all | frequencies |
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user manual | Users Manual | 1.24 MiB | March 12 2018 | |||
1 | Cover Letter(s) | March 12 2018 | ||||||
1 | Cover Letter(s) | March 12 2018 | ||||||
1 | RF Exposure Info | March 12 2018 | ||||||
1 | External Photos | March 12 2018 | ||||||
1 | Internal Photos | March 12 2018 | ||||||
1 | ID Label/Location Info | April 12 2018 / March 12 2018 | ||||||
1 | Attestation Statements | March 12 2018 | ||||||
1 | Test Report | March 12 2018 | ||||||
1 | Test Setup Photos | March 12 2018 |
1 | user manual | Users Manual | 1.24 MiB | March 12 2018 |
DATASHEET TableofContents 1.Introduction..................................................................................................................................................................................1 2.Features........................................................................................................................................................................................1 3.Applications...................................................................................................................................................................................2 4.BlockDiagram...............................................................................................................................................................................2 5.Specification..................................................................................................................................................................................3 5.1AbsoluteMaximumRating......................................................................................................................................................3 5.2OperatingCondition................................................................................................................................................................3 6.ElectricalSpecifications.................................................................................................................................................................3 6.1PowerandDCDCConfiguration.............................................................................................................................................3 ImportantnoteforREG0..........................................................................................................................................................3 6.1.1USBPOWERS....................................................................................................................................................................4 6.1.2Normal(LV)powermodeexample..................................................................................................................................4 6.1.3Highvoltage(HV)powermodeexample.........................................................................................................................5 6.2GeneralPurposeI/O...............................................................................................................................................................5 6.3ModuleReset..........................................................................................................................................................................6 6.4DebugandProgramming........................................................................................................................................................6 6.5Clocks......................................................................................................................................................................................6 7.Firmware.......................................................................................................................................................................................6 7.1Easy,fastandsafecodedevelopment....................................................................................................................................6 7.2OverTheAirDeviceFirmware................................................................................................................................................7 7.3DevelopmentTools.................................................................................................................................................................7 8.ProductDescriptions.....................................................................................................................................................................8 