all | frequencies |
|
|
|
|
exhibits | applications |
---|---|---|---|---|---|---|---|
manual | photos | label |
app s | submitted / available | |||||||
---|---|---|---|---|---|---|---|---|
1 |
|
UM | Users Manual | 2.07 MiB | April 13 2021 | |||
1 |
|
internal photo | Internal Photos | 235.02 KiB | April 13 2021 | |||
1 |
|
external photo | External Photos | 386.80 KiB | April 13 2021 | |||
1 |
|
label and location | ID Label/Location Info | JPEG Image | 45.88 KiB | April 13 2021 | ||
1 |
|
Compliance list statement 996369 | Attestation Statements | 216.94 KiB | April 13 2021 | |||
1 |
|
DTS P1 | Test Report | 3.60 MiB | April 13 2021 | |||
1 |
|
DTS P2 | Test Report | 5.39 MiB | April 13 2021 | |||
1 |
|
DTS P3 | Test Report | 960.05 KiB | April 13 2021 | |||
1 |
|
FCC Authorization letter | Cover Letter(s) | 245.37 KiB | April 13 2021 | |||
1 |
|
FCC confidence letter | Cover Letter(s) | 290.32 KiB | April 13 2021 | |||
1 | Operational Description | Operational Description | April 13 2021 | confidential | ||||
1 |
|
SAR evaluation | RF Exposure Info | 55.97 KiB | April 13 2021 | |||
1 | SCH | Schematics | April 13 2021 | confidential | ||||
1 |
|
SETUP PHOTO | Test Setup Photos | 301.35 KiB | April 13 2021 | |||
1 | block diagram | Block Diagram | JPEG Image | April 13 2021 | confidential | |||
1 | Cover Letter(s) | April 13 2021 |
1 | UM | Users Manual | 2.07 MiB | April 13 2021 |
RF-WM-11AFB1 Ultra-Low-Power 2.4 GHz Wi-Fi Module Version 1.0 Shenzhen RF-star Technology Co., Ltd. Jan. 19th, 2020 www.szrfstar.com Wi-Fi Module List RF-WM-10AFB1 V1.0 - Jan., 2020 Chipset Model Cor e RA M
(KB) Tx Powe
(dBm r
) FLASH Antenn
(Byte) a Dimensio Distanc n
(mm) e
(m) Photo CC3235S M4 256 18 RF-WM-3235B1 Half-hol 20.5 S e 17.5 CC3235SF M4 256 18 RF-WM-3235B1 Half-hol 20.5 embedde e 17.5 4M 4M +
1M d 100 100 CC3220 M4 256 17 RF-WM-3220B1 4M 20 31 100 Chip /
IPEX RF-WM-3200B1 1M Chip 20 31 100 CC3200 M4 256 17 RF-WM-3200B1I 1M IPEX 20 31 150 Contact Me RF-WM-3200B2 16M Chip 20 31 100 RF-WM-3200B3 1M Half-hol 20.5 e 17.5 100 M3 512 17 RF-WM-10AFB1 1M IPEX 20 23 100 M3 512 17 RF-WM-11AFB1 1M IPEX 20 23 100 RTL8710A F F RTL8711A Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power in an open and interference-free environment in sunny weather. 2. Click the picture to buy modules. Shenzhen RF-star Technology Co., Ltd. Page 1 of 25 3. All modules with PCB / Chip antenna and IPEX connector are dispatched with PCB / Chip antenna only by default. If the IPEX connector is needed, pls check with me before quotation. RF-WM-10AFB1 V1.0 - Jan., 2020 www.szrfstar.com 1 Device Overview 1.1 Description RF-WM-11AFB1 is a PCB module based on Realtek Wi-Fi SoC RTL8711AF of the CortexTM-M3 core at 83 MHz. This module has on-chip 512 KB RAM and 1 MB flash, a pin-out of peripherals of SDIO, SPI, UART, I2C, I2S, and GPIOs. It has integrated a 40 MHz crystal, an onboard PCB antenna, and an IPEX/ U.FL connector for connecting to an external antenna. It supports 2.4 GHz 802.11 b/g/n at 20 MHz channel bandwidth with 75 Mbps maximum data rate. The module comes with a pre-programmed serial interface data communication protocol and an AT commands set to minimizes users effort to establish the data link to their existing MCUs or processors. It supports STA, AP, and STA + AP concurrent modes, advanced security features include Wi-Fi WEP, WPA, WPA2, and WPS2 with MD5, SHA-1, SHA2-256, DES, 3DES, and AES security engines. 1.2 Key Features General efficiency (A-MSDU, A-MPDU)
- CMOS MAC, baseband PHY, and RF in a
- Low latency immediate High-Throughput single chip for 802.11b/g/n compatible WLAN Block Acknowledgement (HT-BA)
- Complete 802.11n solution for 2.4 GHz band
- Long NAV for media reservation with CF-End
- 72.2 Mbps receive PHY rate and 72.2 Mbps for NAV release transmit PHY rate using 20 MHz bandwidth
- PHY-level spoofing to enhance legacy
- 150 Mbps receive PHY rate and 150 Mbps compatibility transmit PHY rate using 40 MHz bandwidth
- Power saving mechanism
- Compatible with 802.11n specification WLAN PHY features
- Backward compatible with 802.11b/g devices
- 802.11n OFDM while operating in 802.11n mode
- One Transmit and One Receive path (1T1R) Standards supported
- 20 MHz and 40 MHz bandwidth transmission
- 802.11b/g/n compatible WLAN
- Short guard interval (400 ns)
- 802.11e QoS Enhancement (WMM)
- DSSS with DBPSK and DQPSK, CCK
- 802.11i (WPA, WPA2). Open, shared key, modulation with a long and short preamble and pair-wise key authentication services
- OFDM with BPSK, QPSK, 16QAM, and
- Wi-Fi WPS support
- Wi-Fi direct support 640QAM modulation. Convolutional coding rate: 1/2, 2/3, 3/4, and 5/6
- Lightweight TCP/IP protocol
- Maximum data rate 54 Mbps in 802.11g and WLAN MAC features 150 Mbps in 802.11n
- Frame aggregation for increased MAC
- Fast receiver Automation Gain Control (AGC) Shenzhen RF-star Technology Co., Ltd. Page 2 of 25 RF-WM-10AFB1 V1.0 - Jan., 2020
- Maximum 2 PCM with 8/16 kHz sample rate
- Maximum 2 SPI supported with baud rate up to 20.8 MHz
- Maximum 2 high-speed UART interface with
- Support 4 PWM with configurable duration baud rate up to 4 MHz and duty cycle from 0 ~ 100%
- 1 log UART with standard baud rate support
- Support 4 external timer trigger event (ETE
- Maximum 3 I2C interface function) with a configurable period in low
- I2S with 8/16/24/32/48/96/44.1/88.2 kHz power mode www.szrfstar.com
- On-chip ADC and DAC Peripheral interfaces
- SDIO slave sampling rate 1.3 Applications Cloud connectivity Home automation Home appliances Access control Security systems Smart energy 1.4 Functional Block Diagram confidential Internet gateway Industrial control Smart plug Smart metering Wireless audio IP network sensor nodes Shenzhen RF-star Technology Co., Ltd. Page 3 of 25 www.szrfstar.com RF-WM-10AFB1 V1.0 - Jan., 2020 1.5 Part Number Conventions It will not be sold toIt will not be sold to a third party until the certificate is issued a third party until the certificate is issu The part numbers are of the form of RF-WM-11AFB1 where the fields are defined as follows:
RF WM 11AF
B1 Company Name RF-Star Wireless Type Wi-Fi Module Module Version The First Version Chipset Model Realtek RTL8711AF Figure 2. Part Number Conventions of RF-WM-11AFB1 Shenzhen RF-star Technology Co., Ltd. Page 4 of 25 www.szrfstar.com RF-WM-10AFB1 V1.0 - Jan., 2020 It will not be sold to a third party until the certificate is issued FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Integral antenna with antenna gain 0 dBi This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Radiation Exposure Statement The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device if without further FCC certify ,such as C2PC with SAR. This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:2AD2W-MDFPWS360 Or Contains FCC ID:2AD2W-MDFPWS360 When the module is installed inside another device, the user manual of the host must contain below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. Any company of the host device which install this modular with modular approval should perform the test of radiated & conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209
& 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 &
15.207 ,15B Class B requirementthen the host can be sold legally. Shenzhen RF-star Technology Co., Ltd. Page 5 of 25 www.szrfstar.com Table of Contents RF-WM-10AFB1 V1.0 - Jan., 2020 Wi-Fi Module List ............................................................................................................................................. 1 1 Device Overview .......................................................................................................................................... 2 1.1 Description ......................................................................................................................................... 2 1.2 Key Features ..................................................................................................................................... 2 1.3 Applications ....................................................................................................................................... 3 1.4 Functional Block Diagram ............................................................................................................... 3 1.5 Part Number Conventions ............................................................................................................... 4 Table of Contents ............................................................................................................................................ 6 Table of Figures ............................................................................................................................................... 7 Table of Tables ................................................................................................................................................. 7 2 Module Configuration and Functions ........................................................................................................ 8 2.1 Module Parameters .......................................................................................................................... 8 2.2 Module Pin Diagram......................................................................................................................... 8 2.3 Pin Functions..................................................................................................................................... 9 2.4 Pin Multiplexing ............................................................................................................................... 11 3 Specifications ............................................................................................................................................. 12 3.1 Recommended Operating Conditions ......................................................................................... 12 3.2 Handling Ratings ............................................................................................................................ 12 3.3 RF Parameters ................................................................................................................................ 12 3.3.1 RF Configuration ................................................................................................................. 12 3.3.2 Transmission Distance ....................................................................................................... 13 4 Application, Implementation, and Layout ............................................................................................... 14 4.1 Module Photos ................................................................................................................................ 14 4.2 Recommended PCB Footprint ..................................................................................................... 14 4.3 Antenna ............................................................................................................................................ 15 4.4 Schematic Diagram ........................................................................................................................ 16 4.5 Download and Debug Interface .................................................................................................... 17 4.6 Basic Operation of Hardware Design .......................................................................................... 17 4.7 Trouble Shooting............................................................................................................................. 19 4.7.1 Unsatisfactory Transmission Distance ............................................................................. 19 4.7.2 Vulnerable Module .............................................................................................................. 19 4.7.3 High Bit Error Rate .............................................................................................................. 19 Shenzhen RF-star Technology Co., Ltd. Page 6 of 25 www.szrfstar.com RF-WM-10AFB1 V1.0 - Jan., 2020 4.8 Electrostatics Discharge Warnings .............................................................................................. 19 4.9 Soldering and Reflow Condition ................................................................................................... 20 4.10 Optional Packaging ...................................................................................................................... 21 5 Certificates .................................................................................................................................................. 22 5.1 RoHS ................................................................................................................................................ 22 6 Revision History ......................................................................................................................................... 23 7 Contact Us .................................................................................................................................................. 24 Table of Figures Figure 1. Functional Block Diagram of RF-WM-11AFB1 .................................................................. 1 Figure 2. Part Number Conventions of RF-WM-11AFB1 .................................................................. 4 Figure 3. Pin Diagram of RF-WM-11AFB1 .......................................................................................... 8 Figure 4. Photos of RF-WM-11AFB1 ................................................................................................. 14 Figure 5. Recommended PCB Footprint of RF-WM-11AFB1 (mm) .............................................. 14 Figure 6. Specification of Antenna Seat ............................................................................................ 15 Figure 7. Specification of IPEX Wire .................................................................................................. 15 Figure 8. Schematic Diagram of RF-WM-11AFB1 ........................................................................... 16 Figure 9. Download and Debug Interface of RF-WM-11AFB1 ....................................................... 17 Figure 10. Recommendation of Antenna Layout .............................................................................. 18 Figure 11. Recommended Reflow for Lead-Free Solder ................................................................ 20 Figure 12. Optional Packaging Mode ................................................................................................ 21 Figure 13. RoHS Certificate................................................................................................................. 22 Table of Tables Table 1. Parameters of RF-WM-11AFB1 ............................................................................................. 8 Table 2. Pin Functions of RF-WM-11AFB1 ......................................................................................... 9 Table 3. Pin Multiplexing of RF-WM-11AFB1 ................................................................................... 11 Table 4. Recommended Operating Conditions of RF-WM-11AFB1 .............................................. 12 Table 5. Handling Ratings of RF-WM-11AFB1 ................................................................................. 12 Shenzhen RF-star Technology Co., Ltd. Page 7 of 25 RF-WM-10AFB1 V1.0 - Jan., 2020 www.szrfstar.com 2 Module Configuration and Functions 2.1 Module Parameters Table 1. Parameters of RF-WM-11AFB1 Chipset Realtek RTL8711AF Supply Power Voltage 3.0 V ~ 3.6 V, recommended to 3.3 V Frequency Crystal Package Dimension 2.4 GHz 40 MHz SMT Packaging 23.0 mm x 20.0 mm x (2.4 0.1) mm Type of Antenna PCB antenna / IPEX connector Operating Temperature
-20 +85 Storage Temperature
-40 +125 2.2 Module Pin Diagram Figure 3. Pin Diagram of RF-WM-11AFB1 Shenzhen RF-star Technology Co., Ltd. Page 8 of 25 RF-WM-10AFB1 V1.0 - Jan., 2020 www.szrfstar.com 2.3 Pin Functions Pin Name Description Table 2. Pin Functions of RF-WM-11AFB1 RFOUT RF signal output pin GND GND VDD Ground Ground 3.3 V power supply GPIO_E4 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_E3 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_E2 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_E1 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_E0 GPIO pin, the MUX function can be referred to pin multiplexing table. NC None connect CHIP_EN Chip enable pin, can be used for reset. GPIO_A0 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_A1 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_A2 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_A3 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_A4 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_A5 GPIO pin, the MUX function can be referred to pin multiplexing table. GND VDD NC NC Ground 3.3 V power supply None connect None connect GPIO_C5 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_C4 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_C3 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_C2 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_C1 GPIO pin, the MUX function can be referred to pin multiplexing table. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Shenzhen RF-star Technology Co., Ltd. Page 9 of 25 RF-WM-10AFB1 V1.0 - Jan., 2020 www.szrfstar.com 27 28 29 30 31 32 33 34 GPIO_C0 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_B3 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_B2 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_B1 GPIO pin, the MUX function can be referred to pin multiplexing table. GPIO_B0 GPIO pin, the MUX function can be referred to pin multiplexing table. NFCIP NFCIN GND NFC differential signal input NFC differential signal input Ground Shenzhen RF-star Technology Co., Ltd. Page 10 of 25 Pin name JTAG SDIO UART Group I2C Group SPI Group I2S Group PCM Group Wl_LED PWM ETE WKDT GPIO INT Default State SCHMT Table 3. Pin Multiplexing of RF-WM-11AFB1 www.szrfstar.com 2.4 Pin Multiplexing GPIO_A0 GPIO_A1 GPIO_A2 GPIO_A3 GPIO_A4 GPIO_A5 GPIO_B0 GPIO_B1 GPIO_B2 GPIO_B3 GPIO_C0 GPIO_C1 GPIO_C2 GPIO_C3 GPIO_C4 GPIO_C5 SD_D2 UART2_IN SD_D3 UART2_CTS SD_CMD UART2_RTS SPI1_MISO SPI1_MOSI SPI1_CLK SD_CLK SD_D1 SD_D0 UART2_OUT SPI1_CS UART_LOG_OUT UART_LOG_IN I2C3_SCL I2C3_SDA WL_LED0 ETE1 D_SLP0 D_SBY0 ETE0 ETE2 ETE3 UART0_IN SPI0_CS0 I2S1_WS PCM1_SYNC PWM0 ETE0 UART0_CTS SPI0_CLK I2S1_CLK PCM1_CLK PWM1 ETE1 GPIO_INT UART0_RTS SPI0_MOSI I2S1_SD_TX PCM1_OUT PWM2 ETE2 UART0_OUT SPI0_MISO I2S1_MCK PCM1_IN PWM3 ETE3 GPIO_INT I2C1_SDA SPI0_CS1 I2S1_SD_RX I2C1_SCL SPI0_CS2 RF-WM-10AFB1 V1.0 - Jan., 2020 GPIO_INT GPIO_INT GPIO_INT GPIO_INT GPIO_INT GPIO_INT GPIO_INT GPIO_INT PH HI PH PH PH PH HI PH HI PH HI HI HI HI HI HI PH PH PH PH PH O O O O O O O O O O O O GPIO_E0 JTAG_TRST UART0_OUT I2C2_SCL SPI0_CS0 PCM0_SYNC GPIO_E1 JTAG_TDI UART0_RTS I2C2_SDA SPI0_CLK PCM0_CLK GPIO_E2 JTAG_TDO UART0_CTS I2C3_SCL SPI0_MOSI PCM0_OUT GPIO_E3 JTAG_TMS UART0_IN I2C3_SDA SPI0_MISO PCM0_IN PWM0 PWM1 PWM2 PWM3 GPIO_E4 JTAG_CLK SPI0_CS1 Note: PH = Pull-High, HI = High-Impedance Shenzhen RF-star Technology Co., Ltd. Page 11 of 25 RF-WM-10AFB1 Ver1.0 - Jan., 2020 www.szrfstar.com 3 Specifications 3.1 Recommended Operating Conditions The functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table below. Long-term work beyond this limit will affect the reliability of the module more or less. Table 4. Recommended Operating Conditions of RF-WM-11AFB1 Items Condition Min. Typ. Max. Unit Operating Supply Voltage Battery Mode Operating Temperature Environmental Hot Pendulum
Notes 3.0
-20
-20 3.3
+25 3.6
+85
+20 V
/min To ensure the RF performance, the ripple wave on the source must be less than 200 mV. Table 5. Handling Ratings of RF-WM-11AFB1 Items Condition Min. Typ. Max. Unit Tstg HBM
-55
+25
+125 4000 2 750 V V 3.2 Handling Ratings Storage Temperature Human Body Model Moisture Sensitivity Level Charged-Device Model 3.3 RF Parameters 3.3.1 RF Configuration omitted Shenzhen RF-star Technology Co., Ltd. Page 12 of 25 RF-WM-10AFB1 Ver1.0 - Jan., 2020 The transmission distance test was conducted in the outdoor open area, and two RF-WM-11AFB1 modules were marked as A0 and B0 respectively. And the simultaneous bidirectional communication test was conducted under the modules with external rod antenna and PCB antenna. The test results are as follows:
www.szrfstar.com 3.3.2 Transmission Distance Test conditions:
1. Outside and open-air 2. Transmission distance: 100 meters 3. The data packet: 100 bytes UDP Socket Communication TCP Socket Communication Wi-Fi Module Sending Receiving Packet Packet Number of Packet Packet Loss Loss Rate Sending Receiving Packet Packet Number Packet of Packet Loss Loss Rate PCB A0B0 1000 Antenna A0B0 1000 External A0B0 1000 Antenna A0B0 1000 1000 1000 1000 1000 0 0 0 0 0%
0%
0%
0%
1000 1000 1000 1000 1000 1000 1000 1000 0 0 0 0 0%
0%
0%
0%
Shenzhen RF-star Technology Co., Ltd. Page 13 of 25 4 Application, Implementation, and Layout www.szrfstar.com 4.1 Module Photos RF-WM-10AFB1 Ver1.0 - Jan., 2020 Figure 4. Photos of RF-WM-11AFB1 4.2 Recommended PCB Footprint Figure 5. Recommended PCB Footprint of RF-WM-11AFB1 (mm) Shenzhen RF-star Technology Co., Ltd. Page 14 of 25 www.szrfstar.com 4.3 Antenna RF-WM-10AFB1 Ver1.0 - Jan., 2020 RF-WM-11AFB1 module is integrated the IPEX version 1 antenna seat, the specification of the antenna seat is as follow:
Figure 6. Specification of Antenna Seat The specification of the IPEX wire end is as follow:
Figure 7. Specification of IPEX Wire Shenzhen RF-star Technology Co., Ltd. Page 15 of 25 www.szrfstar.com 4.4 Schematic Diagram confidential RF-WM-10AFB1 Ver1.0 - Jan., 2020 Figure 8. Schematic Diagram of RF-WM-11AFB1 Shenzhen RF-star Technology Co., Ltd. Page 16 of 25 www.szrfstar.com 4.5 Download and Debug Interface RF-WM-10AFB1 Ver1.0 - Jan., 2020 Figure 9. Download and Debug Interface of RF-WM-11AFB1 Regarding the download and debugging methods of the module, please cooperate with the RF-DK-871xB1 development board provided by RF-star. For related information, please refer to the "RF-DK-871xB1 development board user manual". 4.6 Basic Operation of Hardware Design 1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient, and the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated 3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin, which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic voltage. interference. 4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded). Shenzhen RF-star Technology Co., Ltd. Page 17 of 25 www.szrfstar.com RF-WM-10AFB1 Ver1.0 - Jan., 2020 5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect the module performance. It is recommended to stay away from the module according to the strength of the interference. If circumstances permit, appropriate isolation and shielding can be done. 7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended to stay away from the module according to the strength of the interference. If circumstances permit, appropriate isolation and shielding can be done. 8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer. 9. The antenna installation structure has a great influence on module performance. It is necessary to ensure the antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality antenna extension wire can be used to extend the antenna to the outside of the case. 10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened. 11. The recommendation of the antenna layout. The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the antenna is a key factor to increase the data rate and transmission range. Therefore, the layout of the module antenna location and routing is recommended as follows:
(1) Place the antenna on the edge (corner) of the PCB.
(2) Make sure that there is no signal line or copper foil in each layer below the antenna.
(3) It is the best to hollow out the antenna position in the following figure to ensure that S11 of the module is minimally affected.
(4) The impedance of the external IPEX interface is 50 . Note: The hollow-out position is based on the antenna used. Figure 10. Recommendation of Antenna Layout Shenzhen RF-star Technology Co., Ltd. Page 18 of 25 www.szrfstar.com 4.7 Trouble Shooting 4.7.1 Unsatisfactory Transmission Distance RF-WM-10AFB1 Ver1.0 - Jan., 2020 1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened. Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate. The performances of ground absorption and reflection of radio waves will be poor when the module is tested close to the ground. metal shell. 2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor. 3. The signal attenuation will be very obvious if there is a metal near the antenna or the module is placed inside of the 4. The incorrect power register set or the high data rate in an open-air may shorten the communication distance. The 5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower higher the data rate, the closer the distance. the voltage, the smaller the power is. 6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance. 4.7.2 Vulnerable Module voltage. 4.7.3 High Bit Error Rate 1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated 2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices. 3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application. If there is no special demand, it is not recommended to use it at too high or too low temperature. 1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or modify the frequency and channel to avoid interferences. 2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure power supply reliability. 3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high. 4.8 Electrostatics Discharge Warnings The module will be damaged for the discharge of static. RF-star suggests that all modules should follow the 3 precautions below:
1. According to the anti-static measures, bare hands are not allowed to touch modules. Shenzhen RF-star Technology Co., Ltd. Page 19 of 25 www.szrfstar.com 2. Modules must be placed in anti-static areas. 3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design. Static may result in the degradation in the performance of the module, even causing the failure. RF-WM-10AFB1 Ver1.0 - Jan., 2020 4.9 Soldering and Reflow Condition 1. Heating method: Conventional Convection or IR/convection. equivalent methods. 3. Solder paste composition: Sn/3.0 Ag/0.5 Cu 2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or 4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile. 5. Temperature profile: Reflow soldering shall be done according to the following temperature profile. 6. Peak temperature: 245 . Figure 11. Recommended Reflow for Lead-Free Solder Shenzhen RF-star Technology Co., Ltd. Page 20 of 25 www.szrfstar.com 4.10 Optional Packaging RF-WM-10AFB1 Ver1.0 - Jan., 2020 Note: Default tray packaging. Figure 12. Optional Packaging Mode Shenzhen RF-star Technology Co., Ltd. Page 21 of 25 www.szrfstar.com 5 Certificates 5.1 RoHS RF-WM-10AFB1 Ver1.0 - Jan., 2020 Figure 13. RoHS Certificate Shenzhen RF-star Technology Co., Ltd. Page 22 of 25 www.szrfstar.com 6 Revision History RF-WM-10AFB1 Ver1.0 - Jan., 2020 Date Version No. Description 2016.08.01 V1.0 The initial version is released. 2020.01.19 V1.0 Add the Wi-Fi module list. Author Aroo Wang Sunny Li Shenzhen RF-star Technology Co., Ltd. Page 23 of 25 RF-WM-10AFB1 Ver1.0 - Jan., 2020 www.szrfstar.com 7 Contact Us Tel.: 86-755-8632 9687 Web.: www.szrfstar.com SHENZHEN RF-STAR TECHNOLOGY CO., LTD. Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China Shenzhen RF-star Technology Co., Ltd. Page 24 of 25
1 | Compliance list statement 996369 | Attestation Statements | 216.94 KiB | April 13 2021 |
FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 YES N/A Yes YES Refer to instruction Integral antenna with antenna gain 0 dBi Comment Refer to instruction Compliance list INTEGRATION INSTRUCTIONS for 996369 D03 OEM the and 996369 D03 OEM by Sections 2.2 through 2.10. Requirement 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules
(Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturers instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. 2.4 Limited module procedures If a modular transmitter is approved as a limited module, then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum Not applicable N/A N/A Not applicable signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.4 a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);
b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);
c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout;
d) Appropriate parts by manufacturer and specifications;
e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a persons body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an omni-directional antenna is not considered to be a specific antenna type)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration YES Refer to instruction The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device if without further FCC certify ,such as C2PC with SAR. This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. YES Refer to instruction Integral antenna with antenna gain 0 dBi 2.9 Information on test modes and additional testing requirements5 YES Refer to instruction instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. YES Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturers determination that a module as installed in a host complies with FCC requirements. 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that Refer to instruction If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
Contains Transmitter Module FCC ID:
2AD2W-MDFPWS360 Or Contains FCC ID:
2AD2W-MDFPWS360 Any company of the host device which install this modular with modular approval should perform the test of radiated &
conducted emission and spurious emission,etc. according to FCC part 15C :
15.247 and 15.209 &15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209
&15.207 ,15B Class B requirementthen the host can be sold legally. YES Refer to instruction Any company of the host device which install this modular with modular approval should perform the test of radiated
& conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209
&15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209
&15.207 ,15B Class B requirementthen the host can be sold legally. the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.6 When the module is installed inside another device, the user manual of the host must contain below warning statements;
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.
1 | FCC Authorization letter | Cover Letter(s) | 245.37 KiB | April 13 2021 |
DATE: 2021-4-8 Federal Communications Commission Authorization & Evaluation Division 7345 Oakland Mills Road Columbia, Maryland 21046 Authority to Act as Agent On our behalf, I appoint BlueAsia of Technical Services(Shenzhen) Co.,Ltd. IOT Test Centre of BlueAsiaBuilding C, No. 107, Shihuan Road, Shiyan Sub-District, Baoan District,Shenzhen, Guangdong Province, China (Name of Agent company name and address) to act as our agent in the preparation of this application for equipment certification. I certify that submitted documents properly describe the device or system for which equipment certification is sought. I also certify that each unit manufactured, imported or marketed, as defined in the Federal Communications Commissions regulations will have affixed to it a label identical to that submitted for approval with this application.For instances where our authorized agent signs the application for certification on our behalf, I acknowledge that all responsibility for complying with the terms and conditions for certification, still resides with C&A Marketing Inc. 114 Tived Lane East Edison New Jersey United States (Applicant Name and address)
<Signature>
NameChaim Piekarski TitleChief Executive Officer Applicant Company C&A Marketing Inc.
1 | FCC confidence letter | Cover Letter(s) | 290.32 KiB | April 13 2021 |
Avi Goldenberg
@ Ct+A GLOBAL General Counsel Confidential Request Letter DATE : 2021-3-26 Equipment Autorisation Division Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 FCC ID: 2AD2W-MDFPWS360 Product Name: WIFI MODULE Request for Confidentiality Pursuant to Sections 0.457 and 0.459 of the commissions rules, we hereby request that the following documents be held confidential: (List here the documents for which you are seeking confidentiality for example ...) e Schematics e Block diagram e Operation description These materials contain trade secrets and proprietary information and are not customarily released to the public. The public disclosure of this information might be harmful to the company and provide unjustified benefits to our competitors. Sincerely, Chaim Piekarski Chief Executive Officer C&A Marketing Inc.
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2021-04-13 | 2412 ~ 2462 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2021-04-13
|
||||
1 | Applicant's complete, legal business name |
C&A Marketing Inc.
|
||||
1 | FCC Registration Number (FRN) |
0025643727
|
||||
1 | Physical Address |
114 Tived Lane East
|
||||
1 |
Edison, NJ
|
|||||
1 |
United States
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
d******@compliancetesting.com
|
||||
1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
2AD2W
|
||||
1 | Equipment Product Code |
MDFPWS360
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
C**** P********
|
||||
1 | Title |
Chief Executive Officer
|
||||
1 | Telephone Number |
84824******** Extension:
|
||||
1 | Fax Number |
84824********
|
||||
1 |
l******@caglobal.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DTS - Digital Transmission System | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | WIFI MODULE | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Power output listed is conducted.The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other transmitter. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
BlueAsia of Technical Services (Shenzhen)
|
||||
1 | Name |
E**** L********
|
||||
1 | Telephone Number |
+86 1********
|
||||
1 |
e******@cblueasia.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2412.00000000 | 2462.00000000 | 0.0279250 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC