| submitted | available | document details (if available) | source link |
|---|---|---|---|
| July 28 2022 | September 11 2022 | Adobe Acrobat Pro DC 18.9.20050 |
| various | User manual | Users Manual | 1.79 MiB | July 28 2022 / September 11 2022 | delayed release |
Ai-WB1-12F Specification V1.1.0 Ai-WB1-12F Specification Version V1.1.0 Copyright 2022 Ai-WB1-12F Specification V1.1.0 Document resume Version Date Develop/revise content Edition Approve V1.1.0 2022.6.20 First Edition ChaoMei Deng Ning Guan Ai-WB1-12F Specification V1.1.0 Content 1. Product Overview ..................................................................................................................... 4 1.1. Characteristic ................................................................................................................. 5 2. Main parameters ....................................................................................................................... 6 2.1. Static electricity requirement ........................................................................................ 6 2.2. Electrical characteristics ................................................................................................ 7 2.3. Wi-Fi RF Performance .................................................................................................. 7 2.4. BLE RF Performance .................................................................................................... 8 2.5. Power ............................................................................................................................. 8 3. Appearance Dimensions ........................................................................................................... 9 4. Pin Definition ......................................................................................................................... 10 5. Schematic ............................................................................................................................... 12 6. Antenna parameters ................................................................................................................ 13 6.1. Schematic diagram of the antenna test prototype ........................................................ 13 6.2. Antenna S parameter ................................................................................................... 14 6.3. Antenna Gain and Efficiency ...................................................................................... 14 6.4. Antenna pattern ........................................................................................................... 15 7. Design Guidance .................................................................................................................... 16 7.1. Application Guidance Circuit ...................................................................................... 16 7.2. Recommended PCB package size ............................................................................... 16 7.3. Antenna Layout Requirements .................................................................................... 17 7.4. Power supply ............................................................................................................... 18 7.5. GPIO............................................................................................................................ 19 8. Storage conditions .................................................................................................................. 20 9. Reflow welding curve diagram .............................................................................................. 20 10. Product related models ......................................................................................................... 21 11. Product Packaging Information ............................................................................................ 22 12. Contact us ............................................................................................................................. 22 Disclaimer and copyright notice ................................................................................................ 23 Notice ......................................................................................................................................... 23 Ai-WB1-12F Specification V1.1.0 1. Product Overview Ai-WB1-12F is a Wi-Fi&Bluetooth module developed by Shenzhen Ai-Thinker Technology Co., Ltd. The module is equipped with W800 chip as the core processor, supports Wi-Fi 802.11b/g/n protocol, and supports BT/BLE Dual-mode working mode, support BT/BLE4.2 protocol. W800 chip has built-in low-power 32-bit XT804 CPU, operating frequency 240MHz, built-in 2MB Flash, 288KB RAM and rich peripheral interfaces, including SDIO, PSRAM, SPI, UART, I2C, PWM, ADC, Touch sensor, Duplex I2S and GPIO Wait. It can be widely used in the Internet of Things (IoT), mobile devices, wearable electronic devices, smart home and other fields. Figure 1 Main chip architecture diagram Ai-WB1-12F Specification V1.1.0 1.1. Characteristic The package is SMD-22 Support IEEE 802.11 b/g/n protocol Wi-Fi Security Support Wi-Fi WMM/WMM-PS/WPA/WPA2 /WPS Support 20/40MHz bandwidth, the highest rate is 150 Mbps Support BT/BLE dual-mode working mode, support BT/BLE4.2 protocol Support Station Station + SoftAP SoftAP mode Support 32-bit XT804 CPU 288KB RAM The MCU has a built-in Tee security engine, and the code can distinguish between security events and non-security events Integrated SASC/TIPC, memory and internal modules/interfaces can be configured with security attributes to prevent non-secure code access Enable firmware signature mechanism for secure boot/upgrade With firmware encryption function to enhance code security Firmware encryption keys are distributed using asymmetric algorithms for enhanced key security Hardware encryption module: RC4256, AES128, DES/3DES, SHA1/MD5, CRC32, 2048RSA, true random number generator Support SDIO PSRAM SPI UART I2C PWM ADC Touch senser Duplex I2S and GPIO Integrated Wi-Fi MAC/BB/RF/PA/LNA/Bluetooth Support a variety of sleep modes, standby power consumption current 10 A Universal AT instruction for quick start Support secondary development, integrated Windows, Linux development environment Ai-WB1-12F Specification V1.1.0 2. Main parameters Table 1 Description of the main parameters Model Ai-WB1-12F Package SMD-22 Size 24.0*16.0*3.1( 0.2)mm Antenna on-board PCB antenna Frequency 2400 ~ 2483.5MHz Operating temperature Storage temperature
-40
~ 85
-40
~ 125 , < 90%RH Power supply Support voltage 3.0V ~ 3.6V supply current 500mA Interface UART/GPIO/ADC/PWM/I2C/SPI/Touch senser/PSRAM/SDIO/Duplex I2S IO 18 UART rate Default 115200 bps Security Wi-Fi WMM/WMM-PS/WPA/WPA2 /WPS Flash Default 2MByte 2.1. Static electricity requirement Ai-WB1-12F is an electrostatic sensitive device. Therefore, you need to take special precautions when carrying it. Figure 2 ESD preventive measures Ai-WB1-12F Specification V1.1.0 2.2. Electrical characteristics Table 2 Electrical characteristics table Parameters Condition Min. Typical value Max. Unit Voltage Supply VDD I/O VIL VIH VOL VOH IMAX
3.0 0.3 2.0
2.4
2.3. Wi-Fi RF Performance 3.3
3.6 0.8 VDD+0.3 0.4
24 V V V V V mA Table 3 Wi-Fi RF performance table Description Frequency range Typical value 2400 ~ 2483.5MHz Output Power Mode Min. 11n Mode HT20 PA output power 11g Mode, PA output power 11b Mode, PA output power
Typical value 12 13 18 Receive Sensitivity Mode Min. 11b 1 Mbps 11b 11 Mbps 11g 6 Mbps 11g 54 Mbps 11n HT20 (MCS7)
Typical value
-95
-85
-89
-72
-69 Max.
Max.
Unit MHz Unit dBm dBm dBm Unit dBm dBm dBm dBm dBm Ai-WB1-12F Specification V1.1.0 2.4. BLE RF Performance Table 4 BLE RF performance table Description Frequency range Typical value 2400 ~ 2483.5MHz Output Power Min.
Typical value 4 Receive Sensitivity Min.
Typical value
-92 Max. 6 Max.
Rate Mode 1Mbps Rate Mode 1Mbps sensitivity@30.8%PER 2.5. Power Unit MHz Unit dBm Unit dBm The following power consumption figures are based on a 3.3V supply, 25 C ambient temperature, and are measured using the internal voltage regulator. All measurements are made at the antenna interface with filters All transmit data is based on 100% duty cycle, measured in continuous transmit mode. Table 5 Power consumption Mode Min. AVG Max. Unit Tx 802.11b 11Mbps POUT=+19dBm Tx 802.11g 54Mbps POUT =+15dBm Tx 802.11n MCS7 POUT =+12dBm Rx 802.11b packet length 1024 byte Rx 802.11g packet length 1024 byte Rx 802.11n packet length 1024 byte SRAM retention
) Deep-Sleep
348 190 190 96 96 96 10
mA mA mA mA mA mA A 3. Appearance Dimensions Ai-WB1-12F Specification V1.1.0 Front Back Figure 3 Appearance diagram (pictures is for reference only,subject to physical objects) Front Back Figure 4 Dimension diagram Ai-WB1-12F Specification V1.1.0 4. Pin Definition Ai-WB1-12F module has a total of 22 pins, as shown in the pin diagram, the pin function definition table is the interface definition. Front Back Figure 5 Schematic diagram of module pins Table 6 Pin function definition table Ai-WB1-12F Specification V1.1.0 No. Name Function 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 PA7 PA1 RST WAKE UP PA4 PB0 PB1 VCC PB4 PB8 PB9 PB10 PB11 PB5 GND PB7 PB6 PA0 PB2 PB3 RX0 TX0 PWM4/LSPI_MOSI/I2S_MCK/I2S_DI/Touch0/GPIO JTAG_CK/I2C_SCL/PWM3/I2S_LRCK/ADC0 As a chip enable, active low Wakeup function JTAG_SWO/I2C_SDA/PWM4/I2S_BCK/ADC1 PWM0/LSPI_MISO/UART3_TX/PSRAM_CK/Touch3/GPIO PWM1/LSPI_CLK/UART3_RX/PSRAM_CS/Touch4/GPIO 3.3V power supply; the output current of the external power supply is recommended to be above 500mA LSPI_CS/UART2_RTS/UART4_TX/PSRAM_D2/Touch7/GPIO I2S_BCK/MMC_D0/PWM_BREAK/SDIO_D0/Touch11/GPIO I2S_LRCK/MMC_D1/HSPI_CS/SDIO_D1/Touch12/GPIO I2S_DI/MMC_D2/HSPI_DI/SDIO_D2/GPIO I2S_DO/MMC_D3/HSPI_DO/SDIO_D3/GPIO LSPI_MOSI/UART2_CTS/UART4_RX/PSARM_D3/Touch8/GPIO