XC6XXX Datasheet Single Mode Bluetooth Low Energy SoC Preliminary Specification Nanjing XinChip Micro-Electronic Corporation Nanjing Addr: Room F18, forth floor,B Building,China Cloud Computing innovation base,No6 Yongzhi Road,Nanjing,China Shanghai Addr:Room 708, B Building, No 2305 Zuchongzhi Road, Pudong New Area, Shanghai, China Web: www.xinchip.com This document contains information that may be proprietary to, and/or secrets of, XinChip Corporation. The contents of this document should not be disclosed outside the companies without specific written permission. Disclaimer: Descriptions of specific implementations are for illustrative purpose only, actual hardware implementation may differ. Datesheet V1.9 1 General Description 1.1 Overview The XC6XXX chip is a very low power, high performance and highly integrated SoC with Bluetooth 5.0 BLE transceiver. It integrates a high-performance 2.4GHz RF transceiver, rich features baseband, 32 bit MCU and various peripheral IOs. It support 256KByte FLASH and 128KByte RAM to enable programmable protocol and profile to support customized applications. The XC6XXX is manufactured using advanced 55nm CMOS low leakage process,which offers highest integration, lowest power consumption, lowest leakage current and reduced BOM cost while simplifying the overall system design. Rich peripherals include an 8 channel general purpose ADC, power-on-reset(POR), 3axis Q-decoder,UART/SPI/I2C and up to 19 GPIOs, which further reduce overall system cost and size. The XC6XXX operates with a power range from 1.8 to 5.5V and very low power consumption in both Tx and Rx modes, enabling long lifetimes in battery-operated systems while maintaining excellent RF performance.The device can enter an ultra low power sleep mode in which the registers and retention memory content are retained while low power oscillator and sleep timer are ON. The QFN4x4_32 (up to 19 GPIOs) Package is available 1.2 Block Diagram 2 1.3 Application HID Application Lighting Control Wireless Sensor Networks 3D Glassed Proximity and Find Me 1.4 Features Bluetooth 5.0 BLE RF SOC Operation voltage 1.8 V to 3.6 V Operation voltage 3.1 V to 5.5 V ON-CHIP 5V LDO
-94 dBm Sensitivity@1Mbps Maximum 6 dBm output power Low Jitter 32K RC oscillator 32bit MCU Integrated 4-wires ext.-FLASH Interface 128 KByte data RAM I2Cs, SPI and 2 UART Interface 10-channel 10-bit General ADC PWM(max 6, 2 wi inv) keyscan 3 axis Q-decoder Low Power Real Time Counter 1 uA in Sleep Mode 14 uA in Suspend Mode 16 mA Transceiver RX Active 15 mA Transceiver TX Active QFN 4x4 32-pin Package Datesheet V1.9 2 Pin Information (XC6XXX SOP16) The pin assignment for SSOP16 package is shown in picture below. Description SWI data/ General I/O/PWM5 SWI clk/ General I/O/PWM4 Chip boot mode control/ General I/O/PWM0(PWM0 INVERTING can mux to pin1,2,4,5,8,9,10,11) General I/O/ PWM General I/O/12M clkoutput The output of digital LDO, 100nF decap cap The output of digital LDO, 1uF decap cap General I/O/GADC input5/PWM3 General I/O/GADC input4/PWM2 General I/O/GADC input2/uart_rx General I/O/GADC input3/uart_tx The input of 32M crystal oscillator The output of 32M crystal oscillator 3V power supply GND ANT The input of RF 16 Note: max 6 PWM,PIN1=PWM5,PIN2=PWM4,PIN8=PWM3,PIN9=PWM2. PWM0,1(wi INV) can mux to PIN3,4,5,10,11. Can be waked up by alarm &GPIO0~1(pin8,9) in deepsleep mode. Can be waked up by sleep timer & any GPIO in sleep mode. NO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Name SWD SWCK BOOTCTL GPIO3 GPIO2 DECAP1 DECAP2 GPIO1 GPIO0 GPIO19 GPIO18 XC1 XC2 AVDD VSS 3 Datesheet V1.9 3 Electrical Specifications Name Parameter(condition) Min Typ Max Unit 3.1 2.4 1.7 1.7 1.7 1.7 1.1 1.1
-40 VIO-0.3 VSS VIO-0.3 VSS Power Supplies HVIN Voltage Input,typically 4.7uF decouple cap HVOUT Voltage Output, typically 1uF decouple cap, maximum 50mA load capability IQ_HV Quiescent Current of high voltage LDO AVDD Voltage Input,typically 1uF decouple cap AVDD Voltage Input,typically 1uF decouple cap Voltage Output, typically 100nF decouple cap Voltage Output, typically 100nF decouple cap, AVDD Voltage Input VDDIO Voltage Input VDD VDD Temperature TEMP Temperature Digital Input Pin VIH VIL High Level Low Level Digital Output Pin VOH VOL High Level Low Level Current Consumption IVDD Deep sleep mode (LPO, POR, alarm, I/O interrupts on), can be waked up by alarm &
GPIO0~4 IVDD Suspend mode (LPO, 128kB retention RAM,POR, sleep timer, I/O interrupts on), can be waked up by sleep timer & any GPIO IVDD RX mode, BLE , 100% on(wo DCDC @3V) IVDD TX mode, BLE mode, 100% on(wo DCDC
@3V) Normal RF Condition IVDD Average Current, 500ms sniff, hold connection 32 uA FOP Operating Frequency 2400 2480 Mhz FXTAL Crystal Frequency 16 32 Transmitter Characteristics PRF CD RF output power Carrier Drift Rate PRF1 Out of band emission 2Mhz(GFSK)
-24
-1 dBm kHz/50us dBm 4 Com ment
(1)
(2)
(3)
(4)
(5)
(6)
(7) 5.5 3.3 3.6 3.6 3.6 3.6 1.3 1.3
+125 VIO+0.3 VSS+0.3 VIO+0.3 VSS+0.3 nA V V V V V V V V V V V V uA uA mA mA 5 2.9 600 1.2 1.2 1 14 16 15 0 5
-40 Datesheet Out of band emission 3Mhz(GFSK) PRF2 BW 20dB bandwidth V1.9 dBm Mhz PRF1 Out of band emission 2Mhz (/4 DQPSK &
-20 PRF2 Out of band emission 3Mhz (/4 DQPSK &
-42
-40 8PSK) 8PSK) Receiver Characteristics BT4.0 (BLE) SEN High Gain mode, Sensitivity @0.1%
MaxIn Maximum Input Power C/ICO Co-channel C/I, Basic Rate, GFSK C/I1ST ACS C/I 1Mhz, Basic Rate, GFSK C/I2ND ACS C/I 2Mhz, Basic Rate, GFSK C/I3RD ACS C/I 3Mhz, Basic Rate, GFSK C/I1STI ACS C/I image channel, Basic Rate, GFSK C/I2NDI C/I 1 MHz adjacent to image channel, Basic Rate, GFSK
-48 0.9
-30
-94 5 7 5.5
-36
-43
-34
-28 7
-34 dBm dBm dB dB dB dB dB dB
(1) HVIN & HVOUT are input & output of a high voltage LDO which is integrated, input voltage range from 3.1~5.5V, and maximum load 10apability up to 50mA. Typically used in Li_BAT(3.0~4.2V) or USB_Power(4.5~5.5V) applications. If input voltage is lower than 3.6V, HVIN & HVOUT should be left unconnected and should be powered by AVDD,VDDIO directly.
(2) If RF output power should be larger than -4dBm, AVDD should be larger than 2.4V..
(3) VDDIO should always be powered on in all working cycles..
(4) By default, 128kB retention memory is on in retention mode, 64/96/128kB retention memory is surported.
(5) Result based on standard gain mode.
(6) Result based on 0dBm Pout.
(7) 16M, 32M crystal supported, 32M by default. 4 Crystal Oscillator The crystal oscillator requires a crystal with an accuracy of 40ppm as defined by the Bluetooth specification. Without external load capacitors are required to work with the crystal oscillator. The selection of the load capacitors is crystal dependent. The recommended crystal specification shows below. NC/17pF 2 NC/17pF 2 C rystal XIN XOUT 5 Datesheet V1.9 Recommended Oscillator Configuation 12 pF Load Crystal Reference Crystal Electrical Specifications Name Parameter Min Typ Max Unit Comment
(condition) Frequency tolerance
@25 Tolerance stablility over temp @0 to @70 40 40 Operating temperature range
-40
+125 degree Fundamental 32 10 10 12 100 Mhz ppm ppm pF uW Frequency Oscillation mode Load capacitance Drive level Average Current 1 32 137 Unit uA uA uA 5 Power consumption W/O DC-DC Sleep Parameter
Sniff 500ms interval Discoverable ADV interval:640ms Scan interval: 1280ms Scan window:11.25ms 6 Bluetooth Security 6. 1 Pairing Pin Code 6.2 Security Simple Pairing Just Work(No input) Keyboard DisplayYesNo 7 Mfi 6 Support Apples Mfi authentication and iAP1/iAP2 protocols. Datesheet V1.9 8 Bluetooth Stack 7 Datesheet V1.9 10 Application Schematic(XC6XXX SSOP16/SOP16) Programing port:
8 Datesheet V1.9 NoteThe power supply and grounding pad should be as large as possible (as shown in the following figure), and the power supply and grounding trace should be as wide as possible. If the power supply and grounding trace cannot be widened at the same time, the grounding trace should be widened first. Power Supply GND 9 FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this de vice may not cause harmful interference, and (2) this device must accept any interference received, including i nterference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the users au thority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant t o part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interferenc e in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not in stalled and used in accordance with the instructions, may cause harmful interference to radio communications. H owever, there is no guarantee that interference will not occur in a particular installation. If this equipment does ca use harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help important announcement Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular. If the end product will involve the Multiple simultaneously transmitting condition or different operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer for the installation method in end system. 2.4 Limited module procedures Not applicable Not applicable 2.5 Trace antenna designs 2.6 RF exposure considerations The device has been evaluated to meet general RF exposure requirement. The device can be used installed and operated with minimum distance 0mm between the radiator and your body. 2.7 Antennas This radio transmitter 2AFWP-XC6XXX has been approved by Federal Communications Commission to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Model 2402-2480MHz BT Type PCB antenna Peak Gain(dBi) 0 dBi 2.8 Label and compliance information The final end product must be labeled in a visible area with the following "Contains FCC ID: 2AFWP-XC6XXX ". 2.9 Information on test modes and additional testing requirements Host manufacturer is strongly recommended to confirm compliance with FCC requirements for the transmitter when the module is installed in the host. 2.10 Additional testing, Part 15 Subpart B disclaimer Host manufacturer is responsible for compliance of the host system with module installed with all other applicable requirements for the system such as Part 15 B. ISED Statement
-English: This device complies with Industry Canada license exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, a nd (2) This device must accept any interference, including interference that may cause undesired operation of the device. The digital apparatus complies with Canadian CAN ICES 3(B).
-French: Le prsentappareilestconforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationestautorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareildoit accepter tout brouillageradi olectriquesubi, mmesi le brouillageest susceptible d'encompromettre le fonctionnement. L'appareil numrique est conforme CAN CAN ICES-3 (B) / NMB-3 (B). 3 (B)/NMB This radio transmitter (ISED certification number: 21116-XC6XXX) has been approved by Industry Canada to operate with the antenna types listed with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le prsent metteur radio (ISED certification number: 21116-XC6XXX) a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur. Radiation Exposure Statement The device has been evaluated to meet general RF exposure requirement. The device can be used installed and operated with minimum distance 0mm between the radiator and your body. Dclaration d'exposition aux radiations L'appareil a t valu pour rpondre aux exigences gnrales d'exposition aux RF.Cet quipement doit tre install et utilis avec une distance minimale de 0 mm entre le radiateur et votre corps. This device is intended only for OEM integrators under the following condition:
The transmitter module may not be co-located with any other transmitter or antenna. As long as the condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes:
Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 1 condition ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the ISED cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. Note Importante:
Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l' ISED ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling The final end product must be labeled in a visible area with the following: Contains IC:
21116-XC6XXX. Plaque signaltique du produit final Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: Contient des IC: 21116-XC6XXX. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel.