DATA SHEET MeshConnect EM357 Mini Modules ZICM357SP0-1, ZICM357SP2-1 EmberTM EM357 Transceiver Based Modules Integrated Transceiver Modules for ZigBee /IEEE 802.15.4 Development Kit available: ZICM-EM35X-DEV-KIT-2 DESCRIPTION CELs MeshConnect EM357 Mini Modules combine high performance RF solutions with the market's premier ZigBee stack. Available in low and high output power options
(+8dBm and +20dBm), these modules can accommodate variable range and performance requirements. The tiny module footprint makes them suitable for a wide range of ZigBee applications. The MeshConnect EM357 Mini Modules are certified and qualified, enabling customers to accelerate time to market by greatly reducing the design and certification phases of development. CEL's MeshConnect EM357 Mini Modules (ZICM357SP0, ZICM357SP2) are based on the Ember EM357 Zigbee compliant SOC radio IC. The IC is a single-chip solution, compliant with ZigBee specifications and IEEE 802.15.4, a complete wireless solution for all ZigBee applications. The IC consists of an RF transceiver with the baseband modem, a hardwired MAC and an embedded 32-bit ARM Cortex-M3 microcontroller with internal RAM (12kB) and Flash (192kB) memory. The device provides numerous general-purpose I/O pins and peripheral functions such as timers and UARTs. MeshConnect EM357 Mini Modules 192 kB FLASH 12 kB SRAM 32-bit ARM Cortex-M3 Up to 23 GPIO Pins SPI (Master/Slave), TWI, UART Timers, Serial Wire/JTAG Interface 5-channel 14-bit ADC Tx:
Rx:
Link Budget:
ZICM357SP0
+8dBm
-100dBm
+108dB ZICM357SP2
+20dBm
-103dBm
+123dB FEATURES High RF Performance:
Up to 123 dB RF Link Budget
-100 dBm (ZICM357SP0)
-103 dBm (ZICM357SP2) RX Sensitivity:
Data Rate: 250 kbps Advanced Cortex-M3 Processor Advanced Power Management 16 RF Channels Industry's Premier ZigBee Pro Stack: EmberZNet PRO Mini Footprint: (23.9mm x 16.6mm) 0.940" x 0.655"
Antenna Options:
1) Integrated PCB Trace Antenna or 2) RF Port for External Antenna Supports Mesh Networks AES Encryption FCC, CE and IC Certifications ROHS Compliant Thermostats In-Home-Displays Smart Plugs APPLICATIONS Smart Energy / Grid Markets Building Automation and Control Lighting: Fixture and Control Solar Inverter and Control Home Automation and Control General ZigBee Wireless Sensor Networking Energy Management Security Devices HVAC Control ORDERING INFORMATION Part Number Order Number MeshConnect EM357 Mini Modules ZICM357SP0-1 ZICM357SP0-1C ZICM357SP2-1 ZICM357SP2-1C MeshConnect EM357 Development Kit ZICM-EM35X-DEV-KIT-2 The information in this document is subject to change without notice. Document No: 0011-00-07-00-000 (Issue E) Date Published: June 20, 2013 Description
+8 dBm Output Power, PCB Trace antenna
+8 dBm Output Power, with Castellation pin for external antenna
+20 dBm Output Power, PCB Trace antenna
+20 dBm Output Power, with Castellation pin for external antenna MeshConnect EM35x Ember Companion Kit for Ember EM35x Development Kit Min./Multiple 330 / 330 330 / 330 330 / 330 330 / 330 1 / 1 MODULE BLOCK DIAGRAMS Block Diagram Block Diagram EM357 Mini Module (ZICM357SP0) EM357 Mini Module (ZICM357SP2) 24MHz XTAL 24MHz XTAL n o i t a l l e t s a C r o t c e n n o C e g d E Ember EM357 Micro Radio Balun LPF n o i t a l l e t s a C r o t c e n n o C e g d E Ember EM357 Micro Radio PA LNA TX/RX Switch LPF DEVELOPMENT KIT CEL's Development Kit assist users in both evaluation and development. Ember Companion Kit:
CEL's MeshConnect EM35x Ember Companion Kit is designed to work with the Ember development kit [EM35X-
DEV and EM35X-DEV-IAR]. Each module in this CEL kit is soldered on a carrier board making it pin-for-pin compatible with the Ember development board. For more information regarding the MeshConnect Development Kit, refer to the respective development kit user guides documents. (Available at CELs website www.cel.com/MeshConnect) MeshConnect EM35x Ember Companion Kit Kit Contents:
ZICM357SP2-1 modules (2) ZICM357SP2-1C module (1) ZICM357SP0-1 modules (2) ZICM357SP0-1C module (1) Online Documentation DEVELOPMENT KIT ORDERING INFORMATION Part Number MeshConnect EM35x Ember Companion Kit ZICM-EM35X-DEV-KIT-2 Order Number Description MeshConnect EM35x Ember Companion Kit for Ember EM35x Dev Kits Page 2 MeshConnect EM357 Mini Modules TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... System Level Function Transceiver IC......................................................................................................................................................................................... Antenna................................................................................................................................................................................................... Power Amplifier...................................................................................................................................................................................... Software/Firmware.................................................................................................................................................................................. Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... Recommended (Operating Condition).................................................................................................................................................. DC Characteristics.................................................................................................................................................................................. RF Characteristics.................................................................................................................................................................................. Pin Signal and Interfaces Pin Signals I/O Configuration................................................................................................................................................................ I/O Pin Assignment................................................................................................................................................................................. Module Dimensions................................................................................................................................................................................ Module Footprint.................................................................................................................................................................................... 1 1 1 1 2 2 4 4 4 4 4 5 5 5 6 6 8 9 Processing......................................................................................................................................................................................... Agency Certifications................................................................................................................................................................... 11 Shipment, Storage and Handling............................................................................................................................................. 14 Quality.................................................................................................................................................................................................. 14 Revision History.............................................................................................................................................................................. 15 10 Page 3 MeshConnect EM357 Mini Modules TRANSCEIVER IC CELs MeshConnect EM357 Mini Modules use the Ember EM357 transceiver IC. This IC incorporates the RF transceiver with the baseband modem, a hardwired MAC, and an embedded ARM Cortex-M3 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications. For more information about the Ember EM357 IC, visit www.ember.com ANTENNA CELs MeshConnect EM357 Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional configuration which uses a castellation pin on the module allows the user to connect an external antenna. The ZICM357SP0 has been certified with the PCB trace antenna only while the ZICM357SP2 has been certified with the PCB trace antenna and a Nearson half-wave dipole antenna (part number: S181SA-2405S) on a 4 inch cable using the castellation pin of the module. Please refer to the document "ZICM357SP2-1C External Antenna Implementation" for details describing the requirements that must be followed to take advantage of the CEL certification. See Ordering Information on Page 1. The PCB antenna employs a topology that is compact and highly efficient. To maximize range, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute significantly to the antenna performance (it should not be directly under the module PCB Antenna). The position of the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor design affects radiation patterns and can result in reflection, diffraction and/or scattering of the transmitted signal. For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna (a minimum of 1.5" x 1.5" is recommended). The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout. Here are some design guidelines to help ensure antenna performance:
Never place the ground plane or route copper traces directly underneath the antenna portion of the module. Never place the antenna close to metallic objects. Do not place the antenna in a metallic or metalized plastic enclosure. Keep plastic enclosures 1cm or more from the antenna in any direction. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. POWER AMPLIFIER CELs MeshConnect EM357 High Power Module (ZICM357SP2) includes a Power Amplifier (PA). This PA delivers high efficiency, high gain, and high output power (Pout = +20.0 dBm TYP) to provide an extended range and reliable transmission for fewer nodes in a network. For the ZICM357SP2, Power mode 2 with Power Setting "-2" is the maximum setting allowed for FCC compliance. Operating in power mode 3 at higher power settings may damage the power amplifier. SOFTWARE/FIRMWARE CELs MeshConnect EM357 Mini Modules are ideal platforms for the EmberZNet PRO, the industrys most deployed and field proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberZNET PRO is a complete ZigBee protocol software package containing all the elements required for mesh networking applications. For more information regarding the software development for this IC, visit www.ember.com CEL provides reference software that runs multiple functions and executes various commands. The firmware allows the execution of IEEE 802.15.4 communication, validation and manufacturing tests. For example, users can setup a simple ZigBee Point-to-Point network to perform Range and Packet Error Rate (PER) tests. The software can also place the module in various operating modes, which allows for setting and/or testing various parameters. In the overall design, ensure that wiring and other components are not placed near the antenna. The ZICM357SP0 uses the transceiver's Primary RF ports for transmitting and should use power mode 1. The ZICM357SP2 uses the transceiver's Alternate RF ports for transmitting and should use power mode 2. Page 4 MeshConnect EM357 Mini Modules ABSOLUTE MAXIMUM RATINGS Description Power Supply Voltage (VDD) Voltage on any I/O Line RF Input Power ZICM357SP0 ZICM357SP2 MeshConnect ZICM357SPx Module Min
-0.3
-0.3
-40 Max 3.6 VDD + 0.3
+15
+5 125 260 Storage Temperature Range Reflow Soldering Temperature Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Unit VDC VDC dBm C C Unit Description Power Supply Voltage (VDD) Input Frequency Ambient Temperature Range DC CHARACTERISTICS (@ 25 C, VDD = 3.3V, ZICM357SP0 TX power mode 1, ZICM357SP2 TX power mode 2) VDC MHz C MeshConnect ZICM357SPx Module Max Min 3.6 2.1 2480 2405
-40 85 Typ 3.3 25 Description Transmit Mode Current @ 8dBm Transmit Mode Current @ 0dBm Receive Mode Current Transmit Mode Current @ 20dBm Transmit Mode Current @ 0dBm Receive Mode Current Sleep Mode Current ZICM357SP0 ZICM357SP2 MeshConnect ZICM357SPx Module Min Max Typ 44 31 30 150 58 34 1 Unit mA mA mA mA mA mA A RF CHARACTERISTICS (@ 25 C, VDD = 3.3V, ZICM357SP0 TX power mode 1, ZICM357SP2 TX power mode 2) Description MeshConnect ZICM357SPx Module Min Max Typ Unit MHz kHz ZICM357SP0 2480 26 96.2 2405 11
-96.2 General Characteristics RF Frequency Range RF Channels Frequency Error Tolerance Transmitter Maximum Output Power Minimum Output Power Offset Error Vector Magnitude Maximum Output Power
(using power mode 2, power setting -2) Minimum Output Power Offset Error Vector Magnitude Receiver Sensitivity (1% PER, boost mode) Saturation (maximum input level) Sensitivity (1% PER, normal mode) Saturation (maximum input level) Note: For the ZICM357SP2, Power mode 2 with Power Setting "-2" is the maximum setting allowed for FCC compliance. Operating in power mode 3 at higher power settings may damage the power amplifier. dBm dBm dBm dBm
-100
-103 dBm dBm
-94
-97 0
-10 ZICM357SP2 ZICM357SP2 ZICM357SP0 8
-40 5 dBm
35
-40 5 35 dBm 20 21 Page 5 MeshConnect EM357 Mini Modules PIN SIGNALS I/O PORT CONFIGURATION CELs MeshConnect module has 33 edge I/O interfaces for connection to the users host board. The MeshConnect Module Dimensions shows the layout of the 33 edge castellations. MeshConnect I/O PIN ASSIGNMENTS CEL MeshConnect ZICM357SPx Module Pin Number 1, 2, 12, 31, 33 3 4 5 6 7 8 9 10 11 13 14 15 16 17 18 Ember EM357 IC Pin Number 49 11 12 13 14 18 19 20 21 22 16, 23, 28, 37 24 25 26 27 29 Name GROUND PC5 RESET PC6 PC7 PA7 PB3 PB4 PA0 PA1 VCC PA2 PA3 PA4 PA5 PA6 Notes Digital I/O TX_ACTIVE - Logic-level control for PA. The EM35x baseband controls TX_ ACTIVE and drives it high when in TX mode Applies only to the ZICM357SP0. PC5 is a NC on the ZICM357SP2 Active Low chip reset (Input) Digital I/O OSC32B - 32.768 kHz crystal oscillator nTX_ACTIVE - Inverted TX_ACTIVE signal Digital I/O OSC32A - 32.768 kHz crystal oscillator OSC32_EXT - Digital 32.768 kHz clock input source Digital I/O TIM1C4 - Timer 1 Channel 4 input/output REG_EN - External regulator open drain output Digital I/O TIM2C3 - Timer 2 Channel 3 input/output SC1nCTS - UART CTS handshake of Serial Controller 1 SC1SCLK - SPI master/slave clock of Serial Controller 1 Digital I/O TIM2C4 - Timer 2 Channel 4 input/output SC1nRTS - UART RTS handshake of Serial Controller 1 SC1nSSEL - SPI slave select of Serial Controller 1 Digital I/O TIM2C1 - Timer 2 Channel 1 input/output SC2MOSI - SPI master data out/slave data in of Serial Controller 2 Digital I/O TIM2C3 - Timer 2 Channel 3 input/output SC2SDA - TWI data of Serial Controller 2 SC2MISO - SPI master data in/slave data out of Serial Controller 2 Digital I/O TIM2C4 - Timer 2 Channel 4 input/output SC2SCL - TWI clock of Serial Controller 2 SC2SCLK - SPI master/slave clock of Serial Controller 2 Digital I/O TIM2C2 - Timer 2 channel 2 input/output SC2nSSEL - SPI slave select of Serial Controller 2 TRACECLK - Synchronous CPU trace clock Digital I/O ADC4 - ADC Input 4 PTI_EN - Frame signal of Packet Trace Interface (PTI) TRACEDATA2 - Synchronous CPU trace data bit 2 Digital I/O ADC5 - ADC Input 5 PTI_DATA - Data signal of Packet Trace Interface (PTI) nBOOTMODE - Embedded serial bootloader activation out of reset TRACEDATA3 - Synchronous CPU trace data bit 3 Digital I/O TIM1C3 - Timer 1 channel 3 input/output Page 6 MeshConnect EM357 Mini Modules MeshConnect I/O PIN ASSIGNMENTS (Continued) CEL MeshConnect ZICM357SPx Module PIN Number Ember EM357 IC Pin Number Name Notes Digital I/O SC1MISO - SPI slave data out of Serial Controller 1 SC1MOSI - SPI master data out of Serial Controller 1 SC1SDA - TWI data of Serial Controller 1 SC1TXD - UART transmit data of Serial Controller 1 TIM2C1 - Timer 2 channel 1 input/output Digital I/O SC1MISO - SPI master data in of Serial Controller 1 SC1MOSI - SPI slave data in of Serial Controller 1 SC1SCL - TWI clock of Serial Controller 1 SC1RXD - UART receive data of Serial Controller 1 TIM2C2 - Timer 2 channel 2 input/output JTAG clock input from debugger SWCLK - Serial Wire clock input/output with debugger Digital I/O JTD0 - JTAG data out to debugger SWO - Serial Wire Output asynchronous trace output to debugger Digital I/O JTDI - JTAG data in from debugger Digital I/O JTMS - JTAG mode select from debugger SWDIO - Serial Wire bidirectional data to/from debugger Digital I/O VREF - ADC reference input/output IRQA - External interrupt source A TRACECLK - Synchronous CPU trace clock TIM1CLK - Timer 1 external clock input TIM2MSK - Timer 2 external clock mask input Digital I/O ADC3 - ADC Input 3 SWO - Serial Wire Output asynchronous trace output to debugger TRACEDATA0 - Synchronous CPU trace data bit 0 Digital I/O JRST - JTAG reset input from debugger IRQD - Default external interrupt source D TRACEDATA1 - Synchronous CPU trace data bit 1 Digital I/O ADC2 - ADC Input 2 IRQC - Default external interrupt source C TIM1C2 - Timer 1 channel 2 input/output Digital I/O ADC1 - ADC Input 1 IRQB - External interrupt source B TIM1C1 - Timer 1 channel 1 input/output Digital I/O ADC0 - ADC Input 0 TIM2CLK - Timer 2 external clock input TIM1MSK - Timer 1 external clock mask input Castellation Pin for external Antenna PB1 PB2 JTCK PC2 PC3 PC4 PB0 PC1 PC0 PB7 PB6 PB5 RF Out 30 31 32 33 34 35 36 38 40 41 42 43 NC 19 20 21 22 23 24 25 26 27 28 29 30 32 Note: PC5 Applies only to the ZICM357SP0; PC5 is a NC on the ZICM357SP2. Page 7 MeshConnect EM357 Mini Modules MODULE DIMENSIONS MeshConnect EM357 Mini Modules EM300 Series Module ZICM35xSPx 0000000000000 Pin 33 Pin 1 C7 C7B C7 C7B R1 R1 C11 C11 L3 L3 C13 C13 L4 L4 R7 R7 U1 U1 C14 C14 L2 L2 C9 C9 R2 R2 S S e e r r i i e e sA sA R R M M E E M M 3 3 5 5 7 7 C10 C10 R10 R10 C24 C24 C6 C6 C21 C C21 C 0 0 2 2 R11 C23 R11 C23 L L 5 5 C5B C5B C22 C22 R8 R8 C6A C1 C6A C1 L6 L6 C6B C6B R5 R5 C4A C4A C17 C17 C2 C2 R4 R4 C16 C16 Pin 11 R6 R6 R9 R9 XTAL1 XTAL1 C15 C15 Pin 22 0 4 9
. 0 0.655 0.062 0.152 MAX Note: All dimensions are +/- 0.005" unless otherwise specified. Page 8 MeshConnect EM357 Mini Modules MODULE LAND FOOTPRINT Note: For layout recommendation for optimum antenna performance, refer to the Antenna section in this document. Page 9 MeshConnect EM357 Mini Modules PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) Minimum Soak Temperature Maximum Soak Temperature Soak Time TLiquidus Time above TL Tpeak Time within 5 of Tpeak Time from 25 to Tpeak Ramp down rate 3/sec max 150C 200C 60-120 sec 217C 60-150 sec 250C 20-30 sec 8 min max 6C/sec max Pb-Free Solder Paste Use of No Clean soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (half vias) where they contact the host board should meet the appropriate IPC Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section. the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. The best approach is to consider using a no clean solder paste and eliminate the post-soldering cleaning step. Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which Ultrasonic cleaning could damage the module permanently. is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following:
Proper alignment and centering of the module over the pads. Proper solder joints on all pads. Excessive solder or contacts to neighboring pads, or vias. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711). Page 10 MeshConnect EM357 Mini Modules PROCESSING (Continued) Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250 C. Caution If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock. Avoid overheating. Warning Never attempt a rework on the module itself, (e.g. replacing individual components). Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires or cables onto the module RF shield cover is done at the customer's own risk. The ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. AGENCY CERTIFICATIONS (PCB ANTENNA ONLY) The following Certifications are in effect:
ZICM357SP0-1: FCC, IC, CE ZICM357SP2-1: FCC, IC FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS Standards. Operation is subject to the following two conditions:
1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC and IC Rules and Regulations The MeshConnect Module has been certified per FCC Part 15 rules and to Industry Canada license-exempt RSS Standards for integration into products without further testing or certification. To fulfill the FCC and IC certification requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is labeled with its own FCC ID Number and IC ID Number. If the FCC ID and the IC ID are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
or Contains Transmitter Module FCC ID: W7Z-ZICM357SP2 or Contains FCC ID: W7Z-ZICM357SP2 Contains Transmitter Module IC: 8254A-ZICM357SP2" or "Contains IC: 8254A-ZICM357SP2 Contains Transmitter Module FCC ID: W7Z-ZICM357SP0 or Contains FCC ID: W7Z-ZICM357SP0 Contains Transmitter Module IC:8254A-ZICM357SP0" or "Contains IC: 8254A-ZICM357SP0 Page 11 MeshConnect EM357 Mini Modules AGENCY CERTIFICATIONS (Continued) The OEM of the MeshConnect Module may only use the approved antenna, (PCB Trace Antenna) that has been certified with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules. IC Certification Industry Canada Statement The term "IC" before the certification/registration number only signifies that the Industry Canada technical specifications were met. Certification IC - Dclaration d'Industrie Canada Le terme "IC" devant le numro de certification/d'enregistrement signifie seulement que les spcifications techniques Industrie Canada ont t respectes. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php L'article 14 du CNR-210 Le programme d'installation de cet quipement radio doit s'assurer que l'antenne est situe ou oriente de telle sorte qu'il ne pas mettre de champ RF au-del des limites de Sant Canada pour la population gnrale. Consulter le Code de scurit 6, disponible sur le site Web de Sant Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php CE Certification Europe The MeshConnect ZICM357SP0 module has been tested and certified for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing. OEM Labeling Requirements The CE mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials CE with the following form:
If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. The CE mark must be a minimum of 5mm in height If the use of the module is subject to restrictions in the end application, the CE marking on the OEM product should also include the alert sign as shown in the picture to the right. Page 12 MeshConnect EM357 Mini Modules AGENCY CERTIFICATIONS (Continued) Software Compliance The ZICM357SP2 requires software restrictions to meet agency certification requirements. These restrictions have been implemented in the sample application included with the software development kit. If a customer is not starting with CEL's software development kit, they must implement these output power restrictions to use the ZICM357SP2 FCC or IC certification:
Certification RF Channel Valid TX Power Steps Typical Max Output Power ZICM357SP0-1 FCC/IC ETSI ZICM357SP2-1 FCC/IC ZICM357SP2-1C FCC/IC 11 - 25 26 11 - 26 11 - 24 25 26 11 - 24 25 26
-43 to 8
-43 to 0
-43 to 8
-43 to -2
-43 to -6
-43 to -26
-43 to -2
-43 to -12
-43 to -38 8 dBm 1 dBm 8 dBm 20 dBm 17 dBm
-3 dBm 20 dBm 9 dBm
-5 dBm Note: For the ZICM357SP2, Power mode 2 with Power Setting "-2" is the maximum setting allowed for FCC compliance. Operating in power mode 3 at higher power settings may damage the power amplifier. Page 13 MeshConnect EM357 Mini Modules SHIPMENT, HANDLING AND STORAGE Shipment The MeshConnect Modules have two delivery options:
1. Trays (in bundles) of 330 units. Each tray contains 66 units 2. Tape and Reel for easy assembly in a manufacturing environment. The reel diameter is 330mm (12.992in) and contains 700 modules. Tape and Reel Dimensions Measurements are in inches [mm]
0.0790.004 [2.000.10]
0.9570.004 [24.300.10]
4.00 PITCH 0.0140.002 [0.350.05]
0.1690.004 [4.300.10]
SECTION A-A A A 0.0710.004 [1.750.10]
B B 0.7950.006 [20.200.15]
1.7320.011 [44.000.30]
0.9450.004 [24.000.10]
0.6690.004 [17.000.10]
Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. SECTION B-B Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40C and <90% relative humidity. QUALITY CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610 specification, Class II. Our modules go through JESD22 qualification processes which includes high temperature operating life tests, mechanical shock, temperature cycling, humidity and reflow testing. CEL conducts RF and DC factory testing on 100%
of all production parts. CEL builds the quality into our products, giving our customers confidence when integrating our products into their systems. Page 14 MeshConnect EM357 Mini Modules REVISION HISTORY Previous Versions Changes to Current Version Initial preliminary datasheet. Added FCC certification and shipping information; edited "Features" section Updated Min./Multiple values Updated Software Compliance table Updated land pattern; added note about operating in Boost Mode on SP2. Removed "Preliminary" from first page. Updated Antenna section, Shipment section 0011-00-07-00-000 March 29, 2012 0011-00-07-00-000
(Issue A) April 11, 2012 0011-00-07-00-000
(Issue B) May 4, 2012 0011-00-07-00-000
(Issue C) June 22, 2012 0011-00-07-00-000
(Issue D) July 31, 2012 0011-00-07-00-000
(Issue E) February 28, 2013 0011-00-07-00-000
(Issue E) June 20, 2013 Disclaimer The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customers equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. Page(s) N/A 1, 13 1, 13 13 9 1 4, 14 Page 15 MeshConnect EM357 Mini Modules