BT-MSOIII Bluetooth V5.0 Class1 Data Module Approval Sheet
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Bluetooth Module Customer MODEL BnCOM MODEL BT-MSOIII BPM610 History VERSION DATE 1.0 2019-11-27 DESCRIPTION Initial Release Revision 1.0 (NOV,2019) 1 BT-MSOIII Bluetooth V5.0 Class1 Data Module BT-MSOIII Specification Revision 1.0 2019/11/27 CONFIDENTIALINFORMATION BnCOM Co.,Ltd. Revision 1.0 (NOV,2019) 2 BT-MSOIII Bluetooth V5.0 Class1 Data Module List of Contents 1. General ...................................................................................................... 5 1.1 Overview ....................................................................................................................................... 5 1.2 Features ........................................................................................................................................ 6 1.3 Application .................................................................................................................................... 6 1.4 Pin Configuration .......................................................................................................................... 7 1.5 Device Terminal Functions ............................................................................................................ 8 1.6 Package Dimensions & Land Pattern ............................................................................................ 9 2. Characteristics ......................................................................................... 11 2.1 Electrical Characteristics ............................................................................................................. 11 2.2 RF Characteristics ........................................................................................................................ 12 2.3 Antenna Characteristics .............................................................................................................. 13 3. Terminal Description ................................................................................ 14 3.1 UART Interface ............................................................................................................................ 14 3.1.1 Configuration list ................................................................................................................................ 14 4. Design Guide ............................................................................................ 15 4.1 ANT Placement Guide ................................................................................................................. 15 6. Package Information ................................................................................ 17 7. Certification note. ................................................................................... 18 7.1 FCC/IC .......................................................................................................................................... 18 Revision 1.0 (NOV,2019) 3 BT-MSOIII Bluetooth V5.0 Class1 Data Module OEM/integrators Installation Manual the modules limited to OEM installation only the OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Instructions to the OEM/integrator The OEM integrator must include the instructions or statements required by part 15.19 and 15.21 in the user manual. the OEM integrator must include a separate section in the host user's manual concerning the operating conditions to satisfy RF exposure compliance. there is requirement that the grantee provide guidance to the host manufacturer for compliance with part 15b requirements. Revision 1.0 (NOV,2019) 4 BT-MSOIII Bluetooth V5.0 Class1 Data Module 1. General 1.1 Overview This specification covers Bluetooth module which complies with Bluetooth specification version5.0 and integrates RF & Baseband controller in small package. This Module has deployed Airoha AB1122 chipset. All detailed specification including pin outs and electrical specification may be changed without notice. Revision 1.0 (NOV,2019) 5 1.2 Features BT-MSOIII Bluetooth V5.0 Class1 Data Module Bluetooth v5.0 (Dual mode) specification compliant Radio includes integrated balun and typical RF performance of 8dBm transmit power and -94 dBm receive sensitivity Embedded 80251 MCU with 12/24MHz clock rate Embedded 4Mbit Flash Serial interfaces: UART 4 general purpose PIOs Competitive Size: 28mm x 18mm x 2.8mm : 44Pin Operating temperature range (MAX -30 ~ 85) 1.3 Application Mobile Payment POS System Revision 1.0 (NOV,2019) 6 1.4 Pin Configuration BT-MSOIII Bluetooth V5.0 Class1 Data Module Pin Configuration (TOP VIEW) Revision 1.0 (NOV,2019) 7 181920212223242526272846345678910111213141516174544434241403938373635343332313029GNDGNDGNDGNDNCnRESETBT_STATUSNCNC3.3V3.3VGNDGNDGNDNCTXDnCTSRXDNCNCRTS_CTLAT_CMDNCBT_DUTNCNCGNDGNDNCNCGND NC DEBUG_RXGNDDEBUG_ENDEBUG_TX NC NCNCGNDGNDGNDNCMODE_SEL 1.5 Device Terminal Functions BT-MSOIII Bluetooth V5.0 Class1 Data Module Revision 1.0 (NOV,2019) 8 Pin NamePin No.Pin typeDescriptionNoteMODE_SEL10Firmware Mode SelectBT_DUT27BT DUTBT_STATUS9BT_STATUSAT_CMD25AT CommandRTS_CTL24RTS ControlRXD21UART Data InputTXD19UART Data OutputnCTS20UART Clear to Send Active LowDEBUG_RX37Debug Line InputDEBUG_TX34Debug Line OutputDEBUG_EN35Debug Mode Enable, Active Low3.3V13,14Positive Power SupplynRESET8Input, Stong Pull UpResetUART_TXSDAFunctionBAT_PRST_NPIO[5]PIO[14]PIO[4]OtherPinsPIO[24]BidirectionWeak Pull DownUARTInterfaceGND3,4,5,6,15,16,17,29,36,39,42,43,45,46UART_TXPIO[12]Bideirection,Weak Pull DownPIOPIO[7]NCNCNot ConnectUART_RX7,11,12,18,22,23,26,28,30,31,32,33,38,40,41,44GroundGROUNDDebugInterfaceUART_RXBidirectionWeak Pull Down BT-MSOIII Bluetooth V5.0 Class1 Data Module 1.6 Package Dimensions & Land Pattern unit = mm General Tolerances = 0.2mm BT-MSOIII Dimensions Revision 1.0 (NOV,2019) 9 28.0018.000.900.500.151.301.951.355.1528.001.001.201.500.900.502.351.550.152.80 BT-MSOIII Bluetooth V5.0 Class1 Data Module Land Pattern Revision 1.0 (NOV,2019) 10 0.151.350.4018.0028.00ANTENNA AREA1.350.502.351.551.955.560.9015.801.300.500.901.700.15 2. Characteristics 2.1 Electrical Characteristics Absolute Maximum Ratings Rating Storage Temperature range VDD Recommended Operating Conditions Operating Condition Operating Temperature range VDD Current consumption Classic (Test Condition : VDD =3.3V, Temp = 25C) Standby current Connected current TX current with UART RX current with UART UART baud rate = 230,400bps Digital Terminals Input Voltage Levels VIL input logic level low VIH input logic level high Output Voltage Levels VOL output logic level low, lOL = 4.0mA VOH output logic level high, lOH = -4.0mA BT-MSOIII Bluetooth V5.0 Class1 Data Module Min
-40
-0.3 Max 85 4.4 Unit C V Min
-30 2.7
Min 0 0.7 x VDD Min
VDD-0.4 Typ 20 3.3 Avr 9.2 7.8 13 11 Typ
Typ
Max 85 3.6 Unit C V Peak
Max 0.3xVDD VDD+0.4 Max 0.4
Unit mA mA mA mA Unit V V Unit V V Revision 1.0 (NOV,2019) 11 2.2 RF Characteristics BT-MSOIII Bluetooth V5.0 Class1 Data Module Revision 1.0 (NOV,2019) 12 RF SpecificationConditionMin TypMaxUnit2.402-8.86-dB2.441-9.24-dB2.480-8.25-dBTransmit power density--6.29-dBmPmin-25.79-7.75dBmPst3.884.81-dBFrequency Range2401.515-2480.485Mhz20dB bandwidth for modulation-925-Khz2MHz--22.4-dBm3MHz--48.09-dBm4Mhz--48.79-dBmf1avg-165-Khzf2_pass_rate-100-%f2avg/f1avg-0.93-Intial carrier frequency tolerancedf0_avg--13.7-KhzOne slot packet(DH1)--4.7-KHzThree slot packet(DH3)--6.4-KHzFive slot packet(DH5)--6.4-KHz2.402--84.6-dBm2.441--86.9-dBm2.480--86.9-dBmMaximum input level-20-5-dBmReceiverSensitivity at 0.1% BER for allbasic rate packet typesTransmitterOutput transmit powerTransmit power controlAdjacent channel transmit powerModulation characteristicsCarrier frequency drift 2.3 Antenna Characteristics BT-MSOIII Bluetooth V5.0 Class1 Data Module The antenna is monopole type of chip antenna. The antenna impedance matching is optimized for 1 mm ~ 2 mm mother board PCB thickness. The radiation pattern is impacted by the layout of the mother board. Typically the highest gain is towards GND plane and weakest gain away from the GND plane. LOG, Smith Chart & VSWR Radiation Gain Frequency [Mhz]
Efficiency [%]
Average Gain [dBi]
Peak Gain [dBi]
2,400 2420 2,450 2,500 52.15 58.58 57.85 53.68
-2.83
-2.32
-2.38
-2.7 3.06 3.36 2.75 1.64 Revision 1.0 (NOV,2019) 13 BT-MSOIII Bluetooth V5.0 Class1 Data Module 3. Terminal Description 3.1 UART Interface This is a standard UART interface for communicating with other serial devices. BT-MSOIII UART interface provides a simple mechanism for communicating with other serial devices using the RS-232 protocol. When BT-MSOIII is connected to another digital device, UART_RX and UART_TX transfer data between the 2 devices. The remaining 2 signals, UART_CTS and UART_RTS, implement optional RS232 hardware flow control where both are active low indicators 3.1.1 Configuration list Configuration Parameters Data Length Flow Control Parity Number of stop bits Baud rate Supported Values 8bit Hardware RTS/CTS None Even Odd None 1 or 2 1200 2400 4800 9600 19200 38400 57600 76800 115200 230400 460800 921600 1843200 Revision 1.0 (NOV,2019) 14 4. Design Guide 4.1 ANT Placement Guide BT-MSOIII Bluetooth V5.0 Class1 Data Module For antenna radiation, place the ANT area of the module on the outside of PCB Or apply a Copper Keepout Area as shown. Revision 1.0 (NOV,2019) 15 5. Solder Profile BT-MSOIII Bluetooth V5.0 Class1 Data Module The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder re-flow. There are four zones:
1. Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5C/s. 2. Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the flux. The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimise the out gassing of the flux. 3. Reflow Zone - The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. 4. Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give a longer lasting joint. Typical rates will be 2-5C/s. Typical Reflow Solder Profile Key features of the profile:
- Initial ramp = 1-2.5C/sec to 175C 25C equilibrium
- Equilibrium time = 60 to 180 seconds
- Ramp to maximum temperature (245C) = 3C/sec max.
- Time above liquidus temperature (217C): 45-90 seconds
- Device absolute maximum reflow temperature: 260C Devices will withstand the specified profile. Revision 1.0 (NOV,2019) 16 6. Package Information BT-MSOIII Bluetooth V5.0 Class1 Data Module Revision 1.0 (NOV,2019) 17 7. Certification note. 7.1 FCC/IC BT-MSOIII Bluetooth V5.0 Class1 Data Module FCC Information to User This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. Caution THE GRANTEE IS NOT RESPONSIBLE FOR ANY CHANGES OR MODIFICATIONS NOT EXPRESSLY APPROVED BY THE PARTY RESPONSIBLE FOR COMPLIANCE. SUCH MODIFICATIONS COULD VOID THE USERS AUTHORITY TO OPERATE THE EQUIPMENT. Exposure to Radio Frequency Radiation. To comply with FCC RF exposure compliance requirements, a separation distance of at least 20 cm must be maintained between the antenna of this device and all persons. Any Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment. Attention: Tout changement ou modification non expressment approuv par le fabricant peut annuler le droit de l'utilisateur utiliser l'quipement. IMPORTANT NOTE : FCC RF Radiation Exposure Statement This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Revision 1.0 (NOV,2019) 18 BT-MSOIII Bluetooth V5.0 Class1 Data Module IC Information to User This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:
(1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
(1) lappareil ne doit pas produire de brouillage, et
(2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. This Bluetooth module has been granted modular approval for mobile applications. OEM integrators for host products may use the module in their final products without additional FCC / IC (Industry Canada) certification if they meet the following conditions. Otherwise, additional FCC / IC approvals must be obtained. The host product with the module installed must be evaluated for simultaneous transmission requirements. The users manual for the host product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC / IC RF exposure guidelines. To comply with FCC / IC regulations limiting both maximum RF output power and human exposure to RF radiation, use this module only with the included onboard antenna. A label must be affixed to the outside of the host product with the following statements:
Product Name : Bluetooth Module (Appliance Service Tool) Contains FCC ID: 2AKMF-BT-MSOIII Contains IC: 22266-BTMSOIII The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. Revision 1.0 (NOV,2019) 19