Key Features Pre-qualified Bluetooth 1.0B Module RF output power class 2 FCC and ETSI approved 460 kb/s max data rate over UART Multiple interface for different applications
-UART for data
-PCM for voice
-USB for voice and data I2C interface Internal crystal oscillator HCI firmware included Multi Point Operation Built-in shielding Suggested Applications Computers and peripherals Handheld devices and accessories Access points ROK 101 007 ROK 101 007 Bluetooth Module Description ROK 101 007 is a short-range module for implementing Bluetooth function-
ality into various electronic devices. The module consists of three major parts; a baseband controller, a flash memory, and a radio that operates in the globally available 2.42.5 GHz free ISM band. Both data and voice transmission is supported by the module. Communica-
tion between the module and the host controller is carried out using a high-
speed USB interface compliant with USB Specifications 1.1 or an UART/
PCM interface. When using the USB interface, the module appears as a USB slave device and therefore requires no PC resources. ROK 101 007, which is compliant with Bluetooth version 1.0B, is a Class 2 Bluetooth Module (0 dBm) and is type-approved. The module supports all Bluetooth profiles. ROK 101 007 Preliminary I2C_DATA I2C_CLK TXD RXD RTS CTS DETACH WAKE_UP D+
D-
PCM_IN PCM_OUT PCM_SYNC PCM_CLK T6 C3 B5 A5 A6 B6 C1 B4 B1 B2 A1 A2 A3 A4 Baseband UART USB PCM Loop Filter VCO Tank Radio ASIC 13MHz Crystal Voltage Regulation FLASH Memory Radio Module Switch Antenna Filter PBA 313 01/2 POR ADDR DATA CTRL RX-
Balun TX-
Balun C4 C6 C2 B3 R1 R2 T1 T3 VCC_IO VCC ON GND GND GND GND GND T2 R4 R5 R6 T4 T5 C5 ANT NC NC NC NC NC NC R3 RESET#
Figure 1. Block Diagram 0 1 2 3 cm Audio HCI Link Manager Baseband Radio Figure 2. Actual size of the Ericsson Bluetooth Module, and also showing the HW and FW stack. 2 Preliminary ROK 101 007 Absolute Maximum Ratings Parameter Temperature Storage temperature Operating temperature Power Supply VCC VCC_IO Digital Inputs Input low voltage Input high voltage Recommended Operating Conditions Temperature Ambient temperature, Test Power Supply Positive Supply Voltage I/O Ports Supply Voltage Symbol TStg TAmb VCC VCC_IO VIL VIH Tamb VCC VCC_IO Min
-30 0
-0.3
-0.8
-0.5 Typ
+23
+3.3
+3.3 Symbol Condition Electrical Characteristics DC Specifications Unless otherwise noted, the specification applies for TAmb = 0 to +75C, 3.175 < VCC < 5.25V Parameter Typ Power Supply Supply Voltage I/O Ports Supply Voltage Digital Inputs Logical Input High Logical Input Low Logical Input High Logical Input Low Digital Outputs Logical Output High Logical Output Low Except ON signal Except ON signal ON signal only ON signal only 0.7 x VCC_IO 0 2.0 0 0.9 x VCC_IO 0 VIH1 VIL2 VIH2 VIL2 VCC VCC_IO See note 10 3.175 2.7 3.3 3.3 Min VOH VOL Max
+85
+75
+5.25
+3.6 VCC_IO +0.3 Max 5.25 3.6 VCC_IO 0.3 x VCC_IO VCC 0.4 VCC_IO 0.1 x VCC_IO Unit C C V V V V C V V Unit V V V V V V V V 3 ROK 101 007 Preliminary Condition Symbol Min Typ Max Unit Average ICC + ICC_IO See note 1 Page Scan Enable Page scan window: continuous Page scan interval : n/a (0s) Page Scan Enable Page scan window: 11.25ms Page scan interval : 1.28s Page Scan Enable Page scan window: 11.25ms Page scan interval : 2.56s Inquiry Scan Enable Page Scan Window : 2.56s 11.25ms Page Scan Interval : 2.56s Inquiry Scan Window : 11.25ms Inquiry Scan Interval : 2.56s Inquiry Scan Enable Page Scan Window : 11.25ms Page Scan Interval : 1.28s Inquiry Scan Window : 11.25ms Inquiry Scan Interval : 2.56s Inquiry Scan Enable Page Scan Window : 11.25ms Page Scan Interval : 2.56s Inquiry Scan Window : 11.25ms Inquiry Scan Interval : 2.56s Established connection with data transfer Only ICC_IO , VCC_IO=TBD ISTA ISSW ISHW IPSM1 IPSM2 IPSM3 IISM1 IISM2 IISM3 ICS ICC_IO 5.95 2.35 1 50 6.35 6.15 50 6.55 6.35 26 TBD mA mA A mA mA mA mA mA mA mA mA 5Parameter Average Current Consumption Standby