FCC ID: 2ACCREQM1001 BLE Module

Qualcomm QCC711 Module Product Portfolio January 2024 Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 2 (25) Table of Contents 1 Product Overview ................................................................................................... 4 2 Hardware Specification .......................................................................................... 7 2.1 Block Diagram ................................................................................................................. 7 2.2 Pinout Description .......................................................................................................... 7 Pin Map ................................................................................................................................. 7 Pin Definition ......................................................................................................................... 8 I/O Pin Mux Table ................................................................................................................ 10 Programmable Series Engine ............................................................................................. 11 2.2.1 2.2.2 2.2.3 2.2.4 2.3 Computing Subsystem ................................................................................................. 11 Microcontroller ..................................................................................................................... 11 2.3.1 2.4 Memory .......................................................................................................................... 12 2.5 Peripheral Interfaces .................................................................................................... 12 3 Electrical Characteristics ..................................................................................... 13 3.1 Absolute Maximum Ratings ......................................................................................... 13 3.2 Recommended Operating Conditions ........................................................................ 13 4 Radio Performance ............................................................................................... 14 5 Power Consumption ............................................................................................. 15 5.1 Active Power ................................................................................................................. 15 5.2 Sleep Power .................................................................................................................. 15 6 Mechanical Specification ..................................................................................... 16 6.1 Pin Antenna ................................................................................................................... 16 Dimension ........................................................................................................................... 16 Recommended PCB Landing Pattern ................................................................................. 16 6.1.1 6.1.2 6.2 PCB Antenna ................................................................................................................. 17 Dimension ........................................................................................................................... 17 Recommended PCB Landing Pattern ................................................................................. 17 6.2.1 6.2.2 6.3 U.FL Antenna................................................................................................................. 18 Dimension ........................................................................................................................... 18 Recommended PCB Landing Pattern ................................................................................. 18 6.3.1 6.3.2 7 Manufacturing Recommendation ........................................................................ 19 7.1 Power Layout Guideline ............................................................................................... 19 7.2 RF Layout Guideline ..................................................................................................... 19 8 Packaging .............................................................................................................. 21 9 Regulatory Compliance ........................................................................................ 22 3 (25) 10 Order Information .............................................................................................. 23

..C.la.s.s.i.fi.c.a.tio.n.. .S.t.a.tu.s......... D..a.te.......................................................................................................................................................................................................................................................................................20 Doc7um.e3ntation TitleSoldering Recommendations...................... ..D.o.c.u.m.e.n.t.a.ti.o.n.N.o... ..R.e.v.i.s.io.n.. Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Jan 5, 2024 Release Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 4 (25) 1 Product Overview Powered by Qualcomm QCC711, EQM100-1 modules are purposely-designed LGA form factor BLE modules that combine multi-core processing capabilities, high-security as well as BLE long-range to cater to the demands of diverse IoT applications. Their compact size and on-chip memory of SRAM and RRAM

(NVM) contribute to reduced costs and enhanced performance, making them an attractive choice for space-constrained IoT edge devices. Unlike many other BLE modules on the market, EQM100-1 modules have integrated three processors 64MHz Arm Cortex-M processor for application and 32MHz Arm Conrtex-M0 processor for BLE with shared on-chip memory of 128KB SRAM and 512KB RRAM. Additional Root-of-Trust 32MHz RISC-V processor with its own secure SRAM and ROM is dedicated to security subsystem to ensure the highest level of security for IoT applications with critical security needs. They have built-in resistive RAM (RRAM), the industry latest Non-volatile Memory (NVM) technology, eliminating need for externally attached NOR flash as well as resulting in more streamlined and cost-effective system. They also feature 3-wire and 4-

wire SPI display control, making them capable of driving external LCD/TFT screens commonly found on a dedicated MCU. Furthermore, EQM100-1 modules can be powered directly by a battery, making it suitable for portable and battery-operated devices. EQM100-1 can operate in hostless mode, capable of running both the Bluetooth stack and applications internally without requiring an external MCU. Moreover, they support hostless mode (HCI) through a UART interface, functioning as a Bluetooth transceiver to offload the Bluetooth stack. This enables the external MCU to focus on handling applications rather than managing the Bluetooth stack. EQM100-1 modules have undergone rigorous regulatory compliance testing and are certified with FCC, CE, IC, UKCA, RCM, MIC, KC, SRRC and environmentally compliant with RoHS and WEEE directives. They also Bluetooth SIG 5.4 certified, ensuring seamless interoperability with other Bluetooth devices. EQM100-1 modules include the following configurations:

Module Form Factor Antenna EQM100-1P 12.277 x 14.817 x 2.2 mm, 1.27 mm pitch, 40-pin, LGA Pin Antenna EQM100-1B 12.277 x 18.817 x 2.2 mm, 1.27 mm pitch, 40-pin, LGA PCB Antenna EQM100-1U 12.277 x 18.817 x 2.2 mm, 1.27 mm pitch, 40-pin, LGA U.FL Antenna EQM100-1 module portfolio is graphically illustrated below:

Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 5 (25) 12.277 mm 0.8 mm 2.2 mm Figure 1: EQM100-1P Module View 12.277 mm 0.8 mm 2.2 mm Figure 2: EQM100-1B Module View 12.277 mm 0.8 mm 2.2 mm Figure 3: EQM100-1U Module View Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 The module specific development kit is also provided to facilitate application software development as shown below:

6 (25) Front View Side View Back View Figure 4: EQM100-1 Module Development Kit Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 7 (25) 2 Hardware Specification This section provides detailed hardware design and specification of EQM100-1 modules. EQM100-1 hardware design has been optimized for small footprint and reduced RBOM cost. 2.1 Block Diagram EQM100-1 integrates 2/4/8MB 2x3 8-USON NOR flash and 32.768kHz RTC crystal as stuffing options. The design also supports PCB antenna (EQM100-1B) or simply provides antenna pin (EQM100-1U) to allow customized antenna implementation on motherboard. The block diagram is shown below. PCB antenna matching capacitor Low Pass LC Filter

(SLFL15-2R700G-20TF) PIO6 PIO7 PIO8 PIO9 PIO10 PIO11 PIO12 PIO13 PIO14 PIO15 PIO16 PIO17 PIO18 PIO19 PIO20 PIO21 PIO22 PIO23 PIO24 PIO25 Multi-Function Pin (MFP) PIO0/QSPI_CLK CLK PIO3/QSPI_CS B PIO1/QSPI_MO SI PIO2/QSPI_MI O PIO4/QSPI_IO2 PIO5/QSPI_IO3 CS#

DI/D0 DO/D1 WP#/D2 HOLD/D3 PIO5 2/4/8MB NOR Flash 8-USON

(3x2mm) PIO4 PIO2 PIO1 PIO3 PIO0 DS_1 (PIO0~8) VDD_PAD S_2 (PIO9~25) VDD_PA VDD_BAT XTAL32M_OUT 32MHz XTAL32M_IN XTAL32K_OUT (Optional) XTAL32K_IN 32kHz Figure 5: EQM100-1 Module Block Diagram 2.2 Pinout Description 2.2.1 Pin Map In order to maintain pin compatible to allow easy drop replacement, All EQM100-1 shares the same pin map as illustrated below:

Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 8 (25) EQM100-1P EQM100-1B EQM100-1U Figure 6: EQM100-1 Module Pin Map 2.2.2 Pin Definition Pin Pin Name Type Power Domain Description 44,45 VDD_VBAT PWR 66 9 VDD_PADS_1 PWR VDD_PADS_2 PWR

Power input (1.71~3.6V) Host I/O voltage input ( VDD_VBAT) Host I/O voltage input ( VDD_VBAT) 11,47,68 GND 35 50 54 52 64 56 60 56 62 70 72 42 40 38 5 7 13 ANT MFP PIO0 PIO1 PIO2 PIO3 PIO4 PIO5 PIO6 PIO7 PIO8 PIO9 PIO10 PIO11 PIO12 PIO13 PIO14 GND AI/AO GND Ground

Pin antenna DI VDD_VBATT SW configurable as a reset input DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 9 (25) 17 15 19 21 23 25 36 32 30 34 27 PIO15 PIO16 PIO17 PIO18 PIO19 PIO20 PIO21 PIO22 PIO23 PIO24 PIO25 DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO, analog in configurable DI/DO VDD_PADS_2 Generic PIO, analog in configurable DI/DO VDD_PADS_2 Generic PIO, analog in configurable DI/DO VDD_PADS_2 Generic PIO, analog in configurable Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 10 (25) 2.2.3 I/O Pin Mux Table GPIO QSPI I2C FTC LED Analog CoEx Debug SE0 SE1 SE2 SE3 PIO0 QSPI_CLK SDA ftc0_out BLUE PIO1 QSPI_MOSI SCL ftc0_out RED PIO2 QSPI_MISO SDA ftc0_out GREEN PIO3 QSPI_CSB SCL ftc1_out WHITE PIO4 QSPI_IO2 SDA ftc1_out WHITE PIO5 QSPI_IO3 SCL ftc1_out BLUE SDA ftc_in RED SCL ftc_in PIO11 QSPI_CLK SDA PIO12 QSPI_MOSI SCL PIO13 QSPI_MISO SDA ftc2_out PIO14 QSPI_CSB SCL ftc2_out GREEN PIO15 QSPI_IO2 SDA ftc2_out BLUE/WHITE PIO16 QSPI_IO3 SCL ftc_in RED/WHITE PIO6 PIO7 PIO8 PIO9 PIO10 PIO17 PIO18 PIO19 PIO20 PIO21 PIO22 PIO23 PIO24 PIO25 SDA ftc3_out GREEN/WHITE SCL ftc3_out WHITE SDA ftc3_out WHITE WHITE ftc_in WHITE SCL SDA SCL SDA SCL BLUE RED GREEN WHITE ADC ADC ADC ADC Port 0 Port 0 Port 0 Port 0 Port 1 Port 1 Port 1 Port 1 Port 2 Port 2 Port 2 Port 2 Port 3 Port 3 Port 3 Port 3 Port 0 Port 4 Port 4 Port 4 Port 1 Port 0 Port 0 Port 0 Port 2 Port 1 Port 1 Port 1 Port 3 Port 2 Port 2 Port 2 Port 4 Port 3 Port 3 Port 3 TCK/SWD_CLK TMS/SWD_DIO Port 4 Port 4 Port 4 Port 0 Port 0 Port 0 TDI/test_hf Port 0 Port 1 Port 1 Port 1 TDO/SWO Port 1 Port 2 Port 2 Port 2 Test_lf Port 2 Port 3 Port 3 Port 3 Port 3 Port 4 Port 4 Port 4 trace_ctrl Port 4 Port 3 Port 3 trace_clk Port 0 Port 0 Port 1 Port 1 trace_data_0 Port 1 Port 1 Port 2 Port 2 trace_data_1 Port 2 Port 2 Port 3 Port 3 trace_data_2 Port 3 Port 3 Port 4 Port 4 slv_pta_coex_active trace_data_3 Port 4 Port 4 slv_pta_coex_confx slv_pta_coex_status mstr_pta_coex_active mstr_pta_coex_status mstr_pta_coex_confx Port 0 Port 0 Port 0 Port 0 Port 1 Port 1 Port 1 Port 1 Port 2 Port 2 Port 2 Port 2 Port 3 Port 3 Port 3 Port 3 Port 4 Port 4 Port 4 Port 4 Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 11 (25) 2.2.4 Programmable Series Engine Serial Engines (SE) and supported interfaces SE SE0 SE1 SE2 SE3 3-wire or 4-wire SPI Display Controller True 4-wire SPI Controller/Peripheral I2C Controller 8-bit UART 9-bit UART Yes Yes

Yes Yes

Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

Serial engines default port mappings SE 3-wire Display 4-wire Display Port 0 Port 1 Port 2 Port 3 Port 4 CS1 SDIN CLK CS CS1 SDIN CLS CS D/C 2.3 Computing Subsystem 2.3.1 Microcontroller I2C SDA SCL

UART SE0 true 4-wire SPI CTS RTS TXD RXD

MISO MOSI CLS CS CS1 EQM100-1 modules have Qualcomm QCC711 at his core which integrates three microcontrollers Arm Cortex-M3 processor, Arm Cortex-M0 processor, and RISC-V:

Arm Cortex-M3 processor Running at 32MHz, dedicated to higher layer protocol and user applications. It conducts inter-processor communication with Arm Cortec-M0 processor for BLE services and with RISC-V processor for security services. Arm Cortex-M0 processor Running at 32MHz, dedicated to BLE radio and lower protocol layer (MAC) processing. RISC-V processor Running at 32MHz, dedicated to security services. it can function as a Root-of-Trust

(RoT) processor to execute highly secure bootup code under Trusted Execution Environment (TEE) that validate the user application image before handing over the control to Arm Cortex-M3 processor. RISC-V has its own 32KB SRAM, 192KB ROM and protected OTP area and will be NOT visible to user applications, making it highly reliable and secure. The computing subsystem software architecture consists of three parts as illustrated below. Computing Subsystem (APSS) will be open-sourced on GitHub and CodeLinaro while Bluetooth Subsystem (BTSS) and Security Subsystem will be offered in binary format inside software SDK package. GitHub Download Link: https://github.com/quic/qccsdk-qcc711/

CodeLinaro Download Link: TBD Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 12 (25) Arm Cortex-M3 CPU Application Subsystem (APSS) End User Applications

- Contains OEM application

- Drivers for peripherals and interface to other subsystems

- All drivers provided as source Security QAPI

(Key Derive/RNG/Digest/Encrypt/FOTA/Fuse) Mailbox Memory IPC Peripheral Interfaces Source Code RISC-V Root-of-Trust CPU Security Subsystem Profile Inter Processor Communication (IPC) Crypto Engine One-Time Programable

(OTP) OS Secure Boot Fuse Controller System Resource

(DIS/GAP/GATT/L2CAP/HCI) BLE QAPI Shared Memory IPC Arm Cortex-M0 CPU Bluetooth Subsystem (BTSS) Inter Processor Communication (IPC) BLE Host Stack BLE Controller

- Performs image authentication on boot

- Provides crypto services to APSS and BTSS

- Implements Bluetooth and ESL protocols

- Contains both Bluetooth Host and Controller Bainary Bainary Figure 7: Computing Subsystem Software Architecture 2.4 Memory There are 512KB on-chip RRAM, 128KB on-chip SRAM and 2KB OTP/MTP shared among three processors. Built-in Non-volatile memory RRAM hosting execution code will eliminate needs of an external NOR flash to reduce system cost. 416KB out of 512KB RRAM can be used for user applications. 128KB SRAM can be used for runtime data. 64KB out of 128KB SRAM can be used for user applications. Additional NOR flash can be added through QSPI interface for additional data storage. 2.5 Peripheral Interfaces EQM100-1 modules supports the following peripheral interfaces through 26x configurable PIO:

2x SPI master or slave, support 3-wire/4-wire SPI for display and true 4-wire SPI with DMA 2x I2C master and 1x I2C slave, supporting 100kbps, 400kbps, and 1000kbps data rate 2x 9-bit UART with hardware flow control, supporting maximum 2M baud rate 1x 8-bit UART with hardware flow control, supporting maximum 2M baud rate 4x 10-bit ADC 4x FTC (PWM) 4x LED driver 3-wire PTA coexistence master or slave SWD with 4-bit trace Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 13 (25) 3 Electrical Characteristics 3.1 Absolute Maximum Ratings The absolute maximum ratings provided in this section reflect the stress levels that, if exceeded, may cause permanent damage to the device. No functionality is guaranteed outside the operating specifications. Functionality and reliability are only guaranteed within the operating. Pin Parameter Min VDD_VBATT Power input voltage VDD_PADS_2 VDD_PADS_1 I/O port 1 voltage VDD_PADS_2 I/O port 2 voltage VSS - 0.3 VSS - 0.3 Max 3.63 3.63 3.63 Digital I/O PIO25:PIO9 PIO8:PIO0 MFP All ground / VSS pads Storage temperature VSS - 0.3 VDD_PADS_2 + 0.3 VSS - 0.3 VDD_PADS_1 + 0.3 VSS - 0.3 VDD_VBAT + 0.3 0

-40 0 85 Unit V V V V V V V C 3.2 Recommended Operating Conditions Pin Parameter VDD_VBATT Power input voltage VDD_PADS_1 I/O port 1 voltage VDD_PADS_2 I/O port 2 voltage Digital I/O PIO25:PIO9 PIO8:PIO0 MFP All ground / VSS pads Storage temperature Min 1.71 0 0 VSS VSS VSS 0

-40 Max Unit 3.6 3.6 3.6 VDD_PADS_2 VDD_PADS_1 VDD_VBAT 0 85 V V V V V V V C Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 14 (25) 4 Radio Performance Channel Bandwidth Modulation Parameter Data Rate Typical 2MHz GFSK Note: VDD_VBAT = 3.3V Tx Power Rx Sensitivity

@ 30.8% PER

(Boost Mode) Rx Sensitivity

@ 30.8% PER

(Normal Mode) 2Mbps 1Mbps 500kbps 125kbps 2Mbps 1Mbps 500kbps 125kbps 2Mbps 1Mbps 500kbps 125kbps

+6

+6

+6

+6

-93

-96

-98

-103 TBD TBD TBD TBD Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 15 (25) 5 Power Consumption EMQ100-1 modules can operate in four power states as shown below to maximize power saving:

System Request Battery Attach System Request Off Active Battery Loss Wakeup Event Sleep

(External 23kHz Clock) Battery Loss Hibernate

(Internal Slow Oscillator) Battery Loss Wakeup Event Figure 8: Power State Diagram 5.1 Active Power Channel Bandwidth Modulation Parameter dBm Average Current Unit 2MHz GFSK Tx Power 0

+4

+6 Rx Power Normal TBD Rx Power Boost

-95 10.5 14.6 16.6 TBD 5.3 mA mA mA mA mA Unit A MCU State Average Current Sleep 4 Hibernate 16 A 5.2 Sleep Power Test Mode Software controlled 16KB SRAM retained 32kHz crystal running Measured from the SDK - once connected to an AP Software controlled No SRAM retained Measured from the SDK - not connected to an AP Internal LFLPO running Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 16 (25) 6 Mechanical Specification 6.1 Pin Antenna 6.1.1 Dimension Figure 9: EMQ100-1P Module Dimension 6.1.2 Recommended PCB Landing Pattern Figure 10: EMQ100-1P Module PCB Landing Pattern Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 17 (25) 6.2.1 Dimension 6.2 PCB Antenna Figure 11: EMQ100-1B Module Dimension 6.2.2 Recommended PCB Landing Pattern Figure 12: EMQ100-1B Module PCB Landing Pattern Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 18 (25) 6.3.1 Dimension 6.3 U.FL Antenna Figure 13: EMQ100-1U Module Dimension 6.3.2 Recommended PCB Landing Pattern Figure 14: EMQ100-1U Module PCB Landing Pattern Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 19 (25) 7 Manufacturing Recommendation 7.1 Power Layout Guideline EQM100-1 modules are powered by either 3V battery or DC 3.3V. Power pin connection capacitor is as close as possible to chip and pin. Decoupling the power supply from the chip using a capacitor. Use capacitors to prevent noise from coupling back to the power plane. Figure 15: Power Layout Guideline 7.2 RF Layout Guideline To optimize antenna performance, place the module in the corner of the PCB as shown below. Do not cover copper and trace the antenna clearance area. Keep the antenna area as far away as possible from the power supply and metal components. Connect all GND pins directly to a solid GND plane. Place GND vias as close as possible to the GND pin. Use a good layout method to avoid excessive noise coupling with signal lines or supply voltage lines. 15 mm Figure 16: RF Layout Guideline Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 20 (25) 7.3 Soldering Recommendations EQM100-1 modules can be SMT on the board following the temperature curve graph:

Figure 17: Soldering Guideline Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 21 (25) 8 Packaging EQM100-1 modules are packaged on reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a desiccant pack and a humidity card and placed in an 36x25x12cm box. Anti-static warnings and labels adhere to the outside of the bag. Figure 18: Module Packaging Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) EQM100-1 is qualified to moisture sensitivity (MSL3) in accordance with JEDEC J-STD-020 Storage Storage/shelf life in sealed bags is 12 months at <40C and <90% relative humidity.12.2 Packing Label Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 22 (25) 9 Regulatory Compliance Country USA Europe Union Canada Japan Korea Australia United Kingdom China Certification FCC 15C CE IC MIC KC RCM UKCA SRRC No 2ACCREQM100 20625-EQM100 20625-EQM100 214-230249 Coming soon Coming soon Coming soon Coming soon Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 23 (25) 10 Order Information M Q M 1 0 0

- 1 A

- F R RTC XTAL R: RTC X: No RTC Flash Size 0: No Flash 1: 2MB 2: 4MB 3: 8MB Antenna P: Pin B: PCB U: U.FL Figure 18: Ordering Part Number Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 24 (25) Revision History Revision Description 0.1 0.2 1.0 Initial draft Updated module labeling The first public release Date December 14, 2023 January 5, 2024 TBD Documentation Title Documentation No Revision Classification Status Date Qualcomm QCC711 Module Product Portfolio Datasheet V0.2 Public Release Jan 5, 2024 25 (25) Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules FCC Part 15 Subpart C 15.247 & 15.207 & 15.209 2.3 Specific operational use conditions The module is a Bluetooth module with BLE function. Operation Frequency: 2402-2480MHz Number of Channel: 40 Modulation:

GFSK Type: EQM100-1B (PCB Antenna) EQM100-1U (External Antenna) EQM100-1P (PIN Antenna) Gain: EQM100-1B (-1.34dBi) EQM100-1U (3.0dBi) EQM100-1P (1.99dBi) The module can be used for mobile or portable applications with a maximum 3dBi antenna. The host manufacturer installing this module into their product must ensure that the final composit product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation. The host manufacturer has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 2.4 Limited module procedures Not applicable. The module is a Single module and complies with the requirement of FCC Part 15.212. 2.5 Trace antenna designs Not applicable. The module has its own antenna, and doesnt need a hosts printed board microstrip trace antenna etc. EQM100-1P (PIN Antenna) the detailed antenna design is as follows:

2.6 RF exposure considerations The module must be installed in the host equipment such that at least 20cm is maintained between the antenna and users body; and if RF exposure statement or module layout is changed, then the host product manufacturer required to take responsibility of the module through a change in FCC ID or new application. The FCC ID of the module cannot be used on the final product. In these circumstances, the host manufacturer will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. 2.7 Antennas 26 (25) Antenna Specification are as follows:

Type: EQM100-1B (PCB Antenna);

EQM100-1U (External Antenna) EQM100-1P (PIN Antenna) Gain: EQM100-1B (-1.34dBi) EQM100-1U (3.0dBi) EQM100-1P (1.99dBi) This device is intended only for host manufacturers under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna;

The module shall be only used with the internal antenna(s) that has been originally tested and certified with this module. The antenna must be either permanently attached or employ a unique antenna coupler. As long as the conditions above are met, further transmitter test will not be required. However, the host manufacturer is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.) 2.8 Label and compliance information Host product manufacturers need to provide a physical or e-label stating Contains FCC ID: 2ACCREQM1001 with their finished product. 2.9 Information on test modes and additional testing requirements Operation Frequency: 2402-2480MHz Number of Channel: 40 Modulation: GFSK Host manufacturer must perform test of radiated & conducted emission and spurious emission, etc according to the actual test modes for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. Only when all the test results of test modes comply with FCC requirements, then the end product can be sold legally. 2.10 Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for FCC Part 15 Subpart C 15.247 & 15.207 & 15.209 and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Federal Communication Commission Statement (FCC, U.S.) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. 27 (25) This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Caution:

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. IMPORTANT NOTES Co-location warning:

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. OEM integration instructions:

This device is intended only for OEM integrators under the following conditions:

The transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the external antenna(s) that has been originally tested and certified with this module. As long as the conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Validity of using the module certification:

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End product labeling:

The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ACCREQM1001. Information that must be placed in the end user manual:

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. ISED Statement

- English: This device complies with Industry Canada licenseexempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the devi ce. The digital apparatus complies with Canadian CAN ICES3 (B)/NMB3(B).

