PRODUCT SPECIFICATION 6252B-SR Wi-Fi Dual-band 2x2 11ax + Bluetooth 5.2 Combo Module Version:v1.2 FN-LINK TECHNOLOGY LIMITED 1 6252B-SR Module Datasheet Ordering Information Part NO. Description FG6252BSRX-01 T, 3 Antenna ,no shielding RTL8852BS
,a/b/g/n/ac/ax,Wi-Fi+BT5.2,2T2R,SDIO+UAR Customer:
Customer P/N:
Signature:
Date:
Office: 14th floor, Block B, phoenix zhigu, Xixiang Street, Baoan District, Shenzhen Factory: NO.8, Litong RD., Liuyang Economic & Technical Development Zone, Changsha, CHINA TEL:+86-755-2955-8186 Website:www.fn-link.com FN-LINK TECHNOLOGY LIMITED 2 6252B-SR CONTENTS 1. General Description.............................................................................................................. 5 1.1 Introduction......................................................................................................................... 5 1.2 Description.......................................................................................................................... 5 2. Features....................................................................................................................................6 3. Block Diagram........................................................................................................................ 7 4. General Specification........................................................................................................... 8 4.1 WI-FI 2.4GHz Specification.............................................................................................. 8 4.2 WI-FI 5GHz Specification................................................................................................. 9 4.3 Bluetooth Specification....................................................................................................11 5. ID setting information......................................................................................................... 11 6. Pin Definition........................................................................................................................ 12 6.1 Pin Outline........................................................................................................................ 12 6.2 Pin Definition details........................................................................................................12 7. Electrical Specifications.................................................................................................... 14 7.1 Power Supply DC Characteristics.................................................................................14 7.2 Interface Circuit time series........................................................................................... 15 7.2.1 Power on sequence................................................................................................... 15 7.2.2 SDIO Pin Description...............................................................................................15 7.2.3 SDIO Default Mode Timing Diagram......................................................................16 7.2.4 SDIO High Speed Mode Timing Diagram............................................................... 17 7.2.5 SDIO Bus Timing Specifications in SDR Modes.................................................... 18 7.2.6 SDIO Bus Timing Specifications in DDR50 Mode................................................. 21 8. Size reference....................................................................................................................... 22 8.1 Module Picture................................................................................................................. 22 8.2 Marking Description.........................................................................................................23 8.3 Physical Dimensions....................................................................................................... 23 8.4 Layout Recommendation............................................................................................... 24 9. The Key Material List.......................................................................................................... 24 10. Reference Design.............................................................................................................. 25 11. Recommended Reflow Profile....................................................................................... 26 12. Package................................................................................................................................27 12.1 Reel................................................................................................................................. 27 12.2 Carrier Tape Detail........................................................................................................ 27 12.3 Packaging Detail............................................................................................................28 13. Moisture sensitivity...........................................................................................................28 FN-LINK TECHNOLOGY LIMITED 3 6252B-SR Revision History Version Date Contents of Revision Change Preparde Checked Approved V1.0 2021/08/27 Initial Release V1.1 V1.2 2021/7/30 Modify DBDC to DBSC 2021/11/5 Update the specification format FC FC FC Lgp LXY LXY Szs QJP QJP FN-LINK TECHNOLOGY LIMITED 4 6252B-SR 1. General Description 1.1 Introduction Fn-Link Technology would like to announce a low-cost and low-power consumption module which has all of the Wi-Fi functionalities.It is a highly-integrated IEEE 802.11 a/b/g/n/ac/ax MAC/Baseband/RF WLAN single chip.For Wireless LAN operation. The integrated module provides SDIO interface for Wi-Fi.The module provides simple legacy and 20MHz/40MHz/80MHz co-existence mechanism to ensure backward and network compatibility. The wireless module complies with IEEE 802.11 a/b/g/n/ac/ax 2x2 MIMO standard and the speed can achieve up to 1201Mbps with dual stream in 802.11ax. The integrated module provides SDIO interface for Wi-Fi, UART / PCM interface for Bluetooth. This combo module is a total solution for a combination of Wi-Fi and Bluetooth V5.2 technologies. The module is specifically developed for all portable devices. 1.2 Description Model Name 6252B-SR Product Description Support Wi-Fi/Bluetooth functionalities Dimension Wi-Fi Interface BT Interface OS supported L x W x H: 15 x 13 x1.8 mm Support SDIO V1.0/V2.0/V3.0 UART / PCM Android /Linux/iOS /WIN10 Operating temperature 0C to 70C Storage temperature
-40C to 85C FN-LINK TECHNOLOGY LIMITED 5 6252B-SR 2. Features General Highly integrated wireless local area network (WLAN) system-on-chip (SOC) for 802.11a/b/g/n/ac/ax WLAN applications Supports Dual band Single concurrent (2.4G/5G). PHY Features Dual-stream spatial multiplexing up to 1201 Mbps data rate. Supports 20/40MHz at 2.4GHz and supports 20/40/80MHz at 5GHz Supports Transmit Beamforming Host Interface Supports low power SDIO3.0(complies with SDIO 1.1/2.0) interface for WLAN and UART/PCM interface for Bluetooth. Bluetooth Features Supports Bluetooth system (BT5.2 Logo Compliant) Supports WLAN/Bluetooth coexistence Compatible with Bluetooth v2.1+EDR. Dual Mode support: Simultaneous LE and BR/EDR BT host digital interface:
- HCI UART
PCM for audio data FN-LINK TECHNOLOGY LIMITED 6 3. Block Diagram 6252B-SR
--- 3 antenna version FN-LINK TECHNOLOGY LIMITED 7 6252B-SR 4. General Specification 4.1 WI-FI 2.4GHz Specification Feature WLAN Standard Frequency Range Description IEEE 802.11 b/g/n/ac/ax Wi-Fi compliant 2.412 GHz ~ 2.462 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHzCh1 ~ Ch11 Test Items Typical Value Output Power1 802.11ac vHT20 MCS8: 20dBm 2 dB 802.11b /11Mbps : 22dBm 2 dB 802.11g /54Mbps : 20dBm 2 dB 802.11n /MCS7
: 22dBm 2 dB 802.11ac vHT40 MCS9: 20dBm 2 dB 802.11ax HE20 MCS11: 20dBm 2 dB 802.11ax HE40 MCS11: 19dBm 2 dB Meet with IEEE standard EVM EVM -10dB EVM -25dB EVM -28dB EVM -30dB EVM -32dB EVM -35dB EVM -35dB Spectrum Mask Freq. Tolerance SISO Receive Sensitivity
(11b,20MHz) @8% PER SISO Receive Sensitivity
(11g,20MHz) @10% PER 20ppm
1Mbps 11Mbps 6Mbps 54Mbps PER @ -94 dBm PER @ -85 dBm PER @ -90 dBm PER @ -71 dBm SISO Receive Sensitivity
- MCS=0 PER @ -90 dBm
(11n,20MHz) @10% PER
- MCS=7 PER @ -69 dBm SISO Receive Sensitivity
- MCS=0 PER @ -87 dBm
(11n,40MHz) @10% PER
- MCS=7 PER @ -66 dBm SISO Receive Sensitivity
- MCS=0 PER @ -90 dBm
(11ac,20MHz) @10% PER
- MCS=8 PER @ -66 dBm SISO Receive Sensitivity
- MCS=0 PER @ -87 dBm
(11ac ,40MHz) @10% PER
- MCS=9 PER @ -59 dBm SISO Receive Sensitivity
- MCS=0 PER @ -90 dBm
(11ax,20MHz) @10% PER
- MCS=11 PER @ -60 dBm SISO Receive Sensitivity
- MCS=0 PER @ -87 dBm
(11ax ,40MHz) @10% PER
- MCS=11 PER @ -57 dBm Maximum Input Level 802.11b : -10 dBm 802.11g/n : -20 dBm Antenna Reference Small antennas with 0~2.98 dBi peak gain FN-LINK TECHNOLOGY LIMITED 8
-83
-76
-85
-68
-85
-67
-82
-64
-82
-60
-79
-55
-74
-52
-71
-49 4.2 WI-FI 5GHz Specification 6252B-SR Feature WLAN Standard Frequency Range Test Items Output Power1 Description IEEE 802.11a/n/ac/ax, Wi-Fi compliant 5.15 GHz ~ 5.850 GHz(5.0 GHz ISM Band) Typical Value 802.11a /54Mbps:
14 dBm 2 dB 802.11n /MCS7:
13 dBm 2 dB 802.11ac vHT20 MCS8: 12 dBm 2 dB 802.11ac vHT40 MCS9: 13 dBm 2 dB 802.11ac vHT80 MCS9: 12 dBm 2 dB 802.11ax HE20 MCS11: 10 dBm 2 dB 802.11ax HE40 MCS11: 11 dBm 2 dB 802.11ax HE80 MCS11: 10 dBm 2 dB Meet with IEEE standard EVM EVM -25dB EVM -28dB EVM -30dB EVM -32dB EVM -32dB EVM -35dB EVM -35dB EVM -35dB Spectrum Mask Freq. Tolerance SISO Receive Sensitivity
(11a,20MHz) @10% PER 20ppm
6Mbps 54Mbps PER @ -90 dBm PER @ -71 dBm SISO Receive Sensitivity
- MCS=0 PER @ -90 dBm
(11n,20MHz) @10% PER
- MCS=7 PER @ -69 dBm SISO Receive Sensitivity
- MCS=0 PER @ -87 dBm
(11n,40MHz) @10% PER
- MCS=7 PER @ -66 dBm SISO Receive Sensitivity
- MCS=0, NSS1 PER @ -90 dBm
(11ac,20MHz) @10% PER
- MCS=8, NSS1 PER @ -66 dBm SISO Receive Sensitivity
- MCS=0, NSS1 PER @ -87 dBm
(11ac ,40MHz) @10% PER
- MCS=9, NSS1 PER @ -59 dBm SISO Receive Sensitivity
- MCS=0, NSS1 PER @ -84 dBm
(11ac,80MHz) @10% PER
- MCS=9, NSS1 PER @ -56 dBm SISO Receive Sensitivity
- MCS=0 PER @ -90 dBm
(11ax,20MHz) @10% PER
- MCS=11 PER @ -60 dBm SISO Receive Sensitivity
- MCS=0 PER @ -87 dBm
(11ax ,40MHz) @10% PER
- MCS=11 PER @ -57 dBm SISO Receive Sensitivity
- MCS=0 PER @ -84 dBm
(11ax,80MHz) @10% PER
- MCS=11 PER @ -54 dBm Maximum Input Level 802.11a/n: -30 dBm
-85
-68
-85
-67
-82
-64
-82
-60
-79
-55
-79
-54
-74
-52
-71
-49
-68
-46 Antenna Reference Small antennas with 0~4.56 dBi peak gain 2. 2.4G,5G output power control by firmware power by rate table, the table value must same with module target power FN-LINK TECHNOLOGY LIMITED 9 6252B-SR 15GHz(20MHz) Channel table Band range Operating Channel Numbers Channel center frequencies(MHz) 5180MHz~5240MHz 5260MHz~5320MHz 5550MHz~5700MHz 5745MHz~5825MHz 36 40 44 48 52 56 60 64 100 104 108 112 116 132 136 140 149 153 157 161 165 Note: The Wi-Fi RF specification data will be updated in future version. 5180 5200 5220 5240 5260 5280 5300 5320 5500 5520 5540 5560 5580 5660 5680 5700 5745 5765 5785 5805 5825 FN-LINK TECHNOLOGY LIMITED 10 6252B-SR 4.3 Bluetooth Specification Feature Description General Specification Bluetooth Standard Bluetooth V5.2. Host Interface UART Antenna Reference Small antennas with 0~2.98dBi peak gain Frequency Band 2402 MHz ~ 2480 MHz Number of Channels 79 channels GFSK, /4-DQPSK, 8-DPSK Modulation RF Specification Output Power (Class 1) Sensitivity @ BER=0.1%
for GFSK (1Mbps) Sensitivity @ BER=0.01%
for /4-DQPSK (2Mbps) Sensitivity @ BER=0.01%
for 8DPSK (3Mbps) Min(dBm) Typical(dBm) Max(dBm)
-0.468 1.202 2.872
-92
-86
-85 Maximum Input Level
/4-DQPSK (2Mbps) :-20dBm GFSK (1Mbps):-20dBm 8DPSK (3Mbps) :-20dBm Note: The Bluetooth Specification will be updated in future version. 5. ID setting information WI-FI Vendor ID Product ID TBD TBD FN-LINK TECHNOLOGY LIMITED 11 6252B-SR 6. Pin Definition 6.1 Pin Outline
< TOP VIEW >
6.2 Pin Definition details NO. Name Type Description Voltage FN-LINK TECHNOLOGY LIMITED 12 6252B-SR RF I/O port chain1, dual band Wi-Fi and BT for RF I/O port chain0, dual band Wi-Fi Reserved for BT RF I/O port, used only in 3 ANT 15 SD_RESET I ON: pull high; OFF: pull low Ground connections 2ant type) Ground connections Ground connections Ground connections Ground connections Ground connections Ground connections Ground connections Ground connections version Ground connections GPIO5. G_BT If not used keep NC. Do not connect to GND. Reset Pin for SDIO interface Low for disable SDIO interface GPIO10. WLAN to wake-up HOST SDIO command line SDIO clock line SDIO data line 3 SDIO data line 2 SDIO data line 0 SDIO data line 1 Ground connections No connect No connect No connect GND ANT1 GND GND GND GND GND GND ANT0 GND GND 1 2 3 4 5 6 7 8 9 10 11 17 18 19 20 21 22 23 24 25 26 27 28 29 30 12 NC or BT_TRX 13 GND 14 G_BT 16 WL_WAKE_HOST SDIO_CMD SDIO_ CLK SDIO_DATA3 SDIO_DATA2 SDIO_DATA0 SDIO_DATA1 GND NC NC NC PCM_IN PCM_OUT PCM_CLK I/O I/O I/O O I/O I/O I/O I/O I/O I/O I O PCM_SYNC I/O PCM sync signal PCM data input PCM Data output I/O PCM clock FN-LINK TECHNOLOGY LIMITED 13 VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO 31 SUSCLK External Low Power Clock input (32.768KHz) 6252B-SR I/O Voltage supply input 1.8V or 3.3V 1.8V or3.3V Main power voltage source input 3.3V 3.3V 38 BT_DIS_N I ON: pull high; OFF: pull low VDDIO GND NC VDDIO NC NC VCC33 GND UART_TXD UART_RXD UART_RTS UART_CTS 45 G_WL GND NC GND 32 33 34 35 36 37 39 40 41 42 43 46 47 48 49 50 If not used keep NC Ground connections No connect No connect No connect Enable pin for Bluetooth device External pull low to shut down BT Ground connections Bluetooth UART interface Bluetooth UART interface Bluetooth UART interface Bluetooth UART interface Enable pin for WLAN Radio GPIO4, G_WL If not used keep NC. Do not pull high on this pin. Ground connections No connect Ground connections I P P O O I I I O 44 WL_DIS_N ON: pull high; OFF: pull low External pull low to disable WLAN Radio VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO HOST_WAKE_BT HOST wake-up Bluetooth device BT_WAKE_HOST Bluetooth device to wake-up HOST P:POWER I:INPUT O:OUTPUT VDDIO:3.3V 7. Electrical Specifications 7.1 Power Supply DC Characteristics Operating Temperature 0 25 70 deg.C Min. Typ. Max. Unit FN-LINK TECHNOLOGY LIMITED 14 VCC33 VDDIO (3.3V) VDDIO (1.8V) 3.15
1.68 3.3 3.3 1.8 3.45 3.6 1.98 V V V 6252B-SR 7.2 Interface Circuit time series 7.2.1 Power on sequence 7.2.2 SDIO Pin Description The module supports SDIO version 3.0 for all 1.8V 4-bit UHSI speeds: SDR50(100 Mbps), SDR104(208MHz) and DDR50(50MHz, dual rates) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This out-of-band FN-LINK TECHNOLOGY LIMITED 15 interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided. 6252B-SR SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK Clock CMD Command Line 7.2.3 SDIO Default Mode Timing Diagram Parameter Symbol Minimum Typical Maximum Unit SDIO CLK(All values are referred to minimum VIH and maximum VILb) Frequency - Data Transfer mode Frequency - Identification mode Clock low time Clock high time Clock rise time Clock low time Input setup time Input hold time Inputs:CMD, DAT(referenced to CLK) fPP fOD tWL tWH tTLH tTHL tISU tIH 0 0 10 10
5 5
25 400 10 10
MHz kHz ns ns ns ns ns ns FN-LINK TECHNOLOGY LIMITED 16 Outputs:CMD, DAT(referenced to CLK) Output delay time - Data Transfer mode tODLY Output delay time - Identification mode tODLY 0 0
14 50 ns ns a. Timing is based on CL 40 pF load on CMD and Data. b. Min(Vih) = 0.7 VDDIO and max(Vil) = 0.2 VDDIO. 6252B-SR 7.2.4 SDIO High Speed Mode Timing Diagram Parameter Symbol Minimum Typical Maximum Unit SDIO CLK(all values are referred to minimum VIH and maximum VILb) Frequency - Data Transfer mode Frequency - Identification mode Clock low time Clock high time Clock rise time Clock low time Input setup time Input hold time Inputs:CMD, DAT(referenced to CLK) fPP fOD tWL tWH tTLH tTHL tISU tIH 0 0 7 7
6 2
Outputs:CMD, DAT(referenced to CLK) Output delay time - Data Transfer mode tODLY Output delay time - Identification mode tODLY 2.5 FN-LINK TECHNOLOGY LIMITED 17
50 400
3 3
14 MHz kHz ns ns ns ns ns ns ns ns Total system capacitance(each line) CL
40 pF a. Timing is based on CL 40 pF load on CMD and Data. b. Min(Vih) = 0.7 VDDIO and max(Vil) = 0.2 VDDIO. 6252B-SR 7.2.5 SDIO Bus Timing Specifications in SDR Modes Clock timing (SDR Modes) Parametwer Symbol Minimum Maximum Unit Comments
tCLK 40 20 10 4.8
tCR, tCF 0.2 tCLK tCR, tCF < 2.00 ns (max)@100 MHz, ns ns ns ns ns SDR12 mode SDR25 mode SDR50 mode SDR104 mode CCARD = 10 pF CCARD = 10 pF tCR, tCF < 0.96 ns (max)@208 MHz, Clock duty
30 70
Card Input timing (SDR Modes) FN-LINK TECHNOLOGY LIMITED 18 6252B-SR Symbol Minimum Maximum Unit Comments SDR104 Mode SDR50 Mode tIS tIH tIS tIH 1.70a 0.80 3.00 0.80
a. SDIO 3.0 specification value is 1.40 ns. ns ns ns ns CCARD = 10pF, VCT = 0.975V CCARD = 5pF, VCT = 0.975V CCARD = 10pF, VCT = 0.975V CCARD = 5pF, VCT = 0.975V Card output timing (SDR Modes up to 100MHz) Symbol Minimum Maximum Unit Comments FN-LINK TECHNOLOGY LIMITED 19
1.5 tODLY tODLY tOH a. SDIO 3.0 specification value is 7.5 ns. 7.85a 14.0
ns ns ns tCLK10 ns CL=30 pF using driver type B for SDR50 tCLK20 ns CL=40 pF using for SDR12, SDR25 Hold time at the tODLY(min) CL=15 pF 6252B-SR Card output timing (SDR Modes 100MHz to 208MHz) Symbol Minimum Maximum Unit Comments tOP tOP 0
-350 2
+1550 UI ps Card output phase Delay variation due to temp change after tuning
0.6 tODW UI tOP = +1550 ps for junction temperature of tOP = 90 degrees during operation tOP = -350 ps for junction temperature of tOP = -20 degrees during operation tOP = +2600 ps for junction temperature of tOP = -20 to +125 degrees during operation tODW = 2.88 ns @ 208 MHz FN-LINK TECHNOLOGY LIMITED 20 7.2.6 SDIO Bus Timing Specifications in DDR50 Mode 6252B-SR parameter Symbol Minimum Maximum Unit Comments
tCLK tCR, tC
DDR50 mode ns ns 0.2 tCLK tCR, tCF < 4.00 ns (max)@50 MHz, CCARD = 10 pF 55
20
45 Clock duty
Data Timing parameter Input CMD Input setup time Input hold time Output CMD Symbol Minimum Maximum Unit Comments tISU tIH 6 0.8
ns ns CCARD < 10 pF (1 Card) CCARD < 10 pF (1 Card) FN-LINK TECHNOLOGY LIMITED 21 6252B-SR Output delay time tODLY 13.7 CCARD < 30 pF (1 Card) Output hold time tOH CCARD < 15 pF (1 Card)
1.5 3 0.8
ns ns ns ns ns ns Input DAT Input setup time Input hold time Output CMD tISU2x tIH2x Output delay time tODLY2x
7.85a Output hold time tODLY2x 1.5 a. SDIO 3.0 specification value is 7.0 ns CCARD < 10 pF (1 Card) CCARD < 10 pF (1 Card) CCARD < 25 pF (1 Card) CCARD < 15 pF (1 Card) 8. Size reference 8.1 Module Picture L x W : 15 x 13 (+0.3/-0.1) mm PIN1 H: 1.8 (0.2) mm Weight 0.67g FN-LINK TECHNOLOGY LIMITED 22 8.2 Marking Description 8.3 Physical Dimensions NA
<TOP View>
6,5 6252B-SR 6,5 5,625 4,75 4,25 3,85 3,35 2,95 2,45 2,05 1,55 1,15 0,65 0,25 5 7
, 5 2 6 16
, 66 5
, 2 75
, 34
, 84
, 43
, 93 2
, 5 622
, 11 1
, 7 0
, 2 0
, 5 7
, FN-LINK TECHNOLOGY LIMITED 23 8.4 Layout Recommendation 6252B-SR 6,5 6,75 6,5 5,625 4,75 4,25 3,85 3,35 2,95 2,45 2,05 1,55 1,15 0,65 0,25 5 7
, 7 5
, 7 5 2 6 16
, 66 5
, 2 75
, 34
, 84 3
, 4 93 2
, 5 622
, 11 1
, 7
, 0 2
, 0 5
, 7 9. The Key Material List Chipset RTL8852BS Realtek PCB FR4, 4 LAYER, GREEN XY-PCB, GDKX, Sunlord, SLPCB Crystal 2016 40MHz 10ppm ECEC, TKD, Hosonic, JWT, TXC Inductor 2016 1.0uH,20%
Inductor 0603 2.2UH,10%
Diplexer 1608 Dual-band, dual-mode 2.4GHz/5GHz WLAN Sunlord, Ceaiya, Cenker Sunlord, Ceaiya, Cenker Glead, Walsin, ACX, Murata, MAG.LAYERS FN-LINK TECHNOLOGY LIMITED 24 10. Reference Design 6252B-SR Note:
ANT3 is optional for 3 ANT vertion FN-LINK TECHNOLOGY LIMITED 25 6252B-SR 11. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <260C Time within 5C of peak temperature10s Number of Times : 2 times FN-LINK TECHNOLOGY LIMITED 26 6252B-SR 12. Package 12.1 Reel A roll of 1500pcs 12.2 Carrier Tape Detail FN-LINK TECHNOLOGY LIMITED 27 12.3 Packaging Detail the take-up package 6252B-SR 13. Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40C and <90% relative humidity (RH). b) Environmental condition during the production: 30C / 60% RH according to IPC/JEDEC J-STD-033A c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if care paragraph 5. condition b) IPC/JEDEC J-STD-033A paragraph 5.2 is respected FN-LINK TECHNOLOGY LIMITED 28 d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more 6252B-SR 14.Label 14.Label 14.Label WIFI+BT Module WIFI+BT Module WIFI+BT Module WIFI+BT Module Model No: 6252B-SR FCC ID: 2AATL-6252B-SR Rating: DC3.3V 600mA Fn-Link FN-LINK TECHNOLOGY LIMITED 29 FCC Statements:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
--- Reorient or relocate the receiving antenna.
--- Increase the separation between the equipment and receiver.
---Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
--- Consult the dealer or an experienced radio/TV technician for help. Warning: Changes or modifications to this unit not expressly approved by the part responsible for compliance could void the users authority to operate the equipment. LABELING AND USER INFORMATION REQUIREMENTS OF THE END PRODUCT:
The final end product must be labelled in a visible area with the following Contains TX ID:
FCC 2AATL-6252B-
. If the size of the end product is smaller than 8x10cm, then Contains Transmitter Module FCC 2AATL-6252B-
SR"
ID:
SR or additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. A user's manual for the finished product should include one of the following statements:-
For a Class A digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
- For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
--- Reorient or relocate the receiving antenna.
--- Increase the separation between the equipment and receiver.
---Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
--- Consult the dealer or an experienced radio/TV technician for help. The User's Manual for The finished product should include the following statements:
Any changes or modifications to this equipment not expressly approved by the OEM/Integrator may cause harmful interference and void the user's authority to operate this equipment. RF Exposure This device has been evaluated and shown compliant with the FCC RF Exposure limits under fixed exposure conditions (antennas are greater than 20cm from a persons body) when installed in certain specific OEM configurations. General Statements The module is limited to OEM installation only. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. This module should be installed and operated with a minimum distance 20cm between the radiator and your body. OEM integrator shall equipped the antenna to compliance with antenna requirement part 15.203& 15.204 and must not be co-located or operating in conjunction with any other antenna or transmitters. And OEM host shall implement a Class II Permissive Change
(C2PC) or a new FCC ID to demonstrate complied with FCC standard. This module is for use with external antennas only, and the antenna is recommended as below:
Ant.
(Chain) Brand Model name Connector Antenna Information Antenna Type 1,2 FN-LINK K212-10037-A Diople RP-SMA(M) Gain
(dBi) 2.98 Application range 2400-2500MHz 3.59 5150-5250MHz 3.79 5250-5350MHz 4.56 5470-5725MHz 3.85 5725-5850MHz Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the module. The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. This module support Bluetooth 2402-2480MHz & 2.4G WLAN 2412-2462MHz which compliance with part 15.247. And support 5150-5850MHz which compliance with part 15.407. The product is typically use in industrial, household and general office / ITE and audio & video end-products.