V UART interface. A level translator should be used if your application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instrument is recommended. The following figure shows a reference design. Figure 18: Reference Circuit with Translator Chip Please visit http://www.ti.comformore information. Another example with transistor translation circuit is shown as below. Thecircuitdesign of dotted line section can refer to the circuitdesign of solid line section, in terms of both module input and output circuit designs, but please pay attention to the direction of connection. BG96-NA_Hardware_Design Confidential / Released 38 / 64 LTE Module Series BG96-NA Hardware Design Figure 19: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. I2C Interfaces BG96-NA provides one I2C interface. The following table shows the pin definition of I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of I2C Interfaces Pin Name Pin No. I/O Description Comment I2C_SCL I2C_SDA 40 41 OD OD I2C serial clock I2C serial data Require external pull-up to 1.8V Require external pull-up to 1.8V BG96-NA_Hardware_Design Confidential / Released 39 / 64 LTE Module Series BG96-NA Hardware Design 3.13. Network Status Indication BG96-NA provides one network indication pin:NETLIGHT. The pin is used to drive a network status indicationLED. The following tables describe the pin definition and logic level changes ofNETLIGHT in different network status. Table 15: Pin Definition of Network Status Indicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the modulesnetwork activity status. 1.8V power domain Table 16: Working State of the Network Status Indicator Pin Name Logic Level Changes Network Status Flicker slowly (200ms High/1800ms Low) Network searching NETLIGHT Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing A reference circuit is shown in the following figure. Figure 20: Reference Circuit of the Network Indicator BG96-NA_Hardware_Design Confidential / Released 40 / 64 LTE Module Series BG96-NA Hardware Design 3.14. STATUS The STATUS pin is an open drain output for indicating the modules operation status. It can be connected to a GPIO of DTE with a pulled up resistor, or an LED indication circuit as below. When the module is turned on normally, the STATUS will present a low state. Otherwise, the STATUS will present high-impedance state. Table 17: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 OD Indicate the modules operation status 1.8V power domain The following figure shows different circuit designs of STATUS, and you can choose either one according to your application demands. Figure 21: Reference Circuit of the STATUS 3.15. Behavior of the RI AT+QCFG=risignaltype,physical command can be used to configure RI behavior. No matter on which port URC is presented, URC will trigger the behavior of RI pin. NOTE URC can be output from UART port, USB AT port and USB modem port by AT+QURCCFGcommand. The default port is USB AT port. BG96-NA_Hardware_Design Confidential / Released 41 / 64 LTE Module Series BG96-NA Hardware Design The default behaviors of RI are shown as below. Table 18:Default Behavior of RI State Idle URC Response RI keeps athigh level. RI outputs 120ms low pulse when new URC returns. The RI behavior can be changed by AT+QCFG=urc/ri/ringcommand.Please refer to document [2] for details. 3.16. USB_BOOT Interface BG96-NA provides a USB_BOOT pin. During development or factory production, USB_BOOT pin can force the module to boot from USB port for firmware upgrade. Table 19: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Force the module to boot from USB port 1.8V power domain. Active high. If unused, keep it open. The following figure shows a reference circuit of USB_BOOT interface. Figure 22: Reference Circuit of USB_BOOT Interface BG96-NA_Hardware_Design Confidential / Released 42 / 64 LTE Module Series BG96-NA Hardware Design 4 GNSS Receiver 4.1. General Description BG96-NA includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS). BG96-NA supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, BG96-NA GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of BG96-NA. Table 20: GNSS Performance Parameter Description Cold start Conditions Autonomous Sensitivity
(GNSS) Reacquisition Autonomous TTFF
(GNSS) Tracking Cold start
@open sky Warm start
@open sky Hot start Autonomous Autonomous XTRA enabled Autonomous XTRA enabled Autonomous Typ. TBD TBD TBD TBD TBD TBD TBD TBD Unit dBm dBm dBm s s s s s BG96-NA_Hardware_Design Confidential / Released 43 / 64 LTE Module Series BG96-NA Hardware Design
@open sky CEP-50 XTRA* enabled Autonomous
@open sky TBD TBD s m Accuracy
(GNSS) NOTES 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command.
* means under development. 4. 4.3. Layout Guidelines The following layout guidelines should be taken into account in your design. Maximize the distance between GNSS antenna and main antenna. Digital circuits such as (U)SIM card, USB interface, camera module, display connector and SD card should be kept away from the antennas. Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection. Keep 50 ohm characteristic impedance for the ANT_GNSS trace. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. BG96-NA_Hardware_Design Confidential / Released 44 / 64 LTE Module Series BG96-NA Hardware Design 5 Antenna Interfaces BG96-NA antenna interfaces include a main antenna interface andaGNSS antennainterface. The antenna interfaceshave an impedance of 50ohm. 5.1. MainAntenna Interface 5.1.1. Pin Definition The pin definition of main antenna interface is shown below. Table 21: Pin Definition of the RF Antenna Interface Pin Name Pin No. ANT_MAIN 60 I/O IO Description Comment Main antennainterface 50ohmimpedance 5.1.2. Operating Frequency Table 22: Module Operating Frequencies 3GPP Band B2 B4 B12 B13 Transmit 1850~1910 1710~1755 699~716 777~787 Receive 1930~1990 2110~2155 728~746 746~757 Unit MHz MHz MHz MHz 5.1.3. Reference Design of RF Antenna Interface Areference design of ANT_MAIN antenna padis shown as below. It should reserve a -type matching circuit for better RF performance. The capacitors are not mounted by default. BG96-NA_Hardware_Design Confidential / Released 45 / 64 LTE Module Series BG96-NA Hardware Design Figure 23: Reference Circuit of RF Antenna Interface NOTE Place the-type matching components (R1, C1, C2) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50 ohm. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the distance between signal layer and reference ground(H), and the clearance between RF trace and ground(S). Microstrip line or coplanar waveguideline is typically used in RF layout for characteristic impedance control. The line or coplanar following are waveguidelinewithdifferent PCB structures. reference designs of microstrip Figure 24: Microstrip Line Designon a 2-layer PCB BG96-NA_Hardware_Design Confidential / Released 46 / 64 LTE Module Series BG96-NA Hardware Design Figure 25: Coplanar Waveguide Line Design on a 2-layer PCB Figure 26: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 27: Coplanar Waveguide Line Designon a4-layer PCB (Layer 4 as Reference Ground) BG96-NA_Hardware_Design Confidential / Released 47 / 64 LTE Module Series BG96-NA Hardware Design In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:
Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50ohm. The GND pins adjacent to RF pins should not be hot welded, and should be fully connected to ground. The distance between the RF pinsand the RFconnectorshould be as short as possible, and all the right angle tracesshould be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground viasaround RF traces and the reference ground could help to improve RF performance. The distance between theground viasand RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RFlayout, please refer to document [4]. 5.2. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 23: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 49 AI GNSS antennainterface 50 ohm impedance Table 24: GNSS Frequency Type Frequency GPS/Galileo/QZSS 1575.421.023 GLONASS BeiDou 1597.5~1605.8 1561.0982.046 Unit MHz MHz MHz BG96-NA_Hardware_Design Confidential / Released 48 / 64 LTE Module Series BG96-NA Hardware Design A reference design of GNSS antenna interface is shown as below. Figure 28: Reference Circuit of GNSS Antenna Interface NOTES 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on main antenna. Table 25: Main Antenna Requirements Type LTE Requirements VSWR: 2 Gain (dBi): 1 Max Input Power (W): 50 Input Impedance (ohm): 50 Polarization Type: Vertical Cable Insertion Loss: <1.5dB (LTE B1/B2/B3/B4) BG96-NA_Hardware_Design Confidential / Released 49 / 64 LTE Module Series BG96-NA Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use the UF.L-R-SMTconnector provided by HIROSE. Figure 29: Dimensions of the UF.L-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the UF.L-R-SMT. Figure 30:Mechanicals of UF.L-LP Connectors BG96-NA_Hardware_Design Confidential / Released 50 / 64 BG96-
LTE Mod
-NA Hardw dule Series s ware Design n The followin ng figure des scribes the s space factor r of mated c onnector. Figure 31:S Space Facto or of Mated d Connector r (Unit: mm m) For more de etails, pleas e visithttp://w www.hirose. com. Hardware_D Design BG96-NA_H Co onfidential /
/ Released 51 / 64 LTE Module Series BG96-NA Hardware Design 6 Electrical, Reliability and RadioCharacteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 26: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at Digital Pins Min.
-0.3
-0.3 0 0
-0.3 6.2. Power Supply Ratings Table 27: Power Supply Ratings Max. 4.7 5.5 TBD TBD 2.3 Unit V V A A V Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and VBAT_RF Voltage must stay within the min/max values, including voltage drop, ripple and spikes. 3.3 3.8 4.3 V BG96-NA_Hardware_Design Confidential / Released 52 / 64 LTE Module Series BG96-NA Hardware Design Parameter Description Conditions Min. Typ. Max. Unit IVBAT Peak supply current
(during transmissionslot) USB_VBUS USB detection 6.3. Operating Temperature The operating temperature is listed in the following table. TBD TBD 3.0 5.0 5.25 A V Table 28: Operating Temperature Parameter OperationTemperature Range1) Extended Temperature Range2) Min.
-35
-40 NOTES Typ.
+25 Max.
+75
+85 Unit C C 1)Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain SMS, data transmission, etc. There is no unrecoverable malfunction. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP compliant again. 1. 2. 6.4. Current Consumption Theinformation will be added in the future version of this document. BG96-NA_Hardware_Design Confidential / Released 53 / 64 LTE Module Series BG96-NA Hardware Design 6.5. RF Output Power The following table shows the RF output power of BG96-NA module. Table 29: Conducted RF Output Power Frequency LTE-FDD B2/B4B12/B13 Max. 23dBm2.7dB Min. TBD 6.6. RF Receiving Sensitivity The following table shows the conducted RF receiving sensitivity of BG96-NA module. Table 30: BG96-NA Conducted RF Receiving Sensitivity Frequency Primary Diversity SISO LTE-FDD B2 LTE-FDD B4 LTE-FDD B12 LTE-FDD B13 TBD TBD TBD TBD Not Supported Not Supported Not Supported Not Supported TBD TBD TBD TBD 6.7. Electrostatic Discharge Theinformation will be added in the future version of this document. 3GPP
-100.3dBm
-102.3dBm
-99.3dBm
-93.3dBm BG96-NA_Hardware_Design Confidential / Released 54 / 64 LTE Module Series BG96-NA Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module.All dimensions are measured in mm. 7.1. Mechanical Dimensions of the Module 22.500.1 2.30.2
. 1 0 0 5 6 2
. Figure 32: Module Top and Side Dimensions BG96-NA_Hardware_Design Confidential / Released 55 / 64 LTE Module Series BG96-NA Hardware Design 22.50 0.92 7.45 7.15 1.10 1.95 0.55 1.10 1.66 5.10 1.00 1.70 0.85 8.50 26.50 1.70 0.70 1.70 0.85 1.00 1.00 0.92 1.50 1.90 1.10 0.50 1.65 1.15 0.55 62x0.7 40x1.0 62x1.15 40x1.0 1.50 Figure 33: Module Bottom Dimensions (Bottom View) BG96-NA_Hardware_Design Confidential / Released 56 / 64 LTE Module Series BG96-NA Hardware Design 7.2. Recommended Footprint 1.10 11.80 9.70 29.00 1.90 11.80 9.60 9.95 7.45 1.95 9.95 7.15 0.55 0.20 2.55 2.55 0.85 0.85 2.55 2.55 0.85 0.85 4.25 5.95 4.25 5.95 7.65 5.95 4.25 4.25 5.95 7.65 62x0.7 62x2.35 40x1.00 1.00 40x1.00 Figure 34: Recommended Footprint (Top View) NOTE For easymaintenance of the module, please keep about 3mm between the module and other components in thehost PCB. BG96-NA_Hardware_Design Confidential / Released 57 / 64 BG96-
LTE Mod
-NA Hardw dule Series s ware Design n ign Effec ct Drawin ngs of th he Modu le F igure 35: T Top View of f the Modu ule Fig gure 36: Bo ottom View of the Mod ule 7.3. Des NOTE design effec t you get fro ct drawings m Quectel. These are d module that Hardware_D Design BG96-NA_H of BG96-NA A module. F For more ac ccurate pictu ures, please e refer to the e Co onfidential /
/ Released 58 / 64 LTE Module Series BG96-NA Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage BG96-NA is stored in avacuum-sealed bag. The storage restrictionsareshown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40C/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:
Mounted within 72 hours at the factory environment of 30C/60%RH. Stored at <10%RH. 3. Devices require baking before mounting, if any circumstance below occurs. When the ambient temperature is 23C5Cand the humidity indication card shows the humidity is >10% before opening the vacuum-sealed bag. Device mounting cannot be finished within 72 hours at factory conditions of 30C/60%
If baking is required, devices may be baked for 48 hours at 125C5C. 4. NOTE If shorter baking As the plastic package cannot be subjected to high temperature, it should be removed from devices before high to temperature (125C) baking. IPC/JEDECJ-STD-033 for baking procedure. is desired, please refer time BG96-NA_Hardware_Design Confidential / Released 59 / 64 LTE Module Series BG96-NA Hardware Design 8.2. Manufacturing and Welding Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, thethickness of stencil for the module is recommended to be 0.18mm. For more details, please refer todocument [5]. It is suggested that the peak reflow temperature is 235~245C (for SnAg3.0Cu0.5 alloy). The absolute max reflow temperature is 260C. To avoid damage to the module caused byrepeated heating, it is suggested that the module should be mounted after reflow soldering for the other side of PCB has been completed. Recommended reflow soldering thermal profile is shown below. Figure 37: Reflow Soldering Thermal Profile 8.3. Packaging The information will be added in the future version of this document. BG96-NA_Hardware_Design Confidential / Released 60 / 64 LTE Module Series BG96-NA Hardware Design 9 Appendix A References Table 31: Related Documents SN Document Name Remark
[1] Quectel_BG96_Power_Management_Application_Note BG96 Power Management Application Note
[2] Quectel_BG96_AT_Commands_Manual BG96 AT Commands Manual
[3] Quectel_BG96_GNSS_AT_Commands_Manual BG96 GNSS AT Commands Manual
[4] Quectel_RF_Layout_Application_Note RF Layout Application Note
[5] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Table 32: Terms and Abbreviations Abbreviation Description AMR bps CHAP CS CSD CTS Adaptive Multi-rate Bits Per Second Challenge Handshake Authentication Protocol Coding Scheme Circuit Switched Data Clear To Send DC-HSPA+
Dual-carrier High Speed Packet Access DFOTA DL DTR Delta Firmware Upgrade Over The Air Downlink Data Terminal Ready BG96-NA_Hardware_Design Confidential / Released 61 / 64 LTE Module Series BG96-NA Hardware Design DTX EFR ESD FDD FR GMSK GSM HR HSPA HSDPA HSUPA I/O Inorm LED LNA LTE MIMO MO MS MT PAP PCB PDU PPP QAM Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Input/Output Normal Current Light Emitting Diode Low Noise Amplifier Long Term Evolution Multiple Input Multiple Output Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation BG96-NA_Hardware_Design Confidential / Released 62 / 64 LTE Module Series BG96-NA Hardware Design QPSK RF RHCP Rx SISO SMS TDD TX UL UMTS URC
(U)SIM Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHmax VOHmin VOLmax VOLmin Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Single Input Single Output Short Message Service Time Division Duplexing Transmitting Direction Uplink Universal Mobile Telecommunications System Unsolicited Result Code
(Universal) Subscriber Identity Module Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value BG96-NA_Hardware_Design Confidential / Released 63 / 64 LTE Module Series BG96-NA Hardware Design VSWR WCDMA Voltage Standing Wave Ratio Wideband Code Division Multiple Access BG96-NA_Hardware_Design Confidential / Released 64 / 64 LTE Module Series BG96-NA Hardware Design 10 Appendix B GPRS Coding Schemes Table 33: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF CS-1 1/2 3 3 Radio Block excl.USF and BCS 181 BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16
-
456
-
21.4 BG96-NA_Hardware_Design Confidential / Released 65 / 64 LTE Module Series BG96-NA Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 34: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 1 2 2 3 2 3 3 4 3 4 4 4 1 1 2 1 2 2 3 1 2 2 3 4 2 3 3 4 4 4 4 5 5 5 5 5 BG96-NA_Hardware_Design Confidential / Released 66 / 64 BG96-
LTE Mo
-NA Hardw odule Sires s ware Design n App Cod 12 pendix ding S x D E Schem EDGE mes E Mod dulati onan nd Table 35: E EDGE Modu ulation and Coding Sch hemes Mod dulation Coding Family 1 1 Timeslot 2 Tim meslot 4 Timeslot GM SK GM SK GM SK GM SK GM SK GM SK GM SK GM SK 8-PS SK 8-PS SK 8-PS SK 8-PS SK 8-PS SK
/
/
/
/
C B A C B A B A A 9 9.05kbps 18.1k kbps 36.2kbps 13.4kbps 26.8k kbps 53.6kbps 15.6kbps 31.2k kbps 62.4kbps 2 21.4kbps 42.8k kbps 85.6kbps 8 8.80kbps 17.60 0kbps 35.20kbps 11.2kbps 22.4k kbps 44.8kbps 14.8kbps 29.6k kbps 59.2kbps 17.6kbps 35.2k kbps 70.4kbps 2 22.4kbps 44.8k kbps 89.6kbps 2 29.6kbps 59.2k kbps 118.4kbps 4 44.8kbps 89.6k kbps 179.2kbps 5 54.4kbps 108.8 8kbps 217.6kbps 5 59.2kbps 118.4 4kbps 236.8kbps Coding Schemes CS-1:
CS-2:
CS-3:
CS-4:
MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 Hardware_D Design BG96-NA_H Confident tial / Releas sed67 /64
This product uses the FCC Data API but is not endorsed or certified by the FCC