2.4GHz PCB Antenna Application:
WLAN, 802.11b/g, Bluetooth, WLAN, etc _ 03
(F)
(A) C
(E) F
(C) Part number Information 245
(D) PCB Antenna 3.2x1.6mm(0.2mm) High K material 2.4 ~ 2.5GHz PIFA & Single Feeding Type=03 RANT 3216
(B)
(A)Product Type
(B) Size Code
(C) Material
(D) Frequency
(E) Feeding mode
(F) Antenna type Electrical Specification Working Frequency Range Bandwidth Peak Gain Impedance Return loss Polarization Azimuth Beamwidth Operation Temperature() Resistance to Soldering Heats Termination The specification is defined on EVB. Dimension and Terminal Configuration Linear 2400 ~2500 MHz 120 MHz
(Min.) 2.25 dBi (Typ.) 50 Ohm 10 dB ( Min) Omni-directional
-40 ~85 10sec. ( @ 280) Ni / Au (Leadless)
: 13530576606 RAIN International Technology Co., Ltd. TEL: 13530576606 709, Building F, Yuxing Science and Technology Industrial Park, Nanchang Third Industrial Zone, Nanchang Community, Xixiang Street, Bao'an District, Shenzhen Evaluation Board Reference PCB Dimension _ Antenna Layout Reference Unit :mm Electrical Characteristics Return Loss Return Loss & Radiation 1 Frequency(MHz) 2400 2450 2500 S11 (dB)
-10.50
-30.62
-11.47 Radiation 2400MHz 2450MHz 2500MHz _ Z Y X Efficiency Peak Gain Directivity 2400MHz 82.52%
1.15 dBi 1.89 dBi 2450MHz 85.26%
2.25 dBi 1.97 dBi 2500MHz 83.01%
1.19 dBi 1.91 dBi Taping Specifications Reel Specification Reel and Taping Specification _ TYPE 3216 SIZE A 7 5K/Reel 9.00.5 B 602 C D 13.50.5 1782 Tapping Specification Packaging Type A B W E F G H T D P Paper Type 3216 1.900.2 0 3.500.2 0 8.00.2 0 1.750.1 0 3.50.05 4.00.10 2.00.05 0.750.1 0 1.500.1 0 4.00.1 Reliability Table Test Item Electrical Characterization Thermal Shock Temperature Cycling High Temperature Exposure Low Temperature Storage Solderability
(SMD Bottom Side) Soldering Heat Resistance
(RSH) Vibration Mechanical Shock Procedure 1. Preconditioning:
50 10 / 1 hr , then keep for 24 1 hrs at room temp. 2. Initial measure: Spec: refer Initialspec. 3. Rapid change of temperature test:
-30 to +85; 100 cycles;
15 minutes at Lower category temperature;
15 minutes at Upper category temperature. 1. Initial measure: Spec: refer Initialspec. 2. 100 Cycles (-30 to +85), Soak Mode=1 (2 Cycle/hours). 3. Measurement at 24 2Hours after test condition. 1. Initial measure: Spec: refer Initialspec. 2. Unpowered; 500hours @ T=+85. 3. Measurement at 24 2 hours aftertest. 1. Initial measure: Spec: refer Initialspec. 2. Unpowered: 500hours @ T=-30. 3. Measurement at 24 2 hours aftertest. Dipping method:
a. Temperature: 235 5C b. Dipping time: 3 0.5s Preheating temperature: 150 10C. Preheating time: 1~2 min. Solder temperature: 260 5C. Dipping time: 5 0.5s _ Remark
(Reference) User Spec. MIL-STD-202 107 JESD22 JA104 MIL-STD-202 108 MIL-STD-202 108 IEC 60384-21/22 4.10 IEC 60384-21/22 4.10 Requirements Ceramic Type Fulfill the electrical specification No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. The solder should cover over 95% of the critical area of bottom side. No Visible Damage. 5g's for 20 min., 12 cycles each of 3 orientations Note: Use 8"X5" PCB .031" thick 7 secure points on, one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500gs Duration: 0.5ms Velocity change: 15.4 ft/s Waveform: Half-sine No Visible Damage. MIL-STD-202 Method 204 No Visible Damage. MIL-STD-202 Method 213 Humidity Bias 1. Humidity: 85% R.H., Temperature:85 2 C. 2. Time: 500 24 hours. 3. Measurement at 24 2hrs after test condition. No Visible Damage. Fulfill the electrical specification. MIL-STD-202 Method 106 Board Flex
(SMD) 1. Mounting method:
IR-Reflow. PCB Size (L:100 W:40 T:1.6mm) 2. Apply the load in direction of the arrow until bending reaches 2 mm. Adhesion Force of 1.8Kg for 60 seconds. No Visible Damage. _ AEC-Q200 005 AEC-Q200 006 No Visible Damage Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body terminals and body/terminal junction. Physical Dimension Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions. In accordance with specification. JESD22 JB100 Revision History Revision 1 2 Date 2019/03/01 2020/02/22 Content New Datasheet Add 2D radiation characteristic