8.1BlockDiagramofnRF52840....................................................................................................................................................8 9.ProductDescriptionsandDrawings............................................................................................................................................10 9.1MechanicalDrawings............................................................................................................................................................10 9.2PinAssignments....................................................................................................................................................................12 9.3PinFunctionsTable...............................................................................................................................................................13 10.RFDesign...................................................................................................................................................................................14 10.1RFlayoutandGroundPlane...............................................................................................................................................14 10.2CaseDesign.........................................................................................................................................................................15 11.Certification...............................................................................................................................................................................15 11.1BluetoothQualification.......................................................................................................................................................15 11.2FCCstatement.....................................................................................................................................................................16 11.3FCCImportantNotes...........................................................................................................................................................17 11.3.1FCCRadiationExposureStatement.............................................................................................................................17 11.3.2OEMintegrationinstructions.......................................................................................................................................17 11.3.3Endproductlabeling:...................................................................................................................................................17 11.3.4Informationregardingtheendusermanual...............................................................................................................17 11.4CEREGULATORY..................................................................................................................................................................18 11.5Japan(MIC).........................................................................................................................................................................18 12.Solderingtemperaturetimeprofileforreflowsoldering........................................................................................................18 13.Design,Installation,andCautionnotes....................................................................................................................................19 13.1Designnotes........................................................................................................................................................................19 13.2AntennaandPCBNotes......................................................................................................................................................19 13.3InstallationNotes................................................................................................................................................................20 13.4StorageNotes......................................................................................................................................................................20 13.5 OtherCautions................................................................................................................................................................20 14.SafetyConditions......................................................................................................................................................................21 