802.15.4 ATSAMR21G18-MR210UA DATASHEET PRELIMINARY Description The ATSAMR21G18-MR210UA is a 20mm x 19mm wireless module with a solder mount footprint. It integrates an ATSAMR21G18 IC together with a serial flash and a crypto authentication device. Features ATSAMR21G18 system in package Single-chip ARM Cortex-M0+ based 32-bit Microcontroller Low power 2.4GHz transceiver for IEEE 802.15.4 and ZigBee applications 256KB Flash Maximum Operating Frequency: 48 MHz Automatic transmission modes 128-bit AES crypto engine 32-bit MAC symbol counter Temperature sensor AT45DB041E 4-Mbit DataFlash ATECC508A CryptoAuthentication Device Secure Hardware-based Key Storage Performs High-Speed Public Key Algorithms NIST Standard P256 Elliptic Curve Support SHA-256 Hash Algorithm with HMAC Option Guaranteed Unique 72-bit Serial Number High-quality FIPS Random Number Generator (RNG) Intrusion Latch for External Tamper Switch Single 1.8V - 3.6V supply Radio module with a link budget of 103dBm FCC / ETSI compliant RF front end with harmonic filter Three SERCOM units left for external applications 32.768kHz crystal oscillator High precision 16MHz crystal oscillator 12-bit, 350ksps Analog-to-Digital Converter (ADC) Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 I2C up to 3.4MHz Full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface 17 external GPIO lines One GPIO for ATECC508A intrusion latch Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 2 Table of Contents Description.......................................................................................................................1 Features.......................................................................................................................... 1 1. Integrated Devices and Block Diagram..................................................................... 4 1.1. Module Block Diagram................................................................................................................. 4 1.2. Integrated Peripherals.................................................................................................................. 4 1.3. RF Front End Control................................................................................................................... 5 2. Mechanical Description..............................................................................................7 2.1. Mechanical Dimensions................................................................................................................7 2.2. Footprint and Layout Recommendation....................................................................................... 7 3. I/O Pin Assignment....................................................................................................9 4. Electrical Characteristics..........................................................................................11 4.1. Absolute Maximum Ratings........................................................................................................11 4.2. Recommended Operating Ratings............................................................................................. 11 4.3. Module Performance Data..........................................................................................................11 5. Non-Volatile Memory Information............................................................................ 13 6. Radio Certification................................................................................................... 14 6.1. United States (FCC)................................................................................................................... 14 6.2. Europe (ETSI).............................................................................................................................14 Industry Canada (IC) Compliance Statements...........................................................................15 6.3. 6.4. Approved Antennas....................................................................................................................16 7. Boot Loader............................................................................................................. 