FCC ID: 2ACCREQM100 Ehong BLE Module

EQM100-5 Datasheet V1.0 Copyright 2023 Ehong Information Technology Co. Ltd. All rights reserved. Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 2 (26) Table of Contents 1 Product Overview ....................................................................................................... 4 2 Hardware Specification .............................................................................................. 6 2.1 Block Diagram ................................................................................................................. 6 2.2 Pinout Description........................................................................................................... 6 Pin Map .............................................................................................................................................. 6 Pin Definition ..................................................................................................................................... 9 IO Pin Mux Table ............................................................................................................................ 10 Programmable Series Engine ....................................................................................................... 11 2.2.1 2.2.2 2.2.3 2.2.4 2.3 Computing Subsystem ................................................................................................. 11 Microcontroller ................................................................................................................................. 11 2.3.1 2.4 Memory ........................................................................................................................... 12 2.5 Peripheral Interfaces ..................................................................................................... 12 3 Electrical Characteristics ......................................................................................... 13 3.1 Absolute Maximum Ratings ......................................................................................... 13 3.2 Recommended Operating Conditions ......................................................................... 13 4 Radio Performance ................................................................................................... 14 5 Power Consumption................................................................................................. 15 5.1 Active Power .................................................................................................................. 15 5.2 Sleep Power ................................................................................................................... 15 6 Mechanical Specification ......................................................................................... 16 6.1 U.FL Antenna ................................................................................................................. 16 Dimension ........................................................................................................................................ 16 Recommended PCB Landing Pattern.......................................................................................... 16 6.1.1 6.1.2 6.2 PCB Antenna .................................................................................................................. 17 Dimension ........................................................................................................................................ 17 Recommended PCB Landing Pattern.......................................................................................... 18 6.2.1 6.2.2 7 Manufacturing Recommendation ........................................................................... 20 7.1 Power Layout Guideline ............................................................................................... 20 7.2 RF Layout Guideline ..................................................................................................... 20 7.3 Soldering Recommendations ....................................................................................... 21 8 Packaging .................................................................................................................. 22 9 Regulatory Compliance ........................................................................................... 23 10 Order Information .................................................................................................. 24 Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 3 (26) Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 4 (26) 1 Product Overview Powered by Qualcomm QCC711, EQM100-5 modules are purposely-designed M.2 Type 1216 soldered-

down form factor BLE modules that combine multi-core processing capabilities, high-security as well as BLE long-range to cater to the demands of diverse IoT applications. Their compact size and on-chip memory of SRAM and RRAM (NVM) contribute to reduced costs and enhanced performance, making them an attractive choice for space-constrained IoT edge devices. Unlike many other BLE modules on the market, EQM100-5 modules have integrated three processors 64MHz Arm Cortex-M processor for application and 32MHz Arm Conrtex-M0 processor for BLE with shared on-chip memory of 128KB SRAM and 512KB RRAM. Additional Root-of-Trust 32MHz RISC-V processor with its own secure SRAM and ROM is dedicated to security subsystem to ensure the highest level of security for IoT applications with critical security needs. They have built-in resistive RAM (RRAM), the industry latest Non-volatile Memory (NVM) technology, eliminating need for externally attached NOR flash as well as resulting in more streamlined and cost-effective system. They also feature 3-wire and 4-

wire SPI display control, making them capable of driving external LCD/TFT screens commonly found on a dedicated MCU. Furthermore, EQM100-5 modules can be powered directly by a battery, making it suitable for portable and battery-operated devices. EQM100-5 can operate in hostless mode, capable of running both the Bluetooth stack and applications internally without requiring an external MCU. Moreover, they support hostless mode (HCI) through a UART interface, functioning as a Bluetooth transceiver to offload the Bluetooth stack. This enables the external MCU to focus on handling applications rather than managing the Bluetooth stack. EQM100-5 modules have undergone rigorous regulatory compliance testing and are certified with FCC, CE, IC, UKCA, RCM, MIC, KC, SRRC and environmentally compliant with RoHS and WEEE directives. They also hold Bluetooth SIG 5.3 certification and will be software upgradable to SIG 5.4, ensuring seamless interoperability with other Bluetooth devices. EQM100-5 modules include the following configuration in the table:

Module Form Factor Antenna EQM100-5U 12 x 16 x 2.1 mm, 2.00 mm pitch, 76-pin, LGA U.FL Antenna EQM100-5B 12 x 20 x 2.1 mm, 2.00 mm pitch, 76-pin, LGA PCB Antenna EQM100-5 modules are graphically illustrated below:

2.1 mm Figure 1: EQM100-5U Module View Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 5 (26) 2.1 mm Figure 2: EQM100-5B Module View The module specific development kits are also provided to facilitate application software development as shown below:

Figure 3: EQM100-5U Module Development Kit Figure 4: EQM100-5B Module Development Kit Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 6 (26) 2 Hardware Specification This section provides detailed hardware design and specification of EQM100-5 modules. The module hardware design has been optimized for small footprint and reduced RBOM cost. 2.1 Block Diagram EQM100-5 integrates 2/4/8MB 2x3 8-USON NOR flash and 32.768kHz RTC crystal as stuffing options. The design also supports PCB antenna (EQM100-5B) or simply provides antenna pin (EQM100-5U) to allow customized antenna implementation on motherboard. The block diagram is shown below. BT ANT

(U.FL) BT ANT

(PCB) Matching T N A _ F R PIO6 PIO7 PIO8 PIO9 PIO11 PIO12 PIO14 PIO15 PIO16 PIO17 PIO18 PIO19 PIO20 PIO21 PIO22 PIO23 PIO24 PIO25 Multi-Function Pin (MFP)

(Optional) PIO3/QSPI_CSB PIO1/QSPI_MOSI CS#

DI/D0 PIO2/QSPI_MISO DO/D1 PIO4/QSPI_IO2 WP#/D2 PIO5/QSPI_IO3 HOLD/D3 2/4/8MB NOR Flash 8-USON

(3x2mm) PIO5 PIO4 PIO2 PIO1 PIO3 PIO0 VDD_PADS_1 (PIO0~8) VDD_PADS_2 (PIO9~25) VDD_BAT XTAL32M_OUT 32MHz XTAL32M_IN XTAL32K_OUT 32kHz

(Optional) XTAL32K_IN Figure 5: EQM100-5 Module Block Diagram 2.2 Pinout Description 2.2.1 Pin Map EQM100-5U and EQM100-5B share the same pin map as illustrated below:

Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 7 (26) Figure 6: EQM100-5U Module Pin Map Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 8 (26) Figure 7: EQM100-5B Module Pin Map Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 9 (26) 2.2.2 Pin Definition Pin Pin Name Type Power Domain Description 44,45 VDD_VBAT PWR 66 9 VDD_PADS_1 PWR VDD_PADS_2 PWR

I/O I/O Power input (1.71~3.6V) Host I/O voltage input ( VDD_VBAT) Host I/O voltage input ( VDD_VBAT) 11,47,68 GND GND GND Ground 50 54 52 64 56 60 56 62 70 72 42 40 38 5 7 13 17 15 19 21 23 25 36 32 30 34 27 MFP PIO0 PIO1 PIO2 PIO3 PIO4 PIO5 PIO6 PIO7 PIO8 PIO9 PIO10 PIO11 PIO12 PIO13 PIO14 PIO15 PIO16 PIO17 PIO18 PIO19 PIO20 PIO21 PIO22 PIO23 PIO24 PIO25 DI VDD_VBATT SW configurable as a reset input DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_1 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO DI/DO VDD_PADS_2 Generic PIO, analog in configurable DI/DO VDD_PADS_2 Generic PIO, analog in configurable DI/DO VDD_PADS_2 Generic PIO, analog in configurable DI/DO VDD_PADS_2 Generic PIO, analog in configurable 2.2.3 IO Pin Mux Table GPIO QSPI I2C FTC LED Analog CoEx Debug SE0 SE1 SE2 SE3 PIO0 PIO1 PIO2 PIO3 PIO4 QSPI_CLK SDA ftc0_out BLUE QSPI_MOSI SCL ftc0_out RED QSPI_MISO SDA ftc0_out GREEN QSPI_CSB SCL ftc1_out WHITE QSPI_IO2 SDA ftc1_out WHITE PIO5 QSPI_IO3 SCL ftc1_out BLUE SDA SCL ftc_in RED GREEN PIO6 PIO7 PIO8 PIO9 PIO10 PIO11 QSPI_CLK SDA ftc_in PIO12 QSPI_MOSI SCL PIO13 QSPI_MISO SDA ftc2_out PIO14 QSPI_CSB SCL ftc2_out PIO15 QSPI_IO2 SDA ftc2_out BLUE/WHITE PIO16 QSPI_IO3 SCL ftc_in RED/WHITE ftc3_out GREEN/WHITE ftc3_out WHITE ftc3_out WHITE PIO17 PIO18 PIO19 PIO20 PIO21 PIO22 PIO23 PIO24 PIO25 SDA SCL SDA SCL SDA SCL SDA SCL Port 0 Port 0 Port 0 Port 0 Port 1 Port 1 Port 1 Port 1 Port 2 Port 2 Port 2 Port 2 Port 3 Port 3 Port 3 Port 3 Port 0 Port 4 Port 4 Port 4 Port 1 Port 0 Port 0 Port 0 Port 2 Port 1 Port 1 Port 1 Port 3 Port 2 Port 2 Port 2 Port 4 Port 3 Port 3 Port 3 Port 4 Port 4 Port 4 Port 0 Port 0 Port 0 Port 0 Port 1 Port 1 Port 1 Port 1 Port 2 Port 2 Port 2 Port 2 Port 3 Port 3 Port 3 Port 3 Port 4 Port 4 Port 4 Port 4 Port 3 Port 3 Port 0 Port 0 Port 1 Port 1 Port 1 Port 1 Port 2 Port 2 Port 2 Port 2 Port 3 Port 3 Port 3 Port 3 Port 4 Port 4 TCK/SWD_CLK TMS/SWD_DIO TDI/test_hf TDO/SWO Test_lf trace_ctrl trace_clk trace_data_0 trace_data_1 trace_data_2 WHITE slv_pta_coex_active trace_data_3 Port 4 Port 4 ftc_in WHITE slv_pta_coex_status Port 0 Port 0 Port 0 Port 0 BLUE RED GREEN WHITE ADC ADC ADC ADC slv_pta_coex_confx mstr_pta_coex_active mstr_pta_coex_status mstr_pta_coex_confx Port 1 Port 1 Port 1 Port 1 Port 2 Port 2 Port 2 Port 2 Port 3 Port 3 Port 3 Port 3 Port 4 Port 4 Port 4 Port 4 2.2.4 Programmable Series Engine Serial Engines (SE) and supported interfaces SE SE0 SE1 SE2 SE3 3-wire or 4-wire SPI Display Controller True 4-wire SPI Controller/Peripheral I2C Controller 8-bit UART 9-bit UART Yes Yes

Yes Yes

Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

Serial engines default port mappings SE 3-wire Display 4-wire Display Port 0 Port 1 Port 2 Port 3 Port 4 CS1 SDIN CLK CS CS1 SDIN CLS CS D/C 2.3 Computing Subsystem 2.3.1 Microcontroller I2C SDA SCL

UART SE0 true 4-wire SPI CTS RTS TXD RXD

MISO MOSI CLS CS CS1 EQM100-5 modules have Qualcomm QCC711 at his core which integrates three microcontrollers Arm Cortex-M3 processor, Arm Cortex-M0 processor, and RISC-V:

Arm Cortex-M3 processor Running at 32MHz, dedicated to higher layer protocol and user applications. It conducts inter-processor communication with Arm Cortec-M0 processor for BLE services and with RISC-V processor for security services. Arm Cortex-M0 processor Running at 32MHz, dedicated to BLE radio and lower protocol layer (MAC) processing. RISC-V processor Running at 32MHz, dedicated to security services. it can function as a Root-of-Trust

(RoT) processor to execute highly secure bootup code under Trusted Execution Environment (TEE) that validate the user application image before handing over the control to Arm Cortex-M3 processor. RISC-V has its own 32KB SRAM, 192KB ROM and protected OTP area and will be NOT visible to user applications, making it highly reliable and secure. The computing subsystem software architecture consists of three parts as illustrated below. Computing Subsystem (APSS) will be open-sourced on GitHub while Bluetooth Subsystem (BTSS) and Security Subsystem will be offered binary inside software SDK package. Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 12 (26) Arm Cortex-M3 CPU Application Subsystem (APSS)

- Contains OEM application

- Drivers for peripherals and interface to other subsystems

- All drivers provided as source End User Applications System Resource BLE QAPI

(DIS/GAP/GATT/L2CAP/HCI) Security QAPI

(Key Derive/RNG/Digest/Encrypt/FOTA/Fuse) Peripheral Interfaces Shared Memory IPC Mailbox Memory IPC Arm Cortex-M0 CPU Bluetooth Subsystem (BTSS) RISC-V Root-of-Trust CPU Security Subsystem Inter Processor Communication (IPC) Inter Processor Communication (IPC) Profile BLE Host Stack BLE Controller One-Time Programable

(OTP) Crypto Engine OS Secure Boot Fuse Controller

- Implements Bluetooth and ESL protocols

- Contains both Bluetooth Host and Controller Binary Binary

- Performs image authentication on boot

- Provides crypto services to APSS and BTSS Figure 8: Computing subsystem software architecture 2.4 Memory There are 512KB on-chip RRAM, 128KB on-chip SRAM and 2KB OTP/MTP shared among three processors. Built-in Non-volatile memory RRAM hosting execution code will eliminate needs of an external NOR flash to reduce system cost. 416KB out of 512KB RRAM can be used for user applications. 128KB SRAM can be used for runtime data. 64KB out of 128KB SRAM can be used for user applications. Additional NOR flash can be added through QSPI interface for additional data storage. 2.5 Peripheral Interfaces EQM100-5 modules supports the following peripheral interfaces through 26x configurable PIO:

2x SPI master or slave, support 3-wire/4-wire SPI for display and true 4-wire SPI with DMA 2x I2C master and 1x I2C slave, supporting 100kbps, 400kbps, and 1000kbps data rate 3x UART with hardware flow control, supporting maximum 2M baud rate 4x 10-bit ADC (1.8V only) 4x FTC (PWM) 3-wire PTA coexistence master or slave SWD with 4-bit trace Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 13 (26) 3 Electrical Characteristics 3.1 Absolute Maximum Ratings The absolute maximum ratings provided in this section reflect the stress levels that, if exceeded, may cause permanent damage to the device. No functionality is guaranteed outside the operating specifications. Functionality and reliability are only guaranteed within the operating. Pin Parameter Min VDD_VBATT Power input voltage VDD_PADS_2 VDD_PADS_1 I/O port 1 voltage VDD_PADS_2 I/O port 2 voltage VSS - 0.3 VSS - 0.3 Max 3.63 3.63 3.63 PIO25:PIO9 PIO8:PIO0 MFP Digital I/O All ground / VSS pads Storage temperature VSS - 0.3 VDD_PADS_2 + 0.3 VSS - 0.3 VDD_PADS_1 + 0.3 VSS - 0.3 VDD_VBAT + 0.3 0

-40 0 85 Unit V V V V V V V C 3.2 Recommended Operating Conditions Pin Parameter VDD_VBATT Power input voltage VDD_PADS_1 I/O port 1 voltage VDD_PADS_2 I/O port 2 voltage PIO25:PIO9 PIO8:PIO0 MFP Digital I/O All ground / VSS pads Storage temperature Min 1.71 0 0 VSS VSS VSS 0

-40 Max Unit 3.6 3.6 3.6 VDD_PADS_2 VDD_PADS_1 VDD_VBAT 0 85 V V V V V V V C Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 14 (26) 4 Radio Performance Channel Bandwidth Modulation Parameter Data Rate Typical Tx Power Rx Sensitivity

@ 30.8% PER

(Boost Mode) Rx Sensitivity

@ 30.8% PER

(Normal Mode) 2Mbps 1Mbps 500kbps 125kbps 2Mbps 1Mbps 500kbps 125kbps 2Mbps 1Mbps 500kbps 125kbps

+6

+6

+6

+6

-93

-96

-98

-103 TBD TBD TBD TBD 2MHz GFSK Note: VDD_VBAT = 3.3V Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 15 (26) 5 Power Consumption EMQ100-1 modules can operate in four power states as shown below to maximize power saving:

System Request Battery Attach System Request Off Active Battery Loss Wakeup Event Sleep

(External 23kHz Clock) Battery Loss Hibernate

(Internal Slow Oscillator) Battery Loss Wakeup Event Figure 9: Power State Diagram 5.1 Active Power Channel Bandwidth Modulation Parameter dBm Average Current Unit Tx Power Rx Power Normal Rx Power Boost 0

+4

+6 TBD

-95 10.5 14.6 16.6 TBD 5.3 mA mA mA mA mA 2MHz GFSK 5.2 Sleep Power Test Mode MCU State Average Current Unit Software controlled 16KB SRAM retained 32kHz crystal running Measured from the SDK - once connected to an AP Software controlled No SRAM retained Measured from the SDK - not connected to an AP Internal LFLPO running Sleep 4 A Hibernate 16 A Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 16 (26) 6 Mechanical Specification 6.1 U.FL Antenna 6.1.1 Dimension Figure 10: EMQ100-5U Dimension 6.1.2 Recommended PCB Landing Pattern Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 17 (26) Figure 11: EMQ100-5U PCB Landing Pattern 6.2 PCB Antenna 6.2.1 Dimension Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 18 (26) Figure 12: EMQ100-5B Dimension 6.2.2 Recommended PCB Landing Pattern Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 19 (26) Figure 13: EMQ100-5B PCB Landing Pattern Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 20 (26) 7 Manufacturing Recommendation 7.1 Power Layout Guideline EQM100-5 modules are powered by either 3V battery or DC 3.3V. Power pin connection capacitor is as close as possible to chip and pin. Decoupling the power supply from the chip using a capacitor. Use capacitors to prevent noise from coupling back to the power plane. Figure 14: Power Layout Guideline 7.2 RF Layout Guideline To optimize antenna performance, place the module in the corner of the PCB as shown below. Do not cover copper and trace the antenna clearance area. Keep the antenna area as far away as possible from the power supply and metal components. Connect all GND pins directly to a solid GND plane. Place GND vias as close as possible to the GND pin. Use a good layout method to avoid excessive noise coupling with signal lines or supply voltage lines. 15 mm m m 0 4 Figure 15: RF Layout Guideline Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 21 (26) 7.3 Soldering Recommendations EQM100-5 modules can be SMT on the board following the temperature curve graph:

Figure 16: Soldering Guideline Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 22 (26) 8 Packaging EQM100-5 modules are packaged on reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a desiccant pack and a humidity card and placed in an 36x25x12cm box. Anti-static warnings and labels adhere to the outside of the bag. Warning Figure 16: Module Packaging The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) EQM100-5 is qualified to moisture sensitivity (MSL3) in accordance with JEDEC J-STD-020 Storage Storage/shelf life in sealed bags is 12 months at <40C and <90% relative humidity.12.2 Packing Label Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 23 (26) 9 Regulatory Compliance Country USA Europe Union Canada Japan Korea Australia United Kingdom China Certification FCC 15C CE IC MIC KC RCM UKCA SRRC No TBD TBD TBD TBD TBD TBD TBD TBD Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 24 (26) 10 Order Information E Q M 1 0 0

- 5 A

- F R RTC XTAL R: RTC X: No RTC Flash Size 0: No Flash 2: 2MB 4: 4MB 8: 8MB Antenna U: U.FL B: PCB Figure 18: Ordering Part Number Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 25 (26) Revision History Revision Description 0.1 1.0 Initial draft The first public release Date August 15, 2023 TBD Documentation Title EQM100-5 Datasheet Documentation No Revision V0.1 Classification Status Date Public Release Aug 15, 2023 26 (26) Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. Please visit www.ehonglink.com/ for the latest information. THIS CODUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to the use of information in this document, is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners and are hereby acknowledged. Copyright2023 Ehong Information Technology Co. Ltd. All rights reserved. 27 (26) FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the us ers authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, purs uant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmf ul interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference t o radio communications. However, there is no guarantee that interference will not occur in a particular ins tallation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Important Note:

Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Country Code selection feature to be disabled for products marketed to the US/Canada. This device is intended only for OEM integrators under the following conditions:

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2. The transmitter module may not be co-located with any other transmitter or antenna, As long as the three conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Important Note:

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-

evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following" Contains FCC ID: 2ACCREQM100

". Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 28 (26) IC Statement This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:

This device may not cause interference. This device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil contient un ou des metteurs/rcepteurs exempts de licence conformes aux RSS exempts de licence d'Innovation, Sciences et Dveloppement conomique Canada. Le fonctionnement est soumis aux deux conditions suivantes :

Cet appareil ne doit pas provoquer d'interfrences. Cet appareil doit accepter toutes les interfrences, y compris les interfrences susceptibles de provoquer un fonctionnement indsirable de l'appareil. Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Dclaration dexposition aux radiations:

Cet quipement est conforme aux limites dexposition aux rayonnements IC tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following condition:

The transmitter module may not be co-located with any other transmitter or antenna. As long as the condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes:

Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 1 condition ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. Important Note:

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-

evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. Note Importante:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l' IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling The final end product must be labeled in a visible area with the following: Contains IC: 20625-EQM100. Plaque signaltique du produit final Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: Contient des IC:

20625-EQM100. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. 29 (26)

EQM100-5B Label Location Document No: SHE23070127-02 Page 1 of 2 EQM100-5U Label Location Document No: SHE23070127-02 Page 2 of 2

Ehong Technology Co.,Ltd

(2023-08-23) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: LETTER OF AGENT AUTHORIZATION To Whom It May Concern:

We, the undersigned, hereby authorize (Willa Lan at Eurofins Wireless Testing Service

(Shenzhen) Co., Ltd) to act on our behalf in all matters relating to application for equipment authorization, including the signing of all documents relating to these matters. We also hereby certify that no party to the application authorized hereunder is subject to the denial of benefits, including FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C.853(a). This agreement expires one year from the current date. Sincerely, Name:_________ __________ ___________________ _______ Rik Tang

(Signature)

(Printed Name) Job Title: Manager Contact Information: rik.tang@ehonglink.com

Ehong Technology Co.,Ltd

(2023-08-23) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: Attestation Statements Part 2.911(d)(5)(i) request for (FCC ID: 2ACCREQM100)

[Ehong Technology Co.,Ltd] (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincerely,

(Applicant signature)

(Applicant printed name) Rik Tang Ehong Technology Co.,Ltd

(2023-08-23) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: Attestation Statements Part 2.911(d)(5)(ii) request for (FCC ID: 2ACCREQM100)

[Ehong Technology Co.,Ltd] (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincerely,

(Applicant signature)

(Applicant printed name) Rik Tang

Ehong Technology Co.,Ltd

(2023-08-23) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: CONFIDENTIALITY REQUEST FOR (Ehong BLE Module / EQM100-5B, EQM100-5U # AND FCC ID: 2ACCREQM100) To Whom It May Concern:

This letter serves as an official request for confidentiality under sections 0.457 and 0.459 of CFR 47. We have requested that the (Block Diagram, Schematics, Operational Description) required to be submitted with this application be permanently withheld from public review. the above documents are company proprietary information that could never get into the possession of your competition. Please contact me if there is any information you may need. Sincerely, Rik Tang

Ehong Technology Co.,Ltd Request for Modular/Limited Modular Approval Date: August 30, 2023 Subject: Manufacturers Declaration for - Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval Confidentiality Request for: FCC ID: 2ACCREQM100 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement Requirement Met 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i)

- YES - NO(*) Details: The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)

- YES - NO(*) Details: Data to the modulation circuit is buffered as described in the operational description provided with the application 3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)

- YES - NO(*) Details: The module contains its own power supply regulation. Please refer to schematic filed with this application 4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)

- YES - NO(*) Details: The module connects to its antenna using an UFL connector which is considered a non-standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v)

- YES - NO(*) Details: The module was tested stand-alone as shown in test setup photographs filed with this application Ehong Technology Co.,Ltd Modular Approval Requirement 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see Requirement Met KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID:

XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi)

- YES - NO(*) Details: There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application. 7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)

- YES - NO(*) Details: The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii)

- YES - NO(*) Details: The module meets Mobile exclusion levels as shown in the RF exposure information filed with this application. Ehong Technology Co.,Ltd Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval (LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA;

the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: N/A Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met

- Provided in Separate Cover Letter

- N/A Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >

2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: <example N/A>

Split Modular Requirements Requirement Provided in Manual 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained.

- Provided in Separate Cover Letter

- N/A Details: <example N/A >

Ehong Technology Co.,Ltd OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to point 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types

(monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. Sincerely, By:

________________Manager__________

(Signature/Title1) __Rik Tang______________________

(Print name) 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead.

Ehong Technology Co.,Ltd Product Similarity Declaration Product name: Ehong BLE Module Model name: EQM100-5B, EQM100-5U FCC ID: 2ACCREQM100 We (Ehong Technology Co.,Ltd) hereby state that all the models are electrical identical including the same software parameter and circuit design, PCB Layout, RF module/circuit, components on PCB are the same, the only difference are antenna type. EQM100-5B Model is the PCB antenna. EQM100-5U Model is the external antenna. Signature:

Name: Rik Tang Title: Manager 2023.08.22

Ehong Technology Co.,Ltd US Agent for Service of Process LETTER OF ATTESTATION TO:

Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 04/18/2023 Ref: Attestation Statement Part 2.911(d)(7) Filing Applicant:

Company name: Ehong Technology Co.,Ltd Grantee code: 2ACCR Contact Name: Rik Tang Address: Room 501, No.485 Xingmei Road, Minhang Dis,Shanghai, China. Telephone No: +86-021-64769993 Email: rik.tang@ehonglink.com Ehong Technology Co.,Ltd certifies that, as of the dates of this application, Americas Compliance Consulting LLC dba iCertifi iCertifi is our designated U.S. agent for service of process for the above referenced FCC ID. Ehong Technology Co.,Ltd accepts to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any commission-related proceeding involving the equipment. The Applicant is aware of and agrees to comply with the requirements outlined in the FCC Equipment Authorization Program, Report and Order FCC 22-84, and clause 2.911. iCertifi accepts, as of the date of the filing of the application, the obligation of the designated U.S. agent for service process for the above referenced FCC ID. The US Agent for Service of Process is aware of and agrees to comply with the requirements outlined in the FCC Equipment Authorization Program, Report and Order FCC 22-84, and clause 2.911. Designated U.S. Agent Information:

Name: Americas Compliance consulting, LLC dba iCertifi FCC FRN: 0033399411 Address: 1001 SW Disk Drive, Suite 250, Bend, Oregon 97702 Contact Person: Paul Preston Tel: 866-885-4575 Email: fccagent@icertifi.com Sincerely, Ehong Technology Co.,Ltd Americas Compliance Consulting LLC dba iCertifi Paul Preston Rik Tang V02072023