15.RevisionHistory........................................................................................................................................................................21 ListofTables Table1:AbsoluteMaximumRatings................................................................................................................................................3 Table2:OperatingConditions..........................................................................................................................................................3 Table3:PowerModePinSelectionandConnections......................................................................................................................4 Table4:GPIOElectricalCharacteristics.............................................................................................................................................6 Table5:32.768kHzCrystalRequirements.......................................................................................................................................6 Table6:PinFunctionTable.............................................................................................................................................................14 ListofFigures Figure1:SVN840CBlockDiagram...................................................................................................................................................2 Figure2:Normal(LV)PowerModeexample....................................................................................................................................4 Figure3:HighVoltage(HV)PowerModeexample..........................................................................................................................5 Figure4:nRF52480BlockDiagram...................................................................................................................................................8 Figure5:RecommendedPCBLandPads........................................................................................................................................10 Figure6:3DViewandDimensions.................................................................................................................................................11 Figure7:RFKEEPOUTZONE(NoGround/Signals/Components)...................................................................................................11 Figure8:PinAssignments...............................................................................................................................................................12 Figure9:RFGroundExamplebasedonDevBoardGroundPlane.................................................................................................15 Figure10:ReflowProfileforleadFreeSolder................................................................................................................................19 1. Introduction SVN840Cisapowerful,highlyflexible,ultralowpowermultiprotocol2.4GHztransceiversystemonmodule(SoM).It integratesBluetooth5(BluetoothLowEnergy)intoalowpowersystemusingtheNordicnRF52840SoC.WithanARM CortexM4FCPU,integratedchipantenna,2.4GHzradio,andincreasedintegrationwithUSBand5.5VcompatibleDC/DC supply,theSVN840Callowsforshorterdevelopmenttimeandlowercostaswellasreducedtimetomarket. 2. Features NordicnRF52840withARMCortexM4F,64MHz ARMTrustZoneCryptocell310coprocessor Bluetooth5,ANT,2.4GHztransceiver o 95dBmsensitivityin1MbpsBluetoothlowenergy
(BLE)mode o 103dBmsensitivityin125KbpsBLEmode(long range) o +8dBmTXpower(downto20dBmin4dBsteps) o OnaircompatiblewithnRF52,nRF51,nRF24Land nRF24APSeries o Supporteddatarates:
Bluetooth5:2Mbps,1Mbps,500kbps,125kbps CompleteRFsolutionwithintegratedchipantenna IntegratedDCDCconverter Memory:1MBflash/256KBRAM HWacceleratedsecurity o ARMTrustZoneCryptocell310Security o 128bitAES/ECB/CCM/AARcoprocessor(onthe flypacketencryption) Advancedonchipinterfaces o USB2.0fullspeed(12Mbps)controller o QSPI32MHzinterface o Highspeed32MHzSPI o Type2nearfieldcommunication(NFCA)tagwith wakeonfieldandTouchtoPairsupport o ProgrammablePeripheralInterconnect(PPI),20 Channels,CPUindependent 1 o Type2nearfieldcommunication(NFCA)tagwith wakeonfieldandTouchtoPairsupport o 48generalpurposeI/Opins o EasyDMAautomateddatatransferwithoutCPU processingonperipherals o 12bit,200kspsADC8configurablechannelswith programmablegain o 4x4channelpulsewidthmodulator(PWM)units withEasyDMA o I2S,digitalmicrophoneinterface(PDM) o 5X32bit,3x24bitrealtimecounters(RTC) o Upto4xSPImasters/3xSPIslaveswithEasyDMA o Upto2xI2Ccompatible2wiremasters/slaves o 2xUART(CTS/RTS)withEasyDMA o QuadratureDemodulator(QDEC) o Temperaturesensor Dimensions:16x10.8x1.9mm Flexiblepowermanagement o Supplyvoltagerange1.7Vto5.5V o OnchipDC/DCandLDOregulatorswithautomated lowcurrentmodes o Regulatedsupplyforexternalcomponentsfrom1.8V to3.3V o Automatedperipheralpowermanagement o Fastwakeupusing64MHzinternaloscillator o 0.4uAat3VinOFFmode,noRAMretention o 1.5uAat3VinONmode,noRAMretention,wakeon RTC 3. Applications SecureInternetofThings IndustrialIoTControllers AdvancedRemoteControls LowPowerSensorNetworks AccessControl 4. BlockDiagram EnvironmentalMonitoring ClimateControl SmartHomeDevices SmartCityNetworks SmartEnergyManagement ConnectedAppliances Health/Fitnessmonitoring MedicalDevices ConnectedWatch GamingControllers Figure1:SVN840CBlockDiagram 2 5. Specification 5.1AbsoluteMaximumRating Symbol Parameter VDDMax VDDHMax VBUSMax VIOMax VIOMax TStorage VoltageonVDDsupplyin VoltageonVDDHsupplyin VoltageonVBUSsupplyin VoltageonGPIOpin(VCC>3.6V) VoltageonGPIOpin(VCC<=3.6V) Storagetemperaturerange Table1:AbsoluteMaximumRatings Minimum Maximum Unit 0.3 0.3 0.3 0.3 0.3 40 3.9 5.8 5.8 3.9 VCC+0.3V 125 V V V V V C 5.2OperatingCondition Symbol VDDIn VDDDC/DC VDDHIn RiseTimeVDD RiseTimeVDDH VBUSIN TAmbient Parameter VDDoperatingsupplyvoltagein VDDDC/DCstartingvoltage VDDHoperatingsupplyvoltagein VDDsupplyrisetime(0Vto1.7V) VDDHsupplyrisetime(0Vto3.7V)1 VBUSoperatingsupplyvoltagein Operatingambienttemperaturerange Minimum 1.7 1.75 2.5 4.35 40 Typical 3.0 5.0 5.0 25 Maximum 3.6 5.5 5.5 60 1 85 Unit V V V V ms ms C Table2:OperatingConditions 6. ElectricalSpecifications 6.1PowerandDCDCConfiguration ImportantnoteforREG0oftheNordicnRF52480. Initialmassproductionsilicon(NordicRev1)forthenRF52840includessomeerratathataffecttheREG0regulator. TheREG0DCDCconvertermodecannotbeusedreliably.TheLD0modeofREG0canbeusedinhighvoltagemode butwhenapplyingpower,theinputvoltagemusthavearisetimeof1msorless.Duetotherisetimeconstraints andhighercurrentconsumptionofLD0modecomparedtoDCDC,highvoltagemodeshouldbeconsiderednon functionalformostapplicationandshouldnotbeusedonSVN840CmodulesseeNordicnRF52840errata197and 202formoredetails.Theseerrataareexpectedtobecorrectedinfutureproductionsiliconreleaseandsubsequent revisionsoftheSVN840module. TheSVN840hastwointernalregulatorstagesREG0andREG1thateachcontainsanLD0andDCDCregulator.The REG0,isfedbytheVDDHpinandcanacceptasourcevoltageof2.5Vto5.5VanditsoutputisconnectedtotheVDD pinandtheinputofthesecondregulatorstageREG1. ThesecondRegulator(REG1)suppliespowertothemodulecoreandcanacceptaninputsourcevoltageof1.7Vto 3.6V.DependingonhowtheVDDandVDDHpinareconnected,themodulewilloperateinoneoftwomodes:
3 Normal/lowvoltageorhighvoltage.Regardlessofpowermode,thevoltagepresentontheVDDpinisatheGPIO highlogiclevelvoltage.InbothLVandHVmode,theGPIOlogiclevelvoltageisdeterminedbytheVDDin.InHV mode,allexternaldevicesthatareconnectedtotheSVN840sGPIOmusteitherbepoweredbythemodule(from VDD)oruseleveltranslation. WhenthesourcevoltageisappliedtobothVDDandVDDHusingREG0toautomaticallyshutdownleavingonlythe REG1stageactive,atthisstagethemodulewillentertheLVmode.Similarly,whenthesourcevoltageisonly appliedtoVDDHcausingtheVDDpintobecomeanoutputsourcesuppliedbyREG0,thusthemodulewillenterHV mode. Mode Normal(LV) Highvoltage(HV) Pin 38 39 38 39 Name VDD VDDH VDD VDDH Connection 1.73.6Vsourcein SamesourceasVCC 1.8V3.3Vsupplyout 2.5V5.5Vsourcein Table3:PowerModePinSelectionandConnections 6.1.1USBPowerConfiguration TheUSBinterfaceontheSVN840Ccanbeusedwhenthemoduleisineithernormal(LV)orhighvoltage(HV)mode.TheSVN 840CUSBPHYispoweredbyadedicated,internalLD0regulatorthatisfedbytheVBUSpin(40).ThismeansVBUSpower cannotpowertherestofthemodule.IfyouwanttopowerfromUSB,youmustconnecttoVDDHaswellasVBUSorusean externallowdropoutregulatororDC/DCconvertertopowerVDD.FortheUSBPHYtooperate,VBUSmustbeexternally powered.ExamplesinFigure2andFigure3below. 6.1.2Normal(LV)powermodeexample Figure2:Normal(LV)PowerModeexample 4 6.1.3Highvoltage(HV)powermodeexample Figure3:HighVoltage(HV)PowerModeexample 6.2GeneralPurposeI/O ThegeneralpurposeI/Opinsaregroupedin2portsof48GPIOpinsintotal.ThefirstportallowsaccesstopinsP0.00toP0.31 andthesecondallowsaccesstopinsP1.00toP1.15. TheGPIOhasthefollowinguserconfigurablefeatures:
Input/outputdirection Outputdrivestrength Internalpullupandpulldownresistors Wakeupfromhighorlowleveltriggeronallpins Triggerinterruptonstatechangesonallpins AllpinscanbeusedbythePPItask/eventssystem;themaximumnumberofpinsthatcanbeinterfacedthroughthe PPIatthesametimeislimitedbythenumberofGPIOTEchannels Symbol VInHigh VInLow VOutHigh VOutLow RPullUp RPullDown Parameter Inputhighvoltage Inputlowvoltage Outputhighvoltage Outputlowvoltage Pullupresistance Pulldownresistance Minimum Type 0.7*Vcc Vss V0.4 Vss 11 11 13 13 Maximum Vcc 0.3*Vcc Vcc Vss+0.4 16 16 Unit V V V V K K 5 Table4:GPIOElectricalCharacteristics 6.3ModuleReset ForhardwareresetGPIOpinP0.18maybeusedbysettingtheUICRregisterPSELRESET[0]andPSELRESET[1]tothevalue 0x7FFFFFFD2.WhenP0.18isprogrammedaserror!,theinternalpullupisautomaticallyenabled.Nordicexampleapplications anddevelopmentkitprogramsuseP0.18asareset. 6.4DebugandProgramming TheSVN840Coffersaflexibleandpowermechanismfornonintrusivedebugging.ItsupportstwopinSerialWireDebug(SWD) interface.Thisallowsforrealtimedebuggingwithbreakpoints,singlestepping,andinstructiontracecaptureofcodeexecution flow. TheSVN840alsosupportsETMandITMtrace.TracedatafromtheETMandtheITMaresenttoanexternaldebuggerviaa4 bitwideparalleltraceportinterfaceunit(TPIU).InadditiontoparalleltracetheTPIUsupportsserialtraceviatheserialwire output(SWO)traceprotocol.Parallelandserialtracecannotbeusedatthesametime.ETMtraceisonlysupportedinparallel tracemode,whileITMtraceissupportedinbothparallelandserialtracmodes. 6.5Clocks TheSVN840Chastwoclocks,ahighfrequencyandlowfrequencyclock.Thehighfrequencyclockisprovidedbyanonmodule highaccuracy32MHzcrystal.ThelowfrequencyclockcanbeprovidedbyaninternalRCoscillatororsynthesizedfromthe highfrequencyclockorbyanexternal32.768kHzcrystal.Theexternallowfrequencycrystalprovidesthelowestpower consumptionandthegreatestaccuracy.IfusingtheinternalRCoscillatorforthelowfrequencyclockitmustbecalibrated,see NordicnRF52480datasheetfordetails.ItisrecommendedtouseanexternallowfrequencycrystalwhenusingBLE. Parameter Crystalfrequency Frequencytolerance,BLEapplication Loadcapacitance Shuntcapacitance Equivalentseriesresistance InputcapacitanceonXL1&XL2pads Table5:32.768kHzCrystalRequirements Typical 32.768 4 Maximum
+250 12.5 2 100 Unit kHz Ppm pF pF K pF Symbol FNOM_LFXO FTOL_LEFXO_BLE CCL_LFXO CCO_LFXO Rs_LFXO CPIN 7. Firmware 7.1Easy,fastandsafecodedevelopment NordicdevelopmentenvironmentforthenRF52840hasacleanseparationbetweenapplicationcodedevelopmentand embeddedprotocolstack.TheprotocolstacksbyNordicareknownasSoftDevicesandareprecompiled,prelinkedbinaryfiles. Becausethereisaseparationofprotocolandapplicationcodethereisaremovalofthechallengesindebuggingwhenusingan embeddedstack.TheSoftDevicesareavailablefordownloadfromtheNordicwebsite.TheSVN840CSupportstheS140(BLE Central&Peripheral)SoftDeviceandthefeaturesarelistedonNordicswebsite. 6 7.2OverTheAirDeviceFirmware TheOverTheAirDeviceFirmwareUpgrade(OTADFU)featureofnRF52840allowsforinthefieldupdatesofapplication softwareandsoftdevices. 7.3DevelopmentTools ForthenRF52seriesofdevicesNordicsemiconductorprovidesacompleterangeofhardwareandsoftwaredevelopmenttools. ForthefirmwaredevelopmentnRF52480DKboardisrecommended Nordicsoftwaredevelopmenttoolscanbedownloadedfromthefollowingwebpage:
http://infocenter.nordicsemi.com/index.jsp?topic=%2Fcom.nordic.infocenter.gs%2Fdita%2Fgs%2Fgs.html&cp=1 7 8. ProductDescriptions ThisisabriefdescriptiononthenRF52480SoCthatisonthemodule.ForthefulldescriptionoftheSoCvisitNordicswebsite:
https://www.nordicsemi.com/eng/Products/Bluetoothlowenergy 8.1BlockDiagramofnRF52840 TheblockdiagramofNordicnRF52840BluetoothLowenergy(BLE)SOCisshowninFigure4.Thesignalsthatsharephysical pinswithothersignalsareindicatebyaarrowswithwhiteheads. Figure4:nRF52480BlockDiagram 8 TheARMCortexM4processorwithfloatingpointunit(FPU)hasaninstructionsetthatmaximizedcodedensityand performanceoverotherARMCortexMSeriesMicrocontrollerUnits(MCU).A20channelbusprovidedbyProgrammable PeripheralInterconnects(PPI)systemallowsforadirectandautonomoussystemperipheralcommunicationwithoutCPU intervention.TheCPUhas2mainpowermodes,ONandOFF,butalltheinternalsystemblocksareperipheralshavetheirown powercontrolsystems.ThesesystemsalloweachblocktoswitchfromRUNtoIDLEstatebasedonwhetheritisrequiredor notbythecurrentorparticulartasks.BoththePPIsystemandtheindividualpowermanagementofsystemblocksallowsfor greaterpowersavingthanastandardMCU. TheradiosupportsBluetoohLowEnergy(BLE)andANT.Poweroutputisscalableupfrom20dBmto+8dBminstepsof4dBm. ForBLEthenoisesensitivityis96dBmandforANTitis92.5dBm.Thenoisesensitivityischangeddependingonthedatarate inarangeof103dBmto93dBm. 9 9. ProductDescriptionsandDrawings 9.1MechanicalDrawings 10 Figure6:3DViewandDimensions Figure7:RFKEEPOUTZONE(NoGround/Signals/Components) 11 9.2PinAssignments Figure8:PinAssignments 12 9.3PinFunctionsTable PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 17 18 19 20 21 23 24 25 26 27 28 29 30 31 32 34 35 36 37 38 39 40 41 42 43 44 45 Name P0.09 P0.10 P1.11 P1.10 P1.13 P1.12 P1.15 P1.14 P0.02 P0.03 P0.29 P0.28 P0.31 P0.30 P0.04 P0.26 P0.00 P0.27 P0.01 P0.05 P0.07 P0.06 P0.11 P0.08 P1.08 P1.09 P0.15 P0.12 P0.14 P0.13 P0.16 P0.17 P0.19 DCCH VDD VDDH VBUS D D+
