| submitted | available | document details (if available) | source link |
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| various | User Manual | Users Manual | 3.67 MiB |
WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform User's Guide SWRU382November 2014 The WL1837MODCOM8I is a Wi-Fi dual-band, Bluetooth, and BLE module evaluation board (EVB) with the TI WL1837 module (WL1837MOD). The WL1837MOD is a certified WiLink 8 module from TI that offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power-
optimized design. The WL1837MOD offers A 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP
(with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux, Android, WinCE, and RTOS.TI. Contents Overview ...................................................................................................................... 3 General Features ................................................................................................... 3 1.1 Key Benefits ......................................................................................................... 3 1.2 Applications.......................................................................................................... 4 1.3 Board Pin Assignment ...................................................................................................... 4 Pin Description ...................................................................................................... 5 2.1 Jumper Connections ............................................................................................... 7 2.2 Electrical Characteristics.................................................................................................... 7 Antenna Characteristics..................................................................................................... 8 VSWR ................................................................................................................ 8 4.1 Efficiency............................................................................................................. 8 4.2 Radio Pattern........................................................................................................ 9 4.3 Circuit Design ................................................................................................................ 9 EVB Reference Schematics....................................................................................... 9 5.1 Bill of Materials (BOM)............................................................................................ 10 5.2 Layout Guidelines .......................................................................................................... 11 Board Layout....................................................................................................... 11 6.1 Ordering Information....................................................................................................... 16 List of Figures WL1837MODCOM8I EVB (Top View) .................................................................................... 3 EVB Top View................................................................................................................ 4 EVB (Bottom View) .......................................................................................................... 5 Antenna VSWR Characteristics............................................................................................ 8 Antenna Efficiency........................................................................................................... 8 EVB Reference Schematics................................................................................................ 9 WL1837MODCOM8I Layer 1 Layout .................................................................................... 11 WL1837MODCOM8I Layer 2 Layout .................................................................................... 11 WL1837MODCOM8I Layer 3 Layout .................................................................................... 12 WL1837MODCOM8I Layer 4 Layout .................................................................................... 12 Module Layout Guidelines (Top Layer).................................................................................. 13 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 9 10 11 Sitara, WiLink are trademarks of Texas Instruments. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Android is a trademark of Google, Inc. Linux is a registered trademark of Linus Torvalds. Wi-Fi is a registered trademark of Wi-Fi Alliance. SWRU382November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated 1 www.ti.com Module Layout Guidelines (Bottom Layer).............................................................................. 13 Trace Design for the PCB Layout........................................................................................ 14 Layer 1 Combined With Layer 2.......................................................................................... 14 Top Layer Antenna and RF Trace Routing Layout Guidelines .................................................... 15 Bottom Layer Antenna and RF Trace Routing Layout Guidelines................................................. 15 MIMO Antenna Spacing ................................................................................................... 16 List of Tables Pin Description ............................................................................................................... 5 BOM.......................................................................................................................... 10 Module Layout Guidelines ................................................................................................ 13 Antenna and RF Trace Routing Layout Guidelines.................................................................... 15 12 13 14 15 16 17 1 2 3 4 2 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated SWRU382November 2014 Submit Documentation Feedback www.ti.com 1 Overview Figure 1 shows the WL1837MODCOM8I EVB. Overview Figure 1. WL1837MODCOM8I EVB (Top View) 1.1 General Features 100-pin board card The WL1837MODCOM8I EVB includes the following features:
WLAN, Bluetooth, and BLE on a single module board Dimensions: 76.0 mm (L) x 31.0 mm (W) WLAN 2.4- and 5-GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels) Support for BLE dual mode Seamless integration with TI Sitara and other application processors Design for the TI AM335X general-purpose evaluation module (EVM) WLAN and Bluetooth, BLE, and ANT cores that are software- and hardware-compatible with prior WL127x, WL128x, and BL6450 offerings for smooth migration to device Shared host-controller-interface (HCI) transport for Bluetooth, BLE, and ANT using UART and SDIO for WLAN Wi-Fi and Bluetooth single-antenna coexistence Built-in chip antenna Optional U.FL RF connector for external antenna Direct connection to the battery using an external switched-mode power supply (SMPS) supporting 2.9- to 4.8-V operation VIO in the 1.8-V domain 1.2 Key Benefits The WL1837MOD offers the following benefits:
Reduces design overhead: Single WiLink 8 module scales across Wi-Fi and Bluetooth WLAN high throughput: 80 Mbps (TCP), 100 Mbps (UDP) Bluetooth 4.1 + BLE (Smart Ready) Wi-Fi and Bluetooth single-antenna coexistence Low power at 30% to 50% less than the previous generation SWRU382November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated 3 Overview www.ti.com Available as an easy-to-use FCC-, ETSI-, and Telec-certified module AM335x Linux and Android reference platform accelerates customer development and time to market. Lower manufacturing costs saves board space and minimizes RF expertise. 1.3 Applications The WL1837MODCOM8I device is designed for the following applications:
Portable consumer devices Home electronics Home appliances and white goods Smart gateway and metering Video conferencing Video camera and security Industrial and home automation 2 Board Pin Assignment Figure 2 shows the top view of the EVB. Figure 2. EVB Top View 4 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated SWRU382November 2014 Submit Documentation Feedback www.ti.com Figure 3 shows the bottom view of the EVB. Board Pin Assignment Figure 3. EVB (Bottom View) 2.1 Pin Description Table 1 describes the board pins. Name Table 1. Pin Description Type Description SLOW_CLK GND GND WL_EN VBAT GND VBAT VIO GND N.C. WL_RS232_TX N.C. WL_RS232_RX N.C. WL_UART_DBG N.C. N.C. GND GND SDIO_CLK I G G I P G P P G O I O G G I Slow clock input option (default: NU) Ground Ground WLAN enable 3.6-V typical voltage input Ground 3.6-V typical voltage input VIO 1.8-V (I/O voltage) input Ground No connection WLAN tool RS232 output No connection WLAN tool RS232 input No connection WLAN Logger output No connection No connection Ground Ground WLAN SDIO clock No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 SWRU382November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 5 Copyright 2014, Texas Instruments Incorporated Board Pin Assignment www.ti.com Table 1. Pin Description (continued) No. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 Name N.C. GND N.C. SDIO_CMD N.C. SDIO_D0 N.C. SDIO_D1 N.C. SDIO_D2 N.C. SDIO_D3 N.C. WLAN_IRQ N.C. N.C. GND N.C. N.C. N.C. N.C. GND N.C. N.C. N.C. N.C. GND N.C. N.C. N.C. N.C. PCM_IF_CLK N.C. PCM_IF_FSYNC N.C. PCM_IF_DIN N.C. PCM_IF_DOUT N.C. GND N.C. N.C. GND GND N.C. BT_UART_IF_TX N.C. Description Type G No connection Ground No connection I/O WLAN SDIO command No connection I/O WLAN SDIO data bit 0 No connection I/O WLAN SDIO data bit 1 No connection I/O WLAN SDIO data bit 2 No connection I/O WLAN SDIO data bit 3 O G G G I/O I/O I O G G G O No connection WLAN SDIO interrupt out No connection No connection Ground No connection No connection No connection No connection Ground No connection No connection No connection No connection Ground No connection No connection No connection No connection Bluetooth PCM clock input or output No connection Bluetooth PCM frame sync input or output No connection Bluetooth PCM data input No connection Bluetooth PCM data output No connection Ground No connection No connection Ground Ground No connection Bluetooth HCI UART transmit output No connection 6 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform SWRU382November 2014 Submit Documentation Feedback Copyright 2014, Texas Instruments Incorporated www.ti.com Board Pin Assignment Table 1. Pin Description (continued) Name Type Description BT_UART_IF_RX N.C. BT_UART_IF_CTS N.C. BT_UART_IF_RTS N.C. RESERVED1 N.C. BT_UART_DEBUG GND GPIO9 N.C. N.C. N.C. N.C. GND N.C. N.C. N.C. GND N.C. BT_EN N.C. N.C. GND RESERVED2 N.C. GND GPIO11 GND GPIO12 TCXO_CLK_COM GPIO10 I I O O O G I/O G G I G I G I/O G I/O I/O Bluetooth HCI UART receive input No connection Bluetooth HCI UART Clear-to-Send input No connection Bluetooth HCI UART Request-to-Send output No connection Reserved No connection Bluetooth Logger UART output Ground General-purpose I/O No connection No connection No connection No connection Ground No connection No connection No connection Ground No connection Bluetooth enable No connection No connection Ground Reserved No connection Ground General-purpose I/O Ground General-purpose I/O Option to supply 26 MHz externally General-purpose I/O No. 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 2.2 Jumper Connections The WL1837MODCOM8I EVB includes the following jumper connections:
J1: Jumper connector for VIO power input J3: Jumper connector for VBAT power input J5: RF connector for 2.4- and 5-GHz WLAN and Bluetooth J6: Second RF connector for 2.4-GHz WLAN 3 Electrical Characteristics For electrical characteristics, see the WL18xxMOD WiLink Single-Band Combo Module Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE) Data Sheet (SWRS170). SWRU382November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated 7 Antenna Characteristics 4 Antenna Characteristics 4.1 VSWR Figure 4 shows the antenna VSWR characteristics. www.ti.com Figure 4. Antenna VSWR Characteristics 4.2 Efficiency Figure 5 shows the antenna efficiency. Figure 5. Antenna Efficiency 8 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated SWRU382November 2014 Submit Documentation Feedback www.ti.com 4.3 Radio Pattern For information on the antenna radio pattern and other related information, see productfinder.pulseeng.com/product/W3006. Antenna Characteristics 5 Circuit Design 5.1 EVB Reference Schematics Figure 6 shows the reference schematics for the EVB. Figure 6. EVB Reference Schematics SWRU382November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated 9 EDGECONNECTOR-MALEANT2-WL_2.4_IO1/WL_5GHzANT1-WL_2.4_IO2/BT/WL_5GHzR20fortestmode.ThesetwoTPsfortestmodewhenWL_IRQpullhigh.WL_UART_DBGBT_AUD_CLKBT_AUD_FSYNCBT_AUD_INWL_RS232_TXWL_RS232_RXBT_HCI_TXBT_HCI_RXBT_HCI_CTSBT_HCI_RTSBT_EN_SOCBT_UART_DBGSDIO_CLK_WLSDIO_CMD_WLSDIO_D0_WLSDIO_D2_WLSDIO_D3_WLSDIO_D1_WLWLAN_EN_SOCBT_AUD_OUTBT_FUNC1GPIO9GPIO11GPIO12GPIO10SLOW_CLKBT_FUNC2WLAN_IRQRF_ANT1RF_ANT2SDIO_D3_WLGPIO12SDIO_D2_WLGPIO11SDIO_D0_WLSDIO_D1_WLGPIO9WLAN_IRQGPIO10RF_ANT2WL_RS232_TXWL_RS232_RXRF_ANT1BT_FUNC1BT_FUNC2BT_HCI_RXBT_HCI_TXBT_HCI_CTSBT_HCI_RTSBT_AUD_INBT_AUD_OUTBT_AUD_CLKBT_AUD_FSYNCSDIO_CMD_WLSDIO_CLK_WLSLOW_CLKWL_UART_DBGBT_UART_DBGBT_EN_SOCWLAN_EN_SOCEXT_CLK_REQ_OUTEXT_CLK_REQ_OUTTCXO_CLK_COMTCXO_CLK_COMVBAT_INVIO_INVIO_INVBAT_INVIO_INVIO_INVBAT_INVIO_CLKVIO_CLKR2010k0402L32.2nH0402R250R0402C50R0402J6U.FL-R-SMT(10)U.FL123TCXO1NU_TCXO 26MHz2.0x1.6x0.73mmNC1VCC4OUT3GND2R170R0402C60R0402R310R0603J2NU_100pin Micro Edge MEC6SD-100P123456789101112131415161718192021222324252627282930313233343536373839404142434445464748495051525354555657585960616263646566676869707172737475767778798081828384858687888990919293949596979899100ANT1W3006ANT-10.0X3.2MM_BFEED1NC2R330R0402TP41C7NU_0R0402U4NU_TLV70518XBGA-N4_0.8X0.8_0.4VINB2VOUTB1ENA2GNDA1R120R0402R110R0402R34NU0402C11uF0402R300R0402R90R0402J5U.FL-R-SMT(10)U.FL123L2NU0402R100R0402TP11TP51R20R0402L11.3nH04020RR2104020RR190402OSC11V8 / 32.768kHzOSC-3.2X2.5EN1VCC4OUT3GND2R60R0402C32NU_0.1uF0402R30R0402R160R0402U1WL1837MODGJE-13.4X13.3-N100_0.75-TOPGND17VIO38VBAT47EXT_32K36BT_AUD_FSYNC58BT_AUD_IN56BT_AUD_OUT57BT_AUD_CLK60WL_SDIO_D212WL_SDIO_CLK8WL_SDIO_D313WL_SDIO_D010WL_SDIO_D111WL_SDIO_CMD6BT_HCI_RTS50BT_HCI_RX53BT_HCI_TX52BT_HCI_CTS51GND16GPIO_425GPIO_226GPIO_127BT_EN_SOC41WLAN_IRQ14WLAN_EN_SOC40BT_UART_DBG43WL_UART_DBG42GNDG13GNDG14GNDG15GNDG16GNDG9GNDG10GND48GNDG11GNDG12VBAT46GND28GNDG1GNDG2GNDG3GNDG4GNDG5GNDG6GNDG7GNDG8RF_ANT132RESERVED64GND1GND20RESERVED121RESERVED222GND37GND19RESERVED362GNDG17GNDG18GNDG19GNDG20GNDG21GNDG22GNDG23GNDG24GNDG25GNDG26GNDG27GNDG28GNDG29GNDG30GNDG31GNDG32GNDG33GNDG34GNDG35GND23GND59GND34GND29GND7RF_ANT218GND49GND9GND31GND35GND15GND55GND45GND44GND30GND24GND63GND61GND39GND33GND54GNDG36GPIO112GPIO93GPIO104GPIO125R35NU0402C210uF0603R320R0603J1NU_HEADER 1x2H-1X2_2MM12R10R0402R290R0402R80R0402TP71C130.9pF0402TP61TP31R280R04020RR240402R70R0402R140R0402C8NU_0R0402C40.1uF0402R270R0402R130R0402R150R0402C30.1uF04020RR220402R180R0402R40R0402R230R0402C15NU_1uF0402ANT2W3006ANT-10.0X3.2MM_AFEED1NC2C141.5pF0402R5NU0402J3NU_HEADER 1x2H-1X2_2MM12L43.9nH0402R36NU0402TP810RR260402TP21 Circuit Design 5.2 Bill of Materials (BOM) Table 2 lists the BOM for the EVB. Item Description Part Number Package Reference Table 2. BOM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 TI WL1837 Wi-Fi / Bluetooth module XOSC 3225 / 32.768KHZ / 1.8 V /
50 ppm Antenna / Chip / 2.4 and 5 GHz WL1837MODGI 7XZ3200005 W3006 Mini RF header receptacle U.FL-R-SMT-1(10) 13.4 mm x 13.3 mm x 2.0 mm 3.2 mm 2.5 mm 1.0 mm 10.0 mm 3.2 mm 1.5 mm 3.0 mm 2.6 mm 1.25 mm U1 OSC1 ANT1, ANT2 J5, J6 LQP15MN1N8B02 LQP15MN1N3B02 LQP15MN2N2B02 Inductor 0402 / 1.3 nH / 0.1 nH /
SMD Inductor 0402 / 1.8 nH / 0.1 nH /
SMD Inductor 0402 / 2.2 nH / 0.1 nH /
SMD Capacitor 0402 / 1 pF / 50 V / C0G GJM1555C1H1R0BB01
/ 0.1 pF Capacitor 0402 / 2.4 pF / 50 V /
C0G / 0.1 pF Capacitor 0402 / 0.1 F / 10 V /
X7R / 10%
Capacitor 0402 / 1 F / 6.3 V /
X5R / 10% / HF Capacitor 0603 / 10 F / 6.3 V /
X5R / 20%
Resistor 0402 / 0R / 5%
GJM1555C1H2R4BB01 C1608X5R0J106M 0402B104K100CT WR04X000 PTL GRM155R60J105KE19D Resistor 0402 / 10K / 5%
Resistor 0603 / 0R / 5%
PCB WG7837TEC8B D02 / Layer 4 / FR4 (4 pcs / PNL) WR04X103 JTL WR06X000 PTL 0402 0402 0402 0402 0402 0402 0402 0603 0402 0402 0603 76.0 mm 31.0 mm 1.6 mm L1 L3 L4 C13 C14 C3, C4 C1 C2 R1 to R4, R6 to R19, R21 to R30, R33, C5, C6(1) R20 R31, R32 www.ti.com Qty 1 1 2 2 1 1 1 1 1 2 1 1 Mfr Jorjin TXC Pulse Hirose Murata Murata Murata Murata Murata Walsin Murata TDK 31 Walsin 1 2 1 Walsin Walsin
(1) C5 and C6 are mounted with a 0- resistor by default. 10 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated SWRU382November 2014 Submit Documentation Feedback www.ti.com 6 Layout Guidelines 6.1 Board Layout Figure 7 through Figure 10 show the four layers of the WL1837MODCOM8I EVB. Layout Guidelines Figure 7. WL1837MODCOM8I Layer 1 Layout Figure 8. WL1837MODCOM8I Layer 2 Layout SWRU382November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated 11 Layout Guidelines www.ti.com Figure 9. WL1837MODCOM8I Layer 3 Layout Figure 10. WL1837MODCOM8I Layer 4 Layout Figure 11 and Figure 12 show instances of good layout practices. 12 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated SWRU382November 2014 Submit Documentation Feedback www.ti.com Layout Guidelines Figure 11. Module Layout Guidelines (Top Layer) Figure 12. Module Layout Guidelines (Bottom Layer) Table 3 describes the guidelines corresponding to the reference numbers in Figure 11 and Figure 12. Reference 1 2 3 4 5 6 Table 3. Module Layout Guidelines Guideline Description Keep the proximity of ground vias close to the pad. Do not run signal traces underneath the module on the layer where the module is mounted. Have a complete ground pour in layer 2 for thermal dissipation. Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation. Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible. Signal traces can be run on a third layer under the solid ground layer and the module mounting layer. SWRU382November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform 13 Copyright 2014, Texas Instruments Incorporated Layout Guidelines www.ti.com Figure 13 shows the trace design for the PCB. TI recommends using a 50- impedance match on the trace to the antenna and 50- traces for the PCB layout. Figure 13. Trace Design for the PCB Layout Figure 14 shows layer 1 with the trace to the antenna over ground layer 2. Figure 14. Layer 1 Combined With Layer 2 Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing. NOTE: RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered. 14 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated SWRU382November 2014 Submit Documentation Feedback www.ti.com Layout Guidelines Figure 15. Top Layer Antenna and RF Trace Routing Layout Guidelines Figure 16. Bottom Layer Antenna and RF Trace Routing Layout Guidelines Table 4 describes the guidelines corresponding to the reference numbers in Figure 15 and Figure 16. Table 4. Antenna and RF Trace Routing Layout Guidelines Reference Guideline Description 1 2 3 4 5 6 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate. RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF traces must not have sharp corners. RF traces must have via stitching on the ground plane beside the RF trace on both sides. RF traces must have constant impedance (microstrip transmission line). For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid. There must be no traces or ground under the antenna section. SWRU382November 2014 Submit Documentation Feedback WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Copyright 2014, Texas Instruments Incorporated 15 Ordering Information www.ti.com Figure 17 shows the MIMO antenna spacing. The distance between ANT1 and ANT2 must be greater than half the wavelength (62.5 mm at 2.4 GHz). Figure 17. MIMO Antenna Spacing If possible, shield VBAT traces with ground above, below, and beside the traces. Follow these supply routing guidelines:
For power supply routing, the power trace for VBAT must be at least 40-mil wide. The 1.8-V trace must be at least 18-mil wide. Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. Follow these digital-signal routing guidelines:
Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as possible (less than 12 cm). In addition, each trace must be the same length. Ensure enough space between traces (greater than 1.5 times the trace width or ground) to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses. Digital clock signals (SDIO clock, PCM clock, and so on) are a source of noise. Keep the traces of these signals as short as possible. Whenever possible, maintain a clearance around these signals. 7 Ordering Information Part number:
WL1837MODCOM8I DATE November 2014 Revision History REVISION
NOTES Initial draft 16 Revision History Copyright 2014, Texas Instruments Incorporated SWRU382November 2014 Submit Documentation Feedback IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms and conditions of sale of semiconductor products. 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Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/omap www.ti.com/wirelessconnectivity Applications Automotive and Transportation www.ti.com/automotive Communications and Telecom www.ti.com/communications Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Video and Imaging www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video TI E2E Community e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2014, Texas Instruments Incorporated Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Industry Canada Statement This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."
CAN ICES-3(B)/ NMB-3(B) The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology.
the device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
the maximum antenna gain permitted for devices in the bands 52505350 MHz and 54705725 MHz shall comply with the e.i.r.p. limit; and the maximum antenna gain permitted for devices in the band 57255825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate. In addition, high-power radars are allocated as primary users (i.e. priority users) of the bands 52505350 MHz and 56505850 MHz and that these radars could cause interference and/or damage to LE-LAN devices. Radiation Exposure Statement This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: Z64-WL18DBMOD Contains IC: 451I-WL18DBMOD The grantee's FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. This device is intended only for OEM integrators under the following conditions:
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) This radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved by Texas Instrument. Antenna types not included in the list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this transmitter. Antenna Gain (dBi) @ 2.4GHz Antenna Gain (dBi) @ 5GHz 3.2 4.5 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
This product uses the FCC Data API but is not endorsed or certified by the FCC