Preliminary Specification Number: SP-KL1FX-K W-LAN Module Data Sheet Cypress Chipset for 802.11b/g/n Sample P/N : LBWA1KL1FX-TEMP Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 1 / 29 The revision history of the product specification Issued Date Apr. 29. 2015 Revision Code
Revision Page
Changed Items Change Reason Sep. 17, 2015 A Oct. 29, 2015 B Mar. 18. 2016 C Oct 31, 2016 Dec 14, 2016 Feb 9, 2017 Feb 28, 2017 Jul. 25, 2017 Mar. 20, 2018 Jun.14.2018 Dec.28.2018 D E F G H I J K First Issue 4. Dimensions, Marking and Terminal Configurations: Change Pin14 NC to GND Reference schematic 4. Dimensions, Marking and Terminal Configurations, Add note of SDIO 4. Dimensions, Marking, and Terminal Configurations, Add pin 20, 27, 41 functional description. 6. Operating Condition, Add Specification Temperature Range 4. Dimensions, Marking and Terminal 6.1. Operating condition 10. DC/RF Characteristics 6.1. Operating condition APPENDIX 12. Reference Circuit IC Part Number 6.2. Power Up Sequence P. 5 P.16 P.7 P.8 P4 P8 P12 P8 P24 P16 P8 P9 P17 12. Reference Circuit P4 P17 P22 4.Dimensions,Marking and Terminal Configurations 12. Reference Circuit Soldering Conditions/Cleaning Correction Addition Addition Correction Correction Correction Addition Correction Changed Added WLAN Boot up Sequence Added 32.768kHz Xtal in the reference circuit. Added dimensions m3 and m4 Revised Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 2 / 29 TABLE OF CONTENTS 1. Scope ...................................................................................................................................................... 3 2. Part Number ......................................................................................................................................... 3 3. Block Diagram ....................................................................................................................................... 3 4. Dimensions, Marking and Terminal Configurations ......................................................................... 4 5. Rating .................................................................................................................................................... 8 6. Operating Condition ............................................................................................................................. 8 6.1. Operating condition ....................................................................................................................... 8 6.2. Power Up Sequence ........................................................................................................................ 8 7. Digital I/O Requirements ................................................................................................................... 10 8. External LPO Specification ................................................................................................................ 10 9. Interface Timing ................................................................................................................................. 11 9.1. SDIO Timing (Default Mode) ...................................................................................................... 11 9.2. SDIO Timing (High Speed Mode) ............................................................................................... 12 10. DC/RF Characteristics...................................................................................................................... 13 10.1. DC/RF Characteristics for IEEE802.11b .................................................................................. 13 10.2. DC/RF Characteristics for IEEE802.11g .................................................................................. 14 10.3. DC/RF Characteristics for IEEE802.11n.................................................................................. 15 11. Land pattern ...................................................................................................................................... 16 12. Reference Circuit .............................................................................................................................. 17 13. Tape and Reel Packing ..................................................................................................................... 18 14. NOTICE ............................................................................................................................................. 21 14.1. Storage Conditions: .................................................................................................................... 21 14.2. Handling Conditions: ................................................................................................................. 21 14.3. Standard PCB Design (Land Pattern and Dimensions): ........................................................ 21 14.4. Notice for Chip Placer: ............................................................................................................... 21 14.5. Soldering Conditions: ................................................................................................................. 22 14.6. Cleaning: ..................................................................................................................................... 22 14.7. Operational Environment Conditions: ..................................................................................... 22 14.8. Input Power Capacity: ............................................................................................................... 22 15. PRECONDITION TO USE OUR PRODUCTS ............................................................................... 23 Please be aware that an important notice concerning availability, standard warranty and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet. Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 3 / 29 1. Scope This specification is applied to the IEEE802.11b/g/n W-LAN module.
- Interface
- IC/Firmware
- Reference Clock
- MSL
- RoHS
: SDIO (WLAN)
: Cypress/CYW43364
: Reference clock is embedded.
: Level 3
: This module is compliant with the RoHS directive. 2. Part Number Sample Part Number EVK Part Number LBWA1KL1FX-TEMP LBWA1KL1FX-TEMP-D 3. Block Diagram Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 4 / 29 4. Dimensions, Marking and Terminal Configurations
< Top View >
< Side View >
< Bottom View >
B D 012345678 1FX A C Marking A B C D Pin 1 Marking Murata Logo Module Type Inspection Number Meaning Dimensions (unit : mm) Mark L a1 b1 c2 e2 e5 e8 m3 Dimensions 6.95 +/- 0.2 0.25 +/- 0.10 0.30 +/- 0.2 0.50 +/- 0.1 0.2 +/- 0.1 1.175 +/- 0.100 0.50 +/- 0.10 0.5 +/- 0.1 Mark W a2 b2 c3 e3 e6 m1 m4 Dimensions 5.15 +/- 0.2 0.5 +/- 0.1 0.30 +/- 0.2 0.375 +/- 0.100 0.2 +/- 0.1 1.0 +/- 0.1 1.0 +/- 0.1 0.5 +/- 0.1 Mark T a3 c1 e1 e4 e7 m2 Dimensions 1.1 max. 0.25 +/- 0.10 0.50 +/- 0.1 0.2 +/- 0.1 0.3 +/- 0.1 0.525 +/- 0.100 1.0 +/- 0.1 Structure Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 5 / 29 Terminal Configurations No. Terminal Name Type Connection to IC Terminal Description
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(17)
(18)
(19)
(20)
(21)
(22)
(23) GND NC NC NC NC NC NC NC NC NC NC GND NC GND
WL_GPIO_4 I/O GPIO_4 NC
WL_GPIO_2 I/O GPIO_2 WL_GPIO_1 I/O GPIO_1 NC NC NC NC NC NC NC NC NC NC NC GND NC GND SDIO_CLK GND
I
SDIO_CLK SDIO clock input SDIO_CMD I/O SDIO_CMD SDIO command line SDIO_DATA_2 I/O SDIO_DATA_2 SDIO data line 2
(24) SDIO_DATA_0 I/O SDIO_DATA_0 SDIO data line 0
(25) SDIO_DATA_3 I/O SDIO_DATA_3 SDIO data line 3
(26) SDIO_DATA_1 I/O SDIO_DATA_1 SDIO data line 1
(27) WL_GPIO_0_HOST_ WAKE O GPIO_0 WLAN Host Wake Preliminary & Confidential
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Murata Manufacturing Co., Ltd.
(28) WL_REG_ON I WL_REG_ON Preliminary Specification Number: SP-KL1FX-K 6 / 29 Used by PMU to power up or power down the internal regulators used by the WLAN section. Also, when deasserted, this pin holds the WLAN section in reset. This pin has an internal 200k pull-down resistor that is enabled by default. It can be disabled through programming.
(29)
(30)
(31) GND VBAT VIN_LDO
(32) GND (SR_PVSS)
(33) GND (SR_PVSS)
PI PI
LDO_VDDBAT5V, SR_VDDBAT5V LDO_VDD1P5, WLRF_VDD_1P35 SR_VLX PO SR_VLX CBUCK switching regulator output.
(34)
(35)
(36) GND VIO
(37) LPO_IN (32kHz)
(38)
(39)
(40)
(41)
(42)
(46) NC NC GND ANT GND SCC_VDDIO, SYS_VDDIO LPO_IN External sleep clock input
(32.768kHz). NC NC l RF(WiFi) Signal
PI I
Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 7 / 29 SDIO Pin Description No. Pin Name
(i) SD 4-bit Mode
(ii) SD 1-bit Mode 20 24 26 SDIO_CLK CLK Clock CLK Clock SDIO_D0 DATA0 Data line 0 DATA Data line SDIO_D1 DATA1 Data line 1 /Interrupt IRQ Interrupt 23 SDIO_D2 DATA2 Data line 2 SDIO_D3 DATA3 Data line 3 NC NC Not used Not used SDIO_CMD CMD Command line CMD Command line 25 22 SD Host CLK CMD DATA[3:0]
LBWA1KL1FX SD Host CLK CMD DATA IRQ LBWA1KL1FX
(i) SD 4-bit Mode
(ii) SD 1-bit Mode Note : 10 to 100k pull-ups are required on the four DATA lines and the CMD line. This requirement must be met during all operating states by using external pull-up resisters or properly programming internal SDIO host pull-ups. Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 8 / 29 5. Rating Storage Temperature Supply Voltage VBAT VDDIO min.
-40
-0.5
-0.5 max.
+85 5.0 3.9 unit deg.C V V
* Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition. 6. Operating Condition 6.1. Operating condition Operating Temperature Range Specification Temperature Range Operating Voltage VBAT VDDIO VBAT VDDIO min.
-40
-10 3.0 1.71 3.2 1.71 typ.
+25
+25 3.6 1.8 or 3.3 3.6 1.8 or 3.3 max.
+85
+55 4.8 3.63 4.2 3.63 unit deg.C deg.C V V V V Specification Voltage
[Note] All RF characteristics in this datasheet are defined by Specification Temperature Range and Specification Voltage. 6.2. Power Up Sequence
VBAT should not rise 10%-90%faster than 40 microsecond. VBAT should be up before or at the same time as VIO. VIO should NOT be present fast or be held high before VBAT is high. Power On Sequence for WLAN 32.768 kHz Sleep Clock VBAT VDDIO WL_REG_ON 90% of VH
> 2 Sleep cycles Preliminary & Confidential
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Murata Manufacturing Co., Ltd. WLAN Boot up Sequence Preliminary Specification Number: SP-KL1FX-K 9 / 29 1 This wait time is programmable in sleep-clock increments from 1 to 255 (30us to 15ms) Preliminary & Confidential
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Murata Manufacturing Co., Ltd. VBATRamp time from 0V to 4.3V > 40sVDDIO> 2 ms< 1.5 ms< 3 msWL_REG_ONVDDC(from internal PMU)Internal POR< 50 msAfter a fixed delay following internal POR going high, the device responds to host F0 (address 0x14) readsDevice requests a reference clock0.6VAfter 151ms the reference clock is assumed to be up. Access to PLL resistaers is possible.151ms Preliminary Specification Number: SP-KL1FX-K 10 / 29 7. Digital I/O Requirements SDIO Interface I/O Pins Input low voltage (VDDIO = 3.3V) Input high voltage (VDDIO = 3.3V) Input low voltage (VDDIO = 1.8V)) Input high voltage (VDDIO = 1.8V) Output low voltage (VDDIO = 3.3V) Output high voltage (VDDIO = 3.3V) Output low voltage (VDDIO = 1.8V) Output high voltage (VDDIO = 1.8V) Other Digital I/O Pins Input low voltage (VDDIO = 3.3V) Input high voltage (VDDIO = 3.3V) Input low voltage (VDDIO = 1.8V)) Input high voltage (VDDIO = 1.8V) Output low voltage (VDDIO = 3.3V) Output high voltage (VDDIO = 3.3V) Output low voltage (VDDIO = 1.8V) Output high voltage (VDDIO = 1.8V) Sym VIL VIH VIL VIH VOL VOH VOL VOH Sym VIL VIH VIL VIH VOL VOH VOL VOH min.
0.625*VDDIO
1.27
0.75*VDDIO
1.40 max. 0.25*VDDIO
0.58
0.125*VDDIO
0.45
min.
2.0
0.65*VDDIO
VDDIO-0.4
VDDIO-0.45 max. 0.8
0.35*VDDIO
0.40
0.45
unit V V V V V V V V unit V V V V V V V V 8. External LPO Specification Parameter Condition/Notes Frequency Frequency accuracy Duty cycle Input amplitude Signal type Input impedancea
Square wave or sine wave Resistive Capacitive Clock jitter a. When power is applied or switched off. Minimu m
-200 30 200
100
Specification Typical 32.768
Maximu m
+200 70 3300
5 10,000 Units KHz ppm
mV, p-p
k pF ppm Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 11 / 29 9. Interface Timing 9.1. SDIO Timing (Default Mode) Symbol Min(1) Parameter Clock CLK (All values are referred to min. VIH and max. VIL(2) 0 Frequency-Data Transfer Mode 0 Frequency-Identification Mode 10 Clock Low Time 10 Clock High Time
Clock Rise Time Clock Fall Time
Inputs: CMD, DAT (referenced to CLK) Input Setup Time Input Hold Time Outputs: CMD, DAT (referenced to CLK) Output Delay time-Data Transfer Mode Output Delay time-Identification Mode
(1). Timing is based on CL < 40pF load on CMD and Data.
(2). Min (Vih) = 0.7*VDDIO and max (Vil) = 0.2*VDDIO. fPP fOD tWL tWH tTLH tTHL tODLY tODLY tISU tIH 0 0 5 5 Typ(1) Max(1) Unit
25 400
10 10
14 50 MHz kHz ns ns ns ns ns ns ns ns Preliminary & Confidential
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Murata Manufacturing Co., Ltd. CLKOutputInputfPPtWHtISUtIHtODLY(min)tWLtTHLtTLHtODLY(max) 9.2. SDIO Timing (High Speed Mode) Preliminary Specification Number: SP-KL1FX-K 12 / 29 Symbol Min(1) fPP fOD tWL tWH tTLH tTHL Parameter Clock CLK (All values are referred to min. VIH and max. VIL(2) 0 Frequency-Data Transfer Mode 0 Frequency-Identification Mode 7 Clock Low Time 7 Clock High Time
Clock Rise Time Clock Fall Time
Inputs: CMD, DAT (referenced to CLK) Input Setup Time Input Hold Time Outputs: CMD, DAT (referenced to CLK) Output Delay time-Data Transfer Mode Output Hold time Total System Capacitance (each line)
(1). Timing is based on CL < 40pF load on CMD and Data.
(2). Min (Vih) = 0.7*VDDIO and max (Vil) = 0.2*VDDIO. tODLY tOH CL tISU tIH 6 2
2.5
Typ(1) Max(1) Unit
50 400
3 3
14
40 MHz kHz ns ns ns ns ns ns ns ns pF Preliminary & Confidential
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Murata Manufacturing Co., Ltd. CLKInputOutputfPPtWHtISUtIHtOHtWLtTHLtTLHtODLY50% VDD Preliminary Specification Number: SP-KL1FX-K 13 / 29 10. DC/RF Characteristics 10.1. DC/RF Characteristics for IEEE802.11b Specification Mode Frequency Data rate IEEE802.11b DSSS / CCK 2400 - 2483.5MHz 1, 2, 5.5, 11Mbps Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V, Output power setting=17dBm, 11Mbps mode Items
- DC Characteristics -
DC current 1) Tx mode (1024byte, 20usec interval) 2) Rx mode
- Tx Characteristics -
Output Power (tolerance) Spectrum Mask 1) 1st side lobes 2) 2nd side lobes Power-on and Power-down ramp RF Carrier Suppression Modulation Accuracy (EVM) Outband Spurious Emissions 1) 30MHz to 1GHz (BW=100kHz) 2) 1GHz to 12.75GHz (BW=100kHz) 3) 1.8GHz to 1.9GHz (BW=100kHz) 4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
Minimum Input Level (FER < 8%) Maximum Input Level (FER < 8%) Adjacent Channel Rejection (FER < 8%) min. min. 15
15
min.
-10 35 Contents typ. 320 47 typ. 17
-43
-54 15
typ.
-89
max. 370 60 max. 19
-30
-50 2.0
35
-36
-30
-47
-47 max.
-76
unit mA mA unit dBm dBr dBr sec dB
dBm dBm dBm dBm unit dBm dBm dB Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 14 / 29 10.2. DC/RF Characteristics for IEEE802.11g Specification Mode Frequency Data rate IEEE802.11g OFDM 2400 - 2483.5MHz 6, 9, 12, 18, 24, 36, 48, 54Mbps Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V, Output power setting=13dBm, 54Mbps mode Items
- DC Characteristics -
DC current 1) Tx mode (1024byte, 20usec interval) 2) Rx mode
- Tx Characteristics -
Output Power (tolerance) Spectrum Mask 1) 9MHz to 11MHz (0dB ~ -20dB) 2) 11MHz to 20MHz (-20dB ~ -28dB) 3) 20MHz to 30MHz (-28dB ~ -40dB) 4) 30MHz to 33MHz (-40dB) Constellation Error (EVM) Outband Spurious Emissions 1) 30MHz to 1GHz (BW=100kHz) 2) 1GHz to 12.75GHz (BW=100kHz) 3) 1.8GHz to 1.9GHz (BW=100kHz) 4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
Minimum Input Level (PER < 10%) Maximum Input Level (PER < 10%) Adjacent Channel Rejection (PER < 10%) min. min. 11
min.
-20
-1 Contents typ. 270 47 typ. 13
-33
-41
-53
-53
-30
typ.
-75
max. 310 60 max. 15
-20
-28
-40
-40
-25
-36
-30
-47
-47 max.
-65
unit mA mA unit dBm dBr dBr dBr dBr dB dBm dBm dBm dBm unit dBm dBm dB Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 15 / 29 10.3. DC/RF Characteristics for IEEE802.11n Specification Mode Frequency Data rate IEEE802.11n OFDM 2400 - 2483.5MHz 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Conditions : 25deg.C, VBAT=3.6V, VDDIO= 3.3V, Output power setting=12dBm, 65Mbps mode Items
- DC Characteristics -
DC current 1) Tx mode (1024byte, 20usec interval) 2) Rx mode
- Tx Characteristics -
Output Power (tolerance) Spectrum Mask 1) 9MHz to 11MHz (0dB ~ -20dB) 2) 11MHz to 20MHz (-20dB ~ -28dB) 3) 20MHz to 30MHz (-28dB ~ -45dB) 4) 30MHz to 33MHz (-45dB) Constellation Error (EVM) Outband Spurious Emissions 1) 30MHz to 1GHz 2) 1GHz to 12.75GHz 3) 1.8GHz to 1.9GHz 4) 5.15GHz to 5.3GHz
- Rx Characteristics -
Minimum Input Level (PER<10%) Maximum Input Level (PER < 10%) Adjacent Channel Rejection (PER < 10%) min. min. 10
min.
-20
-2 Contents typ. 260 47 typ. 12
-33
-41
-53
-53
-31
typ.
-73
max. 300 60 max. 14
-20
-28
-45
-45
-27
-36
-30
-47
-47 max.
-64
unit mA mA unit dBm dBr dBr dBr dBr dB dBm dBm dBm dBm unit dBm dBm dB Preliminary & Confidential
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Murata Manufacturing Co., Ltd. 11. Land pattern Preliminary Specification Number: SP-KL1FX-K 16 / 29 Top View. Unit : mm Preliminary & Confidential
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Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 17 / 29 12. Reference Circuit Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd. 12345ABCDEFG12345ABCDEFGAntennaAntenna matchingGND(SR_PVSS) have to be isolated from typical GND*1) LQM18PN2R2MGH recommendedWL_GPIO_4WL_GPIO_2WL_GPIO_1SDIO_CLKVBAT*1)2.2uHWL_REG_ONWL_HOST_WAKEVIOSDIO_DATA_1SDIO_DATA_3SDIO_DATA_0SDIO_DATA_2SDIO_CMD2.2uF10~100k10~100k10~100k10~100k10~100kVIOGND11GND4646GND4545GND4444GND4343GND4242ANT41GND4040LPO_IN(32KHZ)37VIO36GND3535SR_VLX34GND(SR_PVSS)33GND1212GND1919SDIO_CLK20GND2121SDIO_CMD22WL_HOST_WAKE27WL_REG_ON28GND2929VBAT30VIN_LDO31GND(SR_PVSS)32WL_GPIO_415WL_GPIO_217WL_GPIO_118SDIO_DATA_223SDIO_DATA_024SDIO_DATA_325SDIO_DATA_126NC2NC3NC4NC5NC6NC7NC8NC9NC10NC11NC13NC16NC38NC39GND1414TYPE1FX32.768 kHz4.7uF4.7uF Preliminary Specification Number: SP-KL1FX-K 18 / 29 13. Tape and Reel Packing
(1) Dimensions of Tape (Plastic tape)
. 1 0 5 7 1
. 2.00.1 4 .00.1 1.5+0.1/-0.0 0.30.05
. 1 0 5 7
. 3 0 2 6 1
. 1 0 5 4 7
. 1.50.1 8.00.1 5.550.1 feeding direction 1.8 max.
(1.70.1) 1) The corner and ridge radiuses (R) of inside cavity are 0.3mm max. 2) Cumulative tolerance of 10 pitches of the sprocket hole is +/-0.2mm 3) Measuring of cavity positioning is based on cavity center in accordance with JIS/IES standard.
(2) Dimensions of Reel Preliminary & Confidential
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Murata Manufacturing Co., Ltd.
(unit : mm) 13220.5(100)(330)17.522.5 max.
(3) Taping Diagrams Preliminary Specification Number: SP-KL1FX-K 19 / 29
[1] Feeding Hole : As specified in (1)
[2] Hole for chip
: As specified in (1)
[3] Cover tape
: 62m in thickness
[4] Base tape
: As specified in (1)
[3]
[1]
[2]
[3]
[4]
Pin 1 Marking
(4) Leader and Tail tape Feeding Hole Feeding Direction Chip Feeding direction Tail tape
(No components) 40 to 200mm Components No components Leader tape
(Cover tape alone) 150mm min. 250mm min. Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 20 / 29
(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user.
(6) The cover tape and base tape are not adhered at no components area for 250mm min.
(7) Tear off strength against pulling of cover tape : 5N min.
(8) Packaging unit : 1000pcs./ reel
(9) material : Base tape : Plastic Real
: Plastic Cover tape, cavity tape and reel are made the anti-static processing.
(10) Peeling of force : 1.1N max. in the direction of peeling as shown below. 1.1N max. 165 to 180 Cover tape
(11) Packaging (Humidity proof Packing) Base tape Label Desiccant Humidity Indicator Label Anti-humidity Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 21 / 29 14. NOTICE 14.1. Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, NOx, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125+5/-0deg.C, 24hours, 1time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 14.2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge. 14.3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 14.4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 22 / 29 14.5. Soldering Conditions:
The recommendation conditions of soldering are as in the following figure. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions (Example) Within 3s 240to 250 deg.C 220 deg.C 180 deg.C 150 deg.C Cooling down Slowly Pre-heating Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. Within 120s Within 60s time(s) 14.6. Cleaning:
Since this Product is Moisture Sensitive, any cleaning is not recommended. If any cleaning process is done the customer is responsible for any issues or failures caused by the cleaning process. 14.7. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas (Cl2, NH3, SOx, NOx, etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 14.8. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 23 / 29 15. PRECONDITION TO USE OUR PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment. - Aerospace equipment - Undersea equipment.
- Power plant control equipment - Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment. - Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you cant agree the above contents, you should inquire our sales. Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 24 / 29 APPENDIX Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 25 / 29 1DX Installation Manual (FCC) FCC ID of this product is as follows. FCC ID: 2AFGD-MUW1FX For OEM integration only device cannot be sold to general public. Therefore we will ask OEM to include the following statements required by FCC on the product and in the Installation manual Notice. Contents 1. Antenna 2. Notice 1. Antenna Please perform the antenna design that followed the specifications of the antenna. The concrete contents of a check are the following three points. 1) It is the same type as the antenna type of antenna specifications. Confirm the same size as the Gerber file. 2) An antenna gain is lower than a gain given in antenna specifications. Measure the gain, and confirm the peak gain is less than the application value (1.4dBi) 3) The emission level is not getting worse. Measure the spurious, and confirm degradation of less than 3dB than spurious value of worst of report used for the application. However it is spurious defined below. Please send those reports to Murata. 2. Notice For OEM integration only device cannot be sold to general public. Therefore we will ask OEM to include the following statements required by FCC/IC on the product and in the Installation manual Notice. Please describe the following warning on the final product which contains this module. Contains Transmitter Module FCC ID:2AFGD-MUW1FX or Contains FCC ID:2AFGD-MUW1FX Please describe the following warning to the manual. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC CAUTION Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter. When the product is small, as for these words mentioned above, the posting to a manual is possible. Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-KL1FX-K 26 / 29 When installing it in a mobile equipment. Please describe the following warning to the manual. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines. This equipment should be installed and operated keeping the radiator at least 20cm or more away from persons body. RF Exposure requirements are met when installed in mobile equipment. This module cannot be installed in portable equipment without further testing and a change to FCC's grant of authorization. Contact Murata regarding portable applications. Note) Portable equipment : Equipment for which the spaces between human body and antenna are used within 20cm. Mobile equipment : Equipment used at position in which the spaces between human body and antenna exceeded 20cm. This device is intended only for OEM integrators under the following conditions:
1)The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2)The transmitter module may not be co-located with any other transmitter or antenna. 3)The use of an antenna with gain less than 1.4 dBi. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID:XXXXXXXXXX. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.