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RAK 833DataShee et K833Lo oRa G Gatew way RAK CIemo odules V1.3 sheet swith M MiniP D Datas SPI a and US SBinte erface e 2018 Rakw M Mentioned in n names, trade A After updatin wireless all ri n this docume emarks are th ng new versio ights reserve ent, the actu heir respecti on, this docu ed. al company ve owners. ument withou and product e. ut prior notice 1 ShenzhenRak w www.rakwiresle kwirelessTechno ess.comETDX17 ologyCo.,LtdCo 70224 opyright
nts C Conten
................ ............... ............... ............... ............... ............... C Contents .. 1 1. Funct tional desc cription .... ............... ............... ............... ............... 1.1. Ov verview ... ............... ............... ............... ............... ............... 1.2.Produ uct Param eters ....... ............... ............... ............... ............... 1.3. Or rder NO. . 2 2. Interfa aces ......... ............... ............... ............... ............... ............... ............... ............... ............... ............... ............... 2.1. Ov verview ... ............... ............... ............... ............... ............... 2.2. 2.3. 2.3.1. 2.3.2. 2.3.3. 2.3.4. 2.3.5. 2.3.6. In terface .... ............... ............... ............... ............... ............... Pi n definitio on with m ini-PCIE .. ............... ............... ............... Module supply in put .......... Antenna a RF interf faces ....... ............... ............... ............... ............... ............... ............... SPI inte rface ....... USB inte erface ..... ............... ............... ............... ............... ............... ............... ............... ............... RESET . ............... ............... ............... ............... ............... SPDT_S SEL .......... ............... ............... ............... ............... 3 3. Electr rical specif fications .. ............... ............... ............... ............... 3.1. Ab bsolute m maximum r rating ....... ............... ............... ............... 3.2. Ma aximum E ESD .......... ............... ............... ............... ............... RAK 833DataShee et
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................ .............. 9 9 3.3. Op 3.3.1. Op 3.3.2. Su 3.3.3. Cu 3.3.4. Lo perating C perating temp upply/power p urrent consum oRa RF chara Conditions perature rang pins ............. mption ......... acteristics .... s .............. ge ................ ................... ................... ................... ............... ................... ................... ................... ................... ............... ................... ................... ................... ................... ............... ................... ................... ................... ................... ............... .................. .................. .................. .................. 0
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2 4 4. Mecha anical spe cifications s ............... ............... ............... ............... 5 5. RAK8 33 Module e schemati ic ............. ............... ............... ............... 6 6. Refere ence Appli ication ..... ............... ............... ............... ............... 7 7. Conta act ............ ............... ............... ............... ............... ............... 8 8. Chang ge Note .... ............... ............... ............... ............... ............... RAK 833DataShee et
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. Func 1 ctional descr ription 1
.1. Overv view RAK 833DataShee et LoRa conc ntegration centrator c into an exi cards with sting route mini PCIe rs and othe form facto ers network or based o n k equipmen nt y embedded d platform offering a f free mini-P PCIe slot wi th USB an d andcosteffic It targeted up to uleshavethe icationboar cientLoRa g gateway sol lutionofferin g fixed ne rt metering d at smar km2 pe n nodes er ExpressMin andardPCIE eindustrysta rdandisalso oidealforma anufacturing ngupto10 p etworks an in mo niCardformf gofsmallser programma nd Internet oderately factor,which ries. 500 able paralle el s t of Thing interfere d henablesea a family of s an easy i abilities. used in any The RA X1301, wh SX ith Lora Ga w The car SP PI connecti RA AK833area de emodulatio ap pplications en nvironmen sy yintegration AK833 is a ich enables ateway cap d can be u ivity. acompletea on paths. s with t.Themodu nintoanappl 1. 2. Produ uct Para meters M Module Protocol Lora Chip pset nd Dual-Ban cy Range Frequenc Power Inp Hardware Software Multichan LEDs USB Node Nu Range Power C put e Interface e Interface nnel umbers onsumption RX Sens Max RF Mean RF Operatio sitivity Output F Output n Temperatu ure S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
4 Frequency y LoRaW WAN 1.0.2 1 SX1301 868MH Hz,915MHz 3870MHz EU863 3.3927.5MH US923 Hz DC 3.3 3 5%
Mini-PC CIE PI USB/S ks1downlin 8uplink 2*LEDs s for PA_EN 0, USB-to-SP USB2.0 odes/km2 500 no Urban2 2~4km/Subu ax): 135 mA TX (ma channels):26 RX(all Ldle:71 1mA Up to -
Up to +
Up to +
48to+
Table1 136.5dBm@
+9 dBm
+9 dBm
+85C 1: Module Pa 60mA
@SF12 arameters nk and LNA_E N 2232H PI bridge FT2 r5~10km/Op pen Area>15k km RAK 833DataShee et cribed in Fi hip for RF s processing s Mini Card igure 1, the signal, whic g functiona complianc e RAK833 ch represe allilies. Add ce, and one card integ nts the cor ditional sign e U. FL con grates one re of the de nal conditio nnectors ar SX1301 ch evice, prov oning circui re available hip and two iding the re itry is imple e for extern
/7 o SX1255/
Ra elated LoR emented fo or as nal antenna As desc nd other ch an m odem and CI Express PC in tegration. 1
.3. Order r NO. art Number Pa r Descri ption RAK83 3-SPI/USB
-915 USB and d SPI, 923
.3MHz-927 7.5 MHz RAK83 3-SPI/USB
-868 USB a and SPI, 8 63MHz-870 0 MHz SPI
, 923.3MH Hz-927.5 M MHz S PI, 863MH le2: Module Number Tabl Hz-870 MHz z RAK 833-SPI-9 15 RAK 833-SPI-8 68 2 2. Inter rfaces 2
.1. Overv view S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
5 2
.2. Interf face Figu ure2:Module View Figure e3:Module In terface RAK 833DataShee et efinition with mi ni-PCIE
.3. Pin d 2 No CIEx PIN Mini PC Re ev.2.0 RAK833 PIN Power I/O Descr ription Remarks 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 WAKE#
3.3Vaux COEX1 GND COEX2 1.5V CLKREQ Q#
WR UIM_PW ATA GND UIM_DA REFCLK-
UIM_CLK K
+
REFCLK+
UIM_RES SET GND U UIM_SPU UIM_IC_ _DM GND N/A BLE1#
20 W_DISA 21 22 23 24 25 GND PERST#
PERn0 3.3Vaux PERp0 NC 3.3Vaux NC GND NC NC NC NC GND NC NC NC NC NC GND NC SPDT_SEL GND N/A NC GND RESET NC 3.3Vaux NC 3.3Vaux GND GND GND GND GND 3.3Vaux S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A RAK K833supply inpu t Gro ound ound Gro Gro ound Gro ound Internallyn Connectto notconnected o3.3V Internallyn Connectt Internallyn Internallyn Internallyn Internallyn notconnected toGround notconnected notconnected notconnected notconnected Connectt Internallyn toground notconnected notconnected notconnected notconnected notconnected toground notconnected 10K ohm pull-up p toground Internallyn Internallyn Internallyn Internallyn Connectt Internallyn Internal 1 Connectt N/A Gro RAK ound K833resetinput RAK K833supply inpu t N/A N/A I N/A I N/A 6 Internallyn Connectt Active hig Internallyn Connectto Internallyn notconnected toground gh(100ns) for S notconnected o3.3V notconnected SX1301 RAK 833DataShee et Gro ound Gro ound Connectt Connectt Internallyn Connectt Internallyn toground toground notconnected toground notconnected 26 27 28 29 30 31 32 33 34 35 36 GND GND 1.5V GND SMB_CL LK ATA PETn0 SMB_DA PETp0 GND GND USB_D-
GND GND NC GND NC NC NC NC GND GND USB_D-
GND GND GND GND GND USB N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A I/O Gro Gro USB ound ound BDataLineD-
37 38 GND USB_D+
+
GND USB_D+
GND USB N/A I/O Gro USB ound BDataLineD+
WAN#
3.3Vaux GND 3.3Vaux LED_WW GND LED_WL LAN#
d Reserved LED_WP PAN#
Reserved d 1.5V Reserved d GND 39 40 41 42 43 44 45 46 47 48 49 50 51 W_DISA 52 3.3Vaux BLE2#
3.3Vaux GND 3.3Vaux NC GND NC PCIe_SCK NC PCIe_MISO NC PCIe_MOSI GND PCIe_CSN 3.3Vaux 3.3Vaux GND 3.3Vaux GND GND K833supply inpu ound K833supply inpu t t RAK Gro RAK Gro ound Hos st SPI CLK Hos st SPI MISO Hos st SPI MOSI Gro Hos ound st SPI CS I N/A I N/A N/A N/A I/O N/A I/O N/A I/O N/A I/O I 3.3Vaux RAK ble3: Pin Def K833supply inpu finition Tab t Internally Internally Internally Connect Connect 90-ohm impedan Pull-up,p downand SB2.0sp theUSBp Connect 90-ohm impedan Pull-up,p downand SB2.0sp theUSBp neednotb ynotconnected ynotconnected ynotconnected ttoground ttoground nominal differen nce. pull-
dseriesresistorsa ecificationsare p pin driverand ttoground nominal differen nce. pull-
dseriesresistorsa ecificationsare p pin driverand beprovidedextern ntial asrequiredbyU partof ntial asrequiredbyU partof nally. Connectt Connect Connectt Internally Connect Internally Max 10M Internally Internally Connect Connectt to3.3V ttoground to3.3V ynotconnected ttoground ynotconnected MHz clock ynotconnected ynotconnected ttoground to3.3V 2
.3.1. Mod dule supp ply input t RAK833 ust be stab m ba ased on the 3 card mus ble, becaus e power con t be suppli se during th nsumption ed through his operatio profile of th h the 3.3Va n the curre he SX1301 ux pins by nt drawn fr chip (see S a DC pow rom 3.3Vau SX1301 DS wer supply. ux can vary S). The voltag significant e ly, S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
7 RAK 833DataShee et
.3.2. Ante 2 enna RF interface es The mod w ith a chara ntenna inte an dules have cteristic im rface. e one RF in pedance o terfaces ov f 50. The R ver a stand RF port (AN ard U. FL c NT1) suppo connectors orts both Tx
(Hirose U. x and Rx, p FL-R-SMT T) e providing th 2
.3.3. SPI interface e A SPI in th e system c ynchronous sy nterface is connector. T s full-duplex provided o The SPI int x protocol. on the PCIe terface give Only the sl e_SCK, PC es access t ave side is CIe_MISO, to the confi implement PCIe_MO guration re ted. SI, PCIe_C egister of SX CSN pins o of a X1301 via 2
.3.4. USB ote:RAK833 No RAK833 U SB 2.0 com co ommunicati an nd can be ease refer pl B interfac 3SPIdonth 3 card can mpliant inte ion with an connected to the data ce avethisfeat support th erface with external ho to any US a sheet of F ture e high spe maximum ost applica SB host eq FT2232H. eed USB to 480 Mb/s d tion proces uipped with o SPI by FT data rate, r ssor. The m h compatib T2232H, it representin module itself ble drivers. includes a ng the interf f acts as a For more d high-spee ny face for an ce USB devic information n, 2
.3.5. RES SET RAK833 sp pecified by 3 card inclu the SX130 udes the R 1 Specifica RESET act ation. ive-high in put signal to reset th he radio op perations a as 2
.3.6. SPD DT_SEL RAK833 PDT_SEL=
SP U SB Port. in 3 card ncludes
="H", USB e SPDT_ th ble, SPDT_ Port Enab t for sele input SEL SPI Port E _SEL="L", ecting SP Enable. Inte interface e. B I or USB ult UP, Defau ernal Pull S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
8 RAK 833DataShee et 3 3. Elect trical s specifi cation ns Stre ayc diti ons fec essingthede causeperma onsothertha shouldbeavo tdevicerelia eviceaboveo anentdamag anthosespe oided.Expos ability. oneormoreo e.Theseares cifiedintheO suretoAbso oftheratings stressrating OperatingCo oluteMaximu listedintheA gsonly.Opera onditionssec umRatingco AbsoluteMax atingthemod ctions(chap nditionsfore ximumRatin duleatthese pter4.1)ofthe extendedper ngsectionm eoratanycon especificati riodsmayaf Th he Operating Whereap gconditionra pplicationinf angedefineth formationisg hoselimitwit given,itisadv thinwhichthe visoryonlyan efunctionali nddoesnotfo tyofthedevic ormpartofth ceisguarant especificatio eed. on. 1. Abso olute max ximum ra ating Limitingv valuesgivenb belowareinac cordancewith htheAbsolute eMaximumR atingSystem m(IEC134). Symbol 3.3Vaux USB SPDT SE RESET SPI Rho ANT Tstg Descript Modulesu USBD+/D L Port sele RAK833r SPI interf Antennar StorageT tion upplyvoltag D-pins ect resetinput face ruggednes Temperatur n Condition oltageat3.3Va InputDCvo oltageatUSBi InputDCvo InputDCvo oltageatSPDT oltageat RES InputDCvo InputDCvo oltageat SPI i OutputRFl oadmismatc auxpins s nterfacepins T SELinputp pins ET inputpin interfacepin hruggedness satANT Mi 0 in. 3 0 0 0
.3
.3
.3 4 0 x. 1 Ma 3. 3. 3. 3. 3. 10:
85 Unit V V V V V VSWR R C Theproduc sexceedingt iedboundar ctisnotprote thepowersu riesbyusinga Table4:Ab ectedagains pplyvoltage appropriatep bsolutemax stovervoltag especificatio protectiond gs ximumrating georreversed dvoltages.If ableabove,m on,giveninta evices. mustbelimite necessary y, edtovaluesw wi oltagespikes vo th inthespecif 3
.2. Maxim mum ES D Typic cal Max 1000 Unit V Re emarks umanBodyModel Hu accordingtoJES D22-A114 Parameter ESDsensitivit xceptANT1 ESDsensitivit ESDimmunity tyforallpinse tyforANT1 yforANT1 M Min Table5 1000 4000 8000 V V V Hu Co Air ESDratings
:MaximumE umanBodyModel ontactDischargea r Dischargeaccor accordingtoJES accordingtoIEC6 rdingtoIEC61000 D22-A114 61000-4-2 0-4-2 RA ion AK833cardare 7.2forESDha eElectrostat andlinginstru icSensitiveD uctions. Devicesandre equirespecia alprecautions swhenhandl ing.Seesect 3 S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
9 3
.3. Opera ating Co onditions s RAK 833DataShee et Unlessoth Operation bey herwiseindica n beyondth yondthemm ated,alloperat he operating ayaffectdev specifications tingconditions s is not reco g conditions vicereliability y. sareatanambie ommended a enttemperatu and extende ureof25C. ed exposure 3. 3.1. Oper rating tem perature r range er Paramete Normalope eratingtempera ature M Min. 20 Typic
+25 cal Max.
+65 Unit C Extendedo operatingtempe erature 40
+85 C Rem Norm
(fully Exte
(RFp norm marks maloperatingte yfunctionaland endedoperating performancem maloperatingra emperaturerang meet3GPPspe gtemperaturera aybeaffectedo nge,thoughmo ge ecifications) ange utside oduleisfullyfun Table6:E Environmenta alconditions 3. 3.2. Supp ply/power pins Symbo ol 3.3Vaux x Para Mod ameter dulesupplyo Table7:In operatingin nputchara nputvol acteristics Min. 3.00 sofSupply/
/Powerpin ns Typica 3.30 al Max. 3.60 Unit V Input tvoltageat3 3.3Vauxmu ustbeabove ethenorma o onthemodu aloperating ule. grangemini imumlimitto oswitch-
3. 3.3. Curre ent consu umption Mode Idle-Mo ode Condition All of the chip mode or shut p on the board tdown. enter idle Mode Mode Active-
(TX) Active-
(RX ) of TX channel is 23dBm and d The power o 3.3V supply. TX disabled and shutdown n PA. Min 60 Type Max 100 Unit uA TBD TBD mA mA Tabl le8:Module3.3 3Vauxsupplyc urrentconsum mption 3. 3.4. LoRa The follow a RF chara acteristics s gives typicall wing table g nal Sign Bandwidt h/[KHz]
500 0 500 0 S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
10 ly sensitivity y level of the e RAK833 ca ard Spreadin g Factor 12 2 7 7 Ra RF Chara Table9:LoR acteristics Sensitiv vity/[dBm]
134
-
-
120 RAK 833DataShee et 4 4. Mech hanica al spec cificatio ons RAK833 ith top-side w w idth and al Sp pecification Th he weight o 3 card are f e and botto ll the other n [9] except of the RAK8 fully compli om-side ke r dimension t for the ca 833 card is ant to the 5 eep-out are ns as defin rd thicknes about 9.7 52-pin PCI eas, with 5 ned by the ss (nominal g. Express Fu 50.95 mm PCI Expre value is 3 ull-Mini Car nominal le ess Mini C
.7 mm), as rd Type F2 ength, 30 m ard Electro described form facto r, mm nomina al omechanica al in Figure 2 2. F Figure4:RA AK833card mechanica aldimensio ons(topvie ew,sideview w,bottomv view) gardingmec chanicalspe ecificationss seethePCIE ExpressMin niCardElect t Forfurthe anicalSpeci erdetailsreg ification[9]. romecha S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
11 RAK 833DataShee et 5 5. RAK RAK833 SP PI of SX130 833 Mo 3 card refer 01 to PCI e odule r Semtechs edge conne schem s reference ector or FT2 matic e design of S 2232H whic SX1301, ad ch convert dd a 4 chan SPI to USB ncel SPDT B2.0 interfa to switch ce. S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
12 RAK833DataSheeet 13 S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
RAK 833DataShee et Fig egardingsch gure5:RAK hematic ple K833cardin ease refer S nerschem SX1301DV matic. VK_e286v02 2a_sch_lay yout from Forfurth Se herdetailsre mtech. S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
14 6 6. Refe Figure C power, co D SP PDT_SEL s rence e 4 shows onnect SPI should be t Applic the minimu I interface o tied to GND cation um applicat or USB inte D otherwise tion schema erface to the e just let this atic of RAK e main proc s pin open. K833 card. U cessor. If u Uses at les se SPI inte st 3.3V/1A erface RAK 833DataShee et Figure6:
:RAK833card dreference minimum s schematic. S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
15 RAK 833DataShee et ng complies w with part 15 of the FCC C Rules. Op peration is s subject to th he following g two ce may not received, in s or modific he user's au odule is ins he final dev t cause har ncluding int cations not uthority to o stalled in th vice or it mu rmful interfe terference t expressly operate the e host devi ust be visib erence, and d (2) this de that may ca ause undes approved b by the party t. equipment C ID label ice, the FC ble when an n access pa evice must sired opera y responsib accept any y ation. ble for comp pliance must be vis anel, door o sible throug or cover is e gh a easily ond label m xt: Contain ntenna gain complies w t .This equip radiator& y must be plac ns FCC ID:
n allowed fo with FCC ra pment shou your body. ced on the 2AF6B-RA or use with adiation exp uld be insta outside of t AK833. this device posure limit alled and op the final de vice that co ontains the e is 2 dBi. ts set forth perated wit for an unco th minimum ontrolled m distance 2 20 cm FC CC Warnin Th his device c onditions:
co
) This devi
(1 in terference An ny Change co ould void th W When the mo w indow on th emoved. re If not, a seco fo ollowing tex M aximum an Th his module en nvironment be etween the 7 7. Cont tact henzhenBu Sh
-Mail: ken.y E-
Ad ddress: Rm li Block, Na Xi usiness yu@rakwire
. 506, Bldg. nshan Distri less.com 3,Minqi Tec ict, Shenzhe chnology Pa en,Guangdo ark,No. 65 Li ong Province Shan Road e,China reless.com hnical chen@rakwir 6108311
. 506, Bldg. nshan Distri 3,Minqi Tec ict, Shenzhe chnology Pa en,Guangdo ark,No. 65 Li ong Province Shan Road e,China henzhenTech Sh E Mail:farce.c Te el : 0755-86 ddress: Rm Ad Xi li Block, Na S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
16 8 8. Chan nge No ote on Versio V1.0 V1.1 V1.2 V1.3 Date 18-01-11 18-03-11 18-05-11 18-06-19 201 201 201 201 RAK 833DataShee et Chan nge Draft Addmodu Fix some lepicture an description nd fix some n mistake fo mistakes or Part NO a Adjust the e RF param eters and t he content eters and parame for reading. M Manufactur S ShenzhenRa R Room506,B re name an kwirelessTe ldgB,NewC d address chnologyCo Compark,Pin o.,Ltd. ngshanFirstR Road,Taoyua anStreet,Na anshanDistr ict,Shenzhe n S ShenzhenRakw ww ww.rakwiresless wirelessTechnolo s.comETDX1702 ogyCo.,LtdCop 224 pyright
17
This product uses the FCC Data API but is not endorsed or certified by the FCC