- French: Le prsentappareilestconforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationestautorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareildoit accepter tout brouillageradiolectriquesubi, mm esi le brouillageest susceptible d'encompromettre le fonctionnement. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le prsent metteur radio a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur. 28 (25) Radiation Exposure Statement This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Dclaration d'exposition aux radiations Cet quipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrl. Cet quipement doit tre install et utilis distance minimum de 20cm entre le radiateur et votre corps. This device is intended only for OEM integrators under the following condition:

The transmitter module may not be co-located with any other transmitter or antenna. As long as the condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes:

Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 1 condition ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. Important Note:

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. Note Importante:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l' IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling The final end product must be labeled in a visible area with the following: Contains IC: 20625-EQM1001. Plaque signaltique du produit final Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: Contient des IC: 20625-

EQM1001 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. 29 (25) Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. Please visit 4 for the latest information. THIS CODUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to the use of information in this document, is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners and are hereby acknowledged. Copyright2024 Meruti Design, Inc. All rights reserved

EQM100-1B Label Location Document No: SHE23120009-02 Page 1 of 3 EQM100-1P Label Location Document No: SHE23120009-02 Page 2 of 3 EQM100-1U Label Location Document No: SHE23120009-02 Page 3 of 3

C5266091_X24_Ed.2 Attestation Statements TO:

Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 The Commission adopted rules for covered telecommunications equipment and video surveillance equipment produced by entities identified on the Commissions Covered List1, which is periodically updated. See the Covered List for more details. This Attestation Statement is to confirm that we follow the Section 2.911(d)(5)(i)-(ii) that prohibit equipment authorization Applicant Company name: Ehong Technology Co.,Ltd Grantee code: 2ACCR FCC ID:

Contact Name:

Address:

Telephone No:

Fax No:

Email:

i. 2ACCREQM1001 Rik Tang Room 501, No.485 Xingmei Road, Minhang Dis,Shanghai, China.

+86-021-64769993

+86-021-64765833 rik.tang@ehonglink.com Ehong Technology Co.,Ltd (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. The applicant must sign this certification. Ehong Technology Co.,Ltd (the applicant) certifies that, as of the date of the filing of the application, the applicant is not (as a specifically named entity or any of its subsidiaries or affiliates) identified on the Covered List as an entity producing covered equipment. The applicant must sign this certification. ii. Ehong Technology Co.,Ltd (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment . Date: 2024/02/29 Applicants Name: Rik Tang Title: CEO Signature 1 The Commissions Covered List is published by the Public Safety and Homeland Security Bureau and posted on the Commissions website. This Covered List, which is periodically updated, identifies particular equipment, produced by particular entities, that constitutes covered equipment. https://www.fcc.gov/supplychain/coveredlist 1/1

Ehong Technology Co.,Ltd C5266091_X10_Ed.2 Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 Subject: Request for Confidentiality FCC ID: 2ACCREQM1001 To Whom It May Concern, Date: 2024-02-29 Pursuant to the provisions of Sections 0.457 and 0.459 of Commission's rules

(47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure. Exhibits ID Label/Location Attestation Statement External Photos Block Diagram Schematics Test Report Test Setup Photos Users Manual Internal Photos Parts List / Tune Up RF Exposure Info Operational Description Cover Letter(s) SDR Software / Security Info Long-Term Confidentiality Short-Term Confidentiality NOTE 2 No No No No No NOTE 1 NOTE 1 No No No No No No No No NOTE 1: Long-Term Confidentiality may be permitted under special conditions (See II. LONG-TERM CONFIDENTIALITY, Section 3 of KDB 726920, use last in force) NOTE 2: Short-Term Confidentiality can be requested for a maximum of 180 days from the date of the grant. Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In case of short-term Confidentiality, the applicant requests the exhibits selected above are withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Sincerely, Rik Tang 1/1

Ehong Technology Co.,Ltd Product Similarity Declaration Product name: BLE Module Model name: EQM100-1B, EQM100-1P, EQM100-1U FCC ID: 2ACCREQM1001 We (Ehong Technology Co.,Ltd) hereby state that all the models are electrical identical including the same software parameter and circuit design, PCB Layout, RF module/circuit, components on PCB are the same, The only difference are antenna type.EQM100-1B Model is the pcb antenna, EQM100-1P Model is the pin antenna, EQM100-1U Model is the external antenna Signature:

Name: Rik Tang Title: CEO 2024.02.29

C5266091_X8_Ed.1 Ehong Technology Co.,Ltd Letter of Authorization Company:

Ehong Technology Co.,Ltd Address: Room 501, No.485 Xingmei Road, Minhang Dis,Shanghai, China. Product Name:

BLE Module Model Number:

EQM100-1B, EQM100-1P, EQM100-1U FCC Identifier:

2ACCREQM1001 We authorize LGAI Technological Center S.A., Ronda de la Font del Carme, s/n, 08193 Bellaterra, Spain, to act on our behalf on all matters concerning the above named equipment. Any individual within LGAI Technological Center S.A. is authorized to act on our behalf and take action on the application. We declare that authorize LGAI Technological Center S.A., Ronda de la Font del Carme, s/n, 08193 Bellaterra, Spain, is allowed to forward all information related to the approval project to the Federal Communication Commission and to discuss any issues concerning the approval application. Any and all acts carried out by LGAI Technological Center S.A. on our behalf shall have the same effect as acts of our own. Name:

Rik Tang Date: 2024-02-29 Title: CEO Signature of applicant:

1/1

C5266091_X9_Ed.2 Ehong Technology Co.,Ltd Modular Transmitter Approval Request Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Company name: Ehong Technology Co.,Ltd FCC ID: 2ACCREQM1001 Gentlemen, In accordance with 47CFR 15.212 Modular Transmitters and KDB 996369 D01 Module Certification Guide v02. FCC ID: 2ACCREQM1001 has been examined against the following requirements. Items to be covered by Single modular transmitters. Requirement per 15.212 and KDB 996369 D01 Modular Certification Guide v02 1. The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly 2. The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal Explanation from Grantee

(do not write yes/no, but explain why product complies/how it is achieved) The module has its own RF shielding. The modular has buffered data inputs, it is integrated in chip 3. The module must contain power supply regulation on the module The modular has power supply regulation 4. The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b) Antenna is independent fixed In addition, The module also is equipped with specified external antenna described in this filling and the antenna connector fulfills the 15.203requirements. 5. The module must demonstrate compliance in a stand-

alone configuration 6. The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements) All power lines derived from the host device are regulated before energizing other circuits internal The label is independent fixed 7. The module must comply with all specific rules applicable to the transmitter including all the conditions provided in the integration instructions by the grantee Compliant with all applicable FCC rules. Detail instructions are given in the Users Manual 8. The module must comply with RF exposure requirements Approved to comply with the applicable RF exposure requirement, please see the MPE evaluation Name: Rik Tang Date: 2024-02-29 Title: CEO Signature of applicant:

1/1

Ehong Technology Co.,Ltd US Agent for Service of Process LETTER OF ATTESTATION TO:

Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 04/18/2023 Ref: Attestation Statement Part 2.911(d)(7) Filing Applicant:

Company name: Ehong Technology Co.,Ltd FRN: 0023604044 Grantee code: 2ACCR Contact Name: Rik Tang Address: Room 501, No.485 Xingmei Road, Minhang Dis,Shanghai, China. Telephone No: +86-021-64769993 Email: rik.tang@ehonglink.com Ehong Technology Co.,Ltd certifies that, as of the dates of this application, Americas Compliance Consulting LLC dba iCertifi iCertifi is our designated U.S. agent for service of process for the above referenced FCC ID. Ehong Technology Co.,Ltd accepts to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any commission-related proceeding involving the equipment. The Applicant is aware of and agrees to comply with the requirements outlined in the FCC Equipment Authorization Program, Report and Order FCC 22-84, and clause 2.911. iCertifi accepts, as of the date of the filing of the application, the obligation of the designated U.S. agent for service process for the above referenced FCC ID. The US Agent for Service of Process is aware of and agrees to comply with the requirements outlined in the FCC Equipment Authorization Program, Report and Order FCC 22-84, and clause 2.911. Designated U.S. Agent Information:

Name: Americas Compliance consulting, LLC dba iCertifi FCC FRN: 0033399411 Address: 1001 SW Disk Drive, Suite 250, Bend, Oregon 97702 Contact Person: Paul Preston Tel: 866-885-4575 Email: fccagent@icertifi.com Sincerely, Ehong Technology Co.,Ltd Americas Compliance Consulting LLC dba iCertifi Paul Preston Rik Tang V02072023