Shutdown - SW Shutdown HW Page Scan Mode R0 Page Scan Mode R1 Page Scan Mode R2 Inquiry Scan with Page Scan Mode R0. Inquiry Scan with Page Scan Mode R1. Inquiry Scan with Page Scan Mode R2. Connect State VCC_IO Current 4 Preliminary ROK 101 007 Condition Symbol Min 2.402 RF Specifications Parameter General Frequency Range Double Sided IF Bandwidth Antenna load VSWR VSWR Receive Performance Sensitivity level Max input level C/I co-channel C/I 1MHz C/I 2MHz C/I 3MHz Blocking, C/IDC-5GHz Out-of-band blocking Spurious Emissions Spurious Emissions Transmitter Performance Frequency deviation RX mode TX mode, see note 2 PIN: -70dBm, 75kHz offset (max), PIN: -20dBm, 75kHz offset (max), C: -60 dBm C: -60 dBm C: -60 dBm C: -67 dBm See figure 6 30-1910 MHz 1910-2000 MHz 2000-2399 MHz 2484-3000 MHz 3.00-12.75 GHz 30 MHz to 1 GHz 1 GHz to 12.75 GHz see notes 3,4 and figure 3 see note 5
+4
-10
-27
-27
-10 140 fMod
-48
-2
-25
-40
-40 fDrift1 fDrift2 fDrift3 Initial frequency error TX power TX carrier drift in 1 slot (366 s) TX carrier drift in 3 slots (1598 s) TX carrier drift in 5 slots (2862 s) 20 dB bandwidth Spurious Emissions Spurious Emissions Spurious Emissions Spurious Emissions Timing performance LPO_CLK frequency Tolerance of LPO_CLK System clock frequency Tolerance of system clock Channel switching time Received Signal Strength Indicator RSSI RSSI see figure 4 Measured with RBW: 10 kHz and peak detector 30 MHz 1GHz 1 GHz 12.75 GHz 1.8 Hz 1.9 GHz 5.15 GHz 5.3 GHz Trimmed, see note 6 see note 6 see note 5 see figure 5 Input power = -40 dBm Input power = -60 dBm fLPO_CLK fSYS_CLK 3,2 13.0000 150
-250
-20 15 3 Typ 1 50 3:1 3:1 1.5 Max 2.480 0.1%
0.1%
14
+4
-30
-40
-57
-47 175
+48 4 25 40 40 1.000
-36
-30
-47
-47
+250
+20 25 11 Unit GHz MHz BER BER dB dB dB dB dBm dBm dBm dBm dBm dBm dBm kHz kHz dBm kHz kHz kHz MHz dBm dBm dBm dBm kHz ppm MHz ppm s n/a n/a 5 ROK 101 007 Preliminary RF Specifications continued... TX_DATA:
See note 4 64 logic 'Low' & 64 logic 'High'
Figure 3. Frequency Deviation PHD_OFF SYNT_ON TX_ON D f PHD_OFF
+f dev
-f dev Old ch. New ch. TX_DATA: High Figure 4. Frequency drift. Figure 5. Channel switching time 6 TX carrier drift TX_DATA: High t TX_DATA: Low t=214 s t=580 s t=1598 s t=2862 s f SYNT_ON TX_ON Channel switching time 50 kHz t RF Specifications continued... C/I Blocking The blocking characteristics can be basically split into two regions: In-
band and Out-of-band. Blocking is performed both on the chip and on the module level. In-band Filtering on chip C/I @ 2MHz: -30 dB -> 0.1%BER C/I 3MHz: -40 dB -> 0.1%BER Out-of-band Antenna filter, DC to 1.9 GHz and 3:rd harmonic. Switch, monic. low freq. and 2:nd har-
RX-balun, low freq. and 2:nd harmonic. On-chip IF filter Figure 6 shows the combination blocking effect of the antenna switch, antenna filter and RX balun. In addition to the blocking characteris-
tics shown in figure 6, there is antenna isolation and filtering on the chip. Marker 1 shows the region where the Bluetooth band is located. Markers 2
- 4 show the blocking at the telecom frequency bands. An example of the total blocking characteristics can be seen in figure 7. Preliminary ROK 101 007 m1 m4 m3 0
-10
-20
-30
-40
-50
-60
-70
-80
-90
) h t a p X R B d
m2
-100 0.0 0.5 1.0 1.5 2.0 m1 freq=2.450GHz dB( RX path)=-3.529 m2 freq=900.0MHz dB(RX path) = -74.580 2.5 GHz 3.0 3.5 4.0 4.5 5.0 m3 freq=1.800GHz dB(RX path) m 4 freq=1.900GHz dB(RX path
= -47.426
) = -36.537 Figure 6. Typical blocking characteristics excluding antenna isolation and on chip filtering. Example 1 Example 2 Interference of +33 dBm at 2015 MHz. Interference of +33 dBm at 1910 MHz.
Antenna isolation 15 dB
Antenna filter, 27 dB
Antenna isolation
Antenna filter, 25 dB 36 dB Antenna switch, RX-balun Antenna switch, RX-balun
Interference level before IF filter +33-15-27=
-9 dBm
Interference level before IF filter +33-25-36=
-28 dBm 0.1% BER requires a C/I of more than -40 dB at the IF filter.
0.1% BER carrier level -40 + (-9)=
-49 dBm
0.1% BER carrier level -40 + (-28)=
-68 dBm Figure 7. Blocking examples. 7 ROK 101 007 Preliminary Pin Description Pin Pin Name A1 PCM_IN A2 PCM_OUT A3 PCM_SYNC A4 PCM_CLK A5 RXD A6 RTS B1 D+
B2 D-
B3 GND B4 WAKE_UP B5 TXD B6 CTS C1 DETACH C2 ON C3 I2C_CLK C4 VCC_IO C5 NC C6 VCC R1 GND R2 GND R3 RESET#
R4 NC R5 NC R6 NC T1 GND T2 ANT T3 GND T4 NC T5 NC T6 I2C_DATA Type CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS Power CMOS CMOS CMOS CMOS Power CMOS Power
Power Power Power CMOS
Power RF Power Power
CMOS Direction In Out In/Out In/Out Input Input In/Out In/Out Power Output Output Output Input Input Output Power
Power Power Power Input
Power In/Out Power Power
In/Out Description PCM data, see notes 7,9 PCM data, see notes 7,9 Sets the PCM data sampling rate, see notes 7,9 PCM clock that sets the PCM data rate, see notes 7,9 RX data to the UART, see note 9 Flow control signal, Request To Send data from UART, see notes 7,9 USB data pin, see notes 9,10 USB data pin, see notes 9,10 Signal ground Indicates that the module wants to be attached to the USB, Active High. See notes 9,10 TX data from the UART, see note 9 Flow control signal, Clear To Send data from UART, see note 9 Indicates that the USB host wants to detach the module, Active High. See notes 7,9 When tied to VCC, the module is enabled. I2C clock signal, see note 9 External supply rail to the Input / Output ports Do not connect Supply Voltage Signal ground Signal ground Active low reset, see notes 8,9 Do not connect Do not connect Do not connect Signal Ground 50 Antenna connection Signal Ground Test point, internal voltage regulator - Do not connect Do not connect I2C data signal, see note 9 Notes 1. Current consumption is based upon when the module is when ON is low and VCC_IO is grounded. 2. During the TX mode, the VSWR specification states the limits that are acceptable before any other RF parameters are strongly effected, i.e. frequency deviation and initial frequency error. 3. Frequency deviation measurements are now recorded differentially, (f Mod1 - f Mod0 ) / 2. 4. Provided that the TX INV register (bit 0) has been set in the enable register at startup. 5. Tolerance for the system clock takes into account both the complete temperature range and aging of the crystal. 6. LPO_CLK frequency is pre-trimmed within a tolerance of 250ppm. 7. 100k pull-up resistors to VCC_IO are used on the module. PCM signals direction is programmable 8. RESET# signal must be fed from an open drain output. 9. CMOS buffers are low voltage TTL compatible signals. 10. To be compliant with the USB specification, VCC_IO 3.11V 8 Preliminary ROK 101 007 Mechanical Specification 32.8 0.2 1.6 5.05 7.85 0.2 0.2 0.2 14.1 15.7 0.2 0.2 Detail A 1.6 0.2 7.85 0.2 14.1 0.2 2 0
. 8 6 1 s l l l a b r e d o s t u o h t i x a m 5 7
. 2 w m m 2
. 0 x o r p p a Detail A T R 2
. 0 4 5
. 0 3.12 4.39 5.66 6.93 8.2 9.47 Co-planarity 0.1 mm CBA 6 5 4 3 2 1 Pad size: 35 mil = 0.889 mm Tolerance on placement: 0.02 mm 2 7 5 8 9 6
. 5
. 3 2 2 2
. 2 2 6 7
. 4 2 Figure 8. Mechanical dimensions. 9 ROK 101 007 Preliminary Application Block Schematics USB Application VCC Host GND USB Control D+
D-
VCC_IO ON VCC Bluetooth Module Wake_up Detach GND Figure 9. A typical USB configuration. UART and PCM Application VCC ON VCC_IO RS232 GND Figure 10. A typical UART or PCM configuration. 10 RS 232 transceiver VCC_IO ON VCC Bluetooth Module 4 UART 4 Codec PCM GND Preliminary ROK 101 007 1b) Loop filter, filters the tuning voltage of the VCO-tank. 1c) RX-balun handles transformation from unbalanced to balanced transmission. 1d) TX-balun handles biasing of the output amplifier stage and transformation from balanced to unbalanced transmission. 1e) Antenna switch directs the power either from the antenna filter to the receive ports or from the ASIC output ports to the antenna filter. 1f) Antenna filter band-pass filters the radio signal. 2. The baseband controller is an ARM7-Thumb based chip that controls the operation of the radio transceiver via one of the interface methods; USB or UART. Additionally, the base-
band controller has a PCM Voice interface and I2C interface. 3. A Flash memory is used together with the baseband controller. Please, refer also to the Firmware section. 4. The power management block regulates and filters the supply voltage. VCC is typically 3.3V and two regulated voltages are produced, 2.8V and 2.2VNOM. 5. An internal clock is mounted on the module. The clock frequency is 13MHz and is generated from a crystal oscillator that guaran-
tees a timing accuracy within 20ppm. Bluetooth Module stack The Host Controller Interface (HCI) handles the communication by the transport layer through the UART or USB interface with the host. The Baseband and radio provides a secure and reliable radio link for higher layers. The following sections describe the Bluetooth module stack in more detail. It is implemented in accord-
ance with and complies with the Specification of the Bluetooth System v1.0B. Functional Description The ROK 101 007 is a complete Bluetooth module that has been specified and designed according to the Bluetooth System v1.0B. Its implementation is based on a high-
performance integrated radio trans-
ceiver (PBA 313 01 /2) working with a baseband controller, a flash memory and surrounding secondary compo-
nents features low energy consump-
tion for use in battery operated devices. Block Diagram ROK 101 007 has five major opera-
tional blocks. Figure 11 illustrates the interaction of the various blocks. The functionality of each block is as follows:
1. Radio functionality is achieved by using the Bluetooth Radio, PBA 313 01/ 2. Six operational blocks are shown for the radio section and their operation is as follows:
1a) VCO-tank is a part of the phase locked loop. The modulation is performed directly on the VCO. To ensure high performance the VCO-tank is laser trimmed. I2C Interface (2) USB Interface (4) UART Interface (4) PCM Voice Interface (4) 1 Loop Filter VCO Tank POWER (3) 4 Voltage Regulation 3 FLASH Memory Radio Module Switch Antenna Filter ANT PBA 313 01/2 ADDR DATA CTRL RX-
Balun TX-
Balun RESET 2 Base-
band Radio ASIC 13MHz Crystal 5 Audio HCI Link Manager Baseband Radio Figure 11. Simplified Block Diagram Figure 12. HW/FW parts included in the Ericsson Buetooth module. 11 ROK 101 007 Preliminary Bluetooth Radio Interface The Bluetooth module is a class 2 device with 4dBm maximum output power with no power control needed. Nominal range of the module with a typical antenna is up to a range of 10 m (at 0 dBm). It is compliant with FCC and ETSI regulations in the ISM band. Baseband Bluetooth uses an ad-hoc net structure with a maximum of eight active units in a single piconet. By default the first unit setting up a connection is the master of the point to point link. The master transmits in the even timeslots and the slave transmits in the odd timeslots. For full duplex transmission, a Time-
Division Duplex (TDD) scheme is used. Packets are sent over the air in timeslots, with a nominal length of 625 s. A packet can be extended to a maximum of 5 timeslots (DM5 and DH5 packets) and is then sent by using the same RF channel for the entire packet. Two types of connections are provided - Asynchronous Connectionless Link (ACL) for data and the Synchronous Connection Oriented Link (SCO) for voice. Three 64 kb/s voice channels can be supported simultaneously. Further-
more, there are also packages used for link control purposes. A variety of different packet types with error correction schemes and data rates can be used over the air interface. Also asymmetric communi-
cation is available for high speed communication in one direction. The Baseband provides the link-
setup and control routines for the layers above. Furthermore, the Baseband also provides Bluetooth security like encryption, authentica-
tion and key management. Please refer to the Specification of the Bluetooth System v1.0B part B for in-depth information regarding the Baseband. Firmware (FW) The module includes firmware for the host controller interface, HCI, and the link manager, LM. The FW resides in the Flash and is available in object code format. Link Manager (LM) The Link Manager in each Bluetooth module can communicate with another Link Manager by using the Link Manager Protocol (LMP) which is a peer to peer protocol. The LMP messages have the highest priority and are used for link-setup, security, control and power saving modes. The receiving Link Manager User Payload
(bytes) FEC CRC Symetric Max. rate Asymetric Max.rate Type ID NULL POLL na na na 18 FHS Link control packets na na na 2/3 na na na yes na na na na na na na na Payload Header
(bytes) User Payload
(bytes) FEC CRC Symetric Max. rate
(kb/s) Asymetric Max rate (kb/s) Forward Reverse 0-17 0-27 0-121 0-183 0-224 0-339 0-29 2/3 no 2/3 no 2/3 no no yes yes yes yes yes yes no 108.8 172.8 258.1 390.4 286.7 433.9 185.6 108.8 172.8 387.2 585.6 477.8 723.2 185.6 108.8 172.8 54.4 86.4 36.3 57.6 185.6 Type DM1 DH1 DM3 DH3 DM5 DH5 1 1 2 2 2 2 1 AUX1 ACL packets Type HV1 HV2 HV3 Payload header
(bytes) User Payload
(bytes) na na na 10 20 30 FEC CRC 1/3 2/3 no no no no Symetric Max. rate
(kb/s) 64.0 64.0 64.0 1D DV SCO packets 10+(0-9) D 2/3 D Yes D 64.0+57.6 D Table 1: Link Control Packets Table, ACL Packets Table, SCO packets 12 LM LC RF LMP LM LC RF Physical layer Figure 13. Link manager filter-out the message and does not need to acknowledge the message to the transmitting LM due to the reliable link provided by the Baseband and radio. LM to LM communication can take place without actions taken by the host. Discovery of features at other Bluetooth enabled devices nearby can be found and saved for later use by the host. Please refer to the Specification of the Bluetooth System v1.0B part C for in-depth information regarding the LMP. Host Control Interface (HCI) The HCI provides a uniform com-
mand I/F to the Baseband and Link Manager and also to HW status registers. There are three different types of HCI packets:
HCI command packets from host to Bluetooth module HCI. HCI event packets from Bluetooth module HCI to host. HCI data packets going both ways. It is not necessary to make use of all different commands and events for an application. If the application is aimed at a pre-specified profile, the capabilities of such a profile is necessary to adjust to see Specifi-
cation of the Bluetooth System v1.0B Profiles. a) With the HCI UART Transport Layer on top of HCI, the module will communicate with a host through the UART I/F. The PCM I/
F is also available for communi-
cating voice. b) With the HCI USB Transport Layer on top of the HCI, the module will communicate with a host through the USB. Detach and Wake_up signals are also available for notebook implemen-
tations. Please refer to the Specification of the Bluetooth System v1.0B part H:1-
4 for in-depth information regarding the HCI and different transport layers Module HW Interfaces UART Interface The UART implemented on the module is an industry standard 16C450 and supports the following baud rates: 300, 600, 900, 1200, 1800, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400 and 460800 bits/s. 128 byte FIFOs are associated with the UART. Four signals will be provided for the UART interface. TxD & RxD are used for data flow, and RTS & CTS is used for flow control. Preliminary ROK 101 007 Please refer to the Specification of the Bluetooth System v1.0B part H:4 regarding the HCI and UART trans-
port layers. full functionality of a USB slave and is compliant to the USB 1.1 specifi-
cation. Data transfer occurs on the bi-directional ports, D+ & D-. PCM Voice Interface The standard PCM interface has a sample rate of 8 kHz (PCM_SYNC). The PCM clock is variable between 200 kHz and 2.0MHz. The PCM data can be linear PCM (13-16bit), -Law
(8bit) or A-Law (8bit). The PCM I/F can be either master or slave providing or receiving the PCM_SYNC. Redirection of PCM_OUT and PCM_IN can be accomplished as well. Over the air the encoding is program-
mable to be CVSD, A-Law or -Law. Preferably the robust CVSD encoding should be used. USB Interface The module is a USB high-speed class device (12Mbps) that has the Additionally, there are two side band signals for a notebook application. Two side band signals Wake_up and Detach are used to control the state from which the notebook resumes. When the host is in a power down mode, Wake_up wakes the host up when the Bluetooth system receives an incoming connection. The host indicates that it is in Suspend mode by using the Detach signal. I2C Interface A master I2C I/F is available on the module. The control of the I2C pins are performed by Ericsson specific HCI commands available in the FW implementation see Appendix C. PCM_CLK tPSS PCM_SYNC PCM_X in PCM_X out tPSH tDSL tDSH MSB MSB MSB-1 MSB-2 MSB-3 tPDLP MSB-1 MSB-2 Figure 14. PCM timing Name fpcmClk fpcmSync tCCH tCCL tPSS tPSH tDSL tDSH tPDLP Description PCM data-transfer clock frequency 1 PCM sample rate sync. frequency PCM_CLK high period PCM_CLK low period PCM_SYNC (setup) to PCM CLK (fall) PCM_SYNC pulse length PCM_X in (setup) to PCM_CLK (fall) PCM_X in (hold) from PCM_CLK (fall) PCM_X out valid from PCM_CLK (rise) Min Typ Max 128 2000 8 200 200 100 200 100 100 150 Unit kHz kHz ns ns ns ns ns ns ns Table 2. PCM parameters 13 ROK 101 007 Preliminary Antenna The ANT pin should be connected to a 50-antenna interface, thereby supporting the best signal strength performance. Ericsson Microelec-
tronics can recommend application specific antennas see Appendix C. Power-up Sequence There is no need for a power up sequence if VCC, ON and VCC_IO are tied together. A power up sequence, if used, shall be applied accordingly: Connection of the supply rails, GND and then VCC; then the ON signal should be applied in order to initiate the internal regulators; and finally, the VCC_IO supply rail can be activated. The power-down sequence is similar to the power-up procedure but in the reverse format. Therefore, the disconnection of the signals shall be as follows: VCC_IO, ON,VCC and finally GND. RESET#
The assignment of the RESET# input is to generate a reset signal to the complete Bluetooth module. During power-up the reset signal is set low automatically so that power supply glitches are avoided. Therefore no reset input should be required after power-up. When implementing an external RESET#, the signal should be fed from an open drain output. Power There are three inputs to the Voltage Management section (VCC, VCC_IO, ON). VCC is the supply voltage that is typically 3.3V. A separate power supply rail (VCC_IO) is provided for the I/O ports, UART, PCM and USB. To be compliant with the USB 1.1 specification, VCC_IO >
3.11V. VCC_IO can either be connected to VCC or to a dedicated supply rail, which is the same as the logical interface of the host. 14 Shielding / EMC Requirements The module has its own RF shielding and is approved according to the standards by FCC and ETSI. If the approval number is not visible on the outside when the module is utilized in the final product, an exterior label must state that there is a transmitter module inside the product. Ground Ground should be distributed with very low impedance as a ground plane. Connect all GND pins to the ground plane. Assembly Guidelines Solder Paste The ROK 101 007 module is made for surface mounting and the SSP connection pads have been formed after printing eutectic Tin/Lead solder paste. The solder paste to use is not critical as long as this is a normal eutectic solder paste. A preferred solder paste height is 150m. Soldering Profile It must be noted that the module should not be allowed to be hanging upside down in the re-flow operation. This means that the module has to be assembled on the side of the PCB that is soldered last. The re-flow process should be a regular surface mount soldering profile (full convection strongly preferred); the ramp-up should not be higher than 2oC/s and with a peak temperature of 210-235oC during 20-
60 seconds. Pad Size It is recommended that the pads on the PCB should have a diameter of 0.7-0.9 mm. The surface finish on the PCB pads should be Nickel/Gold or a flat Tin/Lead surface or OSP (Organic Surface Protection). tr td_on td tr_on t td_VCC_IO_o VCC ON VCC_IO Figure 15. Power up sequence td_off tf_on td_VCC_IO_o ff Parameter Min Nom Max Unit tr tr_on tf_on td_on td_off tdvcc_io_on tdvcc_io_off tr td_on td_off Table 3. Power up parameters 1 60 60 ms s s s s s s Placement The placement machine should be able to recognize odd BGA combina-
tions (all ball recognition preferred) and be able to pick the component asymmetrical. The module contains a flat pick-area of 10mm diameter minimum. The weight of the module is typically 2.8gr. Storage Keep the component in its dry pack when not yet using the reel. After removal from the dry pack ensure that the modules are soldered onto the PCB within 48 hours. Marking Every module is marked with the following information on the:
a) Component designation: ROK 101 007. b) Ericssons name and logotype. c) Manufacturing code (place, year, week) and batch number. d) CE logotype e) Type approval RTA no. See manual Ordering Information Package 30 GP 30 SSP Part No. ROK 101 007/1 ROK 101 007/2 Information given in this data sheet is believed to be accurate and reliable. However no responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Microelectronics. These products are sold only according to Ericsson Microelectronics' general conditions of sale, unless otherwise confirmed in writing. Specifications subject to change without notice. Microelectronics Ericsson Microelectronics AB SE-164 81 Kista-Stockholm, Sweden Telephone: +46 8 757 50 00 www.ericsson.com/microe Preliminary ROK 101 007 Packaging All devices will be delivered in a package protecting them from electrostatic discharges and me-
chanical shock. The package will be marked with the following informa-
tion:
a) Delivery address. b) Purchase order-number c) Type of goods and component designation. d) Ericssons name and logotype. e) Date of manufacture and batch number. f) Number of components in the package. Abbreviations ASIC - Application Specific Integrated Circuit BER - Bit Error Rate CMOS - Complementary Metal Oxide Semiconductor
- Carrier to Interference Ratio C/I DCE - Data Circuit terminating Equipment
- Gold Print GP HCI
- Host Controller Interface ISM - Industrial Scientific and Medical
- Point to Point
- Receive PCB - Printed Circuit Board PCM - Pulse Code Modulation PDA - Personal Digital Assistant PtP Rx SIG - Special Interest Group SSP - Screen Solder Print Tx UART - Universal Asynchronous
- Transmit Receiver Transmitter USB - Universal Serial Bus VCO - Voltage Controlled Oscillator 1522-ROK 101 007 Rev. PA5 Ericsson Microelectronics AB, April 2000 15 Principle schematic for UART inter- connect The inter-connection to the level-
shifter when designing a test-board could be according to the schematic below. (Figure A1.) The Bluetooth module can be connected as a DCE/DTE and a modem/nullmodem cable could therefor be used in-between the test-
board and the PC. Setting up a Bluetooth point-to-point connection The Host Controller Interface (HCI) in the module is a command I/F. The host presents commands to the HCI and receives events back from the HCI of the module. The module Link Manager provides link set up capa-
bility to the HCI. paging scan mode listening for a Bluetooth device asking for a new connection Host_A Bluetooth module is set in paging mode asking for a con-
nection to Host_B This is accomplished by first setting up the connection between the Host and the module and thereafter creating the connection between the modules using HCI commands. 100nF Host_B Bluetooth module is set in ROK 101 007 Preliminary APPENDIX A Getting Started The ROK 101 007 Bluetooth module is easy to use when designing a Bluetooth application. However, there is a need for know-how in the Bluetooth System specification v1.0B as well as the Profile specification v1.0B when designing and end-
customer product. Bluetooth module Know-how in Bluetooth specifica-
tion regarding HCI commands Test board with UART/PCM or USB I/F Visual C++ for PC SW design Preferably HCIdriver, L2CAP, RFCOMM and SDP from Ericsson The list above show some parts that would make designing convenient. All information needed, regarding how to drive the HCI over UART is specified in part H4 of the Bluetooth System v1.0B further more part H1 and also Appendix IX with message charts is relevant. Below follow an example of how to set up an ACL link between to Bluetooth modules by using the UART I/F and also a schematic of how to interface the module and control it by a host, normally a PC or microcontroller. VCC RS-232 16 VCC 1 3 4 5
CX V+
CX V-
100nF 100nF 2 6 15 GND The capacitor values are chosen for a VCC from 3.2 to 3.6 V VCC 100nF VCC VCC_IO ON 100nF BLUETOOTH MODULE ROK 101 007 TXD CTS RXD RTS B5 B6 A5 A6 10 11 9 12 7 14 8 13 MAX3232E 2 RXD 8 CTS 3 TXD 7 RTS 9-pin D-sub Figure A1. Bluetooth module connected as a DCE through level shifter Figure A2. Bluetooth host to host communication 16 Preliminary ROK 101 007 Host set-up via UART:
There are 4 different types of HCI-
packets accepted on the UART I/F. HCI packet type HCI command packet HCI ACL data packet HCI SCO data packet HCI event packet Table A1. HCI packets HCI packet indicator 0x01 0x02 0x03 0x04 The HCI packet indicator shall be sent immediately before the HCI packet. When the entire HCI packet has been received a new indicator should be expected. The default speed setting is 57.6 kb/s and can be changed by sending a specified bit stream to the I/F - see Appendix C on how to change the speed setting of the UART. When the speed set-up for the UART is made for both Host_ A & B, the Command Packets can be sent and Event Packets received by the hosts. See HCI over UART in part H:4 of the Bluetooth System v1.0B for detailed information regarding parameters and protocol. Soft Reset First HCI command packet to send should be the RESET packet. A Command_Complete_Event with a status parameter should be returned to the host. Buffer information Buffer information should be ex-
changed between the module and respective host by using HCI com-
mands. Read_Buffer_Size: Providing the host with information on buffer size for ACL and SCO data packets for the module returned with a Command_Complete_Event packet. The host shall use this information for controlling the transmission Host_Buffer_Size: Providing the module with information on buffer size for ACL and SCO packets to the host. It is the host that manages the data buffers of the Host Controller on the module. Timers It could be necessary to set impor-
tant timers used by the module for time out handling. The timers are all set by writing to registers using HCI commands. The default values can be checked in Specification of the Bluetooth System v1.0B part H:1 or by using Read_xxx_xxx commands. Bluetooth Address The hosts, using the HCI command Read_BD_ADDR will find the Bluetooth address of the module by the Command_Complete_Event with the BD_ADDR as a parameter. By Remote_Name_Request, the BD_ADDR of the remote module can also be found. Inquiry The HCI command Inquiry with the parameters LAP, Inquiry_Length, and Num_Responses can also be used for collecting BD_ADDR of remote Bluetooth units. Creating a Point-to-point connection Page Scan mode Command Command parameters HCI_Write_Scan_Enable 0x0005 Scan_Enable OCF Return parameters Status Table A2. HCI Write Scan Enable OCF code To set a Bluetooth module in the mode for being able to connect to
(Host_B), page scan mode, there are some settings that should be per-
formed. The Write_Scan_Enable command with correct parameter
(Scan_Enable=0x001A) will set the module in Page scan mode if the Command_Complete_Event is successful. Furthermore the setting of authenti-
cation and encryption should be disabled (default) by using the:
Write_Authentication_Enable Write_Encryption_Mode The basic settings for getting into scan mode could be according to the below suggested script list. Read Buffer Size Set Event Filter Write Scan Enable: (Scan Enable:
0x03) Write Voice Setting: (Voice Channel Setting: 0x0060) Write Authentication Enable:
(Authentication Enable: 0x00) 17 ROK 101 007 Preliminary Set Event Filter: (Connection Setup Filter: Connections from All Devices, Auto Accept: 0x02) Write Connection Accept Command HCI_Create_Connection 0x0005 BD_ADDR OCF Command parameters Return parameters Packet_Type Packet_Scan_Repetition_Mode Packet_Scan_Mode Clock_Offset Table A3. HCI Create Connection OCF code Timeout: (Connection Accept Timeout: 0x2000) Write Page Timeout: (Page Timeout: 0x3000) Page mode The Create_Connection command is used to set-up a link to another Bluetooth device. Create_Connection:
BD_ADDR: 0xYYYYYYYYYYYY, Packet Type: 0x0007, Page Scan Repetition Mode: 0x01, Page Scan Mode: 0x00, Clock Offset: 0x0000 This command will cause the Link Manager to try to create a connec-
tion to the Bluetooth module with the appropriate BD_ADDR. The local Bluetooth module (Host_A) starts the paging process to set up a link to the page-scanning remote device
(Host_B). By LMP the negotiation between the two Bluetooth modules Link Manag-
ers (LM) the link set-up can be completed. ACL link up and running Host_A is the master of the point-to-
point piconet and Host_B is slave. The unit starting the paging process is by definition the master. The link set-up is completed when the event Connection_Complete_Event is returned to both Host_A and Host_B with the connection handle as one of the parameters and the status parameter 0x00 (success). When Bluetooth link is up and running the HCI data packets can be sent from host to host. The host must take care of generat-
ing the packages going from Host to Host Controller in the module over the UART I/F, in the same way the Host must arrange the packages received from the Host Controller. Both sides need information on what kind of data is received, to be able to interpret the bit flow correctly. For extensive information on setting up a Bluetooth link please refer to Bluetooth System v1.0B Appendix IX Message Sequence Charts Adding an SCO link When creating a voice connection using the PCM I/F, an ACL link must be up and running between the two devices, an SCO link can thereafter be added. The control of the PCM I/F (FS, PCM_IN/OUT and PCM_CLK) is handled by Ericsson specific HCI command see Appendix C. 0 4 8 Connection handle 12 16 20 24 32 Data total length PB BC Flag Flag Data Table A4. ACL data packet 18 Driving SW HCI- API The Bluetooth module includes all HCI command capabilities according to Bluetooth System v1.0B. Further-
more, there is some Ericsson specific commands available for accessing HW registers and HW control see Appendix C. SW for driving the module should be developed for the HCI interface. There is source code SW available with Ericsson Bluetooth Developers Kit (EBDK), see Appendix B, which can be used for driving the module. This SW comes with the EBDK and has an HCI-API for application development on the HCI I/F. Higher layer-API Software (HCIdriver, L2CAP, RFCOMM and SDP) are available in a generic, source code format, i.e. to be adapted to various operating systems. HCIdriver implements the HCI command driver used by the host L2CAP handles protocol multiplexing, segmentation and re-assembly of packets RFCOMM provides a serial port emulation over the L2CAP protocol SDP Service Discovery Protocol provides information on the services available on a Bluetooth device Additional SW for the application shall be developed for the actual application on top of the RFCOMM API. If the application is according to a SIG predefined profile, it should be implemented accordingly. New applications can be the driver of the specification of new profiles decided by the SIG see Specification of the Bluetooth System v1.0B Profiles. APPENDIX B Development tools Ericsson Bluetooth Development Kit (EBDK) The easiest way of getting started is to use the Ericsson Bluetooth Developers Kit. It provides all parts necessary for developing applica-
tions for the Bluetooth module. Available are:
PC plug&play Demos using radio/baseband Macro capability C++ v5.0 Source code for use in applications HCIdriver, L2CAP, SDP and RFCOMM for applications using UART communication Pins for electrical measurements Antennas Development can easily take place on the EBDK platform and thereafter the implementation of the full Bluetooth capability can be setup by developed SW/HW and the Bluetooth module. Software (HCIdriver, L2CAP, RFCOMM and SDP) will be available in source code for PC. HCIdriver implements the HCI command driver used by the host L2CAP handles protocol multiplexing, segmentation and re-assembly of packets RFCOMM provides a serial port emulation over the L2CAP protocol SDP Service Discovery Protocol provides information on the services available on a Bluetooth device Technical support is available from the EBDK distributor. Please contact Ericsson Microelectronics for order-
ing and information regarding the Preliminary ROK 101 007 Radio Board (0dBm) Ericsson Radio Module Radio Board (20dBm) Ericsson Radio Module optional external antenna EBDK USB USB9602 Radio Board Ericsson Radio Module Memory JTAG Memor y Ericsson BaseBand Base Band Board LEDS A udio MS7540 GLUE LOGIC (XLINX) l o r t n o C
a t a D
s s e r d d A i s n p g n i r o t i n o M RS-232 RS-232 RS-232 I2C Application Board Figure B1. Ericsson Bluetooth Development Kit (EBDK) Ericsson Bluetooth Module ROK 101 007/1 EBSK Level-
shift Codec DC/DC RS-232 USB Audio Power Figure B2. Ericsson Bluetooth Starter Kit (EBSK) EBDK and regarding extra daughter board with ROK 101 007 as add-on to the EBDK. Ericsson Bluetooth Starter Kit (EBSK) A very small convenient kit, which preferably is used in point-to-
multipoint configuration designs, based on the Bluetooth module ROK 101 007. Please contact Ericsson Microelec-
tronics for ordering and information regarding the Ericsson Bluetooth Starter Kit. 19 ROK 101 007 Preliminary APPENDIX C Bluetooth Information This part will be updated and new information will be added continu-
ously. Radio Fast Frequency hopping (1600chan-
nel hop/s) with 79(23) channels available (2.402 to 2.480 GHz) and a symbol rate of 1Ms/s over the air exploits the maximum channel bandwidth in the unlicensed ISM band. To sustain a high transfer rate in busy radio environment, the frequency hopping together with advanced coding techniques maximizes the throughput. During Page and Inquiry the hopping frequency is risen to 3200 hops/s to enhance the time needed for connec-
tion set-up. Modulation technique is a binary Gaussian Frequency Shift Keying GFSK, with a BT product of 0.5. The channel bandwidth is 1 MHz and the frequency deviation from the carrier frequency of the RF channel is between +/-140 to +/-175 kHz for representing a 1/0. 20 Country Europe & USA Japan Spain France RF channels Frequency range f = 2402 + k MHz 2400-2483.5 MHz f = 2473 + k MHz 2471-2497 MHz 2445-2475 MHz f = 2449 + k MHz 2446.5-2483.5 MHz f = 2454 + k MHz k = 0....78 k = 0....22 k = 0....22 k = 0....22 Table C1. Frequency ranges used. A rapid process is ongoing to harmonise Spanish, French and Japanese frequency ranges with the rest of the world. Data and parameter formats There are exceptions in the Bluetooth system for data and parameter formats general rules below. All values are in Binary and Hexadecimal little Endian formats Negative values must use 2s complement format Array parameter notation is parameterA[i], parameterB[i], All parameter values are sent/received in little Endian format. The least signifi-
cant byte is sent first unless noted otherwise. HCI Opcodes The Opcodes have been changed during the ongoing standardisation work. Below is the description on how to send opcodes to the module. Below is the general HCI command Little Endian 0@
4@
8@
12@
16@
20@
24@
28@
31 OpCode lsb OCF msb lsb OGF msb Parameter Total length OpCode Command Field 10 bits OpCode Group Field 6 bits Amount of parameters in bytes OGFRange (6 bits): 0x00-0x3F 0x3E: Bluetooth logo testing 0x3F: Vendor specific debug commands OCFRange (10 bits): 0x0000-0x03FF HCI_Inquiry_Cancel (Example):
LINK CONTROL COMMAND OGF: 0x01 bin: 0000 0001 lsb msb OCF: 0x0002 bin: 0000 0000 0000 0010 lsb msb Real code bin: 0000 01 | 00 0000 0010 msb lsb 0 x 0 4 0 2 Sent to module in hex: 02 04 00 Zero parameters Reverse byte order Figure C1. Byte order sent to module Preliminary ROK 101 007 packet format depicted as well as a byte order description. UART speed setting The baud rate is changed with an Ericsson specific HCI command. HCI_Ericsson_Set_Uart_Baud_Rate The command has one parameter, baud rate - one byte long according to the table below . The op-code for the command is 0xfc07 - the last figure is due to a possible change. Sending the command should be performed accordingly: 07 fc 01 yz , where yz is the chosen baud rate from the table. The op-code is sent in reverse byte order. 01 is the parameter length, in this case one byte. Remember to add the HCI packet indicator. Observe - When changing the baud rate for the module the host also has to change the baud rate. Observe - Removing power to the module the baud rate will be reset to 57.6 kbps. Observe -Two zeros are not printed in the beginning of the binary param-
eters below. The length of the parameter is 1 byte. Ericsson specific HCI commands By using the Ericsson specific HCI command there are a number of features available for the application design. UART speed Parameter to send 460.8 kbps 230.4 kbps 115.2 kbps 57.6 kbps 28.8 kbps 14.4 kbps 7200 bps 3600 bps 1800 bps 900 bps 153.6 kbps 76.8 kbps 38.4 kbps 19.2 kbps 9600 bps 4800 bps 2400 bps 1200 bps 600 bps 300 bps 00000 00001 00010 00011 00100 00101 00110 00111 01000 01001 10000 10001 10010 10011 10100 10101 10110 10111 11000 11001 Table C2. UART speed setting parameter Contact Ericsson Microelectronics for a command reference list. Antennas Antenna design is not specified and standardised in the Bluetooth System v1.0B. Many different types of antennas can and will be used. Application specific antennas suitable for production are expected to be a new market for antenna designs. Ericsson Microelectronics have antennas for the EBDK and other development kits. Contact Ericsson Microelectronics for information on antennas. Contacting Ericsson Microelectronics For further information regarding Bluetooth technology, components and development tools, please contact Ericsson Microelectronics:
Telephone:
+46 8 757 47 00 Scandinavia:
Europe:
+44 1793 488 300 North America: +1 877 374 26 42 Rest of World: +46 8 757 47 00 www.ericsson.se/microe 21