Communication Products BU Document No. Product Code Product No. WM-G-MR-09-Ref2 Rev. 1.4 Product Specification of WM-G-MR-09-Ref2 Wireless LAN Module SOURCE ORGANIZATION: USI WP/RD/WM/HW1 HW Prepared by Ven Date: 2010/04/16 Checked by Erico Yang Date: 2010/04/16 Approved by Concurrence (MD):
Date:
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Concurrence (PM):
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Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 2 1 REVISION HISTORY Version Revised Date No. 1.0 2009-09-28 Camus Chen First released Revised by Description Notes 1.1 2009-11-4 Ven Chen 10.1.3 orderable P/N 1.2 2010-01-07 Ven Chen 1.3 2010-04-16 Ven Chen Add 3.1 block diagram(page 4) Change 8 Mechanical Specification(page 19) Change 10.1.2 Laser mark(page 22) Change 8 Mechanical Specification(page 19) Change 10.1.2 Laser mark(page 22) 1.4 2011-12-09 Robert CHANG Model Name Correction Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 3 INDEX 1 REVISION HISTORY ................................................................................................................................... 2 2 PURPOSE ..................................................................................................................................................... 4 3 SCOPE .......................................................................................................................................................... 4 3.1 BLOCK DIAGRAM ......................................................................................................................................... 4 4 GENERAL FEATURES .............................................................................................................................. 5 5 ELECTRICAL SPECIFICATION................................................................................................................ 6 5.2.1 5.2.2 5.1 SUPPLY VOLTAGE ....................................................................................................................................... 6 5.2 RECOMMENDED OPERATION CONDITIONS ................................................................................................. 6 Temperature, humidity ................................................................................................................. 6 DC Electrical .................................................................................................................................. 6 5.3 POWER CONSUMPTION (SDIO MODE) ...................................................................................................... 7 5.4 WIRELESS SPECIFICATIONS ....................................................................................................................... 7 5.5 RADIO SPECIFICATION ................................................................................................................................. 8 6 INTERFACE .................................................................................................................................................. 9 6.1 PIN DEFINITION ........................................................................................................................................... 9 6.1.1 RECOMMENDED FOOTPRINT ............................................................................................................ 12 6.2 SPEIFICATIONS AND TIMING DIAGRAM ........................................................................................................13 External sleep clock specification ............................................................................................ 13 6.2.1 6.2.2 SDIO protocol timing .................................................................................................................. 13 6.2.3 G-SPI protocol timing ................................................................................................................. 15 Networking Coexistence ............................................................................................................ 16 6.2.4 Reset and configuration timing ................................................................................................. 16 6.2.5 LED Interface .............................................................................................................................. 18 6.2.6 6.2.7 Antenna Interface ....................................................................................................................... 18 7 REGULATORY ........................................................................................................................................... 18 8 MECHANICAL SPECIFICATION ............................................................................................................ 19 9 RECOMMENDED REFLOW PROFILE .................................................................................................. 20 10 PACKAGE AND STORAGE CONDITION ............................................................................................. 21 10.1.1 Package Dimension ................................................................................................................... 21 10.1.2 Laser Mark ................................................................................................................................... 22 10.1.3 Part Order Numbering................................................................................................................ 22 10.1.4 ESD Level .................................................................................................................................... 22 Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 4 PURPOSE 2 The purpose of this document is to define the product specification for 802.11b/g WiFi module WM-G-MR-09-Ref2. 3 SCOPE High speed for wireless LAN connection: IEEE802.11b/g up to 54Mbps data rate by incorporating Direct Sequence Spread Spectrum (DSSS) and OFDM data modulation. Provide seamless roaming within the IEEE 802.11b/g WLAN infrastructure. IEEE 802.11b/g compatible: allow inter-operation among multiple vendors. Auto fallback: 54M, 48M, 36M, 24M, 18M, 12M, 9M, 6M (802.11g); 11M, 5.5M, 2M, 1M (802.11b) data rate with auto fallback. WPA (Wi-Fi Protected Access) Support 802.11i Security standard through implementation of AES / CCMP and WEP with TKIP security mechanism. Support 802.11e Quality of Service (QoS) 3-wire, hardware signaling BT WiFi co-existence supported Compliant with RoHS Interoperability Complying with WECA WiFi. 3.1 BLOCK DIAGRAM The figure is WM-G-MR-09-Ref2 simple block diagram which provide WIFI B/G function. This module consists of Marvell 8686 chip and use simple antenna design concept. To avoid CDMA, GSM, PCS and WCDMA interfering signal, the blocking filter implemented in this module. Otherwise there is embedded 38.4MHz crystal in this module for WiFi chip. Fig. WM-G-MR-09-Ref2 Block Diagram Universal Scientific Industrial Corp. Doc No. Date. Rev 2011/12/09 Page 1.4 5 Description Product Specification WM-G-MR-09-Ref2 4 GENERAL FEATURES Item Description Notes Standard Complies with the latest IEEE802.11b/g wireless LAN Physical Layer Specification
(IEEE 802.11g dated 12/6/2003) Chip Set Marvell 88W8686 Module Interface Type SDIO (1bit and 4 bit) , SDIO_SPI , G-SPI Module Connection 36pin LGA Co-existence Supports 3-wire BT coexistence scheme for an external BT solution 802.11b/g Data Rate 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps, auto rate 802.11b: 11, 5.5, 2, 1Mbps, auto rate OFDM (54, 48, 36, 24, 18, 12, 9, 6Mbps) Modulation CCK (11Mbps, 5.5Mbps) DQPSK (2Mbps) DBPSK (1Mbps) Operating Frequency 2.4GHz ISM band Operating Channels IEEE Channels 111 depending on Regulatory Domain settings Others Compliance with FCC Class B Part 15.247, R&TTE, TELEC major RF regulatory requirements Universal Scientific Industrial Corp. Doc No. Date. Rev 2011/12/09 Page 1.4 6 Description Product Specification WM-G-MR-09-Ref2 5 ELECTRICAL SPECIFICATION Symbol VDD_33 VDD_SHI VDD_18 VDD18A 5.1 SUPPLY VOLTAGE Parameter TR SW, ANT SW, PA_PE SDIO, G-SPI, GPIO, RESETn, PDn, SLEEP_CLK, EEPROM BT_STATE, WL_ACTIVE, BT_PRIORITY Analog Power Supply Voltage Ripple
+/- 2%, 0~100kHz exceeding operating voltage)
(Max. values not Min 3.0 1.62 2.97 Typ 3.3 1.8 3.3 Max Unit 3.6 1.98 3.63 V V V 1.71 1.8 1.89 V 5.2 RECOMMENDED OPERATION CONDITIONS 5.2.1 TEMPERATURE, HUMIDITY Symbol Parameter Ta Ts Humidity Relative Humidity Ambient Operation Temperature Storage Temperature Min
-10
-40 Typ
-
Max 65 85 95 Unit 0C 0C
%
5.2.2 DC ELECTRICAL Symbol VDD_33 VDD_SHI VDD_18 VDD18A Parameter Power supply voltage with respect to GND Power supply voltage with respect to GND Power supply voltage with respect to GND Min 3.0 1.62 2.97 1.71 Typ Max Units 3.3 1.8 3.3 1.8 3.6 1.98 3.63 1.89 V V V Universal Scientific Industrial Corp. Doc No. Date. Rev 2011/12/09 Page 1.4 7 Description Product Specification WM-G-MR-09-Ref2 POWER CONSUMPTION (SDIO MODE) 5.3 The power consumption is typical value measured at 25oC temperature Voltage : VDD3.3 Operating Voltage Current 3.0~3.6 Volt Condition
(3.3V, 25 degree C)
(3.3V, 25 degree C)
(Full temperature and Typical Maximum Maximum Transmit(54Mbps, 12 dBm) Transmit(11Mbps, 14 dBm) Receive(54Mbps, -70 dBm) Receive(11Mbps, -70 dBm) Deep Sleep
(Use Labtool command 26 1) 270mA 270mA 180mA 180mA 0.5mA 300mA 300mA 210mA 210mA 1.0mA voltage range) 400mA 400mA 250mA 250mA 1.5mA 5.4 WIRELESS SPECIFICATIONS The WM-G-MR-09-Ref2 module complies with the following features and standards:
Features WLAN Standards Antenna Port Coexistence Frequency Band Description IEEE 802 Part 11b/g (802.11b/g) One antenna port support 802.11b/g Hardware signaling 2.4GHz ISM Band Universal Scientific Industrial Corp. Doc No. Date. Rev 2011/12/09 Page 1.4 8 Description Product Specification WM-G-MR-09-Ref2 5.5 RADIO SPECIFICATION Over full range of values specified in the Recommended Operation Condition unless specified otherwise. Features Frequency Band Number of selectable Sub channels Modulation Supported rates Maximum receive level Carrier Frequency Accuracy Output Power Description 2.4 GHz ISM Band 11 channels OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK, DQPSK, CCK , 16QAM, 64QAM 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 36, 48, 54 Mbps
- 10dBm (with PER < 8%)
+/- 25ppm
(crystal: 38.4MHz +/-5ppm in 250C) Typical (3.3V, 25 Maximum (3.3V, 25 Maximum (Full temperature and Data Rate 1, 2, 5.5, 11Mbps 6, 9 and >12Mbps degree C) degree C) 12 dBm 12 dBm 12 dBm +1.0 /-2.0 12 dBm +1.0 /-2.0 voltage range) 12 dBm +1.0 /-2.0 12 dBm +1.0 /-2.0 802.11g EVM Requirement Item Data Rate (Mbps) Relative Constellation Error (dB) EVM (%RMS) 1 2 3 4 5 6 7 8 6 (BPSK) 9 (BPSK) 12 (QPSK) 18 (QPSK) 24 (16-QAM) 36 (16-QAM) 48 (64-QAM) 54 (64-QAM) 802.11b EVM
-5
-8
-10
-13
-16
-19
-22
-25 56.2 39.8 31.6 22.4 15.8 11.2 7.9 5.6 Item Data Rate (Mbps) EVM (%RMS) 1 2 3 4 1 (BPSK) 2 (QPSK) 5.5 (QPSK) 11 (QPSK) Sensitivity Receiver Characteristics
( 3.3V, 25 degree C ) 35%
35%
35%
35%
Typical
(3.3V, 25 degree C) Maximum
(3.3V, 25 degree C) Maximum (Full temperature and voltage range) PER <8%, Rx Sensitivity @ 11 Mbps PER <8%, Rx Sensitivity @ 1 Mbps PER <10%, Rx Sensitivity @ 6 Mbps PER <10%, Rx Sensitivity @ 54 Mbps
-85
-91
-86
-70
-83
-89
-84
-68
-81
-87
-82
-66 Unit dBm dBm dBm dBm Universal Scientific Industrial Corp. Doc No. Date. Rev 2011/12/09 Page 1.4 9 Description Product Specification WM-G-MR-09-Ref2 6 INTERFACE 6.1 PIN DEFINITION No Pin Name Type Description GND GND Ground RF PORT O Antenna Port (50ohm) GND NC GND Ground O NC SD_D1 I/O SCLK ECSn I O SDIO 4-bit Mode: Data Line Bit [1]
G-SPI Mode: G-SPI Data Output NC This is for Boot setting of ROM. Boot from SPI EEPROM: Pull down by 100kohm Boot from host Interface: NC GND GND Ground VDD_SHI I GPIO_6 GPIO_5 SD_D3 GPIO_2 SD_CLK I/O I/O I/O I/O I/O Host I/F Voltage: 3.3V Connect to 3.3V power supply Host I/F Voltage: 1.8V Connect to 1.8V power supply Not need to prepare external 1.8V power supply by connecting #9 and #17 (1.8V terminal) General I/O Port , leave open if no use. General I/O Port , leave open if no use. SDIO 4-bit Mode: Data Line Bit [3]
General I/O Port , leave open if no use. SDIO 4-bit Mode: Clock Input G-SPI Mode: G-SPI Clock Input GPIO_4 I/O General I/O Port , leave open if no use. GPIO_1 I/O General I/O Port t , leave open if no use. Default function : LED indicate. VDD_18 POWER VDD_12 POWER 1.8V DC monitor terminal , need 1uF decoupling capacitor 1.2V DC monitor terminal , need 1uF decoupling capacitor GND GND Ground 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 SD_CMD I/O 21 SD_D0 I 22 SD_D2 I/O SDIO 4-bit Mode: Command / Response G-SPI Mode: G-SPI Data Input SDIO 4-bit Mode: Data Line Bit [0]
G-SPI Mode: G-SPI Chip Select Input (Active Low) SDIO 4-bit Mode: Data Line Bit [2]
G-SPI Mode: G-SPI Interrupt Output (Active Low) Universal Scientific Industrial Corp. Doc No. Date. Rev 2011/12/09 Page 1.4 10 Description Product Specification WM-G-MR-09-Ref2 23 IF_SEL_1 O 24 IF_SEL_2 O Select Interface Mode Pin SDIO Mode: No Connect G-SPI Mode: Pull Down by 100kohm Select Interface Mode Pin SDIO Mode: No Connect G-SPI Mode: Pull Down by 100kohm 25 26 27 28 VDD18A POWER 1.8V Analog DC monitor terminal , need 1uF decoupling capacitor GND GND Ground VDD_33 VDD_33 POWER Connect to 3.3V DC supply POWER Connect to 3.3V DC supply WLAN Active (Active Low) 2-Wire BCA Mode When high, WLAN is transmitting or receiving packets. 3-Wire BCA Mode 0 = Bluetooth device is allowed to transmit 1 = Bluetooth device is not allowed to transmit Internal 50kohm pull-down. This pin drives low when PDn is asserted. In WLAN Sleep mode, all I/O Pads are powered down. This Pad must stay at a low state even in power down mode. Please make it open when do not use it. Pull up by 100kohm, Full Power Down (Active Low) Reset (Active Low) , leave open if no use. 29 WL_ACTIVE O 30 31 PDn RESETn I I Universal Scientific Industrial Corp. Doc No. Date. Rev 2011/12/09 Page 1.4 11 Description Product Specification WM-G-MR-09-Ref2 32 33 34 GPIO_0 I/O General I/O Port , leave open if no use. SLEEP_CLK I Clock Input for External Sleep Clock , leave open if no use. PW_SEL O NC Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 13 6.2 SPEIFICATIONS AND TIMING DIAGRAM 6.2.1 EXTERNAL SLEEP CLOCK SPECIFICATION The WM-G-MR-09-Ref2 external sleep clock pin (SLEEP_CLK) is powered from VDD_SHI Voltage Supply. Protocol Timing Symbol Parameter CLK THIGH TLOW TRISE TFALL NOTE: Over full range of values specified in the Recommended Operating Conditions unless Clock Frequency Range Clock high time Clock low time Clock rise time Clock fall time 40 40
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Condition
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5 5
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Max 1000 Typ Min 100 10
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Units KHz otherwise specified. 6.2.2 SDIO PROTOCOL TIMING SDIO Protocol Timing Diagram ns ns ns ns Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 14 SDIO Protocol Timing Diagram High Speed Mode SDIO Timing Data Symbol Parameter Condition Min Typ Fpp TWL TWH TISU TIH Clock Frequency Clock Low Time Clock High Time Input Setup Time Input Hold Time Normal High Speed Normal High Speed Normal High Speed Normal High Speed Normal High Speed 0 0 10 7 10 7 5 6 5 2 0 2.5
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Units MHz MHz ns ns ns ns ns ns Max 25 50
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14
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Output Delay Time Output Hold Time TODLY TOH NOTE: Over full range of values specified in the Recommended Operating Condition unless Otherwise specified. Normal ns ns Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 15 6.2.3 G-SPI PROTOCOL TIMING G-SPI Host Interface Transaction Timing G-SPI Host Interface Inter-Transaction Timing SPI Interface Timing Data Symbol TSCLK TWH TWL TWR TWF Parameter Clock Period Clock High Clock Low Clock Rise Time Clock Fall Time SDI Hold Time SDI Setup Time SDO Hold Time SCSn Fall to Clock Clock to SCSn Rise SCSn Rise to SCSn Fall Typ Max Units Min 20 5 9
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2.5 2.5 5 5 0
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1 1
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TH TSU TV TCSS TCSH TCRF NOTE: Over full range of values specified in the Recommended Operating Condition unless Otherwise specified. 400 ns ns ns ns ns ns ns ns ns ns ns Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 16 6.2.4 RESET AND CONFIGURATION TIMING Notes RESETn is not needed for proper operation due to internal power-on reset logic. Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 17 External Timing Requirement (RESETn Pin) Symbol Parameter Condition Min Typ Max Units
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0
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ms TPU-RESET Valid power to RESETn de-asserted RESETn pulse width TRPW1 NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise 10^2 100
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ns specified. 1. For external reset, the device reset time is TRPW +300s 2. Minimum value guaranteed for a valid reset smaller values may trigger the reset circuit. Internal Reset Timing Symbol Parameter
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NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise Condition Min 100 Negative internal reset pulse width Typ 100 Max
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Units s specified. Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 18 6.2.5 LED INTERFACE Pin No. 16 Pin description GPIO_1 Function description WLAN status LED (Tx power or Rx ready LED NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Symbol Parameter LOH Switching current high Condition Tristate on pad (requires pull-up on board) Typ Units Tristate when driving high mA 10 mA
@0.4V Switching current low IOL 6.2.6 ANTENNA INTERFACE Antenna diversity is not supported on the Wireless Module. The output impedance of the antenna port is 50 Ohms. REGULATORY 7 The WM-G-MR-09-Ref2 module is tested on module level to comply with following standards (pre-test):
US/CAN: FCC CFR47 Part 15.247 Europe: ETS 300-328 V1.6.1 Test setup: laptop plus adaptor card with Marvell Lab tool in SDIO mode Final certification should be completed on system level. Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 20 RECOMMENDED REFLOW PROFILE 9 Universal Scientific Industrial Corp. Date. Description Product Specification WM-G-MR-09-Ref2 Doc No. Rev 2011/12/09 Page 1.4 21 10 PACKAGE AND STORAGE CONDITION 10.1.1 PACKAGE DIMENSION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Radiation Exposure Statement The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device, for example, USB dongle like transmitters is forbidden. This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
Contains Transmitter Module FCC ID: XM5-MDLWMGMR09 when the module is installed inside another device, the user manual of this device must contain below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as describe