Ground UART1_RX/MMC_CMD/HSPI_INT/SDIO_CMD/Touch10/GPIO UART1_TX/MMC_CLK/HSPI_CK/SDIO_CK/Touch9/GPIO I2S_MCLK/LSPI_CS/PWM2/I2S_DO/BOOTMODE PWM2/LSPI_CK/UART2_TX/PSRAM_D0/Touch5/GPIO PWM3/LSPI_MISO/UART2_RX/PSRAM_D1/Touch6/GPIO UART0_RX/PWM1/UART1_CTS/I2C_SCL UART0_TX/PWM0/UART1_RTS/I2C_SDA 5. Schematic Ai-WB1-12F Specification V1.1.0 Figure 6 Schematic Ai-WB1-12F Specification V1.1.0 6. Antenna parameters 6.1. Schematic diagram of the antenna test prototype Figure 7 Schematic diagram of the antenna test prototype 6.2. Antenna S parameter Ai-WB1-12F Specification V1.1.0 Figure 8 Antenna S parameters 6.3. Antenna Gain and Efficiency Table 7 Antenna Gain and efficiency Frequency ID 1 2 3 4 5 6 7 8 9 10 11 Frequency(MHz) 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500 Gain (dBi) 1.63 1.49 1.61 1.90 2.09 2.22 2.15 2.04 1.80 1.78 1.60 Efficiency (%) 54.1 54.57 56.92 58.90 61.35 63.54 63.64 62.99 61.33 60.62 59.16 6.4. Antenna pattern Ai-WB1-12F Specification V1.1.0 Figure 9 Antenna pattern Ai-WB1-12F Specification V1.1.0 7. Design Guidance 7.1. Application Guidance Circuit Figure 10 Application circuit diagram If the IO port is used as PWM, it is recommended to reserve a 4.7K pull-down resistor on the periphery of the module. Especially in the application of light control, it can prevent the flashing light phenomenon at the moment of power-on start. For power input, a 470uF capacitor needs to be added next to the VCC pin and placed close to the VCC pin, otherwise it will affect the RF EVM and other performance. 7.2. Recommended PCB package size Ai-WB1-12F Specification V1.1.0 Figure 11 Recommended PCB package size (top view) 7.3. Antenna Layout Requirements In the installation position on the motherboard, the following two methods are recommended:
Option 1: Put the module on the edge of the motherboard, and the antenna area extends out of the edge of the motherboard. Option 2: Put the module on the edge of the motherboard, and hollow out an area on the edge of the motherboard at the antenna position. In order to meet the performance of the on-board antenna, it is forbidden to place metal parts around the antenna and keep away from high-frequency devices. Ai-WB1-12F Specification V1.1.0 Figure 12 Schematic diagram of antenna layout 7.4. Power supply Recommended 3.3V voltage, peak current above 500mA. It is recommended to use LDO for power supply; if DC-DC is used, it is recommended that the ripple be controlled within 30mV. It is recommended to reserve the position of the dynamic response capacitor for the DC-DC power supply circuit, which can optimize the output ripple when the load changes greatly. It is recommended to add ESD devices to the 3.3V power interface. Figure 13 DC-DC step-down circuit diagram Ai-WB1-12F Specification V1.1.0 7.5. GPIO There are some IO ports on the periphery of the module. If you need to use it, it is recommended to connect a 10-100 ohm resistor in series with the IO port. This suppresses overshoot and makes the level on both sides smoother. Helps with both EMI and ESD. For the up-down and down-down of the special IO port, please refer to the instruction manual of the specification, which will affect the startup configuration of the module. The IO port of the module is 3.3V. If the level of the main control and the IO port of the module does not match, a level conversion circuit needs to be added. If the IO port is directly connected to a peripheral interface, or a terminal such as a pin header, it is recommended to reserve an ESD device near the terminal of the IO port trace. Figure 14 Level convert circuit Ai-WB1-12F Specification V1.1.0 8. Storage conditions Products sealed in moisture-proof bags should be stored in a non-condensing atmosphere <40 C/90%RH. The module's moisture sensitivity level MSL is level 3. the vacuum bag is unpacked, it must be used within 168 hours at 25 5
/60%RH, otherwise it will need to be baked before going online again. 9. Reflow welding curve diagram Figure 15 Reflow welding diagram Ai-WB1-12F Specification V1.1.0 10. Product related models Table 8 Product related model list Model Ai-WB1-12F Ai-WB1-32S Ai-WB1-12F-Kit Ai-WB1-32S-Kit Power Supply 3.0V ~ 3.6V I 500mA 3.0V ~ 3.6V I 500mA 3.3V or 5V, I>500mA 3.3V or 5V, I>500mA Packa ge SMD-
22 SMD-
38 DIP-3 0 DIP-3 8 Size Antenna 24.0*16.0*3.1( 0.2)mm on-board PCB antenna Default onboard PCB 25.5*18.0*3.1( 0.2)mm antenna/compatible 25.41*55.19(0.2)mm 25.4*55.78(0.2)mm IPEX interface on-board PCB antenna on-board PCB antenna Product related information https://docs.ai-thinker.com Ai-WB1-12F Specification V1.1.0 11. Product Packaging Information Ai-WB1-12F module is packaged in a tape, 800pcs/reel.As shown in the below image:
Figure 16 Package and packing diagram 12. Contact us Ai-Thinker official website Office forum Develop DOCS LinkedIn Tmall shop Taobao shop Alibaba shop Technical support email support@aithinker.com Domestic business cooperation sales@aithinker.com Overseas business cooperation overseas@aithinker.com Company Address Room 403,408-410, Block C, Huafeng Smart Innovation Port, Gushu 2nd Road, Xixiang, Baoan District, Shenzhen. Tel +86-0755-29162996 WeChat mini program WeChat official account Ai-WB1-12F Specification V1.1.0 Disclaimer and copyright notice The information in this article,including the URL address for reference,is subject to change without notice. The document is provided"as is"without any guarantee responsibility,including any guarantee for merchantability,suitability for a specific purpose,or non-infringement,and any guarantee mentioned elsewhere in any proposal,specification or sample.This document does not bear any responsibility,including the responsibility for infringement of any patent rights arising from the use of the information in this document.This document does not grant any license for the use of intellectual property rights in estoppel or other ways,whether express or implied. The test data obtained in the article are all obtained from Ai-Thinker's laboratory tests,and the actual results may vary slightly. All brand names,trademarks and registered trademarks mentioned in this article are the property of their respective owners,and it is hereby declared. The final interpretation right belongs to Shenzhen Ai-Thinker Technology Co.,Ltd. Notice Due to product version upgrades or other reasons,the contents of this manual may be changed. Shenzhen Ai-Thinker Technology Co.,Ltd.reserves the right to modify the contents of this manual without any notice or prompt. This manual is only used as a guide.Shenzhen Ai-Thinker Technology Co.,Ltd. makes every effort to provide accurate information in this manual.However, Shenzhen Ai-Thinker Technology Co.,Ltd. does not guarantee that the contents of the manual are completely free of errors.All statements and information in this manual And the suggestion does not constitute any express or implied guarantee. FCC WARNING FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncon-
trolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labelled in a visible area with the following:
Contains Transmitter Module 2ATPO-AIWB1 Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15C (15.247).it Specifically identified AC Power Line Conducted Emission, Radiated Spurious emissions, Band edge and RF Conducted Spurious Emissions, Conducted Peak Output Power, Bandwidth, Power Spectral Density, Antenna Requirement. 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-
point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturers instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. Explanation: The product antenna uses an irreplaceable antenna with a gain of 1dBi 2.4 Single Modular If a modular transmitter is approved as a Single Modular , then the module manufacturer isresponsible for approving the host environment that the Single Modular is used with. The manufacturer of a Single Modular must describe, both in the filing and in the installation instructions, the alternative means that the Single Modular manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A Single Modular manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as:
shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This Single Modular procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is a single module. 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna); b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered); c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout; d) Appropriate parts by manufacturer and specifications; e) Test procedures for design verification; and f) Production test procedures for ensuring compliance The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID
(new application) procedure followed by a Class II permissive change application 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions
(mobile, portable xx cm from a persons body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). Explanation: The module complies with FCC radiofrequency radiation exposure limits for uncontrolled environments. The device is installed and operated with a distance of more than 20 cm between the radiator and your body." This module follows FCC statement design, FCC ID :2ATPO-AIWB1 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an omni-directional antenna is not considered to be a specific antenna type). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The product antenna uses an irreplaceable antenna with a gain of 1dBi 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: "Contains FCC ID: 2ATPO-AIWB1 2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturers determination that a module as installed in a host complies with FCC requirements. Explanation: Ningde lingyang Electronic Technology Co., Ltd. can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter. 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.
This product uses the FCC Data API but is not endorsed or certified by the FCC