EMB1061 BLE module User Manual

 

Track Number: AN0092EN Version: 1.0 Category: Application Note Abstract MXCHIP Co., Ltd 2017.7.11 Open EMB1061 Hardware Design Guide This document lists the consideration in each step during designing product with MXCHIP module. In order to achieve rapid mass production, Users should be familiar with the document to pre-consider and avoid problems effectively in designing, producing, programming and testing. More Help For more products information please visit: http://mxchip.com/

For more development data please go to MiCO developer bbs: http://mico.io/

For more Fogcloud data please go to Fogcloud developer center: http://easylink.io/

Copyright Notice Mxchip copyrights this specification. No part of this specification may be reproduced in any form or means(specially brand, type name, part number and pictures), without the prior written consent of Mxchip. Shanghai MXCHIP Information Technology Co., Ltd. 9th Floor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai.200333 Tel.: 021-52655026 Website: http://mxchip.com/

Application Note

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Version Record Date Version Details 2017-7-11 V1.0 Initial release EMB1061 Hardware Design Guide Application Note

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EMB1061 Hardware Design Guide.....................................................................................................................................1 Version Record......................................................................................................................................................................1 1. Introduction.......................................................................................................................................................................3 2. Hardware Design Guide...................................................................................................................................................6 2.1 MECHANICAL SIZE.................................................................................................................................................... 6 2.1.1 EMB1061 Pin Definition...........................................................................................................................6 2.2 REFERENCE PCB PACKAGE DESIGN......................................................................................................................... 7 2.3 DC POWER DESIGN................................................................................................................................................... 7 2.4 RF DESIGN................................................................................................................................................................ 8 2.4.1 On-board PCB Antenna Design.................................................................................................................8 2.4.2 External Antenna........................................................................................................................................9 2.5 ESD DESIGN............................................................................................................................................................10 3. Downloading Firmware..................................................................................................................................................11 4. Important Statement...................................................................................................................................................... 12 5. SMT..................................................................................................................................................................................13 5.1 STENCILS................................................................................................................................................................. 13 5.2 TEMPERATURE CURVE OF REFLOW......................................................................................................................... 14 6. reference design...............................................................................................................................................................15 7. Technical Support........................................................................................................................................................... 17 Figure Content Figure 1.1. Top view of EMB1061.........................................................................................................................3 Figure 1.2 Hardware Block.................................................................................................................................... 5 Figure 2.1 Top View of Mechanical Size (Unit:mm).............................................................................................6 Figure 2.2 Minimum PCB Clearance Area............................................................................................................ 9 Figure 2.3 Position of the Module..........................................................................................................................9 Figure 2.4 Size of connector for external antenna..............................................................................................10 Figure 5.1 Stencils size.........................................................................................................................................13 Figure 5.2 Temperature Curve of Secondary Reflow...........................................................................................14 EMB1061 Hardware Design Guide Application Note

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1. Introduction This document lists the consideration in each step during designing product with MXCHIP module. In order to achieve rapid mass production, Users should be familiar with the document to pre-consider and avoid problems effectively in designing, producing, programming and testing. Suitable module type:

EMB1061 Phase to attention:

Hardware design;

Firmware downloading;

Firmware testing;

SMT;

Top view of EMB1061 EMB1061 Figure 1.1. Top view of EMB1061 Module type Antenna Type Illustration EMB1061-P EMB1061-E On-board PCB IPEX Default Optional EMB1061 has two types of antenna: PCB antenna (EMB1061-P), IPEX connector (EMB1061-E). EMB1061 Hardware Design Guide Application Note

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EMB1061-P EMB1061 Hardware Design Guide Application Note

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Hardware Block EMB1061-E Figure 1.2 Hardware Block EMB1061 Hardware Design Guide Application Note

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2. Hardware Design Guide 2.1 Mechanical Size Mechanical size of EMB1061 (Unit: mm) Figure 2.1 Top View of Mechanical Size (Unit:mm) EMB1061 Package Definition 2.1.1 EMB1061 Pin Definition Table 1 EMB1061 Pin Definition NO. 1 Name I2C1 DAT Pin of ST SOC IO13 Type I/O Main function Alternative function I2C1 DAT GPIO13 EMB1061 Hardware Design Guide Application Note

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NO. 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Name I2C1 CLK RESET SWDIO SWCLK UART CTS/BOOT UART RTS VCC GND UART_TX UART_RX SPI IN SPI OUT SPI CS SPI CLK I2C2 DAT I2C2 CLK IO14 AO ADC1 ADC2 GND Pin of ST SOC IO12 RESETN IO10 IO9 IO7 IO6 VBAT2 GND IO8 IO11 IO3 IO2 IO1 IO0 IO5 IO4 IO14 ANATEST1 ADC1 ADC2 GND Type I/O Input I/O I/O I/O I/O S S I/O I/O I/O I/O I/O I/O I/O I/O I/O O I I S Main function Alternative function I2C1 CLK Reset SWDIO SWCLK UART CTS/BOOT UART RTS POWER_SUPPLY GND USER_UART_TX USER_UART_RX SPI IN SPI OUT SPI CS SPI CLK I2C2 DAT I2C2 CLK GPIO14 GPIO12 GPIO10 GPIO9 I2C2_DAT I2C2_CLK SPI_CLK GPIO11 PWM1 PWM0 GPIO1 GPIO0 PWM1 PMW0 Analog Output Analog Output Analog Output ADC1 ADC2 GND ADC INPUT ADC INPUT 2.2 Reference PCB Package Design Figure 2.1 is the reference module package design for baseplate PCB design. Solder mask openness can be the same size with EMB1061s pad. EMB1061s PCB thickness is 1.0mm. 2.3 DC Power Design EMB1061s operation voltage is 1.7~3.6V with typical voltage 3.3V. The peak current of the module is about 10mA. If powered by battery, please pay attention to the max voltage and minimal discharge voltage. For coin cell, the typical voltage is 3.0V, and the minimal discharge voltage is 2.0V, and in practice it usually end up discharging at about 2.5V. For example, CR2032 coin cell, the discharge characteristics is as below picture. When choosing EMB1061 Hardware Design Guide battery, please check whether its discharge characteristics is suitable for EMB1061. Application Note

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If using DC-DC, DC-DCs output voltage should be 3.3V, and its max current should be above 20mA. PCB route should be particularly aware for DC/DC power supply. Compact element, excellent connection between input and output ground, long distance between feedback signal and inductance and Schottky diode are required for route. Details about the requirements should refer to the datasheet of DC/DC device. Maximum output current and dissipate heat should be aware for the using of LDO. For example, voltage drop is 1.7V when voltage reduces from 5V to 3.3V. If the current is 100mA, power consumption is 1.7V *

100mA=170mW. Power Dissipation is a parameter of LDO, which should be over 170mW. 2.4 RF Design 2.4.1 On-board PCB Antenna Design There should not be components, or ground, or circuit 15mm away from EMB1061s PCB antenna. EMB1061 Hardware Design Guide Application Note

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Figure 2.2 Minimum PCB Clearance Area In order to reduce the influence from metal components to PCB antenna and wireless signal, it is better to mount EMB1061 on these areas, as shown in figure 2.3. Figure 2.3 Position of the Module 2.4.2 External Antenna Size of connector for external antenna is shown in figure 2.4. Make sure the correct size with suppliers before buying the connectors of antenna. EMB1061 Hardware Design Guide Application Note

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Figure 2.4 Size of connector for external antenna 2.5 ESD Design ESD level of the module: Human body model (HBM) is 2000V, charged device model (CDM) is 500V. Position of ESD protected components should be reserved if the products require higher ESD requirement. EMB1061 Hardware Design Guide Application Note

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3. Downloading Firmware 1. Unzip the package and install the USB driver "CDM 2.08.30 WHQL Certified_64". 2.Power supply to the development board through USB interface. View its corresponding serial port number from device Manager. 3. Enter BOOTLOADER mode. After confirming that the module is powered (a red LED lights up next to the USB port), hold down the BOOT button and reset the module through the Reset button, then release the BOOT button. If the operation succeeds, EMB1061 enters BootLoader mode. 4. Open firmware upgrade tool software, select module EMB1061, select user serial port number and fix A document. 5. Select the firmware file to upgrade (click the firmware button), and if everything is normal, you will see the upgrade button brighten. Indicates that you can upgrade. Hover over the firmware button to see the absolute path of the firmware that has been selected. As shown in the figure:

6. Click the upgrade button and a dialog box will pop up to prompt the user to confirm that the module is now in BootLoader mode. Click OK to start the upgrade, as shown in figure:

7. After a successful upgrade, the module will automatically Reset and run from the latest firmware. If there is an error in the upgrade process, the tool will pop up an error prompt, according to which the user can further process. EMB1061 Hardware Design Guide Application Note

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4. Important Statement MXCHIP has a duty to make sure there is no quality problem when sell the module to customers. Customers have the rights to ask MXCHIP to exchange goods if the product has quality problem. If the customer find the problem after welding the module on board without testing at the beginning, MXCHIP is only responsible for the compensation of the module part. MXCHIP would help customers solve technical problem in developing firmware without save any MVA/bin file. Customers should save different development vision and download relative vision in module before producing. EMB1061 Hardware Design Guide Application Note

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5. SMT 5.1 Stencils Stencils thickness is suggested to be 0.12mm (0.1~0.15mm) with Laser grinding. Recommended solder paste:

No lead SAC305. Stencils size is shown in figure 5.1, pad holes extend 0.15mm in order to improving solder wicking. Solder masks width should be 0.1mm wider than stencils paste layer, like Pin1 of Figure 5.1. So that if there is no AOI testing, you can check whether the module is placed well by eye to reduce the Pseudo Soldering. There is EMB1061s PCB lib in mxchip.com, and you can use it directly. Figure 5.1 Stencils size EMB1061 Hardware Design Guide Application Note

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5.2 Temperature Curve of Reflow Pseudo soldering could be reduced by control the furnace with temperature curve of secondary reflow, as shown in figure 5.2. Secondary reflow times should be less than twice. 1. Max Rising Slope : 3/sec 2. Max Falling Slope: -3 /sec 3. 4. Over 217 Time:40sec~70sec 5. Peak Temp.240~250 Preheat Time(150~200): 60sec~120sec Figure 5.2 Temperature Curve of Secondary Reflow EMB1061 Hardware Design Guide Application Note

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6. reference design Power source circuit USB to UART external interface circuit Figure 12 USB to UART Figure 13 External Interface Circuit of EMB1061 Voltage of EMB1061 UART is 3.3V. 5V UART should convert to 3.3V UART for the users that have 5V EMB1061 Hardware Design Guide chips. Convert circuit is shown in figure 14. Application Note

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Figure 14 3.3V UART- 5V UART Convert Circuit EMB1061 Hardware Design Guide Application Note

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7. Technical Support For consultation or purchase the product, please contact Mxchip during working hours:

From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86-21-52655026 Contact address: 9th Floor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai. Postcode200333 Email: sales@mxchip.com EMB1061 Hardware Design Guide Application Note

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FCC Regulations:

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital device , pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help. Caution: Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. RF Exposure Information This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. IMPORTANT NOTE:

This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, forth for an population/uncontrolled environment can be satisfied. the FCC radiation exposure limits set Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. EMB1061 Hardware Design Guide Application Note

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USERS MANUAL OF THE END PRODUCT:

In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following " Contains Transmitter Module FCC ID: P53-EMB1061 ". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. EMB1061 Hardware Design Guide