CSM84F12 IOT Module Data Sheet V1.0 June.2018 1 / 13 Table of Contents 1. Introduction ............................................................................................................................. 3 1.1 General Description ..........................................................................................................................3 1.2 Hardware Description ......................................................................................................................3 2. System Block Diagram .............................................................................................................. 4 3. CSM84F12 Pin-out .................................................................................................................... 5 3.1 Pin-out view ......................................................................................................................................5 3.2 CSM84F12 Pin Assignment and Descriptions .................................................................................5 4. Electrical Specifications .......................................................................................................... 6 4.1 Absolute Maximum Ratings .............................................................................................................6 4.2 Environmental Ratings .....................................................................................................................7 4.2.1 Storage Condition .................................................................................................................................7 4.3 Thermal Characteristics ...................................................................................................................7 4.4 PMU Under Voltage Lock-out (UVLO) Characteristics ....................................................................8 4.5 Electrostatic Discharge Specifications ............................................................................................8 4.6 Recommended Operating Conditions and DC Characteristics .......................................................8 5. Electrical Specifications ...................................................................................................... 10 5.1 Transmitter Characteristics for 2.4GHz Operation ...................................................................... 10 5.2 Receiver Characteristics for 2.4GHz Operation ............................................................................ 11 6. System Power Consumption ............................................................................................... 11 7. Soldering Recommendations ................................................................................................. 11 Appendix A: HW Reference Design ...................................................................................................... 13 2 / 13 1. Introduction 1.1 General Description The CSM84F12 module is an intelligent Internet of Everything platform enables customers to add Wi-Fi to a wide variety of products with minimal development effort and cost. 1.2 Hardware Description CST84F11+CSE7761 Size: 18 x 18 x 3.5mm0.1mm Operating voltage: 3.3 V 5%
16Mbit flash 192KB SRAM Support FlyOS FlyLink RF interface Internal PIFA antenna Operating temperature range:
Commercial: -20C ~ +85C Power consumption Transmit: 290 mA @18dBm Receive: TBD Standby mode (Sleep): TBD Deep sleep: TBD Package:
Golden Finger: 18 PADs Host interface: GPIO X 12,UART, SPI,UART, PWM WiFi mode support:
Station Soft AP Station + Soft AP Active Power Accuracy: 0.1% error of Reading over 8000:1 Dynamic Range. Voltage and Current Active Power Accuracy: 0.1% error of Reading over 1000:1 Dynamic Range. 3 / 13 Active value Accuracy: 0.1% error of Reading over 1000:1 Dynamic Range. On-chip 1.25 V Reference (5ppm/C typ, <20 ppm/C max). Leakage Function: Leakage current 30mA, < 30ms reaction time. System Calibrations Function: 100% Calib Range Phase Compensation Funciton: 2.56Compensate Range, 0.02 minimum Compensating value. 2. System Block Diagram 4 / 13 CST84F11ANT2.4GPower 3.3VCSE7761 3. CSM84F12 Pin-out 3.1 Pin-out view 3.2 CSM84F12 Pin Assignment and Descriptions Symbol Type Pin Description ACN ACNOUT I/O I/O 1 2 IIN1+ Differential analog input pins for the current channel IIN1- Differential analog input pins for the current channel 5 / 13 Symbol Type Pin Description VIN- Differential analog input pins for the voltage channel TXD RXD GPIO controller for relay1 GPIO controller for relay2 LED for RELAY 3.3V supply for whole module GPIO controller for relay3 Enable chip. 1: enable chip;
0: Shutdown Chip key LED to indicator statues of WIFI IIN2+ Differential analog input pins for the current channel IIN2- Differential analog input pins for the current channel Ground ACLOUT GPIO1_DEBUG_TX GPIO3_DEBUG_RX RELAY2 RELAY1 RELAY_LED VDD RELAY3 EN KEY WIFI_LED V2N V2P GND I/O I/O I/O I/O I/O I/O
-
I/O I/O I/O I/O I/O I/O
-
-
-
3 4 5 6 7 8 10 12 13 14 15 16 17 9 11 18 4. Electrical Specifications 4.1 Absolute Maximum Ratings The absolute maximum ratings in Table 4-1 indicate levels where permanent damage to the device can occur, even if these limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-
term reliability of the device. Table 4-1: Absolute Maximum Ratings 6 / 13 Symbol (domain) Description Max Rating Unit EFUSE_VDD VBAT ACLOUT , ACNOUT , V2P, V2N 4.2 Environmental Ratings VDD input for EFUSE burn-in. Pull low when read mode VDD input
-0.3 to 2.75
-0.3 to 3.6
-1 to 6 V V V The environmental ratings are shown in Table 4-2 Table 4-2 Environmental Ratings Characteristic Conditions/Comments Value Units Ambient Temperature (TA) Functional operation
-20 to +85 C 4.2.1 Storage Condition The calculated shelf life in sealed bag is 12 months if stored between 0C and 40C at less than 90%
relative humidity (RH). After the bag is opened, devices that are subjected to solder reflow or other high temperature processes must be handled in the following manner:
a) Mounted within 168-hours of factory conditions < 30 C /60%RH b) Storage humidity needs to maintained at <10% RH c) Baking is necessary if customer exposes the component to air over 168 hours, Baking condition:
125C / 8hrs 4.3 Thermal Characteristics Table 4-3: the thermal characteristics of the CSM84F12. Thermal characteristics without external heat sink in still air condition Symbol Description Typ. Unit TJ JA JC Jt Maximum Junction Temperature (Plastic Package) 125 C Thermal Resistance JA (C /W) for JEDEC 4L system PCB 57.7 C/W Thermal Resistance JC (C /W) for JEDEC 4L system PCB TBD C/W Thermal Characterization parameter Jt (C /W) for JEDEC 4L system PCB 7.9 C/W Maximum Lead Temperature (Soldering 10s) 260 C Notes: * Thermal characteristics without external heat sink in still air condition 7 / 13 4.4 PMU Under Voltage Lock-out (UVLO) Characteristics Table 4-4 PMU UVLO characteristics Symbol (domain) Description Min. Typ. Max. Unit Under Voltage Lock-Out (UVLO) Under voltage rising threshold of VBAT Under voltage falling threshold of VBAT VDD33: ball VBAT VDD33: ball VBAT 2.95 2.85 V V 4.5 Electrostatic Discharge Specifications This is an ESD sensitive product! Observe precaution and handle with care. Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Proper use of wrist and heel grounding straps to discharge static electricity is required when handling these devices. Table 4-5: ESD Specifications Pin Type Test Condition ESD Rating Unit Human Body Mode refers to MIL-STD-883G Method
(HBM) 3015.7 Pass 2.5 KV Machine Mode (MM) refers to JEDEC EIA/JESD22-A115 Pass 250 V 4.6 Recommended Operating Conditions and DC Characteristics Table 4-6: Recommended Operating Conditions and DC Characteristics Domain (Symbol) Description Min. Typ. Max. Unit VDD16_DCDC_OUT LDO/Buck converter 1.6V output 1.7 EFUSE_VDD DVDD12 VDD12_RTC_OUT VDD input for EFUSE burn-in. Pull low when read mode VDD output for internal digital circuit VDD output for internal RTC circuit 2.25 2.5 2.75 1.3 1.3 VBAT
(VIL) 3.3V supply Input Low voltage when 3.14
-0.3 3.3 3.46 0.8 V V V V V V 8 / 13 VBAT=3.3V Input High voltage when VBAT=3.3V Schmitt trigger low to high threshold voltage when VBAT=3.3V Schmitt trigger high to low threshold voltage when VBAT=3.3V Output low voltage when VBAT=3.3V Output high voltage when VBAT=3.3V Input weakly pull-down resistance when VBAT=3.3V. All GPIO pins have internal weakly pull- down option except that GPIO_5 has internal weakly pull-up option Low level output current @
VOL(max), 8mA setting Low level output current @
VOL(max), 12mA setting High level output current @
VOH(min), 8mA setting High level output current @
VOH(min), 12mA setting 2 3.6 V 1.6 1.74 1.89 V 1.27 1.4 1.56 V 2.4 0.4 V V 35 51 84 K 11.9 17.7 23.4 mA 15.8 23.5 31.1 mA 17.2 34.1 58.8 mA 23.9 47.2 81.5 mA 9 / 13
(VIH)
(VT+)
(VT-)
(VOL)
(VOH)
(RPD)
(IOL)
(IOH) 5. Electrical Specifications Figure 5-1: RF Front-End Reference Topology for RF Performance Note: All specifications are measured at the Antenna Port unless otherwise specified. 5.1 Transmitter Characteristics for 2.4GHz Operation Table 5-1 summarizes the transmitter characteristics for the CSM84F12. Table 5-1 transmitter characteristics Parameter Condition/Notes Min. Typ. Max. Unit Frequency Range 2412
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2484 MHz Rx Sensitivity CCK, 1 Mbps
(CCK) CCK, 11 Mbps Rx Sensitivity OFDM, 6 Mbps
(OFDM) OFDM, 54 Mbps Rx Sensitivity (HT20) HT20, MCS0 Greenfield 800nS GI Non-STBC HT20, MCS7
-94.0
-87.0
-91.0
-72.0
-91.0
-68.0 dBm dBm dBm dBm dBm dBm 10 / 13 RF_IOAntennaMatchingRF PortAntenna Port 5.2 Receiver Characteristics for 2.4GHz Operation Table 5-2 summarizes the receiver characteristics for the CSM84F12. Notice that transmitter and especially receiver characteristics must be test under test guider. Table 5-2 receiver characteristics Parameter Condition/Notes Min. Typ. Max. Unit TX Output Power CCK, 1-11 Mbps OFDM, 54 Mbps HT20, MCS7 17.5 14.0 14.0 dBm dBm dBm 6. System Power Consumption Note: All results are measured at the condition that VBAT are 3.3V. Table 6-1: Power Consumption WLAN Operational Modes Typ. Unit Rx, CCK, 1 Mbps(Continuous) Rx, OFDM, 54 Mbps(Continuous) Rx, HT20, MCS7(Continuous) Tx, CCK, 1 Mbps, 19dBm(Continuous) Tx, OFDM, 54 Mbps, 16dBm(Continuous) Tx, HT20, MCS7, 15dBm(Continuous) Normal work(Avg) Tx&Rx (Avg for DCDC mode, normal usage) Tx&Rx (Avg for LDO mode, normal usage) 7. Soldering Recommendations 91 101 103 292 237 239 30 80 100 mA mA mA mA mA mA mA mA mA The CSM84F12 module can be SMT on the board following the temperature curve graph:
11 / 13 Figure 7-1: CSM84F12 temperature curve graph Table 7-1: Solder Profile Section Profile Section Profile Feature Pb-free Package 1 2 3 Preheat
- Temperature min (Tsmin)
- Temperature max.(Tsmax)
- Time (min. to max.) Tsmax ro TL
- Ramp-up rate Time maintained above:
- Temperature (TL)
- Time Average ramp-up rate (TL to Tp) 4 5 Peak Temperature (Tp) Time within 5 of actual peak temperature
(tp) Ramp-down rate 150C 200C 60 ~ 180 seconds 3C /second max. 217C 60 ~ 150 seconds 3C /second max. 2505C 20 ~ 40 seconds 6C /second max. Time 25C to peak temperature 8 minutes max. 12 / 13 Appendix A: HW Reference Design 13 / 13