PR RELIMINAR shConn Mes RY DATAS nect SHEET B1010 SP0 M Mini Mod B1010 iver Based dules SP0-1x Modules BL LE Transcei Integrat ted Trans sceiver M odules fo or Blueto ooth Sma art Applic cations ESCRIPTIO DE ELs MeshConn CE k and significa risk ergy wireless Ene pro otocol. The Zig tran dro The Me qui non Pyt e B1010SP0-1 eshWorksTM pla ckly and easil n-CSRmesh) thon-based scr ese devices ar Bee and Threa nsition betwee op-in compatibl ON nect Bluetooth antly reduce ti solutions, inclu Smart Module ime-to-market uding the inno es eliminate de for Bluetooth vative CSRme esign Low esh e footprint-com ad-based Mod en multiple wi e module hard mpatible with C dules, allowing reless networ ware. ELs existing li designers to e king standards ne of easily s via x is also com atform. By em y program the Bluetooth Sm ripts. patible with CE mploying Mesh e B1010SP0-1 mart applicatio ELs award-win hWorks, users x for standard ons using si nning s can d (i.e. imple 50m to 100m tware eshWorksTM P BLO OCK DIAGR RAM 32 kHz XTAL 1 6 MHz XTAL External EEPROM ANT latform e g d E n o i t a l l e t s a C r o t c e n n o C CSR1010 Micro p processor Radio s Sensor Netwo orking RDERING I INFORMAT TION der Number Ord Part Number r Description n MeshConnec t B1010SP0 Min ni Modules B1 010SP0-1-R CSR1010 IC B10 010SP0-1C-R CSR1010 IC
, +8dBm Output P Power, PCB Trace e Antenna
, +8dBm Output P Power, Castellatio on Pin for External l Antenna M Min/Multiple 600/600 600/600 EY FEATUR Best-in-Class
+8dBm Trans Supports CS Available with Interoperable 15 Analog/Di Supports UA RES s RF Range of smit Power RMeshTM h Avi-onTM Soft e with CEL's Me gital I/O Pins RT, I2C & SPI PPLICATIO Connected H Building Auto Sports & Fitn Health Senso Mobile Acces General Blue ONS Home omation ness Sensors ors ssories etooth Wireless KE AP OR B1010SP0 Mini Modul es DEV VELOPME ENT KITS shConnec ct Energy Starter De evelopmen nt Kit R's Energy pla tion for produc L's Energy Sta prehensive wa ications using atform provides cts using the Bl arter Developm ay for designers CSR's Energ s a complete B uetooth Low E ment Kit is a sim s to develop Bl y solution. ed luetooth qualifi nergy standard d. mple yet uetooth Smart h kit contains:
n board with B Evaluation ergy Platform S CSR En o S Software Deve e examples and d o x xIDE for Ener o P Production test Cable Mini-USB Setup & Q Quick Start Gui des Module 1010SP0 Mini Software lopment Kit (SD development to rgy (includes co t and configura DK) application n ools ompiler) ation tools t meshconnec ct.cel.com/B10 010 for more inf formation. Visit Me The SDK the f shWorks B Bluetooth Sm K and wireless following:
Bluetooth S mart module is networking pla Smart Dev an integral par atform. The Mes velopment rt of the MeshW shWorks kit Kit Works contains MeshWor IDE, and S Two Bluet for rapidly Companio smartpho rks Software ScriptNinja c tooth Smart S y prototyping m on app to comm ne (used as a
, including Pyth configuration to Sensor Nodes many different a municate with B bridge) hon scripting la ool with integrated applications Bluetooth 4.x anguage, d sensors x-equipped t http://www.ce respective deve el.com/MeshW elopment kit us Works for more ser guides. e information. R Refer to Me CSR solu CEL com appl Each Visit the r KIT T ORDERIN Kit Family NG INFORM Orde MATION er Number MeshConnect Energy Starter Development Kit MeshWorks Bluetooth Smart Development Kit B1010 0SP0-EVB-1 BM MW-KIT-1 BMW-
-SENSOR-1 Description Mi n/Multiple Energy Starte er Development K Kit, with license for r CSR Energy SD DK Bluetooth Sma art MeshWorks Ev valuation Kit (Inclu udes Two Sensor Nodes) Bluetooth Sma art MeshWorks Se ensor Node 1/1 1/1 1/1 BLE OF CO SCRIPTION.. YFEATURES PLICATIONS OCKDIAGRA DERINGINFO VELOPMENT ORDERING BLEOFCONT ANSCEIVERI TENNA....... TERNALEEPR FTWARE/FI YSTALTRIM SOLUTEMAX COMMENDE CHARACTER CHARACTER PINASSIGN M35xZIGBE ODULEDIME ODULELAND OCESSING... ENCYCERTIF PMENT,HA ALITY......... FERENCES... VISIONHISTO CLAIMER... ONTENTS
.................. ................. ................. AM.............. ORMATION TKITS......... INFORMATI TENTS........ C............... ................. ROM.......... IRMWARE.. VALUES..... XIMUMRAT EDOPERATIN RISTICS....... RISTICS........ NMENTS..... EE/THREADM ENSIONS..... DFOORTPRIN
.................. FICATIONS(
NDLINGAN
.................. ................. ORY........... ................. ................. ................. ................. ................. ................. ................. ION............ ................. ................. ................. ................. ................. ................. TINGS......... NGCONDITI
.................. ................. ................. MODULECO
.................. NT.............. .................
(PCBANTEN DSTORAGE
.................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. IONS.......... ................. ................. ................. OMPATIBILIT
.................. ................. ................. NAONLY).. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. TY.............. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. B1010SP0 Mini Modul es
.................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. ................. .........1
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........15 TA DES KEY APP BLO ORD DEV KIT TAB TRA ANT EXT SOF CRY ABS REC DC RFC I/O ZICM MO MO PRO AGE SHI QUA REF REV DIS B1010SP0 Mini Modul es Mini Module,
's Energy pla with CSR's qu nce solution ide utilizing the C atform. This tra alified Bluetoo eally suited for CSR1010 trans nsceiver incorp oth v4.x specifi all BLE applic sceiver IC, is porates a base ication stack, i ations. For mo a single-mode eband modem, it is an excelle ore information e Bluetooth Low
, RF circuitry, a ent low cost, lo about the CSR w Energy and 16-bit ow power R1010 IC, ANSCEIVE Ls MeshConne E) device that i P microprocess sumption and h se visit www.cs ER IC ect B1010SP0 is part of CSR sor. Together w high performan sr.com. TENNA Ls B1010SP0 M s a castellation B trace antenna Mini Modules in pin on the mo a only. nclude an integ odule allows the grated Printed e user to conne Circuit Board (
ect an external
(PCB) trace an l antenna. The tenna. An optio B1010SP0 ha onal configurat as been certifie tion which d with the PCB antenna provided on the ormance (it sho gn of the prod ection, diffractio employs a top e host PCB. Co ould not be dire duct enclosure on and/or scatte pology that is c orrectly position ectly under the contribute to ering of the tra compact and hi ned, the groun e module PCB antenna perfo nsmitted signa ghly efficient. T d plane on the antenna). The ormance. Poor al. To maximize ra e host PCB will position of the r design affects ange, an adeq contribute sig e module on the s radiation pat uate ground p nificantly to the e host board a tterns and can lane must e antenna nd overall n result in optimum anten edge of the hos o the antenna ctly beneath th nna performanc st board. To fu
(a minimum o e module will a ce, the MeshCo rther improve p of 1.5" x 1.5"
also allow you t onnect Mini Mo performance, a is recommend to run traces un odules should b a ground plane ded). The insta nder this layer. be mounted wi e may be placed allation of an u
. CEL can prov th the PCB trac d on the host b uninterrupted g vide assistance ce antenna ove board under the ground plane o e with your PCB erhanging e module, on a layer B layout. following are s Never pl Never pl In the ov Do not p Keep pla some design gu lace the ground lace the antenn verall design, e place the anten astic enclosure uidelines to hel d plane or rout na close to me ensure that wiri nna in a metallic es 1cm or more lp ensure anten e copper trace tallic objects ng and other c c or metalized e away from the nna performan es directly unde ce:
erneath the ante enna portion o f the module components are plastic enclosu e antenna in an e not placed ne ure ny direction ear the antenna a er Industry Ca approved for t gain should be cessful commu nada regulatio the transmitter e so chosen th nication. ns, this radio tr by Industry Ca hat the equiva ransmitter may anada. To redu alent isotropica y only operate uce potential ra ally radiated p using an anten adio interferenc power (e.i.r.p.) nna of a type a ce to other user is not more t and maximum (
rs, the antenna than that nece
(or lesser) a type and essary for formment la gain maximal olectrique l'i onne quivale a rglementatio
(ou infrieur) a intention des a nte (p.i.r.e.) ne on d'Industrie C approuv pour autres utilisateu e dpasse pas Canada, le prs l'metteur par urs, il faut chois l'intensit nce sent metteur r Industrie Can sir le type d'an essaire l'tab radio peut fonc ada. Dans le b tenne et son g lissement d'un ctionner avec u but de rduire l ain de sorte qu e communicati une antenne d'u un type et es risques de brouillage ue la puissance e isotrope te. ion satisfaisant TERNAL E B1010SP0 M e updates. The R1010 referenc EEPROM ini Module inc e EEPROM is ce design. instruction set e details. orporates an a connected to t additional 512k the master I2C kB external EE interface usin EPROM for sto g I2C_SCL, I2 oring program 2C_SDA, and P code and Ove PIO[2] as detai er-The-Air iled in the t for the EEPR ROM is similar r to the Fudan FM24C512D. See the Fuda an Microelectro onics Group w website for TRA CEL
(BLE XAP cons plea AN CEL uses PCB The be p perfo desi refle For o the e up to direc The Und gain its g succ Conf d'un radio rayo EXT The code CSR The more B1010SP0 Mini Modul es CSR Energy ate an interoper mple applicatio forms, and prod SO OFTWARE /
Ls B1010SP0 M CEL upporting stand to su top of the Blu on t expa anding the netw ly be develope easi The crea exam platf
. CR Duri mea poss B10 In or eval Whe box trans appe deve click RYSTAL TR ng the manufa asuring frequen sible to zero. C 10SP0 Mini Mo en the tool is fir is displayed. T sport to commu ear if the appro elopment kit ins k OK. rder to manual uation board is
/ FIRMWAR Mini Modules r dard BLE 4.x d etooth Smart work range thro ed which can be RE run CSR's En devices, the B1 standard that ough a mesh, e controlled thr ergy platform, 010SP0 Mini M enables mes comprehensive rough a smartp which is a fully Modules also s sages to be r e lighting, hom phone, tablet, o y qualified Blue support CSRme relayed over m me automation, or any other BL etooth Low Ene esh, which is a multiple Blueto and building a LE 4.x device. ergy solution. I a protocol layer ooth Smart de automation solu n addition r that runs evices. By utions can y platform is a rable BLE 4.x ons for popula duction test an a feature-rich B solution. This i ar Bluetooth S d configuration Bluetooth Sma includes a fully Smart and CS n tools. For mo art developmen y licensed xIDE Rmesh profile re information, nt environment E software deve s, example ho visit www.csr. t and contains elopment envir ost application com. s everything re ronment (with c ns for iOS and equired to compiler), d Android 0SP0 Mini Mod stal trim token crystal trim va for optimal perf dules are test so the frequen lue, which is st formance. ted for full RF ncy error for an tored in the ex F and DC func n unmodulated xternal EEPRO ctionality. This d RF tone is as OM, before refla s includes s close as ashing the es, install CSR'
's Energy dev velopment kit a and launch the CsConfig tool while the RIM VALUE acturing proce ncy error and s CEL recommen odule with diffe ES ess, all B1010 setting the crys nds saving the erent software f ly save the cry s connected to ystal trim value your PC. rst launched, th The evaluation unicate with the opriate drivers w stallation proce he Connection board uses the e module. This were installed d edure. Once it Options dialog g e USB SPI s option should d during the is selected, he key names a esponding valu e is named Cr wn to the right, orted to a .keyr uded into your x elopment. are now displa ues are in the r rystal frequenc the value is 0x r file using Keys xIDE project du ayed in the left l right list. The c cy trim. In the x0015. The ke s->Export to fil uring your appl list and their crystal trim example ys can be e and lication ng production, using the comm onfigcmd.exe) n flash the app was exported onfigcmd.exe to it is recommen mand line versio also present w plication firmwa previously into ool again. nded to export on of this tool within the devel are. Finally, me the module us the keys to a lopment kit. erge the key file e sing the All th corre valu show expo inclu deve Duri file u
(csc Then that csco B1010SP0 Mini Modules Max Unit AB BSOLUTE M MAXIMUM RATINGS Des scription Sto rage temperatur e range Pow wer supply voltag ge (VDD_BAT) I/O supply voltage Min
-40 1.8
-0.4 85 4.4 4.4 C V V V Oth her terminal volta age*
VSS - 0.4 VDD + 0.4
* VD DD = Terminal S Supply Domain RE COMMEND DED OPER RATING CO ONDITIONS S Des scription Ope erating temperat ure range Pow wer supply voltag ge (VDD_BAT) I/O supply voltage (V VDD_PADS) DC CHARACT TERISTICS S (@25C unles Min
-30 1.8 1.2 Typ Ma ax Unit
-
-
-
85 5 3. 6 3. 6 C V V s otherwise spec cified) Des scription C Conditions Min Ty yp Max Unit
@ 2.7V
@ 1.8V
@ 3.6V
@ 2.7V
@ 2.7V
@ 1.8V
@ 3.6V
@ 3.3V
-
-
-
-
-
3 5 5 4 2 5 2 3 4 2 9 3 7 1 0. 9
-
-
-
-
-
mA mA mA mA mA mA mA A Tra nsmitter Current t Draw, max outp put power Tra nsmitter Current t Draw @ 0dBm Rec ceiver Current D raw Sle ep mode current t (Dormant mode e) B1010SP0 Mini Modules RF CHARACT TERISTICS S (@25C unless s otherwise spec cified) Pat th Description n Conditions s Min T Typ Max Unit Operating F Frequency Maximum o output power 2nd Harmon nic 3rd Harmon nic In-band em issions TX RX Modulation delta F1 average e Modulation delta F1 / F2 Modulation delta F2 max Frequency a accuracy Frequency o offset Maximum D Drift Rate (kHz/50 0s) Receiver Se ensitivity Receiver Se ensitivity (with dir rty transmitter) Maximum re eceived signal at t 30.8% PER F = Fo 2M Hz F = Fo 3M Hz F = Fo > 3M MHz 2402
-
-
-
-
-
-
225 0.8
-
-100
-100
-20 8
-
-
-38
-38
-38 2480
-
54 54
-
-
-
2 255 275
-
100 25 25 8
-94
-93
-10
-
-
100 100 20
-10 MHz dBm dBuV dBuV dBm dBm dBm kHz
-
%
kHz kHz kHz / 50uS dBm dBm dBm B1010SP0 Mini Modul es Notes Castellation Pin n for External An tenna I/O Refe PIN ASSIG r to the CSR101 GNMENTS 0 datasheet for p pin functionality d details. Mo dule Pin N Number C SR1010 IC in Number P Pin Nam e 33 to 48 VSS 26 NC 4 NC 16 29 32 28 17 NC 23 15 14 24 19 20 22 13 NC 18 12 25 11 NC SPI_IO#_S SEL NC WAKE NC PIO[3]
I2C_SDA A VDD_BAT_S SMPS I2C_SCL L PIO[4]
NC PIO[9]
T_RX PIO[1] / UART T_TX PIO[0] / UAR PIO[10]
PIO[6]
PIO[7]
PIO[8]
AIO[0]
NC PIO[5]
AIO[1]
PIO[11]
AIO[2]
RF Out 1, 2 2, 12, 31, 33 3 4 4, 5, 6 7 8,9 10 11 13 14 15 1 16, 17 18 19 20 21 22 23 24 25 26 27 28 29 30 32 ZIC The mod CM35x ZIGB BEE/THRE EAD MODU ULE COMPA ATIBILITY Y geometry of th dules. The digit he land pattern tial and analog and location o g I/O mapping of the RF caste is described be llation is identic elow:
cal to the ZICM M35x family of Z ZigBee/Thread d ZICM35x B1010S SP0 Notes Co Co Serial ontroller 1 Serial ontroller 2 GPIO GPIO GPIO GPIO GPIO GPIO UART/SPI/I2C Two wire UA ART/I2C PB3 and PB4 4 are not connec cted SPI/I2C SPI/I2 2C PA6 PC2 PC3 PC4 PC0 PB6 PIO9 9 PIO6 6 PIO7 7 PIO8 8 PIO5 5 1 PIO1 ADC PB0, PB5, PB7 AIO0, AIO2 2, AIO1 PB6 is connected to are no PIO11. PC1, PA ot connected A4 and PA5 ODULE DIM MENSIONS MO MO Dime ODULE LAN ensions are sh ND FOORT hown in inches, TPRINT with millimete r conversion in n brackets B1010SP0 Mini Modul es Note
: Refer to the An ntenna section in this document fo for layout recomm mendations which will yield optim mal antenna perfo ormance. B1010SP0 Mini Modul es PR Rec Par OCESSING G ed Reflow commende rameter Values Profile Ram mp Up Rate (from m Tsoakmax to Tpeak k) Min imum Soak Tem mperature Max ximum Soak Tem mperature Soa ak Time TLiqu uidus Tim me above TL Tpea ak Tim me within 5 of Tpe eak Tim me from 25 to Tpe eak 3/sec m max 150C C 200C C 60-120 s sec 217C C 60-150 s sec 250C C 20-30 s ec 8 min m max Ram mp Down Rate 6C/sec m max Pb-
Use
-Free Sold of No Clean er Paste soldering paste e is strongly re ecommended, a as it does not r require cleaning g after the sold dering process. Note: T appropria Electronic The quality of s te IPC Specif c Assemblies d solder joints on fication. See t document. n the castellatio the Castellated ons ("half vias"
d Terminations
") where they c s Section in t contact the hos the latest IPC st board should C-A-610 Accep d meet the ptability of eaning eneral, cleanin cleaning proce ng the populate ess. ed module is st trongly discour raged. Residua als under the m module cannot be easily rem oved with Cleaning board and between n Cleaning housings, Ultrasonic with water c d the module. T neighboring pa with alcohol which is not a c cleaning coul can lead to c The combinatio ads. Water coul or a simila accessible for p d damage the capillary effec on of soldering ld also damage ar organic so post-washing in module perma cts where wat g flux residuals e any stickers o olvent will like nspection. The anently. ter is absorbe s and encapsu or labels. ely flood sold solvent could a ed into the g lated water co gap between uld lead to sho the host ort circuits dering flux re also damage a esiduals into ny stickers or l the abels. two best approach h is to consider using a No C lean solder pa aste and elimin ate the post-so oldering cleanin ng step. tical Inspe r soldering the ection module to the host board, co onsider optical inspection to c check the follow wing:
Proper alig Proper sol Excessive gnment and ce der joints on al solder or conta ntering of the m ll pads acts to neighbo module over th e pads oring pads or v vias Cle In ge any The Op After Rep Only peating Re y a single reflow eflow Solde w soldering pro ering ocess is encour raged for host B1010SP0 Mini Modul es boards. Wa If a sold ave Solderi wave solderin ering process i ing g process is r required on the is encouraged. e host boards due to the pr resence of lea aded compone nts, only a sin ngle wave nd Solderi d soldering is p ng possible. When Han Han Rew The sold work MeshConnect er joint and mo n using a solde ering iron, follow w IPC recomme endations.(refe erence docume ent IPC-7711). Module can be odule should no e unsoldered fr ot exceed the m rom the host bo maximum peak oard. Use of a k reflow temper hot air rework rature of 250C tool should be C. programmable e and the Cau If tem Avoi ution mperature ram id overheating. mps exceed the e reflow tempe rature profile, module and co omponent dam mage may occu ur due to therm mal shock. Wa Neve cove arning er attempt a erage. rework on the e module itsel f (i.e., replacin ng individual c components);
such actions will terminate warranty rounding ve the module o mer's own risk. ditional Gr mpts to improv e at the custom nterference. Add Attem done RF i or the system g The ground pi grounding by s ins at the mod soldering braids ule perimeter s s, wires or cab should be suffic les onto the mo cient for optim odule RF shiel um immunity to d cover is o external FCC This subj Le p est a OE The Stan the O outs ID a mod follow The this Rad AG The GENCY CER following certif RTIFICATIO fications are in ONS (PCB effect:
ANTENNA A ONLY) B1010SP 0: FCC and IC C B1010SP0 Mini Modul es C Complia device compli ect to the follow ance Statem es with Part 15 wing two condi ment Part 5 of the FCC R tions:
15.19, Sec Rules and with I tion 7.15 o ndustry Canad N of RSS-GEN da license-exem mpt RSS Stand dards. Operatio on is 1. This devic 2. This devic ce may not cau ce must accept use harmful int t any interferen erference. nce received, in ncluding interfe erence that may y cause undes ired operation. prsent apparei autorise aux d il est conforme deux conditions e aux CNR d'Ind s suivantes:
dustrie Canada a applicables a aux appareils ra adio exempts d de licence. L'ex xploitation 1. l'appareil 2. l'utilisateu susceptib ne doit pas pro ur de l'appareil ble d'en compro oduire de brou doit accepter t omettre le fonc illage, et tout brouillage tionnement. radiolectrique e subi, mme s si le brouillage e est Wa Cha arning (Par nges or modific rt 15.21) cations not exp pressly approve ed by CEL cou uld void the use er's authority to o operate the eq quipment. 20 To c trans oper cm Separa comply with FC smitter must be rating in conjun ation Dista CC/IC RF expos e installed to pr nction with any ance sure limits for g rovide a separa other antenna tion/uncontrolle general populat ation distance o of at least 20 c
. or transmitter. ed exposure, th cm from all pers he antenna(s) u sons and must used for this t not be co-loca ated or M Respon MeshConnect ndards for integ OEM of the Me ide of the final nd the IC ID ar dule is installed wing:
sibility to t Mini Module h gration into pro eshConnect Mo product. The M re not visible w must also disp the FCC an has been certifi ducts without f odule must ens MeshConnect M when the modul play a label refe nd IC Rule ed per FCC Pa further testing o sure that the inf Mini Module is e is installed in erring to the en es and Reg art 15 Rules an or certification. formation prov labeled with its nside another d nclosed module ulations nd to Industry C To fulfill the FC ided on the Me s own FCC ID device, then the e. The exterior Canada license CC and IC Cer eshConnect lab Number and IC e outside of the label can use e-exempt RSS rtification requir bel is placed on C ID Number. I e device into w wording such a rements, n the f the FCC hich the as the Contains Contains s Transmitter M s Transmitter M Module FCC ID:
Module IC: 8254
: W7Z-B1010S 4A-B1010SP0"
SP0 or Contai
" or "Contains I ns FCC ID: W7 C: 8254A-B10 7Z-B1010SP0 10SP0 OEM of the Me module. The O iator Limits bef eshConnect M OEM of the Mes fore declaring F ini Module may shConnect Min FCC Complian y only use the ni Module must ce per Part 15 approved ante t test their final of the FCC Ru enna (PCB trac product config ules. e antenna) tha guration to com at has been cer mply with Uninte rtified with entional Certificatio IC C The term "IC" befo met. on Indus re the certificat stry Canad tion/registration da Stateme n number only ent signifies that th he Industry Ca nada technical l specifications were Cer Le te Indu rtification erme "IC" deva ustrie Canada o IC - Dclar ant le numro d ont t respect ration d'Ind de certification/
es. dustrie Can
/d'enregistreme nada ent signifie seu lement que les s spcifications s techniques Sec The exce http:
ction 14 of installer of this ess of Health C
//www.hc-sc.gc f RSS-210 s radio equipme Canada limits fo c.ca/ewh-semt ent must ensur or the general p t/pubs/radiation re that the ante population. Con n/99ehd-dhm23 enna is located nsult Safety Co 37/index-eng.p or pointed suc ode 6, obtainab php ch that it does n ble from Health not emit RF fie h Canada's web ld in bsite:
rticle 14 du programme d'in ettre de champ onible sur le si 0 u CNR-210 et quipement nstallation de ce RF au-del de es limites de Sa nt Canada: htt te Web de San radio doit s'ass ant Canada po tp://www.hc-sc surer que l'ante our la populatio c.gc.ca/ewh-sem enne est situe on gnrale. C mt/pubs/radiati e ou oriente d Consulter le Cod ion/99ehd-dhm e telle sorte qu de de scurit m237/index-eng u'il ne pas 6, g.php B1010SP0 Mini Modul es HANDLING G AND STO ORAGE Modules are d delivered in tap pe and reel. The e reel diameter r is 12.992" (33 30mm) and con ntains 600 mod dules. L'a Le p me disp SH Shi The IPMENT, H ipment MeshConnect assembly line. Han The ndling MeshConnect Modules are d designed and p packaged to be e processed in a an automated t Modules cont le permanently tain highly sens y. sitive electronic c circuitry. Han ndling without p proper ESD pr rotection may d destroy or Modules are m carefully to pre moisture-sensit event permanen tive devices. A nt damage due ppropriate han e to moisture in dling instructio take. ons and precau tions are summ marized in Mo MSL oisture Sen L 3, per J-STD-
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-033 vel (MSL) Wa The dam arning MeshConnect mage the modul Wa The J-ST arning MeshConnect TD-033. Read c orage age/shelf life in Sto Stor QU CEL spec tests all p CEL UALITY r the highest q L Modules offer s II. Our modu cification, Class s, mechanical shock, temper s. roduction parts n sealed bags i is 12 months a t <40C and <9 90% relative hu umidity. quality at comp ules go through rature cycling, petitive prices. h JESD22 qua humidity and re Our modules a alification proce eflow testing. C are manufactu esses which inc CEL conducts ured in complia cludes high te RF and DC fac ance with the I mperature ope ctory testing on PC-A-610 erating life n 100% of L builds the qua ality into our pro oducts, giving o our customers confidence wh hen integrating our products in nto their system ms. B1010SP0 Mini Modul es Download Link Page(
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-231985-DS - CS SR1010 Data Sh REV VISION HIS Previous Vers STORY sions Refere ence Documents s eet Chan ges to Current V Version 001 May 9-00-07-00-000 y 15, 2015 Initi al Preliminary Da ata Sheet DIS SCLAIMER R o part of this docu EL assumes no re e information in sign-in, refer to oducts. Not all p d additional infor Th de pro an No CE CE EL does not assu om the use of CE fro im plied or otherwis De pro eq cus escriptions of circ oduct operation a uipment shall b stomers or third this document is the latest publi products and/or t rmation. s current as of the ications of CEL types are availab e published date Data Sheets o ble in every cou e. The information r Data Books, e ntry. Please che n is subject to ch etc., for the mos eck with an CEL hange without no st up-to-date sp L sales represen otice. For actual pecifications of C tative for availab CEL bility ument may be co esponsibility for opied or reprodu any errors that m ced in any form o may appear in thi or by any means is document. s without the prio or written consen t of CEL. ume any liability f EL products liste se, is granted und for infringement ed in this docume der any patents, of patents, copy ent or any other copyrights or oth yrights or other in r liability arising f her intellectual p ntellectual proper from the use of s roperty rights of rty rights of third such products. N CEL or others. parties by or aris No license, expre sing ess, cuits, software a and application e e done under th parties arising fr nd other related examples. The in he full responsib om the use of th information in th ncorporation of th bility of the cus ese circuits, soft his document are hese circuits, so tomer. CEL ass tware and inform e provided for illu ftware and inform sumes no respo ation. ustrative purpose mation in the des onsibility for any es in semicondu sign of a custom losses incurred uctor mers d by FO For m TEC For T R MORE IN more informatio NFORMAT on about CEL TION MeshConnect products and s solutions, visit o our website at www.cel.com/M MeshConnect. CHNICAL A Technical Assi ASSISTAN stance, visit ht NCE tp://www.cel.co om/MeshConne ectHelp