P0.20 P0.21 P0.22 Type Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Power PowerInput/Output Power Power Input/Output Input/Output Input/Output Input/Output Input/Output 13 Description GPIO/NFC11 GPIO/NFC11 GPIO1 GPIO1 GPIO1 GPIO1 GPIO1 GPIO1 GPIO/AIN01 GPIO/AIN11 GPIO/AIN51 GPIO/AIN41 GPIO/AIN71 GPIO/AIN61 GPIO/AIN2 GPIO GPIO/XTAL1 GPIO GPIO/XTAL2 GPIO/AIN3 GPIO/TraceClock GPIO GPIO/TraceData[2]
GPIO GPIO GPIO/TraceData[3]
GPIO GPIO/TraceData[1]
GPIO GPIO GPIO GPIO GPIO DC/DCConverterOutput LowVoltageInput:1.7V3.6V HighVoltageOuput:1.8V3.3V LowVoltage:ConnecttoVDD HighVoltageInput:2.5Vto5.5V USBPower USBData USBData+
GPIO GPIO GPIO P0.23 P0.24 P0.25 P0.18 P1.00 SWDCLK SWDIO P1.01 P1.02 P1.03 P1.04 P1.05 P1.06 P1.07 GND Input/Output Input/Output Input/Output Input/Output Input/Output Input Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Power 46 47 48 49 50 51 52 53 54 55 56 57 58 59 16,22,33,60,61, 62,63,64,65 Note1:ThesepinsareincloseproximitytothenRF52480antennaandpowersupply.Device radioperformancecouldbeaffectedbyhighfrequencydigitalI/Oandlargecurrentsinandout ofthesepins.Nordicrecommendskeepingonlylowfrequency(lessthan10kHz)andlowdrive
(Max4mA,seeGPIOElectricalSpecificationsofNordicDataSheet)signalsonthesepins. GPIO GPIO GPIO GPIO/RESET GPIO/TraceData[0]/SWO SWDClock SWDIO GPIO1 GPIO1 GPIO1 GPIO1 GPIO1 GPIO1 GPIO1 Ground Table6:PinFunctionTable 10. RFDesign 10.1RFlayoutandGroundPlane Theintegratedchipantennarequiresagroundplanetoradiateeffectively.Theareaunderthechipandalongthetopsideof themodulemustbeclearofanycopperorothermetals.Havingtheseneartheantennawilldetuneandsignificantlyeffect performance.ThemoduleshouldbeplacedonthelongestedgefacingoutpreferablyinthemiddleofthePCBoratleast3.6 cmfromtheedge.Havingasmallgroundplacewillreducetheeffectiveradiatedpowersoitisrecommendedtohavea continuousuninterruptedgroundplaneofatleast40mmby40mmormoreunderthemodule.Anexampleisshownbelowin Figure9. 14 Figure9:RFGroundExamplebasedonDevBoardGroundPlane 10.2CaseDesign Whendesigningandplacingthemoduleinacaseorenclosuremetalshouldbekeptclearfromtheantennaareabothabove andbelow.AllmetalneartheantennaimpactRFperformanceandneedtobeconsideredinyourdesigns.Themoduleistuned forfreeairandissomewhatresistancetothedetuningcausedbyplastics.ItisnotimmuneandassuchRFperformanceshould beevaluatedinyourdesignswhenplacingplasticonoroverthenmodule. 11. Certification 11.1BluetoothQualification TheSVN840CBluetoothQualificationscanbefoundunderRFPHYComponent(Tested)DeclarationIDXXXXXXXandQDID XXXXX. 15 11.2FCCstatement Thisdevicecomplieswithpart15oftheFCCRules.Operationissubjecttothefollowingtwoconditions:(1)Thisdevice maynotcauseharmfulinterference,and(2)thisdevicemustacceptanyinterferencereceived,includinginterference thatmaycauseundesiredoperation. Changesormodificationsnotexpresslyapprovedbythepartyresponsibleforcompliancecouldvoidtheuser's authoritytooperatetheequipment. FCCRadiationExposureStatement ThismodularcomplieswithFCCRFradiationexposurelimitssetforthforanuncontrolledenvironment.This transmittermustnotbecolocatedoroperatinginconjunctionwithanyotherantennaortransmitter. IftheFCCidentificationnumberisnotvisiblewhenthemoduleisinstalledinsideanotherdevice,thentheoutsideof thedeviceintowhichthemoduleisinstalledmustalsodisplayalabelreferringtotheenclosedmodule.Thisexterior labelcanusewordingsuchasthefollowing:ContainsTransmitterModuleFCCID:2AMOF840COrContainsFCCID:
2AMOF840C Whenthemoduleisinstalledinsideanotherdevice,theusermanualofthehostmustcontainbelowwarning statements;
1. ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothefollowingtwoconditions:
(1) Thisdevicemaynotcauseharmfulinterference.
(2) Thisdevicemustacceptanyinterferencereceived,includinginterferencethatmaycauseundesiredoperation. 2. Changesormodificationsnotexpresslyapprovedbythepartyresponsibleforcompliancecouldvoidtheuser's authoritytooperatetheequipment. Thedevicesmustbeinstalledandusedinstrictaccordancewiththemanufacturer'sinstructionsasdescribedinthe userdocumentationthatcomeswiththeproduct 16 11.3FCCImportantNotes 11.3.1FCCRadiationExposureStatement ThisequipmentcomplieswithFCCRFRadiationexposurelimitssetforthforanuncontrolledenvironment. Thistransmittermustnotbecolocatedoroperatinginconjunctionwithanyotherantennaortransmitter. Thisequipmentcomplieswithpart15oftheFCCRules.Operationissubjecttothetwoconditions:
Thisdevicemaynotcauseharmfulinterference,and Thisdevicemustacceptanyinferencereceived,includinginterferencethatmaycauseundesiredoperation. Thedevicemustbeinstalledandusedinstrictaccordancewiththemanufacturersinstructionsasdescribedinthisdocument. 11.3.2OEMintegrationinstructions ThisdeviceisintendedonlyforOEMintegratorsunderthefollowingconditions:
Theantennaandtransmittermustnotbecolocatedwithanyothertransmitterorantenna. Themoduleshallbeonlyusedwiththeintegralantenna(s)thathasbeenoriginallytestedandcertifiedwiththis module. Aslongasthetwo(2)conditionsabovearemet,furthertransmittertestingwillnotberequired.However,theOEMintegrator isstillresponsiblefortestingtheirendproductforanyadditionalcompliancerequirementswiththismoduleinstalled(for example,digitaldeviceemission,pcperipheralsrequirementsetc.) Intheeventthattheseconditionscannotbemet(forexamplecertainlaptopconfigurationorcolocationwithanother transmitter),thentheFCCauthorizationforthismoduleincombinationwiththehostequipmentisnolongerconsideredvalid andtheFCCIDofthemodulecannotbeusedthefinalproduct.Intheseandcircumstance,theOEMintegratorwillbe responsibleforreevaluatingtheendproduct(includingthetransmitter)andobtainingaseparateFCCauthorization. 11.3.3Endproductlabeling:
Thefollowingquotesmustbelabeledinthevisibleareaofthefinalproduct SVN840C:ContainsFCCID:2AMOF840C Anysimilarwordingsthatexpressthesamemeaningmaybeused. TheFCCStatementbelowshouldalsobeincludedonthelabel.Whennotpossible,theFCCStatementshouldbeincluded intheusermanualofthehostdevice. Thisdevicecomplieswithpart15oftheFCCrules. Operationissubjecttothefollowingtwoconditions.(1)Thisdevicemaynotcauseharmfulinterference.(2)Thisdevice mustacceptanyinterferencereceived,includinginterferencethatmaycauseundesiredoperation. 11.3.4Informationregardingtheendusermanual TheOEMintegratorhastobeawarenottoprovideinformationtotheenduserregardinghowtoinstallorremovethisRF moduleintheusersmanualoftheendproductwhichintegratesthismodule.Theendusermanualshallincludeallrequired regulatoryinformation/warningasshowninthismanual. 17 11.4CEREGULATORY TheSVN840Cmoduleisbeingtestedandisexpectedtobecompliantagainstthefollowingstandards.OEMintegratorsshould consultwithqualifiedtesthousetoverifyallregulatoryrequirementshavebemetoftheircompletedevice. EURadioEquipmentDirective2014/53/EU:
EN609501:2006+A11:2009+A1:2010+A12:2011 ETSIEN300328V2.1.1 ETSIEN3014891V2.1.1 ETSIEN30148917V3.1.1 11.5Japan(MIC) TheSVN840Cmodulehasreceivedtypecertificationandislabeledwithitsowntechnicalconformitymarkandcertification numberasrequiredtoconformtothetechnicalstandardsregulatedbytheMinistryofInternalAffairsandCommunications
(MIC)ofJapanpursuanttotheRadioActofJapan.Integrationofthismoduleintoafinalendproductdoesnotrequire additionalradiocertificationprovidedinstallationinstructionsarefollowedandnomodificationsofthemoduleareallowed. Additionaltestingmayberequired:
Ifthehostproductissubjecttoelectricalappliancesafety(forexample,poweredfromanACmains),thehostproduct mayrequireProductSafetyElectricalApplianceandMaterial(PSE)testing.Theintegratorshouldcontacttheir conformancelaboratorytodetermineifthistestingisrequired. ThereisavoluntaryElectromagneticCompatibility(EMC)testforthehostproductadministeredbyVCCI:
http://www.vcci.jp/vcci_e/index.html ThelabelontheendproductwhichcontainsaBMD300SeriesmodulemustfollowtheMICmarkingrequirements.Labeling requirementsforJapanavailableattheMinistryofInternalAffairsandCommunications(MIC)website:
http://www.tele.soumu.go.jp/e/index.htm. TheSVN840Cmoduleislabeledwithitsassignedtechnicalconformitymarkandcertificationnumber.Theendproductin whichthismoduleisbeingusedmusthaveanexternallabelreferringtothetypecertifiedmoduleinside:
Containstransmittermodulewithcertificatenumber:
12. Solderingtemperaturetimeprofileforreflowsoldering Maximumnumberofcyclesforreflowis2.Nooppositesidereflowisallowedduetomoduleweight. 18 Figure10:ReflowProfileforleadFreeSolder 13. Design,Installation,andCautionnotes Failingtofollowtheguidelinessetbythisdocumentmayresultinproductsfailureoffunctionsanddamagetheproducts. 13.1Designnotes 1. Followtheconditionsdefinedinthisdatasheetinordertoassureproperperformanceoftheproduct. 2. SupplyvoltagemustbefreeofACripplevoltage. 3. Supplyvoltageshouldnotbehigherthanthespecifiedinputsorreversed.Also,itshouldnotcontainnoiseorspikes. 4. Thisproductshouldnotbemechanicallystressedwheninstalled. 5. Keepthisproductawayfromheatduringstorageandinstallation. 6. Avoidassemblyanduseofequipmentwheretheproductstemperaturemayexceedthemaximumallowance. 7. Keepthisproductawayfromotherhighfrequencycircuits. 13.2AntennaandPCBNotes Donotplacetheproductwiththeantennainsideofametalcase.Doingthiswillsignificantlyaffectperformanceofthe antenna. ForPCBlayoutavoidrunningsignallinesbelowtheproductwheneverpossible,especiallyhighfrequencysignals,unlessthe groundplanebetweentheproductandthesignalslines.Donotputagroundplaneundertheantenna,seesection9Product DescriptionsandDrawingsandsection10RFDesign. 19 13.3InstallationNotes 1. Refertotherecommendlayoutanddesignguidelinesinthisdocumentwhendesigningaboard. 2. Donotpresspartsontothemetalshieldingcoverorsecureobjecttothemetalshielding,thiswillpossiblydamagethe product. Ifhandsoldering,refertotheprecautionsdetailedinthisdocumentandkeeptheconditionsdefinedinthissection. 3. Anycontactwithwires,casing,orobjectshouldbeavoided,especiallymetalobjects. 4. 5. Reflowispossiblewiththisproductupto2times.Thereflowtemperatureprofileshouldbefollowed. 6. Whenreflowingdonotmechanicallystressorvibratetheproduct. 7. Carefullypositiontheproductsuchthatitsheatorothercomponentsthataresusceptibletoheatwillnotbeburnedor affected. 8. Carefullypositiontheproductsuchthatitstemperatureswillnotincreaseduetotheeffectsofheatgeneratedby nearbycomponentsorobjects. 9. Donotwashthisproduct. 10. Takeprecautionsagainststaticelectricity.Ifpulesorotherelectricalloadsareappliedtotheproduct,pleasecheckthe operationsbeforeassemblingintoafinalproduct. 11. Donotusedroppedproducts. 12. Donottouchorcontaminatethepins. 13. Followtherecommendedminimumandmaximumpowerratingsforpowersupplyappliedtothisproduct. 14. DonotapplypressuretotheproductwhensolderedontothePCBitmaypeeloff. 15. Thisproductisintendedforgeneralpurposeandstandarduseingeneralelectronicequipment,suchashome appliances,officeequipment,informationandcommunicationequipment. 13.4StorageNotes 1. Theproductshouldnotbemechanicallystressedduringstorage. 2. Donotstoretheproductinthefollowingconditionsastheperformanceoftheproductcouldbeadverselyaffected:
I. II. III. IV. Storageinsaltyorhumidairorincorrosivegasenvironments Storageindirectsunlight Storageinanenvironmentoutsidethespecifiedrangesdefinedinthisdocument Storageoftheproductsformorethanoneyearafterdateofdeliverystorageperiod. 3. Keepawayfromwaterandpoisonousorcorrosivegas. 4. Donotstressorshocktheproductwhentransported. 13.5 OtherCautions 1. Thisspecificationsheetiscopyrighted.Reproductionofthisdatasheetsispermissibleonlyifreproductioniswithout alterationandisaccompaniedbyallassociatedwarranties,conditions,limitations,andnotices. 2. Donotusetheproductforotherpurposesthanwhatisdefinedinthisdocument. 3. Providefailsafefunctionsonyourproducttopreventanadditionsdamagethatmaybecausedbyabnormalfunction orthefailureofaproduct. Ifanabnormaloroutofrangevoltageisappliedduetoaproblemintheproduct,componentsorcircuits,replace theseproductswithnewproducts.Eveniftheyappearsatisfactorytheymaynothavethesameperformanceasbefore thevoltagewasapplied. Ifyouhaveanyquestions,contactEMC 4. 5. 20 14. SafetyConditions Thesespecificationsareintendedtopreservethequalityassuranceofproductsandindividualcomponents.Beforeuse,check andevaluatetheoperationwhenmountedonyourproducts.Abidebythesespecifications,withoutdeviationwhenusingthe products.Theseproductsmayshortcircuit.Ifelectricalshocks,smoke,fire,and/oraccidentsinvolvinghumanlifeare anticipatedwhenashortcircuitoccurs,thenprovidetheflowingfailsafefunctions,asaminimum. Installprotectioncircuitandaprotectiondeviceinordertoensuresafetyofthewholesystem. Installaredundantcircuitoranothersystemtopreventadualfaultcausinganunsafestatustoensuresafetyofthe wholesystem. 15. RevisionHistory RevisionNumber ChangesandNotes 0.9 InitialRelease Date yyyy/mm/dd 21
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2018-12-03 | 2402 ~ 2480 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2018-12-03
|
||||
1 | Applicant's complete, legal business name |
Eagle Matrix Co.,Ltd.
|
||||
1 | FCC Registration Number (FRN) |
0026547547
|
||||
1 | Physical Address |
NGA Kioicho Building 6F
|
||||
1 |
Tokyo, N/A 102-0094
|
|||||
1 |
Japan
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
m******@compliancetesting.com
|
||||
1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
2AMOF
|
||||
1 | Equipment Product Code |
840C
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
S**** S**** Z****
|
||||
1 | Title |
Engineering Director
|
||||
1 | Telephone Number |
+81-3********
|
||||
1 | Fax Number |
+81-3********
|
||||
1 |
s******@emcjpn.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DTS - Digital Transmission System | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | CALM. Module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Power output listed is conducted. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
DongGuan ShuoXin Electronic Technology Co., Ltd.
|
||||
1 | Name |
T**** W********
|
||||
1 | Telephone Number |
+86 7********
|
||||
1 |
m******@attps.cn
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0010100 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC