| submitted | available | document details (if available) | source link |
|---|---|---|---|
| August 29 2019 | August 29 2019 | 关于申请专利应提交资料 starcraft |
| various | User Manual | Users Manual | 919.82 KiB | August 29 2019 |
m1805 Module Specification Cost-sensitive m1805 Module MS48SF2 Specification UART module MS48SF2 is based on m1805 Chipset. It is a small size (16122mm) and stand-alone module with 12 GPIO. The data transmission between module and mobile phone can be achieved via operation of UART. With up to 60-meter working distance in open space, 512KB flash memory, etc., the data can be transmitted via Bluetooth Features Range: 10-60Mopen space Flash memory: 512KB Received sensitivity: -97dBm Transmitted power: -20~+5dBm Transmitted current: 8mA/0dBm Received current: 8mA GPIO: 12 Size: 15.8122mm Working voltage: 3.0- 3.6V Working frequency: 2400-2483 MHz Working temperature: -30C- +60 C Depth optimization of BLE stack Power consumption of sleep mode is under 4uA Transmission speed is up to 3kB/s UART instruction supported Android 4.3+, IOS 7+ supported MFi is not required 50 ohm PCB antenna With metal cover shield Applications Medical devices Heart rate monitor Blood pressure monitor Blood glucose meter Thermometer Sport facilities Weighing machine Sports and fitness sensors Accessories 3D glasses and gaming controller Mobile accessories Remote controllers / Toys Electronic devices Cycle computer Certification ISO 9001 ISO14001 OAHS18001 Copyright Minew 1 m1805 Module Specification Revision history Version Date V 1.0 2019.02.22 Notes Compiling the specification Contributors Person of Approve Lynn Copyright Minew 2 m1805 Module Specification Index Revision history..........................................................................................................................................................................2 1. Product introduction.............................................................................................................................................................. 4 1.1 Ordering information...................................................................................................................................................4 2. Pin description........................................................................................................................................................................5 2.1 Pin assignment............................................................................................................................................................ 5 2.2 Pin definition.................................................................................................................................................................5 2.3 Block diagram.............................................................................................................................................................. 6 2.4 Mechanical drawing....................................................................................................................................................6 3. Electrical specification.......................................................................................................................................................... 7 3.1 Absolute maximum ratings........................................................................................................................................ 7 3.2 Recommended operating conditions.......................................................................................................................8 3.3 Electronic characteristic.......................................................................................................................................... 8 3.3.1 General radio characteristics.........................................................................................................................8 3.3.2 Radio current consumption (Transmitter)....................................................................................................8 3.3.3 RX BLE 1Mbps GFSK (Receiver).................................................................................................................9 3.3.4 RX BLE 2Mbps GFSK.....................................................................................................................................9 3.3.5 RX 500kbps GFSK........................................................................................................................................10 3.3.6 RX 125Kbps GFSK........................................................................................................................................11 3.3.7 RSSI Specifications.......................................................................................................................................11 4. Electrical schematic............................................................................................................................................................ 12 5. Package information...........................................................................................................................................................13 5.1 Package dimension.................................................................................................................................................. 13 6. Reflow and soldering.......................................................................................................................................................... 15 7. Notes & cautions................................................................................................................................................................. 16 7.1 Design notes..............................................................................................................................................................16 7.2 Layout notes.............................................................................................................................................................. 16 7.3 Installation and soldering.........................................................................................................................................17 7.4 Handling and storage ............................................................................................................................................. 17 7.5 Life support applications ........................................................................................................................................18 8. Disclaimer.............................................................................................................................................................................18 9. Contact information.............................................................................................................................................................19 Copyright Minew 3 m1805 Module Specification 1. Product introduction UART module MS48SF2 is based on m1805 Chipset. is a small size (16122mm) and stand-alone module with 12 GPIO. The data transmission between module and mobile phone can be achieved via operation of UART. With up to 60-meter working distance in open space, 512KB flash memory and -97dBm received sensitivity, the data can be transmitted via Bluetooth. It MS48SF2 is a compact module with a metal cover shield which can support Android 4.3+, IOS 7+. Its BLE stack can be depth optimization and the transmission speed is up to 3kB/s. 1.1 Ordering information Ordering number Description MS48SF2 PS1912OB, m1805FA-R, PCB ANT, reel pack Copyright Minew 4 2. Pin description 2.1 Pin assignment m1805 Module Specification 2.2 Pin definition Symbol VCC GND NC ANT P00 P01 P02 P03 P09 P10 P14 P25 P31 P32 P33 P34 Description Power positive pole Power negative pole null Antenna All functions configurable/JTAG_TDO(Not support ADC function) All functions configurable/JTAG_TDI (Not support ADC function) All functions configurable/JTAG_TMS (Not support ADC function) All functions configurable/JTAG_TCK (Not support ADC function) All functions configurable (Not support ADC function) All functions configurable (Not support ADC function) All functions configurable/ AIO <3>
All functions configurable/test_mode_select[1](Not suppor interrupt du) All functions configurable (Not support interrupt and ADC function) All functions configurable(Not support interrupt and ADC function) All functions configurable (Not support interrupt and ADC function) All functions configurable (Not support interrupt and ADC function) Copyright Minew 5 2.3 Block diagram m1805 Module Specification 2.4 Mechanical drawing Unit: mm Tolerance: +/- 1.0, default Copyright Minew 6 m1805 Module Specification 3. Electrical specification The electrical specifications of the module are directly related to the Specifications for the m1805 chipset. The below information is only the extract from m1805 specification. For more detailed information, please refer to the up-to-date specification of the chipset available. 3.1 Absolute maximum ratings Parameter Min. Max Unit Symbol Supply voltages VDD3 DEC VSS I/O Pin voltage VIO Environmental (AQFN package) Storage temperature Moisture Sensitivity Level Human Body Model Class 2 Charged Device Model MSL ESD HBM ESD CDMQF Flash memory Endurance Retention of times Number an address can be written between erase cycles
-0.3
+3.6 1.32 0
-0.3 VDD + 0.3V
-40
+125 3 2 500 V V V V C KV V 20000 10 years at 40C Write/erase cycles 2 Times Notes Maximum ratings are the extreme limits to which the chip can be exposed for a limited amount of time without permanently damaging it. Exposure to absolute maximum ratings for prolonged periods of time may affect the reliability of the device. Copyright Minew 7 m1805 Module Specification 3.2 Recommended operating conditions Symbol VDD3 tr_VDD Parameter supply voltage,normal mode Supply rise time (0 V to 1.8 V) TA Operating temperature Min. 1.8 Nom. 3.0
-40 27 Max. 3.6 100 125 Units V ms C Important : The On-chip power-on reset circuitry may not function properly for rise times longer than the specified maximum. 3.3 Electronic characteristic 3.3.1 General radio characteristics Description Parameter Tx only at 0dBm With internal DC-DC @ 3V With internal DC-DC @ 3V Rx only Max. Min. TYP 8 8 3.3.2 Radio current consumption (Transmitter) Parameter RF Max output Power RF Min Output Power Description Min. OBW for BLE 1Mbps 20dB occupy-bandwidth for BLE modulation 1Mbps OBW for BLE 2Mbps 20dB occupy-bandwidth for BLE modulation 2Mbps OBW for GFSK 500 kbps 20dB occupy-bandwidth for GFSK modulation 2Mbps OBW for GFSK 125 bps 20dB occupy-bandwidth for GFSK modulation 2Mbps Error Vector Measure FDEV for BLE 1Mbps Offset EVM for OQPSK modulation Frequency deviation for GFSK modulation 1Mbps FDEV for BLE 2Mbps Frequency deviation for GFSK modulation 2Mbps 160 320 Max. Typ. 10
-20 1100 2300 1100 1100 0.02 250 500 kHz kHz Units mA mA Units dBm dBm kHz kHz kHz kHz Copyright Minew 8 3.3.3 RX BLE 1Mbps GFSK (Receiver) m1805 Module Specification Parameter Rx Sensitivity co-channel rejection Selectivity +-1MHz Selectivity +-2MHz Selectivity +-3MHz Selectivity +-4MHz Selectivity +-5MHz or More Selectivity frequency Imag Intermodulation Carrier Frequency Offset Tolerance Sample Offset Tolerance Clock Description Sensitivity test 1Mbps BLE ideal BER=1E-3 transmitter, 37 Byte Min Typ.
-97 modulated interferer in channel, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 1MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 2MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 3MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 4MHz, 37 Byte BER=1E-3 Wanted signal at 5MHz, 37 Byte BER=1E-3 Wanted imagefrequency, 37 Byte BER=1E-3 Wanted signal at 2402MHz, -64dBm, Two interferers at 2405 and 2408 MHz respectively, at the given power level, 37 Byte BER=1E-3
-67dBm, modulated interferer at >=+/-
-67dBm, modulated interferer signal at at
-6 7 45 50 50 55 22
-20
+-350
+-120 Max. Units dBm I/C dB I/C dB I/C dB I/C dB I/C dB I/C dB I/C dB dBm KHz ppm 3.3.4 RX BLE 2Mbps GFSK Symbol Rx Sensitivity co-channel rejection Selectivity +-1MHz Selectivity +-2MHz Selectivity +-3MHz Copyright Minew Description Sensitivity test 2Mbps BLE ideal transmitter, 37 Byte BER=1E-3 Min Typ.
-94 Max. Units dBm modulated interferer in channel, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 1MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 2MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 3MHz, 37 Byte BER=1E-3
-6
-5 9 30 I/C dB I/C dB I/C dB I/C dB 9 Wanted signal at -67dBm, modulated interferer at +/- 4MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at >=+/- 5MHz, 37 Byte BER=1E-3 Wanted imagefrequency, 37 Byte BER=1E-3 Wanted signal at 2402MHz, -64dBm, Two interferers at 2405 and 2408 MHz respectively, at the given power level, 37 Byte BER=1E-3
-67dBm, modulated interferer signal at at Selectivity +-4MHz Selectivity +-5MHz or More Selectivity frequency Imag Intermodulation Carrier Frequency Offset Tolerance Sample Offset Tolerance Clock 3.3.5 RX 500kbps GFSK transmitter, 37 Byte Description Sensitivity test 500Kbps BLE ideal BER=1E-3 modulated interferer in channel, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 1MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 2MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 3MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 4MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at >=+/-
5MHz, 37 Byte BER=1E-3 Wanted imagefrequency, 37 Byte BER=1E-3 Wanted signal at 2402MHz, -64dBm, Two interferers at 2405 and 2408 MHz respectively, at the given power level, 37 Byte Ber=1E-3
-67dBm, modulated interferer signal at at Parameter Rx Sensitivity co-channel rejection Selectivity +-1MHz Selectivity +-2MHz Selectivity +-3MHz Selectivity +-4MHz Selectivity +-5MHz or More Selectivity frequency Imag Intermodulation Frequency Carrier Offset Tolerance Sample Clock Offset Tolerance Copyright Minew m1805 Module Specification 40 55 22
-20
+-350
+-120 I/C dB I/C dB I/C dB dBm KHz ppm Min Typ.
-98
-4 10 45 50 50 55 24
-19
+-350
+-120 Max. Units dBm I/C dB I/C dB I/C dB I/C dB I/C dB I/C dB I/C dB dBm KHz ppm 10 3.3.6 RX 125Kbps GFSK m1805 Module Specification Description Sensitivity test 125Kbps BLE ideal BER=1E-3 transmitter, 37 Byte Min Typ.
-103 Parameter Rx Sensitivity co-channel rejection Selectivity +-1MHz Selectivity +-2MHz Selectivity +-3MHz Selectivity +-4MHz Selectivity +-5MHz or More Selectivity frequency Imag Intermodulation Carrier Frequency Offset Tolerance Sample Offset Tolerance Clock modulated interferer in channel, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 1MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 2MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 3MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at +/- 4MHz, 37 Byte BER=1E-3 Wanted signal at -67dBm, modulated interferer at >=+/- 5MHz, 37 Byte BER=1E-3 Wanted signal at frequency, 37 Byte BER=1E-3 Wanted signal at 2402MHz, -64dBm, Two interferers at 2405 and 2408 MHz respectively, at the given power level, 37 Byte BER=1E-3
-67dBm, modulated interferer at image 3.3.7 RSSI Specifications Parameter RSSI Dynamic Range RSSI Accuracy RSSI Resolution RSSI Period Description Min RSSI Accuracy Valid in range -100 to -30dBm Totally 7bit, from 0 to 127 Max. Units dBm I/C dB I/C dB I/C dB I/C dB I/C dB I/C dB I/C dB dBm KHz ppm Max. Units dB dB dB us
-1
-11 45 50 50 55 28
-18
+-350
+-120 Typ. 70
+/-2 1 8 Copyright Minew 11 4. Electrical schematic m1805 Module Specification Copyright Minew 12 5. Package information 5.1 Package dimension m1805 Module Specification Unit: mm Tolerance: +/- 0.1, default Copyright Minew 13 m1805 Module Specification Unit: mm Tolerance: +/- 0.1, default Details Quantity(module) Tape Weight Single module Weight Gross Weight Dimension Tolerance: +/- 10g, default Reel 850PCS 450g 0.6g 970g W44mm T0.35mm Copyright Minew 14 6. Reflow and soldering m1805 Module Specification Profile Feature Solder Paste Preheat Temperature min (Tsmin) Preheat Temperature max (Tsmax) Preheat Time (Tsmin to Tsmax)(ts) Average ramp-up rate (Tsmax to Tp) Liquidous Temperature (TL) Time (tL)Maintained Above (TL) Peak Temperature (Tp) Average ramp-down rate (Tp to Tsmax) Time 25C to peak temperature Sn-Pb Assembly Sn63/Pb37 100C 150C 60-120 sec 3C/second max 183C 60-90 sec 220-235C 6C/second max 6 minutes max Pb-Free Assembly Sn96.5/Ag3/Cu0.5 150C 200C 60-120 sec 3C/second max 217C 30-90 sec 230-250C 6C/second max 8 minutes max Copyright Minew 15 m1805 Module Specification 7. Notes & cautions We cannot assure that the specification has no errors and omission even though this specification is under collate and check strictly. This specification is under the protection of laws and regulations of copyright, please do not copy and duplicate at any form, or do not transmit part or full of this specification in any wire and wireless network in any form, or do not edit or translate to any other format, word, code, etc. 7.1 Design notes
(1) It is critical to following the recommendations of this document to ensure the module meets the specifications.
(2) The module should be placed at the edge of the circuit board as far as possible to keep away from other circuits.
(3) Antenna should be kept away from other circuits. It can prevent low radiation efficiency and the normal use of other circuits from being affected.
(4) The landing of components should be appropriate and that is better for reducing the parasitic inductance.
(5) Please refuse to supply voltage that is not within the range of specification.
(6) Please make sure the module or its surface may not suffer from the physical shock or extreme stress. 7.2 Layout notes To make sure wireless performance is at its best condition, please layout the module on the carrier board as below instructions and picture.
(1) Placement of the antenna The antenna area of module shall lay clearance completely and should not be blocked by the metal. Otherwise it will have effect on antenna performance (As the picture indicated below).
(2) Placement of top-layer The placement of top-layer in carrier board shall be lay copper completely to reduce the signal line in carrier board or other interference.
(3) Clearance Copyright Minew 16 The upper and below area of antenna (including the case) shall have 4mm or more than 4mm clearance to reduce the influences for antenna. m1805 Module Specification
*The Grey area above is Carrier board. 7.3 Installation and soldering
(1) Please do not lay copper under the module antenna. It can prevent the influence of signal radiation and the transmission distance from being affected. 7.4 Handling and storage
(1) Due to the fact that CMOS components are included in the module, it is better to eliminate static electricity at any methods when transporting or working with the module. Moreover, it is strongly recommended adding anti-ESD components to circuit design to hinder damage from real-life ESD events. Anti-ESD methods can be also used in mechanical design. Copyright Minew 17 m1805 Module Specification
(2) Please store the modules within -40 to +125 before and after installation and make sure the modules is away from the direct sunlight exposure for a long duration. Modules should be far away from humid and salty air conditions, and any corrosive gasses or substances.
(3) Please not to wash the module. No-Clean Paste is used in production. The metal shield may be oxidized by the washing process and may lead to chemistry reaction with No-Clean Paste. If modules goes through the washing process, functions of the module may not guaranteed. 7.5 Life support applications
(1) The module is not design for life support device or system and not allowed to be used in destructive devices or system in any direct, or indirect ways. Minew is not responsible for compensation of any losses when applying modules under such application as described above.
(2) Minew shall not responsible for the customers products or application. 8. Disclaimer The factory has passed the ISO9001 quality management system, ISO14001 environmental management system and OAHS18001 occupational health and safety assessment . Each product has been rigorously tested (transmission power test, sensitivity test, power consumption test, stability test, aging test, etc.).
* NOTICES:
(1) The Bluetooth trade mark is owned by the Bluetooth SIG Inc. USA.
(2) All other trademarks listed herein are owned by their respective owners.
(3) All specifications are subject to change without notice.
(4) Please do not use this specification for produce, sell or illegal purpose without Minews authorization.
(5) Minew have right to interpret all the items above. Copyright Minew 18 m1805 Module Specification 9. Contact information Manufacturer: Shenzhen Minew Technologies Co., Ltd. Tel: 0086-755-2103 8160 Email: info@Minew.com URL: https://www.minew.com/
Address:
3rd Floor, Building I, Gangzhilong Science Park, Qinglong Road, Longhua District, Shenzhen 518109, China Copyright Minew 19 FCC WARNING This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help. The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction. This module meets the requirements of FCC part 15C(15.247).it specifically establish the 6dB Bandwidth, Peak Output Power, Radiated Spurious Emission, Power Spectral Density, Restricted Band of Operation and Band Edge, Out of Band Emissions. It is a single module. PCB antenna, antenna gain tolerance:-2.48dBi 0.5 The antenna cannot be removed , Unconventional interface, The module with trace antenna designs, and This manual has been shown the layout of trace design, antenna, connectors, and isolation requirements. This module Its complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This module is designed to comply with the FCC statement, FCC ID is: 2ABU6-MS48SF2. The host system using this module, should have label in a visible area indicated the following texts:
"Contains FCC ID: 2ABU6-MS48SF2. SHENZHEN MINEW TECHNOLOGIES CO., LTD. can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter. The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.
This product uses the FCC Data API but is not endorsed or certified by the FCC