PRODUCT SPECIFICATION L297B-SR Wi-Fi Dual-band 2x2 11ac+ Bluetooth 5.0 Combo Module Version:v1.2 FN-LINK TECHNOLOGY LIMITED 1 L297B-SR Module Datasheet Ordering Information Part NO. Description FGL297BSRX-00 SDIO/ UART, PCB version V1.0 NXP88W8997, b/g/n/ac, Wi-Fi+BLE5.0, 2T2R, 13X15mm, Customer:
Customer P/N:
Signature:
Date:
Office: 14th floor, Block B, phoenix zhigu, Xixiang Street, Baoan District, Shenzhen Factory: NO.8, Litong RD., Liuyang Economic & Technical Development Zone, Changsha, CHINA TEL:+86-755-2955-8186 Website:www.fn-link.com FN-LINK TECHNOLOGY LIMITED 2 L297B-SR CONTENTS 1. General Description.............................................................................................................. 5 1.1 Introduction......................................................................................................................... 5 1.2 Description.......................................................................................................................... 5 2. Features....................................................................................................................................6 3. Block Diagram........................................................................................................................ 7 4. General Specification........................................................................................................... 7 4.1 2.4GHz WI-FI Specification..............................................................................................7 4.2 5GHz WI-FI Specification................................................................................................. 8 4.3 Bluetooth Specification..................................................................................................... 9 5. ID setting information........................................................................................................... 9 6. Pin Definition........................................................................................................................ 10 6.1 Pin Outline........................................................................................................................ 10 6.2 Pin Definition details........................................................................................................10 7. Electrical Specifications.................................................................................................... 12 7.1 Host Interface Specifications......................................................................................... 12 7.1.1 SDIO Specifications................................................................................................. 12 7.1.2 Default Speed, High-Speed Modes.......................................................................... 12 7.1.3 SDR12, SDR25, SDR50 Modes (up to 100 MHz) (1.8V)....................................... 13 7.1.4 SDR104 Mode (208 MHz) (1.8V)........................................................................... 14 7.1.5 DDR50 Mode (50 MHz) (1.8V)...............................................................................15 7.2 High-Speed UART Specifications................................................................................. 17 7.2.1 UART Timing Diagram............................................................................................17 7.2.2 UART Baud Rates Supported...................................................................................17 8. Size reference....................................................................................................................... 18 8.1 Module Picture................................................................................................................. 18 8.2 Marking Description.........................................................................................................18 8.3 Physical Dimensions....................................................................................................... 19 8.4 Layout Recommendation............................................................................................... 20 9. The Key Material List.......................................................................................................... 21 10. Reference Design.............................................................................................................. 22 11. Recommended Reflow Profile....................................................................................... 23 12. Package................................................................................................................................24 12.1 Reel................................................................................................................................. 24 12.2 Packaging Detail............................................................................................................24 13. Moisture sensitivity...........................................................................................................25 FN-LINK TECHNOLOGY LIMITED 3 L297B-SR Revision History Version Date Contents of Revision Change Preparde Checked Approved V1.0 2021/11/19 New version Tzq Qjp V1.1 2022/01/19 Revision pin definition Tzq Qjp Add Module picture Add marking description V1.2 2022/02/15 Update ping outline FC FC FC FN-LINK TECHNOLOGY LIMITED 4 L297B-SR 1. General Description 1.1 Introduction This document is to specify the product requirements for 802.11a/b/g/n/ac and Bluetooth 5.0 SDIO&UART module. This module based on NXP(MARVELL) 88W8997 chipset that complied with IEEE 802.11a, IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11ac standard from 2.4~2.5GHz and 5.15GHz ~ 5.85GHz, and it also can be used to provide up to 11Mbps for IEEE 802.11b, 54Mbps for IEEE 802.11a and IEEE 802.11g, 150Mbps for 802.11n and 866.7Mbps for IEEE 802.11ac to connect your wireless LAN. 1.2 Description Model Name L297B-SR Product Description Support Wi-Fi/Bluetooth functionalities Dimension Wi-Fi Interface BT Interface OS supported L x W x H: 13 x 15 x2.3 mm Support SDIO V2.0/3.0 UART/SDIO Android /Linux/ Win CE /iOS /XP/WIN7/WIN10 Operating temperature
-30C to 85C Storage temperature
-55C to 125C FN-LINK TECHNOLOGY LIMITED 5 L297B-SR 2. Features General Compatible with IEEE 802.11a standard to provide wireless 54Mbps data rate Compatible with IEEE 802.11b standard to provide wireless 11Mbps data rate Compatible with IEEE 802.11g standard to provide wireless 54Mbps data rate Compatible with IEEE 802.11n standard to provide wireless 150Mbps data rate Compatible with IEEE 802.11ac standard to provide wireless 866.7Mbps data rate Supports TKIP/WEP, AES/CCMP, AES/CMAC, AES/GCMP and WAPI enhanced security Host Interface SDIO 2.0/3.0 Interface for WLAN SDIO Interface or High-Speed UART Interface for Bluetooth HSF compliant Bluetooth Features Bluetooth 5.0 compliant Supports Bluetooth classic (BDR/EDR) Supports Bluetooth Low Energy (BLE) FN-LINK TECHNOLOGY LIMITED 6 3. Block Diagram L297B-SR 4. General Specification 4.1 2.4GHz WI-FI Specification Feature WLAN Standard Frequency Range Description IEEE 802.11 b/g/n Wi-Fi compliant 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHzCh1 ~ Ch14 Test Items Typical Value Output Power 802.11g /54Mbps : 15dBm 2 dB 802.11b /11Mbps : 16dBm 2 dB 802.11n /MCS7
: 14dBm 2 dB Spectrum Mask Freq. Tolerance Meet with IEEE standard 20ppm Receive Sensitivity
(11b,20MHz) @8% PER
11Mbps PER @ -83 dBm
-76 EVM EVM -10dB EVM -25dB EVM -28dB FN-LINK TECHNOLOGY LIMITED 7 L297B-SR Receive Sensitivity
(11g,20MHz) @10% PER Receive Sensitivity
(11n,20MHz) @10% PER Receive Sensitivity
(11n,40MHz) @10% PER
54Mbps PER @ -74 dBm
- MCS=7 PER @ -68 dBm
- MCS=7, PER @ -66 dBm
-65
-64
-61 4.2 5GHz WI-FI Specification Feature WLAN Standard Frequency Range Description IEEE 802.11a/n/ac, Wi-Fi compliant 4.900 GHz ~ 5.845 GHz (5.0 GHz ISM Band) Number of Channels 5.0GHzPlease see the table1 Modulation Test Items Output Power 802.11a/n : 64-QAM,16-QAM, QPSK, BPSK 802.11ac : 256-QAM, 64-QAM,16-QAM, QPSK, BPSK Typical Value 802.11a /11Mbps
: 15dBm 2 dB 802.11n /MCS7(HT20)
: 14dBm 2 dB 802.11n /MCS7(HT40)
: 14dBm 2 dB 802.11ac/MCS8(VHT20)
: 11 dBm2 dB 802.11ac/MCS9(VHT40)
: 11 dBm2 dB 802.11ac/MCS9(VHT80)
: 11 dBm2 dB EVM EVM -10dB EVM -25dB EVM -28dB EVM -30dB EVM -32dB EVM -32dB Spectrum Mask Meet with IEEE standard Receive Sensitivity
(11a,20MHz) @8% PER Receive Sensitivity
(11n,20MHz) @10% PER Receive Sensitivity
(11n,40MHz) @10% PER Receive Sensitivity
(11ac,20MHz)@10% PER Receive Sensitivity
(11ac,40MHz) @10% PER Receive Sensitivity
(11ac,80MHz) @10% PER
54Mbps PER @ -71 dBm
- MCS=7 PER @ -68 dBm
- MCS=7, PER @ -66 dBm
- MCS=8 PER @ -64 dBm
- MCS=9 PER @ -58 dBm
- MCS=9 PER @ -55 dBm
-65
-64
-61
-59
-54
-51 FN-LINK TECHNOLOGY LIMITED 8 L297B-SR 4.3 Bluetooth Specification Feature Description General Specification Bluetooth Standard Bluetooth V5.0 Host Interface Frequency Band Number of Channels Modulation RF Specification BDR Output Power BLE Output Power Sensitivity @ BER=0.1%
for GFSK (1Mbps) Sensitivity @ BER=0.01%
for /4-DQPSK (2Mbps) Sensitivity @ BER=0.01%
for 8DPSK (3Mbps) Sensitive @PER=30.8%
for BLE UART 2402 MHz ~ 2480 MHz 79 channels for BDR+EDR 40 channels for BLE GFSK, /4-DQPSK, 8-DPSK Min(dBm) Typical(dBm) Max(dBm) Min Typical IEEE 8 8
-86
-86
-80
-90
-70
-70
-70
-70 Maximum Input Level
/4-DQPSK (2Mbps) :-20dBm GFSK (1Mbps):-20dBm 8DPSK (3Mbps) :-20dBm 5. ID setting information WI-FI Vendor ID Product ID 0x02DF 0x9141 FN-LINK TECHNOLOGY LIMITED 9 L297B-SR 6. Pin Definition 6.1 Pin Outline
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6.2 Pin Definition details NO. Name Type Description Voltage 1 2 9 GND RF0 RF1 3~8 GND 10 GND Ground connections WIFI_RF0 Ground connections WIFI_RF1/BT_RF Ground connections FN-LINK TECHNOLOGY LIMITED 10 15 WL_REG_ON I When the host reboot, this pin should VDDIO WL_WAKE_HOST WLAN to wake up HOST 11 GND 12~14 NC 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 SD_CMD SD_CLK SD_D3 SD_D2 SD_D0 SD_D1 GND NC LX_OUT 2.2VIN PCM_SYNC PCM_IN PCM_OUT PCM_CLK LPO GND NC VDDIO NC VBAT NC NC GND UART_Tx UART_Rx UART_RTS UART_CTS NC NC L297B-SR VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO O I/O I/O I/O I/O I/O I/O O I I/O I/O I/O I/O I Ground connections Floating (NC) Full Power-Down power down (active low) SDIO command line SDIO clock line SDIO data line 3 SDIO data line 2 SDIO data line 0 SDIO data line 1 Ground connections Floating (NC) to pin26 (2.2V) DCDC_IN (2.2V) PCM Sync PCM Input PCM Output PCM Clock Ground connections 3.3V Floating (NC) VDD3.3V Floating (NC) Floating (NC) UART_Tx UART_Rx UART_RTS UART_CTS Floating (NC) Floating (NC) Need to connect a Power Inductor and then connect Crystals of up to 32.768 K Ground connections Floating (NC) Only control the Voltage of SDIO, Can be 1.8V or FN-LINK TECHNOLOGY LIMITED 11 L297B-SR NC NC NC 46 47 48 49 50 Floating (NC) Floating (NC) Floating (NC) HOST_WAKE_BT BT_WAKE_HOST I O Host device to wake up Bluetooth Bluetooth device to wake up host P:POWER I:INPUT O:OUTPUT VDDIO:3.3V 7. Electrical Specifications 7.1 Host Interface Specifications 7.1.1 SDIO Specifications The SDIO host interface pins are powered from the VIO_SD voltage supply 7.1.2 Default Speed, High-Speed Modes SDIO Protocol Timing DiagramDefault Speed Mode (3.3V) SDIO Protocol Timing DiagramHigh-Speed Mode (3.3V) FN-LINK TECHNOLOGY LIMITED 12 L297B-SR SDIO Timing DataDefault Speed, High-Speed Modes (3.3V)1, 2 NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. 7.1.3 SDR12, SDR25, SDR50 Modes (up to 100 MHz) (1.8V) SDIO Protocol Timing DiagramSDR12, SDR25, SDR50 Modes (up to 100 MHz) (1.8V) FN-LINK TECHNOLOGY LIMITED 13 L297B-SR SDIO Timing DataSDR12, SDR25, SDR50 Modes (up to 100 MHz) (1.8V) NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified 7.1.4 SDR104 Mode (208 MHz) (1.8V) SDIO Protocol Timing DiagramSDR104 Mode (208 MHz) SDIO Timing DataSDR104 Mode (208 MHz) NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. FN-LINK TECHNOLOGY LIMITED 14 L297B-SR 7.1.5 DDR50 Mode (50 MHz) (1.8V) SDIO CMD Timing DiagramDDR50 Mode (50 MHz) SDIO DAT[3:0] Timing DiagramDDR50 Mode1 (50 MHz) FN-LINK TECHNOLOGY LIMITED 15 SDIO Timing DataDDR50 Mode (50 MHz) NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified L297B-SR FN-LINK TECHNOLOGY LIMITED 16 7.2 High-Speed UART Specifications 7.2.1 UART Timing Diagram L297B-SR UART Timing Data1 7.2.2 UART Baud Rates Supported
*Note:Default 115200 FN-LINK TECHNOLOGY LIMITED 17 L297B-SR 8. Size reference 8.1 Module Picture L x W : 13 x 15 (+0.3/-0.1) mm H: 2.3 (0.2) mm Weight TBD 8.2 Marking Description FN-LINK TECHNOLOGY LIMITED 18 8.3 Physical Dimensions
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L297B-SR FN-LINK TECHNOLOGY LIMITED 19 8.4 Layout Recommendation L297B-SR FN-LINK TECHNOLOGY LIMITED 20 L297B-SR 9. The Key Material List Chipset NXP 88W8997 NXP PCB L297B-SR ,6L,FR4,13x15x0.8mm XY-PCB,KX-PCB,SL-PCB,Sunlord Crystal 2520 40MHz 12pF 10ppm TST,HOSONIC,TKD,ECEC,JWT Shielding L297B-SR Shielding
, FN-LINK TECHNOLOGY LIMITED 21 L297B-SR 10. Reference Design FN-LINK TECHNOLOGY LIMITED 22 L297B-SR 11. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250C Number of Times : 2 times FN-LINK TECHNOLOGY LIMITED 23 L297B-SR 12. Package 12.1 Reel A roll of 1500pcs 12.2 Packaging Detail the take-up package Using self-adhesive tape Size of black tape: 24mm*32.6m the cover tape :21.3mm*32.6m Color of plastic disc: blue FN-LINK TECHNOLOGY LIMITED 24 L297B-SR NY bag size:460mm*385mm size 350*350*35mm The packing case size:350*210*370mmg 13. Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40C and <90% relative humidity (RH) b) Environmental condition during the production: 30C / 60% RH according to IPC/JEDEC J-STD-033A c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if paragraph 5 condition b) IPC/JEDEC J-STD-033A paragraph 5.2 is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more FN-LINK TECHNOLOGY LIMITED 25 FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 External Antenna , 4dBi(Provided by the applicant) This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:Reorient or relocate the receiving antenna.Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.Consult the dealer or an experienced radio/TV technician for help.FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:
2AATL-L297BSR Or Contains FCC ID: 2AATL-L297BSR When the module is installed inside another device, the user manual of the host must contain below warning statements;
1.This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(5) 2.(1)This device may not cause harmful interference;(2)This device must accept any interference received, including interference that may cause undesiredoperation.Note: This equipment has been tested and found to comply with the limits for a Class B digital device,pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection againstharmful interference in a residential installation. This equipment generates, uses and can radiate radiofrequency energy and, if not installed and used in accordance with the instructions, may cause harmfulinterference to radio communications.However, there is no guarantee that interference will not occur in a particular installation. If this equipmentdoes cause harmful interference to radio or television reception, which can be determined by turning theequipment off and on, the user is encouraged to try to correct the interference by one or more of thefollowing measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 2.Changes or modifications not expressly approved by the party responsible for compliance could void theuser's authority to operate the equipment.The devices must be installed and used in strict accordance with the manufacturer's instructions as describedin the user documentation that comes with the product.Any company of the host device which install this modular with modular approval should perform the test ofradiated & conducted emission and spurious emission, etc. according to FCC part 15C : 15.247 and 15.209& 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209& 15.207 ,15B Class B requirementthen the host can be sold legally. External antenna specification Antenna manufacturerRTANT COMMUNICATIONS co.,LTD Building E, Shalong Ludlang Industrial Houjie Town, Dongguan City Innovation Park, Shatang Industrial Zone, antenna modelExternal Antenna Antenna Gain4dBi Please refer to the chart below for PCB size of RF line terminal.
The line between the External antenna and the BT module must be 50 ohm.