FCC ID: XYO-AMA01R LTE Cellular Module

AMA-01R Hardware Design Guide APPLICABILTY TABLE TABLE APPLICABILTY TABLE AMA-01R HW Design Guide TABLE APPLICABILTY TABLE TABLE AMA-01R_V1.0 2024- 02- 27 ATEL Technical Documentation 1 / 75 AMA-01R Hardware Design Guide 1. INTRODUCTION .................................................................................................................................................... 5 1.1. Scope ..................................................................................................................................................... 5 1.2. Audience ............................................................................................................................................... 5 2. GENERAL PRODUCT

...................................................................................................................... 6 2.1. Overview .................................................................................................................................................. 6 2.2. Product Variants and Frequency Bands.................................................................................................. 7 2.3. Target Market .......................................................................................................................................... 7 2.4. Main Features .......................................................................................................................................... 7 2.4.1 Block Diagram ......................................................................................................................................... 9 2.5. TX Output Power .................................................................................................................................... 10 2.6. RX Sensitivity ......................................................................................................................................... 10 2.7. Mechanical Specifications ..................................................................................................................... 11 2.7.1. Dimensions ............................................................................................................................................ 11 2.7.2. Weight .................................................................................................................................................... 11 2.8. Temperature Range .............................................................................................................................. 11 3. PINS ALLOCATION ............................................................................................................................................ 12 3.1. Pin-out ................................................................................................................................................... 12 3.2. Signals that Must Be Connected ........................................................................................................... 19 3.3. LGA Pads Layout .................................................................................................................................... 21 4. POWER SUPPLY ................................................................................................................................................ 22 4.1. Power Supply Requirements ................................................................................................................ 22 4.2. Power Consumption .............................................................................................................................. 22 4.3. General Design Rule.............................................................................................................................. 24 4.3.1. Electrical Design Guidelines ................................................................................................................. 24 4.3.2. Thermal Design Guidelines ................................................................................................................... 26 4.3.3. Power Supply PCB Layout Guidelines ................................................................................................... 27 4.3.4. Bypass Capacitor on Power Supplies .................................................................................................... 29 4.4 VAUX Power Output ............................................................................................................................... 30 4.5. RTC Supply ............................................................................................................................................. 30 5. DIGITAL SECTION .............................................................................................................................................. 31 5.1. Logic Levels ........................................................................................................................................... 31 5.1.1. 1.8V Standard GPIOs .............................................................................................................................. 31 5.1.2. 1.8V SIM Card Pads ................................................................................................................................ 31 5.1.3. Dual Voltage Pads - Absolute Maximum Ratings ................................................................................. 32 5.1.4. SIM Card Pads @3.3V ............................................................................................................................. 32 5.2. Power Off ............................................................................................................................................... 35 5.2.1. Shutdown by Software Command ......................................................................................................... 35 5.2.2. Hardware Shutdown .............................................................................................................................. 36 5.2.3. Unconditional Shutdown ........................................................................................................................ 37 5.3.1. USB Port ................................................................................................................................................ 39 5.3.2. Serial Ports ........................................................................................................................................... 40 2 / 75 AMA-01R Hardware Design Guide 5.3.3. I2C - Inter-integrated Circuit ................................................................................................................ 44 5.3.4. General Purpose I/O ............................................................................................................................. 44 5.3.5. Using a GPIO Pad as Input ...................................................................................................................... 45 5.3.6. Using a GPIO Pad as an Interrupt / Wakeup Source ............................................................................. 45 5.3.7. Using a GPIO Pad as Output ................................................................................................................... 45 5.4 Indication of Network Service Availability............................................................................................. 46 5.5. Indication of Software Ready ................................................................................................................ 47 5.6. External SIM Holder .............................................................................................................................. 47 5.7.1. SIM Schematic Example ........................................................................................................................ 47 5.7 ADC Converter ........................................................................................................................................ 48 5.7.1 Description............................................................................................................................................... 48 5.7.2 Using the ADC Converter ........................................................................................................................ 48 5.8 Debug of the AMA-01R Module in Production ........................................................................................ 49 6.4. Antenna Requirements ......................................................................................................................... 50 6.6. PCB Design Guidelines .......................................................................................................................... 51 6.6.1.2. Transmission Line Measurements ....................................................................................................... 53 6.6.1.3. Antenna Installation Guidelines ............................................................................................................ 55 7. AUDIO SECTION ................................................................................................................................................. 56 7.1. Analog Front-End .................................................................................................................................. 56 7.1.1. MIC Connection ...................................................................................................................................... 56 7.1.2. EAR Connection...................................................................................................................................... 57 8. MECHANICAL DESIGN ....................................................................................................................................... 58 8.1. General .................................................................................................................................................. 58 8.2. Finishing & Dimensions ........................................................................................................................ 58 9.2. PCB Pad Design ...................................................................................................................................... 59 9.4. Thermal Performance .......................................................................................................................... 60 9.5. Stencil .................................................................................................................................................... 61 9.6. Solder Reflow ........................................................................................................................................ 62 9.7. Inspection .............................................................................................................................................. 63 10. PACKAGING ................................................................................................................................................... 64 10.1 Tray ......................................................................................................................................................... 64 10.2 Reel ....................................................................................................................................................... 66 10.3 Carrier Tape Detail ................................................................................................................................ 66 10.5. Moisture Sensitivity............................................................................................................................... 68 11.1.1. Copyrights .............................................................................................................................................. 70 11.1.2. Computer Software Copyrights ............................................................................................................. 70 11.2. Usage and Disclosure Restrictions ..................................................................................................... 71 11.2.1. License Agreements .............................................................................................................................. 71 11.2.2. Copyrighted Materials ........................................................................................................................... 71 11.2.3. High Risk Materials ............................................................................................................................... 71 11.2.4. Third Party Rights .................................................................................................................................. 72 11.2.5. Waiver of Liability.................................................................................................................................. 72 13.3 Safety Recommendations ..................................................................................................................... 73 3 / 75 12. .................................................................................................................................................... 74 AMA-01R Hardware Design Guide 4 / 75 AMA-01R Hardware Design Guide 1. 1.1. Scope This document introduces the ATEL AMA-01R module and presents possible and recommended hardware solutions for the development of a product based on the AMA-01R module. All the features and solutions described in this document are applicable to all AMA-01R variants, where AMA-01R refers to the variants listed in the applicability table If a specific feature is applicable to a specific product only, it will be clearly marked. Note : AMA-01R refers to all modules listed in the Applicability Table. This document covers all the basic functions of a wireless module; it cannot include every hardware solution or every product that can be designed. Where the suggested hardware configurations are not to be considered mandatory, the information provided should be used as a guide and starting point to successfully develop the product with the ATEL AMA-01R module. Note : The integration of the GSM/GPRS/EGPRS/UMTS/LTE AMA-

01R cellular module within a user application must be done according to the design rules described in this manual. 1.2. Audience This document is intended for system integrators that are using the ATEL AMA-

01R module in their products. 5 / 75 AMA-01R Hardware Design Guide 2. GENERAL PRODUCT 2.1. Overview The AMA-01R is an industrial-grade, cost-optimized LTE Cat1 module series ideal for IoT applications that need data and voice transmission, The use of a Single Antenna reduces the hardware design complexity, and allowing for the reduction of the overall device dimensions, making it possible to serve IoT applications with stringent size requirements. 6 / 75 AMA-01R Hardware Design Guide 2.2. Product Variants and Frequency Bands Table 2summarizes all region variants within the AMA-01R family, showing the band sets supported in each variant. Different bands combinations are available:

Region Variant 2G LTE FDD UMTS B2,B3 B5,B8 B1,B 2 , B3,B4,B5 B7, B8, B20, B28 B1,B2,B5,B8 Table 2: RFBands Variant Refer to RF Section for details information about frequencies and bands. Note: Cellular technologies and frequency bands that are enabled may vary based on firmware version and firmware configuration used. 2.3. Target Market AMA-01R can be used for applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:

Emergency call Road pricing Pay-as-you-drive insurance Internet connectivity 2.4. Main Features The AMA-01R series of cellular modules features an LTE CAT1,UMTS,GSM modem base band and RF transceiver to cover 700MHz~2.7GHz bands for worldwide roaming. 7 / 75 AMA-01R Hardware Design Guide Function Features Modem FDD LTE CAT1 o DL 10Mbps/ UL 5Mbps o VoLTE supported GSM/GRPS/EDGE Class 12 UMTS Support for SIM profile switching Regional variants with optimal choice of RF bands for worldwide coverage of countries and MNOs SIM SIM/USIM card controller Application processor Application processor to run customer application code o ARM Cortex-R5 with 832MHz clock o 32K I-Cache o 32K D-Cache o 64KB ATCM and 64KB BTCM o 64KB ROM and 64KB on-chip SRAM for application usage Interfaces Rich set of interfaces, including:

USB2.0 USB port is typically used for:

o Flashing of firmware and module configuration o Production testing o AT command access o Diagnostic monitoring and debugging Peripheral Ports I2C, UART GPIOs Antenna ports Form factor Form factor (29x29mm), accommodating the multiple RF bands in each region variant Environment and quality requirements The entire module is designed and qualified by ATEL for satisfying the environment and quality requirements. Single supply module The module generates all its internal supply voltages. RTC No dedicated RTC supply, RTC is supplied by VBATT Operating temperature Table 3: Features Table Range -40 C to +85 C (conditions as defined in Section 2.8 Temperature Range 8 / 75 AMA-01R Hardware Design Guide 2.4.1 Block Diagram Figure below shows an overview of the internal architecture of the AMA-01R module. includes the following sub-functions:

Application processor and Modem subsystem with their external interfaces. These two functions are contained in a single SOC. RF front end and antenna ports. Rich IO interfaces. Depending on which AMA-01R software features are enabled, some of its exported interfaces due to multiplexing may be used internally and therefore may not be usable by the application. PMIC with the RTC function inside Figure 1: Block Diagram 9 / 75 AMA-01R Hardware Design Guide 2.5. TX Output Power Typical values for Max output level are as follow:

Band Power class 2G EGSM 900 - 2G EGSM 850 2G DCS 1800 - 2G PCS 4G LTE (FDD) All Bands Table 4: Transmission Output Power Class 4 (2W) Class 1 (1W) Class 3 (0.2W) Class 3 (0.2W) Band Mode Clas s RF power (dBm) B8 900, B5 850 B3 1800, B2 1900 2G GSM/GPRS 2G EGPRS 2G GSM/GPRS 2G EGPRS 4G LTE FDD -CAT1 WCDMA 4 E2 1 E2 3 3 33dBm +/- 1dB 27dBm +/- 1dB 30dBm +/- 1dB 26dBm +/- 1dB 23dBm +/- 1dB 23dBm +/- 1dB Table 5: Transmission Output Power - Band 2.6. RX Sensitivity Below the 3GPP measurement conditions used to define the RX sensitivity:

Technology 3GPP Compliance 2G GSM/GPRS 4G LTE Table 6: Reception Sensitivity BER Class II <2.44%

Throughput >95% 10MHz BER <0.1%

10 / 75 AMA-01R Hardware Design Guide 2.7. Mechanical Specifications 2.7.1. Dimensions The overall dimensions of AMA-01R are:

X Y Z mm Length Width Thickness Table 8: AMA-01Rdimensions 29.4 mm, +/- 0.15 mm tolerance 29.4 mm, +/- 0.15 mm tolerance 2.2 mm, +/- 0.2 mm tolerance Note : Consider a typical label thickness of 0.1 mm in addition to the module thickness. 2.7.2. Weight The nominal weight of the AMA-01R module is 3.7 2.8. Temperature Range Mode Temperature Note Operating Temperature Range 20C +55C 40C +85C The module is fully functional(*) in all the temperature range and it fully meets the 3GPP specifications. The module is fully functional (*) in all the temperature range, might slightly deviate from the 3GPP specifications. Storage and Temperature Range Table 9: Temperature Range 40C +85C The module is not powered and not connected to power supply Note: (*) Functional: if applicable, the module is able to make and receive voice calls, data calls, send and receive SMS and data traffic. 11 / 75 AMA-01R Hardware Design Guide 3. PINS ALLOCATION 3.1. Pin-out PAD Signal I/O Function Type Comment USB HS 2.0 Communication Port B15 C15 USB_D+

USB_D-

A13 USB_VBUS I/O I/O AI USB differential Data (+) USB differential Data (-) Power sense for the internal USB transceiver Power Pull down to GND to enter emergency download mode UART_DEBU G F14 FORCED_USB_BOOT I FORCED_USB_BOOT 1.8V Asynchronous UART N15 C103/TXD M15 C104/RXD M14 C108/DTR L14 C105/RTS P15 C106/CTS N14 C109/DCD P14 C107/DSR R14 C125/RING DEBUG_UART_TXD M6 DEBUG_UART_RXD AUX UART D15 E15 TX_AUX RX_AUX SIM Card Interface 1 A6 A7 SIMCLK1 SIMRST1 I O I I O O O O O I O I O O Serial data input (TXD) from DTE Serial data output to DTE Input for Data Terminal Ready (DTR) from DTE Input for Request to send signal (RTS) from DTE Output for Clear to send signal (CTS) to DTE Output for Data Carrier Detect (DCD) to DTE Output for Data Set Ready

(DSR) to DTE Output for Ring Indication

(RI) to DTE Trace UART TX Trace UART RX TX_AUX RX_AUX 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V External SIM 1 signal Clock External SIM 1 signal Reset 1.8/3.3 V 1.8/3.3 V 12 / 75 Function Type Comment External SIM 1 signal - Data I/O 1.8/3.3 V Internally PU 4.7 k to SIMVCC1 AMA-01R Hardware Design Guide PAD Signal A5 SIMIO1 SIMIN1 A3 SIMVCC1 SIM Card Interface 2 C1 D1 SIMCLK2 SIMRST2 C2 SIMIO2 SIMIN2 D2 SIMVCC2 I/O I/O I

O O External SIM 1 signal -

Presence External SIM 1 signal Power supply for SIM 1 External SIM 2 signal Clock External SIM 2 signal Reset I/O External SIM 2 signal Data I/O I

External SIM 2 signal Presence External SIM 2 signal Power supply for SIM 2 General Purpose Digital I/O C8 C9 GPIO_ 1 GPIO_2 I/O GPIO_ 1 / STAT_LED I/O GPIO_2 C10 GPIO_3 I/O GPIO_3/I2C2_SCL C11 GPIO_4 I/O GPIO_4/I2C2_SDA B14 GPIO_5 I/O GPIO_5/I2C3_SCL C12 GPIO_6 I/O GPIO_6/I2C3_SDA C13 GPIO_7 I/O GPIO_7 K15 GPIO_8 I/O GPIO_8/ SW_RDY L15 G15 GPIO_9 GPIO_ 10 RF Section K1 Antenna Miscellaneous Functions I/O I/O GPIO_9 GPIO_ 10 I/O GSM/EDGE/LTE Main antenna

(50 Ohm) 1.8V Active low 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V Internally PU 4.7k to SIMVCC2 1.8V Active low Alternate Fn STAT_LED Alternate Fn I2C Alternate Fn I2C Alternate Fn I2C Alternate Fn I2C Alternate Fn SW_RDY 1.8/3.3 V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V RF R12 R13 ON_OFF_N HW_SHUTDOWN_N I I Power ON / Power OFF input Unconditional Shutdown input Active low Active low 13 / 75 Function Type Comment AMA-01R Hardware Design Guide PAD Signal R11 VAUX/PWRMON E13 VIO_ 1V8 B1 H4 K3 L3 ADC_IN1 ADC_IN2 ATC1 ATC2 I2C Interface I/O O O AI AI I/O I/O Supply output for external accessories /

Power ON monitor IO voltage for internal ICs This power rail is always on while AMA-01R is working. Analog/Digital Converter Input 1 Analog/Digital Converter Input 2 Antenna Tuner Ctrl Antenna Tuner Ctrl B11 I2C_SCL I/O I2C clock B10 I2C_SDA I/O I2C Data Analog Audio B2 B3 B4 B5 EAR+

EAR-

MIC+

MIC-

Antenna Tuner L3 K3 ATC1 ATC2 Power Supply M1 VBATT M2 VBATT N1 N2 P1 P2 A2 VBATT_PA VBATT_PA VBATT_PA VBATT_PA GND O O I I O O

Analog Audio (EAR+) Analog Audio (EAR-) Analog Audio (MIC+) Analog Audio (MIC-) Antenna Tuner Ctrl Antenna Tuner Ctrl Main Power Supply

(Digital Section) Main Power Supply

(Digital Section) Main Power Supply (RF Section) Main Power Supply (RF Section) Main Power Supply (RF Section) Main Power Supply (RF Section) Ground 14 / 75 RF GPIO RF GPIO Need external PU 4.7k to 1.8V Need external PU 4.7k to 1.8V 1.8V 1.8V Analog Analog 1.8V 1.8V 1.8V 1.8V Analog Analog Analog Analog 1.8V 1.8V Power Power Power Power Power Power AMA-01R Hardware Design Guide B13 D4 E1 E2 E14 F2 G1 G2 G7 G8 G9 H1 H2 H7 H8 H9 J1 J2 J7 J8 J9 L1 L2 M3 M4 M12 N3 N4 N5 N6 P3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND

Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground 15 / 75 AMA-01R Hardware Design Guide P4 P5 P6 P8 P9 P10 P13 R3 R10 GND GND GND GND GND GND GND GND GND GND GND GND GND Reserved for Internal D12 F15 H14 J12 F12 E12 G12 K12 H12 G13 F13 N13 L13 J13 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved M13 Reserved K13 H13 L12 Reserved Reserved Reserved

Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 16 / 75 AMA-01R Hardware Design Guide PAD Signal I/O Function Type Comment M11 M10 L4 B9 B6 B7 B8 Reserved Reserved Reserved Reserved Reserved Reserved Reserved B12 Reserved Reserved A8 A9 A10 A11 A12 A14 C7 D5 D6 D7 D8 D9 D10 D11 D13 D14 E4 F1 F4 G3 H3 H15 J3 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved

Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 17 / 75 AMA-01R Hardware Design Guide PAD Signal I/O Function Type Comment J4 J15 M5 M7 M8 M9 N7 N8 N10 N11 N12 P11 P12 C14 C3 C5 C6 D3 E3 F3 R7 N9 G14 J14 K14 P7 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Table 10: Pin-out Information

Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 18 / 75 AMA-01R Hardware Design Guide Note : When the UART signals are used as the communication port between the host and the modem, the RTS must be connected to GND

(on the module side) if flow control is not used. If the UART port is not used, all UART signals can be left disconnected Note : The following pins are unique for the AMA-01R REF_CLK I2C_SCL I2C_SDA ADC_IN1 ADC_IN2 Warning : Reserved pins must not be connected. 3.2. Signals that Must Be Connected Table 11 lists the AMA-01R signals that must be connected even if not used by the end application:

M1, M2, N1, N2, P1, P2 Signal VBATT &

VBATT_PA A2, B13, D4, E1, E2, E14, F2, G1, G2, G7, G8, G9, H1, H2, H7, H8, H9, J1, J2, J7, J8, J9, K2, L1, L2, M3, M4, M12, N3, N4, N5, N6, P3, P4, P5, P6, P8, P9, P10, P13, R2, R5, R6, R8, R10 GND R12 R13 B15 C15 A13 F14 ON/OFF Main power on off signal HW_SHUTDOWN_N Emergency power off USB_D+

USB_D-

USB_VBUS If not used, connect to a Test Point or an USB connector If not used, connect to a Test Point or an USB connector If not used, connect to a Test Point or an USB connector FORCED_USB_BOOT If not used, connect to a Test Point 19 / 75 AMA-01R Hardware Design Guide PAD Signal Notes C103/TXD C104/RXD C105/RTS C106/CTS If not used, connect to a Test Point If not used, connect to a Test Point If flow control is not used, connect to GND If not used, connect to a Test Point DEBUG_UART_TXD If not used, connect to a Test Point DEBUG_UART_RXD If not used, connect to a Test Point GPIO_ 1/STAT_LED If not used, connect to a Test Point Antenna MAIN antenna N15 M15 L14 P15 M6 C8 K1 Table 11: AMA-01Rsignals that must be connected 20 / 75 AMA-01R Hardware Design Guide 3.3. LGA Pads Layout Top View Figure 2: LGA Pads Layout SUPPLY AND CONTROL SIM CARD ANALOG FUNCTIONALITY GROUND DIGITAL FUNCTIONALITY DIGITAL COMMUNICATION RF SIGNALS RESERVED/NOT ASSIGNED/ RESERVED FOR FUTURE USE 21 / 75 AMA-01R Hardware Design Guide 4. POWER SUPPLY The power supply circuitry and board layout are very important parts of the complete product design, with a critical impact on the overall product performance. Please read the following requirements and guidelines carefully to ensure a good and proper design.. 4.1. Power Supply Requirements The AMA-01R power requirements are as follows:

Power Supply Value Nominal Supply Voltage Operating Voltage Range 3.8V normal: 3.4 - 4.2 V Max ripple on module input supply 30 mV Table 12: Power Supply Requirements Note : The Operating Voltage Range MUST never be exceeded; the applications power supply section must be designed with care to avoid an excessive voltage drop. If the voltage drop exceeds the limits it may cause an unintentional module power off. Note: For approval on the final products the power supply is required to be within the Normal Operating Voltage Range. In the extended voltage operating range below the 3.4V the RF power could have some reduction. 4.2. Power Consumption Table 13provides typical current consumption values of AMA-01R for the various available modes. Mode Average

(Typ.) Mode Description Switched Off Switched off 130uA Module supplied but switched Off (RTC On) Idle Mode (Standby Mode;

No AT+CFUN = 1 Call in Progress) 24mA Module full functionality with power saving disabled 22 / 75 AMA-01R Hardware Design Guide DRX AT+CFUN=5 GSM LTE Operative Mode (LTE) LTE (max power) LTE (0dBm) Operative Mode (GSM) GSM Tx and Rx mode GSM900/GSM850 PL5 DCS1800/PCS1900 PL0 GPRS 2 Tx + 1 Rx GSM900/GSM850 PL5 DCS1800/PCS1900 PL0 Average (Typ.) 2mA 550mA 260mA GSM900: 230mA DCS1800: 160mA PCS1900: 160mA GSM850: 230mA GSM900: 380mA DCS1800: 255mA PCS1900: 255mA GSM850: 390mA Table 13: Current Consumption

*Worst/best case current values dependon networkconfiguration, not under module control. Note : The electrical design for the power supply must ensure a peak current output of at least 2.0A. The support of specific network wireless technology depends on the product variant configuration. Note : In GSM/GPRS mode, the RF transmission is not continuous, but is split into bursts at a base frequency of about 216 Hz with relative current peaks up to approximately 2.0A. Therefore, the power supply must be designed to withstand these current peaks without large voltage drops. This means that both the electrical design and the board layout must be designed for this current flow. If the PCB layout is not well designed, a loud background noise is generated. This will be reflected on all audio paths producing an annoying audible noise at 216 Hz. 23 / 75 AMA-01R Hardware Design Guide If the voltage drops during the peaks, the current absorption is too high. The device may even shut down due to a drop in the supply voltage. 4.3. General Design Rule The principal guidelines for the Power Supply Design comprise three different design steps:

the electrical design of the power supply the thermal design the PCB layout 4.3.1. Electrical Design Guidelines The electrical design of the power supply strongly depends on the power source where this power is drained. We will distinguish them into three categories:

+5V input (typically PC internal regulator output)

+12V input (typically automotive) Battery 4.3.1.1. +5V Source Power Supply Design Guidelines The desired output for the power supply is 3.8V. So, the difference between the input source and the desired output is not big, and therefore a linear regulator can be used. A switching power supply is preferred to reduce power consumption. When using a linear regulator, a proper heat sink must be provided to dissipate the generated power. A low bypass ESR capacitor of adequate capacity must be provided to cut the current absorption peaks near the AMA-01R module. A 100 F tantalum capacitor is usually suitable on both VBATT and VBATT_PA power lines. Make sure the low ESR capacitor on the output of the power supply (usually a tantalum one) is rated at least 10V. A protection diode must be placed near the power input to protect the AMA-

01R module from power polarity inversion. 24 / 75 AMA-01R Hardware Design Guide Figure 3 : An Example of Linear Regulator with5 V Input 4.3.1.2. +12V Source Power Supply Design Guidelines The desired output for the power supply is 3.8V, so due to the big difference between the input source and the desired output, a linear regulator is not suitable and shall not be used. A switching power supply will be preferable because of its better efficiency. When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption. In any case the frequency and Switching design selection is related to the application to be developed since the switching frequency could also generate EMC interferences. For the car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage. A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100F capacitor is usually suitable. Make sure the low ESR capacitor on the power supply output is rated at least 10V. For Automotive applications a spike protection diode should be inserted close to the power input, in order to clean the supply from the spikes. 25 / 75 AMA-01R Hardware Design Guide Figure 4: An Example of Switching Regulator with12V Input 4.3.1.3. Battery Source Power Supply Design Guidelines The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V. Hence a single 3.7V Li-Ion cell battery type is suitable for supplying the power to the AMA-01R module. A low ESR bypass capacitor of adequate capacity must be provided to cut the current absorption peaks; usually a 100F tantalum capacitor is suitable. Make sure that the low ESR capacitor (usually a tantalum one) is rated at least 10V. A protection diode must be placed near the power input to protect the AMA-

01R module from power polarity inversion. Otherwise, the battery connector must be done in such a way to avoid polarity inversions when connecting the battery. The battery capacity must be at least 500 mAh to withstand the current peaks of 2A. Note : DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with AMA-01R. Their use can lead to overvoltage on the AMA-01R and damage it. USE ONLY Li-Ion battery types. 4.3.2. Thermal Design Guidelines The thermal design for the power supply heat sink should be done with the following specifications:

Considering the very low current during Idle, especially if the Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs significant current only during an Active Call or Data session 26 / 75 AMA-01R Hardware Design Guide In LTE mode, the AMA-01R emits RF signals continuously during transmission. Therefore, special attention must be paid on how to dissipate the heat generated. The AMA-01R is designed to conduct the heat flow from the module ICs towards the bottom of the PCB across GND metal layers The generated heat is mostly conducted to the grounding plane under the AMA-

01R module. The application board should be properly designed to dissipate this heat. The design of the application board must ensure that the area under the AMA-

01R module is as large as possible. Make sure the AMA-01R is mounted on the large ground area of application board and provides plenty of ground vias to dissipate heat. Note : Make PCB design in order to have the best connection of GND pads to large surfaces of copper. Note : The average consumption during transmission depends on the power level at which the device is requested to transmit over the network. Therefore, the average current consumption varies significantly. Note : The thermal design for the power supply should be made keeping an average consumption at maximum transmission level during calls of LTE/UMTS/GPRS. 4.3.3. Power Supply PCB Layout Guidelines As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the performance of the power supply The Bypass low ESR capacitor must be placed close to the ATEL AMA-01R power input pads or, in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to 27 / 75 AMA-01R Hardware Design Guide The protection diode must be placed close to the input connector where the power source is drained. The PCB traces from the input connector to the power regulator IC must be wide enough to ensure that no voltage drops occur during the 2A current peaks. Note that this is not done in order to avoid RF power loss but to avoid voltage drops on the power line at the current peaks frequency of 216 Hz which will be reflected on all the components connected to that supply (also introducing the background noise at the burst base frequency). The PCB traces to AMA-01R and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is necessary for the same above-mentioned reasons. Try to keep these traces as short as possible. To reduce the EMI due to switching, it is important to keep the mesh involved very small; therefore the input capacitor, the output diode (if not embodied in the IC) and the regulator shall form a very small loop.This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually). The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier. The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables. The insertion of EMI filter on VBATT pins is suggested in those designs where antenna is placed close to battery or supply lines. A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose. 28 / 75 AMA-01R Hardware Design Guide Figure 5: RecommendedCircuit 4.3.4. Bypass Capacitor on Power Supplies When a sudden voltage step to or cut from the power supplies is asserted, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to fail or to malfunction. Bypass capacitors are needed to alleviate this behaviour. The behaviour may appear for different applications. Customers must pay special attention to this issue when they design their application board. The length and width of the power lines must be considered carefully, and the capacitance of the capacitors must be selected accordingly. The capacitor will also avoid power supplies ripple and the switching noise caused in TDMA systems, such as GSM. In particular, a suitable bypass capacitor must be mounted on the following lines on the application board:

VBATT & VBATT_PA (M1, M2, N1, N2, P1, P2) USB_VBUS (Pad A13) Recommended values are:

100uF for both VBATT and VBATT_PA together 4.7uF for USB_VBUS (including the 1uF capacitor inside the module) However, customers should consider that the capacitance mainly depends on the conditions of their application board. 29 / 75 AMA-01R Hardware Design Guide 4.4 VAUX Power Output A regulated power supply output is provided to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shutdown. The operating range characteristics of the supply are as follows:

Item Min Typical Max Output voltage Output current Output bypass capacitor

(inside the module)

1.8V

2.2uF Table 14:Operating range characteristics ofthe supply 4.5. RTC Supply

50mA The RTC within the AMA-01R module does not have a dedicated RTC supply pin. The RTC block is supplied by the VBATT supply. When the VBATT is removed, RTC time is lost and RTC stopped; if you need to maintain the time and RTC running, VBATT must be supplied continuously. In Power OFF mode, the average current consumption is ~ 130uA. 30 / 75 AMA-01R Hardware Design Guide 5. DIGITAL SECTION 5.1. Logic Levels Unless otherwise specified, all the interface circuits of the AMA-01R are 1.8V CMOS logic. Only few specific interfaces (such as USIM) are capable of dual voltage I/O. The following tables show the logic level specifications used in the AMA-01R interface circuits. 1.8V Pads - Absolute Ratings Parameter Min Max Input level on any digital when on Input voltage on analog pins when on

-0.3V

-0.3V

+2.2V

+2.2 V Table 15: Absolute Maximum Ratings - Not Functional 5.1.1. 1.8V Standard GPIOs Pad Parameter Min TYP Max Unit Comment VIH VIL VOH IIL IIH RPU RPD i Input high level Input low level VCC*0.7 1.8V VCC+0.2

-0.3 0V 0.3*VCC Output high level VCC-0.2V Output low level Low-level input leakage current High-level input leakage current Pull-up resistance Pull-down resistance Input capacitance

55 51

79 87 0.2V 10 10 121 169 5

[V]

[V]

[V]

[V]

[uA]

[uA]

[k]

[k]

[pF]

No pull-

up No pull-

down Table 16:Operating Range Interface Levels(1.8VCMOS) 5.1.2. 1.8V SIM Card Pads Pad Parameter Min TYP Max Unit Comment VIH VIL Input high level Input low level VCC*0.7 1.8V VCC+0.2

-0.3V 0V 0.43V

[V]

[V]

31 / 75 AMA-01R Hardware Design Guide Pad Parameter Min TYP Max Unit Comment VOH Output high level 1.35V 1.8V 1.875V Output low level 0V 0V 0.2V IIL IIH RPU RPD i Low-level input leakage current High-level input leakage current

Pull-up resistance Pull-down resistance Input capacitance 10 10 5 45 45

[V]

[V]

[uA]

No pull-up No pull-

down

[uA]

[k]

[k]

[pF]

Table 17:Operating Range SIM Pads Working at 1.8V 5.1.3. Dual Voltage Pads - Absolute Maximum Ratings Parameter Min Max Input level on any digital when on Input voltage on analog when on

-0.3V

-0.3V

+3.6V

+3.6 V Table 18: Absolute Maximum Ratings - Not Functional 5.1.4. SIM Card Pads @3.3V Pad Parameter Min TYP Max Unit Comment VIH VIL Input high level Input low level VOH Output high level Output low level IIL IIH RPU RPD i Low-level input leakage current High-level input leakage current Pull-up resistance Pull-down resistance Input capacitance 3.3

(VCC) VCC+0

.3 0V 0.8 2

-0.3 2.4 0.4V 10 10 72 27 5 26 27 47 54

[V]

[V]

[V]

[V]

[uA]

No pull-up

[uA]

No pull-down

[k]

[k]

[pF]

Table 19:Operating Range For SIM Pads Operating at3.3V 32 / 75 AMA-01R Hardware Design Guide ON_OFF_N pad must be asserted low for more than 3.2 seconds and less than 6.8 seconds, and then released. The maximum current that can be drained from the ON/OFF # pad is 0.12 mA. This pin is pulled up internally; customers should expect to see VBATT at the output. Figure 6 illustrates a simple circuit to power on the module using an inverted buffer output. Figure 6: Power-on Circuit; illustrates a simple circuit to power on the module using an inverted buffer output. Note : Do not use any pull up resistor on the ON_OFF_N line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the AMA-01R power regulator and improper power on/off of the module. The line ON_OFF_N must be connected only in open collector or open drain configuration. Note : To avoid back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of AMA-

01R when the module is powered off or during an ON-OFF transition. Note :: To check if the device has just powered on, the hardware line PWRMON should be monitored. After turning on the AMA-01R module, a predefined internal boot sequence performs the HW and SW initialization of the module, which takes some time to complete. During this process, the AMA-01R is not accessible. As shown in Figure 7, the AMA-01R becomes operational at least 15 seconds after ON_OFF is asserted. 33 / 75 AMA-01R Hardware Design Guide the Note: During Initialization state, AT commands are not available. The DTE host must wait for the Activation state prior to communicating with the AMA-01R. Figure 7: Power ON Sequence Note : SW_RDY signal functions as SW_RDY) i s availab le o n GPIO_8

(by defa ult GPIO _8 Note : To check whether the AMA-01R is fully operational, monitor the SW_RDY hardware line. When SW_RDY goes high, the module is fully operational and is ready to accept AT commands. initialization of the AMA-01R, Note : During the SW the SW configures all pads and interfaces in the desired status. When PWRMON goes high, this indicates that the initialization of all I/O pads is completed. Note : Do not use any pull-up resistor on the ON_OFF_N line as it is pulled up internally. Using a pull-up resistor may cause latch-up problems on the AMA-01R power regulator and improper power on/off of the module. The ON_OFF_N line must be connected only in an open- collector configuration 34 / 75 AMA-01R Hardware Design Guide Note : Active low signals are labeled with a name that ends with "#"

or with _N Note : To avoid back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of AMA-01R when the module is powered off or during an ON-OFF transition. 5.2. Power Off Turning off the device can be done in the following different ways :

Shutdown by software using AT#SHDN software command Hardware shutdown using ON_OFF_N pad Unconditional shutdown using HW_SHUTDOWN_N When the device is shutdown by a software command or a hardware shutdown, it sends a detach disconnection request to the network, informing the network that the device will no longer be reachable. if the device has turned off, monitor the Note: To check PWRMON hardware line. When PWRMON goes low, this indicates that the device is turned off. Note : To avoid back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of AMA-

01R when the module is powered off or during an ON-OFF transition. Warning : Not following the recommended shut-down procedures might damage the device and consequently void the warranty. 5.2.1. Shutdown by Software Command The AMA-01R module can be shut down via a software command. When a shutdown command is sent, the AMA-01R enters the Finalization state and at the end of the finalization process shuts down PWRMON. 35 / 75 AMA-01R Hardware Design Guide Usually, it will take more than 2 seconds from sending a shutdown command until a complete shutdown is achieved. The DTE host should monitor the PWRMON status to observe the actual power-off. Figure 8: Shutdown by Software Command Note : To check if the device is turned off, monitor the PWRMON hardware line. When PWRMON goes down, the device has powered off. 5.2.2. Hardware Shutdown To turn off the AMA-01R module, the ON_OFF_N pad must be asserted low for more than 1.7 seconds and less than 6.8 seconds, and then released. Use the same circuitry and timing for power-on. When the hold time of ON/OFF# is more than 1.7 seconds, the AMA-01R enters the Finalization state and finally shuts down PWRMON . The duration of the Finalization may vary depending on the current situation of the module, so it is not possible to define a value. Usually, it will take more than 3 seconds issuing a shutdown command until a complete shutdown is achieved. The DTE host should monitor the PWRMON status to observe the actual power-off. To turn off the AMA-01R module, the ON_OFF_N pad must be asserted low for more than 1.7 seconds and less than 6.8 seconds, and then released. 36 / 75 AMA-01R Hardware Design Guide Figure 9: Hardware Shutdown Note : To check whether the device is turned off, monitor the PWRMON hardware line. When PWRMON goes down, the device has powered off. 5.2.3. Unconditional Shutdown To unconditionally shut down the AMA-01R module, the HW_SHUTDOWN_N pad must be tied low for at least 0.6 milliseconds and then released. Figure 10shows a simple circuit for applying an unconditional shutdown. Figure 10: Circuit for Unconditional Hardware Shutdown 37 / 75 AMA-01R Hardware Design Guide Figure 11: Power down timing using HW_SHUTDOWN_N Note : Recommended values are as follows: R2 = 47k , R1 = 10k for a 3V signal level. Note : Do not use any pull-up resistor on the HW_SHUTDOWN_N line or any digital output of the totem pole. Using a pull-up resistor may cause latch-up problems on the AMA-01R power regulator and improper module functioning. The HW_SHUTDOWN_N line must be connected only in an open-collector configuration. Note : The Unconditional Hardware Shutdown must always be implemented on the boards, but the software must use it only as an emergency exit procedure, and not as a normal power-off operation. 38 / 75 AMA-01R Hardware Design Guide 5.3. Communication Ports 5.3.1. USB Port The AMA-01R module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480Mbits/sec). It can also operate with USB full-

speed hosts (12Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers, as well as for diagnostic monitoring and firmware update. The USB port is typically the main interface between the AMA-01R module and OEM hardware. Note : The USB_D+ and USB_D- signals have a clock rate of 480 MHz. The signal traces must be routed carefully. Minimize trace lengths, number of vias, and capacitive loading. The impedance value should be as close as possible to 90 Ohms differential. Table belowlists the USB interface signals. Signal USB_VBUS USB_D+

USB_ID A13 C15 B15 Power and cable detection for the internal USB transceiver. Acceptable input voltage range 2.5V 5.5V @ max 5 mA consumption Minus (-) line of the differential, bi-directional USB signal to/from the peripheral device Plus (+) line of the differential, bi-directional USB signal to/from the peripheral device A14 Not supported, NC internal. FORCED_USB_BOO T F14 FORCED_USB_BOOT Table 20: USB Interface Signals Note : USB_VBUS input power is used internally to detect the USB port and start the enumeration process. It is a power supply pin with a maximum consumption of 5 mA. Do not use pull up or a voltage divider for sourcing this supply 39 / 75 AMA-01R Hardware Design Guide Note : Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least USB signals test points are required as the USB physical communication is needed in the case of SW update. 5.3.2. Serial Ports The serial port is typically a secondary interface between the AMA-01R module and OEM hardware. The following serial ports are available on the module:

Modem Serial Port 1 (Main) Modem Serial Port 2 (Auxiliary) Modem Serial Port 3(DEBUG_LOG) Several serial port configurations can be designed for the OEM hardware. The most common are:

RS232 PC com port Microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) Microcontroller UART @ 3.3V/5V or other voltages different from 1.8V Depending on the type of serial port on the OEM hardware, level translator circuits may be required to make the system operate. The only configuration that does not require level translation is the 1.8V UART. The AMA-01R UART has CMOS levels as described in Section 5.1, Logic Level Specification. 5.3.2.1. Modem Serial Port 1 Signals On the AMA-01R, Serial Port 1 is a +1.8V UART with 7 RS232 signals. It differs from the PC-RS232 in signal polarity (RS232 is reversed) and levels.Table 23 lists the signals of AMA-01R Serial Port 1. RS232 Pin#

1 2 3 Signal Pad No. Name Usage DCD -

DCD_UART N14 RXD - TX_UART M15 TXD -RX_UART N15 Data Carrier Detect Transmit line

*see Note Receive line

*see Note Output from AMA-01R that indicates carrier presence Output transmit line of AMA-01R UART Input receive line of AMA-01R UART 40 / 75 AMA-01R Hardware Design Guide RS232 Pin#

Signal Pad No. Name Usage 4 5 6 7 8 9 DTR -

DTR_UART GND DSR -

DSR_UART RTS -

RTS_UART CTS -

CTS_UART M14 A2, B13, D4 Data Terminal Ready Input to AMA-01R that controls the DTE READY condition Ground Ground P14 Data Set Ready Output from AMA-01R that indicates that the module is ready L14 Request to Send P15 Clear to Send Input to AMA-01R controlling the Hardware flow control Output from AMA-01R controlling the Hardware flow control Output from AMA-01R indicating the Incoming call condition RI - RI_UART R14 Ring Indicator Table 21: Modem Serial Port 1Signals Note : To avoid back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of AMA-

01R when the module is powered off or during an ON-OFF transition. Note : For minimum implementations, only the TXD, RXD lines need to be connected to the host, but RTS must be either grounded or connected directly to CTS. The other lines can be left open provided a software flow control is implemented. Note : According to V.24, Rx/Tx signal names refer to the application side; therefore, on the AMA-01R side, these signal are in the opposite direction: TXD from the application side will be connected to the reception line (here named TXD/ RX_UART) of the AMA-01R serial port and vice versa for Rx. Note : The DTR pin is used to control the UART and system sleep Pulling the DTR pin down prevents the UART and the entire module from entering low power mode. DTR can be left floating if not used (DTR is internally pulled high). 41 / 75 AMA-01R Hardware Design Guide PAD Signal I/O Function Type Comment D15 E15 TXD_AUX RXD_AUX O I Auxiliary UART (Tx Data to DTE) Auxiliary UART (Rx Data to DTE) 1.8V 1.8V Table 2 2 : Modem Serial Port2 Signals Note : To avoid back powering it is recommended to prevent any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. 5.3.2.3. Modem Serial Port 3 DEBUG_UART_TXD M6 DEBUG_UART_RXD Table 23: Modem Serial Port3 O I LOG_UART_TXD LOG_UART_RXD 1.8V 1.8V Note : The DEBUG_UART is used as the SW main debug console. Test points must be placed on this interface even if not used. 5.3.2.4. RS232 Level Translation To interface the AMA-01R with a PC COM port or an RS232 (EIA/TIA-232) application, a level translator is required. This level translator must perform the following actions:

Invert the electrical signal in both directions Change the level from 0/1.8V to +15/- 15V The RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing for a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and therefore some sort of level translation is always required. The easiest way to translate the levels and invert the signal is by using a single chip-level translator. There are a multitude of them, which differ in the number of drivers and receivers and in the levels (be sure to get a real RS232 level translator, not a RS485 or other standards). 42 / 75 AMA-01R Hardware Design Guide By convention, the driver is the level translator from the 0- 1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0- 1.8V UART. To translate the whol set of control lines of the UART, the following is required:

2 drivers 2 receivers Warning : The digital input lines, operating at 1.8V CMOS levels, have absolute maximum input voltage of 2.2V. The level translator IC outputs on the module side (i.e. AMA-01R inputs) will cause damage to the module inputs if the level translator is powered with

+3.8V power. Therefore, the level translator IC must be powered from a dedicated +1.8V power supply. As an example, RS232 level adaption circuitry could use a MAXIM transceiver

(MAX218). In this case, the chipset is able to translate directly from 1.8V to the RS232 levels (example on 4 signals only). Figure 12: RS232 Level Adaption Circuitry Example Note : In this case, it is necessary to take into account the length of the lines on the application to avoid problems in the case of high-

speed rates on RS232. The RS232 serial port lines are usually connected to a DB9 connector as shown in the figure below. Signal names and directions are named and defined from the DTE perspective. 43 / 75 AMA-01R Hardware Design Guide Figure 13: RS232 Serial Port Lines Connection Layout 5.3.3. I2C - Inter-integrated Circuit The AMA-01R supports I2C interface on the following pins:

B14 - I2C 3_SCL C12 - I2C 3_SDA The I2C can also be used externally by the end customer application. AMA-01R supports I2C Master Mode only. 5.3.4. General Purpose I/O The general-purpose I/O pads can be configured to act in three different ways:

Input Output Alternative function (internally controlled) Input pads can only be read, reporting digital values (high / low) present on the pad at the time of reading. Output pads can only be written or queried and set values on the pad output. Alternative function pads can be controlled internally by AMA-01R firmware and act according to the implementation. The following GPIOs are always available as a primary function on the AMA-01R. PAD Signal I/O Function Type Note C8 C9 GPIO_ 1 GPIO_2 C10 GPIO_3 C11 GPIO_4 B14 GPIO_5 Configurable GPIO CMOS 1.8V Configurable GPIO CMOS 1.8V Configurable GPIO CMOS 1.8V Configurable GPIO CMOS 1.8V Configurable GPIO CMOS 1.8V I/

O I/

O I/

O I/

O I/

O Can be used to I2C2_SCL Can be used to I2C2_SDA Can be used to I2C3_SCL 44 / 75 AMA-01R Hardware Design Guide PAD Signal I/O Function Type Note C12 GPIO_6 C13 GPIO_7 K15 GPIO_8 L15 GPIO_9 G15 GPIO_ 10 I/

O I/

O I/

O I/

O I/

O Table 24: Primary GPIOs Configurable GPIO CMOS 1.8V Can be used to I2C3_SDA Configurable GPIO CMOS 1.8V Configurable GPIO CMOS 1.8V Configurable GPIO CMOS 1.8V Configurable GPIO CMOS 1.8V 5.3.5. Using a GPIO Pad as Input GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device is connected to the GPIO input, the pad has interface levels other than 1.8V CMOS. It can be buffered with an open collector transistor with a 10 k pull-up resistor to 1.8V. 5.3.6. Using a GPIO Pad as an Interrupt / Wakeup Source GPIO pads that are used as input can also be used as an interrupt source for the software. In general, all GPIO pads can also be used as interrupts. However, not all GPIOs can be used as a wakeup source of the module (wakeup from sleep). Only the following GPIOs can be used to wake up the system from sleep:

GPIO_2 GPIO_7 GPIO_9 GPIO_ 10 5.3.7. Using a GPIO Pad as Output GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output, and therefore the pull-

up resistor can be omitted. 45 / 75 AMA-01R Hardware Design Guide Figure 14: GPIO Output Pad Equivalent Circuit 5.4 Indication of Network Service Availability The STAT_LED pin status shows information on the network service availability and call status. In the AMA-01R module, the STAT_LED usually needs an external transistor to drive an external LED. The STAT_LED does not have a dedicated pin. The STAT_LED functionality is available on GPIO_ 1 pin (by default GPIO_ 1 functions as STAT_LED) See the AT Command User Guide for details on the AT#SLED section. LED Status Device Status Permanently off Device off Blinking Permanently on Blinking 1s on and 2s off Registered in idle Blinking time depends on network condition in order to minimize power consumption Registered in idle with power saving Not registered Table 25: NetworkService Availability Indication 46 / 75 AMA-01R Hardware Design Guide Figure 15: Status LED Circuit Example 5.5. Indication of Software Ready The SW_RDY signal provides indication about the module ability to receive commands. As long as the SW_RDY is asserted low, it indicates that the AMA-01R has not finished booting yet. Once the SW_RDY is asserted high, it indicates that the AMA-01R is ready to receive commands. The SW_RDY does not have a dedicated pin. The SW_RDY functionality is available on GPIO_8 pin (by default GPIO_8 functions as SW_RDY). 5.6. External SIM Holder This section presents the recommended schematics for the design of SIM interfaces on the application boards. The AMA-01R supports two external SIM interfaces. 5.7.1. SIM Schematic Example Figure 16shows in particular how to design the application side and what values to assign to the components. 47 / 75 AMA-01R Hardware Design Guide Figure 16: SIM Schematics Note: The resistor value on SIMIO pulled up to SIMVCC must be defined to comply with the 3GPP specification for USIM electrical testing. The AMA-01R module contains an internal pull-up resistor of 4.7K on SIMIO. However, the un-mounted R1 option in the application can be used to tune SIMIO timing if required. Table 26lists the values of C1 to be adopted with the AMA-01R product:

Product P/N C1 Range (nF) 1F+0.1F Table 26: SIM Interface C1Range 5.7 ADC Converter 5.7.1 Description The AMA-01R module provides two on-board Analog to Digital converters. Each ADC reads the voltage level applied to the relevant pin, the accuracy is about [email protected]. Item Min Max Units Input voltage range Accuracy Table 27: ADC Parameters

-0.3

1.8V 20mV Volt mV 5.7.2 Using the ADC Converter An AT command is available to use the ADC function. 48 / 75 AMA-01R Hardware Design Guide 5.8 Debug of the AMA-01R Module in Production To test and debug the mounting of the AMA-01R module, it is highly recommended to add several test pads on the application board design for the following purposes:

Check the connection between the AMA-01R itself and the application Test the performance of the module by connecting it with an external computer Depending on the customers application, these test pads include, but are not limited to the following signals:

TXD RXD ON/OFF HW_SHUTDOWN_N GND VBATT DEBUG_UART_TXD DEBUG_UART_RXD USB_VBUS USB_D+

USB_D-

FORCED_USB_BOOT In addition, the following signals are also recommended (but not mandatory:

SW_RDY PWRMON GPIO_ 1 (STAT_LED) GPIO_8 (SW_RDY) 49 / 75 AMA-01R Hardware Design Guide 6.4. Antenna Requirements The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the general performance of the product, so read carefully and follow the requirements and the guidelines for a proper design. The antenna and antenna transmission line on PCB for a ATEL AMA-01R device shall fulfil the following requirements:

Item Frequency range Bandwidth Impedance Input power Value Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) See table 33: Bandwidth 50 ohm GSM: > 33dBm Average power LTE: > 23dBm Average power WCDMA: > 23dBm Average power VSWR absolute max

= 10:1 (limit to avoid permanent damage) VSWR recommended

= 2:1 (limit to fulfill all regulatory requirements) Table 34: Antenna and Antenna transmission line on PC 50 / 75 AMA-01R Hardware Design Guide 6.6. PCB Design Guidelines When using the AMA-01R, since there's no antenna connector on the module, the antenna must be connected to the AMA-01R antenna pad (K1) by means of a transmission line implemented on the PCB. This transmission line shall fulfil the following requirements:

Item Value Characteristic Impedance 50 ohm (+- 10%) Max Attenuation 0.3 dB Coupling Ground Plane Coupling with other signals shall be avoided Cold End (Ground Plane) of antenna shall be equipotential to the AMA-

01R ground pins Table 36: Antenna Pad Requirements The transmission line should be designed according to the following guidelines:

make sure that the transmission lines characteristic impedance is 50 ohm;

keep the antenna waveguide on the PCB as short as possible, since the antenna line loss shall be less than about 0,3 dB;

the geometry of the line must have uniform characteristics, constant cross section, avoid meanders and abrupt curves;

any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar Waveguide...) can be used to implement the printed transmission line relating to the antenna;

51 / 75 AMA-01R Hardware Design Guide possible to the related canonical model;

keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line;

it is advisable to surround (on both sides) the PCB transmission line with Ground, avoiding that other signal tracks face directly the antenna line track;

avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;

the ground surrounding the antenna line on the PCB must be tightly connected to the main Ground Plane through holes (at east once every 2mm), placed near the edges of the ground facing the line track;

place EM noisy devices as far as possible from AMA-01R antenna line;

keep the antenna line far away from the AMA-01R power supply lines;

if EM noisy devices (such as fast switching ICs, LCD and so on) are present on the PCB hosting the AMA-01R, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surrounding it with the Ground planes, or shield it with a metal frame cover;

if EM noisy devices are not present around the line, the use of geometries such as Microstrip or Grounded Coplanar Waveguide is preferable, since they typically ensure less attenuation if compared to a Stripline of the same length. The following image shows the suggested layout for the Antenna pad connection:

Figure 17: Layout for the Antenna padconnection 52 / 75 AMA-01R Hardware Design Guide The interface board is made on a FR4, 4-layers PCB. The substrate material is characterized by relative permittivity r = 4.6 0.4 @ 1 GHz, TanD= 0.019 0.026 @ 1 GHz. A characteristic impedance of nearly 50 is achieved using a track width = 1.1 mm, clearance from a coplanar ground plane = 0.3 mm each side. The line uses the reference ground plane on layer 3, while copper is removed from layer 2 below the line. The height of the trace above ground plane is 1.335 mm. The calculated characteristic impedance is 51.6 , the estimated line loss is less than 0.1 dB. The line geometry is shown below:

Figure 18: Line Geometry 6.6.1.2. Transmission Line Measurements An HP8753E VNA (Full-2-port calibration) was used in this measurement session. A calibrated coaxial cable was soldered to the pad corresponding to RF output; a SMA connector was soldered to the board in order to characterize the losses of the 53 / 75 AMA-01R Hardware Design Guide Return Loss plot of line under test is shown below:

Figure 19: Return Loss plot ofline under test The input impedance of the line (in Smith Chart format, once the line has been terminated to 50 load) is shown in the following figure:

Figure 20: Line input impedance 54 / 75 AMA-01R Hardware Design Guide Figure 21: Insertion Loss ofG-CPW line plus SMA connector 6.6.1.3. Antenna Installation Guidelines Install the antenna in a place covered by the LTE signal. The Antenna must not be installed inside metal cases. The Antenna must be installed according Antenna manufacturer instructions. The Antenna integration should optimize the Radiation Efficiency. Efficiency values

> 50% are recommended on all frequency bands. The Antenna integration should not perturb the radiation pattern described in the documentation of the Antenna manufacturer. It is preferable to get an omnidirectional radiation pattern. The Antenna Gain must not exceed the values indicated in regulatory requirements, where applicable, in order to meet the related EIRP limitations. The Typical antenna Gain in most M2M applications does not exceed 2.1dBi. 55 / 75 AMA-01R Hardware Design Guide 7. AUDIO SECTION 7.1. Analog Front-End 7.1.1. MIC Connection The bias for the microphone should be as clean as possible; the first connection (single ended) is preferable since the Vmic noise and the background noise are input as common mode and therefore rejected. This sounds strange; usually the connection to be used to reject the common mode is the balanced one. In this situation we must remember that the microphone is a sound to current transducer, therefore the resistor is the current to tension transducer, so finally the resistor feeds the input in a balanced way even if the configuration, from the microphone point of view, seems to be un-balanced. Figure 22: MIC Connection single ended However, if a "balanced way" is desired, much more care must be paid to Vmic noise and background noise; also the 33pF- 100Ohm-33pF -RF filter must be doubled (one each wire). Vmic 1K10K

ADC INPUT

ATEL MODULE 100n MIC+

100 33pF 33pF MIC-

GND 100n 100 33pF 33pF 1K Figure 23: MIC Connection balance 56 / 75 AMA-01R Hardware Design Guide Tip: Since the J-FET transistor inside the microphone acts as RF detector amplifier, ask your supplier for a microphone with anti-EMI capacitor (usually a 33pF or a 10pF capacitor placed across the output terminals inside the case). 7.1.2. EAR Connection DAC OUTPUT

EAR-

ATEL MODULE Figure 24: EAR Connection The audio output of the AMA-01R is balanced, this is helpful to double the level and to reject common mode (click and pop are common modes and therefore rejected);

The power of the analog output is 37mW, its too low to directly manage a loudspeaker with electrical impedance of at least 8Ohm ,so an external amplifier is needed. The circuit of the an external amplifier need to be designed according the datasheet of the external amplifier. Tip: to obtain the maximum audio level at a given output voltage level

(dBspl/Vrms), the following breaking through procedure can be used. Have the loudspeaker as close as you can to the listener (this also simplify the echo cancelling); choose the loudspeaker with the highest sensitivity (dBspl per W); choose loudspeakers with the impedance close to the limit (ex: 16 or 8 Ohm). 57 / 75 AMA-01R Hardware Design Guide 8. MECHANICAL DESIGN 8.1. General The AMA-01R module is designed comply with a standard lead-free soldering process. 8.2. Finishing & Dimensions The below figure shows the mechanical dimensions of the AMA-01R module. Figure 25: AMA-01R Mechanical Dimensions(Bottom View) 58 / 75 AMA-01R Hardware Design Guide 9.2. PCB Pad Design In PCB design, the solder pads can be defined as either Solder Mask Defined (SMD) or Non-Solder Mask Defined (NSMD). The difference between these two solder mask pad definitions, is in the closeness of the solder mask to the metal pad. In SMD pads, the solder mask opening is smaller than the metal pad and overlaps the metal on all sides. The solder mask opening defines the solderable area of the pad. In NSMD pads, the solder mask opening is larger than the metal pad and does not overlap the metal. The metal edge defines the solderable area of the pad (see Figure below). Since the metal etching process in PCB manufacture, has significantly tighter alignment and etching tolerances than the alignment registration of the solder masking process, which, a more accurate solder pad land pattern can be obtained with NSMD pads. In addition, with SMD pads, the solder mask that overlaps the metal pad introduces additional height above the metal surface that may affect solder joint adhesion and reliability. Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Copper Pad Solder Mask SMD NSMD

(Solder Mask Defined)

(Non Solder Mask Defined) Figure 31: PCBsolder padrecommendations 59 / 75 AMA-01R Hardware Design Guide Inhibit area for micro-via Figure 32: Paddimensions recommendations Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces:

Finish Ni /

Immersion Au Layer Thickness (um) Properties 3 7 / 0.05 0.15 good solder ability protection, high shear force values Table 37: Recommendations for PCB padsurfaces The PCB must be able to resist the higher temperatures which are occurring during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better than compared to the lead-free solder paste. It is not necessary to panel the applications PCB, however in that case it is recommended to use milled contours and predrilled board breakouts; scoring or v-cut solutions are not recommended. 9.4. Thermal Performance FR4 is one of the most commonly used PCB materials, it is a flame retardant composite material, composed by fiberglass-reinforced and epoxy laminate. One of the features of the FR4, is to have a very low thermal conductivity. An inexpensive way to improve thermal 60 / 75 AMA-01R Hardware Design Guide way that a PTH or via is used for electrical interconnections between layers. A series of plated through-hole thermal vias, should be located in the GND area underneath ATEL module of the PCB to provide a thermal connection from the PCB GND to additional metal layers of the PCB. The application PCB layout should include plated through-hole thermal vias for efficient heat dissipation from the ATEL module into the PCB. One of the following thermal via types should be used:

Open plated through-hole vias that will provide lower PCB fabrication costs but may fill with solder. Plugged and capped plated through-hole vias that will provide higher PCB fabrication costs but will not fill with solder. ATEL recommends creating areas of 10 mil (0.254-mm) vias arranged on a 25 mil

(0.635- mm) rectilinear matrix. The reason for this choice is the combination of to several PCB manufacturers, 10-mil holes and 25-mil spacing are reasonable and repeatable production choice. cost, performance and manufacturability. According A uniform metal plating thickness on the PCB will ensure reliable, high ATEL module solder assembly yield. 9.5. Stencil A silk-screen process will be required for the deposition of solder paste to the PCB, for reflow of the ATEL module to the PCB. The silk-screen process requires the use of a metal stencil based on an opening where the solder paste is transferred through the openings on the solder pads of the application PCB. To minimize solder voids and ensure maximum electrical and thermal connectivity of the module to the PCB, large pads, solder volume, and solder straining must be considered in the stencil design. The design and fabrication of the stencil determines the quality of the solder paste deposition onto the PCB and the resulting solder joint after reflow. The primary stencil parameters are aperture size, thickness, and fabrication method. The stencil should be made from stainless steel and the apertures layout can be the same of the recommended footprint (1:1). The recommended thickness shall be 127 um (5 mil). A stencil thickness of 152 m (6 mil) can be used as well. 61 / 75 AMA-01R Hardware Design Guide For leadfree applications, a Sn-Ag (SA) or Sn-Ag-Cu (SAC) solder paste can be used. Any Type 3 solder paste that is either water-soluble or no clean is acceptable. We recommend using only no clean solder paste in order to avoid the cleaning of the modules after assembly. 9.6. Solder Reflow Recommended solder reflow profile :

Figure 33: Recommendedsolder reflow profile Profile Feature Pb-Free Assembly Free Average rate (TL to TP) 3C/second max Preheat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (min to max) (ts) Tsmax to TL Rate Time maintained above:

Temperature (TL) Time (tL) 150C 200C 60- 180 seconds 3C/second max 217C 60- 150 seconds Peak Temperature (Tp) 245 +0/-5C Time within 5C of actual Peak Temperature Rate Time 25C to Peak 10-30 seconds 6C/second max. 8 minutes max. Table 38: Profile feature recommendations 62 / 75 AMA-01R Hardware Design Guide AMA-02R Hardware Design Guide Note : All temperatures refer to topside of the package, measured on the package body surface Warning : THE 01R PROCESS ONLY. MODULE WITHSTANDS ONE REFLOW Warning : The above solder reflow profile represents the typical SAC reflow limits and does not guarantee adequate adherence of the module to the customer application throughout the temperature range. Customer must optimize the reflow profile depending on the overall system taking into account such factors as thermal mass and warpage. 9.7. Inspection An inspection of the solder joint between the solder pads of the ATEL module and the application PCB should be performed. The best visual inspection tool for inspection of the ATEL module solder joints on the PCB is a transmission X-ray, which can identify defects such as solder bridging, shorts, opens, and large voids (Note: small voids in large solder joints are not detrimental to the reliability of the solder joint). 63 / 75 AMA-01R Hardware Design Guide 10.1 Tray The AMA-01R modules are packaged on trays that can be used in SMT processes for pick & place handling.The first Marketing and Engineering samples of the AMA-01R series will be shipped with the current packaging of the AMA-01R modules (on trays of 20 pieces each). The mass production units of AMA-01R will be shipped according to the following drawings:

Figure 34: Tray packaging 64 / 75 AMA-01R Hardware Design Guide Figure 35: Tray dimensions 65 / 75 AMA-01R Hardware Design Guide 10.2 Reel The AMA-01R can be packaged on reels of 200 each. See figure for module positioning into the carrier. Figure 3 6 : Module positioning into the carrier 10.3 Carrier Tape Detail Figure 37: Carrier Tape Detail Page 76 of 88 2024- 02- 27 Not Subject to NDA 66 / 75 AMA-01R Hardware Design Guide Figure 38: Reeldetail Figure 39: Detail 67 / 75 AMA-01R Hardware Design Guide Figure 40: Packaging detail 10.5. Moisture Sensitivity The AMA-01R is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions:

a) Calculated shelf life in sealed bag: 12 months at <40C and <90% relative humidity (RH). b) Environmental condition during the production: 30C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) IPC/JEDEC J-STD-033D paragraph 5.2 is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more. 68 / 75 AMA-01R Hardware Design Guide Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 DCS 1800 GSM 850 EGSM 900 1710 ~ 1785 1805 ~ 1880 512 ~ 885 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 890 ~ 915 935 ~ 960 0 ~ 124 880 ~ 890 925 ~ 935 975 ~ 1023 LTE 2100 B1 1920 ~ 1980 2110 ~ 2170 LTE 1900 B2 1850 ~ 1910 1930 ~ 1990 LTE 1800 B3 1710 ~ 1785 1805 ~ 1880 LTE AWS B4 1710 ~ 1755 2110 ~ 2155 LTE 850 B5 824 ~ 849 869 ~ 894 LTE 900 B8 880 ~ 915 925 ~ 960 LTE 800 B20 832 ~ 862 791 ~ 821 LTE 700 B28A 703 ~ 733 758 ~ 788 LTE 700 B28B 703 ~ 748 758 ~ 803 Table 40: RFBands Characteristics Tx: 18000 ~

18599 Rx: 0

~ 599 Tx: 18600 ~

19199 Rx:

600 ~ 1199 Tx: 19200 ~

19949 Rx:

1200 ~ 1949 Tx: 19950 ~

20399 Rx:

1950 ~ 2399 Tx: 20400 ~

20649 Rx:

2400 ~ 2649 Tx: 21450 ~

21799 Rx:

3450 ~ 3799 Tx: 24150 ~

24449 Rx:

6150 ~ 6449 Tx: 27210 ~

27510 Rx:

9210 ~ 9510 Tx: 27210 ~

27659 Rx:

9210 ~ 9659 80 MHz 95 MHz 45 MHz 45 MHz 45 MHz 190 MHz 80 MHz 95 MHz 400 MHz 45 MHz 45 MHz

-41 MHz 55 MHz 55 MHz 69 / 75 AMA-01R Hardware Design Guide 11.1. Copyrights and Other Notices SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE Although reasonable efforts have been made to ensure the accuracy of this document, ATEL assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein. The information contained in this document has been carefully checked and is believed to be reliable. ATEL reserves the right to make changes to any of the products described herein, to revise it and to make changes from time to time without any obligation to notify anyone of such revisions or changes. ATEL does not assume any liability arising from the application or use of any product, software, or circuit described herein;

neither does it convey license under its patent rights or the rights of others. This document may contain references or information about ATELs products

(machines and programs), or services that are not announced in your country. Such references or information do not necessarily mean that ATEL intends to announce such ATEL products, programming, or services in your country. 11.1.1. Copyrights This instruction manual and the ATEL products described herein may include or describe ATEL copyrighted material, such as computer programs stored in semiconductor memories or other media. The laws in Italy and in other countries reserve to ATEL and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any of ATELs or its licensors copyrighted material contained herein or described in this instruction manual, shall not be copied, reproduced, distributed, merged or modified in any way without the express written permission of the owner. Furthermore, the purchase of ATEL products shall not be deemed to grant in any way, neither directly nor by implication, or estoppel, any license. 11.1.2. Computer Software Copyrights ATEL and the Third Party supplied Software (SW) products, described in this instruction manual may include ATELs and other Third Partys copyrighted computer programs stored in semiconductor memories or other media. The laws in Italy and in other countries reserve to ATEL and other Third Party, SW exclusive rights for copyrighted 70 / 75 AMA-01R Hardware Design Guide programs contained in ATELs products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being ATEL or the Third Party software supplier. Furthermore, the purchase of ATEL products shall not be deemed to grant either directly or by implication, estoppel, or in any other way, any license under the copyrights, patents or patent applications of ATEL or other Third Party supplied SW, except for the normal non-exclusive, royalty free license to use arising by operation of law in the sale of a product. 11.2. Usage and Disclosure Restrictions 11.2.1. License Agreements The software described in this document is owned by ATEL and its licensors. It is furnished by express license agreement only and shall be used exclusively in accordance with the terms of such agreement. 11.2.2. Copyrighted Materials The Software and the documentation are copyrighted materials. Making unauthorized copies is prohibited by the law. The software or the documentation shall not be reproduced, transmitted, transcribed, even partially, nor stored in a retrieval system, nor translated into any language or computer language, in any form or by any means, without prior written permission of ATEL. 11.2.3. High Risk Materials Components, units, or third-party goods used in the making of the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: operations of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). ATEL and its supplier(s) specifically disclaim any expressed or implied warranty of fitness eligibility for such High Risk Activities. 71 / 75 AMA-01R Hardware Design Guide or service names are property of their respective owners. 11.2.4. Third Party Rights The software may include Third Partys software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License, shall apply to the Third Party Rights software as well. ATEL HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESSED OR IMPLIED FROM ANY THIRD PARTY REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY OTHER CODES), AND THE USE OF ANY OR ALL OTHER CODES IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE. NO THIRD PARTY LICENSORS OF OTHER CODES MUST BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES

(INCLUDING WITHOUT LIMITATION LOST OF PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODES OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. 11.2.5. Waiver of Liability IN NO EVENT WILL ATEL AND ITS AFFILIATES BE LIABLE FOR AY DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY INDIRECT DAMAGE OF ANY KIND WHATSOEVER, INCLUDING BUT NOT LIMITED TO REIMBURSEMENT OF COSTS, COMPENSATION OF ANY DAMAGE, LOSS OF PRODUCTION, LOSS OF PROFIT, LOSS OF USE, LOSS OF BUSINESS, LOSS OF DATA OR REVENUE, WHETHER OR NOT THE POSSIBILITY OF SUCH DAMAGES COULD HAVE BEEN REASONABLY FORESEEN, CONNECTD IN ANY WAY TO THE USE OF THE PRODUCT/S OR TO THE INFORMATION CONTAINED IN THE PRESENT DOCUMENTATION, EVEN IF ATEL AND/OR ITS AFFILIATES HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. 72 / 75 AMA-01R Hardware Design Guide 13.3 Safety Recommendations Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where:

it can interfere with other electronic devices, particularly in environments such as hospitals, airports, aircrafts, etc. there is a risk of explosion such as gasoline stations, oil refineries, etc. It is the responsibility of the user to enforce the country regulation and the specific environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible for the functioning of the final product. Therefore, the external components of the module, as well as any project or installation issue, have to be handled with care. Any interference may cause the risk of disturbing the GSM network or external devices or having an impact on the security system. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed carefully in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation. The equipment is intended to be installed in a restricted area location. The equipment must be supplied by an external specific limited power source in compliance with the standard EN 62368- 1:2014. The European Community provides some Directives for the electronic equipment introduced on the market. All of the relevant information is available on the European Community website:

https://ec.europa.eu/growth/sectors/electrical-engineering_en 73 / 75 12. ADC Analog Digital Converter CLK CMOS CS DAC DTE ESR GPIO HS HSDP A HSIC HSUP A I/O MISO MOSI Clock Complementary Metal Oxide Semiconductor Chip Select Digital Analog Converter Data Terminal Equipment Equivalent Series Resistance General Purpose Input Output High Speed High Speed Downlink Packet Access High Speed Inter Chip High Speed Uplink Packet Access Input Output Master Input Slave Output Master Output Slave Input MRDY Master Ready PCB Printed Circuit Board SIM SRDY SIM TTSC SRDY SIM UART SRDY SIM USB UART VNA SIM USB UART SIM UART SIM UART UART UART UART Real Time Clock Subscriber Identification Module Slave Ready ATEL Technical Support Centre Universal Asynchronous Receiver Transmitter Universal Serial Bus Vector Network Analyzer Voltage Standing Wave Radio 74 / 75 FCC Certification Requirements According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-

based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XYO-AMA01R. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

GSM850/WCDMA Band V/ LTE Band 5: 3.53dBi GSM1900/WCDMA Band II/ LTE Band 2: 3.65dBi LTE Band 4: 3.83dBi LTE Band 7: 2.37dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: FCC ID: XYO-AMA01R. or Contains FCC ID: FCC ID: XYO-AMA01R. must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. 75 / 75

Asiatelco Technologies Co. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2024/2/28 FCC ID: XYO-AMA01R Ref: Attestation Statements Part 2.911(d)(5)(i) Filing Positioning Universal Inc certifies that the equipment for which authorization is sought is notcovered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing Positioning Universal Inc certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincerely, Signature Print name: Ella Chen Rev 1/26/2023

Asiatelco Technologies Co. Request for Confidentiality Date: _2024-2-28_ Subject: Confidentiality Request for: _ FCC ID: XYO-AMA01R __ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent Permanent Permanent*

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Schematics Tune-Up Procedure Test Setup Photos Users Manual

*Note: ______(Insert Explanation as Necessary)______ _ Asiatelco Technologies Co. _ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

Ella Chen

(Signature/Title2)

(Print name)

Asiatelco Technologies Co. POWER OF ATTORNEY DATE: 2024-2-28 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Yu Hongmei on our behalf, to apply to FCC on our equipment for FCC ID:

XYO-AMA01R. Any and all acts carried out by TA Technology (Shanghai) Co., Ltd. / Yu Hongmei on our behalf shall have the same effect as acts of our own. Sincerely, Signature Print name: Ella Chen CompanyAsiatelco Technologies Co.

[Asiatelco Technologies Co.]

[#289 Bisheng Road, Building-8, 3F, Zhang jiang Hi-Tech Park, Pudong, Shanghai 201204, China]

Date: [2024/2/28]

Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 FCC ID: [XYO-AMA01R];

FRN: 0032571200 US Agent Attestation Statement / Part 2.911(d)(7)

[Asiatelco Technologies Co.] certifies, that as of [2024/2/28], we have designated Asiatelco Technologies Inc. to accept service of process on our behalf for FCC ID: [XYO-AMA01R].

[Asiatelco Technologies Co.], accepts to maintain an agent of service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-

related administrative or judicial proceeding involving the equipment, whichever is later. Asiatelco Technologies Inc., accepts as of the date of the filing of this application, the obligation of being the designated agent for the purpose of accepting service of process on behalf of [Asiatelco Technologies Co.] for FCC ID: [XYO-AMA01R]. Designated Agent Information:

Company Name: Asiatelco Technologies Inc. FRN: 0029986338 Address: 4611 Teller Avenue, Suite 110, Newport Beach, CA 92660, USA Contact Person: Ella Chen Telephone: 021-51688806 Email: [email protected] Sincerely, Company: [Asiatelco Technologies Co.]

Designated Agent: Asiatelco Technologies Inc. Company Representative: [Ella Chen]

Designated Agent Representative: Ella Chen Signature:

Signature: