BoT-nLE521 6 0
/
3 0
/
8 1 0 2 0 1 r e V
. 1 / 17 BoT-nLE521 List of Contents 1. General ............................................................................................................................................. 3 1.1 Overview ...................................................................................................................................................................3 1.2 Block Diagram ........................................................................................................................................................3 1.3 Features .....................................................................................................................................................................4 1.4 Application ...............................................................................................................................................................4 1.5 Pin Configuration ..................................................................................................................................................5 1.6 PIN Description ......................................................................................................................................................6 1.7 Dimensions ..............................................................................................................................................................7 1.8 Land Pattern ............................................................................................................................................................8 2. Characteristics ................................................................................................................................ 9 2.1 Electrical Characteristics .....................................................................................................................................9 2.2 RF Characteristics ............................................................................................................................................... 11 3.1 Regulator ............................................................................................................................................................... 12 3.2 32.768KHz Crystal Oscillator .......................................................................................................................... 13 4. Application Schematic ............................................................................................................... 15 5. Antenna ......................................................................................................................................... 16 5.1 Antenna Layout Guide ..................................................................................................................................... 16 6. Certification .................................................................................................................................. 17 6.1 FCC Statement ..................................................................................................................................................... 17 2 / 17 BoT-nLE521 1. General 1.1 Overview The BoT-nLE521 module is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth Smart (Bluetooth low energy) applications. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. BoT-nLE521 combines an excellent RF transceiver with an industry-standard enhanced Cortec-M4 CPU, in-system programmable flash memory, 24kB RAM, and many other powerful supporting features and peripherals. The BoT-nLE521 is suitable for systems where very low power Consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption. 1.2 Block Diagram BoT-nLE521 Block Diagram 3 / 17 FilterRadioMultiprotocol2.4GHzBalunProcessor64 MHz ARMCortex-M4 CPU192kB Flash with cache24kB RAMAHB Lite busAPB busTimers / CountersAnalog I/ODigital I/OSystem PeripheralsOscillatorsPowersupplyGPIO32 MHzCrystalInternal Antenna&Matching NetworkPIO SWDCLKSWDIODCCDEC4VDDRFINT_ANT BoT-nLE521 1.3 Features Built in Antenna Bluetooth Smart (Bluetooth Low Energy) Module. ARM Cortex-M4 32-bit processor with FPU, 64 MHz Memory: 192 kB Flash / 24 kB RAM RF Output Power: MAX +4 dBm (-20 ~ 4 dBm) RF Receive Sensitivity: -96 dBm Type 2 near field communication (NFC-A) tag with wakeup-on-field and touch to-pair capabilities Fully automatic LDO and DC/DC regulator system (Used LDO by Default) Temperature Sensor UART (CTS/RTS) with EasyDMA, SPI, and I2C data interfaces. 12-Bit 200 ksps ADC with - 8 configurable channels with programmable gain Size: 15 mm x 8 mm x 1.8 mm Operating Voltage: 1.7V to 3.6V Operating Temperature: -40 to +85 RoHS compliant 1.4 Application Computer peripherals and I/O devices Mouse Keyboard Multi-touch trackpad Interactive entertainment devices Remote control Gaming controller Beacons Personal Area Networks Health/fitness sensor and monitor devices Medical devices Key-fobs + wrist watches Remote control toys 4 / 17 1.5 Pin Configuration BoT-nLE521 TOP VIEW 5 / 17 112123456789101613171918203029282726252423222131323314151 GND GND GND GND P0.28/AIN4 P0.25 P0.30/AIN6 DCC DEC4 VDD_nRFSWDIOGNDGNDSWDCLKP0.20P0.21/RESETP0.18P0.15P0.16P0.14 GND P0.00/XL1 P0.01/XL2 P0.04/AIN2 P0.05/AIN3 P0.06 P0.09 P0.10 P0.12 GND ANT RFGND 1.6 PIN Description Pin No. Pin Name Pin Function Description BoT-nLE521 GND GND GND GND P0.25 P0.28 AIN4 P0.30 AIN6 DEC4 DCC VDD_nRF GND P0.00 XL1 P0.01 XL2 P0.04 AIN2 P0.05 AIN3 P0.06 RXD P0.09 TXD P0.10 CTS P0.12 RTS GND P0.14 P0.15 P0.16 P0.18 P0.20 P0.21 RESET SWDCLK SWDIO GND GND RF ANT GND GROUND GROUND GROUND GROUND DIGITAL I/O DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT POWER POWER POWER GROUND DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT DIGITAL I/O DIGITAL INPUT DIGITAL I/O DIGITAL OUTPUT DIGITAL I/O DIGITAL OUTPUT DIGITAL I/O DIGITAL INPUT GROUND DIGITAL I/O DIGITAL I/O DIGITAL I/O DIGITAL I/O DIGITAL I/O DIGITAL I/O nRESET DIGITAL INPUT DIGITAL I/O GROUND GROUND RF IN / OUT PORT INTERNAL Ground Pin. Ground Pin. Ground Pin. Ground Pin. General purpose I/O pin. General purpose I/O pin. SAADC/COMP input General purpose I/O pin. COMP input 1.3 V regulator supply decoupling Input from DC/DC converter. Output from 1.3 V LDO DC/DC regulator output Power supply pin. Ground Pin. General purpose I/O pin. Connection for 32.768 kHz crystal (LFXO) General purpose I/O pin. Connection for 32.768 kHz crystal (LFXO) General purpose I/O pin. SAADC/COMP input General purpose I/O pin. SAADC/COMP input General purpose I/O pin. UART RXD General purpose I/O pin. UART TXD General purpose I/O pin. UART CTS General purpose I/O pin. UART RTS Ground Pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. Configurable as system RESET pin. Serial Wire Debug clock input for debug and programming Serial Wire Debug I/O for debug and programming Ground Pin. Ground Pin. Bluetooth 50 transmitter output / receiver input Internal antenna. It should be connected to Pin 32 RF for ANTENNA IN / OUT normal operation. GROUND Ground Pin. 6 / 17 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 1.7 Dimensions BoT-nLE521 TOP VIEW 7 / 17 112128.0mm4.03456789100.81613171918203029282726252423222131320.80.3511.7mm333.450.63.03.00.80.60.50.814150.350.30.30.30.30.8250.50.43.3mm0.80.510.50.50.50.50.52.02.00.20.2015.0mm0.3 1.8 Land Pattern BoT-nLE521 Land Pattern (TOP VIEW) 8 / 17 2124.034567890.81613171918203029282726252423222131320.811.7mm3.450.43.03.00.80.40.50.814150.350.30.30.30.30.8250.500.43.3mm0.80.510.50.70.50.91.2332.02.00.20.28.0mm15.0mm0.30.35100.31.2110.36.24.00.3 2. Characteristics 2.1 Electrical Characteristics Absolute Maximum Ratings Symbol Parameter VDD GND VI/O, VDD3.6V VI/O, VDD >3.6V Storage temperature Radio ra MSL ESD HBM ESD CDM Endurance Retention RF Input Level Moisture Sensitivity Level Human Body Model Charged Device Model Flash Memory Endurance 10000 Flash Memory Retention 10 years BoT-nLE521 Max.
+3.9 0 VDD + 0.3
+3.9
+125 10 4 1000 Units V V V V C dBm kV V write/erase cycles At 40 C Min.
-0.3
-0.3
-0.3
-40 2 Recommended Operating Conditions Symbol Parameter VDD VDD tR_VDD TA LDO Regulator Operation (Default Mode) DC/DC Regulator Oprtation Supply rise time (0V to 1.7V) Operation temperature DC Characteristics Min. 1.7 2.1 Typ. 3.0 3.0
-40 25 Max. 3.6 3.6 60 85 Units V V ms C Symbol Parameter (condition) Min. Typ. Max. Units Input high voltage Input low voltage Output high voltage, standard drive, 0.5 mA, VDD 1.7 VDD-0.4 Output high voltage, high drive, 5 mA, VDD 2.7 V Output high voltage, high drive, 3 mA, VDD 1.7 V Output low voltage, standard drive, 0.5 mA, VDD 1.7 Output low voltage, high drive, 5 mA, VDD 2.7 V VDD-0.4 VDD-0.4 VSS VSS 0.7 X VDD VDD VSS 0.3 X VDD VDD VDD VDD VSS +0.4 VSS +0.4 V V V V V V V 9 / 17 VIH VIL VOH,SD VOH,HDH VOH,HDL VOL,SD VOL,HDH BoT-nLE521 VOL,HDL Output low voltage, high drive, 3 mA, VDD 1.7 V VSS VSS +0.4 11 11 RPU RPD Pull-up resistance Pull-down resistance ITX,+4dBm,DCDC TX only run current (DCDC, 3V) PRF=+4 dBm ITX,+4dBm TX only run current PRF=+4 dBm IRX,1M,DCDC RX only run current (DCDC, 3V) 1Msps IRX,1M RX only run current 1Msps IRX,2M,DCDC RX only run current (DCDC, 3V) 2Msps IRX,2M RX only run current 2Msps ION_RAMOFF_EVENT System ON, No RAM retention, Wake on any event ION_RAMON_EVENT System ON, Full 24 kB RAM retention, Wake on any event ION_RAMON_POF ION_RAMON_GPIOTE ION_RAMON_GPIOTEPORT ION_RAMON_RTC IOFF_RAMOFF_RESET IOFF_RAMON_RESET System ON, Full 24 kB RAM retention, Wake on any event, Power fail comparator enabled System ON, Full 24 kB RAM retention, Wake on GPIOTE input
(Event mode) System ON, Full 24 kB RAM retention, Wake on GPIOTE PORT event System ON, Full 24 kB RAM retention, Wake on RTC
(running from LFRC clock) System OFF, No RAM retention, Wake on reset System OFF, Full 24 kB RAM retention, Wake on reset 16 16 13 13 7.0 15.4 4.6 10.0 5.2 11.2 0.6 0.8 0.8 3.3 0.8 1.5 0.3 0.5 V k k mA mA mA mA mA mA A A A A A A A A 10 / 17 BoT-nLE521 2.2 RF Characteristics Symbol fOP Description Operating frequencies fPLL,PROG,RES PLL programming resolution fPLL,CH,SP PLL channel spacing fDELTA,BLE,1M Frequency deviation @ BLE 1Msps fDELTA,BLE,2M Frequency deviation @ BLE 2Msps PRF PRFC PRFCR PRF1,1 PRF2,1 PRF1,2 PRF2,2 Maximum output power RF power control range RF power accuracy 1st Adjacent Channel Transmit Power 1 MHz (1 Msps) 2nd Adjacent Channel Transmit Power 2 MHz (1 Msps) 1st Adjacent Channel Transmit Power 2 MHz (2 Msps) 2nd Adjacent Channel Transmit Power 4 MHz (2 Msps) PRX,MAX Maximum received signal strength at < 0.1% PER PSENS,IT,SP,1M,BLE Sensitivity, 1Msps BLE ideal transmitter, <=37 bytes BER=1E-3 PSENS,IT,SP,2M,BLE Sensitivity, 2Msps BLE ideal transmitter, <=37 bytes RSSIACC RSSI Accuracy Valid range -90 to -20 dBm RSSIRESOLUTION RSSI resolution RSSIPERIOD Sample period Min. 2402 Typ. Max. 2480 Units MHz 2 1 250 500 0 24
-25
-50
-25
-50 0
-96
-93 2 1 8 4 4 kHz MHz kHz kHz dBm dB dB dBc dBc dBc dBc dBm dBm dBm dB dB us 11 / 17 BoT-nLE521 3. Terminal Description 3.1 Regulator The following internal power regulator alternatives are supported:
Internal LDO regulator Internal DC/DC regulator The LDO is the default regulator. Using the DC/DC regulator will reduce current consumption compared to when using the LDO regulator, but the DC/DC regulator requires an external LC filter to be connected, as shown in Figure. LDO Regulator Setup DC/DC Regulator Setup 12 / 17 BoT-nLE521 3.2 32.768KHz Crystal Oscillator The BoT-nLE521 external 32.768KHz Crystal does not required for BLE mode If you choose to use an internal 32.768kHz oscillator, an average of 10uA of current is consumed compared to an external crystal. The ANT specification requires 50ppm accuracy for a 32.768kHz clock. The internal 32.768kHz oscillator may not meet specifications. BoT-nLE521 F/W does not yet support ANT Mode. Clock control The load capacitance (CL) is the total capacitance seen by the crystal across its terminals and is given by:
Circuit diagram of the 32.768 kHz crystal oscillator C1 and C2 are ceramic SMD capacitors connected between each crystal terminal and ground. Cpcb1 and Cpcb2 are stray capacitances on the PCB. 13 / 17 BoT-nLE521 32.768 kHz RC oscillator (LFRC) Symbol fNOM_LFRC Nominal frequency Description fTOL_LFRC Frequency tolerance fTOL_CAL_LFRC Frequency tolerance for LFRC after calibration Min. Typ. Max. 32.768 2 500 Units kHz
%
ppm 32.768 kHz crystal oscillator (LFXO) Symbol fNOM_LFXO Crystal frequency Description Min. Typ. Max. 32.768 fTOL_LFXO_BLE Frequency tolerance requirement for BLE stack fTOL_LFXO_ANT Frequency tolerance requirement for ANT stack CL_LFXO C0_LFXO RS_LFXO PD_LFXO Cpin Load capacitance Shunt capacitance Equivalent series resistance Drive level Input capacitance on XL1 and XL2 pads 250 50 4 12.5 2 100 1 Units kHz ppm ppm pF pF kohm uW pF 14 / 17 4. Application Schematic BoT-nLE512 15 / 17 BoT-nLE512 5. Antenna 5.1 Antenna Layout Guide 16 / 17 2123456789161317191820302928272625242322213132141513310115.05.0In order to use the built-in antenna on the module, please connect PAD31 and PAD32 as short as possible. 3.10PCB OUTLINE0.30Clearance Area8.0mm BoT-nLE512 6. Certification 6.1 FCC Statement FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: 2APB6-BoT-nLE521 Or Contains FCC ID: 2APB6-BoT-nLE521 When the module is installed inside another device, the user manual of the host must contain below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product Any company of the host device which install this modular with limit modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C : 15.247 and 15.209 requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirement then the host can be sold legally. 17 / 17