FCC ID: W7Z-ZICM357P2 MeshConnect EM357 Zigbee Module

DATA SHEET MeshConnect EM357 Module ZICM357P2-1 Ember EM357 Transceiver Based Module Integrated Transceiver Modules for ZigBee / IEEE 802.15.4 Development Kit available: ZICM357P2-KIT1-1 DESCRIPTION CELs MeshConnect EM357 Module combines high perfor-

mance RF solution with the market's premier ZigBee stack. The addition of on board memory enables Over-The-Air (OTA) programming without the need for additional in system memory. The integrated power amplifier maximizes range and perfor-

mance. The small module footprint makes it suitable for a wide range of ZigBee applications. The MeshConnect EM357 mod-

ule is certified and qualified enabling customers to accelerate time to market by greatly reducing the design and certification phases of development. CELs MeshConnect EM357 module (ZICM357P2-1) is based on the Ember EM357 Zigbee compliant SOC IC. The IC is a single-chip solution, compliant with ZigBee specifications and IEEE 802.15.4, a complete wireless solution for all ZigBee applications. The IC consists of an RF transceiver with the baseband modem, a hardwired MAC and an embedded 32-bit ARM Cortex-M3 microcontroller with internal RAM (12kB) and Flash (192kB) memory. The device provides numerous general-purpose I/O pins and peripheral functions such as timers and UARTs. The MeshConnect EM357 module adds a power amplifier (PA) to increase range up to 2.5 miles, provide more reliable trans-

mission, and reduce the number of nodes in your network. It is especially useful for open outdoor applications where the nodes are physically far apart or for indoor use where the nodes have to operate in a noisy RF environment. The Modules outstand-

ing 120dB link budget ensures high quality connections even in such harsh environments. The MeshConnect EM357 module also integrates an 1MB Flash memory for Over-The-Air program updates, making this device ready for Smart Energy Applications. MeshConnect EM357 Module 192 kB (EM357 internal) 1MB (on module board) FLASH Memory:

12 kB SRAM 32-bit ARM Cortex-M3 Up to 23 GPIO Pins SPI (Master/Slave), TWI, UART Timers, Serial Wire/JTAG Interface 5-channel 14-bit ADC Transmit power +20dBm 1MB additional flash for Over-The-Air programming

+120 dB RF link budget Range up to 2.5 miles FEATURES High RF performance:

Up to 120 dB RF Link Budget RX Sensitivity: -100 dBm RF TX Power: +20 dBm Data Rate: 250 kbps Small footprint: 1 x 1.41

(25.4 mm x 35.9 mm) Advanced Power Management Scheme w/ Deep Sleep Mode Integrated PCB trace antenna Optional U.FL external Antenna 15 RF channels Up to 13,000 feet of range AES encryption FCC, CE and IC certifications ROHS compliant General ZigBee wireless sensor networking Smart Meters APPLICATIONS Smart Energy / Grid Markets Building automation and control Home automation and control Thermostats Displays Energy Management Security Devices HVAC control Lighting control ORDERING INFORMATION Part Number Order Number MeshConnect EM357 Module ZICM357P2-1 ZICM357P2-1C ZICM357P2-KIT1-1 Description

+20 dBm Output power, PCB Trace antenna

+20 dBm Output power, with U.FL Connector for external antenna

+20 dBm Engineering Development Kit The information in this document is subject to change without notice, please confirm data is current Document No: 0008-00-07-00-000 (Issue A) Date Published: January 21, 2011 Page 1 MeshConnect EM357 Module MODULE BLOCK DIAGRAM EM357 Module SPI Bus Ember EM357 Balun PA Balun DEVELOPMENT KIT CEL's Development Kit assists users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules into the target environ-

ment and evaluate performance on-site. The Development Kit also serves as an invaluable aid in application develop-

ment. Through the many interface headers on the board, the user has access to all of the MeshConnect module pins, enabling easy connection to target systems for ap-

plication development. The interface board features a serial communication inter-

face, a power management module, and peripherals such as a buzzer, a temperature sensor, push-button switches, LEDs, and GPIO headers. For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CELs website http://www.cel.com) MeshConnect EM357 Module Development Kit Kit Contents:

Evaluation Boards w/Module (2) USB Cables (1) AA Batteries (4) Software & Technical Information CD (1) DEVELOPMENT KIT ORDERING INFORMATION Description Order Number Part Number MeshConnect EM357 Module Development Kit ZICM357P2-KIT1-1

+20 dBm Engineering Development Kit Page 2 24 MHz XTALRadioMicroprocessor ANTCastellation Edge ConnectorPWR RegFlash1MB MeshConnect EM357 Module TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... System Level Function Transceiver IC......................................................................................................................................................................................... Additional Flash Memory....................................................................................................................................................................... Antenna................................................................................................................................................................................................... Power Amplifier....................................................................................................................................................................................... Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... Recommended (Operating Condition).................................................................................................................................................. DC Characteristics.................................................................................................................................................................................. RF Characteristics.................................................................................................................................................................................. Pin Signal & Interfaces Pin Signals I/O Configuration................................................................................................................................................................ I/O Pin Assignment................................................................................................................................................................................. Software/Firmware.................................................................................................................................................................................. Module Dimensions................................................................................................................................................................................ Module Footprint.................................................................................................................................................................................... 1 1 1 1 2 2 4 4 4 4 5 5 5 5 6 6 8 9 9 Processing......................................................................................................................................................................................... Agency Certifications................................................................................................................................................................... Shipment, Storage & Handling................................................................................................................................................. 14 References & Revision History................................................................................................................................................. 15 12 11 Page 3 MeshConnect EM357 Module TRANSCEIVER IC The MeshConnect EM357 module uses the Ember EM357 transceiver IC. This IC incorporates the RF transceiver with the baseband modem, a hardwired MAC, and an embedded ARM Cortex-M3 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications. For more information about the Ember EM357 IC, visit http://www.ember.com ADDITIONAL FLASH MEMORY The MeshConnect EM357 module incorporates an additional 1MB external Flash memory for Over-The-Air program up-

dates. The Flash memory communicates over the EM357s second serial controller using SPI. The flash memory is wired to the following castellation pins:

PA0 - SC2MOSI PA1 - SC2MISO PA2 - SC2SCLK PA3 - SC2nSSEL WP - Flash memory Write Protect line (has internal pull-up resistor, but not connected to the EM357) The instruction set for the Flash memory is similar to the Micron M25P80. Note that in order to achieve the specified sleep current for the module, it is necessary to send a Deep Power-Down command to the Flash memory. See http://www.micron.com for more information on the instruction set. ANTENNA CELs MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional U.FL connec-

tor can be specified, providing connection to a 50-ohm external antenna of the users choice. See Ordering Information on page 1. The PCB antenna employs an Inverted F-Antenna topology that is compact and highly efficient. To maximize range, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute significantly to the antenna performance (it should not be directly under the Inverted F-Antenna). The position of the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor design affects radiation patterns and can result in reflection, diffraction, and/or scattering of the transmitted signal. Here are some design guidelines to help ensure antenna performance:

Never place the ground plane or route copper traces directly underneath the antenna portion of the module. Never place the antenna close to metallic objects. In the overall design, ensure that wiring and other components are not placed near the antenna. Do not place the antenna in a metallic or metalized plastic enclosure. Keep plastic enclosures 1cm or more from the antenna in any direction. For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout. POWER AMPLIFIER The MeshConnect EM357 Module includes a Power Amplifier (PA). This PA delivers high efficiency, high gain, and high output power (Pout = +20.0 dBm TYP) to provide an extended range and reliable transmission for fewer nodes in a network. The PA is connected to the alternate EM357 IC TX output, so EM357 TX power modes 2 or 3 must be used to achieve the specified output power. Page 4 MeshConnect EM357 Module ABSOLUTE MAXIMUM RATINGS Description Power Supply Voltage (VDD) Voltage on any I/O Line RF Input Power Storage Temperature Range Reflow Soldering Temperature MeshConnect EM357 Module Min

-0.3

-0.3

-40 Max 3.6 VDD + 0.3 15 125 260 Unit VDC VDC dBm C C Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Description Power Supply Voltage (VDD) Input Frequency Ambient Temperature Range MeshConnect EM357 Module Max Min 2.7 3.6 2405 2475 85

-40 Typ 3.3 25 Unit V MHz C DC CHARACTERISTICS (@ 25C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted) Description Transmit Mode Current Receive Mode Current Sleep Mode Current MeshConnect EM357 Module Max Min Typ 170 28 6 Unit mA mA A RF CHARACTERISTICS (@ 25C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted) Description General Characteristics RF Frequency Range RF Channels Frequency Error Tolerance Transmitter Maximum Output Power Minimum Output Power Offset Error Vector Magnitude Receiver Sensitivity (1% PER, boost mode) Sensitivity (1% PER, normal mode) Saturation (maximum input level) MeshConnect EM357 Module Min Max Typ 2405 11

-96.2 0 20

-40 15

-100

-98 2475 25 96.2 35

-94

-92 Unit MHz kHz dBm dBm

dBm dBm dBm Page 5 MeshConnect EM357 Module PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the users host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS CEL MeshConnect EM357 Module PIN Number Ember EM357 IC Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 49 N/C 21 22 24 25 49 16, 23, 28, 37 12 13 14 18 19 20 26 27 29 Name GROUND WP PA0 PA1 PA2 PA3 GROUND VCC RESET PC6 PC7 PA7 PB3 PB4 PA4 PA5 PA6 Notes Flash memory write protect (internal pull-up) Dedicated as SC2MOSI due to Flash memory Dedicated as SC2MISO due to Flash memory Dedicated as SC2SCLK due to Flash memory Reserved as SC2nSSEL for Flash memory Active Low (Input) Digital I/O OSC32B - 32.768 kHz crystal oscillator nTX_ACTIVE - Inverted TX_ACTIVE signal Digital I/O OSC32A - 32.768 kHz crystal oscillator OSC32_EXT - Digital 32.768 kHz clock input source Digital I/O TIM1C4 - Timer 1 Channel 4 output TIM1C4 - Timer 1 Channel 4 input REG_EN - External regulator open drain output Digital I/O TIM2C3 - Timer 2 channel 3 output TIM2C3 - Timer 2 channel 3 input SC1nCTS - UART CTS handshake of Serial Controller 1 SC1SCLK - SPI master/slave clock of Serial Controller 1 Digital I/O TIM2C4 - Timer 2 channel 4 output TIM2C4 - Timer 2 channel 4 input SC1nRTS - UART RTS handshake of Serial Controller 1 SC1nSSEL - SPI slave select of Serial Controller 1 Digital I/O ADC4 - ADC Input 4 PTI_EN - Frame signal of Packet Trace Interface (PTI) TRACEDATA2 - Synchronous CPU trace data bit 2 Digital I/O ADC5 - ADC Input 5 PTI_DATA - Data signal of Packet Trace Interface (PTI) nBOOTMODE - Embedded serial bootloader activation out of rest TRACEDATA3 - Synchronous CPU trace data bit 3 Digital I/O TIM1C3 - Timer 1 channel 3 output TIM1C3 - Timer 1 channel 3 input Page 6 MeshConnect I/O PIN ASSIGNMENTS (Continued) MeshConnect EM357 Module CEL MeshConnect EM357 Module PIN Number Ember EM357 IC Pin Number 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 30 49 49 49 31 32 33 34 35 49 36 38 40 41 Name PB1 GROUND GROUND GROUND PB2 JTCK PC2 NC PC3 PC4 GROUND PB0 PC1 PC0 NC PB7 Notes Digital I/O SC1MISO - SPI slave data out of Serial Controller 1 SC1MOSI - SPI master data out of Serial Controller 1 SC1SDA - TWI data of Serial Controller 1 SC1TXD - UART transmit data of Serial Controller 1 TIM2C1 - Timer 2 channel 1 output TIM2C1 - Timer 2 channel 1 input Digital I/O SCIMISO - SPI master data in of Serial Controller 1 SC1MOSI - SPI slave data in of Serial Controller 1 SC1SCL - TWI clock of Serial Controller 1 SC1RXD - UART receive data of Serial Controller 1 TIM2C2 - Timer 2 channel 2 output TIM2C2 - Timer 2 channel 2 input JTAG clock input from debugger SWCLK - Serial Wire clock input/output with debugger Digital I/O JTDO - JTAG data out to debugger SWO - Serial Wire Output asynchronous trace output to debugger No connect Digital I/O JTDI - JTAG data in from debugger Digital I/O JTMS - JTAG mode select from debugger SWDIO - Serial Wire bidirectional data to/from debugger Digital I/O VREF - ADC reference output VREF - ADC reference input IRQA - External interrupt source A TRACECLK - Synchronous CPU trace clock TIM1CLK - Timer 1 external clock input TIM2MSK - Timer 2 external clock mask input cc Digital I/O JRST - JTAG reset input from debugger IRQD - Default external interrupt source D TRACEDATA1 - Synchronous CPU trace data bit 1 No connect Digital I/O ADC2 - ADC Input 2 IRQC - Default external interrupt source C TIM1C2 - Timer 1 channel 2 output TIM1C2 - Timer 1 channel 2 input Page 7 MeshConnect I/O PIN ASSIGNMENTS (Continued) MeshConnect EM357 Module CEL MeshConnect EM357 Module PIN Number Ember EM357 IC Pin Number Name Notes Digital I/O ADC1 - ADC Input 1 IRQB - External interrupt source B TIM1C1 - Timer 1 channel 1 output TIM1C1 - Timer 1 channel 1 input Digital I/O ADC0 - ADC Input 0 TIM2CLK - Timer 2 external clock input TIM1MSK - Timer 1 external clock mask input No connect No connect No connect No connect No connect No connect 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 42 43 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 PB6 PB5 GROUND GROUND GROUND NC NC NC NC NC NC GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND Note: PC5 is not brought out to a castellation since it is required to control the PA. For additional Pin-out details please reference Ember's EM357 IC Data sheet. SOFTWARE/FIRMWARE The MeshConnect EM357 Module is an ideal platform for the EmberZNet PRO, the industrys most deployed and field proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberZNET PRO is a complete ZigBee protocol software package containing all the elements required for mesh networking applications. For more information regarding the software development for this IC, visit http://www.ember.com The MeshConnect Development Kit provides a guide on how to access the EM357 IC and utilize the Ember software devel-

opment environment. It also provides a point to point demo application (transfer data between 2 devices) to conduct a range test and supports low level peripheral tests. Page 8 MeshConnect EM357 Module MODULE DIMENSIONS MeshConnect EM357 Module w/PCB Trace Antenna ZICM357P2 EM357 Module 0000000000000 RF Shield Pin 1 Pin 56 C7 C7B C7 C7B R1 R1 C11 C11 L3 L3 C13 C13 L4 L4 R7 R7 U1 U1 C14 C14 L2 L2 C9 C9 R2 R2 R10 R10 C24 C24 C6 C6 S S e e r r i i e e sA sA R R M M E E M M 3 3 5 5 7 7 C10 C10 C21 C C21 C 0 0 2 2 R11 C23 R11 C23 L L 5 5 C5B C5B C22 C22 R8 R8 C6A C1 C6A C1 L6 L6 C6B C6B R5 R5 C4A C4A C17 C17 C2 C2 R4 R4 C16 C16 R6 R6 R9 R9 XTAL1 XTAL1 C15 C15 3 0 9

. 0 3 1 4

. 1 Pin 19 Pin 38 1.000 0.195 0.062 MeshConnect EM357 Module w/U.FL Connector for external antenna 0.120 ZICM357P2 EM357 Module 0000000000000 RF Shield Pin 1 Pin 56 C7 C7B R1 C11 L3 C13 L4 R7 U1 C14 L2 C9 R2 R10 C24 C6 S e r i e sA R M E M 3 5 7 C10 C21 C 0 2 R11 C23 L 5 C5B C22 R8 C6A C1 L6 C6B R5 C4A C17 C2 R4 C16 R6 R9 XTAL1 C15 3 0 9

. 0 3 1 4

. 1 Pin 19 Pin 38 1.000 0.195 0.062 For layout recommendation for optimum antenna performance, refer to Antenna section in this document. Page 9 MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm]. MeshConnect EM357 Module Page 10 MeshConnect EM357 Module PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) Minimum Soak Temperature Maximum Soak Temperature Soak Time TLiquidus Time above TL Tpeak Time within 5 of Tpeak Time from 25 to Tpeak Ramp down rate 3/sec max 150C 200C 60-120 sec 217C 60-150 sec 250C 20-30 sec 8 min max 6C/sec max Pb-Free Solder Paste Use of No Clean soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (half vias) where they contact the host board should meet the appropriate IPC Speci-

fication. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section. Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. The best approach is to consider using a no clean solder paste and eliminate the post-soldering cleaning step. Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which Ultrasonic cleaning could damage the module permanently. the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following:

Proper alignment and centering of the module over the pads. Proper solder joints on all pads. Excessive solder or contacts to neighboring pads, or vias. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Page 11 MeshConnect EM357 Module PROCESSING (Continued) Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711) Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250 C. Caution If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. AGENCY CERTIFICATIONS FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC Rules and Regulations The MeshConnect Module has been certified per FCC Part 15 rules for integration into products without further testing or certification. To fulfill the FCC certification requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: W7Z-ICP0 or Contains FCC ID: W7Z-ICP0 The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certified with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Uninten-

tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules. Page 12 MeshConnect EM357 Module AGENCY CERTIFICATIONS (Continued) IC Certification Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Certification IC - Dclaration d'Industrie Canada Le terme "IC" devant le numro de certification / d'enregistrement signifie seulement que les spcifications techniques Industrie Canada ont t respectes. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php L'article 14 du CNR-210 Le programme d'installation de cet quipement radio doit s'assurer que l'antenne est situe ou oriente de telle sorte qu'il ne pas mettre de champ RF au-del des limites de Sant Canada pour la population gnrale. Consulter le Code de scurit 6, disponible sur le site Web de Sant Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/

index-eng.php CE Certification Europe The MeshConnect RF module has been tested and certified for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing. OEM Labeling Requirements The `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials CE with the following form:

If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. The CE mark must be a minimum of 5mm in height The CE marking must be affixed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the CE marking as shown in the picture Page 13 MeshConnect EM357 Module SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect Modules are delivered in trays of 28. Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40C and <90% relative humidity. Page 14 MeshConnect EM357 Module REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version 0008-00-07-00-000

(Issue ES) October 14, 2010 0008-00-07-00-000

(Issue A) January 21, 2011 Initial preliminary datasheet. Updated RF Channels to 15 for FCC Certification. Updated Pin out table. Updated processing guidelines. Page(s) N/A 1, 5 Disclaimer The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customers equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. Page 15