17 8. Ordering Information................................................................................................18 9. References.............................................................................................................. 19 10. Revision History.......................................................................................................20 1. Integrated Devices and Block Diagram 1.1. Module Block Diagram Figure 1-1Module Block Diagram AT45DB041E 4-Mbit DataFlash SPI ATECC508 CryptoAuthentication Device SWI ATSAMR21G18-MR210UA ATSAMR21G18 ARM Cortex-M0+
Balun &
Harmonic Filter Antenna Diversity Switch U.Fl 50Ohm U.Fl 50Ohm 1 GPIO 17 GPIO 1.2. Integrated Peripherals 1.2.1. Serial Flash Interconnection Table 1-1Serial Flash Interconnection DataFlash Signal MCU Function MCU Pin Port and SERCOM Configuration PA22 SERCOM5 PAD[2] DIPO=0x2 PA23 SERCOM5 PAD[3] DOPO=0x2 PB03 SERCOM5 PAD[1] DOPO=0x2 PB02 to be set low in software before SPI access MISO MOSI SCK GPIO SO SI SCK
#CS 37 38 48 47 The signals in this table are not available as module I/O. More information about the FLASH IC can be found in its related datasheet [ADESTO]. 1.2.2. UART with Hardware Flow Control (RTS/CTS) For an Application where the ADC is not in use, SERCOM0 can be multiplexed as shown in the table below. Table 1-2UART with Hardware Flow Control (RTS/CTS) Module Pin MCU Function MCU Pin Port and SERCOM Configuration 14 25 UART TX UART RX 15 10 SERCOM0; MUX=C; PAD[0] TXPO=0x2 SERCOM0; MUX=D; PAD[1] RXPO=0x1 Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 4 Module Pin MCU Function MCU Pin Port and SERCOM Configuration 26 13 UART RTS UART CTS 11 12 SERCOM0; MUX=D; PAD[2] TXPO=0x2 SERCOM0; MUX=D; PAD[3] TXPO=0x2 The signals in this table are not available as module IO. More information about the FLASH IC can be found in its related datasheet. (ADESTO) 32kHz Crystal PA00 and PA01 are used for the 32kHz crystal. This pins are not available as module IO. SAM R21 USB Availability The USB pins are made available as differential pair routed GPIOs. A base board with the required connection hardware can support an USB interface. Table 1-3SAM R21 USB Availability Function MCU Pin Port Configuration or Xplain Function Module Pin 1.2.3. 1.2.4. 19 20 GPIO or USB_D+
SPIO or USB_D-
33 34 PA24: For USB MUX=G PA25: For USB MUX=G The module power supply cant be operated directly from a 5V USB source. The module base board has to implement the required voltage regulator. 1.3. RF Front End Control The antenna diversity signals ANT_DIV_P/N are used to control the diversity switch U4. The signal ANT_DIV_P is available at the IO ring pin 18 to indicate the antenna currently in use. In addition at pin 17, the RX_TX indicator signal is available to indicate if the module is currently in transmit mode. Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 5 Table 1-4RF Front End Control RF Front End Signal MCU Function MCU Pin ANT_DIV_P FECTRL2 ANT_DIV_N FEM_RX_TX FECTRL1 FECTRL3 21 16 22 Port and SERCOM Configuration PA12; MUX=F;
F3CFG=DIG1 Available at module pin 18 PA09; MUX=F;
F1CFG=DIG2 PA13; MUX=F;
F0CFG=DIG3 for High active TX indication F0CFG=DIG4 for Low active TX indication Available at module pin 17 Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 6 2. Mechanical Description 2.1. Mechanical Dimensions Dimensions are in mm. The module pins are arranged with a 1mm pitch distance. The module is designed in a symmetric way. Figure 2-1Module Bottom Dimensions ( Seen from a CAD top perspective ) The module can be mounted to a base board with a soldered RF connection. For this case one or both U.Fl connectors are left unconnected and the RF pads on the bottom side are used to feed an antenna located on the base board. 2.2. Footprint and Layout Recommendation Since the module does not contain an antenna, the module does not set any limits for the base board material selection or the board stack-up construction. The module does also not require a certain positioning on the board in relation to the board edge. The module must be placed away from interference sources on the base board like clock oscillators or step converters. The area underneath the module must be filled with a grounded copper plane. The RF-Pad area needs special attention. The following sections provide more information on that. A typical design is supposed to connect the I/O ring to the base board while the antenna feeds are using the U.Fl connectors. Using the antennas in Approved Antennas on page 16, the modular approval for the final product can be used without re-certification. 2.2.1. Design without RF-Pads For a design without U.Fl connected antennas, the base board design has to have no copper fill within the RF-Pad area (*!). All layers with less than 0.5mm distance from top shall not be filled with copper underneath the RF-Pad area. Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 7 For all other I/O pads the geometry in below figure should be used. Figure 2-2Recommended Base Board Layout 2.2.2. Design without RF-Pads For applications where the antenna is implemented on the base PCB, the RF-Pads can be used to connect the RF signals. The pad layout is available in Figure 2-2Recommended Base Board Layout on page 8. The base board traces shall be designed with a line impedance of 50Ohm. Depending on the base board stack construction a microstrip or a grounded coplanar design can be implemented. The best choice will be the line type with the best match in between line width and the 0.8mm pad width. For all other IO pads the geometry in Figure 2-2Recommended Base Board Layout on page 8 should be used. Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 8 3. I/O Pin Assignment The module pin assignment is shown in below table. The Column "MCU pin" is referring to the ATSAMR21G18 datasheet [SAMR21]. The column Port Configuration is intended to help determine the required SAMR21 port configuration.. Table 3-1RF Front End Control Function MCU Pin Port Configuration Module Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 GND GND VCC VCC RSTN SPI_CS SPI_MOSI SPI_MISO SPI_SCLK GPIO
-
GND RXD1 TXD1
-
-
FEM_RX_TX ANT_DIV_P GPIO/USB_DM GPIO/USB_DP
-
RXD0 TXD0 40 26 27 25 28 41 12 15 22 21 33 34 24 23 SERCOM1; MUX=C; DOPO=0x1; Master PAD1 SERCOM1; MUX=C; DOPO=0x1 Master PAD2 For slave operation this pin is MISO SERCOM1; MUX=C; DIPO=0x0 Master PAD0 For slave operation this pin is MOSI SERCOM1; MUX=C; DOPO=0x1 Master PAD3 PA28 (Yellow LED; low active) Not connected SERCOM0; MUX=D; PAD[3] RXPO=0x3 Can be used for UART with RTS/CTS SERCOM0; MUX=C; PAD[0] TXPO=0x0 Can be used for UART with RTS/CTS Not connected Not connected PA13; MUX=F; FECTRL3 (LED red) PA12; MUX=F; FECTRL2 (LED green) PA24 for USB MUX=G PA25 for USB MUX=G Not connected SERCOM2; MUX=C; PAD[3]; RXPO=0x3 SERCOM2; MUX=C; PAD[2]; TXPO=0x1 Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 9 Module Pin Function MCU Pin Port Configuration 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 AREF ADC0 ADC1
-
-
GND SWCLK SWDIO
-
ATECC508 GPIO
-
-
I2C SCL I2C SDA
-
-
-
GND GND 9 10 11 45 46 32 31 MUX=B; disable digital MUX=B; AIN[1]; disable digital Can be used for UART with RTS/CTS MUX=B; AIN[2] disable digital Can be used for UART with RTS/CTS Not connected Not connected Programming interface Programming interface Not connected Crypto IC GPIO with intrusion detection feature Not connected Not connected SERCOM3 PAD1 MUX=C SERCOM3 PAD0 MUX=C Not connected Not connected Not connected Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 10 Electrical Characteristics This section will outline the main parameters required to build applications. The module characteristics are determined by the implemented parts. See References on page 19 for required datasheet references. 4. 4.1. Absolute Maximum Ratings Table 4-1Absolute Maximum Ratings Symbol Parameter TSTOR VPIN Storage temperature Pin voltage with respect to GND and VDD ESD robustness VESD Condition Min.
-40 GND-0.3V Unit Typ. Max. C
+125 VDD+0.3V V Modules I/O's routed to SAM R21 Human Body Model 4 Charged Device Model 550 kV V PRF Input RF level
+10 dBm 4.2. Recommended Operating Ratings Table 4-2Recommended Operating Ratings Symbol TOP VDD Parameter Operating temperature range Supply voltage 4.3. Module Performance Data Condition Min.
-40 1.8 Typ. Max. 85 3.6 Unit C V If not otherwise stated the measurements are done with VDD=3.3V at 25C. Table 4-3Module Performance Data Symbol Parameter IDD Supply current Condition MCU at TBD MHz(1) With transceiver in RX_ON state With transceiver in TX state Min. Typ. Max. Unit mA 4 10 10 PRF Pemit RF transmit power Radiated transmit power Using antenna ANT-24G-S21-P5FL(2) U.Fl interface 2 Using antenna M07-FL(3) 3.5 3.5 8 8 dBm dBm EIRP Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 11 Symbol Parameter PSPUR_TX Transmitter spurious Condition U.Fl connector, conducted, >2.5GHz Min. Typ. Max. Unit dBm
-50 PSENS dod fRef_0 fRef_T f32k_0 f32lk_T emissions Receiver sensitivity Outdoor range U.Fl interface Using antenna ANT-24G-S21-P5FL ANT-24G-S21-P5FL in Ch26(2) Using antenna M07-FL M07-FL in Ch26(3) Reference crystal deviation T = 25C default XTAL_TRIM setting T = 25C NV memory XTAL_TRIM setting
-5
-5 Reference crystal drift over temperature Watch crystal deviation
-40C <TOP< +85C
-15 T = 25C default XTAL_TRIM setting T = 25C NV memory XTAL_TRIM setting Watch crystal drift over temperature
-40C <TOP< +85C
-98 TBD TBD TBD TBD TBD TBD TBD
+20
+5
+15 dBm m ppm ppm ppm ppm Note:
1. Transceiver state TRX_OFF, FLASH deselect. 2. For FCC band edge compliance it is required to operate Ch26 with not more than power level 13. 3. For FCC band edge compliance it is required to operate Ch26 with not more than power level 14 Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 12 5. Non-Volatile Memory Information The SAM R21 provides a user readable Non-Volatile Memory (NVM) space referred to as the user row in the data sheet. The base address for the application is 0x804008. Table 5-1NVM (User Row) Data Offset Address
+0x00
+0x02
+0x0A
+0x14
+0x1C
+0x1D
+0x1E Field Description Data structure revision 0x1501 Module specific IEEE MAC Address Module specific serial number Product specific part number Product PCB/assembly revision Reference crystal calibration value Checksum for this data structure Field Name MIB_REVISION MAC_IEEE_ADDRESS BOARD_SERIAL ATMEL_PART_NO PCBA_REV XTAL_TRIM CRC16 Length 2 Bytes 8 Bytes 10 Bytes 8 Bytes 1 Byte 1 Byte 2 Bytes The end user application software has to copy two data fields to radio transceiver registers. The data in MAC_IEEE_ADDRESS have to be copied to the registers IEEE_ADDR_0 to _7. The MAC_IEEE_ADDRESS is stored little endian with the first byte stored at the lowest address. The XTAL_TRIM value has been determined during production test and needs to be copied to the transceiver XTAL_TRIM section inside the XOSC_CTRL register. This will reduce the absolute deviation for the 16MHz reference crystal. See Module Performance Data on page 11 for parameter details. Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 13 6. 6.1. Radio Certification The module ATSAMR21G18-MR210UA in combination with the approved antennas listed in Approved Antennas on page 16 have received regulatory approvals for modular devices in the United States and European countries. United States (FCC) The module ATSAMR21G18-MR210UA complies with the requirements of FCC part 15. To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following regulations:
The modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following. Any similar wording that expresses the same meaning may be used. Sample Label for integration of ATSAMR21G18-MR210UA:
Contains FCC-ID: VNR-ATSAMR210UA-0 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation (FCC 15.19). The antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions
(FCC 2.1093) requires separate equipment authorization. Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21). To be compliant with FCC part 15 the transmit power setting (register 0x05, PHY_TX_PWR) for channel 26 must not exceed the values in Table 6-1Approved Antennas on page 16. The module application software must ensure this settings for operation within the FCC territory. 6.2. Europe (ETSI) The module ATSAMR21G18-MR210UA is conform for use in European Union countries. If the ATSAMR21G18-MR210UA module is incorporated into a product, the manufacturer must ensure the compliance of the final product to the European harmonized EMC and low-voltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 14 6.3. The manufacturer must maintain a copy of the ATSAMR21G18-MR210UA module documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. The CE marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the initials "CE" taking the following form:
If the CE marking is reduced or enlarged, the proportions must be respected. The CE marking must have a height of at least 5 mm except where this is not possible on account of the nature of the apparatus. The CE marking must be affixed visibly, legibly, and indelibly. More detailed information about CE marking requirements can be found at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12. For the operation in Europe, there is no power setting limit. Industry Canada (IC) Compliance Statements This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the device and the user or bystanders. Cet quipement est conforme aux limites d'exposition aux radiofrquences dfinies par Industrie Canada pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre le dispositif et l'utilisateur ou des tiers. CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). This Module is labeled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another device, then the device should display the label on it referring the enclosed module. In that case, the final end product must be labelled in a visible area with the following:
Contains Transmitter Module IC: 20266-ATSAMR210UA0 OR Contains IC: 20266-ATSAMR210UA0 Ce module est tiquet avec son propre ID IC. Si le numro de certification IC ID n'est pas visible lorsqu'il est install l'intrieur d'un autre appareil, l'appareil doit afficher l'tiquette sur le module de rfrence ci-
joint. Dans ce cas, le produit final doit tre tiquet dans un endroit visible par le texte suivant:
Contains Transmitter Module IC: 20266-ATSAMR210UA0 Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 15 OR Contains IC: 20266-ATSAMR210UA0 6.4. Approved Antennas The device has been tested and approved for use with the antenna type listed below. The device may be integrated with other custom design antennas which OEM installer must authorize with respective regulatory agencies. The used antenna is to be connected to the Radio PCB via U.Fl connection. Table 6-1Approved Antennas Manufacturer Part Number Description Gain FCC Max. Ch26 Power Register Settings RF Solutions ANT-24G-S21-P5FL 21mm quarter wave monopole with TekfunCo.,LTD M07-FL U.Fl pigtail 170mm quarter wave monopole with U.Fl pigtail 0dBi 13..15 5dBi 14..15 The above table shows the allowed power settings for Channel 26 if the equipment is operated under FCC conditions. According to KDB 178919 [Policy] it is allowed to substitute approved antennas through equivalent antennas of the same type with equal or less antenna gain:
Equivalent antennas must be of the same type (e.g., yagi, dish, etc.), must be of equal or less gain than an antenna previously authorized under the same FCC ID, and must have similar in band and out-of-band characteristics (consult specification sheet for cutoff frequencies). Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 16 7. Boot Loader The module will be delivered with a pre flashed boot loader. Refer to the boot loader manual for detailed information. It is online available under the Application Note code AVR2054. Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 17 8. Ordering Information Module Type ATSAMR21G18-
MR210UA Packaging(1) Ordering Code Tape & Reel ATSAMR21G18-
MR210UA-T Package 19mm x 20mm SMT Operational Range Industrial (-40oC to 85C) Note:
1. MOQ is a reel with 200 modules. Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 18 9. References 1. ADESTO. (n.d.). Adesto Technologies. Retrieved from AT45DB041E Datasheet: http://
www.adestotech.com 2. ATECC508. (n.d.). www.atmel.com. Retrieved from ECC-based Devices: http://www.atmel.com/
products/security-ics/cryptoauthentication/ecc-256.aspx 3. Policy, P. C. (n.d.). 178919 D01 Permissive Change Policy. Retrieved from FCC OET: https://
apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?id=33013&switch=P 4. SAM R21. (n.d.). www.atmel.com. Retrieved from http://www.atmel.com/Images/Atmel-42223-SAM-
R21_Datasheet.pdf Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 19 10. Revision History Doc Rev. Date 42475B 09/2015 Description Updated United States (FCC) on page 14. Added Industry Canada (IC) Compliance Statements on page 15 42475A 07/2015 Initial document release. Atmel ATSAMR21G18-MR210UA [DATASHEET]
Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 20 Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200
|
www.atmel.com 2015 Atmel Corporation. / Rev.: Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 Atmel, Atmel logo and combinations thereof, Enabling Unlimited Possibilities, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. ARM, ARM Connected logo, and others are the registered trademarks or trademarks of ARM Ltd. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications where the failure of such products would reasonably be expected to result in significant personal injury or death (Safety-Critical Applications) without an Atmel officer's specific written consent. Safety-Critical Applications include, without limitation, life support devices and systems, equipment or systems for the operation of nuclear facilities and weapons systems. Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by Atmel as military-grade. Atmel products are not designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive-grade.