FCC ID: QIPPLAS9-X Cinterion Module PLAS9-X

Cinterion PLAS9-X Hardware Interface Overview Version:

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00.044 PLAS9-X_HIO_v00.044 M2M.GEMALTO.COM Cinterion PLAS9-X Hardware Interface Overview Page 2 of 39 2 Document Name: Cinterion PLAS9-X Hardware Interface Overview Version:

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Status 00.044 2017-09-19 PLAS9-X_HIO_v00.044 Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-

UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NON-

EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIV-

ERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-

tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2017, Gemalto M2M GmbH, a Gemalto Company Trademark Notice Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corpora-

tion in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview Contents 39 Page 3 of 39 Contents 1 Introduction ................................................................................................................. 6 Key Features at a Glance .................................................................................. 6 1.1 1.2 PLAS9-X System Overview ............................................................................... 9 2 3 4 5 6 7 Interface Characteristics .......................................................................................... 10 Application Interface ........................................................................................ 10 2.1 2.1.1 USB Interface...................................................................................... 10 2.1.2 UICC/SIM/USIM Interface................................................................... 11 2.1.3 Analog-to-Digital Converter (ADC)...................................................... 13 2.1.4 GPIO Interface .................................................................................... 13 2.1.5 Control Signals.................................................................................... 14 2.1.5.1 PWR_IND Signal................................................................. 14 2.1.5.2 Behavior of the RING0 Line ................................................ 14 2.1.5.3 Remote Wakeup.................................................................. 14 2.1.5.4 Low Current Indicator.......................................................... 14 GSM/UMTS/LTE Antenna Interface................................................................. 15 2.2.1 Antenna Installation ............................................................................ 16 2.2.2 RF Line Routing Design...................................................................... 17 2.2.2.1 Line Arrangement Instructions ............................................ 17 2.2.2.2 Routing Examples ............................................................... 19 Sample Application .......................................................................................... 21 2.2 2.3 Operating Characteristics ........................................................................................ 23 Operating Modes ............................................................................................. 23 3.1 3.2 Power Supply................................................................................................... 24 Mechanical Dimensions ........................................................................................... 25 4.1 Mechanical Dimensions of PLAS9-X ............................................................... 25 Regulatory and Type Approval Information ........................................................... 27 Directives and Standards................................................................................. 27 5.1 SAR requirements specific to portable mobiles ............................................... 29 5.2 5.3 Reference Equipment for Type Approval......................................................... 30 Compliance with FCC and IC Rules and Regulations ..................................... 31 5.4 Document Information.............................................................................................. 33 6.1 Revision History ............................................................................................... 33 Related Documents ......................................................................................... 33 6.2 Terms and Abbreviations ................................................................................. 33 6.3 6.4 Safety Precaution Notes .................................................................................. 36 Appendix.................................................................................................................... 37 7.1 List of Parts and Accessories........................................................................... 37 PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview Tables 39 Page 4 of 39 Tables Table 1:

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Signals of the SIM interface (SMT application interface) ............................... 11 Return loss in the active band........................................................................ 15 Overview of operating modes ........................................................................ 23 Directives ....................................................................................................... 27 Standards of North American type approval .................................................. 27 Requirements of quality ................................................................................. 27 Standards of the Ministry of Information Industry of the Peoples Republic of China............................................................................ 28 Toxic or hazardous substances or elements with defined concentration limits............................................................................................................... 28 Antenna gain limits for FCC and IC (TBD.).................................................... 31 List of parts and accessories.......................................................................... 37 Molex sales contacts (subject to change) ...................................................... 38 Hirose sales contacts (subject to change) ..................................................... 38 PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview Figures 39 Page 5 of 39 Figures Figure 1:

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PLAS9-X system overview............................................................................... 9 USB circuit ..................................................................................................... 10 First UICC/SIM/USIM interface ...................................................................... 12 Second UICC/SIM/USIM interface................................................................. 12 Embedded Stripline line arrangement............................................................ 17 Micro-Stripline line arrangement samples...................................................... 18 Routing to applications RF connector ........................................................... 19 Routing to PLAS9-X evaluation modules RF connector................................ 20 PLAS9-X sample application.......................................................................... 22 Decoupling capacitor(s) for BATT+................................................................ 24 PLAS9-X top and bottom view .................................................................... 25 Dimensions of PLAS9-X (all dimensions in mm)............................................ 26 Reference equipment for type approval......................................................... 30 PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 1 Introduction 9 1 Introduction Page 6 of 39 This document1 describes the hardware of the Cinterion PLAS9-X module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the re-

quirements to be considered for integrating further components. 1.1 Key Features at a Glance Feature General Frequency bands GSM class Output power

(according to Release 99) Implementation GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz UMTS/HSPA+: Triple band, 850 (BdV), 1700 (BdIV), 1900 (BdII) LTE (FDD): Six band, 700 (Bd12 <MFBI Bd17>, Bd13, Bd29 <supplemen-

tary downlink>), 850 (Bd5), 1700 (Bd4), 1900 (Bd2) Small MS Class 4 (+33dBm 2dB) for EGSM850 Class 4 (+33dBm 2dB) for EGSM900 Class 1 (+30dBm 2dB) for GSM1800 Class 1 (+30dBm 2dB) for GSM1900 Class E2 (+27dBm 3dB) for GSM 850 8-PSK Class E2 (+27dBm 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIV Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Output power

(according to Release 8) LTE (FDD):

Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd12 <MFBI Bd17>

Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd13 Class 3 (+23dBm +-2dB) for LTE 850, LTE FDD Bd5 Class 3 (+23dBm +-2dB) for LTE 1700, LTE FDD Bd4 Class 3 (+23dBm +-2dB) for LTE1900, LTE FDD Bd2 Power supply Operating temperature

(board temperature) Physical RoHS 3.3V < VBATT+ < 4.2V Normal operation: -30C to +85C Extended operation: -40C to +95C Dimensions: 40mm x 32mm x 2.8mm Weight: approx. 6.5g All hardware components fully compliant with EU RoHS Directive 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Gemalto M2M product. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 1.1 Key Features at a Glance 9 Page 7 of 39 Feature LTE features 3GPP Release 10 Implementation Downlink carrier aggregation (CA) to increase bandwidth, and thereby increase bitrate:

Maximum aggregated bandwidth: 40MHz Maximum number of component carriers: 2 Inter-band FDD, non-contiguous Intra-band FDD, contiguous, non-contiguous Supported inter-band CA configurations:

CA_2A-5A (with bandwidth combination set 0), CA_2A-12A (with bandwidth combination sets 0 and 1), CA_2A-29A (with bandwidth combination sets 0, 1 and 2), CA_4A-5A (with bandwidth combination sets 0 and 1), CA_4A-12A (with bandwidth combination sets 0, 1, 2, 3 and 4), CA_4A-29A (with bandwidth combination sets 0, 1 and 2) Supported intra-band CA configurations:

CA_4A-4A (with bandwidth combination set 0) CAT 6 supported DL 300Mbps, UL 50Mbps 2x2 MIMO in DL direction HSPA features 3GPP Release 9 UE CAT. 14, 24 DC-HSPA+ DL 42Mbps HSUPA UL 5.76Mbps Compressed mode (CM) supported according to 3GPP TS25.212 UMTS features 3GPP Release 9 GSM / GPRS / EGPRS features Data transfer PS data rate 384 kbps DL / 384 kbps UL EDGE E2 power class for 8 PSK GPRS:

Multislot Class 12 Mobile Station Class B Coding Scheme 1 4 EGPRS:

Multislot Class 12 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 NACC, extended UL TBF Mobile Station Class B Point-to-point MT and MO, Cell broadcast, Text and PDU mode SRB loopback and test mode B 8-bit, 11-bit RACH 1 phase/2 phase access procedures Link adaptation and IR SMS Software AT commands Hayes, 3GPP TS 27.007 and 27.005, and proprietary Gemalto M2M com-

mands PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 1.1 Key Features at a Glance 9 Page 8 of 39 Feature Firmware update Interfaces Module interface Antenna USB UICC interface RING0 Power on/off, Reset Power on/off Reset Emergency-off Special Features Antenna GPIO ADC inputs Evaluation kit Evaluation module Implementation Generic update from host application over USB 2.0 High Speed device interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket. For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equip-

ment. 50. GSM/UMTS/LTE main antenna, UMTS/LTE Diversity/MIMO antenna USB 2.0 High Speed (480Mbit/s) device interface or USB 3.0 Super Speed (5Gbit/s) device interface 2 UICC interfaces (switchable) Supported chip cards: UICC/SIM/USIM 3V, 1.8V Signal line to indicate URCs. Switch-on by hardware signal IGT Switch-off by AT command (AT^SMSO) or IGT (option) Automatic switch-off in case of critical temperature or voltage conditions Orderly shutdown and reset by AT command Emergency-off by hardware signal EMERG_OFF SAIC (Single Antenna Interference Cancellation) / DARP (Downlink Advanced Receiver Performance) Rx Diversity (receiver type 3i - 64-QAM) / MIMO 10 I/O pins of the application interface programmable as GPIO. Programming is done via AT commands. Analog-to-Digital Converter with two unbalanced analog inputs for (exter-

nal) antenna diagnosis PLAS9-X module soldered onto a dedicated PCB that can be connected to the ALAS6A-DSB75 adapter in order to be mounted onto the DSB75. ALAS6A-DSB75 adapter A special adapter required to connect the PLAS9-X evaluation module to the DSB75. DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. DSB75 PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Page 9 of 39 Cinterion PLAS9-X Hardware Interface Overview 1.2 PLAS9-X System Overview 9 1.2 PLAS9-X System Overview GSM/UMTS/LTE Antenna diversity 1 2 Application Antenna switch Antenna diagnostic GSM/UMTS/LTE 2x GPIO 2x ADC Module USB RING0 GPIO ADC UICC Power supply IGT, Emergency Off Host application SIM card SIM card

) I D N _ R W P

(

n o i t a c i d n i r e w o P On/Off n o i t a c i l

) T X E V

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p p a r o f r e w o P Figure 1: PLAS9-X system overview PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2 Interface Characteristics 22 2 Interface Characteristics Page 10 of 39 PLAS9-X is equipped with an SMT application interface that connects to the external applica-

tion. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 USB Interface PLAS9-X supports a USB 3.0 Super Speed (5Gbps) device interface, and alternatively a USB 2.0 device interface that is High Speed and Full Speed compatible. The USB interface is primarily intended for use as command and data interface, and for downloading firmware1. The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLAS9-X is designed as a self-powered device compliant with the Universal Serial Bus Spec-

ification Revision 3.02. Module VREG (3V075) lin. reg. SMT USB part1) 2.0 USB_HS _PHY USB 2.0 Controller 2.0 USB 3.0 Controller 3.0 USB_SS _PHY VBUS 100nF 100nF 1F Detection only Host wakeup BATT+

GND USB_DP3) USB_DN3) USB_SSRX_N USB_SSRX_P USB_SSTX_N USB_SSTX_P VUSB_IN2) RING0 1) All serial (including RS) and pull-up resistors for data lines are implemented. 2) Since VUSB_IN is used for detection only it is recommended not to add any further blocking capacitors on the VUSB_IN line. 3) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. Figure 2: USB circuit To properly connect the module's USB interface to the external application, a USB 3.0 or 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with PLAS9-X needs to be installed. 1. Note: For firmware download, the module enumerates new as a USB 2.0 device. Also, it is not possible to use the USB 2.0 High Speed device mode and the USB 3.0 Super speed device mode simultaneously. 2. The specification is ready for download on http://www.usb.org/developers/docs/

PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.1 Application Interface 22 2.1.2 UICC/SIM/USIM Interface Page 11 of 39 PLAS9-X has two UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM inter-

faces. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with PLAS9-X and is part of the Gemalto M2M reference equipment submit-

ted for type approval. See Chapter 7 for Molex ordering numbers. Table 1: Signals of the SIM interface (SMT application interface) Signal GND Description Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g., pad P12, may be used to improve EMC. Chipcard clock lines for 1st and 2nd SIM interface. CCCLK1 CCCLK2 CCVCC1 CCVCC2 CCIO1 CCIO2 CCRST1 CCRST2 CCIN1 CCIN2 SIM supply voltage lines for 1st and 2nd SIM interface. Serial data lines for 1st and 2nd SIM interface, input and output. Chipcard reset lines for 1st and 2nd SIM interface. Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCINx signal is active low. The CCINx signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCINx signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of PLAS9-X. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLAS9-X. By default, only the 1st SIM interface is available and can be used. Using the AT command AT^SCFG=SIM/CS it is possible to switch between the two SIM interfaces. Command set-

tings are non-volatile - for details see [1]. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.1 Application Interface 22 Page 12 of 39 open: Card removed closed: Card inserted 1n SIM /

