FCC ID: TLZ-NM430SM IEEE 802.11 1X1 b/g/n Wireless LAN and Bluetooth 4.2 12mm x 12mm Stamp LGA module

Features IEEE 802.11 1X1 b/g/n Wireless LAN and Bluetooth 4.2 12mm x 12mm LGA module AW-NM430 1 Datasheet Rev. A DF

(For Standard) Compatible with Bluetooth v2.1+EDR and WiFi operation Support 802.11n 1x1 SISO and HT40 v4.2 Systems Supports Bluetooth 4.0 Low Energy(BLE) IEEE 802.11n compliant with maximum data HS-UART interface for Bluetooth data tran rates up to 150 Mbps (40 MHz channel) smission compliant with H5 specification SDIO 2.0 interface for connecting WLAN PCM interface for audio data transmission technologies to the host processor via Bluetooth controller Security support for WPA/WPA2 personal, WPS2.0 Support 802.11w protected manages frames Support 802.11e QoS Enhancement(WMM) Support 802.11i WPA, WPA2. Open, shared key and pair-wise key authentication services Bluetooth Revision History Document NO: R2-2430-DST-01 2 Revision DCN NO. Description Initials Approved Revision Date A 2021/06/29 DCN022852 Initial Version Morris. N.C. Chen 3 Table of Contents Revision History .............................................................................................................................. 2 Table of Contents ............................................................................................................................ 3 1. Introduction ................................................................................................................................. 5 1.1 Product Overview ............................................................................................................................... 5 1.2 Block Diagram ..................................................................................................................................... 6 1.3 Specifications Table ........................................................................................................................... 7 1.3.1 General ...................................................................................................................................... 7 1.3.2 WLAN ......................................................................................................................................... 7 1.3.3 Bluetooth .................................................................................................................................... 8 1.3.4 Operating Conditions ................................................................................................................. 9 2. Pin Definition ............................................................................................................................. 10 2.1 Pin Map .............................................................................................................................................. 11 2.2 Pin Table ............................................................................................................................................ 10 3. Electrical Characteristics ......................................................................................................... 13 3.1 Absolute Maximum Ratings ............................................................................................................ 13 3.2 Recommended Operating Conditions ........................................................................................... 13 3.3 Digital IO Pin DC Characteristics .................................................................................................... 13 3.3.1 3.3V Operation ........................................................................................................................ 13 3.4 SDIO Power-On Sequence ............................................................................................................... 14 3.5 UART Interface Power-On Sequence ............................................................................................. 14 3.5.1 UART Hardware Flow Control Not Supported ........................................................................ 14 3.5.2 UART Hardware Flow Control Supported ............................................................................... 15 3.6 Power Consumption* ........................................................................................................................ 15 3.6.1 WLAN ....................................................................................................................................... 15 3.6.2 Bluetooth .................................................................................................................................. 16 4. Mechanical Information ............................................................................................................ 17 4.1 Mechanical Drawing ......................................................................................................................... 17 5. Packaging Information ............................................................................................................. 18 4 1. Introduction 1.1 Product Overview AzureWave Technologies, Inc. introduces the IEEE 802.11b/g/n WLAN LGA module AW-NM430. With four advanced radio technologies integrated into a LGA module, AW-NM430 provides the best and most convenient SMT process. The module is targeted to mobile devices including, Tablet PC, Portable Media Players (PMPs), Portable Navigation Devices (PNDs), Personal Digital Assistants (PDAs), Tracking Devices, Gaming Devices which need convenient SMT process and low power consumption. By using AW-NM430, the customers can easily integrate the Wi-Fi by a LGA card module with the benefits of high design flexibility, high success rate on SMT process, short development cycle, and quick time-to-market. Compliance with the IEEE 802.11b/g/n standard, the AW-NM430 uses DSSS, OFDM, DBPSK, DQPSK, CCK and QAM baseband modulation technologies. A high level of integration and full implementation of the power management functions specified in the IEEE 802.11 standard minimize the system power requirements by using AW-NM430. The AW-NM430 supports standard interface SDIO for WLAN, HS-UART for Bluetooth. 5 1.2 Block Diagram Confidentiality 6 1.3 Specifications Table 1.3.1 General Features Product Description 802.11 1X1 b/g/n Wireless LAN and Bluetooth 4.2 Description Major Chipset RTL8723DS-CG Host Interface WiFi + BT SDIO + UART Dimension 12mm x 12mm x 1.8mm(max) Form factor LGA module Antenna For LGA, 1T1R, external MainWiFi/Bluetooth TX/RX Weight 0.4910g 1.3.2 WLAN Features WLAN Standard IEEE 802.11 b/g/n Frequency Rage WLAN: 2.4 GHz : 2.412 ~ 2.484 GHz Description Modulation WLAN:DSSS, OFDM, DBPSK, DQPSK, CCK, 16-QAM, 64-QAM Number of Channels WLAN 2.4GHz USA, NORTH AMERICA, Canada and Taiwan 1 ~ 11 China, Australia, Most European Countries 1 ~ 13 Output Power

(Board Level Limit)(1) 2.4G 11b (11Mbps)

@EVM<35%

11g (54Mbps)

@EVM-25 dB 11n (HT20 MCS7)

@EVM-27 dB 11n (HT40 MCS7)

@EVM-28 dB Min 14 12 11 11 Typ 16 14 13 13 Max 18 16 15 15 Unit dBm dBm dBm dBm 7 Receiver Sensitivity 2.4G 11b (11Mbps) 11g (54Mbps) 11n (HT20 MCS7) 11n (HT40 MCS7) Min Typ

-83

-71

-67

-64 Max

-80

-68

-64

-61 Unit dBm dBm dBm dBm Data Rate WLAN:

802.11b : 1, 2, 5.5, 11Mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps 802.11n : up to 150Mbps-single Security WPA/WPA2

(1) If you have any certification questions about output power please contact FAE directly. 1.3.3 Bluetooth Features Bluetooth Standard Frequency Rage Modulation Output Power Receiver Sensitivity Description Bluetooth 2.1+Enhanced Data Rate (EDR) + BT4.2 2402~2480MHz GFSK (1Mbps), /4 DQPSK (2Mbps) and 8DPSK (3Mbps) BT Power BT Sensitivity (BER<0.1%) BER EDR Low Energy BER EDR Low Energy Min 3 3 3 Min Typ 5 5 5 Typ

-91

-83

-94 Max 7 7 7 Max

-82

-70

-70 Unit dBm dBm dBm Unit dBm dBm dBm 8 1.3.4 Operating Conditions Features Description Operating Conditions Voltage 3.3V Operating Temperature 0~70 Operating Humidity less than 85%R.H Storage Temperature

-40~90 Storage Humidity less than 60%R.H ESD Protection Human Body Model 3.5KV Changed Device Model 500V 9 2. Pin Definition 2.1 Pin Map AW-NM430 Pin Map (Top View) 10 2.2 Pin Table Pin No. Definition Basic Description Type Voltage 1 GND_1 Ground 2 WL_BT_ANT Option for RF I/O pin out 3 GND_2 Ground 4 NC_1 5 NC_2 Floating Pin, No connect to anything. Floating Pin, No connect to anything. Floating Floating 6 7 BT_WAKE BT Device Wake BT_HOST_WAKE BT Host Wake 8 NC_3 9 VD33 10 NC 11 NC 12 WL_DIS#

Floating Pin, No connect to anything. Floating

3.3V power voltage source input Floating Pin, No connect to anything. Floating

Floating Pin, No connect to anything. This Pin can externally shut down the RTL8723DS WLAN function when WL_DIS# is pulled low. When this Pin is pulled low, SDIO interface will be also disabled. This Pin can be also defined as the WLAN Radio-off function with host interface remaining connected. Floating

VDDIO 13 WL_DEV_WAKE_ HOST 14 SD_D2 WL Host Wake SDIO Data line Bit[2]

15 SD_D3 SDIO Data line Bit[3]

16 SD_CMD SDIO Command 17 SD_CLK SDIO Clock input SDIO Data line Bit[0]

SDIO Data line Bit[1]

Ground 18 SD_D0 19 SD_D1 20 GND_3 21 NC 23 NC 24 LPO 11 Floating Pin, No connect to anything. Floating 22 VDDIO 1.8V/3.3V Digital I/O Power Supply Floating Pin, No connect to anything. Floating External Low Power Clock input (32.768KHz)

I/O

I O P I I/O I/O I/O I/O I I/O I/O

P I

1.8V

VDDIO VDDIO 3.3V VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO

1.8V/3.3 V

VDDIO 25 PCM_OUT PCM Data output 26 PCM_CLK PCM Clock 27 PCM_IN PCM data input 28 PCM_SYNC PCM sync signal 29 NC Floating Pin, No connect to anything. 30 TCXO_IN External Xtal in 31 GND_4 Ground 36 GND_6 Ground 32 NC_4 33 GND_5 34 BT_DIS#

35 NC_5 37 NC 38 NC 39 NC_6 40 NC_7 41 UART_RTS 42 UART_OUT Floating Pin, No connect to anything. Ground This Pin can externally shut down the RTL8723DS BT function when BT_DIS# is pulled low. When this Pin is pulled low, UART interface will be also disabled. This Pin can be also defined as the BT Radio-off function with host interface remaining connected. Floating Pin, No connect to anything. Floating Pin, No connect to anything. Floating Pin, No connect to anything. GPIO Mode : GPIO[8]. Bluetooth External Coexistence Mode : BT_FREQ. GPIO Mode : GPIO[9]. Bluetooth External Coexistence Mode : BT_STATE. Module internal default pull down. Floating Pin, No connect to anything. UART_OUT High speed UART DATA OUT 43 UART_IN UART_IN High speed UART Data In 44 UART_CTS UART_CTS High speed UART DTS VDDIO VDDIO VDDIO VDDIO I VDDIO I/O I/O I/O I/O Floating Floating Floating

Floating

Floating Floating Floating I/O I/O O I I

VDDIO VDDIO 12 3. Electrical Characteristics 3.1 Absolute Maximum Ratings Symbol Parameter Minimum Typical Maximum Unit VDD33 3.3V input

3.3 3.6 V 3.2 Recommended Operating Conditions Symbol Parameter Minimum Typical Maximum VDD33 3.3V power supply VDDIO Digital IO Supply Voltage 3.0 1.62 3.3 1.8~3.3 3.6 3.6 Unit V V 3.3 Digital IO Pin DC Characteristics 3.3.1 3.3V Operation Symbol Parameter Minimum Typical Maximum Unit Symbol Parameter Minimum Typical Maximum Unit VIH VIL VOH VOL VIH VIL VOH VOL VIH VIL VOH VOL Input high voltage Input low voltage Output high voltage Output low voltage Input high voltage Input low voltage Output high voltage Output low voltage 2.0

2.97 1.8 2.5 0 2.8v Operation 0 1.8v Operation Input high voltage 1.3 Input low voltage Output high voltage 1.62 Output low voltage

0 3.3 0

2.8 0

1.8 0

13 3.6 0.9 3.3 0.33 3.1 0.8 3.1 0.28 2.0 0.8 1.8 0.18 V V V Symbol Parameter Minimum Typical Maximum Unit 3.4 SDIO Power-On Sequence Symbol Description T33ramp The 3.3V main power ramp up duration. T18ramp The 1.8V main power ramp up duration. Tnon_rdy SDIO Not Ready Duration. In this state, the RTL8723DS may respond to commands without the ready bit being set. After the ready bit is set, the host will initiate complete card detection procedure. Symbol T33ramp T18ramp Tnon_rdy Min 0.2 0.2 1 Typical 0.5 0.5 2 Max 2.5 2.5 2.5 Units ms ms ms 3.5 UART Interface Power-On Sequence 3.5.1 UART Hardware Flow Control Not Supported 14 3.5.2 UART Hardware Flow Control Supported Symbol T33ramp Description 3.3V Power Pre-Charge Ramp Up Duration Before Formal Power Up. We recommended that a 3.3V power-on and then power-off sequence is executed by the host controller before the formal power on sequence. This procedure can eliminate host card detection issues when power ramp up duration is too long, or when a system warm reboot fail. Toff The duration 3.3V is cut off before formal power up. T33ramp The 3.3V main power ramp up duration. T12ramp The internal 1.2V ramp up duration. Tnon_rdy UART Not Ready Duration. In this state, the RTL8723DS will not respond to any commands. Symbol Typical Units Max No Limit 1000 2.5 1.5 10 ms ms ms ms ms T33ramp Toff T33ramp T12ramp Tnon_rdy Min 0.2 250 0.2 0.1 1 3.6 Power Consumption*

3.6.1 WLAN

500 0.5 0.5 2 15 No. Item VBAT_IN=3.3V Band

(GHz) Mode BW

(MHz) RF Power

(dBm) Transmit Receive Max. Avg. Max. Avg. DUTY

98.8%

16 14 13 278.4 277.1 144.2 142.7 29.8%

136.4 135.2 27.7%

93.8 96.2 96.9 85.5 91.8 94.2 VBAT_IN=3.3V Max. 21uA 160uA 237uA Avg. 21uA 2.7mA 1.4mA 11b@1Mbps 2.4 11g@54Mbps 11n@MCS7 20 20 40 Mode No. 1 2 3 Radio Off Power Save DTM 1 (2.4GHz) Power Save DTM 3 (2.4GHz) No. Mode

* Current Unit: mA 3.6.2 Bluetooth 1 2 Transmit Receive

* Current Unit: mA

* The power consumption is based on Azurewave test environment, these data for reference only.

* The power consumption is based on Azurewave test environment, these data for reference only. VBAT_IN=3.3V Max. 64.1 50.6 Avg. 51.5(124.22kB/s) 46.3(207.33kB/s) 16 4. Mechanical Information 4.1 Mechanical Drawing Unit: mm 17 5. Packaging Information One reel can pack 1,500pcs 12x12 LGA modules 1. One production label is pasted on the reel, one desiccant and one humidity indicator card are put on the reel 2. One reel is put into the anti-static moisture barrier bag, and then one label is pasted on the bag One desiccant One production label One humidity indicator card One production label 3. A bag is put into the anti-static pink bubble wrap One anti-static pink bubble wrap 18 4. A bubble wrap is put into the inner box and then one label is pasted on the inner box Production label 5. 5 inner boxes could be put into one carton One production label Productionlabel 6. Sealing the carton by AzureWave tape 7. One carton label and one box label are pasted on the carton. If one carton is not full, one balance label pasted on 19 the carton One carton label One box label 20 Layout Guide Rev. C

(For Standard) 1 Revision History Version Revision Date Description Initials Approved A B C 2019/08/01 Initial Version Renton Tao N.C. Chen 2020/04/22 Modify module type name Jimmy Chen N.C. Chen 2021/08/30 Modify RF Trace Guide Morris Huang N.C. Chen 2 INTRODUCTION This document provides key guidelines and recommendations to be followed when creating AW-

NM430 layout. It is strongly recommended that layouts be reviewed by the AzureWave engineering team before being released for fabrication. The following is a summary of the major items that are covered in detail in this application note. Each of these areas of the layout should be carefully reviewed against the provided recommendations before the PCB goes to fabrication. GENERAL RF GUIDELINES Ground Layout Power Layout Digital Interface RF Trace Antenna Antenna Matching GENERAL LAYOUT GUIDELINES THE OTHER LAYOUT GUIDE INFORMATION 3 1. GENERAL RF GUIDELINES Follow these steps for optimal WLAN performance. 1. Control WLAN 50 ohm RF traces by doing the following:

Route traces on the top layer as much as possible and use a continuous reference ground plane underneath them. Verify trace distance from ground flooding. At a minimum, there should be a gap equal to the width of one trace between the trace and ground flooding. Also keep RF signal lines away from metal shields. This will ensure that the shield does not detune the signals or allow for spurious signals to be coupled in. Keep all trace routing inside the ground plane area by at least the width of a trace. Check for RF trace stubs, particularly when bypassing a circuit. 2. Keep RF traces properly isolated by doing the following:

Do not route any digital or analog signal traces between the RF traces and the reference ground. Keep the balls and traces associated with RF inputs away from RF outputs. If two RF traces are close each other, then make sure there is enough room between them to provide isolation with ground fill. on the shield layer. Verify that there are plenty of ground vias in the shield attachment area. Also verify that there are no non-ground vias in the shield attachment area. Avoid traces crossing into the shield area 3. Consider the following RF design practices:

Confirm antenna ground keep-outs. Verify that the RF path is short, smooth, and neat. Use curved traces or microwave corners for all turns; never use 90-degree turns. Avoid width discontinuities over pads. If trace widths differ significantly from component pad widths, then the width change should be mitered. Verify there are no stubs. Do not use thermals on RF traces because of their high loss. The RF traces between AW-NM430 RF_ANT pin and antenna must be made using 50 controlled-impedance transmission line. 4 2. Ground Layout Please follow general ground layout guidelines. Here are some general rules for customers reference. The layer 2 of PCB should be a complete ground plane. The rule has to be obeyed strictly in the RF section while RF traces are on the top layer. Each ground pad of components on top layer should have via drilled to PCB layer 2 and via should be as close to pad as possible. A bulk decoupling capacitor needs two or more. Dont place ground plane and route signal trace below printed antenna or chip antenna to avoid destroying its electromagnetic field, and there is no organic coating on printed antenna. Check antenna chip vendor for the layout guideline and clearance. Move GND vias close to the pads. 3. Power Layout Please follow general power layout guidelines. Here are some general rules for customers reference. A 4.7uF capacitor is used to decouple high frequency noise at digital and RF power terminals. This capacitor should be placed as close to power terminals as possible. In order to reduce PCBs parasitic effects, placing more via on ground plane is better. 4. Digital Interface Please follow power and ground layout guidelines. Here are some general rules for customers reference. The digital interface to the module must be routed using good engineering practices to minimize coupling to power planes and other digital signals. The digital interface must be isolated from RF trace. 5. RF Trace The RF trace is the critical to route. Here are some general rules for customers reference. The RF trace impedance should be 50 between ANT port and antenna matching network. The length of the RF trace should be minimized. To reduce the signal loss, RF trace should laid on the top of PCB and avoid any via on it. 5 The CPW (coplanar waveguide) design and the microstrip line are both recommended; the customers can choose either one depending on the PCB stack of their products. The RF trace must be isolated with aground beneath it. Other signal traces should be isolated from the RF trace either by ground plane or ground vias to avoid coupling. To minimize the parasitic capacitance related to the corner of the RF trace, the right angle corner is not recommended. If the customers have any problem in calculation of trace impedance, please contact AzureWave. Correct RF trace 6 Right-angled corner Via on RF trace Incorrect RF trace AW-NM430 RF trace should be follow the rules as below a. Line length of Antenna trace about 373.5 mil and 94.9 mil b. Line width of Antenna trace about 8 mil c. Air gap between RF trace and ground about 25 mil 7 6. Antenna Matching PCB designer should reserve an antenna matching network for post tuning to ensure the antenna performance in different environments. Matching components should be close to each other. Stubs should also be avoided to reduce parasitic while no shunt component is necessary after tuning. 7. GENERAL LAYOUT GUIDELINES Follow these guidelines to obtain good signal integrity and avoid EMI:

1. Place components and route signals using the following design practices:

Keep analog and digital circuits in separate areas. 8 Identify all high-bandwidth signals and their return paths. Treat all critical signals as current loops. Check each critical loop area before the board is built. A small loop area is more important than short trace lengths. Orient adjacent-layer traces so that they are perpendicular to one another to reduce crosstalk. Keep critical traces on internal layers, where possible, to reduce emissions and improve immunity to external noise. However, RF traces should be routed on outside layers to avoid the use of vias on these traces. Keep all trace lengths to a practical minimum. Keep traces, especially RF traces, straight wherever possible. Where turns are necessary, use curved traces or two 45-degree turns. Never use 90-degree turns. 2. Consider the following with respect to ground and power supply planes:

Route all supply voltages to minimize capacitive coupling to other supplies. Capacitive coupling can occur if supply traces on adjacent layers overlap. Supplies should be separated from each other in the stack-up by a ground plane, or they should be coplanar (routed on different areas of the same layer). Provide an effective ground plane. Keep ground impedance as low as possible. Provide as much ground plane as possible and avoid discontinuities. Use as many ground vias as possible to connect all ground layers together. Maximize the width of power traces. Verify that they are wide enough to support target currents, and that they can do so with margin. Verify that there are enough vias if the traces need to change layers. 3. Consider these power supply decoupling practices:

Place decoupling capacitors near target power pins. If possible, keep them on the same side as the IC they decouple to avoid vias that add inductance. If a filter component cannot be directly connected to a given power pin with a very short and fat etch, do not connect it by a copper trace. Instead, make the connection directly to the associated planes using vias. Use appropriate capacitance values for the target circuit, and consider each capacitor's self-

resonant frequency. 9 10. Stamp Module stencil and Pad opening Suggestion Stencil thickness0.10~0.12mm Function Pad opening size suggestion: Max. 1:1 PS: This opening suggestion just for customer reference, please discuss with AzureWaves Engineer before you start SMT. Solder Printer Opening and Customer PCB Footprint suggestion. Example:

10 11. The other layout guide Information Make sure every power traces have good return path (ground path). Connect the input pins of unused internal regulators to ground. Leave the output pins of unused internal regulators floating. High speed interface (i.e. UART/SDIO/HSIC) shall have equal electrical length. Keep them away from noise sensitive blocks. Good power integrity of VDDIO will improve the signal integrity of digital interfaces. Good return path and well shielded signal can reduce crosstalk, EMI emission and improve signal integrity. port. RF IO is around 50 ohms, reserve Pi or T matching network to have better signal transition from port to Smooth RF trace help to reduce insertion loss. Do not use 90 degrees turn (use two 45 degrees turns or one miter bend instead). Well arranged ground plane near antenna and antenna itself will help to reduce near field coupling between other RF sources (e.g. GSM/CDMA antennas). Discuss with AzureWave Engineer after you finish schematic and layout job. 11 12. Mechanical Drawing Package Outline Drawing 12 Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT NOTE:

FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. IMPORTANT NOTE:

This module is intended for OEM integrator. This module is only FCC authorized for the specific rule parts listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Additional testing and certification may be necessary when multiple modules are used. satisfied. USERS MANUAL OF THE END PRODUCT:

In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following "

Contains TX FCC ID: TLZ-NM430SM ". This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. Antenna List Ant. Brand Model Name Antenna Type Connector Gain (dBi) 1 2 YAGEO ANT3216A063R2400A Chip Antenna MAG. LAYERS MSA-4008-25GC1-A2 PIFA Antenna I-PEX I-PEX 1.69 2.98 This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:

(1) This device may not cause interference.

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil contient des metteurs / rcepteurs exempts de licence qui sont conformes au (x) RSS (s) exempts de licence d'Innovation, Sciences et Dveloppement conomique Canada. L'opration est soumise aux deux conditions suivantes:

(1) Cet appareil ne doit pas provoquer d'interfrences.

(2) Cet appareil doit accepter toute interfrence, y compris les interfrences susceptibles de provoquer un fonctionnement indsirable de l'appareil. This device and its antenna(s) must not be co-located with any other transmitters except in accordance with IC multi-transmitter product Referring to the multi-transmitter policy, multiple-transmitter(s) and module(s) can be operated simultaneously without reassessment permissive procedures. change. Cet appareil et son antenne (s) ne doit pas tre co-localiss ou fonctionnement en association avec une autre antenne ou transmetteur. This radio transmitter [6100A-NM430SM] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Le prsent metteur radio (6100A-NM430SM) a t approuv par Innovation, Sciences et Dveloppement conomique Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal d'antenne. Les types d'antennes non inclus dans cette liste qui ont un gain suprieur au gain maximal indiqu pour tout type list sont strictement interdits pour une utilisation avec cet appareil. IMPORTANT NOTE:

IC Radiation Exposure Statement:

This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Cet quipement est conforme aux limites d'exposition aux rayonnements IC tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. IMPORTANT NOTE:

This module is intended for OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessary when multiple modules are used. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the IC RSS-102 radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT:

In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the IC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. Operation is subject to the following two conditions: (1) this device may not cause harmful interference (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following "

Contains IC: 6100A-NM430SM". The Host Model Number (HMN) must be indicated at any location on the exterior of the end product or product packaging or product literature which shall be available with the end product or online. Ant. Brand Model Name Antenna Type Connector Gain (dBi) YAGEO ANT3216A063R2400A Chip Antenna MAG. LAYERS MSA-4008-25GC1-A2 PIFA Antenna I-PEX I-PEX 1.69 2.98 Antenna List 1 2

Features AW-NM430SM IEEE 802.11 1X1 b/g/n Wireless LAN and Bluetooth 4.2 12mm x 12mm Stamp LGA module 1 Datasheet Rev. E DF

(For Standard) Compatible with Bluetooth v2.1+EDR and WiFi operation Support 802.11n 1x1 SISO and HT40 v4.2 Systems Supports Bluetooth 4.0 Low Energy(BLE) IEEE 802.11n compliant with maximum data HS-UART interface for Bluetooth data tran rates up to 150 Mbps (40 MHz channel) smission compliant with H5 specification SDIO 2.0 interface for connecting WLAN PCM interface for audio data transmission technologies to the host processor via Bluetooth controller Security support for WPA/WPA2 personal, WPS2.0 Support 802.11w protected manages frames Support 802.11e QoS Enhancement(WMM) Support 802.11i WPA, WPA2. Open, shared key and pair-wise key authentication services Bluetooth Revision History Document NO: R2-2430SM-DST-01 2 Revision Version0

.1 Version0

.2 Version0

.3 Version0

.4 Version0

.5 Version0

.6 Revision Date 2019/02/18 2019/05/06 2019/05/07 2019/06/10 2019/07/08 2019/07/17 DCN NO. Description Initials Approved Draft version Jimmy Chen N.C. Chen Change Pin Definition, output power limit, receiver sensitivity Jimmy Chen N.C. Chen Modify Power limit, EVM Spec Jimmy Chen N.C. Chen Add RX Max Jimmy Chen N.C. Chen Add ESD Protection, revise storage temp Revise BT Power, BT RX Level, format change Jimmy Chen N.C. Chen Jimmy Chen N.C. Chen 2019/08/19 DCN016287 Datasheet format update Jimmy Chen N.C. Chen 2019/12/23 DCN016598 Update Power Consumption Jimmy Chen N.C Chen 2020/04/22 DCN017138 Modify module type name Jimmy Chen N.C Chen 2020/06/16 DCN017529 Datasheet format update Morris Huang N.C Chen 2021/04/19 DCN021428 Modify datasheet form Morris Huang N.C Chen A B C D E 3 Table of Contents Revision History .............................................................................................................................. 2 Table of Contents ............................................................................................................................ 3 1. Introduction ................................................................................................................................. 5 1.1 Product Overview ............................................................................................................................... 5 1.2 Block Diagram ..................................................................................................................................... 6 1.3 Specifications Table ........................................................................................................................... 7 1.3.1 General ...................................................................................................................................... 7 1.3.2 WLAN ......................................................................................................................................... 7 1.3.3 Bluetooth .................................................................................................................................... 8 1.3.4 Operating Conditions ................................................................................................................. 9 2. Pin Definition ............................................................................................................................. 10 2.1 Pin Map .............................................................................................................................................. 10 2.2 Pin Table ............................................................................................................................................ 10 3. Electrical Characteristics ......................................................................................................... 13 3.1 Absolute Maximum Ratings ............................................................................................................ 13 3.2 Recommended Operating Conditions ........................................................................................... 13 3.3 Digital IO Pin DC Characteristics .................................................................................................... 13 3.3.1 3.3V Operation ........................................................................................................................ 13 3.4 SDIO Power-On Sequence ............................................................................................................... 14 3.5 UART Interface Power-On Sequence ............................................................................................. 14 3.5.1 UART Hardware Flow Control Not Supported ........................................................................ 14 3.5.2 UART Hardware Flow Control Supported ............................................................................... 15 3.6 Power Consumption* ........................................................................................................................ 15 3.6.1 WLAN ....................................................................................................................................... 15 3.6.2 Bluetooth .................................................................................................................................. 16 4. Mechanical Information ............................................................................................................ 17 4.1 Mechanical Drawing ......................................................................................................................... 17 5. Packaging Information ............................................................................................................. 18 4 1. Introduction 1.1 Product Overview AzureWave Technologies, Inc. introduces the IEEE 802.11b/g/n WLAN stamp LGA module AW-NM430SM. With four advanced radio technologies integrated into a stamp LGA module, AW-NM430SM provides the best and most convenient SMT process. The module is targeted to mobile devices including, Tablet PC, Portable Media Players (PMPs), Portable Navigation Devices

(PNDs), Personal Digital Assistants (PDAs), Tracking Devices, Gaming Devices which need convenient SMT process and low power consumption. By using AW-NM430SM, the customers can easily integrate the Wi-Fi by a stamp LGA card module with the benefits of high design flexibility, high success rate on SMT process, short development cycle, and quick time-to-market. Compliance with the IEEE 802.11b/g/n standard, the AW-NM430SM uses DSSS, OFDM, DBPSK, DQPSK, CCK and QAM baseband modulation technologies. A high level of integration and full implementation of the power management functions specified in the IEEE 802.11 standard minimize the system power requirements by using AW-NM430SM. The AW-NM430SM supports standard interface SDIO for WLAN, HS-UART for Bluetooth. 5 1.2 Block Diagram Confidentiality 6 1.3 Specifications Table 1.3.1 General Features Product Description 802.11 1X1 b/g/n Wireless LAN and Bluetooth 4.2 Description Major Chipset RTL8723DS-CG Host Interface WiFi + BT SDIO + UART Dimension 12mm x 12mm x 1.8mm(max) Form factor Stamp LGA module Antenna For Stamp LGA, 1T1R, external MainWiFi/Bluetooth TX/RX Weight 0.4910g 1.3.2 WLAN Features WLAN Standard IEEE 802.11 b/g/n Frequency Rage WLAN: 2.4 GHz : 2.412 ~ 2.484 GHz Description Modulation WLAN:DSSS, OFDM, DBPSK, DQPSK, CCK, 16-QAM, 64-QAM Number of Channels WLAN 2.4GHz USA, NORTH AMERICA, Canada and Taiwan 1 ~ 11 China, Australia, Most European Countries 1 ~ 13 Output Power

(Board Level Limit)(1) 2.4G 11b (11Mbps)

@EVM<35%

11g (54Mbps)

@EVM-25 dB 11n (HT20 MCS7)

@EVM-27 dB 11n (HT40 MCS7)

@EVM-28 dB Min 14 12 11 11 Typ 16 14 13 13 Max 18 16 15 15 Unit dBm dBm dBm dBm 7 Receiver Sensitivity 2.4G 11b (11Mbps) 11g (54Mbps) 11n (HT20 MCS7) 11n (HT40 MCS7) Min Typ

-83

-71

-67

-64 Max

-80

-68

-64

-61 Unit dBm dBm dBm dBm Data Rate WLAN:

802.11b : 1, 2, 5.5, 11Mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps 802.11n : up to 150Mbps-single Security WPA/WPA2

(1) If you have any certification questions about output power please contact FAE directly. 1.3.3 Bluetooth Features Bluetooth Standard Frequency Rage Modulation Output Power Receiver Sensitivity Description Bluetooth 2.1+Enhanced Data Rate (EDR) + BT4.2 2402~2480MHz GFSK (1Mbps), /4 DQPSK (2Mbps) and 8DPSK (3Mbps) BT Power BT Sensitivity (BER<0.1%) BER EDR Low Energy BER EDR Low Energy Min 3 3 3 Min Typ 5 5 5 Typ

-91

-83

-94 Max 7 7 7 Max

-82

-70

-70 Unit dBm dBm dBm Unit dBm dBm dBm 8 1.3.4 Operating Conditions Features Description Operating Conditions Voltage 3.3V Operating Temperature 0~70 Operating Humidity less than 85%R.H Storage Temperature

-40~90 Storage Humidity less than 60%R.H ESD Protection Human Body Model 3.5KV Changed Device Model 500V 9 2. Pin Definition 2.1 Pin Map AW-NM430SM Pin Map (Top View) 2.2 Pin Table 10 Pin No. Definition Basic Description Type Voltage 1 GND_1 Ground 2 WL_BT_ANT Option for RF I/O pin out 3 GND_2 Ground 4 NC_1 5 NC_2 Floating Pin, No connect to anything. Floating Pin, No connect to anything. Floating Floating 6 7 BT_WAKE BT Device Wake BT_HOST_WAKE BT Host Wake 8 NC_3 9 VD33 10 NC 11 NC 12 WL_DIS#

Floating Pin, No connect to anything. Floating

3.3V power voltage source input Floating Pin, No connect to anything. Floating

Floating Pin, No connect to anything. This Pin can externally shut down the RTL8723DS WLAN function when WL_DIS# is pulled low. When this Pin is pulled low, SDIO interface will be also disabled. This Pin can be also defined as the WLAN Radio-off function with host interface remaining connected. Floating

VDDIO 13 WL_DEV_WAKE_ HOST 14 SD_D2 WL Host Wake SDIO Data line Bit[2]

15 SD_D3 SDIO Data line Bit[3]

16 SD_CMD SDIO Command 17 SD_CLK SDIO Clock input SDIO Data line Bit[0]

SDIO Data line Bit[1]

Ground 18 SD_D0 19 SD_D1 20 GND_3 21 NC 23 NC 24 LPO 25 PCM_OUT PCM Data output 26 PCM_CLK PCM Clock 11 Floating Pin, No connect to anything. Floating 22 VDDIO 1.8V/3.3V Digital I/O Power Supply Floating Pin, No connect to anything. Floating External Low Power Clock input (32.768KHz)

I/O

I O P I I/O I/O I/O I/O I I/O I/O

P I I/O I/O

1.8V

VDDIO VDDIO 3.3V VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO

1.8V/3.3 V

VDDIO VDDIO VDDIO I/O I/O VDDIO VDDIO 27 PCM_IN PCM data input 28 PCM_SYNC PCM sync signal 29 NC Floating Pin, No connect to anything. 30 TCXO_IN External Xtal in 31 GND_4 Ground 36 GND_6 Ground 32 NC_4 33 GND_5 34 BT_DIS#

35 NC_5 37 NC 38 NC 39 NC_6 40 NC_7 41 UART_RTS 42 UART_OUT Floating Pin, No connect to anything. Ground This Pin can externally shut down the RTL8723DS BT function when BT_DIS# is pulled low. When this Pin is pulled low, UART interface will be also disabled. This Pin can be also defined as the BT Radio-off function with host interface remaining connected. Floating Pin, No connect to anything. Floating Pin, No connect to anything. Floating Pin, No connect to anything. GPIO Mode : GPIO[8]. Bluetooth External Coexistence Mode : BT_FREQ. GPIO Mode : GPIO[9]. Bluetooth External Coexistence Mode : BT_STATE. Module internal default pull down. Floating Pin, No connect to anything. UART_OUT High speed UART DATA OUT 43 UART_IN UART_IN High speed UART Data In 44 UART_CTS UART_CTS High speed UART DTS I VDDIO Floating Floating Floating

Floating

Floating Floating Floating I/O I/O O I I

VDDIO VDDIO 12 3. Electrical Characteristics 3.1 Absolute Maximum Ratings Symbol Parameter Minimum Typical Maximum Unit VDD33 3.3V input

3.3 3.6 V 3.2 Recommended Operating Conditions Symbol Parameter Minimum Typical Maximum VDD33 3.3V power supply VDDIO Digital IO Supply Voltage 3.0 1.62 3.3 1.8~3.3 3.6 3.6 Unit V V 3.3 Digital IO Pin DC Characteristics 3.3.1 3.3V Operation Symbol Parameter Minimum Typical Maximum Unit Symbol Parameter Minimum Typical Maximum Unit VIH VIL VOH VOL VIH VIL VOH VOL VIH VIL VOH VOL Input high voltage Input low voltage Output high voltage Output low voltage Input high voltage Input low voltage Output high voltage Output low voltage 2.0

2.97 1.8 2.5 0 2.8v Operation 0 1.8v Operation Input high voltage 1.3 Input low voltage Output high voltage 1.62 Output low voltage

0 3.3 0

2.8 0

1.8 0

13 3.6 0.9 3.3 0.33 3.1 0.8 3.1 0.28 2.0 0.8 1.8 0.18 V V V Symbol Parameter Minimum Typical Maximum Unit 3.4 SDIO Power-On Sequence Symbol Description T33ramp The 3.3V main power ramp up duration. T18ramp The 1.8V main power ramp up duration. Tnon_rdy SDIO Not Ready Duration. In this state, the RTL8723DS may respond to commands without the ready bit being set. After the ready bit is set, the host will initiate complete card detection procedure. Symbol T33ramp T18ramp Tnon_rdy Min 0.2 0.2 1 Typical 0.5 0.5 2 Max 2.5 2.5 2.5 Units ms ms ms 3.5 UART Interface Power-On Sequence 3.5.1 UART Hardware Flow Control Not Supported 14 3.5.2 UART Hardware Flow Control Supported Symbol T33ramp Description 3.3V Power Pre-Charge Ramp Up Duration Before Formal Power Up. We recommended that a 3.3V power-on and then power-off sequence is executed by the host controller before the formal power on sequence. This procedure can eliminate host card detection issues when power ramp up duration is too long, or when a system warm reboot fail. Toff The duration 3.3V is cut off before formal power up. T33ramp The 3.3V main power ramp up duration. T12ramp The internal 1.2V ramp up duration. Tnon_rdy UART Not Ready Duration. In this state, the RTL8723DS will not respond to any commands. Symbol Typical Units Max No Limit 1000 2.5 1.5 10 ms ms ms ms ms T33ramp Toff T33ramp T12ramp Tnon_rdy Min 0.2 250 0.2 0.1 1 3.6 Power Consumption*

3.6.1 WLAN

500 0.5 0.5 2 15 No. Item VBAT_IN=3.3V Band

(GHz) Mode BW

(MHz) RF Power

(dBm) Transmit Receive Max. Avg. Max. Avg. DUTY

98.8%

16 14 13 278.4 277.1 144.2 142.7 29.8%

136.4 135.2 27.7%

93.8 96.2 96.9 85.5 91.8 94.2 VBAT_IN=3.3V Max. 21uA 160uA 237uA Avg. 21uA 2.7mA 1.4mA 11b@1Mbps 2.4 11g@54Mbps 11n@MCS7 20 20 40 Mode No. 1 2 3 Radio Off Power Save DTM 1 (2.4GHz) Power Save DTM 3 (2.4GHz) No. Mode

* Current Unit: mA 3.6.2 Bluetooth 1 2 Transmit Receive

* Current Unit: mA

* The power consumption is based on Azurewave test environment, these data for reference only.

* The power consumption is based on Azurewave test environment, these data for reference only. VBAT_IN=3.3V Max. 64.1 50.6 Avg. 51.5(124.22kB/s) 46.3(207.33kB/s) 16 4. Mechanical Information 4.1 Mechanical Drawing Unit: mm 17 5. Packaging Information One reel can pack 1,500pcs 12x12 stamp LGA modules 1. One production label is pasted on the reel, one desiccant and one humidity indicator card are put on the reel 2. One reel is put into the anti-static moisture barrier bag, and then one label is pasted on the bag One desiccant One production label One humidity indicator card One production label 3. A bag is put into the anti-static pink bubble wrap One anti-static pink bubble wrap 4. A bubble wrap is put into the inner box and then one label is pasted on the inner box 18 Production label One production label 5. 5 inner boxes could be put into one carton Production 6. Sealing the carton by AzureWave tape 7. One carton label and one box label are pasted on the carton. If one carton is not full, one balance label pasted on the carton 19 One carton label One box label One production label 20 Layout Guide Rev. C

(For Standard) 1 Revision History Version Revision Date Description Initials Approved A B C 2019/08/01 Initial Version Renton Tao N.C. Chen 2020/04/22 Modify module type name Jimmy Chen N.C. Chen 2021/08/30 Modify RF Trace Guide Morris Huang N.C. Chen 2 INTRODUCTION This document provides key guidelines and recommendations to be followed when creating AW-

NM430 layout. It is strongly recommended that layouts be reviewed by the AzureWave engineering team before being released for fabrication. The following is a summary of the major items that are covered in detail in this application note. Each of these areas of the layout should be carefully reviewed against the provided recommendations before the PCB goes to fabrication. GENERAL RF GUIDELINES Ground Layout Power Layout Digital Interface RF Trace Antenna Antenna Matching GENERAL LAYOUT GUIDELINES THE OTHER LAYOUT GUIDE INFORMATION 3 1. GENERAL RF GUIDELINES Follow these steps for optimal WLAN performance. 1. Control WLAN 50 ohm RF traces by doing the following:

Route traces on the top layer as much as possible and use a continuous reference ground plane underneath them. Verify trace distance from ground flooding. At a minimum, there should be a gap equal to the width of one trace between the trace and ground flooding. Also keep RF signal lines away from metal shields. This will ensure that the shield does not detune the signals or allow for spurious signals to be coupled in. Keep all trace routing inside the ground plane area by at least the width of a trace. Check for RF trace stubs, particularly when bypassing a circuit. 2. Keep RF traces properly isolated by doing the following:

Do not route any digital or analog signal traces between the RF traces and the reference ground. Keep the balls and traces associated with RF inputs away from RF outputs. If two RF traces are close each other, then make sure there is enough room between them to provide isolation with ground fill. on the shield layer. Verify that there are plenty of ground vias in the shield attachment area. Also verify that there are no non-ground vias in the shield attachment area. Avoid traces crossing into the shield area 3. Consider the following RF design practices:

Confirm antenna ground keep-outs. Verify that the RF path is short, smooth, and neat. Use curved traces or microwave corners for all turns; never use 90-degree turns. Avoid width discontinuities over pads. If trace widths differ significantly from component pad widths, then the width change should be mitered. Verify there are no stubs. Do not use thermals on RF traces because of their high loss. The RF traces between AW-NM430 RF_ANT pin and antenna must be made using 50 controlled-impedance transmission line. 4 2. Ground Layout Please follow general ground layout guidelines. Here are some general rules for customers reference. The layer 2 of PCB should be a complete ground plane. The rule has to be obeyed strictly in the RF section while RF traces are on the top layer. Each ground pad of components on top layer should have via drilled to PCB layer 2 and via should be as close to pad as possible. A bulk decoupling capacitor needs two or more. Dont place ground plane and route signal trace below printed antenna or chip antenna to avoid destroying its electromagnetic field, and there is no organic coating on printed antenna. Check antenna chip vendor for the layout guideline and clearance. Move GND vias close to the pads. 3. Power Layout Please follow general power layout guidelines. Here are some general rules for customers reference. A 4.7uF capacitor is used to decouple high frequency noise at digital and RF power terminals. This capacitor should be placed as close to power terminals as possible. In order to reduce PCBs parasitic effects, placing more via on ground plane is better. 4. Digital Interface Please follow power and ground layout guidelines. Here are some general rules for customers reference. The digital interface to the module must be routed using good engineering practices to minimize coupling to power planes and other digital signals. The digital interface must be isolated from RF trace. 5. RF Trace The RF trace is the critical to route. Here are some general rules for customers reference. The RF trace impedance should be 50 between ANT port and antenna matching network. The length of the RF trace should be minimized. To reduce the signal loss, RF trace should laid on the top of PCB and avoid any via on it. 5 The CPW (coplanar waveguide) design and the microstrip line are both recommended; the customers can choose either one depending on the PCB stack of their products. The RF trace must be isolated with aground beneath it. Other signal traces should be isolated from the RF trace either by ground plane or ground vias to avoid coupling. To minimize the parasitic capacitance related to the corner of the RF trace, the right angle corner is not recommended. If the customers have any problem in calculation of trace impedance, please contact AzureWave. Correct RF trace 6 Right-angled corner Via on RF trace Incorrect RF trace AW-NM430 RF trace should be follow the rules as below a. Line length of Antenna trace about 373.5 mil and 94.9 mil b. Line width of Antenna trace about 8 mil c. Air gap between RF trace and ground about 25 mil 7 6. Antenna Matching PCB designer should reserve an antenna matching network for post tuning to ensure the antenna performance in different environments. Matching components should be close to each other. Stubs should also be avoided to reduce parasitic while no shunt component is necessary after tuning. 7. GENERAL LAYOUT GUIDELINES Follow these guidelines to obtain good signal integrity and avoid EMI:

1. Place components and route signals using the following design practices:

Keep analog and digital circuits in separate areas. 8 Identify all high-bandwidth signals and their return paths. Treat all critical signals as current loops. Check each critical loop area before the board is built. A small loop area is more important than short trace lengths. Orient adjacent-layer traces so that they are perpendicular to one another to reduce crosstalk. Keep critical traces on internal layers, where possible, to reduce emissions and improve immunity to external noise. However, RF traces should be routed on outside layers to avoid the use of vias on these traces. Keep all trace lengths to a practical minimum. Keep traces, especially RF traces, straight wherever possible. Where turns are necessary, use curved traces or two 45-degree turns. Never use 90-degree turns. 2. Consider the following with respect to ground and power supply planes:

Route all supply voltages to minimize capacitive coupling to other supplies. Capacitive coupling can occur if supply traces on adjacent layers overlap. Supplies should be separated from each other in the stack-up by a ground plane, or they should be coplanar (routed on different areas of the same layer). Provide an effective ground plane. Keep ground impedance as low as possible. Provide as much ground plane as possible and avoid discontinuities. Use as many ground vias as possible to connect all ground layers together. Maximize the width of power traces. Verify that they are wide enough to support target currents, and that they can do so with margin. Verify that there are enough vias if the traces need to change layers. 3. Consider these power supply decoupling practices:

Place decoupling capacitors near target power pins. If possible, keep them on the same side as the IC they decouple to avoid vias that add inductance. If a filter component cannot be directly connected to a given power pin with a very short and fat etch, do not connect it by a copper trace. Instead, make the connection directly to the associated planes using vias. Use appropriate capacitance values for the target circuit, and consider each capacitor's self-

resonant frequency. 9 10. Stamp Module stencil and Pad opening Suggestion Stencil thickness0.10~0.12mm Function Pad opening size suggestion: Max. 1:1 PS: This opening suggestion just for customer reference, please discuss with AzureWaves Engineer before you start SMT. Solder Printer Opening and Customer PCB Footprint suggestion. Example:

10 11. The other layout guide Information Make sure every power traces have good return path (ground path). Connect the input pins of unused internal regulators to ground. Leave the output pins of unused internal regulators floating. High speed interface (i.e. UART/SDIO/HSIC) shall have equal electrical length. Keep them away from noise sensitive blocks. Good power integrity of VDDIO will improve the signal integrity of digital interfaces. Good return path and well shielded signal can reduce crosstalk, EMI emission and improve signal integrity. port. RF IO is around 50 ohms, reserve Pi or T matching network to have better signal transition from port to Smooth RF trace help to reduce insertion loss. Do not use 90 degrees turn (use two 45 degrees turns or one miter bend instead). Well arranged ground plane near antenna and antenna itself will help to reduce near field coupling between other RF sources (e.g. GSM/CDMA antennas). Discuss with AzureWave Engineer after you finish schematic and layout job. 11 12. Mechanical Drawing Package Outline Drawing 12 Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT NOTE:

FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. IMPORTANT NOTE:

This module is intended for OEM integrator. This module is only FCC authorized for the specific rule parts listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Additional testing and certification may be necessary when multiple modules are used. satisfied. USERS MANUAL OF THE END PRODUCT:

In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following "

Contains TX FCC ID: TLZ-NM430SM ". This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. Antenna List Ant. Brand Model Name Antenna Type Connector Gain (dBi) 1 2 YAGEO ANT3216A063R2400A Chip Antenna MAG. LAYERS MSA-4008-25GC1-A2 PIFA Antenna I-PEX I-PEX 1.69 2.98 This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:

(1) This device may not cause interference.

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil contient des metteurs / rcepteurs exempts de licence qui sont conformes au (x) RSS (s) exempts de licence d'Innovation, Sciences et Dveloppement conomique Canada. L'opration est soumise aux deux conditions suivantes:

(1) Cet appareil ne doit pas provoquer d'interfrences.

(2) Cet appareil doit accepter toute interfrence, y compris les interfrences susceptibles de provoquer un fonctionnement indsirable de l'appareil. This device and its antenna(s) must not be co-located with any other transmitters except in accordance with IC multi-transmitter product Referring to the multi-transmitter policy, multiple-transmitter(s) and module(s) can be operated simultaneously without reassessment permissive procedures. change. Cet appareil et son antenne (s) ne doit pas tre co-localiss ou fonctionnement en association avec une autre antenne ou transmetteur. This radio transmitter [6100A-NM430SM] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Le prsent metteur radio (6100A-NM430SM) a t approuv par Innovation, Sciences et Dveloppement conomique Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal d'antenne. Les types d'antennes non inclus dans cette liste qui ont un gain suprieur au gain maximal indiqu pour tout type list sont strictement interdits pour une utilisation avec cet appareil. IMPORTANT NOTE:

IC Radiation Exposure Statement:

This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Cet quipement est conforme aux limites d'exposition aux rayonnements IC tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. IMPORTANT NOTE:

This module is intended for OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessary when multiple modules are used. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the IC RSS-102 radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT:

In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the IC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. Operation is subject to the following two conditions: (1) this device may not cause harmful interference (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following "

Contains IC: 6100A-NM430SM". The Host Model Number (HMN) must be indicated at any location on the exterior of the end product or product packaging or product literature which shall be available with the end product or online. Ant. Brand Model Name Antenna Type Connector Gain (dBi) YAGEO ANT3216A063R2400A Chip Antenna MAG. LAYERS MSA-4008-25GC1-A2 PIFA Antenna I-PEX I-PEX 1.69 2.98 Antenna List 1 2

AzureWave Technologies, Inc.

8F., No.94, Baozhong Rd. , Xindian Dist., New Taipei City , Taiwan 231

Confidential Letter

Date: 2021/8/13

Federal Communications Commission

7435 Oakland Mills Road

Columbia MD 21046

Subject: Request for Confidentiality

FCC ID：TLZ-NM430SM

To Whom It May Concern:

Long Term Confidentiality

Pursuant to Sections 0.457 and 0.459 of the Commission’s Rules, we hereby respectfully request

confidential treatment of information accompanying this application as outlined below:

● Block Diagrams

Schematics

●

● Operational Description

The above materials contain trade secrets and proprietary information not customarily released to the

public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified

benefits to its competitors.

We understand that pursuant to Rule 0.457, disclosure of this Application and all accompanying

documentation will not be made before the date of the Grant for this application.

Short Term Confidentiality

Pursuant to Sections 0.457 and 0.459 of the Commission’s Rules, we hereby respectfully request short-term

confidential treatment of information accompanying this application as outlined below until 90 days after

the Grant Date of Equipment Authorization in order to ensure sensitive business information remains

confidential until the actual marketing of the device:

● External Photos

Internal Photos

Test Setup photos

●

●

● Users Manuals

Respectfully,

Applicant’s company name

: AzureWave Technologies, Inc.

Applicant’s company address

: 8F., No.94, Baozhong Rd. , Xindian Dist., New Taipei City , Taiwan

231

Signature

:

Name and Job Title

: Patrick Lin / Director

E-Mail

Tel

Fax

: patrick.lin@azurewave.com

: 02-55995599 *5580

: 02-66289666

Module Approval Request Letter Date: 2021/9/9 Subject: Module Approval 3. 2. FCC ID: TLZ-NM430SM To Whom It May Concern:

We, Sporton International Inc., are authorized by AzureWave Technologies, Inc. to have their state-of-the-art device approved under module approval authorization. The application of this module is specified to mobile host equipment. The requirements regulated in KDB 996369 D01 & Part 15.212 have been fulfilled and clearly explained below. 1. The requirement of RF shielding: The shielding of the radio portion can be demonstrated in exhibition External Photo. The requirement of buffered inputs: Buffered data inputs stage has been integrated in chip RTL8723DS. The requirement of power supply regulation: The part number of the power regulator is in chip RTL8723DS. The requirements of section 15.203 and 15.204(C): The requirements of antenna connector and spurious emission have been fulfilled. Please reference the exhibition Test Report. The requirement of stand-alone test configuration: Please reference exhibition Test Configuration Photo for the stand-alone test configuration. The requirement of labeling: The instruction on the labeling rule of the end product has been stated in the users manual of this module. Please also see the exhibition Label Sample. The requirement of compliance on specific rule or operating requirements: The required FCC rule has been fulfilled and all the instructions for maintaining compliance has been clearly stated in the Users Manual. The requirement of RF exposure: Please refer exhibition RF Exposure for the compliance of MPE RF exposure rule. 4. 6. 8. 7. 5. Please do not hesitate to contact me for any questions of this request letter. Thank you. Company name

: Sporton International Inc. Company Address

: No.8, Lane 724, Bo-ai St., Jhubei City, Hsinchu County 302, Taiwan, R.O.C. Signature

Name Job Title

: Leo Huang

: Manager

AzureWave Technologies, Inc.

8F., No.94, Baozhong Rd. , Xindian Dist., New Taipei City , Taiwan 231

Power of Attorney

Date: 2021/8/13

I hereby have entrusted the following person to be a proxy regarding application for Type

Address

: No.8, Lane 724, Bo-ai St., Jhubei City, HsinChu County 302, Taiwan, R.O.C.

e-mail

: Leohuang@sporton.com.tw

I am therefore responsible for the contents of the application.

Dear Sir,

Certification.

Sporton International Inc.

Name

: Leo Huang

Job Title

: Manager

FCC ID: TLZ-NM430SM

Respectfully,

Applicant’s company name

: AzureWave Technologies, Inc.

Applicant’s company address

: 8F., No.94, Baozhong Rd. , Xindian Dist., New Taipei City , Taiwan

231

Signature

:

Name and Job Title

: Patrick Lin / Director

: patrick.lin@azurewave.com

: 02-55995599 *5580

: 02-66289666

E-Mail

Tel

Fax

AzureWave Technologies, Inc.

8F., No.94, Baozhong Rd. , Xindian Dist., New Taipei City , Taiwan 231

SDoC Attestation Letter

Date: 2021/8/13

We AzureWave Technologies, Inc., as the grantee of this project (FCC ID: TLZ-NM430SM / Brand

Name: AzureWave / Model No.: AW-NM430SM, AW-NM430), would like to declare that the

composite portion has been authorized under the Supplier's Declaration of Conformity procedures

(Sporton report No.: FD131818, FCC designation number: TW1096). The final product shall

consequently comply with the FCC rule applied for SDoC Procedure.

Respectfully,

Applicant’s company name

: AzureWave Technologies, Inc.

Applicant’s company address

: 8F., No.94, Baozhong Rd. , Xindian Dist., New Taipei City , Taiwan

231

Signature

:

Name and Job Title

: Patrick Lin / Director

E-Mail

Tel

Fax

: patrick.lin@azurewave.com

: 02-55995599 *5580

: 02-66289666