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, e t a c o i l 29.5 x 18.9 x 3.0 mm LEON-G100/G200 quad-band GSM/GPRS Data and Voice Modules System Integration Manual Abstract This document describes the features and integration of the LEON-G100/G200 quad-band GSM/GPRS data and voice modules. The LEON-G100/G200 are complete and cost efficient solutions, bringing full feature quad-band GSM/GPRS data and voice transmission technology in a compact form factor. www.u-blox.com LEON-G100/G200 - System Integration Manual Document Information Title Subtitle LEON-G100/G200 quad-band GSM/GPRS Data and Voice Modules Document type System Integration Manual Document number GSM.G1-HW-09002-F3 Document status Preliminary Document status information Objective Specification This document contains target values. Revised and supplementary data will be published later. Advance Information Preliminary This document contains data based on early testing. Revised and supplementary data will be published later. This document contains data from product verification. Revised and supplementary data may be published later. Released This document contains the final product specification. This document applies to the following products:
Name Type number Firmware version PCN / IN LEON-G100 LEON-G200 LEON-G100-04S-00 LEON-G100-05S-00 LEON-G100-05A-00 LEON-G200-04S-00 LEON-G200-05S-00 07.40.01 07.50.00 07.50.00 07.40.01 07.50.00 GSM.G1-SW-10007 GSM.G1-SW-10008 N.A. GSM.G1-SW-10007 GSM.G1-SW-10008 This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They can be downloaded from www.u-blox.com. u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright 2011, u-blox AG. u-blox is a registered trademark of u-blox Holding AG in the EU and other countries. GSM.G1-HW-09002-F3 Page 2 of 101 LEON-G100/G200 - System Integration Manual Preface u-blox Technical Documentation As part of our commitment to customer support, u-blox maintains an extensive volume of technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development. AT Commands Manual: This document provides the description of the supported AT commands by the LEON GSM/GPRS Voice and Data Modules to verify all implemented functionalities. System Integration Manual: This Manual provides hardware design instructions and information on how to set up production and final product tests. Application Note: document provides general design instructions and information that applies to all u-blox Wireless modules. See Section Related documents for a list of Application Notes related to your Wireless Module. How to use this Manual The LEON-G100/G200 System Integration Manual provides the necessary information to successfully design in and configure these u-blox wireless modules. This manual has a modular structure. It is not necessary to read it from the beginning to the end. The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance. A warning symbol indicates actions that could negatively impact or damage the module. Questions If you have any questions about u-blox Wireless Integration, please:
Read this manual carefully. Contact our information service on the homepage http://www.u-blox.com Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com Technical Support Worldwide Web Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and helpful FAQ can be accessed 24h a day. By E-mail Contact the nearest of the Technical Support offices by email. Use our service pool email addresses rather than any personal email address of our staff. This makes sure that your request is processed as soon as possible. You will find the contact details at the end of the document. Helpful Information when Contacting Technical Support When contacting Technical Support please have the following information ready:
Module type (e.g. LEON-G100) and firmware version Module configuration Clear description of your question or the problem A short description of the application Your complete contact details GSM.G1-HW-09002-F3 Preliminary Preface Page 3 of 101 LEON-G100/G200 - System Integration Manual Contents Preface ................................................................................................................................ 3 Contents .............................................................................................................................. 4 1.6 1.2.1 1.2.2 1 System description ....................................................................................................... 7 1.1 Overview .............................................................................................................................................. 7 1.2 Architecture .......................................................................................................................................... 8 Functional blocks ........................................................................................................................... 9 Hardware differences between LEON-G100 and LEON-G200 ........................................................ 9 Pin-out ............................................................................................................................................... 10 1.3 1.4 Operating modes ................................................................................................................................ 12 Power management ........................................................................................................................... 14 1.5 1.5.1 Power supply circuit overview ...................................................................................................... 14 1.5.2 Module supply (VCC) .................................................................................................................. 15 Current consumption profiles ...................................................................................................... 22 1.5.3 Battery charger (LEON-G200 only) ............................................................................................... 25 1.5.4 1.5.5 RTC Supply (V_BCKP) .................................................................................................................. 30 System functions ................................................................................................................................ 31 1.6.1 Module power on ....................................................................................................................... 31 1.6.2 Module power off ....................................................................................................................... 35 1.6.3 Module reset ............................................................................................................................... 36 RF connection ..................................................................................................................................... 39 SIM interface ...................................................................................................................................... 40 SIM functionality ......................................................................................................................... 41 Serial Communication......................................................................................................................... 41 Asynchronous serial interface (UART)........................................................................................... 41 DDC (I2C) interface ...................................................................................................................... 52 Audio .............................................................................................................................................. 55 1.10.1 Analog Audio interface ............................................................................................................... 55 1.10.2 Digital Audio interface ................................................................................................................. 61 1.10.3 Voice-band processing system ..................................................................................................... 63 ADC input (LEON-G100 only) .......................................................................................................... 64 1.11.1 ADC Calibration .......................................................................................................................... 65 General Purpose Input/Output (GPIO) ............................................................................................. 66 M2M Setup Schematic Example ...................................................................................................... 68 Approvals ........................................................................................................................................ 69 1.14.1 Compliance with FCC and IC Rules and Regulations .................................................................... 69 1.12 1.13 1.14 1.9.1 1.9.2 1.7 1.8 1.8.1 1.11 1.10 1.9 2.1 2 Design-In ..................................................................................................................... 71 Design-in checklist .............................................................................................................................. 71 Schematic checklist ..................................................................................................................... 71 Layout checklist ........................................................................................................................... 71 2.1.1 2.1.2 GSM.G1-HW-09002-F3 Preliminary Contents Page 4 of 101 LEON-G100/G200 - System Integration Manual 2.2 2.1.3 2.2.1 2.2.2 2.2.3 Antenna checklist ........................................................................................................................ 72 Design Guidelines for Layout .............................................................................................................. 72 Layout guidelines per pin function ............................................................................................... 72 Footprint and paste mask ............................................................................................................ 78 Placement ................................................................................................................................... 80 2.3 Module thermal resistance .................................................................................................................. 80 Antenna guidelines ............................................................................................................................. 81 2.4 Antenna termination ................................................................................................................... 82 Antenna radiation ....................................................................................................................... 83 Antenna detection functionality .................................................................................................. 85 ESD Immunity Test Precautions ........................................................................................................... 87 General Precautions .................................................................................................................... 87 2.5.1 Antenna Interface Precautions ..................................................................................................... 88 2.5.2 2.5.3 Module Interfaces Precautions ..................................................................................................... 89 2.4.1 2.4.2 2.4.3 2.5 3.1 3.2 3 Handling and soldering ............................................................................................. 90 Packaging, shipping, storage and moisture preconditioning ............................................................... 90 Soldering ............................................................................................................................................ 90 Soldering paste............................................................................................................................ 90 3.2.1 Reflow soldering ......................................................................................................................... 90 3.2.2 Optical inspection ........................................................................................................................ 92 3.2.3 Cleaning ...................................................................................................................................... 92 3.2.4 Repeated reflow soldering ........................................................................................................... 92 3.2.5 3.2.6 Wave soldering............................................................................................................................ 92 Hand soldering ............................................................................................................................ 92 3.2.7 3.2.8 Rework ........................................................................................................................................ 92 3.2.9 Conformal coating ...................................................................................................................... 92 3.2.10 Casting ........................................................................................................................................ 93 3.2.11 Grounding metal covers .............................................................................................................. 93 3.2.12 Use of ultrasonic processes .......................................................................................................... 93 4 Product Testing........................................................................................................... 94 u-blox in-series production test ........................................................................................................... 94 4.1 Appendix .......................................................................................................................... 95 A.1 A.2 A Extra Features ............................................................................................................. 95 Firmware (upgrade) Over The Air (FOTA) (LEON-G200 only) ................................................................ 95 Firmware (upgrade) Over AT (FOAT) ................................................................................................... 95 A.2.1 Overview ..................................................................................................................................... 95 A.2.2 FOAT procedure .......................................................................................................................... 95 Firewall ............................................................................................................................................... 95 TCP/IP ................................................................................................................................................. 95 A.4.1 Multiple IP addresses and sockets ................................................................................................ 96 FTP ..................................................................................................................................................... 96 A.3 A.4 A.5 GSM.G1-HW-09002-F3 Preliminary Contents Page 5 of 101 LEON-G100/G200 - System Integration Manual A.6 HTTP ................................................................................................................................................... 96 A.7 SMTP .................................................................................................................................................. 96 A.8 GPS .................................................................................................................................................... 96 B Glossary ...................................................................................................................... 97 Related documents........................................................................................................... 99 Revision history .............................................................................................................. 100 Contact ............................................................................................................................ 101 GSM.G1-HW-09002-F3 Preliminary Contents Page 6 of 101 LEON-G100/G200 - System Integration Manual 1 System description 1.1 Overview LEON-G100/G200 GSM/GPRS modules integrate a full-featured Release 99 GSM-GPRS protocol stack, with the following main characteristics. Quad band support: GSM 850 MHz, EGSM 900 MHz, DCS 1800 MHz and PCS 1900 MHz Power class 4 (33 dBm nominal maximum output power) for GSM/EGSM bands Power class 1 (30 dBm nominal maximum output power) for DCS/PCS bands GPRS multi-slot class 10 All GPRS coding schemes from CS1 to CS4 are supported GPRS bit rate: 85.6 kb/s (max.), 53.6 kb/s (typ.) in down-link; 42.8 kb/s (max.), 26.8 kb/s (typ.) in up-link CS (Circuit Switched) Data calls are supported in transparent/non transparent mode up to 9.6 kb/s Encryption algorithms A5/1 for GSM and GPRS support Bearer service fax Group 3 Class 2.0 support Class B Mobile Stations (i.e. the data module can be attached to both GPRS and GSM services, using one service at a time) Network operation modes I to III are supported GPRS multi-slot class determines the maximum number of timeslots available for upload and download and thus the speed at which data can be transmitted and received: higher classes typically allow faster data transfer rates. GPRS multi-slot class 10 uses a maximum of 4 slots in download (reception) and 2 slots in upload (transmission), with 5 slots in total. The network automatically configures the number of timeslots used for reception or transmission (voice calls take precedence over GPRS traffic). The network also automatically configures channel encoding (CS1 to CS4). The maximum GPRS bit rate of the mobile station depends on the coding scheme and number of time slots. GSM.G1-HW-09002-F3 Preliminary System description Page 7 of 101 LEON-G100/G200 - System Integration Manual 1.2 Architecture Figure 1: LEON-G100 block diagram Figure 2: LEON-G200 block diagram GSM.G1-HW-09002-F3 Preliminary System description Page 8 of 101 MemoryUART2 Analog AudioDDC (for GPS)GPIOADCSIM CardVccV_BCKPPower-OnReset26 MHz32.768 kHzHeadset DetectionRF TransceiverPowerManagementBasebandANTSAWFilterSwitchPADigital AudioMemoryVcc V_BCKP26 MHz32.768 kHzChargerRF TransceiverPowerManagementBasebandANTSAWFilterSwitchPAUART2 Analog AudioDDC (for GPS)GPIOSIM CardPower-OnResetHeadset DetectionDigital Audio LEON-G100/G200 - System Integration Manual 1.2.1 Functional blocks LEON-G100/G200 modules consist of the following functional blocks:
RF Baseband Power Management 1.2.1.1 RF The RF block is composed of the following main elements:
RF transceiver (integrated in the GSM/GPRS single chip) performing modulation, up-conversion of the baseband I/Q signals, down-conversion and demodulation of the RF received signals. The RF transceiver includes:
Constant gain direct conversion receiver with integrated LNAs;
Highly linear RF quadrature demodulator;
Digital Sigma-Delta transmitter modulator;
Fractional-N Sigma-Delta RF synthesizer;
3.8 GHz VCO;
Digital controlled crystal oscillator. Transmit module, which amplifies the signals modulated by the RF transceiver and connects the single antenna input/output pin of the module to the suitable RX/TX path, via its integrated parts:
Power amplifier;
Antenna switch;
RX diplexer SAW (band pass) filters 26 MHz crystal, connected to the digital controlled crystal oscillator to perform the clock reference in active or connected mode 1.2.1.2 Baseband The Baseband block is composed of the following main elements:
Baseband integrated in the GSM/GPRS single chip, including:
Microprocessor;
DSP (for GSM/GPRS Layer 1 and audio processing);
Peripheral blocks (for parallel control of the digital interfaces);
Audio analog front-end;
Memory system in a multi-chip package integrating two devices:
NOR flash non-volatile memory;
PSRAM volatile memory;
32.768 kHz crystal, connected to the oscillator of the RTC to perform the clock reference in idle or power-
off mode 1.2.1.3 Power Management The Power Management block is composed of the following main elements:
Voltage regulators integrated in the GSM/GPRS single chip for direct connection to battery Charging control circuitry 1.2.2 Hardware differences between LEON-G100 and LEON-G200 Hardware differences between the LEON-G100 and the LEON-G200 modules:
Charging control circuitry is available on the LEON-G200 module only ADC input is provided on the LEON-G100 module only GSM.G1-HW-09002-F3 Preliminary System description Page 9 of 101 LEON-G100/G200 - System Integration Manual 1.3 Pin-out Table 1 describes the pin-out of LEON-G100/G200 modules, with pins grouped by function. Function Power Pin VCC No 50 I/O Description Remarks I Module Supply GND N/A Ground 1, 3, 6, 7, 8, 17, 25, 36, 45, 46, 48, 49 V_BCKP 2 I/O Real Time Clock supply VSIM 35 O SIM supply I I Charger voltage supply input Charger voltage measurement input V_CHARGE -
(LEON-G200) CHARGE_SENSE
(LEON-G200) RF ANT Audio HS_DET I2S_WA 4 5 47 18 26 I2S_TXD 27 O I2S transmit data I2S_CLK 28 O I2S clock I2S_RXD 29 I I2S receive data I/O RF antenna nominal impedance. 50 See section 1.7, 2.2.1.1 and 2.4 I O Headset detection input I2S word alignment Clean and stable supply is required: low ripple and low voltage drop must be guaranteed. Voltage provided has to be always above the minimum limit of the operating range. Consider that there are large current spike in connected mode, when a GSM call is enabled. See section 1.5.2 GND pins are internally connected but good (low impedance) external ground can improve RF performances: all GND pins must be externally connected to ground V_BCKP = 2.0 V (typical) generated by the module to supply Real Time Clock when VCC supply voltage is within valid operating range. See section 1.5.5 SIM supply automatically generated by the module. See section 1.8 V_CHARGE and CHARGE_SENSE must be externally connected. The external supply used as charging source must be voltage and current limited. See section 1.5.4 V_CHARGE and CHARGE_SENSE must be externally connected. The external supply used as charging source must be voltage and current limited. See section 1.5.4 Internal active pull-up to 2.85 V enabled. See section 1.10.1.3 I2S Interface: see section 1.10.2. Check device specifications to ensure compatibility of supported modes to LEON-G100/G200 module. Add a test point to provide access to the pin for debugging. I2S Interface: see section 1.10.2. Check device specifications to ensure compatibility of supported modes to LEON-G100/G200 module. Add a test point to provide access to the pin for debugging. I2S Interface: see section 1.10.2. Check device specifications to ensure compatibility of supported modes to LEON-G100/G200 module. Add a test point to provide access to the pin for debugging. I2S Interface: see section 1.10.2. Internal active pull-up to 2.85 V enabled. Check device specifications to ensure compatibility of supported modes to LEON-G100/G200 module. Add a test point to provide access to the pin for debugging. HS_P SPK_P 37 38 O O First speaker output with low power single-
ended analog audio This audio output is used when audio downlink path is Normal earpiece or Mono headset Audio pin: see section 1.10.1 Second speaker output with high power differential analog audio This audio output is used when audio downlink path is Loudspeaker. Audio pin: see section 1.10.1 GSM.G1-HW-09002-F3 Preliminary System description Page 10 of 101 LEON-G100/G200 - System Integration Manual Function Pin SPK_N No 39 MIC_BIAS2 41 MIC_GND2 MIC_GND1 MIC_BIAS1 SIM SIM_CLK SIM_IO SIM_RST DSR RI DCD DTR RTS CTS TxD RxD SCL SDA ADC1
(LEON-G100) UART DDC ADC GPIO GPIO1 System Reserved GPIO2 PWR_ON RESET_N Reserved Reserved Reserved Reserved
(LEON-G100) Table 1: LEON-G100/G200 pin-out 42 43 44 32 33 34 9 10 11 12 13 14 15 16 30 31 5 20 21 19 22 23 24 40 4 I/O Description Remarks O I I I I Second speaker output with power differential analog audio output This audio output is used when audio downlink path is Loudspeaker. Audio pin: see section 1.10.1 Second microphone analog signal input and bias output This audio input is used when audio uplink path is set as Headset Microphone. Audio pin: see section 1.10.1 Second microphone analog reference Local ground of second microphone. Audio pin:
see section 1.10.1 First microphone analog reference Local ground of the first microphone. Audio pin:
see section 1.10.1 First microphone analog signal input and bias output This audio input is used when audio uplink path is set as Handset Microphone. Audio pin: see section 1.10.1 O SIM clock I/O SIM data SIM reset SIM interface: see section 1.8. Must meet SIM specifications SIM interface: see section 1.8. Internal 4.7k pull-up to VSIM. Must meet SIM specifications SIM interface: see section 1.8. Must meet SIM specifications UART data set ready Circuit 107 (DSR) in V.24. See section 1.9.1. UART ring indicator Circuit 125 (RI) in V.24. See section 1.9.1. UART data carrier detect Circuit 109 (DCD) in V.24. See section 1.9.1. UART data terminal ready UART ready to send Internal active pull-up to 2.85 V enabled. Circuit 108/2 (DTR) in V.24. See section 1.9.1. Internal active pull-up to 2.85 V enabled. Circuit 105 (RTS) in V.24. See section 1.9.1. UART clear to send Circuit 106 (CTS) in V.24. See section 1.9.1. UART transmitted data UART received data I2C bus clock line Internal active pull-up to 2.85 V enabled. Circuit 103 (TxD) in V.24. See section 1.9.1. Circuit 104 (RxD) in V.24. See section 1.9.1. Fixed open drain. External pull-up required. See section 1.9.2 O O O O I I O I O O I/O I2C bus data line I ADC input I/O GPIO I/O I GPIO Power-on input Fixed open drain. External pull-up required. See section 1.9.2 Resolution: 12 bits. See section 1.11; consider that the impedance of this input changes depending on the operative mode See section 1.12. Add a test point to provide access to the pin for debugging. See section 1.12 PWR_ON pin has high input impedance. Do not keep floating in noisy environment:
external pull-up required. See section 1.6.1 I/O Reset signal See section 1.6.3 Do not connect Do not connect Do not connect Do not connect GSM.G1-HW-09002-F3 Preliminary System description Page 11 of 101 LEON-G100/G200 - System Integration Manual 1.4 Operating modes LEON-G100/G200 modules include several operating modes, each have different features and interfaces. Table 2 summarizes the various operating modes and provides general guidelines for operation. Operating Mode Description Features / Remarks Transition condition General Status: Power-down Not-Powered Mode VCC supply not present or below normal operating range. Microprocessor not operating. RTC only operates if supplied through V_BCKP pin. Power-Off Mode VCC supply within normal operating range. Microprocessor not operating. Only RTC runs. General Status: Normal Operation Idle-Mode Microprocessor runs with 32 kHz as reference oscillator. Module does not accept data signals from an external device. Module is switched off. Application interfaces are not accessible. Internal RTC timer operates only if a valid voltage is applied to V_BCKP pin. Any external signal connected to UART I/F, I2S I/F, HS_DET, or a GPIO must be set low or tri-stated to avoid an increase of module power-off consumption. Module is switched off: normal shutdown after sending the AT+CPWROFF command (refer to u-blox 2G GSM/GPRS AT Commands Manual