UICC CCIN1 CCRST1 CCCLK1 GND CCIO1 e c a f r e t n i n o i t a c i l p p a T M S Module CCVCC1 220n Figure 3: First UICC/SIM/USIM interface The total cable length between the SMT application interface pads on PLAS9-X and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line. Note: Figure 3 shows how to connect a SIM card holder to the first SIM interface. With the sec-

ond SIM interface some internally integrated components on the SIM circuit will have to be ex-

ternally integrated as shown for the second SIM interface in Figure 4. The external components at CCIN2 should be populated as close as possible to the signals SMT pad Module Open: Card removed Closed: Card inserted 2k2 22k 100pF 1nF SIM /

UICC VEXT CCIN2 CCRST2 CCCLK2 GND CCIO2 10k CCVCC2 220nF e c a f r e t n i n o i t a c i l p p a T M S Figure 4: Second UICC/SIM/USIM interface PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.1 Application Interface 22 2.1.3 Analog-to-Digital Converter (ADC) Page 13 of 39 PLAS9-X provides two unbalanced ADC input lines: ADC1_IN and ADC2_IN. They can be used to measure two independent, externally connected DC voltages in the range of 0.05V to VBATT+. GPIO Interface 2.1.4 PLAS9-X has 10 GPIOs for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. GPIO1...GPIO10 may be configured as low current indicator signal (see Section 2.1.5.4), or may be set as remote host wakeup lines (see Section 2.1.5.3). PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.1 Application Interface 22 2.1.5 Control Signals Page 14 of 39 PWR_IND Signal 2.1.5.1 PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is required. 2.1.5.2 Behavior of the RING0 Line The RING0 line serves to indicate URCs (Unsolicited Result Code). The RING0 line behavior and usage can be configured by AT command. For details see [1]:

AT^SCFG. Remote Wakeup 2.1.5.3 If no call, data or message transfer is in progress, the external host application may shut down its own module interfaces or other components in order to save power. If a call, data, or other request (URC) arrives, the external application can be notified of this event and be woken up again by a state transition of a configurable remote wakeup line. Available as remote wakeup lines are all GPIO signals as well as the RING0 line. Please refer to [1]: AT^SCFG: "Re-

moteWakeUp/..." for details on how to configure these lines for defined wakeup events on specified device interfaces. 2.1.5.4 Low Current Indicator A low current indication is optionally available over a GPIO line. By default, low current indica-

tion is disabled and the GPIO pads can be configured and employed as usual. For a GPIO pad to work as a low current indicator the feature has to be enabled by AT com-

mand (see [1]: AT^SCFG: MEopMode/PowerMgmt/LCI). By default, the GPIO6 pad is config-

ured as LCI_IND signal. If enabled, the GPIOx/LCI_IND signal is high when the module is sleeping. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 22 2.2 GSM/UMTS/LTE Antenna Interface Page 15 of 39 The PLAS9-X GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity/MIMO antenna to improve signal reliability and quality1. The interface has an impedance of 50. PLAS9-X is capable of sustaining a total mismatch at the antenna interface without any damage, even when transmitting at maximum RF power. The external antennas must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Matching networks are not in-

cluded on the PLAS9-X PCB and should be placed in the host application, if the antenna does not have an impedance of 50. Regarding the return loss PLAS9-X provides the following values in the active band:

Table 2: Return loss in the active band State of module Receive Transmit Idle Return loss of module

> 8dB not applicable

< 5dB Recommended return loss of application

> 12dB

> 12dB not applicable 1. By delivery default the UMTS/LTE Rx diversity/MIMO antenna is configured as available for the module since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 22 2.2.1 Antenna Installation Page 16 of 39 The antenna is connected by soldering the antenna pads (ANT_MAIN; ANT_DRX_MIMO) and their neighboring ground pads directly to the applications PCB. The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application PCB.The wiring of the antenna connection, starting from the antenna pad to the applications antenna must result in a 50 line impedance. Line width and distance to the GND plane need to be optimized with regard to the PCBs layer stack. Related instruc-

tions are given in Section 2.2.2. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-

nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-

tion 2.2.2 for instructions of how to design the antenna connection in order to achieve the required 50 line impedance. For type approval purposes (i.e., FCC KDB 996369 related to modular approval requirements), an external application must connect the RF signal in one of the following ways:

Via 50 coaxial antenna connector (common connectors are U-FL or SMA) placed as close as possible to the module's antenna pad. By soldering the antenna to the antenna connection line on the applications PCB (without the use of any connector) as close as possible to the modules antenna pad. By routing the application PCBs antenna to the modules antenna pad in the shortest pos-

sible way. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 22 2.2.2 RF Line Routing Design Page 17 of 39 Line Arrangement Instructions 2.2.2.1 Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software). Embedded Stripline This below figure shows line arrangement examples for embedded stripline. Figure 5: Embedded Stripline line arrangement PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 22 Page 18 of 39 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Figure 6: Micro-Stripline line arrangement samples PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 22 Page 19 of 39 Routing Examples 2.2.2.2 Interface to RF Connector Figure 7 shows a sample connection of a modules antenna pad at the bottom layer of the mod-

ule PCB with an application PCBs coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.40mm is recommended for an application with a PCB layer stack resembling the one of the PLAS9-X evaluation board. For different layer stacks the stripline width will have to follow stripline routing rules, avoiding 90 degree corners and using the shortest distance to the PCBs coaxial antenna connector. G N D G N D e.g. ANT_ MAIN G N D G N D G N D G N D Stripline (50 ohms) on top layer of evaluation board from antenna pad to module edge Width = 0.40 mm Ground connection Edge of module PCB 50 ohms microstrip line E.g., U.FL antenna connector Figure 7: Routing to applications RF connector PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 22 Page 20 of 39 Figure 8 shows a further sample connection of an evaluation modules antenna pad at the bot-

tom layer of the PLAS9-X evaluation module PCB with the PCBs coaxial antenna connector. The PLAS9-X evaluation module is part of the reference equipment used by Gemalto M2M for type approval (see also Section 5.3). G N D G N D e.g. Ant_ WGSM G N D Stripline (50 ohms) on top layer of evaluation board from antenna pad to module edge Width = 0,40 mm G N D Ground Connection Edge of Module PCB 50 ohms micro stripline E.g. U.FL antennaconnector G N D G N D Figure 8: Routing to PLAS9-X evaluation modules RF connector PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.3 Sample Application 22 2.3 Sample Application Page 21 of 39 Figure 9 shows a typical example of how to integrate an PLAS9-X module with an application. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply VCC C of the microcontroller. Low state of the open collector pulls the PWR_IND signal low and indicates that the PLAS9-X module is active, high level notifies the Power Down mode. If the module is in Power Down mode avoid current flowing from any other source into the mod-

ule circuit, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse flow. While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [3]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. Some LGA pads are connected to clocks or high speed data streams that might interfere with the modules antenna. The RF receiver would then be blocked at certain frequencies (self in-

terference). The external applications PCB tracks connected to these pads should therefore be well shielded or kept away from the antenna. This applies especially to the USB and UICC/

SIM interfaces. Disclaimer:

No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 9 and the information detailed in this section. As functionality and compliance with na-

tional regulations depend to a great amount on the used electronic components and the indi-

vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using PLAS9-X modules. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 2.3 Sample Application 22 Page 22 of 39 Figure 9: PLAS9-X sample application PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 3 Operating Characteristics 24 3 3.1 Operating Characteristics Operating Modes Page 23 of 39 The table below briefly summarizes the various operating modes referred to throughout the document. Table 3: Overview of operating modes Mode Normal operation Function GSM / GPRS /

UMTS / HSPA /

LTE SLEEP GSM / GPRS /

UMTS / HSPA /

LTE IDLE GPRS DATA Power saving set automatically when no call is in progress and the USB connection is detached. Power saving disabled or an USB connection active, but no data trans-

fer in progress. GPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). EGPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings). UMTS data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. HSPA data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. LTE data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. EGPRS DATA UMTS DATA HSPA DATA LTE DATA Power Down Airplane mode Normal shutdown after sending the AT^SMSO command. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied. Only a volt-

age regulator is active for powering the RTC, as long as operating voltage applied at BATT+

does not drop below approx. 1.4V. Airplane mode shuts down the radio part of the module, causes the module to log off from the GSM/GPRS network and disables all AT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see [1]). PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 3.2 Power Supply 24 3.2 Power Supply Page 24 of 39 PLAS9-X needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+:

BATT+_RF with 2 lines for the RF power amplifier supply BATT+ with 2 lines for the general power management. The main power supply from an external application has to be a single voltage source and has to be expanded to two sub paths (star structure). Each voltage domain must be decoupled by application with low ESR capacitors (> 47F MLCC @ BATT+; > 4x47F MLCC @ BATT+_RF) as close as possible to LGA pads. Figure 10 shows a sample circuit for decoupling capacitors for BATT+. Module SMT interface BATT+

BATT+_RF 2 2 1x 4x Decoupling capacitors e.g. 47F X5R MLCC Figure 10: Decoupling capacitor(s) for BATT+

BATT+

GND The power supply of PLAS9-X must be able to provide the peak current during the uplink trans-

mission. All key functions for supplying power to the device are handled by the power management IC. It provides the following features:

Stabilizes the supply voltages for the baseband using switching regulators and low drop lin-

ear voltage regulators. Switches the module's power voltages for the power-up and -down procedures. Delivers, across the VEXT line, a regulated voltage for an external application. LDO to provide SIM power supply. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 4 Mechanical Dimensions 26 4 Mechanical Dimensions Page 25 of 39 Mechanical Dimensions of PLAS9-X 4.1 Figure 11 shows a 3D view1 of PLAS9-X and provides an overview of the board's mechanical dimensions. For further details see Figure 12. Length:

Width:

Height:

40mm 32mm 2.8mm Top view Bottom view Figure 11: PLAS9-X top and bottom view 1. The coloring of the 3D view does not reflect the modules real color. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 4.1 Mechanical Dimensions of PLAS9-X 26 Page 26 of 39 Figure 12: Dimensions of PLAS9-X (all dimensions in mm) PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 5 Regulatory and Type Approval Information 32 Page 27 of 39 5 Regulatory and Type Approval Information Note that some regulatory and type approval information is still to be defined. 5.1 Directives and Standards PLAS9-X has been designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "PLAS9-X Hardware Interface Description".1 Table 4: Directives 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Table 5: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22, Part 24; US Equipment Authorization FCC Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields Product Safety Certification (Safety requirements) Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) Canadian Standard OET Bulletin 65

(Edition 97-01) UL 60 950-1 NAPRD.03 V5.32 RSS132, RSS133, RSS139 Table 6: Requirements of quality IEC 60068 DIN EN 60529 Environmental testing IP codes 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 5.1 Directives and Standards 32 Page 28 of 39 Table 7: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). SJ/T 11364-2006 According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products

(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Hardware Interface Description. Please see Table 8 for an overview of toxic or hazardous substances or ele-

ments that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 8: Toxic or hazardous substances or elements with defined concentration limits PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 5.2 SAR requirements specific to portable mobiles 32 Page 29 of 39 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable PLAS9-X based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagnetic fields (EMFs) from mobile telecommunication equipment (MTE) in the frequency range 30MHz - 6GHz IMPORTANT:

Manufacturers of portable applications based on PLAS9-X modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate relat-

ed to the specific portable mobile. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 5.3 Reference Equipment for Type Approval 32 5.3 Reference Equipment for Type Approval Page 30 of 39 The Gemalto M2M general reference setup submitted to type approve PLAS9-X is shown in the figure below: Figure 13 illustrates the setup for general tests and evaluation purposes. The evaluation module can be plugged directly onto the ALAS6A-DSB75 adapter. The GSM/UMTS/

LTE test equipment is still connected via SMA connectors on the ALAS6A-DSB75 adapter. The PC is connected via USB interface. Power Supply DSB75 3 1 4 C 1 5 0 4 X 0 1 4 X 1 1 1 4 X 1 1 2 1 X 1 PC U S B 3

. 0 1 5 2 0 6 X 5 0 1 P T 0 1 7 X 1 3 2 4 1 7 S 5 1 7 S 0 1 7 S 1 1 7 S 3 3 3 3 1 1 1 1 1 0 6 S 5 1 4 C 1 2 2 1 X 4 1 4 C 5 0 5 X 6 0 1 0 0 7 X 0 3 4 V 1 3 4 V 6 0 5 X 2 3 1 2 3 1 2 1 1 S 0 2 1 X 1 0 1 1 S 1 1 1 S 3 1 2 6 5 4 S 5 5 4 S 4 5 4 S 0 5 4 S 7 5 4 2 2 2 S 1 1 1 3 3 3 2 5 4 S 3 5 4 S 4 6 4 S 7 6 4 S 2 6 4 S 3 6 4 S 6 6 4 S 2 1 3 1 5 4 S 1 6 4 S 2 2 1 1 3 3 2 2 1 1 3 3 2 2 2 1 1 1 3 3 3 2 2 2 1 3 1 1 3 3 2 2 2 1 1 1 3 3 3 0 6 4 S 5 6 4 S 8 6 4 S 9 6 4 S 1 2 2 2 3 1 1 3 9 5 4 S 8 5 4 3 S 1 1 0 0 4 X 1 0 4 X 0 1 1 X 3 2 4 1 5 9 6 1 3 0 2 X 5 1 9 6 1 5 9 6 1 5 0 2 X 1 0 2 X 2 0 2 X 1 5 5 X 2 5 5 X 2 2 1 3 1 3 1 6 5 X 1 2 EVAL-Board with module W 2 1 0 5 S 1 3 4 0 5 S 3 0 5 S 1 3 1 2 3 1 2 0 0 5 S 1 3 2 0 5 S 2 3 1 2 0 1 2 0 1 5 X 0 1 1 1 5 X 1 9 1 9 CTS0 V234 TXD0 V230 RXD0 V235 RING0 V231 DCD0 V236 DTR0 DSR0 V232 V237 RTS0 V233 V238 V240 V239 V241 V242 V243 SYNC V244 6 0 2 X 4 0 2 X 1 1 9 0 1 3 0 7 X 1 2 2 4 5 5 X 3 1 3 1 3 1 2 2 0 0 2 S 1 0 2 S UMTS/LTE Rx Diversity /

MIMO GSM/UMTS/

LTE ALAS6A-

DSB75-

Adapter Figure 13: Reference equipment for type approval GSM / UMTS / LTE Testequipment Please note that for EMC and RF performance tests, slightly different reference equipment con-

figurations are used. If necessary, please contact Gemalto for further details. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 5.4 Compliance with FCC and IC Rules and Regulations 32 Page 31 of 39 5.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M modules reference application described in Section 5.3 will be registered under the following identifiers:

PLAS9-X:

FCC Identifier QIPPLAS9-X Industry Canada Certification Number: 7830A-PLAS9X Granted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating PLAS9-X modules are authorized to use the FCC Grants and Industry Canada Certificates of the PLAS9-X modules for their own final products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPPLAS9-X" and accordingly Contains IC: 7830A-PLAS9X. The integration is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 9 for FCC and IC. Table 9: Antenna gain limits for FCC and IC (TBD.) Maximum gain in operating band Band12, Band13, Band 29 700MHz (LTE) Band 5, 850MHz (GSM/WCDMA/LTE) Band 4, 1700MHz (WCDMA/LTE) Band 2, 1900MHz (GSM/WCDMA/LTE) FCC limit IC limit Unit dBi dBi dBi dBi IMPORTANT:

Manufacturers of portable applications incorporating PLAS9-X modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for por-

table mobiles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 5.4 Compliance with FCC and IC Rules and Regulations 32 Page 32 of 39 Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter-

ference in a residential installation. This equipment generates, uses and can radiate radio fre-

quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver Increase the separation between the equipment and receiver. is connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. If Canadian approval is requested for devices incorporating PLAS9-X modules the above note will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not con-

tain any information on how to install or remove the module from the final product. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 6 Document Information 36 6 6.1 Document Information Revision History Page 33 of 39 New document: "Cinterion PLAS9-X Hardware Interface Overview" Version 00.044 Chapter

--

What is new Initial document setup. 6.2 Related Documents

[1] PLAS9-X AT Command Set

[2] PLAS9-X Release Note

[3] Application Note 48: SMT Module Integration

[4] Universal Serial Bus Specification Revision 3.0

[5] Universal Serial Bus Specification Revision 2.0 6.3 Terms and Abbreviations Abbreviation ANSI ARP CA CE CS CS CSD DL dnu DRX DSB DTX EDGE EGSM EMC ESD ETS Description American National Standards Institute Antenna Reference Point Carrier Aggregation Conformit Europene (European Conformity) Coding Scheme Circuit Switched Circuit Switched Data Download Do not use Discontinuous Reception Development Support Board Discontinuous Transmission Enhanced Data rates for GSM Evolution Extended GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 6.3 Terms and Abbreviations 36 Page 34 of 39 Abbreviation ETSI FCC FDD GPRS GSM HiZ HSDPA I/O IMEI ISO ITU kbps LED LGA LTE MBB Mbps MCS MFBI MIMO MLCC MO MS MSL MT nc NTC PCB PCL PCS PD PDU PS PSK PU QAM Description European Telecommunications Standards Institute Federal Communications Commission (U.S.) Frequency Division Duplex General Packet Radio Service Global Standard for Mobile Communications High Impedance High Speed Downlink Packet Access Input/Output International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Land Grid Array Long term evolution Moisture barrier bag Mbits per second Modulation and Coding Scheme Multiple Frequency Band Indicator Multiple Input Multiple Output Multi Layer Ceramic Capacitor Mobile Originated Mobile Station, also referred to as TE Moisture Sensitivity Level Mobile Terminated Not connected Negative Temperature Coefficient Printed Circuit Board Power Control Level Personal Communication System, also referred to as GSM 1900 Pull Down resistor Protocol Data Unit Packet Switched Phase Shift Keying Pull Up resistor Quadrature Amplitude Modulation PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 6.3 Terms and Abbreviations 36 Page 35 of 39 Abbreviation R&TTE RF rfu ROPR RTC Rx SAR SELV SIM SMD SMS SMT SRAM SRB TE TPC TS Tx UL UMTS URC USB UICC USIM WCDMA Description Radio and Telecommunication Terminal Equipment Radio Frequency Reserved for future use Radio Output Power Reduction Real Time Clock Receive Direction Specific Absorption Rate Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Static Random Access Memory Signalling Radio Bearer Terminal Equipment Transmit Power Control Technical Specification Transmit Direction Upload Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus USIM Integrated Circuit Card UMTS Subscriber Identification Module Wideband Code Division Multiple Access PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 6.4 Safety Precaution Notes 36 6.4 Safety Precaution Notes Page 36 of 39 The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLAS9-X. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-

ure to comply with these precautions violates safety standards of design, manufacture and in-

tended use of the product. Gemalto M2M assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 7 Appendix 38 7 Appendix Page 37 of 39 List of Parts and Accessories 7.1 Table 10: List of parts and accessories Description PLAS9-X Supplier Gemalto M2M Standard module Ordering information Gemalto M2M IMEI:

Packaging unit (ordering) number:

L30960-N5130-B100 Module label number:

L30960-N5130-B100-11 PLAS9-X Evaluation module Gemalto M2M Ordering number: TBD. (PLAS9) DSB75 Support Box Gemalto M2M Ordering number: L36880-N8811-A100 Votronic Handset VOTRONIC /

Gemalto M2M Gemalto M2M ordering number: L36880-N8301-A107 Votronic ordering number: HH-SI-30.3/V1.1/0 Votronic Entwicklungs- und Produktionsgesellschaft fr elek-

tronische Gerte mbH Saarbrcker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 Email: contact@votronic.com Ordering numbers: 91228 91236 Sales contacts are listed in Table 11. Sales contacts are listed in Table 11 and Table 12. SIM card holder incl. push button ejector and slide-in tray U.FL antenna connector Molex Molex or Hirose 1. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 Cinterion PLAS9-X Hardware Interface Overview 7.1 List of Parts and Accessories 38 Page 38 of 39 Table 11: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 Table 12: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click:

http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217 Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Hirose Electric Europe B.V. UK Branch:

First Floor, St. Andrews House, Caldecotte Lake Business Park, Milton Keynes MK7 8LE Great Britain Hirose Electric Europe B.V. German Branch:

Herzog-Carl-Strasse 4 73760 Ostfildern Germany Phone: +49-711-456002-1 Fax: +49-711-456002-299 Email: info@hirose.de Hirose Electric Europe B.V. Hogehillweg 8 1101 CC Amsterdam Z-O Netherlands Phone: +44-1908-369060 Fax: +44-1908-369078 Phone: +81-03-3491-9741 Fax: +81-03-3493-2933 Phone: +31-20-6557-460 Fax: +31-20-6557-469 PLAS9-X_HIO_v00.044 Confidential / Preliminary 2017-09-19 39 About Gemalto Since 1996, Gemalto has been pioneering groundbreaking M2M and IoT products that keep our customers on the leading edge of innovation. We work closely with global mobile network operators to ensure that Cinterion modules evolve in sync with wireless networks, providing a seamless migration path to protect your IoT technology investment. Cinterion products integrate seamlessly with Gemalto identity modules, security solutions and licensing and monetization solutions, to streamline development timelines and provide cost efficiencies that improve the bottom line. As an experienced software provider, we help customers manage connectivity, security and quality of service for the long lifecycle of IoT solutions. For more information please visit www.gemalto.com/m2m, www.facebook.com/gemalto, or Follow@gemaltoIoT on Twitter. Gemalto M2M GmbH Werinherstrasse 81 81541 Munich Germany GEMALTO.COM/M2M

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