BoT-nLE521 1 / 17 BoT-nLE521 List of Contents 1. General ............................................................................................................................................. 3 1.1 Overview ...................................................................................................................................................................3 1.2 Block Diagram ........................................................................................................................................................3 1.3 Features .....................................................................................................................................................................4 1.4 Application ...............................................................................................................................................................4 1.5 Pin Configuration ..................................................................................................................................................5 1.6 PIN Description ......................................................................................................................................................6 1.7 Dimensions ..............................................................................................................................................................7 1.8 Land Pattern ............................................................................................................................................................8 2. Characteristics ................................................................................................................................ 9 2.1 Electrical Characteristics .....................................................................................................................................9 2.2 RF Characteristics ............................................................................................................................................... 11 3.1 Regulator ............................................................................................................................................................... 12 3.2 32.768KHz Crystal Oscillator .......................................................................................................................... 13 4. Application Schematic ............................................................................................................... 15 5. Antenna ......................................................................................................................................... 16 5.1 Antenna Layout Guide ..................................................................................................................................... 16 6. Certification .................................................................................................................................. 17 6.1 FCC Statement ..................................................................................................................................................... 17 2 / 17 BoT-nLE521 1. General 1.1 Overview The BoT-nLE521 module is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth Smart (Bluetooth low energy) applications. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. BoT-nLE521 combines an excellent RF transceiver with an industry-standard enhanced Cortec-M4 CPU, in-system programmable flash memory, 24kB RAM, and many other powerful supporting features and peripherals. The BoT-nLE521 is suitable for systems where very low power Consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption. 1.2 Block Diagram 3 / 17 BoT-nLE521 1.3 Features Built in Antenna Bluetooth Smart (Bluetooth Low Energy) Module. ARM Cortex-M4 32-bit processor with FPU, 64 MHz Memory: 192 kB Flash / 24 kB RAM RF Output Power: MAX +4 dBm (-20 ~ 4 dBm) RF Receive Sensitivity: -96 dBm Type 2 near field communication (NFC-A) tag with wakeup-on-field and touch to-pair capabilities Fully automatic LDO and DC/DC regulator system (Used LDO by Default) Temperature Sensor UART (CTS/RTS) with EasyDMA, SPI, and I2C data interfaces. 12-Bit 200 ksps ADC with - 8 configurable channels with programmable gain Size: 15 mm x 8 mm x 1.8 mm Operating Voltage: 1.7V to 3.6V Operating Temperature: -40 to +8 RoHS compliant 1.4 Application Computer peripherals and I/O devices Mouse Keyboard Multi-touch trackpad Interactive entertainment devices Remote control Gaming controller Beacons Personal Area Networks Health/fitness sensor and monitor devices Medical devices Key-fobs + wrist watches Remote control toys 4 / 17 1.5 Pin Configuration BoT-nLE521 GND GND GND GND P0.25 P0.28/AIN4 P0.30/AIN6 DEC4 DCC 1 2 3 4 5 6 7 8 9 VDD_nRF 10 32 31 33 GND 30 GND 29 GND 28 SWDIO 27 SWDCLK 26 P0.21/RESET 25 P0.20 24 P0.18 23 P0.16 22 P0.15 21 P0.14 11 12 13 14 15 16 17 18 19 20 TOP VIEW 5 / 17 BoT-nLE521 1.6 PIN Description Pin No. Pin Name Pin Function Description 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 GND GND GND GND P0.25 P0.28 AIN4 P0.30 AIN6 DEC4 DCC VDD_nRF GND P0.00 XL1 P0.01 XL2 P0.04 AIN2 P0.05 AIN3 P0.06 RXD P0.09 TXD P0.10 CTS P0.12 RTS GND P0.14 P0.15 P0.16 P0.18 P0.20 P0.21 RESET SWDCLK SWDIO GND GND RF ANT GND GROUND GROUND GROUND GROUND DIGITAL I/O DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT POWER POWER POWER GROUND DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT DIGITAL I/O DIGITAL INPUT DIGITAL I/O DIGITAL OUTPUT DIGITAL I/O DIGITAL OUTPUT DIGITAL I/O DIGITAL INPUT GROUND DIGITAL I/O DIGITAL I/O DIGITAL I/O DIGITAL I/O DIGITAL I/O DIGITAL I/O nRESET DIGITAL INPUT DIGITAL I/O GROUND GROUND RF IN / OUT PORT INTERNAL Ground Pin. Ground Pin. Ground Pin. Ground Pin. General purpose I/O pin. General purpose I/O pin. SAADC/COMP input General purpose I/O pin. COMP input 1.3 V regulator supply decoupling Input from DC/DC converter. Output from 1.3 V LDO DC/DC regulator output Power supply pin. Ground Pin. General purpose I/O pin. Connec on for 32.768 kHz crystal (LFXO) General purpose I/O pin. Connec on for 32.768 kHz crystal (LFXO) General purpose I/O pin. SAADC/COMP input General purpose I/O pin. SAADC/COMP input General purpose I/O pin. UART RXD General purpose I/O pin. UART TXD General purpose I/O pin. UART CTS General purpose I/O pin. UART RTS Ground Pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. Con gurable as system RESET pin. Serial Wire Debug clock input for debug and programming Serial Wire Debug I/O for debug and programming Ground Pin. Ground Pin. Bluetooth 50 transmi Internal antenna. It should be connected to Pin 32 RF for input ANTENNA IN / OUT GROUND normal opera on. Ground Pin. 6 / 17 1.7 Dimensions 8.0mm 4.0 BoT-nLE521 1 0.5 2 3 4 5 6 7 8 9 0.5 10 11 0.35 0.20 0.4 32 31 3.0 33 2.0 3.0 30 29 28 27 26 25 24 23 22 21 0.3 12 0.3 13 14 15 16 17 0.3 18 0.3 19 20 0.5 0.8 0.5 0.35 0.825 TOP VIEW 7 / 17 BoT-nLE521 1.8 Land Pattern 8.0mm 6.2 4.0 4.0 0.4 32 31 0.3 3.0 33 2.0 3.0 1 1.2 2 3 4 5 6 7 8 0.2 0.3 9 1.2 0.9 10 30 29 28 27 26 25 24 23 22 21 0.3 0.3 0.3 0.3 11 12 13 14 15 16 17 18 19 20 0.35 0.5 0.825 0.8 0.50 0.35 Land Pattern (TOP VIEW) 8 / 17 2. Characteristics 2.1 Electrical Characteristics Absolute Maximum Ratings Symbol Parameter VDD GND VI/O, VDD 3.6V VI/O, VDD >3.6V Storage temperature Radio MSL ESD HBM ESD CDM Endurance Reten on Min.
-0.3
-0.3
-0.3
-40 RF Input Level Moisture Sensi vity Level 2 Human Body Model Charged Device Model Flash Memory Endurance 10000 Flash Memory Reten on 10 years BoT-nLE521 Max.
+3.9 0 VDD + 0.3
+3.9
+125 10 4 1000 Units V V V V C dBm kV V write/erase cycles At 40 C Recommended Operating Conditions Symbol Parameter VDD VDD tR_VDD TA LDO Regulator Opera on (Default Mode) DC/DC Regulator Oprta on Supply rise me (0V to 1.7V) Opera on temperature Min. 1.7 2.1 Typ. 3.0 3.0
-40 25 Max. 3.6 Units V 3.6 60 85 V ms C DC Characteristics Symbol Parameter (condi on) Input high voltage Input low voltage Min. 0.7 X VDD Typ. Max. VDD Units V VSS 0.3 X VDD Output high voltage, standard drive, 0.5 mA, VDD 1.7 VDD-0.4 Output high voltage, high drive, 5 mA, VDD 2.7 V Output high voltage, high drive, 3 mA, VDD 1.7 V Output low voltage, standard drive, 0.5 mA, VDD 1.7 Output low voltage, high drive, 5 mA, VDD 2.7 V VDD-0.4 VDD-0.4 VSS VSS VDD VDD VDD VSS +0.4 VSS +0.4 VIH VIL VOH,SD VOH,HDH VOH,HDL VOL,SD VOL,HDH V V V V V V 9 / 17 BoT-nLE521 VSS +0.4 16 16 VOL,HDL Output low voltage, high drive, 3 mA, VDD 1.7 V RPU RPD Pull-up resistance Pull-down resistance ITX,+4dBm,DCDC TX only run current (DCDC, 3V) PRF=+4 dBm ITX,+4dBm TX only run current PRF=+4 dBm IRX,1M,DCDC RX only run current (DCDC, 3V) 1Msps IRX,1M RX only run current 1Msps IRX,2M,DCDC RX only run current (DCDC, 3V) 2Msps IRX,2M RX only run current 2Msps ION_RAMOFF_EVENT System ON, No RAM reten on, Wake on any event ION_RAMON_EVENT System ON, Full 24 kB RAM reten on, Wake on any event ION_RAMON_POF ION_RAMON_GPIOTE ION_RAMON_GPIOTEPORT ION_RAMON_RTC IOFF_RAMOFF_RESET IOFF_RAMON_RESET System ON, Full 24 kB RAM reten on, Wake on any event, Power fail comparator enabled System ON, Full 24 kB RAM reten on, Wake on GPIOTE input
(Event mode) System ON, Full 24 kB RAM reten on, Wake on GPIOTE PORT event System ON, Full 24 kB RAM reten on, Wake on RTC
(running from LFRC clock) System OFF, No RAM reten on, Wake on reset System OFF, Full 24 kB RAM reten on, Wake on reset VSS 11 11 13 13 7.0 15.4 4.6 10.0 5.2 11.2 0.6 0.8 0.8 3.3 0.8 1.5 0.3 0.5 V k k mA mA mA mA mA mA A A A A A A A A 10 / 17 Min. 2402 2.2 RF Characteristics Symbol fOP Descrip n Opera ng frequencies fPLL,PROG,RES PLL programming resolu on fPLL,CH,SP PLL channel spacing fDELTA,BLE,1M Frequency devia on @ BLE 1Msps fDELTA,BLE,2M Frequency devia on @ BLE 2Msps PRF PRFC PRFCR PRF1,1 PRF2,1 PRF1,2 PRF2,2 Maximum output power RF power control range RF power accuracy 1st Adjacent Channel Transmit Power 1 MHz (1 Msps) 2nd Adjacent Channel Transmit Power 2 MHz (1 Msps) 1st Adjacent Channel Transmit Power 2 MHz (2 Msps) 2nd Adjacent Channel Transmit Power 4 MHz (2 Msps) PRX,MAX Maximum received signal strength at < 0.1% PER PSENS,IT,SP,1M,BLE Sensi vity, 1Msps BLE ideal transmi er, <=37 bytes BER=1E-3 PSENS,IT,SP,2M,BLE Sensi vity, 2Msps BLE ideal transmi er, <=37 bytes RSSIACC RSSI Accuracy Valid range -90 to -20 dBm RSSIRESOLUTION RSSI resolu on RSSIPERIOD Sample period Typ. 2 1 250 500 0 24
-25
-50
-25
-50 0
-96
-93 2 1 8 BoT-nLE521 Max. 2480 Units MHz 4 4 kHz MHz kHz kHz dBm dB dB dBc dBc dBc dBc dBm dBm dBm dB dB us 11 / 17 BoT-nLE521 3. Terminal Description 3.1 Regulator The following internal power regulator alternatives are supported:
Internal LDO regulator Internal DC/DC regulator The LDO is the default regulator. Using the DC/DC regulator will reduce current consumption compared to when using the LDO regulator, but the DC/DC regulator requires an external LC filter to be connected, as shown in Figure. LDO Regulator Setup DC/DC Regulator Setup 12 / 17 BoT-nLE521 3.2 32.768KHz Crystal Oscillator The BoT-nLE521 external 32.768KHz Crystal does not required for BLE mode If you choose to use an internal 32.768kHz oscillator, an average of 10uA of current is consumed compared to an external crystal. The ANT specification requires 50ppm accuracy for a 32.768kHz clock. The internal 32.768kHz oscillator may not meet specifications. BoT-nLE521 F/W does not yet support ANT Mode. Clock control The load capacitance (CL) is the total capacitance seen by the crystal across its terminals and is given by:
Circuit diagram of the 32.768 kHz crystal oscillator C1 and C2 are ceramic SMD capacitors connected between each crystal terminal and ground. Cpcb1 and Cpcb2 are stray capacitances on the PCB. 13 / 17 BoT-nLE521 32.768 kHz RC oscillator (LFRC) Symbol fNOM_LFRC Nominal frequency Descrip n fTOL_LFRC Frequency tolerance fTOL_CAL_LFRC Frequency tolerance for LFRC a calibra on Min. Typ. Max. 32.768 2 500 Units kHz
ppm 32.768 kHz crystal oscillator (LFXO) Symbol fNOM_LFXO Crystal frequency Descrip n Min. Typ. Max. 32.768 Units kHz fTOL_LFXO_BLE Frequency tolerance requirement for BLE stack fTOL_LFXO_ANT Frequency tolerance requirement for ANT stack 250 50 CL_LFXO C0_LFXO RS_LFXO PD_LFXO Cpin Load capacitance Shunt capacitance Equivalent series resistance Drive level Input capacitance on XL1 and XL2 pads 4 12.5 2 100 1 ppm ppm pF pF kohm uW pF 14 / 17 7 1
5 1 1 2 5 E L n
T o B c i t a m e h c S n o i t a c i l p p A
. 4 BoT-nLE521 5. Antenna 5.1 Antenna Layout Guide 5.0 PCB OUTLINE 8.0mm 5.0 Clearance Area 32 31 In order to use the built-in antenna on the module, please connect PAD31 and PAD32 as short as possible. 33 30 29 28 27 26 25 24 23 22 21 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 16 / 17 BoT-nLE521 6. Certification 6.1 FCC Statement FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: 2APB6-BoT-nLE521 Or Contains FCC ID: 2APB6-BoT-nLE521 When the module is installed inside another device, the user manual of the host must contain below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product Any company of the host device which install this modular with limit modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C : 15.247 and 15.209 requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirement then the host can be sold legally. 17 / 17 Operation Description RF Filter Balun Radio Mul protocol 2.4GHz Processor 64 MHz ARM Cortex-M4 CPU GPIO INT_ANT Internal Antenna
Matching Network Oscillators Power supply 32 MHz Crystal 192kB Flash with cache 24kB RAM Timers / Counters Analog I/O Digital I/O System Peripherals PIO SWDCLK SWDIO DCC DEC4 VDD BoT-nLE521 BLE wireless Module transmits and receives 2.4GHz frequency The default operating voltage is 3.3 V, and the BLE transmission / reception data is processed by the main processor BoT-nLE521 wireless transmit / receive data operates with AT + Command stored in main processor. Appendix A. FCC ID Label and Location FCC ID: 2APB6-BOT-NLE521 Product Label Sample with FCC Label information Following is a sample copy of the label that will be placed on the rear cabinet of the product. The FCC ID Label and compliance statement are marked in the product label. The warning statement and Information to the User are described in the user manual.
- Model: BoT-nLE521 Label Location The label shown shall be permanently affixed at a conspicuous location on the device and be readily visible to the user at the time purchase.(Labeling requirements per 2.925) Label here Report no. ETLT180307.0036, Page A1 of A1 Head Office: #371-51, Gasan-dong, Geumcheon-gu, Seoul, 153-803, Korea Tel : 82-2-858-0786 Fax : 82-2-858-0788 Open site: #499-1, Sagot-ri, Seosin-myeon, Hwaseong-si, Gyeonggi-do, 445-882, Korea ETLQP-21-F40-0 Appendix J. Radio Frequency Exposure FCC ID: 2APB6-BOT-NLE521 Standard Applicable:
According to 1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensure that the public is not exposed to radio frequency energy level in excess of the Commissions guideline. This is a Portable device with its physical nature to be used nearby, the distance between radiating structure and human is less than 20 cm. As per KDB 447498 D01, The 1-g and 10-g SAR test exclusion thresholds for 100 MHz to 6 GHz at test separation distances 50 mm are determined by:
[(max. power of channel, including tune-up tolerance, mW) / (min. test separation distance, mm)] *
3.0 for 1-g SAR and 7.5 for 10-g extremity SAR, where f(GHz)]
f (GHz) is the RF channel transmit frequency in GHz Power and distance are rounded to the nearest mW and mm before calculation The result is rounded to one decimal place for comparison Measurement Result:
This is a portable device and the Max peak output power is (1.41 mW) lower than the threshold given and derived as above, where
= 1.41 (mW) / 5 (mm) * 2.480 (GHz) = 0.44 < 3.00 As the result of calculation result indicates, the RF exposure generating from given transmitter (transmitter employed digital modulation) can be excluded from SAR measurement, and is deemed compliant with RF exposure as per FCC. Frequency
[MHz]
Output Power
[dBm]
Target power
[dBm]
Allowed tolerance
[dB]
Max tune up power
[dBm]
Max tune up power
[mW]
Separation distance
[mm]
RF exposure Limit 2 402 2 440 2 480 1.34 1.33 1.33
-0.5
-0.5
-0.5 2.00 2.00 2.00 1.5 1.5 1.5 1.41 1.41 1.41 5 5 5 0.44 0.44 0.44 3.00 3.00 3.00 ex) Target power[dBm] = Max tune up power[dBm] Allowed tolerance[dB]
Report no. ETLT180307.0036, Page J1 of J1 Head Office: #371-51, Gasan-dong, Geumcheon-gu, Seoul, 153-803, Korea Tel : 82-2-858-0786 Fax : 82-2-858-0788 Open site: #499-1, Sagot-ri, Seosin-myeon, Hwaseong-si, Gyeonggi-do, 445-882, Korea ETLQP-21-F40-0