[2]). Application interfaces are not accessible. Only internal RTC in operation. Any external signal connected to the UART I/F, I2S I/F, HS_DET pin, or a GPIO must be set low or tri-stated to avoid an increase of the module power-off consumption. If power saving is enabled, the module automatically enters idle mode whenever possible. Application interfaces are disabled. If hardware flow control is enabled, the CTS line indicates when the module is in idle (power saving configuration): the line is driven in the OFF state when the module is not prepared to accept data signals. If hardware flow control is disabled, the CTS line is fixed to ON state. Module by default is not set to automatically enter in idle mode whenever possible, unless power saving configuration is enabled by appropriate AT command (refer to u-blox 2G GSM/GPRS AT Commands Manual [2], AT+UPSV). Module cannot be switched on by a falling edge provided on the PWR_ON input, neither by a preset RTC alarm, nor by charger detection on the V_CHARGE and CHARGE_SENSE pins. Module can be switched on by a falling edge provided on the PWR_ON input, by a preset RTC alarm, or by charger detection on the V_CHARGE and CHARGE_SENSE pins. If the module is registered with the network and power saving is enabled, it automatically goes in idle mode and periodically wakes up to active mode to monitor the paging channel for the paging block reception according to network indication. If module is not registered with the network and power saving is enabled, it automatically enters idle mode and periodically wakes up to monitor external activity. Module wakes up from idle mode to active mode if an RTC alarm occurs. Module wakes up from idle mode to active mode when data is received on UART interface (refer to 1.9.1 for more details). Module wakes up from idle mode to active mode if a voice or data call incoming. Module wakes up from idle mode to active mode when the RTS input line is set to the ON state by the DTE if the AT+UPSV=2 command is sent to the module (feature not enabled by default). Active-Mode Microprocessor runs with 26 MHz as reference oscillator. The module is ready to accept data signals from an external device. Module is switched on and is fully active:
power saving is not enabled. The application interfaces are enabled. GSM.G1-HW-09002-F3 Preliminary System description Page 12 of 101 LEON-G100/G200 - System Integration Manual Operating Mode Description Features / Remarks Transition condition The module is switched on and a voice call or a data call (GSM/GPRS) is in progress. Module is fully active. Application interfaces are enabled. When call terminates, module returns to the last operating state (Idle or Active). Module is switched off and cannot be switched on (not powered mode). The Pre-Charge phase of the charging process is enabled: charging of the deeply discharged battery is forced by HW at low current while the module is switched off Module is switched on and normal operations are enabled (Idle mode, Active mode or Connected mode). The charging process is enabled:
charging of battery is controlled by the microprocessor while the module is switched on Connected-Mode Voice or data call enabled. Microprocessor runs with 26 MHz as reference oscillator. Module is ready to accept data signals from an external device. General Status: Charging (LEON-G200 only) Pre-charge mode Charge-mode Battery connected to VCC. Battery voltage level is below the VCC normal operating range. Charger connected to V_CHARGE and CHARGE_SENSE inputs with proper voltage and current characteristics. Charging of the deeply discharged battery is enabled while the module is switched off. Battery connected to VCC. Battery voltage level is within the VCC normal operating range. Charger connected to V_CHARGE and CHARGE_SENSE inputs with proper voltage and current characteristics. Charging process enabled while the module is switched on and normal operations are enabled. Table 2: Module operating modes summary GSM.G1-HW-09002-F3 Preliminary System description Page 13 of 101 LEON-G100/G200 - System Integration Manual 1.5 Power management 1.5.1 Power supply circuit overview Figure 3: Power supply concept Power supply is via VCC pin. This is the only one main power supply pin. VCC pin connects the RF Power Amplifier and the integrated power management unit within the module: all supply voltages needed by the module are generated from the VCC supply by integrated voltage regulators. V_BCKP is the Real Time Clock (RTC) supply. When the VCC voltage is within the specified extended operating range, the module supplies the RTC: 2.0 V typical are generated by the module on the V_BCKP pin. If the VCC voltage is under the minimum specified extended limit, the RTC can be externally supplied via V_BCKP pin. When a 1.8 V or a 3 V SIM card type is connected, LEON-G100/G200 automatically supply the SIM card via VSIM pin. Activation and deactivation of the SIM interface with automatic voltage switch from 1.8 to 3 V is implemented, in accordance to the ISO-IEC 78-16-e specifications. The integrated power management unit also provides the control state machine for system start up, including start up with discharged batteries, pre-charging and system reset control. LEON-G100/G200 feature a power management concept optimized for most efficient use of battery power. This is achieved by hardware design utilizing power efficient circuit topology, and by power management software controlling the power saving configuration of the module. Battery management runs in the context of the operation and maintenance process:
Battery charging control, in order to maintain the full capacity of the battery Collecting and processing of measurements of battery voltage GSM.G1-HW-09002-F3 Preliminary System description Page 14 of 101 V_BCKPGSM/GPRS ChipsetPSRAMNOR FlashMCP Memory4-Bands GSM FEMAntennaSwitchPALDOsBBLDOsRFRTCLDOLDOEBUCharging Control1 F1 FLDOVSIMVCCLEON-G100/G2002 x 22 F23550 LEON-G100/G200 - System Integration Manual 1.5.2 Module supply (VCC) LEON-G100/G200 modules must be supplied through VCC pin by a DC power supply. Voltages must be stable, due to the surging consumption profile of the GSM system (described in the section 1.5.3). Name VCC Description Module Supply GND Ground Table 3: Module supply pins Remarks Clean and stable supply is required: low ripple and low voltage drop must be guaranteed. Voltage provided has to be always above the minimum limit of the operating range. Consider that there are large current spike in connected mode, when a GSM call is enabled. GND pins are internally connected but good (low impedance) external ground can improve RF performances: all GND pins must be externally connected to ground. VCC pin ESD rating is 1 kV (contact discharge). A higher protection level could be required if the line is externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin if it is externally accessible on the application board. The voltage provided to VCC pin must be within the normal operating range limits specified in the LEON-G100/G200 Data Sheet [1]. Complete functionality of the module is only guaranteed within the specified operational normal voltage range. Note that the module cannot be switched on if the VCC voltage value is below the specified normal operating range minimum limit: ensure that the input voltage at VCC pin is above the minimum limit of the normal operating range for more than 1 second after the start of the switch-on of the module. When LEON-G100/G200 modules are in operation, the voltage provided to VCC pin can exceed the normal operating range limits but must be within the extended operating range limits specified in LEON-G100/G200 Data Sheet [1]. Module reliability is only guaranteed within the specified operational extended voltage range. Note that the module switches off when VCC voltage value drops below the specified extended operating range minimum limit: ensure that the input voltage at VCC pin never drops below the minimum limit of the extended operating range when the module is switched on, not even during a GSM transmit burst, where the current consumption can rise up to maximum peaks of 2.5 A in case of a mismatched antenna load. Operation above the extended operating range maximum limit is not recommended and extended exposure beyond it may affect device reliability. Stress beyond the VCC absolute maximum ratings may cause permanent damage to the module:
if necessary, voltage spikes beyond VCC absolute maximum ratings must be limited to values within the specified boundaries by using appropriate protection. When designing the power supply for the application, pay specific attention to power losses and transients. The DC power supply has to be able to provide a voltage profile to the VCC pin with the following characteristics:
GSM.G1-HW-09002-F3 Preliminary System description Page 15 of 101 LEON-G100/G200 - System Integration Manual o Voltage drop during transmit slots has to be lower than 400 mV o Undershoot and overshoot at the start and at the end of transmit slots have to be not present o Voltage ripple during transmit slots has to be:
lower than 100 mVpp if fripple 200 kHz lower than 10 mVpp if 200 kHz < fripple 400 kHz lower than 2 mVpp if fripple > 400 kHz Figure 4: Description of the VCC voltage profile versus time during a GSM call Any degradation in power supply performance (due to losses, noise or transients) will directly affect the RF performance of the module since the single external DC power source indirectly supplies all the digital and analog interfaces, and also directly supplies the RF power amplifier (PA). 1.5.2.1 VCC application circuits The LEON module must be supplied through the VCC pin by one (and only one) proper DC power supply from the following:
Switching regulator Low Drop-Out (LDO) linear regulator Rechargeable Li-Ion battery Primary (disposable) battery GSM.G1-HW-09002-F3 Preliminary System description Page 16 of 101 TimeundershootovershootripplerippledropVoltage3.8 V (typ)RX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotRX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotGSM frame 4.615 ms (1 frame = 8 slots)GSM frame 4.615 ms (1 frame = 8 slots)TimeundershootovershootripplerippledropVoltage3.8 V (typ)RX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotRX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotGSM frame 4.615 ms (1 frame = 8 slots)GSM frame 4.615 ms (1 frame = 8 slots)RX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotRX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotGSM frame 4.615 ms (1 frame = 8 slots)GSM frame 4.615 ms (1 frame = 8 slots) LEON-G100/G200 - System Integration Manual Figure 5: VCC supply concept selection The switching step-down regulator is the typical choice when the available primary supply source has a nominal voltage much higher (e.g. greater than 5 V) than the LEON-G100/G200 operating supply voltage. The use of switching step-down provides the best power efficiency for the overall application and minimizes current drawn from main supply source. The use of an LDO linear regulator becomes convenient for primary supplies with relatively low voltage (e.g. less than 5 V). In this case a switching regulator with a typical efficiency of 90% reduces the benefit of voltage step-down for input current savings. Linear regulators are not recommended for high voltage step-down as they will dissipate a considerable amount of power in thermal energy. If the LEON-G100/G200 is deployed in a mobile unit with no permanent primary supply source available, then a battery is required to provide VCC. A standard 3-cell Lithium-Ion battery pack directly connected to VCC is the typical choice for battery-powered devices. Batteries with Ni-MH chemistry should be avoided, since they typically reach a maximum voltage during charging that is above the maximum rating for VCC. The use of primary (disposable) batteries is uncommon, since the typical cells available are seldom capable of delivering the burst peak current for a GSM call due to high internal resistance. The following sections highlight some design aspects for each of these supplies. Switching regulator The characteristics of the switching regulator connected to the VCC pin should meet the following requirements:
Power capabilities: the switching regulator with its output circuit must be capable of providing a proper voltage value to the VCC pin and delivering 2.5 A current pulses with a 1/8 duty cycle to the VCC pin Low output ripple: the switching regulator and output circuit must be capable of providing a clean (low noise) VCC voltage profile High switching frequency: for best performance and for smaller applications select a switching frequency 600 kHz (since an L-C output filter is typically smaller for high switching frequency). Using a switching regulator with a variable switching frequency or with a switching frequency lower than 600 kHz must be carefully evaluated since this can produce noise in the VCC voltage profile and therefore impact and worsen GSM modulation spectrum performance. An additional L-C low-pass filter between the switching regulator output and the VCC supply pin can mitigate the ripple on VCC, but adds extra voltage drop due to resistive losses in series inductors PWM mode operation: select preferably regulators with Pulse Width Modulation (PWM) mode. Pulse Frequency Modulation (PFM) mode and PFM/PWM mode transitions while in active mode must be avoided to reduce the noise on the VCC voltage profile. Switching regulators able to switch between low ripple GSM.G1-HW-09002-F3 Preliminary System description Page 17 of 101 Main Supply Available?BatteryLi-Ion 3.7 VLinear LDO RegulatorMain Supply Voltage >5 V?Switching Step-Down RegulatorNo, portable deviceNo, less than 5 VYes, greater than 5 VYes, always available LEON-G100/G200 - System Integration Manual PWM mode and high efficiency burst or PFM mode can be used, provided the mode transition occurs when the GSM module changes status from idle mode (current consumption approximately 1 mA) to active mode
(current consumption approximately 100 mA): it is permissible to use a regulator that switches from the PWM mode to the burst or PFM mode at an appropriate current threshold (e.g. 60 mA) Figure 6 and the components listed in Table 4 show an example of a high reliability power supply circuit, where the VCC module supply is provided by a step-down switching regulator capable to deliver 2.5 A current pulses, with low output ripple, with 1 MHz fixed switching frequency in PWM mode operation. The use of a switching regulator is suggested when the difference from the available supply rail and the VCC value is high: switching regulators provide good efficiency transforming a 12 V supply to the 3.8 V typical value of the VCC supply. The following power supply circuit example is implemented on the LEON Evaluation Board. Figure 6: Suggested schematic design for the VCC voltage supply application circuit using a step-down regulator Reference Description Part Number - Manufacturer C1 C2 C3 C4 C5 C6 C7 C8 C9 D1 L1 L2 R1 R2 R3 R4 R5 U1 47 F Capacitor Aluminum 0810 50 V MAL215371479E3 - Vishay 10 F Capacitor Ceramic X7R 5750 15% 50 V C5750X7R1H106MB - TDK 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata 680 pF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71H681KA01 - Murata 22 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H220JZ01 - Murata 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata 470 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E474KA12 - Murata 22 F Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata 330 F Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET Schottky Diode 40 V 3 A MBRA340T3G - ON Semiconductor 10 H Inductor 744066100 30% 3.6 A 744066100 - Wurth Electronics 1 H Inductor 7445601 20% 8.6 A 7445601 - Wurth Electronics 470 k Resistor 0402 5% 0.1 W 15 k Resistor 0402 5% 0.1 W 33 k Resistor 0402 5% 0.1 W 390 k Resistor 0402 1% 0.063 W 100 k Resistor 0402 5% 0.1 W 2322-705-87474-L - Yageo 2322-705-87153-L - Yageo 2322-705-87333-L - Yageo RC0402FR-07390KL - Yageo 2322-705-70104-L - Yageo Step Down Regulator MSOP10 3.5 A 2.4 MHz LT3972IMSE#PBF - Linear Technology Table 4: Suggested components for VCC voltage supply application circuit using a high reliability step-down regulator Figure 7 and the components listed in Table 5 show an example of a low cost power supply circuit, where the VCC module supply is provided by a step-down switching regulator capable of delivering 2.5 A current pulses, transforming a 12 V supply input. GSM.G1-HW-09002-F3 Preliminary System description Page 18 of 101 LEON-G100LEON-G20012VC6R3C5R2C3C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C71238114C8C9L2D1R4R5L1C4U150VCCGND LEON-G100/G200 - System Integration Manual Figure 7: Suggested schematic design for the VCC voltage supply application circuit using a low cost step-down regulator Reference Description Part Number - Manufacturer C1 C2 C3 C4 C5 C6 D1 L1 R1 R2 R3 R4 R5 U1 22 F Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 Murata 100 F Capacitor Tantalum B_SIZE 20% 6.3V 15m T520B107M006ATE015 Kemet 5.6 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H562KA88 Murata 6.8 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H682KA88 Murata 56 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H560JA01 Murata 220 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E224KA88 Murata Schottky Diode 25V 2 A STPS2L25 STMicroelectronics 5.2 H Inductor 30% 5.28A 22 m 4.7 k Resistor 0402 1% 0.063 W 910 Resistor 0402 1% 0.063 W 82 Resistor 0402 5% 0.063 W 8.2 k Resistor 0402 5% 0.063 W 39 k Resistor 0402 5% 0.063 W MSS1038-522NL Coilcraft RC0402FR-074K7L Yageo RC0402FR-07910RL Yageo RC0402JR-0782RL Yageo RC0402JR-078K2L Yageo RC0402JR-0739KL Yageo Step Down Regulator 8-VFQFPN 3 A 1 MHz L5987TR ST Microelectronics Table 5: Suggested components for VCC voltage supply application circuit using a low cost step-down regulator Low Drop-Out (LDO) linear regulator The characteristics of the LDO linear regulator connected to VCC pin should meet the following requirements:
Power capabilities: the LDO linear regulator with its output circuit has to be capable to provide a proper voltage value to VCC pin and has to be capable to deliver 2.5 A current pulses with 1/8 duty cycle to VCC pin Power dissipation: the power handling capability of the LDO linear regulator has to be checked to limit its junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input voltage to the min output voltage to evaluate the power dissipation of the regulator) Figure 8 and the components listed in Table 6 show an example of a power supply circuit, where the VCC module supply is provided by an LDO linear regulator capable to deliver 2.5 A current pulses, with proper power handling capability. The use of a linear regulator is suggested when the difference from the available supply rail and the VCC value is low: linear regulators provide good efficiency transforming a 5 V supply to the 3.8 V typical value of the VCC supply. GSM.G1-HW-09002-F3 Preliminary System description Page 19 of 101 LEON-G100LEON-G20012VR5C6C1VCCINHFSWSYNCOUTGND263178C3C2D1R1R2L1U150VCCGNDFBCOMP54R3C4R4C5 LEON-G100/G200 - System Integration Manual Figure 8: Suggested schematic design for the VCC voltage supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1 C2 R1 R2 R3 U1 10 F Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata 10 F Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata 47 k Resistor 0402 5% 0.1 W 4.7 k Resistor 0402 5% 0.1 W 2.2 k Resistor 0402 5% 0.1 W LDO Linear Regulator ADJ 3.0 A RC0402JR-0747KL - Yageo Phycomp RC0402JR-074K7L - Yageo Phycomp RC0402JR-072K2L - Yageo Phycomp LT1764AEQ#PBF - Linear Technology Table 6: Suggested components for VCC voltage supply application circuit using an LDO linear regulator Rechargeable Li-Ion battery The characteristics of the rechargeable Li-Ion battery connected to VCC pin should meet the following requirements:
Maximum pulse and DC discharge current: the rechargeable Li-Ion battery with its output circuit has to be capable to deliver 2.5 A current pulses with 1/8 duty cycle to VCC pin and has to be capable to deliver a DC current greater than the module maximum average current consumption to VCC pin. Note that the maximum pulse discharge current and the maximum DC discharge current are not always reported in batteries data sheet, but the maximum DC discharge current is typically almost equal to the battery capacity in Ampere-hours divided by 1 hour DC series resistance: the rechargeable Li-Ion battery with its output circuit has to be capable to avoid a VCC voltage drop greater than 400 mV during transmit bursts Maximum charging voltage (overcharge detection voltage): if the charging process is managed by the GSM module, the overcharge detection voltage of the used battery pack, which enables battery protection, must be greater or equal than 4.3 V, to be charged by the GSM module Charging operating temperature range: if the charging process is managed by the GSM module, the charging operating temperature range of the used battery pack must include the 0C-40C range, to be charged by the GSM module Maximum DC charging current: the rechargeable Li-Ion battery has to be capable to be charged by the charging current provided by the selected external charger. Note that the maximum DC charging current is not always reported in batteries data sheet, but the maximum DC charging current is typically almost equal to the battery capacity in Ampere-hours divided by 1 hour Primary (disposable) battery The characteristics of the primary (non-rechargeable) battery connected to VCC pin should meet the following requirements:
GSM.G1-HW-09002-F3 Preliminary System description Page 20 of 101 5 VC1R1INOUTADJGND12453C2R2R3U1SHDNLEON-G100LEON-G20050VCCGND LEON-G100/G200 - System Integration Manual Maximum pulse and DC discharge current: the no-rechargeable battery with its output circuit has to be capable to deliver 2.5 A current pulses with 1/8 duty cycle to VCC pin and has to be capable to deliver a DC current greater than the module maximum average current consumption to VCC pin. Note that the maximum pulse and the maximum DC discharge current is not always reported in batteries data sheet, but the maximum DC discharge current is typically almost equal to the battery capacity in Ampere-hours divided by 1 hour DC series resistance: the no-rechargeable battery with its output circuit has to be capable to avoid a VCC voltage drop greater than 400 mV during transmit bursts Additional hints for the VCC supply application circuits To reduce voltage drops, use a low impedance power source. The resistance of the power supply lines
(connected to VCC and GND pins of the module) on the application board and battery pack should also be considered and minimized: cabling and routing must be as short as possible in order to minimize power losses. To avoid undershoot and overshoot on voltage drops at the start and at the end of a transmit burst during a GSM call (when current consumption on the VCC supply can rise up to 2.5 A in the worst case), place a 330 F low ESR capacitor (e.g. KEMET T520D337M006ATE045) located near VCC pin of LEON-G100/G200. To reduce voltage ripple and noise, place near VCC pin of the LEON-G100/G200 the following components:
100 nF capacitor (e.g Murata GRM155R61A104K) to filter digital logic noises from clocks and data sources 10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noises from clocks and data sources 10 pF capacitor (e.g. Murata GRM1555C1E100J) to filter transmission EMI in the DCS/PCS bands 39 pF capacitor (e.g. Murata GRM1555C1E390J) to filter transmission EMI in the GSM/EGSM bands Note that the Figure 9 shows the complete configuration but the mounting of the each single component depends on application design. Figure 9: Suggested schematics design to reduce voltage ripple, noise and avoid undershoot and overshoot on voltage drops Reference Description Part Number - Manufacturer C1 C2 C3 C4 C5 330 F Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata 39 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E390JA01 - Murata 10 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E100JA01 - Murata Table 7: Suggested components to reduce voltage ripple and noise and avoid undershoot and overshoot on voltage drops GSM.G1-HW-09002-F3 Preliminary System description Page 21 of 101 VBATC1C4LEON-G100LEON-G20050VCCGNDC3C2C5+
LEON-G100/G200 - System Integration Manual 1.5.3 Current consumption profiles During operation, the current consumed by LEON-G100/G200 through VCC pin can vary by several orders of magnitude. This is applied to ranges from the high peak of current consumption during the GSM transmitting bursts at maximum power level in connected mode, to the low current consumption in idle mode when power saving configuration is enabled. 1.5.3.1 Current consumption profiles Connected mode When a GSM call is established, the VCC consumption is determined by the current consumption profile typical of the GSM transmitting and receiving bursts. The current consumption peak during a transmission slot is strictly dependent on the transmitted power, which is regulated by the network. If the module transmits in GSM talk mode in the GSM 850 or in the EGSM 900 band at the maximum power control level (32.2 dBm typical transmitted power in the transmit slot/burst), the current consumption can reach up to 2500 mA (with highly unmatched antenna) for 576.9 s (width of the transmit slot/burst) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/8 duty cycle, according to GSM TDMA. During a GSM call, current consumption is in the order of 100-200 mA in receiving or in monitor bursts and is about 30-50 mA in the inactive unused bursts (low current period). The more relevant contribution to determine the average current consumption is set by the transmitted power in the transmit slot. An example of current consumption profile of the data module in GSM talk mode is shown in Figure 10. Figure 10: Description of the VCC current consumption profile versus time during a GSM call (1 TX slot) When a GPRS connection is established there is a different VCC current consumption profile also determined by the transmitting and receiving bursts. In contrast to a GSM call, during a GPRS connection more than one slot can be used to transmit and/or more than one slot can be used to receive. The transmitted power depends on network conditions and sets the peak of current consumption, but following the GPRS specifications the maximum transmitted power can be reduced if more than one slot is used to transmit, so the maximum peak of current consumption is not as high as can be the case in a GSM call. If the module transmits in GPRS class 10 connected mode in the GSM 850 or in the EGSM 900 band at the maximum power control level (30.5 dBm typical transmitted power in the transmit slot/burst), the current consumption can reach up to 1800 mA (with highly unmatched antenna) for 1.154 ms (width of the 2 transmit slots/bursts) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/4 duty cycle, according to GSM TDMA. GSM.G1-HW-09002-F3 Preliminary System description Page 22 of 101 Time [ms]RX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotRX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotGSM frame 4.615 ms (1 frame = 8 slots)Current [A]200 mA~170 mA2500 mAPeak current depends on TX powerGSM frame 4.615 ms (1 frame = 8 slots)1.51.00.50.02.52.0~170 mA~40 mA LEON-G100/G200 - System Integration Manual In the following figure is reported the current consumption profiles with 2 slots used to transmit. Figure 11: Description of the VCC current consumption profile versus time during a GPRS connection (2 TX slots) 1.5.3.2 Current consumption profiles Cyclic idle/active mode (power saving enabled) The power saving configuration is by default disabled, but it can be enabled using the appropriate AT command
(refer to u-blox 2G GSM/GPRS AT Commands Manual [2], AT+UPSV command). When the power saving is enabled, the module automatically enters idle-mode whenever possible. When power saving is enabled, the module is registered or attached to a network and a voice or data call is not enabled, the module automatically enters idle-mode whenever possible, but it must periodically monitor the paging channel of the current base station (paging block reception), in accordance to GSM system requirements. When the module monitors the paging channel, it wakes up to active mode, to enable the reception of paging block. In between, the module switches to idle-mode. This is known as GSM discontinuous reception (DRX). The module processor core is activated during the paging block reception, and automatically switches its reference clock frequency from the 32 kHz used in idle-mode to the 26 MHz used in active-mode. The time period between two paging block receptions is defined by the network. It can vary from 470.76 ms
(width of 2 GSM multiframes = 2 x 51 GSM frames = 2 x 51 x 4.615 ms) up to 2118.42 ms (width of 9 GSM multiframes = 9 x 51 frames = 9 x 51 x 4.615 ms): this is the paging period parameter, fixed by the base station through broadcast channel sent to all users on the same serving cell. An example of the current consumption profile of the data module when power saving is enabled is shown in Figure 12: the module is registered with the network, automatically goes into idle mode and periodically wakes up to active mode to monitor the paging channel for paging block reception (cyclic idle/active mode). GSM.G1-HW-09002-F3 Preliminary System description Page 23 of 101 Time [ms]RX slotunused slotunused slotTX slotTX slotunused slotMON slotunused slotRX slotunused slotunused slotTX slotTX slotunused slotMON slotunused slotGSM frame 4.615 ms (1 frame = 8 slots)Current [A]200mA~170 mA1800 mAPeak current depends on TX power~170 mAGSM frame 4.615 ms (1 frame = 8 slots)1.51.00.50.02.52.0~40 mA LEON-G100/G200 - System Integration Manual Figure 12: Description of the VCC current consumption profile versus time when power saving is enabled: the module is in idle mode and periodically wakes up to active mode to monitor the paging channel for paging block reception 1.5.3.3 Current consumption profiles Fixed active mode (power saving disabled) Power saving configuration is by default disabled, or it can be disabled using the appropriate AT command (refer to u-blox 2G GSM/GPRS AT Commands Manual [2], AT+UPSV command). When power saving is disabled, the module doesnt automatically enter idle-mode whenever possible: the module remains in active mode. The module processor core is activated during active-mode, and the 26 MHz reference clock frequency is used. An example of the current consumption profile of the data module when power saving is disabled is shown in Figure 13: the module is registered with the network, active-mode is maintained, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception. GSM.G1-HW-09002-F3 Preliminary System description Page 24 of 101
~30 msIDLE MODEACTIVE MODEIDLE MODE500-700 A8-10 mA20-22 mA~150 mAActive Mode EnabledIdle Mode EnabledPLL EnabledRX+DSP Enabled500-700 A~150 mA0.44-2.09 sIDLE MODE~30 msACTIVE MODETime [s]Current [mA]150100500Time [ms]Current [mA]150100500 LEON-G100/G200 - System Integration Manual Figure 13: Description of the VCC current consumption profile versus time when power saving is disabled: active-mode is always held, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception 1.5.4 Battery charger (LEON-G200 only) For battery charging functionalities the module is provided with integrated circuitry and software. Two pins are available to connect the positive pole of the external DC supply used as charger. Name Description Remarks V_CHARGE Charger Voltage Supply Input CHARGE_SENSE Charger Voltage Measurement Input V_CHARGE and CHARGE_SENSE pins must be externally connected together. V_CHARGE and CHARGE_SENSE pins must be externally connected together. Table 8: Battery charger pins V_CHARGE and CHARGE_SENSE pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins if they are externally accessible on the application board. GSM.G1-HW-09002-F3 Preliminary System description Page 25 of 101 ACTIVE MODE20-22 mA20-22 mA~150 mARX+DSP Enabled20-22 mA~150 mA0.47-2.12 sPaging periodTime [s]Current [mA]150100500Time [ms]Current [mA]150100500 LEON-G100/G200 - System Integration Manual The V_CHARGE pin is the charger supply input: it sinks the charge current that is typically in the order of several hundred of mA. The CHARGE_SENSE pin is connected to an internal ADC converter to measure the charging voltage: it senses the charger voltage and sinks a few A. V_CHARGE and CHARGE_SENSE pins must be externally connected together as shown in Figure 14. There may not be any capacitor on the charge path: a straight connection must be provided between the output of the external supply used as charging source and V_CHARGE and CHARGE_SENSE pins of the module. If the battery charging process is not managed by the GSM module, V_CHARGE and CHARGE_SENSE pins can be left floating on the application board. Figure 14: Connection of an external DC supply used as charger and a Li-Ion battery to the LEON-G200 module To prevent damage to the module and the battery, use only chargers that comply with the characteristics given in section 1.5.4.2. 1.5.4.1 Charging process description A valid charger is recognized if the voltage provided to V_CHARGE and CHARGE_SENSE pins are within the operating range limits (5.6 V minimum, 15 V maximum). If the module is switched off, the charger circuitry generates the power on in charging mode after charger detection. The algorithm that controls battery charging, implements a classic Li-Ion battery charging process, divided into 4 phases:
1. Pre-Charge, at low current, for deeply discharged batteries (VCC voltage within 0 V and 3.1 V typical) 2. Fast Charge, at the maximum current provided by the external DC supply used as charger that must be current limited, for discharged batteries (VCC voltage within 3.1 V typical and 4.2 V typical) 3. Top Charge, to complete the over-charging of the batteries, after the maximum voltage is reached (VCC voltage equal to 4.2 V typical) 4. Trickle Charge, to maintain the battery at higher level of charge, if the external DC supply used as charger remains connected If the batteries are deeply discharged (VCC voltage within 0 V and 3.1 V typical with 7% tolerance due to change in temperature and life time), and the device is in not-powered mode, the charger circuit starts pre-charging when a valid voltage is provided to V_CHARGE and CHARGE_SENSE pins of the module. In the pre-charging phase, the charge transistor switch mounted inside the module is pulsed with a 100 Hz clock and GSM.G1-HW-09002-F3 Preliminary System description Page 26 of 101 LEON-G200+ChargerVoltage and current limitedLi-Ion Battery5CHARGE_SENSE4V_CHARGEGND50VCCGND-+-
LEON-G100/G200 - System Integration Manual an on-time of 12.5% of a period. This means the average charge current is reduced to avoid overheating of charger parts and to gently charge the deeply discharged batteries: the average pre-charge current is ~1/8 (i.e. 12.5%) of the current provided by the external charger, so it is ~1/8 of the external charger current limit. Pre-charging phase is hardware controlled and continues as long as the VCC voltage reaches the 3.1 V typical limit, so the module is able to start the following fast charging phase. During fast charging phase (following the pre-charging phase) the charge transistor switch mounted inside the module is pulsed with a 100 Hz and an on-time of 99% of a period: the average charge current is almost equal
(i.e. 99%) to the current provided by the external charger, so it is almost equal to the external charger current limit. The remaining off time (i.e. 1% of a period) is used to check if the external charger is still connected since detection is critical when charging switch is closed. The integrated charging circuit doesnt have any voltage or current limitation, therefore the charger must be chosen very carefully: during the fast charging phase, the battery is charged with the maximum DC current provided by the external DC supply used as charger, which must be current limited as described in the charger specification section. When the battery voltage reaches the nominal maximum voltage (4.2 V typical with 2% tolerance due to change in temperature and life time), charging enters the constant voltage phase (top charge algorithm): in this phase the average charging current decreases until the battery is completely charged. After the constant voltage phase, the battery is maintained at a higher level of charge with the trickle charge algorithm until an external charger is connected to the module. The charging process is enabled only within the temperature range from 0C to 40C, with a 5C hysteresis to prevent rapid switching on and off as the temperature drifts around the set point: charging is disabled when the temperature falls below 0C and then enabled when it rises above 5C; charging is disabled when the measured temperature rises above 40C and then enabled when falls below 35C. Battery over-voltage detection is implemented to switch-off charging if the battery is removed during charging. The VCC over-voltage threshold level is set to the nominal value of 4.47 V (evaluated with 2% of tolerance due to change in temperature and life time). The charging process is disabled when an external charger is removed from V_CHARGE and CHARGE_SENSE pins. 1.5.4.2 External charger specification It is suggested to use a charger with the following electrical characteristics:
6 V DC voltage 500 mA current limit (if it is less than the maximum DC charging current specified by the used battery) To avoid damage to the module, the external supply used as charging source must be voltage and current limited, with a voltage limit 15 V and a current limit 1.0 A. DC supplies with fold-back current protection cannot be used as charger for the module. The V-I output characteristics of the external supply used as charger must be within the valid area delineated by:
the maximum acceptable charging voltage (equal to 15 V in any case) the minimum open circuit voltage valid for charger detection (equal to 5.6 V in any case) the maximum acceptable charging current (equal to 1.0 A or to the maximum DC charging current specified by the used battery if it is less than 1.0 A) the minimum charging current (specified by the application, e.g. 400 mA) Maximum voltage The voltage limit of the external charger must be 15 V. Since the module is not provided with an internal overvoltage protection circuit on V_CHARGE and CHARGE_SENSE pins, the charging voltage must be lower or GSM.G1-HW-09002-F3 Preliminary System description Page 27 of 101 LEON-G100/G200 - System Integration Manual equal to the maximum acceptable charging voltage value of 15 V at any time: voltage spikes that may occur during connection or disconnection of the charger must be limited within this value, so the external supply used as charging source must be voltage limited with a voltage limit 15 V. Minimum voltage The charger must be able to provide a minimum open circuit output voltage 5.6 V for the valid charger detection. Maximum current The current limit of the external charger must be 1.0 A (that is the module absolute maximum rating as charging current) and must be lower than the maximum DC charging current specified by the used battery. Since the module is not provided with an internal over-current protection circuit on V_CHARGE and CHARGE_SENSE pins, the charging current must be lower or equal to the maximum acceptable charging current value at any time: current spikes that may occur during charger connection or disconnection must be limited within this value, so the external supply used as charging source must be current limited with a proper current limit. Minimum current A minimum acceptable value for the charging current is not specified, but the charging current value should be large enough to perform the whole battery charging process within the time interval defined by the application and the charging current value should be greater than the highest possible average current consumption of the system that is supplied by the battery (i.e. the module plus any additional device on the application board) to let the increase of the battery level while the system reaches its highest current consumption. For example, if the battery supplies only the module and the charging current value is equal to 400 mA, the battery level can be increased also when the module reaches its highest current consumption (during a GPRS connection). If some other devices are supplied by the battery beside the module, when the battery is deeply discharged (VCC below 3.1 V typical), the module is switched off and the pre-charging current (~1/8 of the external charger current limit) is enabled: this current should be greater than the highest possible average current consumption of the system to let the increase of the battery level while the system reaches its highest current consumption. For example, Figure 15 shows the valid area for the charger V-I output characteristics using a battery with a maximum DC charging current equal to 600 mA: the maximum acceptable charging current is defined by the battery requirement (600 mA). GSM.G1-HW-09002-F3 Preliminary System description Page 28 of 101 LEON-G100/G200 - System Integration Manual Figure 15: Valid area for the charger V-I output characteristics using a battery with a max DC charging current equal to 600 mA For example, Figure 16 shows the valid area for the charger V-I output characteristics using a battery with a maximum DC charging current greater than 1000 mA: the maximum acceptable charging current is defined by the module requirement (1000 mA). Figure 16: Valid area for the charger V-I output characteristics using a battery with a max DC charging current greater than 1 A GSM.G1-HW-09002-F3 Preliminary System description Page 29 of 101 1615.014131211109876543210800700500400300200100090010001100mAV5.66001615.01413121110987654321080070050040030020010009006001100mAV5.61000 LEON-G100/G200 - System Integration Manual 1.5.5 RTC Supply (V_BCKP) V_BCKP connects the Real Time Clock (RTC) supply, generated internally by a linear regulator integrated in the module chipset. The output of this linear regulator is enabled when the main voltage supply providing the module through VCC is within the valid operating range, or if the module is switched-off. Name V_BCKP Description Real Time Clock supply Table 9: Real Time Clock supply pin Remarks V_BCKP = 2.0 V (typical) generated by the module to supply Real Time Clock when VCC supply voltage is within valid operating range. V_BCKP pin ESD rating is 1 kV (contact discharge). A higher protection level could be required if the line is externally accessible on the application board. A higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin if it is externally accessible on the application board. The RTC provides the time reference (date and time) of the module, also in power-off mode, since the RTC runs when the V_BCKP voltage is within its valid range (specified in LEON-G100/G200 Data Sheet [1]). The RTC block is able to provide programmable alarm functions by means of the internal 32.768 kHz clock. The RTC block has very low, but highly temperature dependent power consumption. For example at 25C and a V_BCKP voltage of 2.0 V the power consumption is approximately 2 A, whereas at 85C and an equal voltage it increases to 5 A. The RTC can be supplied from an external back-up battery through V_BCKP, when the main voltage supply is not provided to the module through VCC. This enables the time reference (date and time) to run even when the main supply is not provided to the module. The module cannot switch on if a valid voltage is not present on VCC, even when RTC is supplied through V_BCKP (meaning that VCC is mandatory to switch-on the module). If V_BCKP is left unconnected and the main voltage supply of the module is removed from VCC, the RTC is supplied from the 1 F buffer capacitor mounted inside the module. However, this capacitor is not able to provide a long buffering time: within 0.5 seconds the voltage on V_BCKP will fall below the valid range (1 V min). If RTC is not required when VCC supply is removed, V_BCKP can be left floating on the application board. If RTC has to run for a time interval of T [seconds] at 25C and VCC supply is removed, place a capacitor of nominal capacitance of C [F] at the V_BCKP pin. Choose the capacitor using the following formula:
C [F] = (Current_Consumption [A] x T [seconds]) / Voltage_Drop [V] = 2 x T [seconds]
The current consumption of the RTC is around 2 A at 25C, and the voltage drop is equal to 1 V (from the V_BCKP typical value of 2.0 V to the valid range minimum limit of 1.0 V). For example, a 100 F capacitor (such as the Murata GRM43SR60J107M) can be placed at V_BCKP to provide a long buffering time. This capacitor will hold V_BCKP voltage within its valid range for around 50 seconds at 25C, after the VCC supply is removed. If a very long buffering time is required, a 70 mF super-capacitor (e.g. Seiko Instruments XH414H-IV01E) can be placed at V_BCKP, with a 4.7 k series resistor to hold the V_BCKP voltage within its valid range for around 10 hours at 25C, after the VCC supply is removed. The purpose of the series resistor is to limit the capacitor charging current due to the big capacitor specifications, and also to let a fast rise time of the voltage value at the V_BCKP pin after VCC supply has been provided. These capacitors will allow the time reference to run during a disconnection of the VCC supply. GSM.G1-HW-09002-F3 Preliminary System description Page 30 of 101 LEON-G100/G200 - System Integration Manual Figure 17: Real time clock supply (V_BCKP) application circuits: (a) using a 100 F capacitor to let the RTC run for 50 seconds at 25C; (b) using a 70 mF capacitor to let the RTC run for ~10 hours at 25C when the VCC supply is removed; (c) using a not rechargeable battery Reference Description Part Number - Manufacturer C1 R2 C2 100 F Tantalum Capacitor GRM43SR60J107M - Murata 4.7 k Resistor 0402 5% 0.1 W RC0402JR-074K7L - Yageo Phycomp 70 mF Capacitor XH414H-IV01E - Seiko Instruments Table 10: Example of components for V_BCKP buffering If longer buffering time is required to allow the time reference to run during a disconnection of the VCC supply, a rechargeable battery, which has to be able to provide a 2.0 V nominal voltage and must not exceed the maximum operating voltage value of 2.25 V, can be connected to the V_BCKP pin with a proper series resistor. Otherwise a not rechargeable battery, which has to be able to provide a 2.0 V nominal voltage and must not exceed the maximum operating voltage value of 2.25 V, can be connected to the V_BCKP pin with a proper series resistor and a proper series diode. The purpose of the series resistor is to limit the battery charging current due to the battery specifications, and also to let a fast rise time of the voltage value at the V_BCKP pin after VCC supply has been provided. The purpose of the series diode is to avoid a current flow from the V_BCKP pin of the module to the not rechargeable battery. 1.6 System functions 1.6.1 Module power on The power-on sequence of the module is initiated in one of 4 ways:
Rising edge on the VCC pin to a valid voltage as module supply Low level on the PWR_ON signal RTC alarm Charger detection on the V_CHARGE and CHARGE_SENSE pins (LEON-G200 only) Name PWR_ON Description Power-on input Table 11: Power-on pin Remarks PWR_ON pin has high input impedance. Do not keep floating in noisy environment: external pull-up required. PWR_ON pin ESD rating is 1 kV (contact discharge). A higher protection level could be required if the line is externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin if it is externally accessible on the application board. GSM.G1-HW-09002-F3 Preliminary System description Page 31 of 101 LEON-G100/G200C1(a)2V_BCKPR2C2(superCap)(b)2V_BCKP2V(c)2V_BCKPLEON-G100/G200LEON-G100/G200 LEON-G100/G200 - System Integration Manual 1.6.1.1 Rising edge on VCC When a supply is connected to VCC pin, the module supply supervision circuit controls the subsequent activation of the power up state machines: the module is switched-on when the voltage rises up to the VCC normal operating range minimum limit (3.35 V) starting from a voltage value lower than 2.25 V. 1.6.1.2 Low level on the PWR_ON Power-on sequence of the module starts when a low level is forced on the PWR_ON signal for at least 5 ms. The electrical characteristics of the PWR_ON input pin are different from the other digital I/O interfaces: the high and the low logic levels have different operating ranges and the pin is tolerant against voltages up to the battery voltage. The detailed electrical characteristics are described in LEON-G100/G200 Data Sheet [1]. PWR_ON pin has high input impedance and is weakly pulled to the high level on the module. Avoid keep it floating in noisy environment. To hold the high logic level stable, the PWR_ON pin must be connected to a pull-up resistor (e.g. 100 k) biased by a supply rail present on the application board, in range from 1.8 V to 4.5 V, which supply rail should be available when the module is in power-off mode. If PWR_ON input is connected to a push button that shorts the PWR_ON pin to ground, the V_BCKP supply pin or the VCC supply pin of the module can be used to bias the pull-up resistor. If PWR_ON input is connected to an external device (e.g. application processor), it is suggested to use an open drain output of the external device with an external pull-up. Connect the pull-up the V_BCKP supply pin or the VCC supply pin of the module, or to another supply rail present on the application board, in range from 1.8 V to 4.5 V, which supply rail should be available when the module is in power-off mode. If PWR_ON pin is connected to a push-pull output pin of an application processor, the pull-up can be provided to pull high the PWR_ON level when the application processor is switched off. If the high-level voltage of the push-pull output pin of the application processor is greater than 2.0 V, the V_BCKP supply cannot be used to bias the pull-up resistor: the supply rail of the application processor or the VCC supply can be used. Using a push-pull output of the external device, take care to fix the proper level in all the possible scenarios to avoid an inappropriate switch-on of the module. The module can be switched-on by forcing a low level for at least 5 ms on the PWR_ON pin: the module is not switched-on by a falling edge provided on the PWR_ON pin. The suggested PWR_ON pull-up resistor value is 100 k: lower resistance value will increase the module power-off consumption. GSM.G1-HW-09002-F3 Preliminary System description Page 32 of 101 LEON-G100/G200 - System Integration Manual Figure 18: Power on (PWR_ON) application circuits using a push button or using an application processor 1.6.1.3 RTC alarm The module can be switched-on by the RTC alarm if a valid voltage is applied to VCC pin, when Real Time Clock system reaches a pre-defined scheduled time. The RTC system will then initiate the boot sequence by indicating to the power management unit to turn on power. Also included in this setup is an interrupt signal from the RTC block to indicate to the baseband processor, that a RTC event has occurred. 1.6.1.4 Charger detection on V_CHARGE and CHARGE_SENSE pins (LEON-G200 only) The module can be switched-on by a charger: when a voltage value within the valid range for charger detection is applied to the module V_CHARGE and CHARGE_SENSE pins (See LEON-G100/G200 Data Sheet [1]), the module is switched on in charge mode. 1.6.1.5 Additional considerations The module is switched on when the voltage rises up to the VCC normal operating range: the first time that the module is used, it is switched on in this way. Then, the proper way to switch-off the module is by means of the AT+CPWROFF command. When the module is in power-off mode, i.e. the AT+CPWROFF command has been sent and a voltage value within the normal operating range limits is still provided to the VCC pin, the digital input-output pads of the baseband chipset (i.e. all the digital pins of the module) are locked in tri-state (i.e. floating). The power down tri-state function isolates the pins of the module from its environment, when no proper operation of the outputs can be guaranteed. To avoid an increase of the module current consumption in power down mode, any external signal of the digital interfaces connected to the module must be set low or tri-
stated when the module is in not-powered mode or in the power-off mode. The module can be switched on from power-off mode by forcing a proper start-up event (i.e. a low level on the PWR_ON pin, or an RTC alarm, or a charger detection). After the detection of a start-up event, all the digital pins of the module are held in tri-state until all the internal LDO voltage regulators are turned on in a defined power-on sequence. Then, as described in Figure 19, the baseband core continues to be held in reset state for a time interval: the module still pulls the RESET_N pin low and any signal from the module digital interfaces is held in reset state. The reset state of all the digital pins is reported in the pin description table of the LEON-G100/G200 Data Sheet [1]. When the module releases the RESET_N pin, the level at this pin will be pulled GSM.G1-HW-09002-F3 Preliminary System description Page 33 of 101 Power-on push buttonLEON-G100/G20019PWR_ONLEON-G100/G20019PWR_ONApplication Processor100 k100 k2V_BCKPESD LEON-G100/G200 - System Integration Manual high by the action of the internal pull-up and the configuration of the module interfaces will start: during this phase any digital pin is set in a proper sequence from reset state to the default operational configuration. The module is fully ready to operate when all the interfaces are configured. Figure 19: Power on sequence description (* - the PWR_ON signal state is not relevant during this phase) GSM.G1-HW-09002-F3 Preliminary System description Page 34 of 101 VCCV_BCKPPWR_ONLDOsRESET_NSystem StateBB Pads StateReset OperationalOperationalTristate / Floating ResetOFFON*Start-up event0 ms~22 ms~23 ms~45 ms~1500 msPWR_ON can be set highStart of interfaces' configurationAll interfaces are configured LEON-G100/G200 - System Integration Manual 1.6.2 Module power off The correct way to switch off LEON-G100/G200 modules is by means of the AT command AT+CPWROFF (more details in u-blox 2G GSM/GPRS AT Commands Manual [2]): in this way the current parameter settings are saved in the modules non-volatile memory and a proper network detach is performed. An under-voltage shutdown will be done if VCC falls below the extended operating range minimum limit (see LEON-G100/G200 Data Sheet [1]), but in this case the current parameter settings are not saved in the modules non-volatile memory and a proper network detach cannot be performed. When the AT+CPWROFF command is sent, the module starts the switch-off routine replying OK on the AT interface: during this phase, the current parameter settings are saved in the modules non-volatile memory, a network detach is performed and all module interfaces are disabled (i.e. the digital pins are locked in tri-state by the module). Since the time to perform a network detach depends on the network settings, the duration of this phase can differ from the typical value reported in Figure 20. At the end of the switch-off routine, the module pulls the RESET_N pin low to indicate that it is in power-off mode: all the digital pins are locked in tri-state by the module and all the internal LDO voltage regulators except the RTC supply (V_BCKP) are turned off in a defined power-off sequence. The module remains in power-off mode as long as a switch-on event doesnt occur
(i.e. a low level on the PWR_ON pin, or an RTC alarm, or a charger detection), and enters not-powered mode if the supply is removed from the VCC pin. To avoid an increase of module current consumption in power-down mode, any external signal connected to the module digital pins (UART interface, Digital audio interface, HS_DET, GPIOs) must be set low or tri-stated when the module is in the not-powered or power-off modes. If the external signals connected to the module digital pins cannot be set low or tri-stated, insert a switch (e.g. Texas Instruments SN74CB3Q16244, or Texas Instruments TS5A3159, or Texas Instruments TS5A63157) between the two-circuit connections. Set the switch to high impedance when the module is in power-
down mode (to avoid an increase of the module power consumption). The power-off sequence is described in Figure 20. Figure 20: Power off sequence description (* - the PWR_ON signal state is not relevant during this phase) GSM.G1-HW-09002-F3 Preliminary System description Page 35 of 101 VCCV_BCKPPWR_ON*LDOsRESET_NSystem StateBB Pads StateOperationalOFFTristate / Floating ONOperational Tristate / FloatingAT+CPWROFFsent to the module0 ms~50 ms~400 msOKreplied by the module LEON-G100/G200 - System Integration Manual 1.6.3 Module reset LEON-G100/G200 modules can be reset using the RESET_N pin: when the RESET_N pin is forced low for at least 50 ms, an external or hardware reset is performed, that causes an asynchronous reset of the entire module, except for the RTC. Forcing an external or hardware reset, the current parameter settings are not saved in the modules non-volatile memory and a proper network detach is not performed. LEON-G100/G200 modules can also be reset by means of the AT command AT+CFUN (more details in u-blox 2G GSM/GPRS AT Commands Manual [2]): in this case an internal or software reset is performed, that causes, like the external or hardware reset, an asynchronous reset of the entire module except for the RTC. Forcing an internal or software reset, the current parameter settings are saved in the modules non-volatile memory and a proper network detach is performed. The RESET_N pin is pulled low by the module when the module is in power-off mode or an internal reset occurs. In these cases an internal open drain FET pulls the line low. Name RESET_N Description Reset signal Table 12: Reset pin Remarks A series Schottky diode is integrated in the module as protection. An internal 12.6 k pull-up resistor pulls the line to 1.88 V when the module is not in the reset state. An internal open drain FET pulls the line low when an internal reset occurs and when the module is in power down mode. RESET_N pin ESD rating is 1 kV (contact discharge). A higher protection level could be required if the line is externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin if it is externally accessible on the application board. For more details about the general precautions for ESD immunity about RESET_N pin please refer to chapter 2.5.1. The electrical characteristics of RESET_N are different from the other digital I/O interfaces. The high and low logic levels have different operating ranges and absolute maximum ratings. The detailed electrical characteristics are described in the LEON-G100/G200 Data Sheet [1]. As described in the Figure 21, a series Schottky diode is mounted inside the module on the RESET_N pin to increase the maximum allowed input voltage up to 4.5 V as operating range. Nevertheless the module senses a low level when the RESET_N pin is forced low from the external. As described in Figure 21, the module has an internal pull-up resistor (12.6 k typical) which pulls the level on the RESET_N pin to 1.88 V (typical) when the module is not in reset state. Therefore an external pull-up is not required on the application board. Forcing RESET_N low for at least 50 ms will cause an external reset of the module. When RESET_N is released from the low level, the module automatically starts its power-on reset sequence. If RESET_N is connected to an external device (e.g. an application processor on an application board) an open drain output can be directly connected without any external pull-up. Otherwise, use a push-pull output. Make sure to fix the proper level on RESET_N in all possible scenarios, to avoid unwanted reset of the module. The reset state of each digital pin is reported in the pin description table in the LEON-G100/G200 Data Sheet [1]. GSM.G1-HW-09002-F3 Preliminary System description Page 36 of 101 LEON-G100/G200 - System Integration Manual Figure 21: Application circuits to reset the module using a push button or using an application processor When the module is in power-off mode or an internal reset occurs, RESET_N is pulled low by the module itself:
RESET_N acts as an output pin in these cases since an internal open drain FET (illustrated in Figure 21 and in Figure 22) pulls the line low. The RESET_N pin can indicate to an external application that the module is switched on and is not in the reset state: RESET_N is high in these cases and is low otherwise. To sense the RESET_N level (i.e. both the high level and the low level), the external circuit has to be able to cause a small current through the series Schottky diode integrated in the module as protection (illustrated in Figure 21 and Figure 22) by means of a very weak pull-
down. One of the following application circuits can be implemented to determine the RESET_N status:
RESET_N connected to an LED that emits light when the module is powered up and not in reset state and doesnt emit light otherwise, through a biased inverting NPN transistor, with a series base resistor with a resistance value greater or equal to 330 k RESET_N connected to an input pin of an application processor that senses a low logic level (0 V) when the module is powered up and is not in reset state and senses a high logic level (i.e. 3.0 V) otherwise, through an inverting and level shifting NPN transistor, with a series base resistor with a resistance value greater or equal to 330 k RESET_N connected to an input pin of the application processor that senses a high logic level (1.8 V) when the module is powered up and is not in reset state and senses a low logic level (0 V) otherwise, through a weak pull-down resistor, with a resistance value greater or equal to 680 k. Examples of application circuits to sense the RESET_N level are shown in the Figure 22. GSM.G1-HW-09002-F3 Preliminary System description Page 37 of 101 Reset push buttonOUTINLEON-G100/G20012.6 k1.88 V22RESET_NOUTINLEON-G100/G20012.6 k1.88 V22RESET_NApplication ProcessorESD LEON-G100/G200 - System Integration Manual Figure 22: Application circuits to sense if the module is in the reset state The RESET_N is set low by the module for 160 s to indicate that an internal reset occurs. The exact low level time interval depends on the implemented circuit, since the fall time of the RESET_N low pulse depends on the pull-down value, which must be greater or equal to 680 k. For example, if LEON RESET_N pin is connected through a 680 k pull-down resistor to an input pin of an application processor in the 1.8 V domain (i.e. Vih = 0.7 x 1.8 V = 1.26 V, Vil = 0.3 x 1.8 V = 0.54 V), the low level time interval will be ~145 s, since the 680 k pull-down forces a ~35 s 100%-0% fall time, as illustrated in the Figure 23. GSM.G1-HW-09002-F3 Preliminary System description Page 38 of 101 OUTINLEON-G100/G20012.6 k1.88 V22RESET_NApplication Processor680 kINPUTOUTINLEON-G100/G20012.6 k1.88 V22RESET_NApplication ProcessorINPUT22 k330 kOUTINLEON-G100/G20012.6 k1.88 V22RESET_N330 k220 LEON-G100/G200 - System Integration Manual Figure 23: RESET_N behavior due to an internal reset 1.7 RF connection The ANT pin has 50 nominal impedance and must be connected to the antenna through a 50 transmission line to allow transmission and reception of radio frequency (RF) signals in the GSM operating bands. Name ANT Description RF antenna Table 13: Antenna pin Remarks 50 nominal impedance. ANT port ESD rating is 4 kV (contact discharge). A higher protection level could be required if the line is externally accessible on the application board. A higher protection level can be achieved with an external high pass filter, consists of a 15 pF capacitor (e.g. Murata GRM1555C1H150JA01) and a 39 nH coil (e.g. Murata LQG15HN39NJ02) connected to the ANT port. Note that antenna detection functionality will be not provided implementing this high pass filter for ESD protection on the ANT port. Choose an antenna with optimal radiating characteristics for the best electrical performance and overall module functionality. An internal antenna, integrated on the application board, or an external antenna, connected to the application board through a proper 50 connector, can be used. See section 2.4 and 2.2.1.1 for further details regarding antenna guidelines. The recommendations of the antenna producer for correct installation and deployment (PCB layout and matching circuitry) must be followed. If an external antenna is used, the PCB-to-RF-cable transition must be implemented using either a suitable 50 connector, or an RF-signal solder pad (including GND) that is optimized for 50 characteristic impedance. If antenna supervisor functionality is required, the antenna should have built in DC diagnostic resistor to ground to get proper antenna detection functionality (See section 2.4.3 Antenna detection functionality). GSM.G1-HW-09002-F3 Preliminary System description Page 39 of 101 Depends on the pull-down strength(~35 s with 680 k)time [s]1600LOW = 0 VHIGH = 1.88 VReset state startReset state endRESET_N LEON-G100/G200 - System Integration Manual 1.8 SIM interface An SIM card interface is provided on the board-to-board pins of the module. High-speed SIM/ME interface is implemented as well as automatic detection of the required SIM supporting voltage. Both 1.8 V and 3 V SIM types are supported: activation and deactivation with automatic voltage switch from 1.8 to 3 V is implemented, according to ISO-IEC 78-16-e specifications. The SIM driver supports the PPS (Protocol and Parameter Selection) procedure for baud-rate selection, according to the values determined by the SIM Card. Table 14 describes the board-to-board pins related to the SIM interface:
Name VSIM SIM_CLK SIM_IO SIM_RST Description SIM supply SIM clock SIM data SIM reset Table 14: SIM Interface pins Remarks 1.80 V typical or 2.85 V typical automatically generated by the module 3.25 MHz clock frequency Internal 4.7 k pull-up to VSIM A low capacitance ESD protection (e.g. Infineon ESD8V0L2B-03L or AVX USB0002RP or AVX USB0002DP) must be placed near the SIM card holder on each line (VSIM, SIM_IO, SIM_CLK, SIM_RST). SIM interface pins ESD rating is 1 kV (contact discharge): higher protection level is required if the lines are connected to a SIM card holder/connector, so they are externally accessible on the application board. For more details about the general precautions for ESD immunity about SIM pins please refer to chapter 2.5.1. Figure 24 shows the minimal circuit connecting the LEON and the SIM card. Figure 24: SIM interface application circuit GSM.G1-HW-09002-F3 Preliminary System description Page 40 of 101 LEON-G100/G200C1SIM CARD HOLDERCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)C2C3C5D1D2C5C6C7C1C2C3SIM Card Bottom View (contacts side)J135VSIM33SIM_IO32SIM_CLK34SIM_RSTC4 LEON-G100/G200 - System Integration Manual Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H470JZ01 - Murata C5 D1, D2 J1 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata ESD Transient Voltage Suppressor USB0002RP or USB0002DP - AVX SIM Card Holder Various Manufacturers, C707-10M006-136-2 - Amphenol Corporation Table 15: Example of components for SIM card connection When connecting the module to a SIM card holder, perform the following steps on the application board:
Bypass digital noise via a 100 nF capacitor (e.g. Murata GRM155R71C104KA01) on the SIM supply (VSIM) To prevent RF coupling, connect a 47 pF bypass capacitor (e.g. Murata GRM1555C1H470JZ01) at each SIM signal (VSIM, SIM_CLK, SIM_IO, SIM_RST) to ground near the SIM connector Mount very low capacitance ESD protection (e.g. Infineon ESD8V0L2B-03L or AVX USB0002RP) near the SIM card connector Limit capacitance and series resistance on each SIM signal to match the requirements for the SIM interface
(27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 s is the maximum allowed rise time on the SIM_IO and SIM_RST lines): always route the connections to keep them as short as possible 1.8.1 SIM functionality The following SIM services are supported:
Abbreviated Dialing Numbers (ADN) Fixed Dialing Numbers (FDN) Last Dialed Numbers (LDN) Service Dialing Numbers (SDN) SIM Toolkit R96 is supported. 1.9 Serial Communication 1.9.1 Asynchronous serial interface (UART) The UART interface is a 9-wire unbalanced asynchronous serial interface that provides an AT commands interface, GPRS data and CSD data, software upgrades. The UART interface provides RS-232 functionality conforming with ITU-T V.24 Recommendation [4], with CMOS compatible signal levels: 0 V for low data bit or ON state, and 2.85 V for high data bit or OFF state. An external voltage translator (Maxim MAX3237) is required to provide RS-232 compatible signal levels. For the detailed electrical characteristics refer to the LEON-G100/G200 Data Sheet [1]. LEON-G100/G200 modules are designed to operate as a GSM/GPRS modem, which represents the data circuit-terminating equipment (DCE) as described by the ITU-T V.24 Recommendation [4]. A customer application processor connected to the module through the UART interface represents the data terminal equipment (DTE). The signal names of the LEON-G100/G200 UART interface conform to ITU-T V.24 Recommendation [4]. GSM.G1-HW-09002-F3 Preliminary System description Page 41 of 101 LEON-G100/G200 - System Integration Manual The UART interface includes the following lines:
Name DSR RI DCD DTR RTS CTS TxD RxD Description Data set ready Ring Indicator Data carrier detect Data terminal ready Ready to send Clear to send Transmitted data Received data Table 16: UART pins Remarks Module output, functionality of ITU-T V.24 Circuit 107 (Data set ready) Module output, functionality of ITU-T V.24 Circuit 125
(Calling indicator) Module output, functionality of ITU-T V.24 Circuit 109 (Data channel received line signal detector) Module input, functionality of ITU-T V.24 Circuit 108/2 (Data terminal ready) Internal active pull-up to 2.85 V enabled. Module hardware flow control input, functionality of ITU-T V.24 Circuit 105 (Request to send) Internal active pull-up to 2.85 V enabled. Module hardware flow control output, functionality of ITU-T V.24 Circuit 106 (Ready for sending) Module data input, functionality of ITU-T V.24 Circuit 103
(Transmitted data) Internal active pull-up to 2.85 V enabled. Module data output, functionality of ITU-T V.24 Circuit 104
(Received data) UART interface pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins if they are externally accessible on the application board. 1.9.1.1 UART features UART interface is controlled and operated with:
AT commands according to 3GPP TS 27.007 [5]
AT commands according to 3GPP TS 27.005 [6]
AT commands according to 3GPP TS 27.010 [7]
u-blox AT commands All flow control handshakes are supported by the UART interface and can be set by appropriate AT commands
(see u-blox 2G GSM/GPRS AT Commands Manual [2]): hardware flow control (RTS/CTS), software flow control
(XON/XOFF), or no flow control. Autobauding is supported. It can be enabled or disabled by an AT command (see u-blox 2G GSM/GPRS AT Commands Manual [2]). Autobauding is enabled by default. Hardware flow control is enabled by default. For the complete list of supported AT commands and their syntax refer to the u-blox 2G GSM/GPRS AT Commands Manual [2]. Autobauding result can be unpredictable with spurious data if idle-mode (power-saving) is entered and the hardware flow control is disabled. The following baud rates can be configured using AT commands:
2400 b/s GSM.G1-HW-09002-F3 Preliminary System description Page 42 of 101 LEON-G100/G200 - System Integration Manual 4800 b/s 9600 b/s 19200 b/s 38400 b/s 57600 b/s 115200 b/s (default value when autobauding is disabled) The following baud-rates are available with autobauding only:
1200 b/s 230400 b/s Automatic frame recognition is supported: this feature is enabled in conjunction with autobauding only, which is enabled by default. The frame format can be:
8N1 (8 data bits, No parity, 1 stop bit) 8E1 (8 data bits, even parity, 1 stop bit) 8O1 (8 data bits, odd parity, 1 stop bit) 8N2 (8 data bits, No parity, 2 stop bits) The default frame configuration with fixed baud rate is 8N1, described in the Figure 25. Figure 25: UART default frame format (8N1) description 1.9.1.2 UART signal behavior (AT commands interface case) See Table 2 for a description of operating modes and states referred to in this section. At the module switch-on, before the initialization of the UART interface (each pin is first tristated and then set to its relative reset state reported in the pin description table in LEON-G100/G200 Data Sheet [1] (see the power on sequence description in Figure 19). At the end of the boot sequence, the UART interface is initialized, the module is by default in active mode and the UART interface is enabled. The configuration and the behavior of the UART signals after the boot sequence are described below. For a complete description of data and command mode please refer to u-blox 2G GSM/GPRS AT Commands Manual [2]. RxD signal behavior The module data output line (RxD) is set by default to OFF state (high level) at UART initialization. The module holds RxD in OFF state until no data is transmitted by the module. GSM.G1-HW-09002-F3 Preliminary System description Page 43 of 101 D0D1D2D3D4D5D6D7Start of 1-BytetransferStart Bit(Always 0)Possible Start ofnext transferStop Bit(Always 1)tbit = 1/(Baudrate)Normal Transfer,8N1 LEON-G100/G200 - System Integration Manual TxD signal behavior The module data input line (TxD) is set by default to OFF state (high level) at UART initialization. The TxD line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the TxD input. CTS signal behavior The module hardware flow control output (CTS line) is set to the ON state (low level) at UART initialization. If the hardware flow control is enabled (for more details please refer to u-blox 2G GSM/GPRS AT Commands Manual [2], AT&K, AT\Q, AT+IFC AT command) the CTS line indicates when the module is in active mode and the UART interface is enabled: the module drives the CTS line to the ON state or to the OFF state when it is either able or not able to accept data from the DTE (refer to chapter 1.9.1.3 for the complete description). If the hardware flow control is not enabled, the CTS line is always held in the ON state after UART initialization. When the power saving configuration is enabled and the hardware flow-control is not implemented in the DTE/DCE connection, data sent by the DTE can be lost: the first character sent when the module is in idle-mode wont be a valid communication character (refer to chapter 1.9.1.3 for the complete description). During the MUX mode, the CTS line state is mapped to FCon / FCoff MUX command for flow control issues outside the power saving configuration while the physical CTS line is still used as a power state indicator. For more details please refer to Mux Implementation Application Note [14]. RTS signal behavior The hardware flow control input (RTS line) is set by default to the OFF state (high level) at UART initialization. The RTS line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the RTS input. If the HW flow control is enabled (for more details please refer to u-blox GSM/GPRS AT Commands Manual [2]
AT&K, AT\Q, AT+IFC command description) the RTS line is monitored by the module to detect permission from the DTE to send data to the DTE itself. If the RTS line is set to OFF state, any on-going data transmission from the module is immediately interrupted or any subsequent transmission forbidden until the RTS line changes to ON state. The DTE must be able to still accept a certain number of characters after the RTS line has been set to OFF state: the module guarantees the transmission interruption within 2 characters from RTS state change. If AT+UPSV=2 is set and HW flow control is disabled, the RTS line is monitored by the module to manage the power saving configuration:
When an OFF-to-ON transition occurs on the RTS input line, the module switches from idle-mode to active-mode after 20 ms and the module doesnt enter idle-mode until the RTS input line is held in the ON state If RTS is set to OFF state by the DTE, the module automatically enters idle-mode whenever possible as in the AT+UPSV=1 configuration (cyclic idle/active mode) For more details please refer to chapter 1.9.1.3 and u-blox 2G GSM/GPRS AT Commands Manual [2], AT+UPSV command. DSR signal behavior If AT&S0 is set, the DSR module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. GSM.G1-HW-09002-F3 Preliminary System description Page 44 of 101 LEON-G100/G200 - System Integration Manual If AT&S1 is set, the DSR module output line is set by default to OFF state (high level) at UART initialization. The DSR line is then set to the OFF state when the module is in command mode and is set to the ON state when the module is in data mode. DTR signal behavior The DTR module input line is set by default to OFF state (high level) at UART initialization. The DTR line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the DTR input. Module behavior according to DTR status depends on the AT command configuration (see u-blox 2G GSM/GPRS AT Commands Manual [2], &D AT command). DCD signal behavior If AT&C0 is set, the DCD module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. If AT&C1 is set, the DCD module output line is set by default to OFF state (high level) at UART initialization. The DCD line is then set by the module in accordance with the carrier detect status: ON if the carrier is detected, OFF otherwise. In case of voice call DCD is set to ON state when the call is established. For a data call there are the following scenarios:
GPRS data communication: Before activating the PPP protocol (data mode) a dial-up application must provide the ATD*99***<context_number># to the module: with this command the module switches from command mode to data mode and can accept PPP packets. The module sets the DCD line to the ON state, then answers with a CONNECT to confirm the ATD*99 command. Please note that the DCD ON is not related to the context activation but with the data mode CSD data call: To establish a data call the DTE can send the ATD<number> command to the module which sets an outgoing data call to a remote modem (or another data module). Data can be transparent (non reliable) or non transparent (with the reliable RLP protocol). When the remote DCE accepts the data call, the module DCD line is set to ON and the CONNECT <communication baudrate> string is returned by the module. At this stage the DTE can send characters through the serial line to the data module which sends them through the network to the remote DCE attached to a remote DTE RI signal behavior The RI module output line is set by default to the OFF state (high level) at UART initialization. Then, during an incoming call, the RI line is switched from OFF state to ON state with a 4:1 duty cycle and a 5 s period (ON for 1 s, OFF for 4 s, see Figure 26), until the DTE attached to the module sends the ATA string and the module accepts the incoming data call. The RING string sent by the module (DCE) to the serial port at constant time intervals is not correlated with the switch of the RI line to the ON state. Figure 26: RI behavior during an incoming call GSM.G1-HW-09002-F3 Preliminary System description Page 45 of 101 1stime [s]151050RI ONRI OFFCall incomes1stime [s]151050RI ONRI OFFCall incomes LEON-G100/G200 - System Integration Manual The RI line can notify an SMS arrival. When the SMS arrives, the RI line switches from OFF to ON for 1 s (see Figure 27), if the feature is enabled by the proper AT command (please refer to u-blox 2G GSM/GPRS AT Commands Manual [2], AT+CNMI command). RI OFF RI OFF RI ON RI ON 1s 1s 0 0 SMS arrives SMS Figure 27: RI behavior at SMS arrival 1.9.1.3 UART and power-saving time [s]
time [s]
The power saving configuration is controlled by the AT+UPSV command (for the complete description please refer to u-blox 2G GSM/GPRS AT Commands Manual [2], AT+UPSV command). When power saving is enabled, the module automatically enters idle-mode whenever possible, otherwise the active-mode is maintained by the module. The AT+UPSV command sets the module power saving configuration, but also configures the UART behavior in relation to the power saving configuration. The conditions for the module entering idle-mode also depend on the UART power saving configuration. The different power saving configurations that can be set by the AT+UPSV command are described in the following subchapters and are summarized in Table 17. For more details on the command description please refer to u-blox AT commands Manual [2]. AT+UPSV HW flow control RTS line Communication during idle mode and wake up 0 0 0 0 1 1 1 1 2 2 2 Enabled (AT&K3) Enabled (AT&K3) Disabled (AT&K0) Disabled (AT&K0) ON OFF ON OFF Enabled (AT&K3) ON Enabled (AT&K3) OFF Disabled (AT&K0) ON Disabled (AT&K0) OFF Enabled (AT&K3) Enabled (AT&K3) Disabled (AT&K0) ON OFF ON Data sent by the DTE will be correctly received by the module. Data sent by the module will be buffered by the module and will be correctly received by the DTE when it will be ready to receive data (i.e. RTS line will be ON). Data sent by the DTE will be correctly received by the module. Data sent by the module will be correctly received by the DTE if it is ready to receive data, otherwise data will be lost. Data sent by the DTE will be buffered by the DTE and will be correctly received by the module when active-mode is entered. Data sent by the module will be buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). When a low-to-high transition occurs on the TxD input line, the module switches from idle-mode to active-mode after 20 ms: this is the wake up time of the module. As a consequence, the first character sent when the module is in idle-mode (i.e. the wake up character) wont be a valid communication character because it cant be recognized, and the recognition of the subsequent characters is guaranteed only after the complete wake-up
(i.e. after 20 ms). Data sent by the module will be correctly received by the DTE if it is ready to receive data, otherwise data will be lost. Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. The module is forced in active-mode and it doesnt enter idle-mode until RTS line is set to OFF state. When a high-to-low (i.e. OFF-to-ON) transition occurs on the RTS input line, the module switches from idle-mode to active-mode after 20 ms: this is the wake up time of the module. GSM.G1-HW-09002-F3 Preliminary System description Page 46 of 101 LEON-G100/G200 - System Integration Manual AT+UPSV HW flow control RTS line Communication during idle mode and wake up 2 Disabled (AT&K0) OFF When a low-to-high transition occurs on the TxD input line, the module switches from idle-mode to active-mode after 20 ms: this is the wake up time of the module. As a consequence, the first character sent when the module is in idle-mode (i.e. the wake up character) wont be a valid communication character because it cant be recognized, and the recognition of the subsequent characters is guaranteed only after the complete wake-up
(i.e. after 20 ms). Table 17: UART and power-saving summary AT+UPSV=0: power saving disabled, fixed active-mode The module doesnt enter idle-mode and the CTS line is always held in the ON state after UART initialization. The UART interface is enabled and data can be received. This is the default configuration. AT+UPSV=1: power saving enabled, cyclic idle/active mode The module automatically enters idle-mode whenever possible, and periodically wakes up from idle-mode to active-mode to monitor the paging channel of the current base station (paging block reception), in accordance to GSM system requirements. Idle-mode time is fixed by network parameters and can be up to ~2.1 s. When the module is in idle-mode, a data transmitted by the DTE will be lost if hardware flow control is disabled, otherwise if hardware flow control is enabled, data will be buffered by the DTE and will be correctly received by the module when active-mode is entered. When the module wakes up to active-mode, the UART interface is enabled and data can be received. When a character is received, it forces the module to stay in the active-mode for a longer time. The active-mode duration depends by:
Network parameters, related to the time interval for the paging block reception (minimum of ~11 ms) Time period from the last data received at the serial port during the active-mode: the module doesnt enter idle-mode until a timeout expires. This timeout is configurable by the +UPSV AT command, from 40 GSM frames (~184 ms) up to 65000 GSM frames (300 s). Default value is 2000 GSM frames (~9.2 s). Every subsequent character received during the active-mode, resets and restarts the timer; hence the active-
mode duration can be extended indefinitely. The behavior of hardware flow-control output (CTS line) during normal module operations with power-saving and HW flow control enabled (cyclic idle-mode and active-mode) is illustrated in Figure 28. Data input CTS OFF CTS OFF CTS ON CTS ON max ~2.1 s max ~2.1 s UART disabled UART disabled min ~11 ms min ~11 ms UART enabled UART enabled
~9.2 s (default)
~9.2 s (default) UART enabled UART enabled time [s]
time [s]
Figure 28: CTS behavior with power saving enabled: the CTS line indicates when the module is able (CTS = ON = low level) or not able (CTS = OFF = high level) to accept data from the DTE and communicate through the UART interface GSM.G1-HW-09002-F3 Preliminary System description Page 47 of 101 LEON-G100/G200 - System Integration Manual AT+UPSV=2: power saving enabled and controlled by the RTS line The module behavior is the same as for +UPSV=1 case if the RTS line is set to OFF by the DTE. When an OFF-to-ON transition occurs on the RTS input line, the module switches from idle-mode to active-mode after 20 ms and then the module doesnt enter the idle-mode until the RTS input line is held in the ON state. This configuration can only be enabled with the module HW flow control disabled. Even if HW flow control is disabled, if the RTS line is set to OFF by the DTE, the CTS line is set by the module accordingly to its power saving configuration (like for +UPSV=1 with HW flow control enabled). When the RTS line is set to OFF by the DTE, the timeout to enter idle-mode from the last data received at the serial port during the active-mode is the one previously set with the AT+UPSV=1 configuration or it is the default value. Wake up from idle-mode to active-mode via data reception If a data is transmitted by the DTE during the module idle-mode, it will be lost (not correctly received by the module) in the following cases:
+UPSV=1 with hardware flow control disabled
+UPSV=2 with hardware flow control disabled and RTS line set to OFF When the module is in idle-mode, the TxD input line of the module is always configured to wake up the module from idle-mode to active-mode via data reception: when a low-to-high transition occurs on the TxD input line, it causes the wake-up of the system. The module switches from idle-mode to active-mode after 20 ms from the first data reception: this is the wake up time of the module. As a consequence, the first character sent when the module is in idle-mode (i.e. the wake up character) wont be a valid communication character because it cant be recognized, and the recognition of the subsequent characters is guaranteed only after the complete wake-up (i.e. after 20 ms). Figure 29 and Figure 30 show an example of common scenarios and timing constraints:
HW flow control set in the DCE, and no HW flow control set in the DTE, needed to see the CTS line changing on DCE Power saving configuration is active and the timeout from last data received to idle-mode start is set to 2000 frames (AT+UPSV=1,2000) Figure 29 shows the case where DCE is in idle mode and a wake-up is forced. In this scenario the only character sent by the DTE is the wake-up character; as a consequence, the DCE will return to idle-mode when the timeout from last data received expires. (2000 frames without data reception). Figure 29: Wake-up via data reception without further communication GSM.G1-HW-09002-F3 Preliminary System description Page 48 of 101 CTS OFFCTSONActive mode is held for 2000 GSM frames (~9.2 s)time Wake up time: up to 15.6 mstime TxD module inputWake up character Not recognized by DCE LEON-G100/G200 - System Integration Manual Figure 30 shows the case where in addition to the wake-up character further (valid) characters are sent. The wake up character wakes-up the DCE. The other characters must be sent after the wake up time of 20 ms. If this condition is met, the characters are recognized by the DCE. The DCE is allowed to re-enter idle-mode after 2000 GSM frames from the latest data reception. Figure 30: Wake-up via data reception with further communication The wake-up via data reception feature cant be disabled. The wake-up via data reception feature can be used in both +UPSV=1 and +UPSV=2 case (when RTS line is set to OFF). In command mode, if autobauding is enabled and HW flow control is not implemented by the DTE, the DTE must always send a character to the module before the AT prefix set at the beginning of each command line: the first character will be ignored if the module is in active-mode, or it will represent the wake up character if the module is in idle-mode. In command mode, if autobauding is disabled, the DTE must always send a dummy AT to the module before each command line: the first character will not be ignored if the module is in active-mode (i.e. the module will reply OK), or it will represent the wake up character if the module is in idle-mode (i.e. the module wont reply). No wake-up character or dummy AT is required from the DTE during connected-mode since the module continues to be in active-mode and doesnt need to be woken-up. Furthermore in data mode a wake-up character or a dummy AT would affect the data communication. GSM.G1-HW-09002-F3 Preliminary System description Page 49 of 101 CTS OFFCTSONActive mode is held for 2000 GSM frames (~9.2s) after the last data receivedtime Wake up time: up to 15.6 mstime TxD module inputWake up character Not recognized by DCEValid characters Recognized by DCE LEON-G100/G200 - System Integration Manual 1.9.1.4 UART application circuits Providing the full RS-232 functionality (using the complete V.24 link) For complete RS-232 functionality conforming to ITU-T Recommendation [4] in DTE/DCE serial communication, the complete UART interface of the module (DCE) must be connected to the DTE as described in Figure 31. Figure 31: UART interface application circuit with complete V.24 link in the DTE/DCE serial communication Providing the TxD, RxD, RTS and CTS lines only (not using the complete V.24 link) If the functionality of the DSR, DCD, RI and DTR lines is not required in the application, or the lines are not available, the application circuit described in Figure 32 must be implemented:
Connect the module DTR input line to GND, since the module requires DTR active (low electrical level) Leave DSR, DCD and RI lines of the module unconnected and floating Figure 32: UART interface application circuit with partial V.24 link (5-wire) in the DTE/DCE serial communication If only TxD, RxD, RTS and CTS lines are provided as described in Figure 32 the procedure to enable the power saving depends on the HW flow-control status. If HW flow-control is enabled (AT&K3, that is the default setting) the power saving will be activated by AT+UPSV=1. Through this configuration, when the module is in idle-mode, a data transmitted by the DTE will be buffered by the DTE and will be correctly received by the module when active-mode is entered. If the HW flow-control is disabled (AT&K0), the power saving can be enabled by AT+UPSV=2. The module is in idle-mode until a high-to-low (i.e. OFF-to-ON) transition on the RTS input line will switch the module from GSM.G1-HW-09002-F3 Preliminary System description Page 50 of 101 LEON-G100/G200(DCE)TxDApplication Processor(DTE)RxDRTSCTSDTRDSRRIDCDGND15TXD12DTR16RXD13RTS14CTS9DSR10RI11DCDGNDLEON-G100/G200(DCE)TxDApplication Processor(DTE)RxDRTSCTSDTRDSRRIDCDGND15TXD12DTR16RXD13RTS14CTS9DSR10RI11DCDGND LEON-G100/G200 - System Integration Manual idle-mode to active-mode after 20 ms. The module will be forced in active-mode if the RTS input line is held in the ON state. Providing the TxD and RxD lines only (not using the complete V24 link) If the functionality of the CTS, RTS, DSR, DCD, RI and DTR lines is not required in the application, or the lines are not available, the application circuit described in Figure 33 must be implemented:
Connect the module CTS output line to the module RTS input line, since the module requires RTS active
(low electrical level) if HW flow-control is enabled (AT&K3, that is the default setting), and CTS is active (low electrical level) when the module is in active mode, the UART interface is enabled and the HW flow-control is enabled Connect the module DTR input line to GND, since the module requires DTR active (low electrical level) Leave DSR, DCD and RI lines of the module unconnected and floating Figure 33: UART interface application circuit with partial V.24 link (3-wire) in the DTE/DCE serial communication If only TxD and RxD lines are provided as described in Figure 33 and HW flow-control is disabled (AT&K0), the power saving will be enabled by AT+UPSV=1. The module enters active-mode 20 ms after a low-to-high transition on the TxD input line; the recognition of the subsequent characters is guaranteed until the module is in active-mode. A data delivered by the DTE can be lost using this configuration and the following settings:
o HW flow-control enabled in the module (AT&K3, that is the default setting) o Module power saving enabled by AT+UPSV=1 o HW flow-control disabled in the DTE In this case the first character sent when the module is in idle-mode will be a wake-up character and wont be a valid communication character (refer to chapter 1.9.1.3 for the complete description). If power saving is enabled the application circuit with the TxD and RxD lines only is not recommended. During command mode the DTE must send to the module a wake-up character or a dummy AT before each command line (refer to chapter 1.9.1.3 for the complete description), but during data mode the wake-up character or the dummy AT would affect the data communication. GSM.G1-HW-09002-F3 Preliminary System description Page 51 of 101 LEON-G100/G200(DCE)TxDApplication Processor(DTE)RxDRTSCTSDTRDSRRIDCDGND15TXD12DTR16RXD13RTS14CTS9DSR10RI11DCDGND LEON-G100/G200 - System Integration Manual Additional considerations To avoid an increase in module power consumption, any external signal connected to the UART must be set low or tri-stated when the module is in power-down mode. If the external signals in the application circuit connected to the UART cannot be set low or tri-stated, a multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244) or a single channel analog switch (e.g. Texas Instruments TS5A3159 or Texas Instruments TS5A63157) must be inserted between the two-circuit connections and set to high impedance when the module is in power-down mode. It is highly recommended to provide on an application board a direct access to RxD and TxD lines of the module (in addition to access to these lines from an application processor). This enables a direct connection of PC (or similar) to the module for execution of Firmware upgrade over the UART. Note that the module FW upgrade over UART (using the RxD and TxD pins) starts at the module switch-on or when the module is released from the reset state: it is suggested to provide access to the PWR_ON pin, or to provide access to the RESET_N pin, or to provide access to the enabling of the DC supply connected to the VCC pin, to start the module firmware upgrade over the UART. 1.9.1.5 MUX Protocol (3GPP 27.010) The module has a software layer with MUX functionality complaint with 3GPP 27.010 [7]. This is a data link protocol (layer 2 of OSI model) using HDLC-like framing and operates between the module
(DCE) and the application processor (DTE). The protocol allows simultaneous sessions over the UART. Each session consists of a stream of bytes transferring various kinds of data like SMS, CBS, GPRS, AT commands in general. This permits, for example, SMS to be transferred to the DTE when a data connection is in progress. The following channels are defined:
Channel 0: control channel Channel 1 5: AT commands /data connection Channel 6: GPS tunneling For more details please refer to GSM Mux implementation Application Note [14]. 1.9.2 DDC (I2C) interface 1.9.2.1 Overview An I2C compatible Display Data Channel (DDC) interface for serial communication is implemented. This interface is intended exclusively to access u-blox GPS receivers. Name SCL SDA Table 18: DDC pins Description I2C bus clock line I2C bus data line Remarks Fixed open drain. External pull-up required. Fixed open drain. External pull-up required. DDC (I2C) interface pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins if they are externally accessible on the application board. GSM.G1-HW-09002-F3 Preliminary System description Page 52 of 101 LEON-G100/G200 - System Integration Manual To be complaint with the I2C bus specifications, the module pads of the bus interface are open drain output and pull up resistors must be used. Since the pull-up resistors are not mounted on the module, they must be mounted externally. Resistor values must conform to the I2C bus specifications [8]. If LEON-G100/G200 modules are connected through the DDC bus to a single u-blox GPS receiver only (only one device is connected on the DDC bus), use a pull-up resistor of 4.7 k . Pull-ups must be connected to a supply voltage of 2.85 V (typical), since this is the voltage domain of the DDC pins (for detailed electrical characteristics see the LEON-G100/G200 Data Sheet [1]). DDC Slave-mode operation is not supported, the module can act as master only. Two lines, serial data (SDA) and serial clock (SCL), carry information on the bus. SCL is used to synchronize data transfers, and SDA is the data line. Since both lines are open drain outputs, the DDC devices can only drive them low or leave them open. The pull-up resistor pulls the line up to the supply rail if no DDC device is pulling it down to GND. If the pull-ups are missing, SCL and SDA lines are undefined and the DDC bus will not work. The signal shape is defined by the values of the pull-up resistors and the bus capacitance. Long wires on the bus will increase the capacitance. If the bus capacitance is increased, use pull-up resistors with nominal resistance value lower than 4.7 k , to match the I2C bus specifications [8] regarding rise and fall times of the signals. Capacitance and series resistance must be limited on the bus to match the I2C specifications [8] (1.0 s is the maximum allowed rise time on the SCL and SDA lines): route connections as short as possible. The module doesnt enter idle-mode when the DDC (I2C) interface is enabled, even if power saving is enabled by the AT+UPSV command. If the pins are not used as DDC bus interface, they can be left floating on the application board. 1.9.2.2 DDC application circuit The SDA and SCL lines can only be used to connect the LEON module to a u-blox GPS module: LEON DDC (I2C) interface is enabled by the +UGPS AT command only (for more details please refer to u-blox 2G GSM/GPRS AT Commands Manual [2]). GPIO2 is driven as output by the +UGPS AT command to switch-on or switch-off the u-blox GPS module, connecting GPIO2 to the active-high enable pin (or the active-low shutdown pin) of the voltage regulator that supplies the u-blox GPS module on the application board. The application circuit for the connection of a LEON wireless module to a u-blox 3.0 V GPS receiver is illustrated in Figure 34 and the suggested components are listed in Table 19. A pull-down resistor is mounted on the GPIO2 line to avoid a switch on of the GPS module when the LEON module is switched-off and its digital pins are tri-stated. Figure 34: Application circuit for 3V u-blox GPS receivers GSM.G1-HW-09002-F3 Preliminary System description Page 53 of 101 LEON-G100/G200R1INOUTGNDGPS LDORegulatorSHDNu-blox3V GPS ReceiverSDASCLVCCR23V03V0VMAIN3V0U121GPIO231SDA30SCLR3 Reference R1, R2, R3 U1 LEON-G100/G200 - System Integration Manual Description Part Number - Manufacturer 4.7 k Resistor 0402 5% 0.1 W RC0402JR-074K7L - Yageo Phycomp Voltage Regulator for GPS Receiver See GPS Receiver Hardware Integration Manual Table 19 - Component for DDC application circuit 1.9.2.3 DDC application circuit for LEON-G100/G200 upcoming version This section applies to the upcoming FW/HW version of LEON-G100/G200. The SDA and SCL lines can be used only to connect the LEON module to a u-blox GPS receiver: LEON DDC (I2C) interface is enabled by the +UGPS AT command only (for more details refer to u-blox 2G GSM/GPRS AT Commands Manual [2]). GPIO2 is driven as an output by the +UGPS AT command to switch on or to switch off the u-blox GPS receiver, connecting GPIO2 to the active-high enable pin (or the active-low shutdown pin) of the voltage regulator that supplies the u-blox GPS module on the application board. The pin #23 is driven as an input by the +UGPS AT command to sense when the u-blox GPS module is ready to send data. The pin #24 is driven as an output by the +UGPS AT command to provide a synchronization timing signal to the u-blox GPS module. The application circuit for the connection of a LEON wireless module to a u-blox 3.0 V GPS receiver is illustrated in Figure 35 and the suggested components are listed in Table 20. A pull-down resistor is mounted on the GPIO2 line to avoid a switch on of the GPS module when the LEON module is switched-off and its digital pins are tri-stated. Figure 35: Application circuit for u-blox 3.0 V GPS receiver Reference R1, R2, R3 U1 Description Part Number - Manufacturer 4.7 k Resistor 0402 5% 0.1 W RC0402JR-074K7L - Yageo Phycomp Voltage Regulator for GPS Receiver See GPS Receiver Hardware Integration Manual Table 20: Components for application circuit for u-blox 3.0 V GPS receiver GSM.G1-HW-09002-F3 Preliminary System description Page 54 of 101 LEON-G100/G200R1INOUTGNDGPS LDORegulatorSHDNu-blox3.0 V GPS receiverSDA2SCL2R23V03V0VMAIN3V0U121GPIO2SDASCLC1TxD1EXTINT031302324VCCR3 LEON-G100/G200 - System Integration Manual 1.10 Audio LEON-G100/G200 modules provide four analog and one digital audio interfaces:
Two microphone inputs:
First microphone input can be used for direct connection of the electret condenser microphone of a handset. This input is used when the main uplink audio path is Handset Microphone (refer to u-blox 2G GSM/GPRS AT Commands Manual [2]; AT+USPM command: <main_uplink> parameter) Second microphone input can be used for direct connection of the electret condenser microphone of a headset. This input is used when the main uplink audio path is Headset Microphone (refer to u-blox 2G GSM/GPRS AT Commands Manual [2]; AT+USPM command: <main_uplink> parameter) Two speaker outputs:
First speaker output is a single ended low power audio output that can be used to directly connect the receiver (earpiece) of a handset or a headset. This output is used when the main downlink audio path is Normal earpiece or Mono headset (refer to u-blox 2G GSM/GPRS AT Commands Manual [2];
AT+USPM command: <main_downlink> parameter). These two downlink path profiles use the same physical output but have different sets of audio parameters (Refer to u-blox 2G GSM/GPRS AT Commands Manual [2]: AT+USGC, AT+UDBF, AT+USTN commands) Second speaker output is a differential high power audio output that can be used to directly connect a speaker or a loud speaker used for ring-tones or for speech in hands-free mode. This output is used when audio downlink path is Loudspeaker (refer to u-blox 2G GSM/GPRS AT Commands Manual [2];
AT+USPM command, <main_downlink> and <alert_sound> parameters) Headset detection input:
If enabled, causes the automatic switch of uplink audio path to Headset Microphone and downlink audio path to Mono headset. Enabling/disabling the detection can be controlled by parameter
<headset_indication> in AT+USPM command (refer to u-blox 2G GSM/GPRS AT Commands Manual [2]) I2S digital audio interface:
This path is selected when parameters <main_uplink> and <main_downlink> in AT+USPM command
(refer to u-blox 2G GSM/GPRS AT Commands Manual [2]) are respectively I2S input line and I2S output line Not all combinations of Input-Output audio paths are allowed. Please check audio command AT+USPM in u-blox 2G GSM/GPRS AT Commands Manual [2] for allowed combinations of audio path and for their switching during different use cases (speech/alert tones). The default values for audio parameters tuning commands (Refer to u-blox 2G GSM/GPRS AT Commands Manual [2]; AT+UMGC, AT+UUBF, AT+UHFP, AT+USGC, AT+UDBF, AT+USTN commands) are tuned for audio device connected as suggested above (i.e. Handset microphone connected on first microphone input, headset microphone on second microphone input). For a different connection, (i.e. connection of a Hands Free microphone) these parameters should be changed on the audio path corresponding to the connection chosen. 1.10.1 Analog Audio interface 1.10.1.1 Uplink path (microphone inputs) The TX (uplink) path of the analog audio front-end on the module consists of two identical microphone circuits. Two electret condenser microphones can be directly connected to the two available microphone inputs. The main required electrical specifications for the electret condenser microphone are 2.2 k as maximum output impedance at 1 kHz and 2 V maximum standard operating voltage. Board-to-board pins related to the uplink path (microphones inputs) are:
GSM.G1-HW-09002-F3 Preliminary System description Page 55 of 101 LEON-G100/G200 - System Integration Manual First microphone input:
MIC_BIAS1: single ended supply to the first microphone and represents the microphone signal input MIC_GND1: local ground for the first microphone Second microphone input:
MIC_BIAS2: single ended supply to the second microphone and represents the microphone signal input MIC_GND2: local ground for the second microphone For a description of the internal function blocks see Figure 40. 1.10.1.2 Downlink path (speaker outputs) The RX (downlink) path of the analog audio front-end of the module consists of two speaker outputs available on the following pins:
First speaker output:
HS_P: low power single ended audio output. This pin is internally connected to the output of the single ended audio amplifier of the chipset Second speaker output:
SPK_N/SPK_P: high power differential audio output. These two pins are internally connected to the output of the high power differential audio amplifier of the chipset See Figure 40 for a description of the internal function blocks. Warning: excessive sound pressure from headphones can cause hearing loss. Detailed electrical characteristics of the low power single-ended audio receive path and the high power differential audio receive path can be found in LEON-G100/G200 Data Sheet [1]. Table 21 lists the signals related to analog audio functions. Name HS_DET HS_P SPK_P SPK_N Description Remarks Headset detection input Internal active pull-up to 2.85 V enabled. First speaker output with low power single-ended analog audio This audio output is used when audio downlink path is Normal earpiece or Mono headset Second speaker output with high power differential analog audio This audio output is used when audio downlink path is Loudspeaker. Second speaker output with power differential analog audio output This audio output is used when audio downlink path is Loudspeaker. MIC_BIAS2 Second microphone analog signal input and bias output MIC_GND2 Second microphone analog reference MIC_GND1 First microphone analog reference MIC_BIAS1 First microphone analog signal input and bias output This audio input is used when audio uplink path is set as Headset Microphone. Single ended supply output and signal input for the second microphone. Local ground of second microphone. Used for Headset microphone path. Local ground of the first microphone. Used for Handset microphone path This audio input is used when audio uplink path is set as Handset Microphone. Single ended supply output and signal input for first microphone. Table 21: Analog Audio Signal Pins All audio lines on an Application Board must be routed in pairs, be embedded in GND (have the ground lines as close as possible to the audio lines), and maintain distance from noisy lines such as VCC and from components such as switching regulators. GSM.G1-HW-09002-F3 Preliminary System description Page 56 of 101 LEON-G100/G200 - System Integration Manual Audio pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins if they are externally accessible on the application board. If the audio pins are not used, they can be left floating on the application board. 1.10.1.3 Handset mode Handset mode is the default audio operating mode of LEON-G100/G200 modules. In this mode the main uplink audio path is Handset microphone, the main downlink audio path is Normal earpiece (refer to u-blox 2G GSM/GPRS AT Commands Manual [2]; AT+USPM command: <main_uplink>, <main_downlink> parameters). Handset microphone must be connected to inputs MIC_BIAS1/MIC_GND1 Handset receiver must be connected to output HS_P Figure 36 shows an example of an application circuit connecting a handset (with a 2.2 k electret microphone and a 32 receiver) to the LEON-G100/G200 modules. The following actions should be done on the application circuit:
Mount a series capacitor on the HS_P line to decouple the bias Mount a 10 F ceramic capacitor (e.g. Murata GRM188R60J106M) if connecting a 32 receiver, or a load with greater impedance (such as a single ended analog input of a codec). Otherwise if a 16 receiver is connected to the line, a ceramic capacitor with greater nominal capacitance must be used: a 22 F series capacitor (e.g. Murata GRM21BR60J226M) is required Mount a 82 nH series inductor (e.g. Murata LQG15HS82NJ02) on each microphone line and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and TDMA noise Figure 36: Handset connector application circuit Reference C1, C2, C3 C4 L1, L2 J1 D1 Description Part Number - Manufacturer 27 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H270JZ01 - Murata 10 F Capacitor Ceramic X5R 0603 20% 6.3V GRM188R60J106M - Murata 82 nH Multilayer inductor 0402
(self resonance frequency ~1 GHz) LQG15HS82NJ02 - Murata Audio Handset Jack Connector, 4Ckt (4P4C) 52018-4416 - Molex Varistor Array for ESD protection CA05P4S14THSG - EPCOS Table 22: Example of components for handset connection 1.10.1.4 Headset mode The audio path is automatically switched from handset mode to headset mode when a rising edge is detected by the module on HS_DET pin. The audio path returns to the handset mode when the line returns to low level. GSM.G1-HW-09002-F3 Preliminary System description Page 57 of 101 LEON-G100/G200C1AUDIO HANDSET CONNECTORC2C3J14321L1L237HS_P43MIC_GND144MIC_BIAS1C4D1 LEON-G100/G200 - System Integration Manual In headset mode the main uplink audio path is Headset microphone, the main downlink audio path is Mono headset (refer to u-blox 2G GSM/GPRS AT Commands Manual [2]; AT+USPM command: <main_uplink>,
<main_downlink> parameters). The audio path used in headset mode:
Headset microphone must be connected to MIC_BIAS2/MIC_GND2 Headset receiver must be connected to HS_P Figure 37 shows an application circuit connecting a headset (with a 2.2 k electret microphone and a 32 receiver) to the LEON-G100/G200 modules. Pin 1 & 2 are shorted in the headset connector, causing HS_DET to be pulled low. When the headset plug is inserted HS_DET is pulled internally by the module, causing a rising edge for detection. Perform the following steps on the application board (as shown in Figure 37; the list of components to be mounted is shown in Table 23):
Mount a series capacitor on the HS_P line to decouple the bias. 10 F ceramic capacitor (e.g. Murata GRM188R60J106M) is required if a 32 receiver or a load with greater impedance (as a single ended analog input of a codec) is connected to the line. 22 F series capacitor (e.g. Murata GRM21BR60J226M) is required if a 16 receiver is connected to the line Mount a 82 nH series inductor (e.g. Murata LQG15HS82NJ02) on each microphone line, and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and the TDMA noise Figure 37: Headset mode application circuit Reference C1, C2, C3 C4 L1, L2 J1 D1 Description Part Number - Manufacturer 27 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H270JZ01 - Murata 10 F Capacitor Ceramic X5R 0603 20% 6.3V GRM188R60J106M - Murata 82nH Multilayer inductor 0402
(self resonance frequency ~1 GHz) LQG15HS82NJ02 - Murata Audio Headset 2.5 mm Jack Connector SJ1-42535TS-SMT - CUI, Inc. Varistor Array for ESD protection CA05P4S14THSG - EPCOS Table 23: Example of components for headset jack connection 1.10.1.5 Hands-free mode Hands-free mode can be implemented using a loudspeaker and a dedicated microphone. GSM.G1-HW-09002-F3 Preliminary System description Page 58 of 101 LEON-G100/G200C4AUDIO HEADSET CONNECTORC1C2C3J1253461L1L218HS_DET37HS_P42MIC_GND241MIC_BIAS2D1 LEON-G100/G200 - System Integration Manual Hands-free functionality is implemented using appropriate DSP algorithms for voice-band handling (echo canceller and automatic gain control), managed via software (Refer to u-blox 2G GSM/GPRS AT Commands Manual [2]; AT+UHFP command). In this mode the main downlink audio path must be Loudspeaker, the main uplink audio path can be Handset microphone or Headset microphone (refer to u-blox 2G GSM/GPRS AT Commands Manual [2];
AT+USPM command: <main_uplink>, <main_downlink> parameters). Use of an uplink audio path for hands-free makes it unavailable for another device (handset/headset). Therefore:
Microphone can be connected to the input pins MIC_BIAS1/MIC_GND1 or MIC_BIAS2/MIC_GND2 High power loudspeaker must be connected to the output pins SPK_P/SPK_N The default parameters for audio uplink profiles Handset microphone and Headset microphone
(refer to u-blox 2G GSM/GPRS AT Commands Manual [2]; AT+UMGC, AT+UUBF, AT+UHFP) are for a handset and a headset microphone. To implement hands-free mode, these parameters should be changed on the audio path corresponding to the connection chosen. Procedure to tune parameters for hands-free mode (gains, echo canceller) can be found in LEON Audio Application Note [12]. When hands-free mode is enabled, the audio output signal on HS_P is disabled. The physical width of the high-power audio outputs lines on the application board must be wide enough to minimize series resistance. Figure 38 shows an application circuit for hands-free mode. In this example the LEON-G100/G200 modules are connected to an 8 speaker and a 2.2 k electret microphone. Insert an 82 nH series inductor (e.g. Murata LQG15HS82NJ02) on each microphone line, and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and the TDMA noise. Figure 38: Hands free mode application circuit Reference Description Part Number - Manufacturer C1, C2, C3, C4 27 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H270JZ01 - Murata L1, L2 SPK MIC 82nH Multilayer inductor 0402
(self resonance frequency ~1 GHz) Loudspeaker Active Elected Microphone LQG15HS82NJ02 - Murata Table 24: Example of components for hands-free connection GSM.G1-HW-09002-F3 Preliminary System description Page 59 of 101 LEON-G100/G200SPKC1C2L2L1MICC3C439SPK_N38SPK_P43MIC_GND144MIC_BIAS1 LEON-G100/G200 - System Integration Manual 1.10.1.6 Connection to an external analog audio device When the LEON-G100/G200 module analog audio output has to be connected to an external audio device, HS_P analog audio output can be used. A 10 F series capacitor (e.g. Murata GRM188R60J106M) must be inserted between the HS_P output and the single ended analog input of the external audio device (to decouple the bias) An additional single ended to differential circuit is required for audio devices with a differential analog input. The signal levels can be adapted by setting gain using AT commands, but additional circuitry must be inserted if the HS_P output level of the module is too high for the input of the audio device If LEON-G100/G200 module analog audio input has to be connected to an external audio device, MIC_BIAS1/
MIC_GND1 can be used (default analog audio input of the module). Insert a 10 F series capacitor (e.g. Murata GRM188R60J106M) between the single ended analog output of the external audio device and MIC_BIAS1 Connect the reference of the single ended analog output of the external audio device to MIC_GND1. If the external audio device is provided with a differential analog output, insert an additional differential to single ended circuit. The signal levels can be adapted by setting gain using AT commands, but additional circuitry must be inserted if the output level of the audio device is too high for MIC_BIAS1 Examples of connecting LEON-G100/G200 modules to external audio applications are illustrated in the Figure 39 and Table 25. To enable the audio path corresponding to these input/output, please refer to u-blox 2G GSM/GPRS AT Commands Manual [2], AT+USPM command. To tune audio levels for the external device please refer to u-blox 2G GSM/GPRS AT Commands Manual [2], AT+USGC, AT+UMGC commands. Figure 39: Application circuits to connect the LEON module to external audio devices with proper single-ended or differential analog audio inputs/outputs GSM.G1-HW-09002-F3 Preliminary System description Page 60 of 101 LEON-G100/G200C137HS_P43MIC_GND144MIC_BIAS1Single-ended Analog InputSingle-ended Analog OutputC2Audio DeviceReferenceGNDReferenceLEON-G100/G20037HS_P43MIC_GND144MIC_BIAS1Positive Analog InputPositive Analog OutputC3Audio DeviceReferenceGNDReferenceNegative Analog OutputDifferential to Single-endedNegative Analog InputSingle-ended to DifferentialC4 LEON-G100/G200 - System Integration Manual Reference Description Part Number - Manufacturer C1, C2, C3, C4 10 F Capacitor X5R 0603 5% 6.3 V GRM188R60J106M - Murata Table 25: Example of components for the connection to an Audio Device 1.10.2 Digital Audio interface LEON-G100/G200 support a bidirectional 4-wire I2S digital audio interface. The module acts as master only. The I2S pins are listed in Table 26:
Name I2S_WA I2S_TXD I2S_CLK I2S_RXD Description I2S word alignment I2S transmit data I2S clock I2S receive data Table 26: I2S interface pins Remarks Module output (master).1 Module output 1 Module output (master) 1 Module input 1 Internal active pull-up to 2.85 V enabled. I2S interface pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins if they are externally accessible on the application board. The I2S interface can be can be used in two modes:
PCM mode: I2Sx Normal I2S mode: I2Sy Beyond the supported transmission modality, the main difference between the PCM mode and the normal I 2S mode is represented by the logical connection to the digital audio processing system integrated in the chipset firmware (see Figure 40):
PCM mode provides complete audio processing functionality Normal I2S mode: digital filters, digital gains, side tone, some audio resources as tone generator, info tones
(e.g. free tone, connection tone, low battery alarm), and ringer are not available The I2S interface is activated and configured using AT commands, see the u-blox 2G GSM/GPRS AT Commands Manual [2] (AT+UI2S command). If the I2S interface is used in PCM mode, digital path parameters can be configured and saved as the normal analog paths, using appropriate path index as described in the u-blox 2G GSM/GPRS AT Commands Manual [2]. Analog gain parameters of microphone and speakers are unused when digital path is selected. Any external signal connected to the digital audio interface must be tri-stated when the module is in power-down mode and must be tri-stated during the module power-on sequence (at least for 1500 ms after the start-up event). If the external signals connected to the digital audio interface cannot be tri-stated, insert a multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance when the module is in power down mode and during the module power-on sequence. If the I2S pins are not used, they can be left floating on the application board. 1 Check device specifications to ensure compatibility of supported modes to LEON-G100/G200 module. Add a test point to provide access to the pin for debugging. GSM.G1-HW-09002-F3 Preliminary System description Page 61 of 101 LEON-G100/G200 - System Integration Manual For debug purposes, include a test point at each I2S pin also if the digital audio interface is not used. Refer to u-blox 2G GSM/GPRS AT Commands Manual [2], AT+UI2S command for possible combinations of connection and settings. 1.10.2.1 PCM mode In PCM mode I2S_TX and I2S_RX are respectively parallel to the analog front end I2S_RX and I2S_TX as internal connections to the voice processing system (see Figure 40), so resources available for analog path can be shared:
Digital filters and digital gains are available in both uplink and downlink direction. They can be configured using AT commands; please refer to the u-blox 2G GSM/GPRS AT Commands Manual [2]
Ringer tone and service tone are mixed on the TX path when active (downlink) The HF algorithm acts on I2S path Main features of the I2S interface in PCM mode:
I2S runs in PCM - short alignment mode (configurable with AT commands) Module functions as I2S master (I2S_CLK and I2S_WA signals generated by the module) I2S_WA signal always runs at 8 kHz I2S_WA toggles high for 1 or 2 CLK cycles of synchronism (configurable), then toggles low for 16 CLK cycles of sample width. Frame length can be 1 + 16 = 17 bits or 2 + 16 = 18 bits I2S_CLK frequency depends on frame length. Can be 17 x 8 kHz = 136 kHz or 18 x 8 kHz = 144 kHz I2S_TX, I2S_RX data are 16 bit words with 8 kHz sampling rate, mono. Data are in 2s complement notation. MSB is transmitted first When I2S_WA toggles high, first synchronization bit is always low. Second synchronism bit (present only in case of 2 bit long I2S_WA configuration) is MSB of the transmitted word (MSB is transmitted twice in this case) I2S_TX changes on I2S_CLK rising edge, I2S_RX changes on I2S_CLK falling edge 1.10.2.2 Normal I2S mode Normal I2S mode supports:
16 bits word Mono interface 8 kHz frequency Main features of I2S interface in Normal I2S mode:
I2S_WA signal always runs at 8 kHz and the channel can be either high or low I2S_TX data 16 bit words with 32 bit frame and 2, dual mono (the word can be written on 2 channels). Data are in 2s complement notation. MSB is transmitted first. The MSB is first transmitted; the bits change on I2S_CLK rising or falling edge (configurable) I2S_RX data are read on the I2S_CLK edge opposite to I2S_TX writing edge I2S_CLK frequency depends by the number of bits and number of channels so is 16 x 2 x 8 kHz = 256 kHz The modes are configurable through a specific AT command (refer to u-blox 2G GSM/GPRS AT Commands Manual [2]) and the following parameters can be set:
I2S_TX word can be written while I2S_WA is high, low or both MSB can be 1 bit delayed or non-delayed on I2S_WA edge I2S_TX data can change on rising or falling edge of I2S_CLK signal I2S_RX data read on the opposite front of I2S_CLK signal GSM.G1-HW-09002-F3 Preliminary System description Page 62 of 101 LEON-G100/G200 - System Integration Manual 1.10.3 Voice-band processing system The digital voice-band processing on the LEON-G100/G200 is implemented in the DSP core inside the baseband chipset. The analog audio front-end of the chipset is connected to the digital system through 16 bit ADC converters in the uplink path, and through 16 bit DAC converters in the downlink path. The digitized TX and RX voice-band signals are both processed by digital gain stages and decimation filter in TX, interpolation filters in RX path. The processed digital signals of TX and RX are connected to the DSP for various tasks (i.e. speech codec, digital mixing and sidetone, audio filtering) implemented in the firmware modules. External digital audio devices can be interfaced to the DSP voice-band processing system via the I2S interface. The voice-band processing system can be split up into three different blocks:
Sample-based Voice-band Processing (single sample processed at 8 kHz, every 125 s) Frame-based Voice-band Processing (frames of 160 samples are processed every 20 ms) MIDI synthesizer running at 47.6 kHz These three blocks are connected by buffers and sample rate converters (for 8 to 47.6 kHz conversion) Figure 40: LEON-G100/G200 voice-band processing system block diagram The sample-based voice-band processing main task is to transfer the voice-band samples from either analog audio front-end TX path or I2Sx RX path to the Voice-band Sample Buffer and from the Voice-band Sample Buffer to the analog audio front-end RX path and/or I2Sx TX path. While doing this the samples are scaled by digital gains and processed by digital filters both in the uplink and downlink direction. The sidetone is generated mixing scaled uplink samples to the downlink samples. The frame-
based voice-band processing implements the Hands Free algorithm. This consists of the Echo Canceller, the Automatic Gain Control and the Noise Suppressor. Hands Free algorithm acts on the uplink signal only. The frame-based voice-band processing also implements an AMR player (according to RFC3267 standard). AMR player supported data rates are: 12.2 10.2 7.95 7.40 6.70 5.90 5.15 4.75 kbps. The speech uplink path final block before radio transmission is the speech encoder. Symmetrically, on downlink path, the starting block is the speech decoder which extracts speech signal from the radio receiver. The circular buffer is a 3000 word buffer to store and mix the voice-band samples from Midi synthesizer. The buffer has a circular structure, so that when the write pointer reaches the end of the buffer, it is wrapped to the begin address of the buffer. GSM.G1-HW-09002-F3 Preliminary System description Page 63 of 101 MultiplexerSwitchDACSwitchADCI2S_RXDI2Sy RXSwitchMIC 1MIC 2Uplink Analog GainUplink filter 2Uplink filter 1Hands-freeTo Radio TXScal_MicDigital GainSidetoneDownlink filter 1Downlink filter 2MIDI playerSPK_P/NHS_PHS Analog_gainSwitchSwitchI2Sx TXI2S_TXDScal_Rec Digital GainMix_AFE Digital GainSPK Analog_gainGain_out Digital GainTone GeneratorSwitchI2Sy TXFrom Radio RXSpeech levelI2Sx RXSample Based ProcessingFrame Based ProcessingAMR PlayerCircular bufferVoiceband Sample Buffer LEON-G100/G200 - System Integration Manual Two different sample-based sample rate converters are used: an interpolator, required to convert the sample-
based voice-band processing sampling rate of 8 kHz to the analog audio front-end output rate of 47.6 kHz; a decimator, required to convert the circular buffer sampling rate of 47.6 kHz to the I2Sx TX or the uplink path sample rate of 8 kHz. 1.10.3.1 Audio codecs The following speech codecs are supported by firmware on the DSP:
GSM Half Rate (TCH/HS) GSM Full Rate (TCH/FS) GSM Enhanced Full Rate (TCH/EFR) 3GPP Adaptive Multi Rate (AMR) (TCH/AFS+TCH/AHS) 1.10.3.2 Echo cancelation and noise reduction LEON-G100/G200 support algorithms for echo cancellation, noise suppression and automatic gain control. Algorithms are configurable with AT commands (refer to the u-blox 2G GSM/GPRS AT Commands Manual [2]). 1.10.3.3 Digital filters and gains Audio parameters such as digital filters, digital gain, Side-tone gain (feedback from uplink to downlink path) and analog gain are available for uplink and downlink audio paths. These parameters can be modified by dedicated AT commands and be saved in 2 customer profiles in the non-volatile memory of the module (refer to the u-blox 2G GSM/GPRS AT Commands Manual [2]). 1.10.3.4 Ringer mode LEON-G100/G200 modules support polyphonic ring tones. The ringer tones are generated by a built-in generator on the chipset and then amplified by the internal amplifier. The synthesizer output is only mono and cannot be mixed with TCH voice path (the two are mutually exclusive). To perform in-band alerting during TCH with voice path open, only Tone Generator can be used. The analog audio path used in ringer mode can be the high power differential audio output (refer to u-blox 2G GSM/GPRS AT Commands Manual [2]; AT+USPM command, <main_downlink> and <alert_sound> parameters for alert sounds routing). In this case the external high power loudspeaker must be connected to the SPK_P/SPK_N output pins of the module as shown in the application circuit (Figure 38) described in section 1.10.1.5. 1.11 ADC input (LEON-G100 only) One Analog to Digital Converter input is available (ADC1) and is configurable using u-blox AT command (see u-blox 2G GSM/GPRS AT Commands Manual [2]). The resolution of this converter is 12-bit with a single ended input range. Name ADC1 Table 27: ADC pin Description ADC input Remarks Resolution: 12 bits. ADC1 pin ESD rating is 1 kV (contact discharge). A higher protection level could be required if the line is externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin if it is externally accessible on the application board. If the ADC1 pin is not used, it can be left floating on the application board. GSM.G1-HW-09002-F3 Preliminary System description Page 64 of 101 LEON-G100/G200 - System Integration Manual The electrical behavior of the measurement circuit in voltage mode can be modeled by a circuit equivalent to that shown in Figure 41. This includes a resistor (Req), voltage source (Ueq), analog preamplifier (with typical gain G=0.5), and a digital amplifier (with typical gain gADC=2048 LSB/V). Figure 41: Equivalent network for ADC single-ended measurement The ADC software driver takes care of the parameters shown in Figure 41 (Req, Ueq, G, gADC): the voltage measured by ADC1 is Uadc and its value expressed in mV is given by the AT+UADC=0 response (for more details on the AT command please refer to u-blox 2G GSM/GPRS AT Commands Manual [2]). The detailed electrical specifications of the Analog to Digital Converter input (Input voltage span, Input resistance in measurement mode Req, Internal voltage Ueq): are reported in the LEON-G100/G200 Data Sheet [1]. As described in the ADC equivalent network shown in Figure 41, one part of the whole ADC circuit is outside the module: the (Usig) and the (Rsig) are characteristics of the application board because they represent the Thvenin's equivalent of the electrical network developed on the application board. If an external voltage divider is implemented to increase the voltage range, check the input resistance in measurement mode (Req) of ADC1 input and all the electrical characteristics. If the Thvenin's equivalent of the voltage source (Usig) has a significant internal resistance (Rsig) compared to the input resistance in measurement mode (Req) of the ADC, this should be taken into account and corrected to properly associate the AT+UADC=0 response to the voltage source value, implementing the ADC calibration procedure suggested in the section 1.11.1 below. If the customer implements the calibration procedure on the developed application board, the influence of the internal series resistance (Rsig) of the voltage source (Usig) is taken into account in the measurement: the AT+UADC=0 response can be correctly associated to the value of the voltage source applied on the application board. 1.11.1 ADC Calibration To improve the absolute accuracy of the 12-bit analog-to-digital converter (ADC), it is suggested to follow the calibration procedure here described. The calibration aim is to evaluate the relationship between the value, expressed in mV, of the voltage source
(V_S, which Thvenin's equivalent is represented by Usig and Rsig shown in Figure 41) that has to be measured and the AT+UADC=0 response (ADC_VALUE, that is the Uadc value expressed in mV) when V_S is applied, calculating the calibration GAIN and OFFSET parameters value. GSM.G1-HW-09002-F3 Preliminary System description Page 65 of 101 LEON-G100ADC1UeqReqUsigRsigUadcG5gADC LEON-G100/G200 - System Integration Manual Calibration is performed providing two known reference values (V_1 and V_2) instead of the voltage source
(V_S) that has to be measured by the ADC. V_1 and V_2 values should be as different as possible: taking into account of the ADC applicable range, the maximum limit and the minimum limit for the voltage source has to be applied to obtain the best accuracy in calibration. The following values are involved in the calibration procedure:
V_1: the first (e.g. maximum) reference known voltage in mV applied in the calibration procedure V_2: the second (e.g. minimum) applied reference known voltage in mV applied in the calibration procedure ADC_1: the AT+UADC=0 response when V_1 is applied ADC_2: the AT+UADC=0 response when V_2 is applied This is the procedure to calibrate the ADC:
1. Apply V_1 2. Read ADC_1 3. Apply V_2 4. Read ADC_2 5. Evaluate GAIN value with the following formula:
6. Evaluate OFFSET value with the following formula:
Now the voltage source (V_S) value expressed in mV can be exactly evaluated from the AT+UADC=0 response
(ADC_VALUE) when V_S is applied, with the following formula:
where the parameters are defined as following:
V_S is the voltage source value expressed in mV ADC_VALUE is the AT+UADC=0 response when V_S is applied GAIN is calculated in the calibration procedure (see point 5) OFFSET is calculated in the calibration procedure (see point 6) 1.12 General Purpose Input/Output (GPIO) LEON-G100/G200 modules provide two General Purpose Input/Output pins (GPIO1, GPIO2) which can be configured via u-blox AT commands (more details available in u-blox 2G GSM/GPRS AT Commands Manual [2], AT+UGPIOC, AT+UGPIOR, AT+UGPIOW). GSM.G1-HW-09002-F3 Preliminary System description Page 66 of 101
)2_ADC1_ADC()2_V1_V(*16384=GAIN--GAIN8192+)2_V1_V()ADC_2 * V_1 ADC_1 * V_2(=OFFSET--163848192 - GAIN * )+_A(=_OFFSETVALUEDCSV Name GPIO1 GPIO2 Table 28: GPIO pins Description GPIO GPIO LEON-G100/G200 - System Integration Manual Remarks Add a test point to provide access to the pin for debugging. Dedicated for connection to a u-blox GPS receiver GPIO1 and GPIO2 pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins if they are externally accessible on the application board. GPIO2 is dedicated for connection to a u-blox GPS receiver: GPIO2 is driven as output by the +UGPS AT command to switch-on or switch-off the u-blox GPS receiver. If LEON-G100/G200 module is connected to a u-blox GPS receiver by the DDC (I2C) interface, GPIO2 must be connected to the active-high enable pin (or the active-low shutdown pin) of the voltage regulator that supplies the u-blox GPS receiver on the application board. If LEON-G100/G200 module is not connected to a u-blox GPS receiver by the DDC (I2C) interface, GPIO2 can be used for general purposes. To avoid an increase of module power consumption any external signal connected to a GPIO must be set low or tri-stated when the module is in power-down mode. If the external signals in the application circuit connected to a GPIO cannot be set low or tri-stated, mount a multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244) or a single channel analog switch (e.g. Texas Instruments TS5A3159 or TS5A63157) between the two-circuit connections and set to high impedance. If the GPIO1 and GPIO2 pins are not used, they can be left floating on the application board. For debug purposes, add a test point on the GPIO1 pin even if this GPIO is not used. GSM.G1-HW-09002-F3 Preliminary System description Page 67 of 101 LEON-G100/G200 - System Integration Manual 1.13 M2M Setup Schematic Example Figure 42 is an example of a schematic diagram where the LEON-G200 module is integrated into an application board, using all the interfaces of the module. Figure 42: Example of schematic diagram to integrate LEON-G200 module in an application board, using all the interfaces GSM.G1-HW-09002-F3 Preliminary System description Page 68 of 101 LEON-G100/G200 - System Integration Manual 1.14 Approvals 1.14.1 Compliance with FCC and IC Rules and Regulations LEON-G100/G200 modules are approved by the following regulatory bodies:
European Conformance CE mark: EC identification number 0682 R&TTED (Radio and Telecommunications Terminal Equipment Directive) PTCRB (PCS Type Certification Review Board) GCF (Global Certification Forum), partial compliance AT&T network compatibility CMIIT (China Ministry of Information Industry); SRRC (State Radio Regulation Center); Approval Code:
LEON-G100: CMIIT ID: 2010CJ0053 LEON-G200: CMIIT ID: 2010CJ0054 FCC (Federal Communications Commission) Identifier:
LEON-G100: XPYLEONG100 LEON-G200: XPYLEONG200 GOST-R, Hygienic, DoC Radiofrequency radiation exposure Information: this equipment complies with FCC radiation exposure limits prescribed for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. IC (Industry Canada) Certification Number:
LEON-G100: 8595A-LEONG100 LEON-G200: 8595A-LEONG200 Manufacturers of mobile or fixed devices incorporating LEON-G100 / LEON-G200 modules are authorized to use the FCC Grants and Industry Canada Certificates of the LEON-G100 / LEON-
G200 modules for their own final products according to the conditions referenced in the certificates. The FCC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating:
"Contains FCC ID: XPYLEONG100" resp. "Contains FCC ID XPYLEONG200". IMPORTANT: Manufacturers of portable applications incorporating LEON-G100 / LEON-G200 modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable device. This is mandatory to meet the SAR requirements for portable devices. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. ICASA (Independent Communications Authority of South Africa) GSM.G1-HW-09002-F3 Preliminary System description Page 69 of 101 LEON-G100/G200 - System Integration Manual ANATEL (Brazilian Agency of Telecommunications, in Portuguese, Agncia Nacional de Telecomunicaes) GSM.G1-HW-09002-F3 Preliminary System description Page 70 of 101 LEON-G100/G200 - System Integration Manual 2 Design-In 2.1 Design-in checklist This section provides a design-in checklist. 2.1.1 Schematic checklist The following are the most important points for a simple schematic check:
DC supply must provide a nominal voltage at VCC pin above the minimum normal operating range limit. DC supply must be capable to provide 2.5 A current bursts with maximum 400 mV voltage drop at VCC pin. VCC supply should be clean, with very low ripple/noise: suggested passive filtering parts can be inserted. Connect only one DC supply to VCC: different DC supply systems are mutually exclusive. V_CHARGE and CHARGE_SENSE must be externally shorted (LEON-G200 only). The DC supply used as charger must be voltage and current limited as specified (LEON-G200 only). Do no leave PWR_ON floating: add a pull-up resistor to a proper supply (i.e. V_BCKP or VCC). Check that voltage level of any connected pin does not exceed the relative operating range. Capacitance and series resistance must be limited on each SIM signal to match the SIM specifications. Insert the suggested low capacitance ESD protection and passive filtering parts on each SIM signal. Check UART signals direction, since the signal names follow the ITU-T V.24 Recommendation [4]. Add a proper pull-up resistor to a proper supply on each DDC (I2C) interface line, if the interface is used. Capacitance and series resistance must be limited on each line of the DDC interface. Insert the suggested passive filtering parts on each used analog audio line. Check the digital audio interface specifications to connect a proper device. For debug purposes, add a test point on each I2S pin and on GPIO1 also if they are not used. To avoid an increase of module current consumption in power down mode, any external signals connected to the module digital pins (UART interface, HS_DET, GPIOs) must be set low or tri-stated when the module is in power down mode. Any external signal connected to the digital audio interface must be tri-stated when the module is in power down mode and must be tri-stated during the module power-on sequence (at least for 1500 ms after the start-up event). Provide proper precautions for ESD immunity as required on the application board. All the not used pins can be left floating on the application board. Follow the recommendations of the antenna producer for correct antenna installation and deployment. Check 50 impedance of ANT line. Ensure no coupling occurs with other noisy or sensitive signals. 2.1.2 Layout checklist The following are the most important points for a simple layout check:
Consider No-routing areas for the Data Module footprint. Route VCC supply line away from sensitive analog signals. Avoid coupling of any noisy signals to microphone inputs lines. VCC line should be wide and short. Ensure proper grounding. GSM.G1-HW-09002-F3 Preliminary Design-In Page 71 of 101 LEON-G100/G200 - System Integration Manual Optimize placement for minimum length of RF line and closer path from DC source for VCC. 2.1.3 Antenna checklist Antenna should have 50 impedance, V.S.W.R less then 3:1, recommended 2:1 on operating bands in deployment geographical area. Antenna should have built in DC resistor to ground to get proper Antenna detection functionality. 2.2 Design Guidelines for Layout The following design guidelines must be met for optimal integration of LEON-G100/G200 modules on the final application board. 2.2.1 Layout guidelines per pin function This section groups the LEON-G100/G200 pins by signal function and provides a ranking of importance in layout design. Figure 43: Module pin-out with highlighted functions GSM.G1-HW-09002-F3 Preliminary Design-In Page 72 of 101 Pinout_Layout_R1.1(ppt)GNDGNDANTGNDGNDMIC_BIAS1MIC_GND1MIC_GND2MIC_BIAS2ReservedSPK_NVCCSPK_PHS_PGNDVSIMSIM_RSTSIM_IOSIM_CLKSDASCLI2S_RXDI2S_CLKI2S_TXDI2S_WAV_BCKPGNDV_CHARGECHARGE_SENSE/ADC1GNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDHS_DETPWR_ONGPIO1GPIO2RESET_NReservedReservedGNDVery ImportantCareful LayoutCommon PracticeLegend:
LEON-G100/G200 - System Integration Manual Rank Function 1st RF Antenna In/out 2nd DC Supply 3rd Analog Audio Audio Inputs Pin(s) ANT VCC MIC_BIAS1, MIC_GND1, MIC_BIAS2, MIC_GND2 Layout Remarks Very Important Very Important Design for 50 See section 2.2.1.1 characteristic impedance. VCC line should be wide and short. Route away from sensitive analog signals. See section 2.2.1.2 Careful Layout Avoid coupling with noisy signals. See section 2.2.1.3 Audio Outputs SPK_P, SPK_N, HS_P 4th Ground GND Careful Layout Provide proper grounding. See section 2.2.1.4 5th Charger 6th Sensitive Pin:
Backup Voltage A to D Converter
(If implemented) Power On 7th Digital pins:
SIM Card Interface Digital Audio DDC UART V_CHARGE, CHARGE_SENSE Careful Layout Check Charger line width. See section 2.2.1.5 Careful Layout Avoid coupling with noisy signals. See section 2.2.1.6 Common Practice Follow common practice rules for digital pin routing See section 2.2.1.7 V_BCKP ADC1 PWR_ON VSIM, SIM_CLK, SIM_IO, SIM_RST I2S_CLK, I2S_RXD, I2S_TXD, I2S_WA SCL, SDA TXD, RXD, CTS, RTS, DSR, RI, DCD, DTR External Reset RESET_N General Purpose I/O GPIO1, GPIO2 Table 29: Pin list in order of decreasing importance for layout design 2.2.1.1 RF Antenna connection The RF antenna connection pin ANT is very critical in layout design. The PCB line must be designed to provide 50 characteristic impedance and minimum loss up to radiating element. Provide proper transition between the ANT pad to application board PCB Increase GND keep-out (i.e. clearance) for ANT pin to at least 250 m up to adjacent pads metal definition and up to 500 m on the area below the Data Module, as described in Figure 44 Add GND keep-out (i.e. clearance) on buried metal layers below ANT pad and below any other pad of component present on the RF line, if top-layer to buried layer dielectric thickness is below 200 m, to reduce parasitic capacitance to ground (see Figure 44 for the description keep-out area below ANT pad) The transmission line up to antenna connector or pad may be a micro strip or a stripline. In any case must be designed to achieve 50 characteristic impedance Microstrip lines are usually easier to implement and the reduced number of layer transitions up to antenna connector simplifies the design and diminishes reflection losses. However, the electromagnetic field extends to the free air interface above the stripline and may interact with other circuitry Buried stripline exhibits better shielding to incoming and generated interferences. Therefore are preferred for sensitive application. In case a stripline is implemented, carefully check that the via pad-stack does not couple with other signals on the crossed and adjacent layers Minimize the transmission line length; the insertion loss should be minimized as much as possible, in the order of a few tenths of a dB The transmission line should not have abrupt change to thickness and spacing to GND, but must be uniform and routed as smoothly as possible GSM.G1-HW-09002-F3 Preliminary Design-In Page 73 of 101 LEON-G100/G200 - System Integration Manual The transmission line must be routed in a section of the PCB where minimal interference from noise sources can be expected Route ANT line far from other sensitive circuits as it is a source of electromagnetic interference Avoid coupling with VCC routing and analog audio lines Ensure solid metal connection of the adjacent metal layer on the PCB stack-up to main ground layer Add GND vias around transmission line Ensure no other signals are routed parallel to transmission line, or that other signals cross on adjacent metal layer If the distance between the transmission line and the adjacent GND area (on the same layer) does not exceed 5 times the track width of the micro strip, use the Coplanar Waveguide model for 50 characteristic impedance calculation Dont route microstrip line below discrete component or other mechanics placed on top layer When terminating transmission line on antenna connector (or antenna pad) it is very important to strictly follow the connector manufacturers recommended layout GND layer under RF connectors and close to buried vias should be cut out in order to remove stray capacitance and thus keep the RF line 50 . In most cases the large active pad of the integrated antenna or antenna connector needs to have a GND keep-out (i.e. clearance) at least on first inner layer to reduce parasitic capacitance to ground. Note that the layout recommendation is not always available from connector manufacturer: e.g. the classical SMA Pin-Through-Hole needs to have GND cleared on all the layers around the central pin up to annular pads of the four GND posts. Check 50 impedance of ANT line Figure 44: GND keep-out area on the top layer around the ANT pad and on the buried metal layer below the ANT pad Any RF transmission line on PCB should be designed for 50 characteristic impedance. Ensure no coupling occurs with other noisy or sensitive signals. 2.2.1.2 Main DC supply connection The DC supply of LEON-G100/G200 modules is very important for the overall performance and functionality of the integrated product. For detailed description check the design guidelines in section 1.5.2. Some main characteristics are:
GSM.G1-HW-09002-F3 Preliminary Design-In Page 74 of 101 Min. 500 mMin. 250 umTop layerBuried metal layerGND planeMicrostrip50 LEON-G100/G200 - System Integration Manual VCC connection may carry a maximum burst current in the order of 2.5 A. Therefore, it is typically implemented as a wide PCB line with short routing from DC supply (DC-DC regulator, battery pack, etc) The module automatically initiates an emergency shutdown if supply voltage drops below hardware threshold. In addition, reduced supply voltage can set a worst case operation point for RF circuitry that may behave incorrectly. It follows that each voltage drop in the DC supply track will restrict the operating margin at the main DC source output. Therefore, the PCB connection has to exhibit a minimum or zero voltage drop. Avoid any series component with Equivalent Series Resistance (ESR) greater than a few m Given the large burst current, VCC line is a source of disturbance for other signals. Therefore route VCC through a PCB area separated from sensitive analog signals. Typically it is good practice to interpose at least one layer of PCB ground between VCC track and other signal routing The VCC supply current supply flows back to main DC source through GND as ground current: provide adequate return path with suitable uninterrupted ground plane to main DC source A tank capacitor with low ESR is often used to smooth current spikes. This is most effective when placed as close as possible to VCC. From main DC source, first connect the capacitor and then VCC. If the main DC source is a switching DC-DC converter, place the large capacitor close to the DC-DC output and minimize the VCC track length. Otherwise consider using separate capacitors for DC-DC converter and LEON-G100/G200 tank capacitor. Note that the capacitor voltage rating may be adequate to withstand the charger over-voltage if battery-pack is used VCC is directly connected to the RF power amplifier. Add capacitor in the pF range from VCC to GND along the supply path Since VCC is directly connected to RF Power Amplifier, voltage ripple at high frequency may result in unwanted spurious modulation of transmitter RF signal. This is especially seen with switching DC-DC converters, in which case it is better to select the highest operating frequency for the switcher and add a large L-C filter before connecting to LEON-G100/G200 in the worst case The large current generates a magnetic field that is not well isolated by PCB ground layers and which may interact with other analog modules (e.g. VCO) even if placed on opposite side of PCB. In this case route VCC away from other sensitive functional units The typical GSM burst has a periodic nature of approx. 217 Hz, which lies in the audible audio range. Avoid coupling between VCC and audio lines (especially microphone inputs) If VCC is protected by transient voltage suppressor / reverse polarity protection diode to ensure that the voltage maximum ratings are not exceeded, place the protecting device along the path from the DC source toward LEON-G100/G200, preferably closer to the DC source (otherwise functionality may be compromised) VCC pad is longer than other pads, and requires a No-Routing area for any other signals on the top layer of the application board PCB, below the LEON-G100/G200 VCC line should be wide and short. Route away from sensitive analog signals. 2.2.1.3 Analog Audio Accurate analog audio design is very important to obtain clear and high quality audio. The GSM signal burst has a repetition rate of 271 Hz that lies in the audible range. A careful layout is required to reduce the risk of noise pickup from audio lines due to both VCC burst noise coupling and RF detection. Analog audio is separated in the two paths:
1. Audio Input (uplink path): MIC_BIASx, MIC_GNDx 2. Audio Outputs (downlink path): SPK_P / SPK_N, HS_P The most sensitive is the uplink path, since the analog input signals are in the V range. The two microphone inputs have the same electrical characteristics, and it is recommended to implement their layout with the same routing rules. GSM.G1-HW-09002-F3 Preliminary Design-In Page 75 of 101 LEON-G100/G200 - System Integration Manual Avoid coupling of any noisy signals to microphone inputs lines It is strongly recommended to route MIC signals away from battery and RF antenna lines. Try to skip fast switching digital lines as well Keep ground separation from other noisy signals. Use an intermediate GND layer or vias wall for coplanar signals MIC_BIAS and MIC_GND carry also the bias for external electret active microphone. Verify that microphone is connected with right polarity, i.e. MIC_BIAS to the pin marked + and MIC_GND (zero Volt) to the chassis of the device Despite different DC level, MIC_BIAS and MIC_GND are sensed differentially within the module. Therefore they should be routed as a differential pair of MIC_BIAS up to the active microphone Route MIC_GND with dedicated line together with MIC_BIAS up to active microphone. Note that MIC_GND is grounded internally within module and does not need external connection to GND Cross other signals lines on adjacent layers with 90 crossing Place bypass capacitor for RF very close to active microphone. The preferred microphone should be designed for GSM applications which typically have internal built-in bypass capacitor for RF very close to active device. If the integrated FET detects the RF burst, the resulting DC level will be in the pass-band of the audio circuitry and cannot be filtered by any other device If DC decoupling is required, consider that the input impedance of microphone lines is in the k range. Therefore, series capacitors with sufficiently large value to reduce the high-pass cut-off frequency of the equivalent high-pass RC filter Output audio lines have two separated configurations. SPK_P / SPK_N are high level balanced output. They are DC coupled and must be used with a speaker connected in bridge configuration Route SPK_P / SPK_N as differential pair, to reduce differential noise pick-up. The balanced configuration will help reject the common mode noise If audio output is directly connected to speaker transducer, given the low load impedance of its load, then consider enlarging PCB lines to reduce series resistive losses HS_P is single ended analog audio referenced to GND. Reduce coupling with noisy lines as this Audio output line does not benefit from common mode noise rejection of SPK_P / SPK_N Use twisted pair cable for balanced audio usage, shielded cable for unbalanced connection to speaker If DC decoupling is required, a large capacitor needs to be used, typically in the F range, depending on the load impedance, in order not to increase the lower cut-off frequency due to its High-Pass RC filter response 2.2.1.4 Module grounding Good connection of the module with application board solid ground layer is required for correct RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module. Connect each GND pin with application board solid GND layer. It is strongly recommended that each GND pad surrounding VCC and ANT pins have one or more dedicated via down to application board solid ground layer. The same applies to GND pins on the opposite side close to charger pins If the application board is a multilayer PCB, then it is required to tight together each GND area with complete via stack down to main board ground layer It is recommended to implement one layer of the application board as ground plane Good grounding of GND pads will also ensure thermal heat sink. This is critical during call connection, when the real network commands the module to transmit at maximum power: proper grounding helps prevent module overheating GSM.G1-HW-09002-F3 Preliminary Design-In Page 76 of 101 LEON-G100/G200 - System Integration Manual 2.2.1.5 Charger Layout (for LEON-G200 only) If battery charger is implemented, V_CHARGE must withstand the charge current (typically in the order of several hundred mA) continuous current sink. Voltage drop is not as critical as for VCC, but dimension the line width adequately to support the charge current without excessive loss that may lead to increase in PCB temperature. CHARGE_SENSE senses the charger voltage: it sinks a few A. Therefore its line width is not critical. Since it is an analog input, it must be connected to V_CHARGE away from noisy sources. 2.2.1.6 Other Sensitive pins A few other pins on the LEON-G100/G200 require careful layout. Backup battery (V_BCKP): avoid injecting noise on this voltage domain as it may affect the stability of sleep oscillator Analog-to-Digital Converter (ADC1): it is a high impedance analog input; the conversion accuracy will be degraded if noise injected. Low-pass filter may be used to improve noise rejection; typically L-C tuned for RF rejection gives better results Power On (PWR_ON): is the digital input for power-on of the LEON-G100/G200. It is implemented as high impedance input. Ensure that the voltage level is well defined during operation and no transient noise is coupled on this line, otherwise the module may detect a spurious power-on request 2.2.1.7 Digital pins External Reset (RESET_N): input for external reset, a logic low voltage will reset the module SIM Card Interface (VSIM, SIM_CLK, SIM_IO, SIM_RST): the SIM layout may be critical if the SIM card is placed far away from LEON-G100/G200 or in close vicinity of RF antenna. In the first case the long connection may radiate higher harmonic of digital data. In the second case the same harmonics may be picked up and create self-interference that can reduce the sensitivity of GSM Receiver channels whose carrier frequency is coincident with harmonic frequencies. In the later case using RF bypass capacitors on the digital line will mitigate the problem. In addition, since the SIM card typically accesses by the end use, it may be subjected to ESD discharges: add adequate ESD protection to improve the robustness of the digital pins within the module. Remember to add such ESD protection along the path between SIM holder toward the module Digital Audio (I2S_CLK, I2S_RX, I2S_TX, I2S_WA): the I2S interface requires the same consideration regarding electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs DDC (SCL, SDA): the DDC interface requires the same consideration regarding electro-magnetic interference as for SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs UART (TXD, RXD, CTS, RTS, DSR, RI, DCD, DTR): the serial interface require the same consideration regarding electro-magnetic interference as for SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs GSM.G1-HW-09002-F3 Preliminary Design-In Page 77 of 101 LEON-G100/G200 - System Integration Manual 2.2.2 Footprint and paste mask Figure 45 and Figure 46 describe the footprint and provide recommendations for the paste mask for LEON modules. These are recommendations only and not specifications. Note that the copper and solder masks have the same size and position. Figure 45: LEON-G100/G200 footprint Figure 46: LEON-G100/G200 paste mask To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent) extending beyond the Copper mask. The solder paste should have a total thickness of 120 m. The paste mask outline needs to be considered when defining the minimal distance to the next component. The exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the specific production processes (e.g. soldering etc.) of the customer. The bottom layer of LEON-G100/G200 shows some unprotected copper areas for GND and VCC signals, plus GND keep-out for internal RF signals routing. Consider No-routing areas for the LEON-G100/G200 footprint as follows:
1. Ground copper and signals keep-out below LEON-G100/G200 on Application Motherboard due to VCC area, RF ANT pin and exposed GND pad on module bottom layer (see Figure 47). 2. Signals Keep-Out below module on Application Motherboard due to GND opening on LEON-G100/G200 bottom layer for internal RF signals (see Figure 48). GSM.G1-HW-09002-F3 Preliminary Design-In Page 78 of 101 29.5 mm [1161.4 mil]18.9 mm [744.1 mil]0.8 mm [31.5 mil]1.1 mm [43.3 mil]1.55 mm [61.0 mil]1.0 mm [39.3 mil]0.8 mm [31.5 mil]21.3 mm [838.6 mil]18.9 mm [744.1 mil]Stencil: 120 m17.1 mm [673.2 mil]0.6 mm [23.6 mil]0.8 mm [31.5 mil]
LEON-G100/G200 - System Integration Manual Figure 47: Ground copper and signal keep-out below data module on application motherboard due to due to VCC area, RF ANT pin and exposed GND pad on data module bottom layer GSM.G1-HW-09002-F3 Preliminary Design-In Page 79 of 101 LEON-G100/G200 - System Integration Manual Figure 48: Signals keep-out below data module on application motherboard due to GND opening on data module bottom layer for internal RF signals Routing below LEON-G100/G200 on application motherboard is generally possible but not recommended: in addition to the required keep-out defined before, consider that the insulation offered by the solder mask painting may be weakened corresponding to micro-vias on LEON-G100/G200 bottom layer, thus increasing the risk of short to GND if the application motherboard has unprotected signal routing on same coordinates. 2.2.3 Placement Optimize placement for minimum length of RF line and closer path from DC source for VCC. 2.3 Module thermal resistance The Case-to-Ambient thermal resistance (RC-A) of the module, with the LEON-G100/G200 mounted on a 130 x 110 x 1.6 mm FR4 PCB with a high coverage of copper (e.g. the EVK-G25H evaluation kit) in still air conditions is equal to 14C/W. With this Case-to-Ambient thermal resistance, the increase of the module temperature is:
Around 12C when the module transmits at the maximum power level during a GSM call in the GSM/EGSM bands GSM.G1-HW-09002-F3 Preliminary Design-In Page 80 of 101 LEON-G100/G200 - System Integration Manual Around 17C when the module transmits at the maximum power level during a GPRS data transfer (2 Tx + 3 Rx slots) in the GSM/EGSM bands Case-to-Ambient thermal resistance value will be different than the one provided if the module is mounted on a PCB with different size and characteristics. 2.4 Antenna guidelines Antenna characteristics are essential for good functionality of the module. The radiating performance of antennas has direct impact on the reliability of connection over the Air Interface. Bad termination of ANT can result in poor performance of the module. The following parameters should be checked:
Item Recommendations Impedance Frequency Range Input Power V.S.W.R Return Loss Gain 50 nominal characteristic impedance Depends on the Mobile Network used. GSM900: 880..960 MHz GSM1800: 1710..1880 MHz GSM850: 824..894 MHz GSM1900: 1850..1990 MHz
>2 W peak
<2:1 recommended, <3:1 acceptable S11<-10 dB recommended, S11<-6 dB acceptable
<3 dBi Table 30: General recommendation for GSM antenna GSM antennas are typically available as:
Linear monopole: typical for fixed application. The antenna extends mostly as a linear element with a dimension comparable to lambda/4 of the lowest frequency of the operating band. Magnetic base may be available. Cable or direct RF connectors are common options. The integration normally requires the fulfillment of some minimum guidelines suggested by antenna manufacturer Patch-like antenna: better suited for integration in compact designs (e.g. mobile phone). They are mostly custom designs where the exact definition of the PCB and product mechanical design is fundamental for tuning of antenna characteristics For integration observe these recommendations:
Ensure 50 antenna termination, minimize the V.S.W.R. or return loss, as this will optimize the electrical performance of the module. See section 2.4.1 Select antenna with best radiating performance. See section 2.4.2 If a cable is used to connect the antenna radiating element to application board, select a short cable with minimum insertion loss. The higher the additional insertion loss due to low quality or long cable, the lower the connectivity Follow the recommendations of the antenna manufacturer for correct installation and deployment Do not include antenna within closed metal case Do not place antenna in close vicinity to end user since the emitted radiation in human tissue is limited by S.A.R. regulatory requirements Do not use directivity antenna since the electromagnetic field radiation intensity is limited in some countries Take care of interaction between co-located RF systems since the GSM transmitted power may interact or disturb the performance of companion systems Place antenna far from sensitive analog systems or employ countermeasures to reduce electromagnetic compatibility issues that may arise GSM.G1-HW-09002-F3 Preliminary Design-In Page 81 of 101 LEON-G100/G200 - System Integration Manual 2.4.1 Antenna termination LEON-G100/G200 modules are designed to work on a 50 load. However, real antennas have no perfect 50 load on all the supported frequency bands. To reduce as much as possible performance degradation due to antenna mismatch, the following requirements should be met:
Measure the antenna termination with a network analyzer: connect the antenna through a coaxial cable to the measurement device, the |S11| indicates which portion of the power is delivered to antenna and which portion is reflected by the antenna back to the modem output A good antenna should have a |S11| below -10 dB over the entire frequency band. Due to miniaturization, mechanical constraints and other design issues, this value will not be achieved. A value of |S 11| of about -6 dB - (in the worst case) - is acceptable Figure 49 shows an example of this measurement:
Figure 49: |S11| sample measurement of a penta-band antenna that covers in a small form factor the 4 GSM bands (850 MHz, 900 MHz, 1800 MHz and 1900 MHz) and the UMTS Band I Figure 50 shows comparable measurements performed on a wideband antenna. The termination is better, but the size of the antenna is considerably larger. Figure 50: |S11| sample measurement of a wideband antenna GSM.G1-HW-09002-F3 Preliminary Design-In Page 82 of 101 LEON-G100/G200 - System Integration Manual 2.4.2 Antenna radiation An indication of the radiated power by the antenna can be approximated by measuring the |S 2\| from a target antenna to the measurement antenna, measured with a network analyzer using a wideband antenna. Measurements should be done at a fixed distance and orientation. Compare the results to measurements performed on a known good antenna. Figure 51 through Figure 52 show measurement results. A wideband log periodic-like antenna was used, and the comparison was done with a half lambda dipole tune on 900 MHz frequency. The measurements show both the |S11| and |S21| for penta-band internal antenna and for the wideband antenna. Figure 51: |S11| and |S21| comparison of a 900 MHz tuned half wavelength dipole and a penta-band internal antenna The half lambda dipole tuned to 900 MHz is known to have good radiation performance (both for gain and directivity). By comparing the |S21| measurement with the antenna under investigation for the frequency for which the half dipole is tuned (e.g. marker 3 in Figure 51) it is possible to rate the antenna being tested. If the performance of the two antennas is similar then the target antenna is good. Figure 52: |S11| and |S21| comparison between a 900 MHz tuned half wavelength dipole and a wideband commercial antenna If |S21| values for the tuned dipole are much better than for the antenna under evaluation (e.g. as seen by markers 1 and 2 of the S21 comparison in Figure 52, where the dipole performance is 5 dB better), then it can be concluded that the radiation of the antenna under evaluation is considerably less. The same procedure should be repeated for other bands with the half wavelength dipole re-tuned to the band under investigation. GSM.G1-HW-09002-F3 Preliminary Design-In Page 83 of 101 LEON-G100/G200 - System Integration Manual For good antenna radiation performance, antenna dimensions should be comparable to a quarter of the wavelength. Different antenna types can be used for the module, many of them (e.g. patch antennas, monopole) are based on a resonating element that works in combination with a ground plane. The ground plane, ideally infinite, can be reduced down to a minimum size that must be similar to one quarter of the wavelength of the minimum frequency that has to be radiated (transmitted/received). Numerical sample: frequency = 1 GHz wavelength = 30 cm minimum ground plane (or antenna size) = 7.5 cm. Below this size, the antenna efficiency is reduced. GSM.G1-HW-09002-F3 Preliminary Design-In Page 84 of 101 LEON-G100/G200 - System Integration Manual 2.4.3 Antenna detection functionality The internal antenna detect circuit is based on ADC measurement at ANT pin: the RF port is DC coupled to the ADC unit in the baseband chip which injects a DC current (30 A) on ANT and measures the resulting DC voltage to evaluate the resistance from ANT pad to GND. The antenna detection is performed by the measurement of the resistance from ANT pad to GND (DC element of the GSM antenna), that is forced by the +UANTR AT command: refer to u-blox 2G GSM/GPRS AT Commands Manual [2] for more details on how to access to this feature. To achieve good antenna detection functionality, use an RF antenna with built-in resistor from ANT signal to GND, or implement an equivalent solution with a circuit between the antenna cable connection and the radiating element as shown in Figure 53. Figure 53: Module Antenna Detection circuit and antenna with diagnostic resistor Examples of components for the antenna detection diagnostic circuit are reported in the following table:
Description Part Number - Manufacturer DC Blocking Capacitor Murata GRM1555C1H220JA01 or equivalent RF Choke Inductor Murata LQG15HS68NJ02, LQG15HH68NJ02 or equivalent Resistor for Diagnostic 15k 5%, various Manufacturers Table 31: Example of components for the antenna detection diagnostic circuit Please note that the DC impedance at RF port for some antennas may be a DC open (e.g. linear monopole) or a DC short to reference GND (e.g. PIFA antenna). For those antennas, without the diagnostic circuit Figure 53, the measured DC resistance will be always on the extreme of measurement range (respectively open or short), and there will be no mean to distinguish from defect on antenna path with similar characteristic (respectively:
removal of linear antenna or RF cable shorted to GND for PIFA antenna). GSM.G1-HW-09002-F3 Preliminary Design-In Page 85 of 101 Antenna AssemblyDiagnostic CircuitApplication BoardLEON-G100/G200ANTADCCurrent SourceRF ChokeDC BlockingFront-End RF ModuleRF ChokeDC BlockingRadiating ElementZo=50 OhmResistor for DiagnosticCoaxial Antenna CableInternal Resistor LEON-G100/G200 - System Integration Manual Furthermore, any other DC signal injected to the RF connection from ANT connector to radiating element will alter the measurement and produce invalid results for antenna detection. It is recommended to use an antenna with a built-in diagnostic resistor in the range from 5 k to 30 k to assure good antenna detection functionality and to avoid a reduction of module RF performances. For example: consider GSM antennas with built-in DC load resistor of 15 k. Using the +UANTR AT command, the module reports the resistance value evaluated from ANT pad to GND:
Reported values close to the used diagnostic resistor nominal value (i.e. values from 10 k to 20 k if a 15 k diagnostic resistor is used) indicate that the antenna is connected Values above the maximum measurement range limit (about 53 k) indicate that the antenna is not connected Reported values below the minimum measurement range limit (about 1 k) indicate that the antenna is shorted to GND Measurement inside the valid measurement range and outside the expected range may indicate an improper connection, damaged antenna or wrong value of antenna load resistor for diagnostic GSM.G1-HW-09002-F3 Preliminary Design-In Page 86 of 101 LEON-G100/G200 - System Integration Manual 2.5 ESD Immunity Test Precautions The immunity to EMS phenomenon Electrostatic Discharge of the device (i.e. the application board where the module is mounted) must be certified complying the testing requirements standard [9] and the requirements for radio and digital cellular radio telecommunications system equipments standards [10] [11]. The ESD test is performed at the enclosure port [10] referred as the physical boundary through which EM field radiates. If the device implements an integral antenna [10] the enclosure is intended as all insulating surfaces housing the device. If the device implements a removable antenna [10] the enclosure port is limited to the antenna port [10] hence the enclosure port comprises the antenna element and its interconnecting cable surfaces. The applicability of the ESD test depends to the device classification [10], as well the test on other ports [10] or on interconnecting cables to auxiliary equipments depends to the device accessible interfaces and manufacturer requirements. Contact discharges [9] are performed at conductive surfaces whereas air discharges [9] are performed at insulating surfaces. Indirect contact discharges are performed to the measurement setup horizontal and vertical coupling planes [9]. In order to satisfy ESD immunity test requirements [9] [10] [11] performed at device enclosure complying the category level [10] shown in the following table, some precautions should be implemented as described in the following sections. Category Contact Discharge to coupling planes (indirect contact discharge) Contact Discharges to conducted surfaces (direct contact discharge) Air Discharge at insulating surfaces Immunity Level
+2 kV / -2 kV
+4 kV / -4 kV Not Applicable2*
+2 kV / -2 kV
+4 kV / -4 kV
+8 kV / -8 kV Table 32: Enclosure ESD immunity level, standards EN 61000-4-2, EN 301 489-1 V1.8.1, EN 301 489-7 V1.3.1 2.5.1 General Precautions The following module interfaces could be involved in the ESD immunity test criticalness depending on the application board handling. Some precautions are herein suggested. A series Schottky diode is integrated in LEON-G100/G200 modules as protection on the RESET_N pin. The external circuit must be able to cause a current flow through the series diode to determine the RESET_N state. Sensitive interface is the reset line (RESET_N pin):
A 47 pF bypass capacitor (e.g. Murata GRM1555C1H470JA01) have to be mounted on the line termination connected to the RESET_N pin to avoid a module reset caused by an electrostatic discharge applied to the application board 2 LEON mounted on application reference design:
Applicability -> EUT with insulating surfaces, air discharges on interconnecting cables between EUT and antenna and auxiliary equipments Not Applicability -> EUT with conductive surface, direct contact discharge GSM.G1-HW-09002-F3 Preliminary Design-In Page 87 of 101 LEON-G100/G200 - System Integration Manual A series ferrite bead (e.g. Murata BLM15HD182SN1) must be added on the line connected to the RESET_N pin to avoid a module reset caused by an electrostatic discharge applied to the application board It is recommended to keep the connection line to RESET_N as short as possible Figure 54: Application circuits to reset line for ESD immunity test Sensitive interface is the SIM interface (VSIM pin, SIM_RST pin, SIM_IO pin, SIM_CLK pin):
A 47 pF bypass capacitor (e.g. Murata GRM1555C1H470J) have to be mounted on the lines connected to VSIM, SIM_RST, SIM_IO and SIM_CLK to assure SIM interface functionality when an electrostatic discharge is applied to the application board It is suggested to use as short as possible connection lines at SIM pins 2.5.2 Antenna Interface Precautions The antenna interface ANT pin could be involved in the ESD immunity test criticalness depending on the application board handling. Antenna port precaution is herein suggested. If the device implements an embedded antenna and the device insulating enclosure avoid air discharge up to
+8 kV / -8 kV to the antenna interface, no further precautions to ESD immunity test should be needed If the device implements an external antenna and the antenna and its connecting cable are provided with completely insulating enclosure to avoid air discharge up to +8 kV / -8 kV to the whole antenna and cable surfaces, no further precautions to ESD immunity test should be needed If the device implements an external antenna and the antenna or its connecting cable are not provided with completely insulating enclosure to avoid air discharge up to +8 kV / -8 kV to the whole antenna and cable surfaces, the following precautions to ESD immunity test should be implemented on the application board GSM.G1-HW-09002-F3 Preliminary Design-In Page 88 of 101 Reset push buttonOUTINLEON-G100/G20012.6 k1.88 V22RESET_NOUTINLEON-G100/G20012.6 k1.88 V22RESET_NApplication ProcessorFerrite BeadFerrite Bead47 pF47 pFESD LEON-G100/G200 - System Integration Manual ANT port ESD rating is 4 kV (contact discharge according to IEC 61000-4-2). A higher protection level is required if the line is externally accessible on the application board. A higher protection level can be achieved with an external high pass filter, consists of a series 15 pF capacitor
(e.g. Murata GRM1555C1H150JA01) and a shunt 39 nH coil (e.g. Murata LQG15HN39NJ102) connected to the ANT port. Note that antenna detection functionality will be not provided implementing this high pass filter for ESD protection on the ANT port. Figure 55: Antenna high pass filter circuit for ESD protection and external antenna 2.5.3 Module Interfaces Precautions Any module pins that are externally accessible, should be included in the ESD immunity test since they are considered to be a port [10]. Depending on applicability, and in order to satisfy ESD immunity test requirements and ESD category level, pins connected to the port should be protected up to +4 kV / -4 kV for direct Contact Discharge, and up to +8 kV / -8 kV for Air Discharge applied to the enclosure. The maximum ESD rating of all the pins of the module, except the ANT pin, is 1 kV (HBM according MIL-Std 883D, method 3015.7, EOS/ESD Standard S5.1-1993). A higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array). GSM.G1-HW-09002-F3 Preliminary Design-In Page 89 of 101 External Antenna EnclosureApplication BoardLEON-G100/G200ANTRadiating ElementZo=50 OhmCoaxial Antenna CableEnclosure Port LEON-G100/G200 - System Integration Manual 3 Handling and soldering No natural rubbers, no hygroscopic materials nor materials containing asbestos are employed. 3.1 Packaging, shipping, storage and moisture preconditioning For information pertaining to reels and tapes, Moisture Sensitivity levels (MSD), shipment and storage information, as well as drying for preconditioning see the LEON-G100/G200 Data Sheet [1]. LEON-G100/G200 modules are Electro-Static Discharge (ESD) sensitive devices. Ensure ESD precautions are implemented during handling of the module. 3.2 Soldering 3.2.1 Soldering paste Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Soldering Paste:
OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification:
Sn 95.5 / Ag 3.9 / Cu 0.6 (95.5% Tin / 0.6 % Silver / 0.6% Copper) 95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0 % Silver / 0.5% Copper) Melting Temperature: 217C Stencil Thickness:
120 m for base boards The final choice of the soldering paste depends on the approved manufacturing procedures. The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.2.2 The quality of the solder joints on the connectors (half vias) should meet the appropriate IPC specification. 3.2.2 Reflow soldering A convection type-soldering oven is strongly recommended over the infrared type radiation oven. Convection heated ovens allow precise control of the temperature and all parts will be heated up evenly, regardless of material properties, thickness of components and surface color. Consider the "IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave) processes, published 2001". Preheat phase Initial heating of component leads and balls. Residual humidity will be dried out. Please note that this preheat phase will not replace prior baking procedures. Temperature rise rate: max 3C/s If the temperature rise is too rapid in the preheat phase it may cause excessive slumping. GSM.G1-HW-09002-F3 Preliminary Handling and soldering Page 90 of 101 LEON-G100/G200 - System Integration Manual Time: 60 120 s End Temperature: 150 - 200C If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if performed excessively, fine balls and large balls will be generated in clusters. If the temperature is too low, non-melting tends to be caused in areas containing large heat capacity. Heating/ reflow phase The temperature rises above the liquidus temperature of 217C. Avoid a sudden rise in temperature as the slump of the paste could become worse. Limit time above 217C liquidus temperature: 40 - 60 s Peak reflow temperature: 245C Cooling phase A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle. Temperature fall rate: max 4C / s To avoid falling off, modules should be placed on the topside of the motherboard during soldering. The final soldering temperature chosen at the factory depends on additional external factors like choice of soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering temperature in the recommended soldering profile may permanently damage the module. Figure 56: Recommended soldering profile When soldering lead-free LEON-G100/G200 modules in a leaded process, check the following temperatures:
PB- Technology Soaktime: 40-80 s Time above Liquidus:
40-90 s Peak temperature:
225-235C LEON-G100/G200 modules must not be soldered with a damp heat process. GSM.G1-HW-09002-F3 Preliminary Handling and soldering Page 91 of 101 PreheatHeatingCooling[C]Peak Temp. 245C[C]250250Liquidus Temperature21721720020040 - 60 sEnd Temp.max 4C/s150 - 200C150150max 3C/s60 - 120 s100Typical Leadfree100Soldering Profile5050050100150200250300Elapsed time [s]
LEON-G100/G200 - System Integration Manual 3.2.3 Optical inspection After soldering the LEON-G100/G200 module, inspect the modules optically to verify that he module is properly aligned and centered. 3.2.4 Cleaning Cleaning the soldered modules is not recommended. Residues underneath the modules cannot be easily removed with a washing process. Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-
jet printed text. Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text. Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators. For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering. 3.2.5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a LEON-G100/G200 module populated on it. The reason for this is the risk of the module falling off due to high weight in relation to the adhesive properties of the solder. 3.2.6 Wave soldering Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for boards populated with LEON-G100/G200 modules. 3.2.7 Hand soldering Hand soldering is not recommended. 3.2.8 Rework The LEON-G100/G200 module can be unsoldered from the baseboard using a hot air gun. Avoid overheating the module. After the module is removed, clean the pads before placing. Never attempt a rework on the module itself, e.g. replacing individual components. Such actions immediately terminate the warranty. 3.2.9 Conformal coating Certain applications employ a conformal coating of the PCB using HumiSeal or other related coating products. These materials affect the HF properties of the LEON-G100/G200 modules and it is important to prevent them from flowing into the module. The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore care is required in applying the coating. Conformal Coating of the module will void the warranty. GSM.G1-HW-09002-F3 Preliminary Handling and soldering Page 92 of 101 LEON-G100/G200 - System Integration Manual 3.2.10 Casting If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes in combination with the LEON-G100/G200 module before implementing this in the production. Casting will void the warranty. 3.2.11 Grounding metal covers Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide optimum immunity to interferences and noise. u-blox gives no warranty for damages to the LEON-G100/G200 module caused by soldering metal cables or any other forms of metal strips directly onto the EMI covers. 3.2.12 Use of ultrasonic processes Some components on the LEON-G100/G200 module are sensitive to Ultrasonic Waves. Use of any Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module. u-blox gives no warranty against damages to the LEON-G100/G200 module caused by any Ultrasonic Processes. GSM.G1-HW-09002-F3 Preliminary Handling and soldering Page 93 of 101 LEON-G100/G200 - System Integration Manual 4 Product Testing 4.1 u-blox in-series production test u-blox focuses on high quality for its products. All units produced are fully tested. Defective units are analyzed in detail to improve the production quality. This is achieved with automatic test equipment, which delivers a detailed test report for each unit. The following measurements are done:
Digital self-test (software download, verification of Flash firmware, etc.) Measurement of voltages and currents Measurement of RF characteristics Figure 57: Automatic test equipment for module tests GSM.G1-HW-09002-F3 Preliminary Product Testing Page 94 of 101 LEON-G100/G200 - System Integration Manual Appendix A Extra Features A.1 Firmware (upgrade) Over The Air (FOTA) (LEON-G200 only) LEON-G100/G200 Firmware can be updated Over The Air. The main idea is that Firmware can be updated over the air reducing the amount of data transmitted. This is achieved by downloading into LEON not the full Firmware, only the delta file which contains only the differences between the two firmware versions (old and new), and compressing the delta file. To perform the update over the air of LEON FW, a 3rd party library from RedBend has been integrated into the FW. This library allows to download into the module just a delta between the 2 FW versions (the one on the module and the upgrade); in this way it is possible to transfer less data and use less space on the flash for storing it. For more details please refer to Firmware Update Application Note [13]. A.2 Firmware (upgrade) Over AT (FOAT) Firmware upgrade is available with LEON-G100/G200 modules using AT commands. A.2.1 Overview This feature allows upgrade the module Firmware over UART, using AT Commands. AT Command AT+UFWUPD triggers a reboot and followed by upgrade procedure at specified baud rate
(refer to u-blox 2G GSM/GPRS AT Commands Manual [2] for more details) The Xmodem-1k protocol is used for downloading the new Firmware image via a terminal application A special boot loader on the module performs Firmware installation, security verifications and module reboot Firmware authenticity verification is performed via a security signature during the download. Firmware is then installed, overwriting the current version. In case of power loss during this phase, the boot loader detects a fault at the next wake-up, and restarts the Firmware download from the Xmodem-1k handshake. After completing the upgrade, the module is reset again and wakes-up in normal boot A.2.2 FOAT procedure The application processor must proceed in the following way:
send through the UART the AT+UFWUPD command, specifying the file type and the desired baud rate reconfigure the serial communication at the selected baud rate, without flow control with the Xmodem-1k protocol send the new FW image via Xmodem-1k A.3 Firewall The feature allows the LEON-G100/G200 user to reject incoming connections originated from IP addresses different from the specified list and inserted in a black list. A.4 TCP/IP Via the AT commands its possible to access the TCP/IP functionalities over the GPRS connection. For more details about AT commands see the u-blox 2G GSM/GPRS AT Commands Manual [2]. GSM.G1-HW-09002-F3 Preliminary Appendix Page 95 of 101 LEON-G100/G200 - System Integration Manual A.4.1 Multiple IP addresses and sockets Using LEONs embedded TCP/IP or UDP/IP stack, only 1 IP instance (address) is supported. The IP instance supports up to 16 sockets. Using an external TCP/IP stack (on the application processor), it is possible to have 2 IP instances (addresses). A.5 FTP LEON-G100/G200 modules support the File Transfer Protocol functionalities via AT commands. Files are read and stored in the local file system of the module. For more details about AT commands see the u-blox 2G GSM/GPRS AT Commands Manual [2]. A.6 HTTP HTTP client is implemented in LEON. HEAD, GET, POST, DELETE and PUT operations are available. The file size to be uploaded / downloaded depends on the free space available in the local file system (FFS) at the moment of the operation. Up to 4 HTTP client contexts to be used simultaneously. For more details about AT commands see the u-blox 2G GSM/GPRS AT Commands Manual [2]. A.7 SMTP LEON supports SMTP client functionalities. It is possible to specify the common parameters (e.g. server data, authentication method, etc.) can be specified, to send an email to a SMTP server. Emails can be send with or without attachment. Attachments are store in the local file system of LEON. For more details about AT commands see the u-blox 2G GSM/GPRS AT Commands Manual [2]. A.8 GPS The LEON-G100/G200 modules allow a simple and fast connection with the u-blox GPS modules (u-blox 5 family and above). Via the DDC bus its possible to communicate and exchange data, while the available GPIOs can handle the GPS device power on/off. For information about implementing u-blox GPS with LEON-G100/G200 modules, including using u-blox AssistNow Assisted GPS (A-GPS) service see the GPS Integration Application Note [3]. GSM.G1-HW-09002-F3 Preliminary Appendix Page 96 of 101 LEON-G100/G200 - System Integration Manual B Glossary 3GPP AC ADC ADN AMR ASIC AT BB CBCH CBS CLK CMOS CS CTS DAC DC DCD DCE DCS DDC DL DRX DSP DSR DTE DTR EBU EEP EGSM EM EMC EMI EMS ESD ESR EUT FAQ FDN FET FFS FIR FOAT FOTA FTP FW GND GPIO GPRS GPS GSM HDLC HTTP I/O I/Q I2C I2S IIR 3rd Generation Partnership Project Alternating Current Analog to Digital Converter Abbreviated Dialing Numbers Adaptive Multi Rate Application Specific Integrated Circuit AT Command Interpreter Software Subsystem, or attention Baseband Cell Broadcast Channel Cell Broadcast Services Clock Complementary Metal Oxide Semiconductor Coding Scheme or Chip Select Clear To Send Digital Analog Converter Direct Current Data Carrier Detect Data Communication Equipment Digital Cellular System Display Data Channel Down Link (Reception) Discontinuous Reception Digital Signal Processing Data Set Ready Data Terminal Equipment Data Terminal Ready External Bus Interface Unit EEPROM Emulation Parameters Extended GSM ElectroMagnetic Electromagnetic Compatibility ElectroMagnetic Interference ElectroMagnetic Static Electrostatic Discharge Equivalent Series Resistance Equipment Under Test Frequently Asked Questions Fixed Dialing Numbers Field Effect Transistor Flash File System Finite Impulse Response Firmware (upgrade) Over AT Firmware Over The Air File Transfer Protocol Firmware Ground General Purpose Input Output General Packet Radio Service Global Positioning System Global System for Mobile Communications High Level Data Link Control HyperText Transfer Protocol Input / Output In phase and Quadrature Inter-Integrated Circuit Inter IC Sound Infinite Impulse Response GSM.G1-HW-09002-F3 Preliminary Appendix Page 97 of 101 LEON-G100/G200 - System Integration Manual IP ISO ITU LDN LDO LED LNA M2M ME MIDI MSB MSD MSL MUX NOM NTC OSI PA PBCCH PCCCH PC PCB PCM PCS PICS PIXIT PMU PPS PSRAM RF RI RoHS RTC RTS RX RXD SAR SAW SCL SDA SDN SIM SMA SMS SMTP STK SW TCH TCP TDMA TS TX TXD UART UDP UL VCO VSWR WA Internet Protocol International Organization for Standardization International Telecomunication Union Last Dialed Numbers Low-Dropout Light Emitting Diode Low Noise Amplifier Machine to Machine Mobile Equipment Musical Instrument Digital Interface Most Significant Bit Moisture Sensitive Devices Moisture Sensitivity Level Multiplexer or Multiplexed Network Operating Mode Negative Temperature Coefficient Open Systems Interconnection Power Amplifier Packet Broadcast Control Channel Packet Common Control Channel Personal Computer Printed Circuit Board Pulse Code Modulation Personal Communications Service Protocol Implementation Conformance Statement Protocol Implementation Extra Information for Testing Power Management Unit Protocol and Parameter Selection Pseudo Static Random Access Memory Radio Frequency Ring Indicator Restriction of Hazardous Substances Directive Real Time Clock Ready To Send Receiver RX Data Specific Absorption Rate Surface Acoustic Wave Serial Clock Serial Data Service Dialing Numbers Subscriber Identity Module SubMiniature version A connector Short Message Service Simple Mail Transfer Protocol SIM Toolkit Software Traffic Channel Transmission Control Protocol Time Division Multiple Access Technical Specification Transmitter TX Data Universal Asynchronous Receiver Transmitter User Datagram Protocol Up Link (Transmission) Voltage Controlled Oscillator Voltage Standing Wave Ratio Word Alignment GSM.G1-HW-09002-F3 Preliminary Appendix Page 98 of 101 LEON-G100/G200 - System Integration Manual Related documents
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[12]
[13]
[14]
u-blox LEON-G100/G200 Data Sheet, Document No GSM.G1-HW-09001 u-blox 2G GSM/GPRS AT Commands Manual, Document No GSM.G1-SW-09002 GPS Implementation Application Note, Document No GSM.G1-CS-09007 ITU-T Recommendation V.24, 02-2000. List of definitions for interchange circuits between data terminal equipment (DTE) and data circuit-terminating equipment (DCE). http://www.itu.int/rec/T-
REC-V.24-200002-I/en 3GPP TS 27.007 - AT command set for User Equipment (UE) (Release 1999) 3GPP TS 27.005 - Use of Data Terminal Equipment - Data Circuit terminating; Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) (Release 1999) 3GPP TS 27.010 - Terminal Equipment to User Equipment (TE-UE) multiplexer protocol (Release 1999) The I2C-bus specification, Version 2.1, Jan 2000, http://www.nxp.com/acrobat_download/literature/9398/39340011_21.pdf CENELEC EN 61000-4-2 (2001): "Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques - Electrostatic discharge immunity test". ETSI EN 301 489-1 V1.8.1: Electromagnetic compatibility and Radio spectrum Matters (ERM);
ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements ETSI EN 301 489-7 V1.3.1 Electromagnetic compatibility and Radio spectrum Matters (ERM);
ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS) LEON Audio Application Note, Document No. GSM.G1-CS-10005 Firmware Update Application Note, Document No GSM.G1-CS-09006 GSM Mux Implementation Application Note for LEON-G100/G200 Document No GSM.G1-CS-10002 Part of the documents mentioned above can be downloaded from u-blox web-site (http://www.u-blox.com). GSM.G1-HW-09002-F3 Preliminary Related documents Page 99 of 101 LEON-G100/G200 - System Integration Manual Revision history Revision Date Name Status / Comments
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A A1 B C 30/04/2009 tgri Initial release. Objective specification 22/06/2009 lpah New CI 16/07/2009 tgr Change of document status to advance information 20/08/2009 lpah Figure 1.1 and Figure 1.2: corrected the LEON block diagram 4/11/2009 tgri/lpah/sses este/fves Figure 1.17: corrected the SIM Application circuit Document updated for serial port handling Table 1: renamed pins and description Chapter 1.9.1: added the figures related to DSR behavior at power-on, RI behavior at SMS Arrival, RI behavior at incoming call and CTS handling in power saving mode Change of document status to Preliminary. Revision of 2.2.2 footprint and paste mask, 2.2.3 paste mask removed Section 1.5.2completely revised. Added Table 3, updated section 1.5.3.1 Section 1.5.4: added charging temperature range values with clarification Section 1.5.5: added clarification regarding V_BCKP current consumption; added formula to evaluate external capacitor capacitance requirement as function of the buffering time; updated application circuits. Updated Figure 17 Section 1.6.1: added Figure 19: Power on sequence description Section 1.6.2: added clarification regarding the application circuit to avoid an increase of the module current consumption in power down mode and added the power off sequence diagram Added Figure 20: Power off sequence description Section 1.6.3: added RESET_N equivalent circuit description Updated Figure 21: Application circuits to reset the module using a push button or using an application processor Section 1.10.1.3: clarified and updated application circuit description to connect a handset; added application circuit description to connect an external audio device with analog input/outputs; clarified and updated application circuit description to connect a headset. Added Figure 20. Section 1.10.1.5: clarified and updated application circuit description in hands free mode Section1.10.2: added clarification regarding the application circuit to avoid an increase of the module current consumption in power down mode. Section 1.8: clarified and updated application circuit description for the SIM card. Section 1.9.1: corrected MAX3237 description; added clarification regarding the application circuit to avoid an increase of the module current consumption in power down mode. Section 1.10: clarified as the measured value is input impedance dependent Section 1.12: added clarification regarding the application circuit to avoid an increase of the module current consumption in power down mode. Updated section 2.1: Check UART signals direction, since the signal names follow the ITU-T V.24 Recommendation. Added section 2.3 to explain module thermal resistance. Section 1.9.1: corrected supported UART frame format. Corrected and improved description Updated and improved Figure 3: Power supply concept Added VCC extended and normal operating ranges description and clarified DC power supply requirements in section 1.5.2 Updated and improved Figure 7 content and caption Clarified current profile description in section 1.5.3.2 Updated and improved content and caption Clarified charger requirements in section 1.5.4 Grouped sections Module power on, Module power off, Module reset into the 1.6 System functions chapter Updated and improved Figure 19: Power on sequence description Updated and improved Figure 20: Power off sequence description Updated Figure 37: Headset mode application circuit content Clarified I2S PCM mode path in section 1.10.2.1 Updated section 1.9.1: clarified, added and corrected UART features, UART signal behavior,. Updated and improved UART signal behavior (AT commands interface case) content and caption Updated Figure 25: UART default frame format (8N1) description caption Deleted the double repeated point in the Design-in checklist Clarified pins arrangement in section 2.2.1 Clarified ground plane requirements in section 2.2.1.4 Renumbered sections Antenna termination, Antenna radiation, Antenna detection functionality Corrected AT Commands Manual code in Related documents section Removed System Configuration chapter D E F F1 01/29/2010 lpah Improved audio interfaces and updated approvals chapter 22/04/2010 lpah Aligned the document to LEON-G100-04S-00 and LEON-G200-04S-00 Digital Audio Interface supported by LEON-G100 08/07/2010 lpah Aligned the document to LEON-G100-05S-00 and LEON-G200-05S-00 30/07/2010 lpah Added more details on Additional hints for the VCC supply application circuits GSM.G1-HW-09002-F3 Preliminary Revision history Page 100 of 101 LEON-G100/G200 - System Integration Manual Revision Date Name Status / Comments F2 F3 13/08/2010 lpah Updated soldering profile information 20/01/2011 lpah Updated stencil information and inserted the application circuit for LEON-x00-06x UART Power saving description added; improved the description of serial line handling Contact For complete contact information visit us at www.u-blox.com u-blox Offices North, Central and South America u-blox America, Inc. Phone:
E-mail:
+1 (703) 483 3180 info_us@u-blox.com Regional Office West Coast:
Phone:
E-mail:
+1 (703) 483 3184 info_us@u-blox.com Technical Support:
Phone:
E-mail:
+1 (703) 483 3185 support_us@u-blox.com Headquarters Europe, Middle East, Africa u-blox AG Phone:
E-mail:
Support:
+41 44 722 74 44 info@u-blox.com support @u-blox.com Asia, Australia, Pacific u-blox Singapore Pte. Ltd. Phone:
E-mail:
Support:
+65 6734 3811 info_ap@u-blox.com support_ap@u-blox.com Regional Office China:
Phone:
E-mail:
Support:
+86 10 68 133 545 info_cn@u-blox.com support_cn@u-blox.com Regional Office Japan:
Phone:
E-mail:
Support:
+81 3 5775 3850 info_jp@u-blox.com support_jp@u-blox.com Regional Office Korea:
Phone:
E-mail:
Support:
+82 2 542 0861 info_kr@u-blox.com support_kr@u-blox.com Regional Office Taiwan:
Phone:
E-mail:
Support:
+886 2 2657 1090 info_tw@u-blox.com support_tw@u-blox.com GSM.G1-HW-09002-F3 Preliminary Page 101 of 101
| 1 | User Manual | Users Manual | 152.14 KiB | / November 10 2011 |
D l hi T l Delphi Telematics Device ti D i Model: SV40001-U1B1 Installation Guide Installation Guide Date: 03-14-2011 Delphi Model: SV40001-U1B1 G General Description i ti l D The product is installed by connecting to The product is installed by connecting to the OBD II Diagnostics Link Connector
(DLC) for 1996 and newer light duty
(DLC) for 1996 and newer light duty vehicles. DLC Connector Delphi Model: SV40001-U1B1 G General Description i ti l D The DLC is typically used by automotive The DLC is typically used by automotive technicians to help diagnose problems with a vehicle with a vehicle. The product uses the DLC similarly to monitor vehicle operation monitor vehicle operation. Delphi Model: SV40001-U1B1 G General Description i ti l D The location of the DLC is typically located The location of the DLC is typically located in the driver-side, lower compartment area of the vehicle of the vehicle. For specific location, consult vehicle manufacturer specific information manufacturer specific information. Delphi Model: SV40001-U1B1 G General Description i ti l D The SV40001-U1B1 has been designed to The SV40001 U1B1 has been designed to comply with the United States Federal Communications Commissions (FCC) RF Communications Commission s (FCC) RF exposure requirements when installed as detailed in this document detailed in this document. Delphi Model: SV40001-U1B1 St l Step 1: Locate DLC in vehicle t DLC i 1 L hi Delphi Model: SV40001-U1B1 2 L St d t Step 2: Locate connector end of product d f t t Delphi Model: SV40001-U1B1 3 Ali St Step 3: Align product and DLC connectors d DLC d t t DLC Connector Product Connector Delphi Model: SV40001-U1B1 Step 4: Install by pushing the product onto Step 4: Install by pushing the product onto DLC Connector: Installation Complete.
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2011-04-14 | 1850.2 ~ 1909.8 | PCB - PCS Licensed Transmitter | Original Equipment |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 | Effective |
2011-04-14
|
||||
| 1 | Applicant's complete, legal business name |
APTIV Services US LLC
|
||||
| 1 | FCC Registration Number (FRN) |
0025770405
|
||||
| 1 | Physical Address |
2151 E.Lincoln Road M/S C4W
|
||||
| 1 |
2151 E.Lincoln Road
|
|||||
| 1 |
Kokomo, IN
|
|||||
| 1 |
United States
|
|||||
| app s | TCB Information | |||||
| 1 | TCB Application Email Address |
S******@ntscorp.com
|
||||
| 1 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
| app s | FCC ID | |||||
| 1 | Grantee Code |
L2C
|
||||
| 1 | Equipment Product Code |
0047TR
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 | Name |
B**** W**** J****
|
||||
| 1 | Title |
Engineering Group Manager
|
||||
| 1 | Telephone Number |
76545********
|
||||
| 1 | Fax Number |
76545********
|
||||
| 1 |
b******@aptiv.com
|
|||||
| app s | Technical Contact | |||||
| n/a | ||||||
| app s | Non Technical Contact | |||||
| n/a | ||||||
| app s | Confidentiality (long or short term) | |||||
| 1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 10/11/2011 | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
| 1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | GSM/GPRS Modem | ||||
| 1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 | Modular Equipment Type | Does not apply | ||||
| 1 | Purpose / Application is for | Original Equipment | ||||
| 1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
| 1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 | Grant Comments | Power Output is ERP for part 22 and EIRP for part 24 measured using specific test configuration described in this filing. This device contains modes that are not operational in U.S. Territories. This filing is only applicable for US operations. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi transmitter product procedures. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This transmitter is approved for configuration described in the filing only and the maximum reported body SAR values are: Part 22: 0.533 W/kg; Part 24:1.207W/kg. | ||||
| 1 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 | Firm Name |
National Technical Systems
|
||||
| 1 | Name |
D****** B******
|
||||
| 1 | Telephone Number |
510-5********
|
||||
| 1 | Fax Number |
510 5********
|
||||
| 1 |
d******@nts.com
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 22H | 824.2 | 848.8 | 2.29 | 0.052 ppm | 300KGXW | ||||||||||||||||||||||||||||||||||
| 1 | 2 | 24E | 1850.2 | 1909.8 | 1.31 | 0.028 ppm | 300KGXW | ||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC