PRELIMINARY DATA SHEET MeshConnect Sub-G Module Series ZICM0868Px ZICM0900Px 868 / 900 MHz Transceiver Based Modules Development Kits Available:
ZICM0868P2-KIT1-1 and ZICM0900P2-KIT1-1 DESCRIPTION CEL's MeshConnect Module Series provides high performance and low cost Sub-G modules for a broad range of wireless net-
works. The MeshConnect certified and qualified modules enable customers to accelerate time to market by greatly reducing design and certification phases of development. CEL's MeshConnect Sub-G modules (868/900MHz) are based on the Silicon Labs SoC ICs (single-chip solutions). Each IC con-
sists of an RF transceiver with baseband modem, a hard-wired MAC and an embedded 8051 microcontroller with internal RAM
(4kB) and Flash (64kB) memory. The device provides numer-
ous general-purpose I/O pins and peripheral functions such as timers and UARTs. The MeshConnect Sub-G modules have 2 different output powers
(+12dBm and +19dBm). They provide a reliable transmission, to reduce the number of nodes in a network. They are especially useful for open outdoor applications where the nodes are physi-
cally far apart. The higher power Modules have an outstanding 118dB link budget ensuring high quality connections even in harsh environments. APPLICATIONS Metering RFID Remote Keyless Entry Home Automation Security Irrigation Weather Stations And more... MeshConnect Sub-G Modules ZICM0868Px ZICM0900Px Best Reliable Performance Good sensitivity providing longer range for Non-line-of-site aplications Low operating (receive) current FEATURES Frequency Range:
902- 928 MHz 868 MHz Sensitivity: -99 dBm Max Output Power:
+ 12 dBm @ 3.6 VDC (ZICM0xxxP0)
+ 19 dBm @ 3.6 VDC (ZICM0xxxP2) Data Rate: 0.123 to 150 kbps Up to 21 GPIO Pins High Speed 8051 MCU:
30 MHz 4kB RAM / 64 kB Flash 10-Bit ADC:
300 ksps, 18-ch inputs Serial Communication:
UARTs, SPI (Master/Slave) SMBus, PCA Modulation:
FSK RF Power Consumption 24 mA Receive 18 mA @ + 1 dBm transmit 30 mA @ + 12 dBm transmit 90 mA @ + 19 dBm transmit Auto-Frequency Calibration (AFC) Frequency Hopping Capability Up to 12 miles of range Operating Temperature Range:
-40 to +85C Software Support:
Synapse SNAP Embedded Firmware Wireless M-Bus (868MHz Only) Silicon Labs EZMac CEL Protocol FCC, CE and IC certifications in Progress ROHS compliant The information in this document is subject to change without notice, please confirm data is current Document No: 0009-00-07-00-000 (Issue ES) Date Published: December 7, 2010 Page 1 ORDERING INFORMATION Part Number Order Number ZICM0868P0-1CU ZICM0868P2-1CU ZICM0868P0-1CS ZICM0868P2-1CS ZICM0868P0-1C ZICM0868P2-1C MeshConnect Sub-G ZICM0868P0-1CU-SN
(Eruope Only) ZICM0868P2-1CU-SN ZICM0868P0-1CS-SN ZICM0868P2-1CS-SN ZICM0868P0-1C-SN ZICM0868P2-1C-SN ZICM0900P0-1CU ZICM0900P2-1CU ZICM0900P0-1CS ZICM0900P2-1CS ZICM0900P0-1C ZICM0900P2-1C MeshConnect Sub-G ZICM0900P0-1CU-SN ZICM0900P2-1CU-SN ZICM0900P0-1CS-SN ZICM0900P2-1CS-SN ZICM0900P0-1C-SN ZICM0900P2-1C-SN ZICM0868P2-KIT1-1 ZICM0900P2-KIT1-1 MeshConnect Sub-G Development Kits MeshConnect Sub-G Module Series Description 868 MHz Module, +12dBm output power with U.FL connector for external antenna 868 MHz Module, +19dBm output power with U.FL connector for external antenna 868 MHz Module, +12dBm output power with RP-SMA connector for external antenna 868 MHz Module, +19dBm output power with RP-SMA connector for external antenna 868 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA) 868 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA) 868 MHz Module, +12dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC address 868 MHz Module, +19dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC address 868 MHz Module, +12dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC address 868 MHz Module, +19dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC address 868 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of RP-SMA) with SNAP Operating System software and MAC address 868 MHz Module, +19dBm output power for 1/4 wave wire antenna(in place of RP-SMA) with SNAP Operating System software and MAC address 900 MHz Module, +12dBm output power with U.FL connector for external antenna 900 MHz Module, +19dBm output power with U.FL connector for external antenna 900 MHz Module, +12dBm output power with RP-SMA connector for external antenna 900 MHz Module, +19dBm output power with RP-SMA connector for external antenna 900 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA) 900 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA) 900 MHz Module, +12dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC address 900 MHz Module, +19dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC address 900 MHz Module, +12dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC address 900 MHz Module, +19dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC address 900 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of RP-SMA) with SNAP Operating System software and MAC address 900 MHz Module, +19dBm output power for 1/4 wave wire antenna (in place of RP-SMA) with SNAP Operating System software and MAC address 868 MHz Evaluation board for +19 dBm module 900 MHz Evaluation board for +19 dBm module Page 2 MODULE BLOCK DIAGRAM Sub-G T/R Switch Low Pass Filter External Memory Optional DEVELOPMENT KIT CEL's Development Kit assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules into the target environment and evaluate performance on-site. The Development Kit also serves as an invaluable aid in application develop-
ment. Through the many interface headers on the board, the user has access to all of the MeshConnect module pins, enabling easy connection to target systems for ap-
plication development. The interface board features a serial communication interface, a power management module, and peripherals such as a buzzer, push-button switches, LEDs, and GPIO headers. For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CELs website http://www.cel.com) MeshConnect Sub-G Module Series MeshConnect Sub-G Module Development Kit Kit Contents:
Evaluation Boards w/Module (2) USB Cables (1) AA Batteries (4) Software & Technical Information CD (1) Part Number DEVELOPMENT KIT ORDERING INFORMATION Description 868 MHz Evaluation board for +19dBm module 900 MHz Evaluation board for +19dBm module Order Number ZICM0868P2-KIT1-1 ZICM0900P2-KIT1-1 MeshConnect Sub-G Development Kits Page 3 ANTSI100x MeshConnect Sub-G Module Series TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... System Level Function Transceiver IC......................................................................................................................................................................................... Antenna.................................................................................................................................................................................... Additional Flash Memory....................................................................................................................................................................... Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... Recommended (Operating Condition).................................................................................................................................................. DC Characteristics.................................................................................................................................................................................. RF Characteristics.................................................................................................................................................................................. 1 1 1 2 3 3 5 5 5 6 6 6 7 Pin Signal & Interfaces Pin Signals I/O Configuration................................................................................................................................................................ I/O Pin Assignment................................................................................................................................................................................. Software/Firmware.................................................................................................................................................................................. Module Dimensions................................................................................................................................................................................ Module Footprint.................................................................................................................................................................................... 8 8 9 10 11 Processing......................................................................................................................................................................................... Agency Certifications................................................................................................................................................................... Shipment, Storage & Handling................................................................................................................................................. 14 References & Revision History................................................................................................................................................. 15 12 13 Page 4 MeshConnect Sub-G Module Series TRANSCEIVER IC The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 SOC transceiver ICs. These ICs incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering a high performance solution for all Sub-G applications. For more information about the Silicon Labs ICs, visit http://www.silabs.com. ANTENNA The MeshConnect Sub-G modules include RF connectors for external antenna options only (There is no trace antenna option). The following options are supported by CEL:
U.FL connector RP-SMA connector A Connection for 1/4 wave wire antenna in place of RP-SMA Here are some design guidelines to help ensure antenna performance:
Never place the antenna close to metallic objects. In the overall design, ensure that wiring and other components are not placed near the antenna. Do not place the antenna in a metallic or metalized plastic enclosure. Keep plastic enclosures 1cm or more from the antenna in any direction. ADDITIONAL FLASH MEMORY (Optional) The Silicon Labs Transceiver ICs (Si1000 and Si1002) have an embedded 64kB of flash. Additional memory (1MB) can be mounted on the module (as an option) to enable Over The Air (OTA) programming capability. This is a custom solution as an option for all part numbers. Page 5 MeshConnect Sub-G Module Series ABSOLUTE MAXIMUM RATINGS Description Power Supply Voltage (VDD) Voltage on any I/O Line RF Input Power Storage Temperature Range Reflow Soldering Temperature MeshConnect Sub-G Module Min
-0.3
-0.3
-40 Max 3.6 VDD + 0.3 10 125 260 Unit VDC VDC dBm C C Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Description Power Supply Voltage (VDD) Input Frequency Input Frequency Ambient Temperature Range 1.8/2.7*
MeshConnect Sub-G Module Max Min 3.6 870 928 85 Typ 3.3 25 863 902
-40 Note: * 2.7v is the min voltage if an additional memory IC was placed on the module. DC CHARACTERISTICS (@ 25C, VDD = 3.6V, ZICM0xxxP2 TX power max) MeshConnect Sub-G Module Description DC CHARACTERISTICS (@ 25C, VDD = 3.6V, ZICM0xxxP0 TX power max) MeshConnect Sub-G Module Description Min Typ 90 24 TBD Max Min Typ 35 24 TBD Max Transmit Mode Current Receive Mode Current Sleep Mode Current Transmit Mode Current Receive Mode Current Sleep Mode Current Unit V MHz MHz C Unit mA mA A Unit mA mA A Page 6 RF CHARACTERISTICS (@ 25C, VDD = 3.6V, ZICM0xxxP2) MeshConnect Sub-G Module Series Description General Characteristics RF Frequency Range Transmitter Maximum Output Power Minimum Output Power FSK Error Carrier Offset Deviation Receiver Sensitivity (1% PER, 156kbps) Saturation (maximum input level) MeshConnect Sub-G Module Min Typ Max 863 TBD TBD 19
-5 75
-99 928 TBD TBD TBD 10 RF CHARACTERISTICS (@ 25C, VDD = 3.6V, ZICM0xxxP0) Description General Characteristics RF Frequency Range Transmitter Maximum Output Power Minimum Output Power FSK Error Carrier Offset Deviation Receiver Sensitivity (1% PER, 156kbps) Saturation (maximum input level) MeshConnect Sub-G Module Min Typ Max 863 TBD TBD 12
-12 75
-99 928 TBD TBD TBD 10 Unit MHz dBm dBm
KHz KHz dBm dBm Unit MHz dBm dBm
KHz KHz dBm dBm Page 7 MeshConnect Sub-G Module Series PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the users host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS Number Notes Name GND GND GND GND GND GND GND NC ANTA GPIO0 GPIO2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Available: Not used for any module functionality Available: Not used for any module functionality Available: Not used for any module functionality P0.7/IREF Must be connected to SDN for SNAP firmware P0.6/
CNVSTR Used as Chip Select for Memory on CEL Eval. Board P0.5/RXD UART TXD P0.4/TXD UART RXD Write Protect Pin of Memory Chip on Module Used as Chip Select for Memory IC on the CEL Module Memory IC MISO signal pin Must be connected to NIRQ for SNAP firmware Memory IC Clock Signal WP NC GND GND NC NC NC P0.3 P0.2 P0.1 P0.0 GND VCC RST/C2CK Debug Clock P2.7/C2D Debug Data P2.6 P2.5 P2.4 P2.3 GPIO connected to Buzzer on CEL Eval Board GPIO connected to Switch 3 on CEL Eval board GPIO connected to LED3 on CEL Eval board GPIO connected to Switch 2 on CEL Eval Board Page 8 MeshConnect I/O PIN ASSIGNMENTS (Continued) Number Name Notes MeshConnect Sub-G Module Series 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 NC NC GND GND GND GND GND P2.2 P2.1 P2.0 P1.7 P1.6 P1.5 NIRQ SDN GND GND GND GND GND GND GND GPIO connected to LED2 on CEL Eval board GPIO connected to Switch 1 on CEL Eval Board GPIO connected to LED1 on CEL Eval board GPIO connected to Switch 0 on CEL Eval Board GPIO connected to LED0 on CEL Eval board Memory IC MOSI External Interrupt Request Radio Shutdown (Active High) SOFTWARE/FIRMWARE The Sub-G modules support the following software:
Synapse SNAP Embedded Firmware Wireless M-Bus (868MHz Only) Silicon Labs EZMac CEL Protocol The MeshConnect Sub-G Development Kit provides a guide on how to access the Si100x IC and utilize the Silicon Labs software development environment. It also provides a set of demo applications to conduct several tests. Below is the list of the demo software features:
Page 9 MeshConnect Sub-G Module Series SOFTWARE/FIRMWARE (Continued) Self Healing (Orphan handling) Point-to-Point network formation Point-to-Multipoint (Star) network formation Self Healing (Orphan handling) Point-to-Point network formation Point-to-Multipoint (Star) network formation ACK Wakeup Modes (Si100X) most likely software will just use one of the wakeup modes Frequency Hopping Unicast Addressing using 16-bit device IDs Broadcast Addressing Packet Forwarding (Master node only) Forwarding Table Aging (Master node only) Promiscuous Mode (TBD later release) Listen Before Talk (LBT) RSSI Packet Filtering Pairing/Joining Network Synchronization through beacon messages to coordinate sleep/wake cycles
- Master node needs to send out beacon as well as figure out when to go to sleep and when to wake up
- End node wakes up and looks for beacon to figure out when to go to sleep and wake up Command line interface for debug/testing/configuration Push buttons for Range or PER packet test on a Eval board Save configuration to flash Save configuration to external flash Over-the-air programming of the image to another device (TBD later release) Low Battery detection MODULE DIMENSIONS MeshConnect Sub-G Module with U.FL Connector for external antenna MeshConnect Sub-G Module with RPSMA Connector for external Antenna For layout recommendation for optimum antenna performance, refer to Antenna section in this document. Page 10 MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm]. MeshConnect Sub-G Module Series EVALUATION BOARD CEL provides an Evaluation board to allow easy testing of the Module. The Evaluation board provides power via:
AA cell batteries USB AC Adapter regulated down to 3.3VDC External Lab Power Supply (A jumper is also provided for the purposes of monitoring the DC current of the module under various modes of operation). Also included on the evaluation board are four momentary push button switches and four LEDs, a piezo buzzer, a potenti-
ometer, and a SPI memory IC. The peripherals are connected to GPIO of the module (see notes in Pin definitions) through slide switches. If the user would wants to connect user specific circuits to the GPIO, slide switches can be used to discon-
nect the evaluation board peripherals. The purpose of the evaluation board is to demonstrate simple applications of using GPIO, communicating with the device and also allow flexibility for user specific needs. Page 11 MeshConnect Sub-G Module Series PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) Minimum Soak Temperature Maximum Soak Temperature Soak Time TLiquidus Time above TL Tpeak Time within 5 of Tpeak Time from 25 to Tpeak Ramp down rate 3/sec max 150C 200C 60-120 sec 217C 60-150 sec 250C 20-30 sec 8 min max 6C/sec max Achieve the brightest possible solder fillets with a good shape and low contact angle. Pb-Free Soldering Paste Use of No Clean soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (half vias) where they contact the host board should meet the appropriate IPC Speci-
fication. See the latest IPC-A-610 "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations. Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. The best approach is to consider using a no clean soldering paste and eliminate the post-soldering cleaning step. Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which Ultrasonic cleaning could damage the module permanently. the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following:
Proper alignment and centering of the module over the pads. Proper solder joints on all pads. Excessive solder or contacts to neighboring pads, or vias. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Page 12 MeshConnect Sub-G Module Series PROCESSING (Continued) Hand Soldering Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350C, follow IPC recommendations/
reference document IPC-7711. Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. AGENCY CERTIFICATIONS FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC Rules and Regulations The MeshConnect Module has been certified per FCC Part 15 rules for integration into products without further testing or certification. To fulfill the FCC certification requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: W7Z-ICP0 or Contains FCC ID: W7Z-ICP0 The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certified with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Uninten-
tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules. Page 13 MeshConnect Sub-G Module Series AGENCY CERTIFICATIONS (Continued) IC Certification Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php CE Certification Europe The MeshConnect 868MHz RF modules has been tested and certified for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing. OEM Labeling Requirements The `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials CE with the following form:
If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. The CE mark must be a minimum of 5mm in height The CE marking must be affixed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the CE marking as shown in the picture SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect Modules are delivered in trays of 28. Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning According to JEDEC ISP, the MeshConnect Modules are moisture-sensitive devices. Appropriate handling instruc-
tions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40C and <90% relative humidity. Page 14 MeshConnect Sub-G Module Series REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version 0008-00-07-00-000
(Issue ES) December 7, 2010 Initial preliminary datasheet. Disclaimer The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customers equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. Page(s) N/A Page 15