FCC ID: QIPPLPS9-W Cinterion PLPS9-W

 

Cinterion PLPS9 Hardware Interface Overview Version:

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00.052a PLPS9_HIO_v00.052a GEMALTO.COM/M2M Cinterion PLPS9 Hardware Interface Overview Page 2 of 52 2 Document Name: Cinterion PLPS9 Hardware Interface Overview Version:

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2019-07-25 PLPS9_HIO_v00.052a Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-

UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NON-

EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIV-

ERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-

tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2019, Gemalto M2M GmbH, a Thales Company Trademark Notice Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corpora-

tion in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview Contents 52 Page 3 of 52 Contents 1 2 3 4 5 Introduction ................................................................................................................. 7 Product Variants ................................................................................................ 7 1.1 Key Features at a Glance .................................................................................. 8 1.2 Supported Frequency Bands .............................................................. 12 1.2.1 1.2.2 Supported CA Configurations ............................................................. 13 System Overview ............................................................................................. 17 1.3 Interface Characteristics .......................................................................................... 18 2.1 Application Interface ........................................................................................ 18 2.1.1 USB Interface...................................................................................... 18 Serial Interface ASC0 ......................................................................... 19 2.1.2 2.1.3 Serial Interface ASC1 ......................................................................... 20 Inter-Integrated Circuit Interface.......................................................... 21 2.1.4 2.1.5 UICC/SIM/USIM Interface................................................................... 22 2.1.6 Digital Audio Interface......................................................................... 24 2.1.6.1 Pulse Code Modulation Interface ........................................ 24 2.1.6.2 Inter-IC Sound Interface...................................................... 24 2.1.7 Analog-to-Digital Converter (ADC)...................................................... 24 2.1.8 GPIO Interface .................................................................................... 24 2.1.9 eMMC Interface .................................................................................. 24 GSM/UMTS/LTE Antenna Interface................................................................. 25 2.2.1 Antenna Installation ............................................................................ 26 2.2.2 RF Line Routing Design...................................................................... 27 2.2.2.1 Line Arrangement Instructions ............................................ 27 2.2.2.2 Routing Examples ............................................................... 29 GNSS Antenna Interface ................................................................................. 30 Sample Application .......................................................................................... 32 2.3 2.4 2.2 GNSS Interface .......................................................................................................... 34 Mechanical Dimensions and Mounting................................................................... 35 4.1 Mechanical Dimensions of PLPS9................................................................... 35 Regulatory and Type Approval Information ........................................................... 37 Directives and Standards................................................................................. 37 5.1 SAR requirements specific to portable mobiles ............................................... 40 5.2 5.3 Reference Equipment for Type Approval ......................................................... 41 Compliance with FCC and ISED Rules and Regulations................................. 42 5.4 PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview Contents 52 Page 4 of 52 6 7 Document Information.............................................................................................. 45 Revision History ............................................................................................... 45 6.1 6.2 Related Documents ......................................................................................... 46 Terms and Abbreviations ................................................................................. 46 6.3 6.4 Safety Precaution Notes .................................................................................. 49 Appendix.................................................................................................................... 50 List of Parts and Accessories........................................................................... 50 7.1 PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview Tables 52 Page 5 of 52 Tables Table 1:

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Supported frequency bands for each PLPS9 variant ..................................... 12 Supported CA configurations ......................................................................... 13 Signals of the SIM interface (SMT application interface) ............................... 22 Return loss in the active band........................................................................ 25 Directives ....................................................................................................... 37 Standards of North American type approval .................................................. 37 Standards of European type approval............................................................ 37 Requirements of quality ................................................................................. 38 Standards of the Ministry of Information Industry of the Peoples Republic of China ............................................................................ 39 Toxic or hazardous substances or elements with defined concentration limits ............................................................................................................... 39 Antenna gain limits for FCC for PLPS9-W ..................................................... 42 Antenna gain limits for FCC and ISED for PLPS9-X...................................... 43 List of parts and accessories.......................................................................... 50 Molex sales contacts (subject to change) ...................................................... 51 Hirose sales contacts (subject to change) ..................................................... 51 PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview Figures 52 Page 6 of 52 Figures Figure 1:

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PLPS9 system overview ................................................................................ 17 USB circuit ..................................................................................................... 18 Serial interface ASC0..................................................................................... 19 Serial interface ASC1..................................................................................... 20 I2C interface connected to VEXT ................................................................... 21 First UICC/SIM/USIM interface ...................................................................... 23 Second UICC/SIM/USIM interface ................................................................. 23 Embedded Stripline line arrangement............................................................ 27 Micro-Stripline line arrangement samples...................................................... 28 Routing to applications RF connector ........................................................... 29 Routing detail ................................................................................................. 29 Supply voltage for active GNSS antenna....................................................... 30 ESD protection for passive GNSS antenna ................................................... 31 PLPS9 sample application ............................................................................. 33 PLPS9 top and bottom view........................................................................ 35 Dimensions of PLPS9 (all dimensions in mm) ............................................... 36 Reference equipment for type approval ......................................................... 41 PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 1 Introduction 17 1 Introduction Page 7 of 52 This document1 describes the hardware of the Cinterion PLPS9 products listed in Section 1.1. It helps you quickly retrieve interface specifications, electrical and mechanical details and in-

formation on the requirements to be considered for integrating further components. 1.1 Product Variants This document applies to the following Gemalto M2M modules:

Cinterion PLPS9-W Cinterion PLPS9-X Where necessary a note is made to differentiate between the various product variants and re-

leases. 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Gemalto M2M product. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Page 8 of 52 Cinterion PLPS9 Hardware Interface Overview 1.2 Key Features at a Glance 17 1.2 Key Features at a Glance Feature General Frequency bands Implementation Note: Not all of the frequency bands (and 3GPP technologies) mentioned throughout this document are supported by every PLPS9 products variant. Please refer to Section 1.2.1 for an overview of the frequency bands sup-

ported by each PLPS9 product variant. GSM class Small MS Output power

(according to Release 99) GSM/GPRS/UMTS:

Class 4 (+33dBm 2dB) for EGSM850 and EGSM900 Class 1 (+30dBm 2dB) for GSM1800 and GSM1900 Class E2 (+27dBm 3dB) for GSM 850 8-PSK and GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK and GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for all supported WCDMA FDD bands Output power

(according to Release 8) LTE (FDD):

Class 3 (+23dBm 2dB) for all supported LTE FDD bands LTE (TDD):

Class 3 (+23dBm 2dB) for all supported LTE TDD bands Power supply Operating temperature

(board temperature) 3.3V < VBATT+ < 4.2V Normal operation: -30C to +85C Restricted operation: -40C to +95C Dimensions: 48mm x 36mm x 3mm Weight: approx. 10.5g Physical RoHS All hardware components fully compliant with EU RoHS Directive LTE features LTE Advanced up to 3GPP Release 11 LTE Advanced Pro up to 3GPP Release 12, 13 Downlink carrier aggregation (CA) to increase bandwidth, and thereby increase bitrate:

Maximum aggregated bandwidth: 80MHz Maximum number of component carriers: 4 Inter-band FDD, TDD Intra-band FDD, TDD, contiguous, non-contiguous Supported inter- and intra-band CA configurations: See Section 1.2.2. If 4x4 MIMO is supported by the mobile network:

Downlink:

Up to 1Gbps CAT 16 with 4x4 MIMO 2 CA DL + 4(2)x2 MIMO 1 CA DL or up to 800Mbps CAT 15 with 4x4 MIMO 2 CA DL Uplink:

Up to 150Mbps CAT 13 with 2 CA UL If 4(2)x2 MIMO is supported by the mobile network:

Downlink:

Up to 800Mbps CAT 15 with 4 CA DL Uplink:

Up to 150Mbps CAT 13 with 2 CA UL PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 1.2 Key Features at a Glance 17 Page 9 of 52 Feature Implementation HSPA features 3GPP Release 8 UMTS features UE CAT. 14, 24 DC-HSPA+ DL 42Mbps HSUPA UL 5.76Mbps Compressed mode (CM) supported according to 3GPP TS25.212 3GPP Release 8 PS data rate 384 kbps DL / 384 kbps UL GSM / GPRS / EGPRS features Data transfer EDGE E2 power class for 8 PSK GPRS:

Multislot Class 12 Mobile Station Class B Coding Scheme 1 4 EGPRS:

Multislot Class 12 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 NACC, extended UL TBF Mobile Station Class B SRB loopback and test mode B 8-bit, 11-bit RACH 1 phase/2 phase access procedures Link adaptation and IR SMS Point-to-point MT and MO, Cell broadcast, Text and PDU mode Software AT commands Hayes, 3GPP TS 27.007 and 27.005, and proprietary Gemalto M2M com-

mands Embedded Linux platform Embedded Linux with API (ARC, RIL). Memory space available for Linux applications is 4GB in the flash file sys-

tem, and 2GB RAM. SIM Application Toolkit SAT Release 99, letter classes b, c, e with BIP and RunAT support Firmware update Firmware update supported. GNSS Features Protocol Modes General NMEA Standalone GNSS (GPS, GLONASS, Beidou, Galileo) Integrated gpsOne 9HT support (GPS, GLONASS, Beidou, Galileo) QZSS and SBAS support Power saving modes DC feed bridge and control of power supply for active antenna via GPIO PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 1.2 Key Features at a Glance 17 Page 10 of 52 Feature Interfaces Module interface Implementation Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket. For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equip-

ment. 50. 2 GSM/UMTS/LTE main antennas, 2 LTE Diversity/MIMO antennas,

(active/passive) GNSS antenna USB 2.0 High Speed (480Mbit/s) device interface or USB 3.0 Super Speed (5Gbit/s) device interface for debugging purposes 8-wire (plus GND line) interface unbalanced, asynchronous Fixed baud rates from 115,200 to 921,600bps Supports RTS0/CTS0 hardware flow control 4-wire, unbalanced asynchronous interface Fixed baud rates: 115,200bps to 921,60bps Supports RTS1/CTS1 hardware flow control 2-wire, unbalanced asynchronous interface at RXD2 and TXD2 lines used for debugging purposes (optional) ASC0:

Linux controlled only:

ASC1:

ASC2:

2 UICC interfaces (switchable):

Supported chip cards: UICC/SIM/USIM 2.85V, 1.8V 1 I2C interface 1 digital interface (PCM/I2S) Switch-on by hardware signal IGT Switch-off by AT command (AT^SMSO) or IGT (option) Automatic switch-off in case of critical temperature or voltage conditions Reset Orderly shutdown and reset by AT command Emergency-off Emergency-off by hardware signal EMERG_OFF SAIC (Single Antenna Interference Cancellation) / DARP (Downlink Advanced Receiver Performance) Rx Diversity (receiver type 3i - 64-QAM) / MIMO HORxD (Higher Order Receive Diversity) with up to 4 antennas 15 I/O pins of the application interface programmable as GPIO. GPIO1 can be configured as dead reckoning synchronization signal. GPIOx can be configured as low current indicator. Programming is done via AT commands. Emergency call handling EU eCall 3GPP Release 10 compliant (modem and GNSS) ERA compliant (modem and GNSS) PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Antenna USB Serial interface UICC interface I2C interface Audio Power on/off, Reset Power on/off Special Features Antenna GPIO Cinterion PLPS9 Hardware Interface Overview 1.2 Key Features at a Glance 17 Page 11 of 52 Feature ADC inputs JTAG eMMC PCIe Evaluation kit Implementation Analog-to-Digital Converter with unbalanced analog inputs for example for

(external) antenna diagnosis JTAG interface for debug purposes Linux controlled:

Embedded Multi-Media Card interface Linux controlled:

PCIe interface Evaluation module PLPS9 module soldered onto a dedicated PCB. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 1.2 Key Features at a Glance 17 1.2.1 Supported Frequency Bands Page 12 of 52 The following table lists the supported frequency bands for each of the PLPS9 product variants mentioned in Section 1.1. Table 1: Supported frequency bands for each PLPS9 variant Band

-W

-X GSM/GPRS/EDGE 850MHz 900MHz 1800MHz 1900MHz UMTS/HSPA Bd.I (2100MHz) Bd.II (1900MHz) Bd.III (1800MHz) Bd.IV (1700MHz) Bd.V (850MHz) Bd.VI (850MHz) Bd.VIII (900MHz) Bd.XIX (850MHz) TD-SCDMA Bd.34 (2000MHz) Bd.39 (1900MHz) LTE-FDD1 Bd.1 (2100MHz) Bd.2 (1900MHz) Bd.3 (1800MHz) Bd.4 (1700MHz) Bd.5 (850MHz) Bd.7 (2600MHz) Bd.8 (900MHz) Bd.12 (700MHz) Bd.13 (700MHz) Bd.18 (850MHz) Bd.19 (850MHz) Bd.20 (800MHz) Bd.26 (850MHz) Bd.28 (700MHz) x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 1.2 Key Features at a Glance 17 Page 13 of 52 Table 1: Supported frequency bands for each PLPS9 variant Band

-W

-X Bd.29 (700MHz)

<supplementary downlink>

Bd.30 (2300MHz)2

<supplementary downlink only acc. FCC regulation>

Bd.32 (1500MHz)

<supplementary downlink>

Bd.66 (1700MHz)3 LTE-TDD4 Bd.34 (2000MHz) Bd.38 (2600MHz) Bd.39 (1900MHz) Bd.40 (2300MHz) Bd.41 (2600MHz)5 x x x x x x 1. Bd.5, Bd.8, Bd.29, and Bd.32 support 2x2 MIMO only, whereas Bd.1, Bd.2, Bd.3, Bd.4, Bd.7, and Bd.66 support 4x4 MIMO in downlink. Also, Bd.2, Bd.3, Bd.4, Bd.5, Bd.8, Bd.12, Bd.13, Bd.18, Bd.19, Bd.20, Bd.26, Bd.28 support 4 antenna RX Diversity (HoRXD). 2. Band 30 support is disabled by means of software due to AT&T advice. 3. With the Band 66 support, the frequency ranges 1755-1780 MHz and 2155-2180 MHz derived from pair-

ing the 1710-1780 and 2110-2180 MHz frequency bands are compliant with 27.5(h) and 27.75. 4. Bd.34 supports 2x2 MIMO only, whereas Bd.38, Bd.39, Bd.40, and Bd.41 support 4x4 MIMO in downlink. 5. Note: Out of the 3GPP specified frequency range for LTE Band 41, only that part which is used in China and Japan (2545MHz to 2655MHz) is supported by PLPS9. 1.2.2 Supported CA Configurations The following table lists the supported CA configurations (aka supported band combinations) for each of the PLPS9 product variants mentioned in Section 1.1. Table 2: Supported CA configurations Downlink CA Uplink CA Downlink

(4x4 MIMO) Bandwidth combination set Product variants

(PLPS9-...) Intra-band continuous 1C 2C 3C 7B 7C

38C 40C

CA_3C CA_38C CA_40C 0, 1 0, 1 0 0 0 0 0 0 0, 1 0, 1 CA_7C 0, 1, 2 CA_1C CA_2C CA_3C CA_5B CA_7B CA_7C CA_8B CA_12B CA_38C CA_40C CA_40D PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 x x x X, W X, W X, W W X W W X W W W Cinterion PLPS9 Hardware Interface Overview 1.2 Key Features at a Glance 17 Page 14 of 52 Uplink CA CA_41C CA_41C Bandwidth combination set Product variants

(PLPS9-...) 0, 1, 2, 3 Table 2: Supported CA configurations Downlink CA Downlink

(4x4 MIMO) 41C

66B 66C 2A-2A 4A-4A Intra-band non-continuous CA_66A-66A 66A-66A Inter-band (two bands) CA_41C CA_41D CA_66B CA_66C CA_2A-2A CA_4A-4A CA_1A-3A CA_1A-3C CA_1A-5A CA_1A-7A CA_1A-8A CA_1A-18A CA_1A-19A CA_1A-20A CA_1A-26A CA_1A-28A CA_2A-2A-4A CA_2A-2A-4A-4A CA_2A-2A-5A CA_2A-2A-12A CA_2A-2A-13A CA_2A-2A-66A CA_2A-4A CA_2A-4A-4A CA_2A-5A CA_2A-12A CA_2A-12B CA_2A-13A CA_2A-28A CA_2A-29A CA_2A-66A CA_2A-66A-66A CA_2C-5A CA_2C-12A CA_2C-29A CA_3A-3A-8A CA_3A-5A CA_3A-7A CA_3A-7B

1A 1A 1A 1A 1A 1A 1A 2A 2A 2A

2A 2A 2A 2A 2A 2A 2C 2C 2C 3A 3A

CA_3C CA_1A-5A CA_1A-8A CA_1A-18A 0, 1, 2 0, 1 CA_1A-26A CA_1A-28A 0, 1 0, 1 0, 1 0, 1 0, 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0, 1, 2 0, 1 0, 1, 2 0, 1 0, 1, 2 0, 1, 2 CA_7C CA_3A-8A CA_3A-20A 0, 1, 2, 3, 4 0, 1 0, 1 0 W W X X X X X W W W W W W W W W W X X X X X X X X X X X X X X X X X X X W W W W PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 1.2 Key Features at a Glance 17 Page 15 of 52 Table 2: Supported CA configurations Downlink CA Uplink CA Downlink

(4x4 MIMO) Bandwidth combination set Product variants

(PLPS9-...)

3A 3A 3A 3A 3A 3C

3C 3C 4A

4A 4A 4A

4A 4A 4A 4A 7A

7A 7A 7A 7A 7B 7C

66A 66A 66A 66A

CA_3A-7C CA_3A-8A CA_3A-19A CA_3A-20A CA_3A-26A CA_3A-28A CA_3C-5A CA_3C-7A CA_3C-7C CA_3C-8A CA_3C-20A CA_3C-28A CA_4A-4A-5A CA_4A-4A-7A CA_4A-4A-12A CA_4A-4A-13A CA_4A-5A CA_4A-7A CA_4A-12A CA_4A-12B CA_4A-13A CA_4A-28A CA_4A-29A CA_5A-7A CA_5A-12A CA_5A-66A CA_7A-8A CA_7A-12A CA_7A-20A CA_7A-28A CA_7B-28A CA_7C-28A CA_8A-20A CA_12A-66A CA_12A-66A-66A CA_13A-66A CA_13A-66A-66A CA_18A-28A CA_20A-32A CA_39A-41A CA_39A-41C CA_39C-41A CA_3C CA_3A-20A CA_3C-8A, CA_3C 0

CA_7A-20A CA_7C CA_41C CA_39C 0, 1, 2, 3, 4, 5 0, 1, 2, 3 0, 1 0 0, 1 0, 1 0, 1 0, 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0, 1 0, 1 0, 1 0, 1 0, 1, 2 0, 1 0, 1, 2 0, 1 0, 1 0, 1 0, 1 0, 1, 2, 3, 4, 5 W W W W W W W W W W W W X X X X X X X X X X X X X X W X W W X X X X W W W W W X, W X, W X, W CA_5A-7A X, W CA_5A-66A-66A 66A 66A PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 1.2 Key Features at a Glance 17 Page 16 of 52 Table 2: Supported CA configurations Inter-band (three bands) Downlink CA Uplink CA Downlink

(4x4 MIMO) Bandwidth combination set Product variants

(PLPS9-...) CA_1A-3A-5A CA_1A-3A-8A CA_1A-3A-19A CA_1A-3A-20A CA_1A-3A-26A CA_1A-3A-28A CA_1A-5A-7A CA_1A-7A-8A CA_1A-7A-20A CA_1A-7A-28A CA_1A-18A-28A 1A CA_1A-19A-28A CA_2A-2A-4A-12A CA_2A-2A-12A-66A CA_2A-4A-4A-12A CA_2A-4A-5A CA_2A-4A-12A CA_2A-4A-13A CA_2A-4A-29A CA_2A-5A-66A CA_2A-12A-66A CA_2A-13A-66A CA_3A-7A-8A CA_3A-7A-28A CA_3A-7C-28A CA_4A-7A-12A CA_2A-12A-66A-66A -

0, 1 0, 1, 2, 3 CA_1A-5A, CA_3A-5A CA_1A-8A, CA_3A-8A CA_3A-20A CA_1A-5A, CA_5A-7A 0, 1 0, 1, 2 0, 1 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0, 1

CA_3A-8A 0, 1, 2 W W W W W W W W W W W W X X X X X X X X X X X W W W X PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Page 17 of 52 Cinterion PLPS9 Hardware Interface Overview 1.3 System Overview 17 1.3 System Overview GNSS TRX1 TRX2 RX3 RX4 Power Supply Antenna-

diagnostic External Antenna Switch (optional) Application Antenna-

diagnostic SIM Card GNSS GSM/UMTS/LTE 3 x ANT _SW GPIO 4 x ADC UICC PLPS9 USB 2.0/3.0 PCIe ASC0 ASC1 GPIO eMMC 2 x I2C Digital Audio IGT EMERG_OFF Power Supply B S U e I C P e c a f r e t n I l a i r e S e c a f r e t n I l a i r e S C 2 I S 2 I

M C P I O P G e c a f r e t n I C M M e T X E V D N I _ R W P Power Supply Application Interfaces Application Figure 1: PLPS9 system overview PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2 Interface Characteristics 34 2 Interface Characteristics Page 18 of 52 PLPS9 is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 USB Interface PLPS9 supports a USB 3.0 Super Speed (5Gbps) device interface, and alternatively a USB 2.0 device interface that is High Speed compatible. The USB interface is primarily intended for use as debugging interface. The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLPS9 is designed as a self-powered device compliant with the Universal Serial Bus Specifi-

cation Revision 3.01. SMT lin. reg. Module USB part a) 2.0 USB_HS _PHY USB 2.0 Controller 2.0 USB_SS _PHY USB 3.0 3.0 Controller 100nF 100nF VBUS Detection only 1F BATT+

GND c) USB_DP USB_DNc) USB_SSRX_N USB_SSRX_P USB_SSTX_N USB_SSTX_P c) c) c) c) VUSB_IN b) All serial (including R S) and pull -up resistors for data lines are implemented . Since VUSB_IN is used for detection only it is recommended not to add any further blocking capacitors on a) b) the VUSB_IN line. c) If the USB interface is operated with super or high speeds, it is recommended to take special care routing the data lines. Application layout should implement a differential impedance of 90 ohms for proper signal integrity . Figure 2: USB circuit To properly connect the module's USB interface to the external application, a USB 3.0 or 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB driver distributed with PLPS9 needs to be installed. 1. The specification is ready for download on http://www.usb.org/developers/docs/

PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.1 Application Interface 34 2.1.2 Serial Interface ASC0 Page 19 of 52 PLPS9 offers a 4-wire (8-wire prepared) (plus GND) unbalanced, asynchronous interface ASC0 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V

(for high data bit or inactive state). PLPS9 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 3: Serial interface ASC0 Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0. Features:

The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. Configured for 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 115,200 to 921,600bps. Supports RTS0/CTS0 hardware flow control. Note: If the ASC0 serial interface is the applications only interface, it is suggested to connect test points on the USB signal lines as a potential tracing possibility. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.1 Application Interface 34 2.1.3 Serial Interface ASC1 Page 20 of 52 Four PLPS9 lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). PLPS9 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 4: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake. On ASC1 no RING line is available. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 115,200 bps to 921,600 bps. Supports RTS1/CTS1 hardware flow. Linux controlled only. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.1 Application Interface 34 2.1.4 Inter-Integrated Circuit Interface Page 21 of 52 PLPS9 provides an Inter-Integrated Circuit (I2C) interface. I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line. Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relation-

ships exist at all times. The module operates as master-transmitter or as master-receiver. The customer application transmits or receives data only on request of the module. The applications I2C interface can be powered via the VEXT line of PLPS9. If connected to the VEXT line, the I2C interface will properly shut down when the module enters the Power Down mode. In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage

(e.g., VEXT) via a pull-up resistor. Module VEXT I2CCLK I2CDAT GND Application p u l l u p R p u l l u p R I2CCLK I2CDAT GND Figure 5: I2C interface connected to VEXT Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.1 Application Interface 34 2.1.5 UICC/SIM/USIM Interface Page 22 of 52 PLPS9 has two UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102 221. It is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 2.85V and 1.8V SIM cards. The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with PLPS9 and is part of the Gemalto M2M reference equipment submitted for type approval. See Chapter 7 for Molex ordering numbers. Table 3: Signals of the SIM interface (SMT application interface) Signal Description Ground connection for SIM interfaces. Optionally a separate SIM ground line may be used to improve EMC. Chipcard clock line for 1st and 2nd SIM interface. SIM supply voltage line for 1st and 2nd SIM interface. Serial data line for 1st and 2nd SIM interface, input and output. Chipcard reset line for 1st and 2nd SIM interface. Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCIN signal is active low. The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of PLPS9. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLPS9. GND CCCLK1 CCCLK2 CCVCC1 CCVCC2 CCIO1 CCIO2 CCRST1 CCRST2 CCIN1 CCIN2 PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.1 Application Interface 34 Page 23 of 52 Module CCCLK1 1n SIM /

UICC open: Card removed closed: Card inserted CCIN1 CCRST1 GND CCIO1 e c a f r e t n i n o i t a c i l p p a T M S CCVCC1 220n Figure 6: First UICC/SIM/USIM interface The total cable length between the SMT application interface pads on PLPS9 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLKx signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line. Note: Figure 6 shows how to connect a SIM card holder to the first SIM interface. With the sec-

ond SIM interface some internally integrated components on the SIM circuit will have to be ex-

ternally integrated as shown for the second SIM interface in Figure 7. The external components at CCIN2 should be populated as close as possible to the signals SMT pad Module CCCLK2 e c a f r e t n i n o i t a c i l p p a T M S VEXT 22k CCIN2 Open: Card removed Closed: Card inserted 2k2 100pF CCRST2 1nF SIM /

UICC GND CCIO2 10k CCVCC2 220nF Figure 7: Second UICC/SIM/USIM interface PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.1 Application Interface 34 2.1.6 Digital Audio Interface Page 24 of 52 PLPS9 supports one digital audio interface that can be employed as either as pulse code mod-

ulation (PCM) or Inter-IC Sound (I2S) interface. Default setting is I2S. Please note that the first DAI is reserved for future use. 2.1.6.1 Pulse Code Modulation Interface PLPS9's PCM interface can be used to connect audio devices capable of pulse code modula-

tion. The PCM functionality is limited to the use of wideband codecs with 16kHz sample rate only. The PCM interface runs at 16 kHz sample rate (62.5s frame length), while the signal pro-

cessing maintains this rate in a wideband AMR call or samples automatically down to 8kHz in a narrowband call. Therefore, the PCM sample rate is independent of the audio bandwidth of the call. 2.1.6.2 Inter-IC Sound Interface The I2S Interface is a standardized bidirectional I2S based digital audio interface for transmis-

sion of mono voice signals for telephony services. The I2S properties and capabilities comply with the requirements layed out in the Phillips I2S Phillips I2S Bus Specifications, revised June 5, 1996. 2.1.7 Analog-to-Digital Converter (ADC) PLPS9 provides four unbalanced ADC input lines: ADC[1-2...4-5]_IN. They can be used to measure four independent, externally connected DC voltages in the range of 0.1V to 1.7V. 2.1.8 GPIO Interface PLPS9 has 15 GPIOs for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. 2.1.9 eMMC Interface PLPS9 has an eMMC interface that can be used for test purposes, e.g., to write crash dumps from the modules FFS to eMMC. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 34 2.2 GSM/UMTS/LTE Antenna Interface Page 25 of 52 The PLPS9 GSM/UMTS/LTE antenna interface comprises two GSM/UMTS/LTE main anten-

nas as well as two UMTS/LTE Rx diversity/MIMO antennas to improve signal reliability and quality1. The interface has an impedance of 50. PLPS9 is capable of sustaining a total mis-

match at the antenna interface without any damage, even when transmitting at maximum RF power. The external antennas must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Matching networks are not in-

cluded on the PLPS9 PCB and should be placed in the host application, if the antenna does not have an impedance of 50. Regarding the return loss PLPS9 provides the following values in the active band:

Table 4: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit

> 8dB Undefined mismatch

> 12dB

> 12dB 1. By delivery default the UMTS/LTE Rx diversity/MIMO antennas are configured as available for the mod-

ule since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna set-

tings. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 34 2.2.1 Antenna Installation Page 26 of 52 The antennas are connected by soldering the antenna pads (ANT_TRX1, ANT_TRX2, ANT_RX3, ANT_RX4; ANT_GNSS) and their neighboring ground pads directly to the applica-

tions PCB. The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application PCB. The wiring of the antenna connection, starting from the antenna pad to the applications anten-

na must result in a 50 line impedance. Line width and distance to the GND plane need to be optimized with regard to the PCBs layer stack. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-

nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-

tion 2.2.2 for instructions of how to design the antenna connection in order to achieve the required 50 line impedance. For type approval purposes (i.e., FCC KDB 996369 related to modular approval requirements), an external application must connect the RF signal in one of the following ways:

Via 50 coaxial antenna connector (common connectors are U-FL or SMA) placed as close as possible to the module's antenna pad. By soldering the antenna to the antenna connection line on the applications PCB (without the use of any connector) as close as possible to the modules antenna pad. By routing the application PCBs antenna to the modules antenna pad in the shortest pos-

sible way. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 34 2.2.2 RF Line Routing Design 2.2.2.1 Line Arrangement Instructions Page 27 of 52 Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software). Embedded Stripline This below figure shows line arrangement examples for embedded stripline. Figure 8: Embedded Stripline line arrangement PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 34 Page 28 of 52 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Figure 9: Micro-Stripline line arrangement samples PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.2 GSM/UMTS/LTE Antenna Interface 34 2.2.2.2 Routing Examples Page 29 of 52 Interface to RF Connector Figure 10 and Figure 11 show a sample connection of a modules antenna pad at the bottom layer of the module PCB with an application PCBs coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.50mm/0.75mm and the spaces of 0.35mm/0.3mm are only recommended for an application with a PCB layer stack resembling the one of the PLPS9 eval-

uation board, and with layer 2 as well as layer 3 cut clear. For different layer stacks the stripline width will have to follow stripline routing rules, avoiding 90 degree corners and using the short-

est distance to the PCBs coaxial antenna connector. G N D G N D e.g. ANT_ TRX1 Stripline (50 ohms) on top layer of evaluation board from antenna pad to module edge Width = 0.50 mm Ground connection Edge of module PCB 50 ohms microstrip line E.g., U.FL antenna connector G N D G N D Figure 10: Routing to applications RF connector RF track under module:

Line/space: 500/350m Module RF track outside module:

Line/space: 750/300m Figure 11: Routing detail PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.3 GNSS Antenna Interface 34 2.3 GNSS Antenna Interface Page 30 of 52 In addition to the RF antenna interface PLPS9 also has a GNSS antenna interface. The GNSS pads shape is the same as for the RF antenna interface (see Section 2.2.1). It is possible to connect active or passive GNSS antennas. In either case they must have 50 impedance. The simultaneous operation of GSM/UMTS/LTE and GNSS is implemented. PLPS9 provides the signal GNSS_EN to enable an active GNSS antenna power supply. Figure 12 shows the flexibility in realizing the power supply for an active GNSS antenna by giving a sample circuit realizing the supply voltage for an active GNSS antenna. Module Application:

GNSS Receiver Antenna Matching ANT_GNSS RF DC DC LNA Active GNSS Antenna ANT_GNSS_DC BATT+

VGNSS

(3.2V) GNSS_EN IN OUT LDO EN LP3985IM5-3.2 Rs Is 1R0 Rv 100

Io Current Sensor FAN4010 Io Rg 3k3 ADCx_IN Si1023X_1 10k 1u ESD Protection Si1023X_2 10k Ug Figure 12: Supply voltage for active GNSS antenna PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.3 GNSS Antenna Interface 34 Page 31 of 52 Figure 13 shows a sample circuit realizing ESD protection for a passive GNSS antenna. Con-

necting the input ANT_GNSS_DC to GND prevents ESD from coupling into the module. Module SMT interface GNSS _EN Not used 100nF ANT_GNSS _DC 10nH ANT_GNSS To GNSS receiver

(Optional) ESD protection 0R Passive GNSS antenna Figure 13: ESD protection for passive GNSS antenna PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.4 Sample Application 34 2.4 Sample Application Page 32 of 52 Figure 14 shows a typical example of how to integrate an PLPS9 module with an application. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply VCC C of the microcontroller. Low state of the open collector pulls the PWR_IND signal low and indicates that the PLPS9 module is active, high level notifies the Power Down mode. If the module is in Power Down mode avoid current flowing from any other source into the mod-

ule circuit, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse flow. While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [3]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. Some LGA pads are connected to clocks or high speed data streams that might interfere with the modules antenna. The RF receiver would then be blocked at certain frequencies (self in-

terference). The external applications PCB tracks connected to these pads should therefore be well shielded or kept away from the antenna. This applies especially to the USB and UICC/

SIM interfaces. Depending on the micro controller used by an external application PLPS9s digital input and output lines may require level conversion. Disclaimer:

No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 14 and the information detailed in this section. As functionality and compliance with na-

tional regulations depend to a great amount on the used electronic components and the indi-

vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using PLPS9 modules. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 2.4 Sample Application 34 Page 33 of 52 47k 47k 100k VCC C VDD

(1.8V) VCC C GSM/UMTS/LTE GSM/UMTS/LTE UMTS/LTE UMTS/LTE GNSS IGT ANT_TRX1 EMERG _OFF ANT_TRX2 PWR_IND ANT_RX4 VEXT (1.8V) ANT_GNSS ANT_RX3 GND GND GND GND GND GND GND GND GND GND OE VCCB V CCA 4 Level Controller PCM interface lines 4 PCM2_... BATT+

2 2 BATT+_RF Module 47F Ultra low ESR Rechargeable Lithium battery

NTC 4 x 47F Ultra low ESR Serial interface ASC0 RXD0, TXD0, ... USB 2.0 HS Mode Or Mode USB 3.0 SS VUSB_IN USB_DP, USB_DN USB_SS... 8 2 4 Optional low capacitance ESD protection**

CCIN CCVCC CCRST CCIO CCCLK GND SIM 220nF 1nF All SIM components should be close to card holder. Keep SIM wires low capacitive. Figure 14: PLPS9 sample application PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 3 GNSS Interface 34 3 GNSS Interface Page 34 of 52 PLPS9 integrates a GNSS receiver that offers the full performance of GPS/GLONASS technol-

ogy. The GNSS receiver is able to continuously track all satellites in view, thus providing accu-

rate satellite position data. The integrated GNSS receiver supports the NMEA protocol via USB or ASC0 interface. NMEA is a combined electrical and data specification for communication between various (marine) electronic devices including GNSS receivers. It has been defined and controlled by the US based National Marine Electronics Association. For more information on the NMEA Standard please refer to http://www.nmea.org. Depending on the receivers knowledge of last position, current time and ephemeris data, the receivers startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowl-

edge of its last position or time, a startup takes considerably longer than if the receiver has still knowledge of its last position, time and almanac or has still access to valid ephemeris data and the precise time. By default, the GNSS receiver is switched off. It has to be switched on and configured. Dead Reckoning Sync Line:

Dead reckoning solutions are used in (automotive) platforms to determine the (vehicles) loca-

tion even when there is no GNSS signal available (e.g. in tunnels, basement garages or even between high buildings in cities). In addition to dead reckoning related NMEA sentences, PLPS9 provides a dead reckoning syn-

chronization line (DR_SYNC line) to be employed in external dead reckoning applications. DR_SYNC is derived from the GNSS signal clock as 1 pulse per second (1PPS) signal. The DR_SYNC signal is provided as long as synchronized with the GNSS satellite clock, and con-

tinues after GNSS signal loss. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 4 Mechanical Dimensions and Mounting 36 Page 35 of 52 4 Mechanical Dimensions and Mounting 4.1 Mechanical Dimensions of PLPS9 Figure 15 shows a 3D view1 of PLPS9 and provides an overview of the board's mechanical di-

mensions2. For further details see Figure 16. Length:

Width:

Height:

48mm 36mm 3mm Top view Bottom view Figure 15: PLPS9 top and bottom view 1. The coloring of the 3D view does not reflect the modules real color. 2. Note: The holes in the shielding (top view) are significantly smaller than the radiated wavelength from the module. Gemalto guarantees that there will be no emissions outside the limits from these. The RF circuitry of the module is fully shielded. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 4.1 Mechanical Dimensions of PLPS9 36

Page 36 of 52

Figure 16: Dimensions of PLPS9 (all dimensions in mm) PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 5 Regulatory and Type Approval Information 44 Page 37 of 52 5 Regulatory and Type Approval Information 5.1 Directives and Standards PLPS9 has been designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "PLPS9 Hardware Interface Description".1 Table 5: Directives 2014/53/EU 2002/95/EC (RoHS 1) 2011/65/EU (RoHS 2) 2015/863/EU (RoHS 3) Directive of the European Parliament and of the council of 16 April 2014 on the harmonization of the laws of the Member States relating to the making available on the market of radio equipment and repealing Directive 1999/

05/EC. The product is labeled with the CE conformity mark. Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain haz-

ardous substances in electrical and electronic equipment

(RoHS). Revised on 8 June 2011. Further revision on 31 March 2015 - amending Annex II to Directive 2011/65/EU of the European Parliament and of the Council as regards the list of restricted substances. Table 6: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22, Part 24, Part 27, and Part 90; US Equipment Authorization FCC OET Bulletin 65

(Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields UL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V5.40 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132, RSS133, RSS139 Canadian Standard Table 7: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station

(MS) conformance specification;

ETSI EN 301 511 V12.5.1 Global System for Mobile communications (GSM); Mobile Stations (MS) equipment; Harmonized Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU GCF-CC V3.74 Global Certification Forum - Certification Criteria 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 5.1 Directives and Standards 44 Page 38 of 52 Table 7: Standards of European type approval ETSI EN 301 489-01 V2.1.1 Draft ETSI EN 301 489-19 V2.1.0 Draft ETSI EN 301 489-52 V1.1.0 Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common technical requirements; Harmonized Standard cov-

ering the essential requirements of article 3.1(b) of Directive 2014/53/EU and the essential requirements of article 6 of Directive 2014/30/EU Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 19: Specific conditions for Receive Only Mobile Earth Stations

(ROMES) operating in the 1,5 GHz band providing data communications and GNSS receivers operating in the RNSS band (ROGNSS) providing positioning, navigation, and timing data; Harmonized Standard covering the essential requirements of article 3.1(b) of Directive 2014/53/EU Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 52: Specific conditions for Cellular Communication Mobile and portable (UE) radio and ancillary equipment; Harmonized Standard cover-

ing the essential requirements of article 3.1(b) of Directive 2014/53/EU ETSI EN 301 908-01 V11.1.1 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and common requirements ETSI EN 301 908-02 V11.1.2 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 2: CDMA Direct Spread (UTRA FDD) User Equipment (UE) ETSI EN 301 908-13 V11.1.2 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 13: Evolved Universal Terrestrial Radio Access (E-UTRA) User Equipment (UE) EN 60950-1:2006/

A11:2009+A1:2010+A1 2:2011+A2:2013 Safety of information technology equipment Table 8: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 5.1 Directives and Standards 44 Page 39 of 52 Table 9: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 SJ/T 11364-2006 Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products

(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Hardware Interface Description. Please see Table 10 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 10: Toxic or hazardous substances or elements with defined concentration limits PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 5.2 SAR requirements specific to portable mobiles 44 Page 40 of 52 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable PLPS9 based applications to be eval-

uated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US and European markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagnetic fields (EMFs) from mobile telecommunication equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 EN 62311:2008 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz - 300 GHz) IMPORTANT:

Manufacturers of portable applications based on PLPS9 modules are required to have their fi-

nal product certified and apply for their own FCC Grant and ISED Certificate related to the spe-

cific portable mobile. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 5.3 Reference Equipment for Type Approval 44 Page 41 of 52 5.3 Reference Equipment for Type Approval The Gemalto M2M general reference setup submitted to type approve PLPS9 is shown in the figure below: Figure 17 illustrates the setup for general tests and evaluation purposes. The evaluation module can be plugged directly onto an Audio Adapter. The GSM/UMTS/LTE/

GNSS test equipment is still connected via SMA connectors on the evaluation module. The PC is connected via USB interface on the evaluation module, and the audio test equipment via au-

dio jack on the Audio Adapter. TRX 1 TRX 2 PLPS 9 r o t i c a p a C k n a B S S N G R X 3 RX4 i o d u A A udio T e ste quipm e nt 0

. 0 / 3

. 2 B S U PC T e ste quipm e nt 4 .0 V Pow e r Supply G N SS T e ste quipm e nt G SM /W CD M A /LT E T e ste quipm e nt Figure 17: Reference equipment for type approval Please note that for EMC and RF performance tests, slightly different reference equipment con-

figurations are used. If necessary, please contact Gemalto for further details. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 5.4 Compliance with FCC and ISED Rules and Regulations 44 Page 42 of 52 5.4 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M modules reference application described in Section 5.3 will be registered under the following identifiers:

PLPS9-W:

FCC Identifier QIPPLPS9-W Granted to Gemalto M2M GmbH PLPS9-X:

FCC Identifier QIPPLPS9-X ISED Certification Number: 7830A-PLPS9X Granted to Gemalto M2M GmbH Note1: Manufacturers of mobile or fixed devices incorporating PLPS9-W/-X modules are autho-

rized to use the FCC Grants and ISED Certificates of the PLPS9-W/-X modules for their own final products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPPLPS9-W" or "Contains FCC ID: QIPPLPS9-X", and accordingly Contains IC: 7830A-PLPS9X. The integration is limited to fixed or mobile categorized host de-

vices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 11 and Table 12 for FCC and/or ISED. Table 11: Antenna gain limits for FCC for PLPS9-W Maximum gain in operating band FCC limit 850MHz (GSM) 1900MHZ (GSM) Band V (UMTS) Band 5 (LTE-FDD) Band 7 (LTE-FDD) CA_7C (LTE-FDD) Band 26 (LTE-FDD) 3.4 2.6 8.5 9.4 6.3 4.3 9.8 Unit dBi dBi dBi dBi dBi dBi dBi 1. Label note in French for ISED: Les fabricants d'quipement mobile ou fixe intgrant le module PLPS9-

W/-X sont autoriss utiliser les accords FCC et certificats d'Innovation, Sciences et Dveloppement conomique Canada (ISED) du module PLPS9-W/-X pour leur propre produit final suivant les conditions rfrences dans ces documents. Dans ce cas, le label FCC du module doit tre visible de l'extrieur, sinon l'quipement hte doit disposer d'un second label avec la dclaration suivante " Contains FCC ID

: QIPALPLPS9-W ", ou " Contains FCC ID : QIPPLPS9-X " et en consquence " Contains IC : 7830A-

PLPS9X ". L'intgration est limite aux catgories d'quipement hte mobile ou fixe, respectant une dis-

tance minimum de 20 centimtres entre l'antenne et toute personne avoisinante pour des conditions d'utilisation normale. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 5.4 Compliance with FCC and ISED Rules and Regulations 44 Page 43 of 52 Table 12: Antenna gain limits for FCC and ISED for PLPS9-X Maximum gain in operating band FCC limit ISED limit All limits Unit 850MHz (GSM) 1900MHZ (GSM) Band II (UMTS) Band IV (UMTS) Band V (UMTS) Band 2 (LTE-FDD) Band 4 (LTE-FDD) Band 5 (LTE-FDD) CA_5A_7A Pcc (LTE-FDD) CA_5A_7A Scc (LTE-FDD) Band 7 (LTE-FDD) CA_7C (LTE-FDD) Band 12 (LTE-FDD) Band 13 (LTE-FDD) Band 66(LTE-FDD) 3.4 2.0 7.5 4.7 8.4 9.1 6.5 9.4 8.7 7.4 6.5 4.3 8.7 9.2 6.4 0.1 2.5 7.5 7.3 5.1 8.5 8.3 6.1 5.4 8.5 8.7 5.6 5.9 8.3 11.8 0.1 2.0 7.5 4.7 5.1 8.5 6.5 6.1 5.4 7.4 6.5 4.3 5.6 5.9 6.4 dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi IMPORTANT:

Manufacturers of portable applications incorporating PLPS9-W/-X modules are required to have their final product certified and apply for their own FCC Grant and/or ISED Certificate re-

lated to the specific portable mobile. This is mandatory to meet the SAR requirements for por-

table mobiles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with ISED license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interfer-

ence to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or televi-

sion reception, which can be determined by turning the equipment off and on, the user is en-

couraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver Increase the separation between the equipment and receiver. is connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 5.4 Compliance with FCC and ISED Rules and Regulations 44 Page 44 of 52 If Canadian approval is requested for devices incorporating PLPS9 modules the above note will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not con-

tain any information on how to install or remove the module from the final product. Notes (ISED):

(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-GEN. Opera-

tion is subject to the following two conditions: (1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device.

(FR) Cet appareil numrique de classe B est conforme aux normes canadiennes ICES-003 et RSS-GEN. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interfrence et (2) cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement.

(EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Innovation, Science and Eco-

nomic Development Canada (ISED) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal op-

eration is minimized. This device has also been evaluated and shown compliant with the ISED RF Exposure limits under mobile exposure conditions. (antennas are greater than 20cm from a persons body).

(FR) Informations concernant l'exposltion aux frquences radio (RF) La puissance de sortie mise par l'appareil de sans fiI est infrieure la limite d'exposition aux frquences radio dInnovation, Sciences et Dveloppement conomique Canada (ISDE). Utili-

sez l'appareil de sans fil de faon minimiser les contacts humains lors du fonctionnement nor-

mal. Ce priphrique a galement t valu et dmontr conforme aux limites d'exposition aux RF d'ISDE dans des conditions d'exposition des appareils mobiles (les antennes se situent moins de 20cm du corps d'une personne). PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 6 Document Information 49 6 Document Information 6.1 Revision History Page 45 of 52 New document: "Cinterion PLPS9 Hardware Interface Overview" v00.052a Chapter What is new

Initial document setup. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Page 46 of 52 Cinterion PLPS9 Hardware Interface Overview 6.2 Related Documents 49 6.2 Related Documents

[1] PLPS9 AT Command Set

[2] PLPS9 Release Note

[3] Application Note 48: SMT Module Integration

[4] Universal Serial Bus Specification Revision 3.0

[5] Universal Serial Bus Specification Revision 2.0 6.3 Terms and Abbreviations Abbreviation Description American National Standards Institute Antenna Reference Point Carrier Aggregation Conformit Europene (European Conformity) Coding Scheme Circuit Switched Circuit Switched Data Download Do not use Discontinuous Reception Development Support Board Discontinuous Transmission Enhanced Data rates for GSM Evolution Extended GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard European Telecommunications Standards Institute Federal Communications Commission (U.S.) Frequency Division Duplex General Packet Radio Service Global Standard for Mobile Communications High Speed Downlink Packet Access High Impedance Input/Output International Mobile Equipment Identity Innovation, Science and Economic Development Canada ANSI ARP CA CE CS CS CSD DL dnu DRX DSB DTX EDGE EGSM EMC ESD ETS ETSI FCC FDD GPRS GSM HiZ HSDPA I/O IMEI ISED PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 6.3 Terms and Abbreviations 49 Abbreviation Description International Standards Organization International Telecommunications Union Page 47 of 52 ISO ITU kbps LED LGA LTE MBB Mbps MCS MFBI MIMO MLCC eMMC MO MS MSL MT nc NTC PCB PCIe PCL PCS PD PDU PS PSK PU QAM RF rfu ROPR RTC Rx SAR kbits per second Light Emitting Diode Land Grid Array Long term evolution Moisture barrier bag Mbits per second Modulation and Coding Scheme Multiple Frequency Band Indicator Multiple Input Multiple Output Multi Layer Ceramic Capacitor Embedded MultiMediaCard Mobile Originated Mobile Station, also referred to as TE Moisture Sensitivity Level Mobile Terminated Not connected Negative Temperature Coefficient Printed Circuit Board Pull Down resistor Protocol Data Unit Packet Switched Phase Shift Keying Pull Up resistor Radio Frequency Reserved for future use Radio Output Power Reduction Real Time Clock Receive Direction Specific Absorption Rate Peripheral Component Interconnect Express Power Control Level Personal Communication System, also referred to as GSM 1900 Quadrature Amplitude Modulation R&TTE Radio and Telecommunication Terminal Equipment PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 6.3 Terms and Abbreviations 49 Page 48 of 52 Abbreviation Description SELV SIM SMD SMS SMT SRAM SRB TE TPC TS Tx UL UMTS URC USB UICC USIM Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Static Random Access Memory Signalling Radio Bearer Terminal Equipment Transmit Power Control Technical Specification Transmit Direction Upload Unsolicited Result Code Universal Serial Bus USIM Integrated Circuit Card Universal Mobile Telecommunications System UMTS Subscriber Identification Module WCDMA Wideband Code Division Multiple Access PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 6.4 Safety Precaution Notes 49 6.4 Safety Precaution Notes Page 49 of 52 The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLPS9. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-

ure to comply with these precautions violates safety standards of design, manufacture and in-

tended use of the product. Gemalto M2M assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 7 Appendix 51 Page 50 of 52 7 Appendix 7.1 List of Parts and Accessories Table 13: List of parts and accessories Description PLPS9 Supplier Ordering information Gemalto M2M Standard module Gemalto M2M IMEI:

Packaging unit (ordering) number:

L30960-N5060-A100 (PLPS9-W) L30960-N5070-A100 (PLPS9-X) Module label number:

S30960-S5060-A100-11 (PLPS9-W) S30960-S5070-A100-11 (PLPS9-X) L30960-N5061-A100 (PLPS9-W) L30960-N5071-A100 (PLPS9-X) PLPS9 Evaluation module Gemalto M2M Ordering number:

Audio Adapter for PLPS9 Evaluation modules Votronic Handset Gemalto M2M On request. VOTRONIC /

Gemalto M2M Votronic ordering number: HH-SI-30.3/V1.1/0 Votronic Entwicklungs- und Produktionsgesellschaft fr elek-

tronische Gerte mbH Saarbrcker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 Email: contact@votronic.com Ordering numbers: 91228 91236 Sales contacts are listed in Table 14. Sales contacts are listed in Table 14 and Table 15. SIM card holder incl. push button ejector and slide-in tray U.FL antenna connector Molex Molex or Hirose 1. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Overview 7.1 List of Parts and Accessories 51 Page 51 of 52 Table 14: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 Table 15: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click:

http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217 Hirose Electric Europe B.V. UK Branch:

First Floor, St. Andrews House, Caldecotte Lake Business Park, Milton Keynes MK7 8LE Great Britain Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Hirose Electric Europe B.V. German Branch:

Herzog-Carl-Strasse 4 73760 Ostfildern Germany Phone: +49-711-456002-1 Fax: +49-711-456002-299 Email: info@hirose.de Hirose Electric Europe B.V. Hogehillweg 8 1101 CC Amsterdam Z-O Netherlands Phone: +44-1908-369060 Fax: +44-1908-369078 Phone: +81-03-3491-9741 Fax: +81-03-3493-2933 Phone: +31-20-6557-460 Fax: +31-20-6557-469 PLPS9_HIO_v00.052a Confidential / Preliminary 2019-07-25 About Gemalto Since 1996, Gemalto has been pioneering groundbreaking M2M and IoT products that keep our customers on the leading edge of innovation. We work closely with global mobile network operators to ensure that Cinterion modules evolve in sync with wireless networks, providing a seamless migration path to protect your IoT technology investment. Cinterion products integrate seamlessly with Gemalto identity modules, security solutions and licensing and monetization solutions, to streamline development timelines and provide cost efficiencies that improve the bottom line. As an experienced software provider, we help customers manage connectivity, security and quality of service for the long lifecycle of IoT solutions. For more information please visit www.gemalto.com/m2m, www.facebook.com/gemalto, or Follow@gemaltoIoT on Twitter. 52 Gemalto M2M GmbH Werinherstrasse 81 81541 Munich Germany GEMALTO.COM/M2M

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Cinterion PLPS9 Hardware Interface Description Version:

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00.052a PLPS9_HID_v00.052a GEMALTO.COM/M2M Cinterion PLPS9 Hardware Interface Description Page 2 of 125 2 Document Name: Cinterion PLPS9 Hardware Interface Description Version:

00.052a Date:

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Status:

2019-07-25 PLPS9_HID_v00.052a Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-

UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NON-

EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIV-

ERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-

tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2019, Gemalto M2M GmbH, a Thales Company Trademark Notice Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corpora-

tion in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description Contents 125 Page 3 of 125 Contents 1 2 Introduction ................................................................................................................. 8 Product Variants ................................................................................................ 8 1.1 Key Features at a Glance .................................................................................. 9 1.2 Supported Frequency Bands .............................................................. 13 1.2.1 1.2.2 Supported CA Configurations ............................................................. 14 System Overview ............................................................................................. 18 Circuit Concept ................................................................................................ 19 1.3 1.4 Interface Characteristics .......................................................................................... 20 Application Interface ........................................................................................ 20 2.1 Pad Assignment.................................................................................. 20 2.1.1 2.1.2 Signal Properties................................................................................. 24 2.1.2.1 Absolute Maximum Ratings ................................................ 31 2.1.3 USB Interface...................................................................................... 32 2.1.4 Serial Interface ASC0 ......................................................................... 33 Serial Interface ASC1 ......................................................................... 34 2.1.5 Inter-Integrated Circuit Interface.......................................................... 35 2.1.6 2.1.7 UICC/SIM/USIM Interface................................................................... 36 2.1.7.1 Enhanced ESD Protection for SIM Interfaces ..................... 38 2.1.8 Digital Audio Interface......................................................................... 39 2.1.8.1 Pulse Code Modulation Interface ........................................ 39 2.1.8.2 Inter-IC Sound Interface...................................................... 40 2.1.9 Analog-to-Digital Converter (ADC)...................................................... 41 2.1.10 RTC Backup........................................................................................ 41 2.1.11 GPIO Interface .................................................................................... 41 2.1.12 Control Signals.................................................................................... 42 2.1.12.1 PWR_IND Signal................................................................. 42 2.1.12.2 Remote Wakeup.................................................................. 42 2.1.12.3 Low Current Indicator.......................................................... 43 2.1.12.4 Firmware Swap ................................................................... 44 2.1.12.5 Heartbeat Signal ................................................................. 44 2.1.13 JTAG Interface.................................................................................... 44 2.1.14 eMMC Interface .................................................................................. 44 2.1.14.1 eMMC Power Supply .......................................................... 44 GSM/UMTS/LTE Antenna Interface................................................................. 45 Antenna Interface Specifications ........................................................ 46 2.2.1 2.2.2 Antenna Installation ............................................................................ 51 2.2.3 RF Line Routing Design...................................................................... 52 2.2.3.1 Line Arrangement Instructions ............................................ 52 2.2.3.2 Routing Examples ............................................................... 54 2.2.4 RF Antenna Diagnostic ....................................................................... 55 GNSS Antenna Interface ................................................................................. 58 2.3.1 GNSS Antenna Diagnostic.................................................................. 59 2.2 2.3 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description Contents 125 Page 4 of 125 3 4 5 2.4 Sample Application .......................................................................................... 60 Prevent Back Powering....................................................................... 61 2.4.1 2.4.2 Sample Level Conversion Circuit........................................................ 62 Sample Circuit for Antenna Detection................................................. 63 2.4.3 GNSS Interface .......................................................................................................... 66 3.1 GNSS Interface Characteristics ....................................................................... 67 4.2.4 Operating Characteristics ........................................................................................ 69 Operating Modes ............................................................................................. 69 4.1 4.2 Power Up/Power Down Scenarios ................................................................... 70 Turn on PLPS9 ................................................................................... 70 4.2.1 Signal States after First Startup .......................................................... 72 4.2.2 4.2.3 Turn off or Restart PLPS9................................................................... 75 4.2.3.1 Switch off PLPS9 Using ATShutdown Command................ 75 4.2.3.2 Restart PLPS9 Using Restart Command ............................ 76 4.2.3.3 Turn off PLPS9 Using IGT Line ........................................... 77 4.2.3.4 Turn off or Restart PLPS9 in Case of Emergency............... 78 4.2.3.5 Overall Shutdown Sequence............................................... 79 Automatic Shutdown ........................................................................... 80 4.2.4.1 Thermal Shutdown .............................................................. 81 4.2.4.2 Deferred Shutdown at Extreme Temperature Conditions.... 82 4.2.4.3 Undervoltage Shutdown...................................................... 83 4.2.4.4 Overvoltage Shutdown........................................................ 83 Power Saving................................................................................................... 84 Power Saving while Attached to GSM Networks ................................ 84 4.3.1 4.3.2 Power Saving while Attached to WCDMA Networks .......................... 86 4.3.3 Power Saving while Attached to LTE Networks .................................. 87 Power Supply................................................................................................... 88 4.4.1 Power Supply Ratings......................................................................... 89 4.4.2 Minimizing Power Losses ................................................................... 96 4.4.3 Monitoring Power Supply by AT Command ........................................ 96 Operating Temperatures.................................................................................. 97 Electrostatic Discharge .................................................................................... 98 Reliability Characteristics ................................................................................. 98 4.5 4.6 4.7 4.4 4.3 Mechanical Dimensions and Mounting................................................................... 99 5.1 Mechanical Dimensions of PLPS9................................................................... 99 Mounting PLPS9 onto the Application Platform ............................................. 101 5.2 SMT PCB Assembly ......................................................................... 101 5.2.1 5.2.1.1 Land Pattern and Stencil................................................... 101 5.2.1.2 Board Level Characterization............................................ 102 5.2.2 Moisture Sensitivity Level ................................................................. 103 Soldering Conditions and Temperature ............................................ 103 5.2.3 5.2.3.1 Reflow Profile .................................................................... 103 5.2.3.2 Maximum Temperature and Duration ................................ 104 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description Contents 125 Page 5 of 125 5.2.4 Durability and Mechanical Handling.................................................. 105 5.2.4.1 Storage Conditions............................................................ 105 5.2.4.2 Processing Life.................................................................. 105 5.2.4.3 Baking ............................................................................... 106 5.2.4.4 Electrostatic Discharge ..................................................... 106 Packaging ...................................................................................................... 107 5.3.1 Trays ................................................................................................. 107 Shipping Materials ............................................................................ 107 5.3.2 5.3.2.1 Moisture Barrier Bag ......................................................... 107 5.3.2.2 Transportation Boxes ........................................................ 109 5.3 6 7 8 Regulatory and Type Approval Information ......................................................... 110 Directives and Standards............................................................................... 110 6.1 6.2 SAR requirements specific to portable mobiles ............................................. 113 Reference Equipment for Type Approval ....................................................... 114 6.3 6.4 Compliance with FCC and ISED Rules and Regulations............................... 115 Document Information............................................................................................ 118 Revision History ............................................................................................. 118 7.1 Related Documents ....................................................................................... 119 7.2 7.3 Terms and Abbreviations ............................................................................... 119 Safety Precaution Notes ................................................................................ 122 7.4 Appendix.................................................................................................................. 123 8.1 List of Parts and Accessories......................................................................... 123 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description Tables 125 Page 6 of 125 Tables Table 1:

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Supported frequency bands for each PLPS9 variant ..................................... 13 Supported CA configurations ......................................................................... 14 Overview: Pad assignments........................................................................... 21 Signal description........................................................................................... 24 Absolute maximum ratings............................................................................. 31 DCE-DTE wiring of ASC0 .............................................................................. 34 Signals of the SIM interface (SMT application interface) ............................... 36 Overview of PCM pin functions ...................................................................... 39 Overview of I2S pin functions ......................................................................... 40 GPIO lines and possible alternative assignment............................................ 41 Remote wakeup lines..................................................................................... 42 Low current indicator line ............................................................................... 43 Return loss in the active band........................................................................ 45 RF Antenna interface GSM/UMTS/LTE (at operating temperature range) .... 46 Possible GPIOx signal states if used for antenna diagnosis.......................... 56 Assured antenna diagnostic states ................................................................ 57 GSM/UMTS/LTE antenna diagnostic decision threshold ............................... 57 Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning ................................................................................... 59 Antenna detection reference circuit - parts list ............................................... 65 GNSS properties ............................................................................................ 67 Power supply for active GNSS antenna......................................................... 68 Overview of operating modes ........................................................................ 69 Signal states................................................................................................... 72 Board temperature warning and switch off level ............................................ 81 Voltage supply ratings.................................................................................... 89 Current consumption ratings .......................................................................... 90 Board temperature ......................................................................................... 97 Electrostatic values ........................................................................................ 98 Reflow temperature recommendations ........................................................ 104 Storage conditions ....................................................................................... 105 Directives ..................................................................................................... 110 Standards of North American type approval ................................................ 110 Standards of European type approval.......................................................... 110 Requirements of quality ............................................................................... 111 Standards of the Ministry of Information Industry of the Peoples Republic of China .......................................................................... 112 Toxic or hazardous substances or elements with defined concentration limits ............................................................................................................. 112 Antenna gain limits for FCC for PLPS9-W ................................................... 115 Antenna gain limits for FCC and ISED for PLPS9-X.................................... 116 List of parts and accessories........................................................................ 123 Molex sales contacts (subject to change) .................................................... 124 Hirose sales contacts (subject to change) ................................................... 124 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description Figures 125 Page 7 of 125 Figures Figure 1:

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Figure 49:

Figure 50:

PLPS9 system overview ................................................................................ 18 PLPS9 block diagram..................................................................................... 19 PLPS9 bottom view: Pad assignments .......................................................... 22 PLPS9 top view: Pad assignments ................................................................ 23 USB circuit ..................................................................................................... 32 Serial interface ASC0..................................................................................... 33 Serial interface ASC1..................................................................................... 34 I2C interface connected to VEXT ................................................................... 35 First UICC/SIM/USIM interface ...................................................................... 37 Second UICC/SIM/USIM interface ................................................................. 37 SIM interfaces - enhanced ESD protection .................................................... 38 PCM timing short frame (master, 4096KHz, 16kHz sample rate) .................. 39 I2S timing (master mode) ............................................................................... 40 PWR_IND signal ............................................................................................ 42 Low current indication timing.......................................................................... 43 eMMC power supply ...................................................................................... 44 Antenna pads (top view) ................................................................................ 51 Embedded Stripline line arrangement............................................................ 52 Micro-Stripline line arrangement samples...................................................... 53 Routing to applications RF connector ........................................................... 54 Routing detail ................................................................................................. 54 Resistor measurement used for antenna detection ....................................... 55 Basic circuit for antenna detection ................................................................. 56 Supply voltage for active GNSS antenna....................................................... 58 ESD protection for passive GNSS antenna ................................................... 59 PLPS9 sample application ............................................................................. 61 Sample level conversion circuits .................................................................... 62 Antenna detection circuit sample - overview.................................................. 63 Antenna detection circuit sample - schematic................................................ 64 Power-on with IGT ......................................................................................... 70 Signal states during turn-off procedure .......................................................... 76 Timing of IGT if used as ON/OFF switch ....................................................... 77 Shutdown by EMERG_OFF signal................................................................. 78 Restart by EMERG_OFF signal ..................................................................... 78 Overall shutdown sequence........................................................................... 79 Power saving and paging in GSM networks .................................................. 85 Power saving and paging in WCDMA networks............................................. 86 Power saving and paging in LTE networks .................................................... 87 Decoupling capacitor(s) for BATT+................................................................ 88 Power supply limits during transmit burst....................................................... 96 Board and ambient temperature differences.................................................. 97 PLPS9 top and bottom view........................................................................ 99 Dimensions of PLPS9 (all dimensions in mm) ............................................. 100 Land pattern (top layer)................................................................................ 101 Recommended design for 110 micron thick stencil (top layer) .................... 102 Reflow Profile ............................................................................................... 103 Shipping tray dimensions ............................................................................. 107 Moisture Sensitivity Label ............................................................................ 108 Humidity Indicator Card - HIC ...................................................................... 109 Reference equipment for type approval ....................................................... 114 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 1 Introduction 19 Page 8 of 125 1 Introduction This document1 describes the hardware of the Cinterion PLPS9 products listed in Section 1.1. It helps you quickly retrieve interface specifications, electrical and mechanical details and in-

formation on the requirements to be considered for integrating further components. 1.1 Product Variants This document applies to the following Gemalto M2M modules:

Cinterion PLPS9-W Cinterion PLPS9-X Where necessary a note is made to differentiate between the various product variants and re-

leases. 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Gemalto M2M product. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Page 9 of 125 Cinterion PLPS9 Hardware Interface Description 1.2 Key Features at a Glance 19 1.2 Key Features at a Glance Feature General Frequency bands Implementation Note: Not all of the frequency bands (and 3GPP technologies) mentioned throughout this document are supported by every PLPS9 products variant. Please refer to Section 1.2.1 for an overview of the frequency bands sup-

ported by each PLPS9 product variant. GSM class Small MS Output power

(according to Release 99) GSM/GPRS/UMTS:

Class 4 (+33dBm 2dB) for EGSM850 and EGSM900 Class 1 (+30dBm 2dB) for GSM1800 and GSM1900 Class E2 (+27dBm 3dB) for GSM 850 8-PSK and GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK and GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for all supported WCDMA FDD bands Output power

(according to Release 8) LTE (FDD):

Class 3 (+23dBm 2dB) for all supported LTE FDD bands LTE (TDD):

Class 3 (+23dBm 2dB) for all supported LTE TDD bands Power supply Operating temperature

(board temperature) 3.3V < VBATT+ < 4.2V Normal operation: -30C to +85C Restricted operation: -40C to +95C Dimensions: 48mm x 36mm x 3mm Weight: approx. 10.5g Physical RoHS All hardware components fully compliant with EU RoHS Directive LTE features LTE Advanced up to 3GPP Release 11 LTE Advanced Pro up to 3GPP Release 12, 13 Downlink carrier aggregation (CA) to increase bandwidth, and thereby increase bitrate:

Maximum aggregated bandwidth: 80MHz Maximum number of component carriers: 4 Inter-band FDD, TDD Intra-band FDD, TDD, contiguous, non-contiguous Supported inter- and intra-band CA configurations: See Section 1.2.2. If 4x4 MIMO is supported by the mobile network:

Downlink:

Up to 1Gbps CAT 16 with 4x4 MIMO 2 CA DL + 4(2)x2 MIMO 1 CA DL or up to 800Mbps CAT 15 with 4x4 MIMO 2 CA DL Uplink:

Up to 150Mbps CAT 13 with 2 CA UL If 4(2)x2 MIMO is supported by the mobile network:

Downlink:

Up to 800Mbps CAT 15 with 4 CA DL Uplink:

Up to 150Mbps CAT 13 with 2 CA UL PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 1.2 Key Features at a Glance 19 Page 10 of 125 Feature Implementation HSPA features 3GPP Release 8 UMTS features UE CAT. 14, 24 DC-HSPA+ DL 42Mbps HSUPA UL 5.76Mbps Compressed mode (CM) supported according to 3GPP TS25.212 3GPP Release 8 PS data rate 384 kbps DL / 384 kbps UL GSM / GPRS / EGPRS features Data transfer EDGE E2 power class for 8 PSK GPRS:

Multislot Class 12 Mobile Station Class B Coding Scheme 1 4 EGPRS:

Multislot Class 12 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 NACC, extended UL TBF Mobile Station Class B SRB loopback and test mode B 8-bit, 11-bit RACH 1 phase/2 phase access procedures Link adaptation and IR SMS Point-to-point MT and MO, Cell broadcast, Text and PDU mode Software AT commands Hayes, 3GPP TS 27.007 and 27.005, and proprietary Gemalto M2M com-

mands Embedded Linux platform Embedded Linux with API (ARC, RIL). Memory space available for Linux applications is 4GB in the flash file sys-

tem, and 2GB RAM. SIM Application Toolkit SAT Release 99, letter classes b, c, e with BIP and RunAT support Firmware update Firmware update supported. GNSS Features Protocol Modes General NMEA Standalone GNSS (GPS, GLONASS, Beidou, Galileo) Integrated gpsOne 9HT support (GPS, GLONASS, Beidou, Galileo) QZSS and SBAS support Power saving modes DC feed bridge and control of power supply for active antenna via GPIO PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 1.2 Key Features at a Glance 19 Page 11 of 125 Feature Interfaces Module interface Implementation Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket. For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equip-

ment. 50. 2 GSM/UMTS/LTE main antennas, 2 LTE Diversity/MIMO antennas,

(active/passive) GNSS antenna USB 2.0 High Speed (480Mbit/s) device interface or USB 3.0 Super Speed (5Gbit/s) device interface for debugging purposes 8-wire (plus GND line) interface unbalanced, asynchronous Fixed baud rates from 115,200 to 921,600bps Supports RTS0/CTS0 hardware flow control 4-wire, unbalanced asynchronous interface Fixed baud rates: 115,200bps to 921,60bps Supports RTS1/CTS1 hardware flow control 2-wire, unbalanced asynchronous interface at RXD2 and TXD2 lines used for debugging purposes (optional) ASC0:

Linux controlled only:

ASC1:

ASC2:

2 UICC interfaces (switchable):

Supported chip cards: UICC/SIM/USIM 2.85V, 1.8V 1 I2C interface 1 digital interface (PCM/I2S) Switch-on by hardware signal IGT Switch-off by AT command (AT^SMSO) or IGT (option) Automatic switch-off in case of critical temperature or voltage conditions Reset Orderly shutdown and reset by AT command Emergency-off Emergency-off by hardware signal EMERG_OFF SAIC (Single Antenna Interference Cancellation) / DARP (Downlink Advanced Receiver Performance) Rx Diversity (receiver type 3i - 64-QAM) / MIMO HORxD (Higher Order Receive Diversity) with up to 4 antennas 15 I/O pins of the application interface programmable as GPIO. GPIO1 can be configured as dead reckoning synchronization signal. GPIOx can be configured as low current indicator. Programming is done via AT commands. Emergency call handling EU eCall 3GPP Release 10 compliant (modem and GNSS) ERA compliant (modem and GNSS) PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Antenna USB Serial interface UICC interface I2C interface Audio Power on/off, Reset Power on/off Special Features Antenna GPIO Cinterion PLPS9 Hardware Interface Description 1.2 Key Features at a Glance 19 Page 12 of 125 Feature ADC inputs JTAG eMMC PCIe Evaluation kit Implementation Analog-to-Digital Converter with unbalanced analog inputs for example for

(external) antenna diagnosis JTAG interface for debug purposes Linux controlled:

Embedded Multi-Media Card interface Linux controlled:

PCIe interface Evaluation module PLPS9 module soldered onto a dedicated PCB. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 1.2 Key Features at a Glance 19 1.2.1 Supported Frequency Bands Page 13 of 125 The following table lists the supported frequency bands for each of the PLPS9 product variants mentioned in Section 1.1. Table 1: Supported frequency bands for each PLPS9 variant Band

-W

-X GSM/GPRS/EDGE 850MHz 900MHz 1800MHz 1900MHz UMTS/HSPA Bd.I (2100MHz) Bd.II (1900MHz) Bd.III (1800MHz) Bd.IV (1700MHz) Bd.V (850MHz) Bd.VI (850MHz) Bd.VIII (900MHz) Bd.XIX (850MHz) TD-SCDMA Bd.34 (2000MHz) Bd.39 (1900MHz) LTE-FDD1 Bd.1 (2100MHz) Bd.2 (1900MHz) Bd.3 (1800MHz) Bd.4 (1700MHz) Bd.5 (850MHz) Bd.7 (2600MHz) Bd.8 (900MHz) Bd.12 (700MHz) Bd.13 (700MHz) Bd.18 (850MHz) Bd.19 (850MHz) Bd.20 (800MHz) Bd.26 (850MHz) Bd.28 (700MHz) x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 1.2 Key Features at a Glance 19 Page 14 of 125 Table 1: Supported frequency bands for each PLPS9 variant Band

-W

-X Bd.29 (700MHz)

<supplementary downlink>

Bd.30 (2300MHz)2

<supplementary downlink only acc. FCC regulation>

Bd.32 (1500MHz)

<supplementary downlink>

Bd.66 (1700MHz)3 LTE-TDD4 Bd.34 (2000MHz) Bd.38 (2600MHz) Bd.39 (1900MHz) Bd.40 (2300MHz) Bd.41 (2600MHz)5 x x x x x x 1. Bd.5, Bd.8, Bd.29, and Bd.32 support 2x2 MIMO only, whereas Bd.1, Bd.2, Bd.3, Bd.4, Bd.7, and Bd.66 support 4x4 MIMO in downlink. Also, Bd.2, Bd.3, Bd.4, Bd.5, Bd.8, Bd.12, Bd.13, Bd.18, Bd.19, Bd.20, Bd.26, Bd.28 support 4 antenna RX Diversity (HoRXD). 2. Band 30 support is disabled by means of software due to AT&T advice. 3. With the Band 66 support, the frequency ranges 1755-1780 MHz and 2155-2180 MHz derived from pair-

ing the 1710-1780 and 2110-2180 MHz frequency bands are compliant with 27.5(h) and 27.75. 4. Bd.34 supports 2x2 MIMO only, whereas Bd.38, Bd.39, Bd.40, and Bd.41 support 4x4 MIMO in downlink. 5. Note: Out of the 3GPP specified frequency range for LTE Band 41, only that part which is used in China and Japan (2545MHz to 2655MHz) is supported by PLPS9. 1.2.2 Supported CA Configurations The following table lists the supported CA configurations (aka supported band combinations) for each of the PLPS9 product variants mentioned in Section 1.1. Table 2: Supported CA configurations Downlink CA Uplink CA Downlink

(4x4 MIMO) Bandwidth combination set Product variants

(PLPS9-...) Intra-band continuous 1C 2C 3C 7B 7C

38C 40C

CA_3C CA_38C CA_40C 0, 1 0, 1 0 0 0 0 0 0 0, 1 0, 1 CA_7C 0, 1, 2 CA_1C CA_2C CA_3C CA_5B CA_7B CA_7C CA_8B CA_12B CA_38C CA_40C CA_40D PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 x x x X, W X, W X, W W X W W X W W W Cinterion PLPS9 Hardware Interface Description 1.2 Key Features at a Glance 19 Page 15 of 125 Uplink CA CA_41C CA_41C Bandwidth combination set Product variants

(PLPS9-...) 0, 1, 2, 3 Table 2: Supported CA configurations Downlink CA Downlink

(4x4 MIMO) 41C

66B 66C 2A-2A 4A-4A Intra-band non-continuous CA_66A-66A 66A-66A Inter-band (two bands) CA_41C CA_41D CA_66B CA_66C CA_2A-2A CA_4A-4A CA_1A-3A CA_1A-3C CA_1A-5A CA_1A-7A CA_1A-8A CA_1A-18A CA_1A-19A CA_1A-20A CA_1A-26A CA_1A-28A CA_2A-2A-4A CA_2A-2A-4A-4A CA_2A-2A-5A CA_2A-2A-12A CA_2A-2A-13A CA_2A-2A-66A CA_2A-4A CA_2A-4A-4A CA_2A-5A CA_2A-12A CA_2A-12B CA_2A-13A CA_2A-28A CA_2A-29A CA_2A-66A CA_2A-66A-66A CA_2C-5A CA_2C-12A CA_2C-29A CA_3A-3A-8A CA_3A-5A CA_3A-7A CA_3A-7B

1A 1A 1A 1A 1A 1A 1A 2A 2A 2A

2A 2A 2A 2A 2A 2A 2C 2C 2C 3A 3A

CA_3C CA_1A-5A CA_1A-8A CA_1A-18A 0, 1, 2 0, 1 CA_1A-26A CA_1A-28A 0, 1 0, 1 0, 1 0, 1 0, 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0, 1, 2 0, 1 0, 1, 2 0, 1 0, 1, 2 0, 1, 2 CA_7C CA_3A-8A CA_3A-20A 0, 1, 2, 3, 4 0, 1 0, 1 0 W W X X X X X W W W W W W W W W W X X X X X X X X X X X X X X X X X X X W W W W PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 1.2 Key Features at a Glance 19 Page 16 of 125 Table 2: Supported CA configurations Downlink CA Uplink CA Downlink

(4x4 MIMO) Bandwidth combination set Product variants

(PLPS9-...)

3A 3A 3A 3A 3A 3C

3C 3C 4A

4A 4A 4A

4A 4A 4A 4A 7A

7A 7A 7A 7A 7B 7C

66A 66A 66A 66A

CA_3A-7C CA_3A-8A CA_3A-19A CA_3A-20A CA_3A-26A CA_3A-28A CA_3C-5A CA_3C-7A CA_3C-7C CA_3C-8A CA_3C-20A CA_3C-28A CA_4A-4A-5A CA_4A-4A-7A CA_4A-4A-12A CA_4A-4A-13A CA_4A-5A CA_4A-7A CA_4A-12A CA_4A-12B CA_4A-13A CA_4A-28A CA_4A-29A CA_5A-7A CA_5A-12A CA_5A-66A CA_7A-8A CA_7A-12A CA_7A-20A CA_7A-28A CA_7B-28A CA_7C-28A CA_8A-20A CA_12A-66A CA_12A-66A-66A CA_13A-66A CA_13A-66A-66A CA_18A-28A CA_20A-32A CA_39A-41A CA_39A-41C CA_39C-41A CA_3C CA_3A-20A CA_3C-8A, CA_3C 0

CA_7A-20A CA_7C CA_41C CA_39C 0, 1, 2, 3, 4, 5 0, 1, 2, 3 0, 1 0 0, 1 0, 1 0, 1 0, 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0, 1 0, 1 0, 1 0, 1 0, 1, 2 0, 1 0, 1, 2 0, 1 0, 1 0, 1 0, 1 0, 1, 2, 3, 4, 5 W W W W W W W W W W W W X X X X X X X X X X X X X X W X W W X X X X W W W W W X, W X, W X, W CA_5A-7A X, W CA_5A-66A-66A 66A 66A PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 1.2 Key Features at a Glance 19 Page 17 of 125 Table 2: Supported CA configurations Inter-band (three bands) Downlink CA Uplink CA Downlink

(4x4 MIMO) Bandwidth combination set Product variants

(PLPS9-...) CA_1A-3A-5A CA_1A-3A-8A CA_1A-3A-19A CA_1A-3A-20A CA_1A-3A-26A CA_1A-3A-28A CA_1A-5A-7A CA_1A-7A-8A CA_1A-7A-20A CA_1A-7A-28A CA_1A-18A-28A 1A CA_1A-19A-28A CA_2A-2A-4A-12A CA_2A-2A-12A-66A CA_2A-4A-4A-12A CA_2A-4A-5A CA_2A-4A-12A CA_2A-4A-13A CA_2A-4A-29A CA_2A-5A-66A CA_2A-12A-66A CA_2A-13A-66A CA_3A-7A-8A CA_3A-7A-28A CA_3A-7C-28A CA_4A-7A-12A CA_2A-12A-66A-66A -

0, 1 0, 1, 2, 3 CA_1A-5A, CA_3A-5A CA_1A-8A, CA_3A-8A CA_3A-20A CA_1A-5A, CA_5A-7A 0, 1 0, 1, 2 0, 1 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0, 1

CA_3A-8A 0, 1, 2 W W W W W W W W W W W W X X X X X X X X X X X W W W X PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 1.3 System Overview 19 Page 18 of 125 1.3 System Overview GNSS TRX1 TRX2 RX3 RX4 Power Supply Antenna-

diagnostic External Antenna Switch (optional) Application Antenna-

diagnostic SIM Card GNSS GSM/UMTS/LTE 3 x ANT _SW GPIO 4 x ADC UICC PLPS9 USB 2.0/3.0 PCIe ASC0 ASC1 GPIO eMMC 2 x I2C Digital Audio IGT EMERG_OFF Power Supply B S U e I C P e c a f r e t n I l a i r e S e c a f r e t n I l a i r e S C 2 I S 2 I

M C P I O P G e c a f r e t n I C M M e T X E V D N I _ R W P Power Supply Application Interfaces Application Figure 1: PLPS9 system overview PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 1.4 Circuit Concept 19 Page 19 of 125 1.4 Circuit Concept Figure 2 shows a block diagram of the PLPS9 module and illustrates the major functional com-

ponents:

Baseband block:

GSM/UMTS/LTE controller/transceiver/power supply NAND/LPDDR2 memory devices Application interface (SMT with connecting pads) RF section:

RF transceiver RF power amplifier/frontend RF filter GNSS receiver/Front end Antenna pad PLPS9 38.4MHz Clocks Powermanagement LDOLDO LDOLDOLDO ADC S1 S2 S3 S4 S5 DDR2SDRAM NANDFlash 4GBit 8GBit 1 I B E 2 I B E Basebandcontroller QLINK GRFC RFFE RFpart Filter

Switches LGAPads BATT+_RF BATT+

GND IGT EMERG_OFF PWR_IND USB3.0 USB2.0 ASC0 ASC1 2xI2C PCM/I2S eMMC SIM GPIO PCIe 4xADC_IN ANT_TRX1 ANT_TRX2 ANT_RX3 ANT_RX4 ANT_GNSS GNSS_EN ANT_GNSS_DC PMU PMU MB/HB PA LB PA GSM PA Figure 2: PLPS9 block diagram PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2 Interface Characteristics 68 2 Interface Characteristics Page 20 of 125 PLPS9 is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 Pad Assignment The SMT application interface on the PLPS9 provides connecting pads to integrate the module into external applications. Table 3 lists the pads assignments. Figure 3 (bottom view) and Fig-

ure 4 (top view) show the connecting pads numbering plan. Please note that a number of connecting pads are marked as reserved for future use (rfu) and further qualified as either (<name>), (dnu), (GND) or (nc):

Pads marked as rfu and qualified as <name> (signal name) may be soldered and could be connected to an external application compliant to the signals electrical characteristics as described in Table 4. Pads marked "rfu" and qualified as "dnu" (do not use) may be soldered but should not be connected to an external application. Pads marked "rfu" and qualified as "GND" (ground) are assigned to ground with PLPS9 modules, but may have different assignments with future Gemalto M2M products using the same pad layout. Pads marked "rfu" and qualified as "nc" (not connected) are internally not connected with PLPS9 modules, but may be soldered and arbitrarily be connected to external ground. Also note that some pads are marked with a circle (

improved impedance control.

). These pads have a round shape for Gemalto strongly recommends to solder all connecting pads for mechanical stability and heat dissipation. Also, Gemalto strongly recommends to provide test points for certain signal lines to and from the module while developing SMT applications for debug and/or test purposes during the manufacturing process. In this way it is possible to detect soldering problems. Please refer to

[3] for more information on test points and how to implement them. The signal lines for which test points should be provided for are marked as Test point required or Test point recom-

mended in Section 2.1.2: Table 4 describing signal characteristics. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 21 of 125 Table 3: Overview: Pad assignments Pad No. Signal Name A1 A2 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A20 A21 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 C1 C2 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C20 C21 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 E1 E2 E3 E4 E5 E6 E7 E8 E9 E10 E11 E12 E13 E14 GND GND GND GND ANT_RX3 GND GND GND ANT_RX4 GND GND GND ANT_GNSS GND ANT_GNSS_DC GND GND rfu (dnu) GND GND GND GND GND GND GND GND GND GND GND GND GND rfu (dnu) GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND HEART_BEAT JTAG_TCK GND GND GND GND GND GND rfu (dnu) ADC4_IN ADC5_IN ADC1_IN ADC2_IN GPIO11 GNSS_EN JTAG_TMS JTAG_TRST JTAG_TDI JTAG_SRST JTAG_TDO IGT GND GND GND GND GND GND rfu (dnu) GPIO1/ DR_SYNC GPIO7 (Interrupt) GPIO14 GPIO13 GPIO12 JTAG_PS_HOLD rfu (dnu) Pad No. Signal Name E15 E16 E17 E18 E19 E20 E21 F2 F3 F4 F5 F6 F7 F8 F14 F15 F16 F17 F18 F19 F20 G2 G3 G4 G5 G6 G16 G17 G18 G19 G20 H2 H3 H4 H5 H6 H16 H17 H18 H19 H20 J2 J3 J4 J5 J6 J16 J17 J18 J19 J20 K2 K3 K4 K5 K6 K16 K17 K18 K19 K20 L2 L3 L4 L5 L6 L7 L8 L14 L15 L16 L17 L18 L19 L20 M1 M2 M3 M4 M5 M6 M7 rfu (dnu) rfu (dnu) rfu (dnu) VEXT rfu (dnu) BATT+

GND ANT_TRX2 GND GND GND rfu (dnu) rfu (dnu) rfu (nc) rfu (nc) GND EMERG_OFF DSR0 RXD0 DTR0 BATT+

GND GND GND GND rfu (dnu) GND GND DCD0 / Download CTS0 RTS0 GND GND GND GND GND USB_SSTX_P USB_SSTX_N GPIO6 (Interrupt) TXD0 rfu (BATT_ID) GND GND GND GND rfu (dnu) GND GND CCIO2 CCIO1 RING0 GND GND GND GND rfu (dnu) USB_SSRX_P USB_SSRX_N CCRST2 CCVCC1 rfu (dnu) ANT_TRX1 GND GND GND rfu (dnu) EMMC_DETECT rfu (nc) rfu (nc) EMMC_PWR GND GND CCVCC2 CCRST1 GPIO4 GND GND GND GND GND GND GPIO17 Pad No. Signal Name M8 M9 M10 M11 M12 M13 M14 M15 M16 M17 M18 M19 M20 M21 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13 N14 N15 N16 N17 N18 N19 P1 P2 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 P15 P16 P17 P18 P20 P21 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 T1 T2 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T20 T21 JTAG_WD_DISABLE I2CDAT1 I2CCLK1 rfu (dnu) rfu (dnu) EMMC_D6 EMMC_D1 GPIO22 USB_DP USB_DN CCCLK2 CCCLK1 GPIO8 (Interrupt) GND GND GND GND GND FSC2 DOUT2 DIN2 BCLK2 GND EMMC_D4 EMMC_D5 EMMC_D2 EMMC_D0 GND GND CCIN2 CCIN1 GND GND BATT+_RF BATT+_RF GPIO5 (Interrupt) rfu (DIN1) rfu (DOUT1) rfu (BCLK1) rfu (FSC1) rfu (MCLK) EMMC_D7 EMMC_CMD EMMC_D3 EMMC_CLK PCIE_CLK_P PCIE_CLK_N VUSB_IN GND GND PWR_IND RTS1 CTS1 TXD1 RXD1 PCIE_HOST_WAKE PCIE_HOST_RST GND GND PCIE_CLK_REQ GND GND GPIO16 (Interrupt) GND GND rfu (dnu) rfu (dnu) FwSwap TXD2 GPIO15 RXD2 GND PCIE_RX_P PCIE_RX_N GND PCIE_TX_P PCIE_TX_N GND GND GND PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 22 of 125 1 2 3 4 7 8 9 10 11 12 13 GND GND FwSWAP TXD2 GPIO15 RXD2 GND PCIE_ RX_P PCIE_ RX_N 15 16 PCIE_ TX_P PCIE_ TX_N 17 GND 18 19 20 21 GND GND RTS1 CTS1 TXD1 RXD1 GND GND GND GND GND GPIO16

(Interrupt) PCIE_ HOST_ WAKE PCIE_ HOST_ RST GND GND BATT+_ BATT+_ RF RF rfu rfu rfu rfu rfu

(DIN1)

(DOUT1)

(BCLK1)

(FSC1)

(MCLK) EMMC_ D7 EMMC_ CMD EMMC_ EMMC_ D3 CLK PCIE_-

CLK_P PCIE_ CLK_N VUSB_ IN GND GND GND GND GND GND FSC2 DOUT2 DIN2 BCLK2 GND GND GND CCIN2 CCIN1 GND EMMC_ EMMC_ EMMC_ EMMC_ D4 D5 D2 D0 M GND GND GND GND GND GND GPIO17 I2CDAT1 I2CCLK I2CDAT I2CCLK GPIO22 USB_DP USB_DN CCCLK2 CCCLK1 GPIO8

(Interrupt) GND 1 2 2 EMMC_ EMMC_ D6 D1 5 rfu

(dnu) PWR_ IND 6 rfu

(dnu) GPIO5

(Inter-

rupt) 14 GND PCIE_ CLK_ REQ ANT_ TRX1 GND GND GND rfu

(dnu) EMMC_ DETECT GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(nc) EMMC_ PWR GND GND CCVCC2 CCRST1 GPIO4 rfu: Reserved for future use (may be connected to external application

(nc): Internally not connected (may be arbitrarily connected to external GND)

(dnu): Do not use (should not be connected to external application) USB_ USB_ SSRX_P SSRX_N CCRST2 CCVCC1 rfu

(dnu) GND GND GND CCIO2 CCIO1 RING0 GND Circle marks round shaped pads designed for improved impedance. Orange: Keep out areas on external applications PCB. Rectangular shaped: GND pads should be soldered, but no further tracks on PCBs 1st layer, as well as a solid ground plane on PCBs 2nd layer. Round shaped: No solder pads, should therefore not be soldered. No fur-

ther tracks on PCBs first layer. USB_ SSTX_P USB_ SSTX_N TXD0 GND rfu

(BATT_ ID) GND GND CTS0 RTS0 GND GPIO6

(Inter-

rupt) DCD0 /

Down-

load ANT_ TRX2 GND GND GND rfu

(dnu) rfu

(dnu) rfu

(nc) rfu

(nc) GND EMERG _OFF DSR0 RXD0 DTR0 BATT+

GND GND GND GND GND GND GPIO14 GPIO13 GPIO12 rfu

(dnu) GPIO1 /

DR_SYNC GPIO7

(Inter-

rupt) JTAG_ PS_ HOLD rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) VEXT BATT+

GND GND GND GND GND ADC4_IN ADC5_IN ADC1_ ADC2_ GPIO11 GNSS_ IN IN EN JTAG_ TMS JTAG_ TRST JTAG_ TDI JTAG_ SRST JTAG_ TDO rfu

(dnu) GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND JTAG_ WD_ DISABLE rfu

(nc) GND GND GND GND GND GND GND GND GND GND GND GND GND GND rfu

(dnu) GND GND GND GND GND GND GND GND GND GND GND GND GND ANT_ RX3 ANT_ RX4 ANT_ GNSS ANT_ GNSS_ DC rfu

(dnu) IGT HEART_ BEAT JTAG_ TCK rfu

(dnu) T R P N L K J H G F E D C B A 2019-07-25 Figure 3: PLPS9 bottom view: Pad assignments PLPS9_HID_v00.052a Confidential / Preliminary Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 23 of 125 21 20 19 18 16 15 13 12 11 10 9 8 7 4 3 2 1 PCIE_ TX_N PCIE_ TX_P PCIE_ RX_N PCIE_ RX_P GND RXD2 GPIO15 TXD2 FwSwap GND GND T GND GND R GND 17 GND GPIO16

(Interrupt) 14 GND PCIE_ CLK_ REQ GND GND GND GND RXD1 TXD1 CTS1 RTS1 PCIE_ HOST_ RST PCIE_ HOST_ WAKE P GND GND VUSB_ IN PCIE_ CLK_N PCIE_-

CLK_P EMMC_ EMMC_ EMMC_ EMMC_ CLK D3 CMD D7 rfu rfu rfu rfu rfu

(MCLK)

(FSC1)

(BCLK1)

(DOUT1)

(DIN1) BATT+_ BATT+_ RF RF GND GND 5 rfu

(dnu) PWR_ IND 6 rfu

(dnu) GPIO5

(Inter-

rupt) GND CCIN1 CCIN2 GND GND GND BCLK2 DIN2 DOUT2 FSC2 GND GND GND GND M GND GPIO8

(Interrupt) CCCLK1 CCCLK2 USB_DN USB_DP GPIO22 I2CCLK I2CDAT I2CCLK I2CDAT1 GPIO17 GND GND GND GND GND GND GPIO4 CCRST1 CCVCC2 GND GND EMMC_ PWR rfu

(nc) EMMC_ EMMC_ EMMC_ EMMC_ D0 D2 D5 D4 EMMC_ EMMC_ D1 D6 2 2 1 JTAG_ WD_ DISABLE rfu

(nc) K GND rfu

(dnu) CCVCC1 CCRST2 USB_ USB_ SSRX_N SSRX_P GND RING0 CCIO1 CCIO2 GND GND rfu: Reserved for future use (may be connected to external application

(nc): Internally not connected (may be arbitrarily connected to external GND)

(dnu): Do not use (should not be connected to external application) Circle marks round shaped pads designed for improved impedance. H GND TXD0 rfu

(BATT_ ID) USB_ SSTX_N USB_ SSTX_P G GND RTS0 CTS0 GND GND GPIO6

(Inter-

rupt) DCD0 /

Down-

load Orange: Keep out areas on external applications PCB. Rectangular shaped: GND pads should be soldered, but no further tracks on PCBs 1st layer, as well as a solid ground plane on PCBs 2nd layer. Round shaped: No solder pads, should therefore not be soldered. No fur-

ther tracks on PCBs first layer. EMMC_ DETECT rfu

(dnu) GND GND GND ANT_ TRX1 GND GND GND GND rfu

(dnu) rfu

(dnu) rfu

(dnu) GND GND GND GND GND GND GND GND GND GND GND GND GND BATT+

DTR0 RXD0 DSR0 EMERG _OFF GND rfu

(nc) rfu

(nc) rfu

(dnu) rfu

(dnu) GND GND GND ANT_ TRX2 E GND BATT+

VEXT rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) JTAG_ PS_ HOLD GPIO7

(Inter-

rupt) GPIO1 /

DR_SYNC rfu

(dnu) GPIO12 GPIO13 GPIO14 GND GND GND GND GND GND JTAG_ TDO JTAG_ SRST JTAG_ TDI JTAG_ TRST JTAG_ TMS EN IN IN GNSS_ GPIO11 ADC2_ ADC1_ ADC5_IN ADC4_IN GND GND GND GND rfu

(dnu) rfu

(dnu) IGT C GND GND JTAG_ TCK HEART_ BEAT GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND B GND A GND GND rfu

(dnu) GND GND GND GND GND GND GND GND GND GND GND GND GND rfu

(dnu) GND GND GND GND GND GND GND GND GND GND GND ANT_ GNSS_ DC ANT_ GNSS ANT_ RX4 ANT_ RX3 N L J F D 2019-07-25 Figure 4: PLPS9 top view: Pad assignments PLPS9_HID_v00.052a Confidential / Preliminary Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 24 of 125 2.1.2 Signal Properties Please note that the reference voltages listed in Table 4 are the values measured directly on the PLPS9 module. They do not apply to the accessories connected. Table 4: Signal description Function Signal name IO Signal form and level Comment Power sup-

ply BATT+

BATT+_RF I VImax = 4.2V VImin = 3.3V (on board) GSM during Tx burst n Tx = n x 577s peak current every 4.615ms Imax = see Table 26 WCDMA TX continuous current Imax = see Table 26 LTE TX continuous current Imax = see Table 26 GND VEXT Ground O CLmax = 1F External supply volt-

age VO = 1.80V -2.4%, +2%

Normal operation:

IOmax = -50mA SLEEP mode operation:

IOmax = -1mA ANT_GNSS_ DC I VImax = 5V Imax = 50mA Supply volt-

age for active GNSS antenna

(input) External GNSS sup-

ply voltage enable

(output) GNSS_EN O VOLmax = 0.45V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 1.30V at I = -2mA VOHnom = 1.65V at I = -100A VOHmax = 1.84V Supply voltage lines for gen-

eral power management and the RF power amplifier. Lines of BATT+/BATT+_RF and GND respectively must be connected in parallel for supply purposes because higher peak currents may occur. Minimum voltage must not fall below 3.3V including drop, ripple, spikes. Application Ground VEXT may be used for appli-

cation circuits. If unused keep line open. Test point recommended. The external digital logic must not cause any spikes or glitches on voltage VEXT. Do not exceed IOmax in any operation mode. If unused connect to GND. The input current must be limited to 50mA (antenna short circuit protection). Enable signal for an external voltage regulator (intended for active GNSS antenna, high=active) No external pull-up allowed during startup until the mod-

ule has been secured in fac-

tory. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 25 of 125 Table 4: Signal description Ignition IGT Function Signal name IO Signal form and level Comment I I I I RPU 200k VOHmax = 1.84V VIHmax =2.00V VIHmin = 1.30V VILmax = 0.50V Low impulse width > 100ms RPU 40k VOHmax = 1.84V VIHmax = 2.00V VIHmin = 1.30V VILmax = 0.50V

low pulse width up to 2000ms

(as long as PWR_IND stays low RPU 24kto VEXT VOHmax=1.84V VIHmin = 1.25V at -25A VIHmax= 2.0V VILmax = 0.35V at -60A VIL (max) = 0.5V VIH (min) = 1.30V VIH (max) = 2.0V IHigh-Z (max) = 1A O VOLmax = 0.4V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 2.2V at I = -2mA VOHnom = 2.65V at I = -100A VOHmax = 2.91V I/O RPU 6.7..8.5k VILmax = 0.55V VIHmin = 2.35V VIHmax = 3.05V VOLmax = 0.4V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 2.35V at I > -45A VOHmax = 2.91V O VOmin = 2.75V VOtyp =2.85V VOmax = 2.91V IOmax = -50mA Emer-

gency off EMERG_ OFF SIM card detection CCIN1 CCIN2 2.85V SIM card inter-

faces CCRST1 CCRST2 CCCLK1 CCCLK2 CCIO1 CCIO2 CCVCC1 CCVCC2 This signal switches the module on. It is required to drive this line low by an open drain or open collector driver connected to GND. Test point recommended. It is required to drive this line low by an open drain or open collector driver connected to GND until the module finally switches off. If unused keep line open. Test point recommended. Note that a low impulse of more than 2000ms will reset the modules RTC. CCIN = Low means SIM card inserted. If SIM card holder does not support CCINx, connect to GND. CCIN2: External pull-up required - for details please refer to Section 2.1.7. If 2nd SIM interface not used, keep line open. Maximum cable length or copper track should be not longer than 100mm to SIM card holder. CCIO2: External 10kW pull-

up required - for details please refer to Section 2.1.7. If unused keep lines open. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 26 of 125 Function Signal name IO Signal form and level Comment Table 4: Signal description 1.8V SIM card inter-

face CCRST1 CCRST2 CCCLK1 CCCLK2 CCIO1 CCIO2 SIM inter-

face shut-

down Serial Interface ASC0 Serial Interface ASC1 RXD1 CTS1 CCVCC1 CCVCC2 BATT_ID RXD0 CTS0 DSR0 RING0 DCD0 TXD0 RTS0 DTR0 TXD1 RTS1 Maximum cable length or copper track should be not longer than 100mm to SIM card holder. CCIO2: External 10kW pull-

up required - for details please refer to Section 2.1.7. If unused keep lines open. Reserved for future use. Connect line to GND. Test points recommended for TXD0, RXD0, DCD0, RTS0, and CTS0. If DCD0 is driven low during startup-phase, module enters Download Mode (see Section 4.2.2) If unused keep line open. Test points recommended for RXD1, TXD1, CTS1, and RTS1. If unused keep line open. O VOLmax = 0.4V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 1.40V at I = -2mA VOHmin = 1.65V at I = -100A VOHmax = 1.84V I/O RPU 6.7..8.5k VILmax = 0.30V VIHmin = 1.30V VIHmax = 1.84V VOLmax = 0.4V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 1.40V at I > -50A VOHmax = 1.84V O VOmin = 1.74V VOtyp = 1.80V VOmax = 1.84V IOmax = -50mA External pull up to VEXT and pull down resistor within battery case required. RPU = 100k RPD = 10k I O VOLmax = 0.45V at I = 2mA VOLnom = 0.1V at I = 100A O VOHmin = 1.30V at I = -2mA VOHnom = 1.65V at I = -100A VOHmax = 1.84V O O I/O I I I VILmax = 0.50V VIHmin = 1.30V VIHmax = 2.0V IIHPD = 27.5A97.5A IILPU = -27.5A-97.5A IHigh-Z max= 1A O VOLmax = 0.45V at I = 2mA VOLnom = 0.1V at I = 100A O VOHmin = 1.30V at I = -2mA VOHnom = 1.65V at I = -100A VOHmax = 1.84V VILmax = 0.50V VIHmin = 1.30V VIHmax = 2.0V IIHPD = 27.5A97.5A IILPU = -27.5A-97.5A IHigh-Z max= 1A I I PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 27 of 125 Table 4: Signal description Function Signal name IO Signal form and level Comment Power indi-

cator PWR_IND O VIHmax = 5.5V VOLmax = 0.45V at Imax = 2mA PWR_IND (Power Indicator) notifies the modules on/off state. PWR_IND is an open collec-

tor that needs to be con-

nected to an external pull-up resistor. Low state of the open collector indicates that the module is on. Vice versa, high level notifies the Power Down mode. Therefore, the signal may be used to enable external vol-

tage regulators that supply an external logic for commu-

nication with the module, e.g. level converters. Test point recommended. USB detection. Test point recommended. If unused keep lines open. Test point recommended. USB High Speed mode operation requires a differ-

ential impedance of 90 If unused keep lines open. USB Super Speed mode operation requires a differ-

ential impedance of 90 USB VUSB_IN I VINmin = 3.0V VINmax = 5.75V IImax = 100A Cin=1F USB_DN USB_DP I/O Full and High speed signal (differen-

tial) characteristics according to USB 2.0 specification. I/O Super Speed signal (differential) Rx characteristics according USB 3.0 specification. O Super Speed signal (differential) Tx characteristics according USB 3.0 specification. USB_ SSRX_N USB_ SSRX_P USB_ SSTX_N USB_ SSTX_P DIN2 BCLK2 FSC2 DOUT2 I I O I I/O I/O O Digital audio inter-

face

(PCM/I2S) VOLmax = 0.45V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 1.30V at I = -2mA VOHnom = 1.65V at I = -100A VOHmax = 1.84V Digital audio interface con-

figurable as PCM or I2S interface. If unused keep lines open. VILmax = 0.50V VIHmin = 1.30V VIHmax = 2.0V IIHPD = 27.5A97.5A IILPU = -27.5A-97.5A IHigh-Z max= 1A PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 28 of 125 Table 4: Signal description Function Signal name IO Signal form and level Comment GPIO interface GPIO1 GPIO4...8 GPIO11...17 GPIO22 I/O VOLmax = 0.45V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 1.30V at I = -2mA VOHnom = 1.65V at I = -100A VOHmax = 1.84V VILmax = 0.50V VIHmin = 1.30V VIHmax = 2.0V IIHPD = 27.5A97.5A IILPU = -27.5A-97.5A IHigh-Z max= 1A GPIO5...GPIO8, and GPIO16 are interrupt enabled. They can be used to for instance wake up the module (see Section 2.1.11). Following functions can be configured for GPIOs using AT commands:

GPIO1 --> DR_SYNC GPIOx --> Low Current Indi-

cator There is a 2.2k decoupling resistor between GPIO17 and JTAG_WD_DISABLE. Test points recommended at GPIO1. If unused keep lines open. However, GPIO7 and GPIO17 must be low during module startup until the module has been secured in factory. 1PPS inter-

face GPIO1

(DR_SYNC) O Clock signal with 1 pulse per second, frequency 1Hz, accuracy 5ms If the feature is enabled (see Chapter 3). Heartbeat ADC interface HEART_ BEAT ADC1_IN, ADC2_IN, ADC4_IN, ADC5_IN O H --> L with 0.1Hz frequency, i.e., 5s ( 1,5s) each for high and low Heartbeat signal, e.g., for external watchdog. I Full specification compliance range VImin>=0.10V VImax<=1.70V RI 10M Resolution: 14 Bit Accuracy: < 2mV ADC conversion time t (max) = 550s at 4.8MHz sample clock If unused keep line open. Prepared for general pur-

pose and antenna diagnos-

tic use. module ADCx_IN MUX, ADC 1k 10n PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 29 of 125 Table 4: Signal description Function Signal name IO Signal form and level Comment PCIe PCIE_RX_N I According to PCI Express Specifica-

tion, Revision 2.0/2.1 (one lane, 5 GBit/s) I2C inter-

face I2CDAT1 I2CDAT2 I2CCLK1 I2CCLK2 I/O VILmax = 0.50V VIHmin = 1.30V VIHmax = 2.0V O JTAG inter-

face JTAG_SRST I PCIE_RX_P PCIE_TX_N O PCIE_TX_P PCIE_CLK_N I/O PCIE_CLK_P PCIE_-

CLK_REQ PCIE_HOST_ RST PCIE_HOST_ WAKE I JTAG_TCK JTAG_TDI JTAG_TMS JTAG_TRST JTAG_TDO O JTAG_WD_ DISABLE I I IO VOLmax = 0.45V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 1.30V at I = -2mA VOHnom = 1.65V at I = -100A VOHmax = 1.84V O VILmax = 0.50V VIHmin = 1.30V VIHmax = 2.0V IIHPD = 27.5A97.5A IILPU = -27.5A-97.5A IHigh-Z max= 1A VOLmax = 0.3V at I = 3mA VOHmax = 1.84V IILPU = -27.5A-97.5A VOLmax = 0.45V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 1.30V at I = -2mA VOHnom = 1.65V at I = -100A VOHmax = 1.84V VILmax = 0.50V VIHmin = 1.30V VIHmax = 2.0V IIHPD = 27.5A97.5A IILPU = -27.5A-97.5A IHigh-Z max= 1A VILmax = 0.3V at -100A VIHmin = 1.50V at 100A VIHmax = 2.0V JTAG_ PS_HOLD VIHmin = 1.65V at 680A VILmax = 0.20V at 680A VOHmax = 1.84V VOHmin = 1.30V at 150A VOLmax = 0.5V at -200A Additional PCIe control sig-

nals Open Drain Output (internal pull up) External pull up resistors required. Maximum load 510Ohm. Debug interface. Test point recommended for all JTAG lines. High during reset and start-

up does disable the watch-

dog timer. (Jumper to VEXT) There is a 2.2k decoupling resistor between JTAG_ WD_DISABLE and GPIO17. High holds the power supply during debugging

(Jumper to VEXT) PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 30 of 125 Table 4: Signal description Function Signal name IO Signal form and level eMMC interface EMMC_ DETECT I Comment eMMC VOLmax = 0.45V at I = 2mA VOLnom = 0.1V at I = 100A VOHmin = 1.30V at I = -2mA VOHnom = 1.65V at I = -100A VOHmax = 1.84V VILmax = 0.50V VIHmin = 1.30V VIHmax = 2.0V IIHPD = 27.5A97.5A IILPU = -27.5A-97.5A IHigh-Z max= 1A EMMC_PWR O VOUT (nom) = 2.95V / 1.8V IOUT (max) = 150mA 1.8V eMMC EMMC_CLK O VOLmax = 0.45V at rated drive strength VOHmin = 1.40V at rated drive strength EMMC_CMD O VOHmax = 1.84V EMMC_D[0... 7]

I/O VILmax = 0.58V at rated drive strength VIHmin = 1.27V at rated drive strength VIHmax = 2.0V IHigh-Z max= 5A 2.95V eMMC EMMC_CLK O VOLmax = 0.36V at rated drive strength VOHmin = 2.05V at rated drive strength EMMC_CMD O VOHmax = 2.91V VILmax = 0.68V at rated drive strength VIHmin = 1.82V at rated drive strength VIHmax = 3.05V IHigh-Z max= 10A EMMC_D[0... 7]

I/O PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 2.1.2.1 Absolute Maximum Ratings Page 31 of 125 The absolute maximum ratings stated in Table 5 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to PLPS9. Table 5: Absolute maximum ratings Parameter Supply voltage BATT+

Voltage at all digital lines in Power Down mode (except VEXT) Voltage at VEXT in Power Down mode Voltage at digital lines in normal operation Voltage at UICC interface, CCVCC 1.8V in normal operation Voltage at UICC interface, CCVCC 3.0V in normal operation Voltage at ADC lines if the module is powered by BATT+

VBATT++0.5V V Voltage at ADC lines if the module is not powered VEXT maximum current shorted to GND Min

-0.3

-0.3

-0.3

-0.3

-0.3

-0.3

-0.5

-0.5

-0.3

-0.3

-0.3

-0.3

-0.3

-0.5

-0.3 Max

+5.5

+0.5

+0.3

+2.3

+2.3

+3.4

+0.5

-600 5.75

+1.4

+3.6

+1.4

+2.1

+5.5 2 2.1 Unit V V V V V V V V V V V V V V mA mA VUSB_IN USB 3.0 data lines USB 2.0 data lines PCIe data and clock lines PCIe control lines Voltage at PWR_IND line PWR_IND input current if PWR_IND= low Voltage at following signals:

IGT, EMERG_OFF PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 32 of 125 2.1.3 USB Interface PLPS9 supports a USB 3.0 Super Speed (5Gbps) device interface, and alternatively a USB 2.0 device interface that is High Speed compatible. The USB interface is primarily intended for use as debugging interface. The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLPS9 is designed as a self-powered device compliant with the Universal Serial Bus Specifi-

cation Revision 3.01. SMT lin. reg. Module USB part a) 2.0 USB_HS _PHY USB 2.0 Controller 2.0 USB_SS _PHY USB 3.0 3.0 Controller 100nF 100nF VBUS Detection only 1F BATT+

GND c) USB_DP USB_DNc) USB_SSRX_N USB_SSRX_P USB_SSTX_N USB_SSTX_P c) c) c) c) VUSB_IN b) All serial (including R S) and pull -up resistors for data lines are implemented . Since VUSB_IN is used for detection only it is recommended not to add any further blocking capacitors on a) b) the VUSB_IN line. c) If the USB interface is operated with super or high speeds, it is recommended to take special care routing the data lines. Application layout should implement a differential impedance of 90 ohms for proper signal integrity . Figure 5: USB circuit To properly connect the module's USB interface to the external application, a USB 3.0 or 2.0 compatible connector and cable or hardware design is required. For further guidelines on im-

plementing the external applications USB 3.0 or 2.0 interface see [4] and [5]. For more infor-

mation on the USB related signals see Table 4. Furthermore, the USB driver distributed with PLPS9 needs to be installed. While a USB connection is active, the module will never switch into SLEEP mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power2. 1. The specification is ready for download on http://www.usb.org/developers/docs/

2. Please note that if the USB interface is employed, and a USB cable is connected, there should also be a terminal program linked to the USB port in order to receive and process the initial SYSSTART URC after module startup. Otherwise, the SYSSTART URC remains pending in the USB driver's output buffer and this unprocessed data prevents the module from power saving. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 33 of 125 2.1.4 Serial Interface ASC0 PLPS9 offers a 4-wire (8-wire prepared) (plus GND) unbalanced, asynchronous interface ASC0 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V

(for high data bit or inactive state). For electrical characteristics please refer to Table 4. PLPS9 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 6: Serial interface ASC0 Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0. Features:

The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. See [1] for details on how to configure the RING0 line by AT^SCFG. Configured for 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 115,200 to 921,600bps. Supports RTS0/CTS0 hardware flow control. Note: If the ASC0 serial interface is the applications only interface, it is suggested to connect test points on the USB signal lines as a potential tracing possibility. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 34 of 125 Line function Signal direction Line function Signal direction Table 6: DCE-DTE wiring of ASC0 V.24 circuit DCE 103 104 105 106 107 109 125 108/2 TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 Input Output Input Output Input Output Output Output 2.1.5 Serial Interface ASC1 DTE TXD RXD RTS CTS DTR DSR DCD RING Output Input Output Input Output Input Input Input Four PLPS9 lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3. PLPS9 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 7: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake. On ASC1 no RING line is available. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 115,200 bps to 921,600 bps. Supports RTS1/CTS1 hardware flow. Linux controlled only. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 2.1.6 Inter-Integrated Circuit Interface Page 35 of 125 PLPS9 provides an Inter-Intergrated Circuit (I2C) interface. I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line. Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relation-

ships exist at all times. The module operates as master-transmitter or as master-receiver. The customer application transmits or receives data only on request of the module. The applications I2C interface can be powered via the VEXT line of PLPS9. If connected to the VEXT line, the I2C interface will properly shut down when the module enters the Power Down mode. In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage

(e.g., VEXT) via a pull-up resistor. For electrical characteristics please refer to Table 4. Module VEXT I2CCLK I2CDAT GND Application p u l l u p R p u l l u p R I2CCLK I2CDAT GND Figure 8: I2C interface connected to VEXT Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 2.1.7 UICC/SIM/USIM Interface Page 36 of 125 PLPS9 has two UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102 221. It is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interfaceare reserved for the SIM interface. The UICC/SIM/USIM interface supports 2.85V and 1.8V SIM cards. Please refer to Table 4 for electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 2.85V or 1.8V SIM card is used. The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with PLPS9 and is part of the Gemalto M2M reference equipment submitted for type approval. See Chapter 8 for Molex ordering numbers. Table 7: Signals of the SIM interface (SMT application interface) Signal Description Ground connection for SIM interfaces. Optionally a separate SIM ground line may be used to improve EMC. Chipcard clock line for 1st and 2nd SIM interface. SIM supply voltage line for 1st and 2nd SIM interface. Serial data line for 1st and 2nd SIM interface, input and output. Chipcard reset line for 1st and 2nd SIM interface. Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCIN signal is active low. The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of PLPS9. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLPS9. By default, only the 1st SIM interface is available and can be used. Using the AT command AT^SCFG=SIM/CS it is possible to switch between the two SIM interfaces. Command set-

tings are non-volatile - for details see [1]. GND CCCLK1 CCCLK2 CCVCC1 CCVCC2 CCIO1 CCIO2 CCRST1 CCRST2 CCIN1 CCIN2 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 37 of 125 Module CCCLK1 1n SIM /

UICC open: Card removed closed: Card inserted CCIN1 CCRST1 GND CCIO1 e c a f r e t n i n o i t a c i l p p a T M S CCVCC1 220n Figure 9: First UICC/SIM/USIM interface The total cable length between the SMT application interface pads on PLPS9 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLKx signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line. An example for an optimized ESD protection for the SIM interface is shown in Section 2.1.7.1. Note: Figure 9 shows how to connect a SIM card holder to the first SIM interface. With the sec-

ond SIM interface some internally integrated components on the SIM circuit will have to be ex-

ternally integrated as shown for the second SIM interface in Figure 10. The external components at CCIN2 should be populated as close as possible to the signals SMT pad Module CCCLK2 e c a f r e t n i n o i t a c i l p p a T M S VEXT 22k CCIN2 Open: Card removed Closed: Card inserted 2k2 100pF CCRST2 1nF SIM /

UICC GND CCIO2 10k CCVCC2 220nF Figure 10: Second UICC/SIM/USIM interface PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 38 of 125 2.1.7.1 Enhanced ESD Protection for SIM Interfaces To optimize ESD protection for the SIM interfaces it is possible to add ESD diodes to the inter-

face lines of the first and second SIM interface as shown in the example given in Figure 11. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: 4kV, air discharge: 8kV. Module CCRST x CCVCC x CCIOx CCCLKx CCINx GND 51R 51R 51R 6 5 4 5-line transient voltage supressor array, e.g., NUP4114 series 1 2 3 SIM_RST SIM_VCC SIM_IO SIM_CLK SIM_DET SIM_GND Figure 11: SIM interfaces - enhanced ESD protection PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 2.1.8 Digital Audio Interface Page 39 of 125 PLPS9 supports one digital audio interface that can be employed as either as pulse code mod-

ulation (PCM) or Inter-IC Sound (I2S) interface. Default setting is I2S. Please note that the first DAI is reserved for future use. 2.1.8.1 Pulse Code Modulation Interface PLPS9's PCM interface can be used to connect audio devices capable of pulse code modula-

tion. The PCM functionality is limited to the use of wideband codecs with 16kHz sample rate only. The PCM interface runs at 16 kHz sample rate (62.5s frame length), while the signal pro-

cessing maintains this rate in a wideband AMR call or samples automatically down to 8kHz in a narrowband call. Therefore, the PCM sample rate is independent of the audio bandwidth of the call. The PCM interface has the following implementation:

Master mode Short frame synchronization 16kHz/8kHz sample rate 4096/1024/512/256 kHz bit clock at 16kHz sample rate 2048/512/256/128 kHz bit clock at 8kHz sample rate Table 8 lists the available PCM interface signals. Table 8: Overview of PCM pin functions Signal name Description Signal direction:

Master DOUT2 DIN2 FSC2 BCLK2 O I O O PCM Data from PLPS9 to external codec PCM Data from external codec to PLPS9 Frame synchronization signal to external codec Bit clock to external codec. Note: If the BCLK2 signal is permanently provided (AT^SAIC parameter <clk_mode> = 0), the module will no longer enter its power save (SLEEP) state. Note: PCM data is always formatted as 16-bit uncompressed twos complement. Also, all PCM data and frame synchronization signals are written to the PCM bus on the rising clock edge and read on the falling edge. The timing of a PCM short frame is shown in Figure 12. 62.5 s BCLK2 FSC2 DOUT2 DIN2 MSB 14 13 12 MSB 14 13 12 2 2 1 1 LSB LSB MSB MSB Figure 12: PCM timing short frame (master, 4096KHz, 16kHz sample rate) PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 2.1.8.2 Inter-IC Sound Interface Page 40 of 125 The I2S Interface is a standardized bidirectional I2S based digital audio interface for transmis-

sion of mono voice signals for telephony services. The I2S interface can be enabled and configured using the AT command AT^SAIC (see [1]). Activation of the I2S line is possible only out of call and out of tone presentation. The I2S prop-

erties and capabilities comply with the requirements layed out in the Phillips I2S Phillips I2S Bus Specifications, revised June 5, 1996. 512kHz bit clock at 16kHz sample rate The I2S interface has the following characteristics:

Bit clock mode: Master Sampling rate: 16KHz (wideband) Frame length: 32 bit stereo voice signal (16 bit word length) Audio frames start with WS (Word Select) line low, followed by a WS high. The left channel is selected by WS=0 whereas the right channel is selected by WS=1. Data on each channel starts with MSB at each edge of WS with a delay of 1 bitclock. The left microphone channel is significant, the right channel will be ignored. The loudspeaker output contains binary iden-

tical data on both channels. Table 9 lists the available I2S interface signals, Figure 13 shows the I2S timing. Table 9: Overview of I2S pin functions Signal name on SMT application interface Signal configuration inactive Signal direction:

Master Description DOUT2 DIN2 FSC2 BCLK2 PD PD PD PD O I O O I2S data from PLPS9 to external codec I2S data from external codec to PLPS9 Frame synchronization signal to/from external codec Word alignment (WS) Bit clock to external codec. BCLKx signal low/high time varies between 45%

and 55% of its clock period. Note: If the BCLK2 signal is permanently provided

(AT^SAIC parameter <clk_mode> = 0), the module will no longer enter its power save (SLEEP) state. 62.5 s BCLK2 FSC2 DOUT2 DIN2 MSB 14 13 12 MSB 14 13 12 2 2 1 1 LSB LSB MSB MSB Figure 13: I2S timing (master mode) PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 2.1.9 Analog-to-Digital Converter (ADC) Page 41 of 125 PLPS9 provides four unbalanced ADC input lines: ADC[1-2...4-5]_IN. They can be used to measure four independent, externally connected DC voltages in the range of 0.1V to 1.7V. As described in Section 2.2.4 and Section 2.3.1 they can be used especially for antenna diagnos-

ing. The AT^SRADC command can be employed to select the ADC line, set the measurement mode and read out the measurement results. 2.1.10 RTC Backup The internal Real Time Clock of PLPS9 is supplied from a separate voltage regulator in the power supply component which is also active when PLPS9 is in Power Down mode and BATT+

is available. An alarm function is provided that allows to wake up PLPS9. When the alarm time is reached the module wakes up into normal operating mode (default), or to the functionality level

(AT+CFUN) that was valid before power down. For example, if the module was in Airplane mode before power down, the module will wake up without logging on to the GSM/UMTS/LTE network. 2.1.11 GPIO Interface PLPS9 has 15 GPIOs for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. Before changing the configuration of a GPIO pin (e.g. input to output) the pin has to be closed. If the GPIO pins are not configured or the pins/driver were closed, the GPIO pins are high-Z with pull down resistor. If a GPIO is configured to input, the pin has high-Z without pull resistor. If PLPS9 is in power save (SLEEP) mode a level state transition at GPIO[3, 5, 6, 7, 8, 16] will wake up the module, if such a GPIO was configured as input with appropriate wakeup capabil-

ityusing AT^SCPIN. To query the level state the AT^SCPOL command may be used. For de-

tails on the mentioned AT commands please see [1]. Table 10 shows GPIO lines with possible alternative functionalities, and comments on these optional assignments. Table 10: GPIO lines and possible alternative assignment Description of possible alternative signals GPIOs /

Alternative signal names GPIO1 /

DR_SYNC DR_SYNC. GPIO1 can also be configured as DR_SYNC line, i.e., a one pulse per second (1PPS) output for external dead reckoning applications. For more information see Chapter 3. GPIOx GPIO lines can be configured as low current indicator signal (see Section 2.1.12.3). PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 42 of 125 2.1.12 Control Signals 2.1.12.1 PWR_IND Signal PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is required. Module For example:

VCC C or BATT+

e c a f r e n t i T M S Pull-up R1 PWR_IND Power supply On/Off

(open collector) Figure 14: PWR_IND signal 2.1.12.2 Remote Wakeup If no call, data or message transfer is in progress, the external host application may shut down its own module interfaces or other components in order to save power. If a call, data, or other request (URC) arrives, the external application can be notified of this event and be woken up again by a state transition of a configurable remote wakeup line. Available as remote wakeup lines are some GPIO signals (recommended is GPIO4). Please refer to [1]: AT^SCFG: "Re-

moteWakeUp/..." for details on how to configure these lines for defined wakeup events on specified device interfaces. Possible states are listed in Table 11. If no line is specifically configured as remote wakeup signal, the remote USB suspend and re-

sume mechanism as specified in the Universal Serial Bus Specification Revision 2.0 applies for the USB interface (see Section 2.1.3). Possible states for the remote wakeup GPIO lines are listed in Table 11. Table 11: Remote wakeup lines Signal GPIOx I/O/P O Description Inactive to active high transition:

0 = No wake up request 1 = The host shall wake up PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 2.1.12.3 Low Current Indicator Page 43 of 125 A low current indication is optionally available over a GPIO line. By default, low current indica-

tion is disabled and the GPIO pads can be configured and employed as usual. For a GPIO pad to work as a low current indicator the feature has to be enabled by AT com-

mand (see [1]: AT^SCFG: MEopMode/PowerMgmt/LCI). If enabled, the GPIOx signal is high when the module is sleeping. During its sleep the module will for the most part be slow clocked with 32kHz RTC. Table 12: Low current indicator line Signal GPIOx I/O/P Description O High active transition:

0 = High current consumption The module draws its power via BATT+

1 = Low current consumption (only reached during SLEEP mode) The module draws only a low current via BATT+

GPIOx 1 0 IBATT+

ILCmax <5mA Sleep

(slow clock phase) Paging Sleep

(slow clock phase) Normal operation t t Figure 15: Low current indication timing ILCmax During the low current periods the current consumption does not exceed the ILCmax value. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.1 Application Interface 68 Page 44 of 125 2.1.12.4 Firmware Swap The firmware swap signal FwSwap allows to toggle between two firmware images that may be available on the module. Setting the FwSwap line to high during the modules startup phase triggers the firmware swap. The signal may for instance be used as a fallback or backup solu-

tion in case a possible firmware update is not successful. Please connect this signal to the external application and implement a test point. 2.1.12.5 Heartbeat Signal HEART_BEAT indicates that the module is well, i.e., that its core components are working fine. The heartbeat starts at module power up, and finishes when the module is powered off. It runs at a frequency of 0.1Hz with 5 seconds high and 5 seconds low state (+/- 1.5 seconds). The heartbeat signal can for instance be used to trigger external watchdog applications. 2.1.13 JTAG Interface For test purposes, e.g., 8D reporting without desoldering the module from the external applica-

tion. 2.1.14 eMMC Interface PLPS9 has an eMMC interface that can be used for test purposes, e.g., to write crash dumps from the modules FFS to eMMC. To connect an eMMC a separate, additional power supply is required as described in Section 2.1.14.1. 2.1.14.1 eMMC Power Supply An eMMC requires two separate power supplies normally named VCC (3V3) and VCCQ (3V3

/ 1V8). PLPS9 however, provides only a single power supply pad for eMMC, i.e., the EMMC_PWR pad. Therefore, an additional external power supply for the eMMC is necessary, and can for instance be provided through a voltage regulator enabled with the EMMC_PWR line. A sample connecting circuit is shown in Figure 16. Note that with PLPS9 the EMMC_PWR line switches from 2.95V to 1.8V during eMMC operation. BATT+

EMMC_PWR

(2V95 / 1V8) PLPS9 BATT+

Vout 2V9 VCC Vin EN Voltage Regulator VCCQ eMMC Figure 16: eMMC power supply PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 2.2 GSM/UMTS/LTE Antenna Interface Page 45 of 125 The PLPS9 GSM/UMTS/LTE antenna interface comprises two GSM/UMTS/LTE main anten-

nas as well as two UMTS/LTE Rx diversity/MIMO antennas to improve signal reliability and quality1. The interface has an impedance of 50. PLPS9 is capable of sustaining a total mis-

match at the antenna interface without any damage, even when transmitting at maximum RF power. The external antennas must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Matching networks are not in-

cluded on the PLPS9 PCB and should be placed in the host application, if the antenna does not have an impedance of 50. Regarding the return loss PLPS9 provides the following values in the active band:

Table 13: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit

> 8dB Undefined mismatch

> 12dB

> 12dB 1. By delivery default the UMTS/LTE Rx diversity/MIMO antennas are configured as available for the mod-

ule since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna set-

tings. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 2.2.1 Antenna Interface Specifications Page 46 of 125 Table 14: RF Antenna interface GSM/UMTS/LTE (at operating temperature range1) Parameter Conditions Min. Typical Max. Unit LTE connectivity Band 1, 2, 3, 4, 5, 7, 8, 12, 13, 18, 19, 20, 26, 28, 34, 38, 39, 40, 41, 66 Receiver Input Sensitivity @

ARP (ch. bandwidth 5MHz; 4 antenna combined, TRX1, TRX2, RX3, RX4)) LTE 2100 Band 1 LTE 1900 Band 2 LTE 700 Band 29 (RX only)

-96.3 LTE 700 Band 32 (RX only)

-99.3

-102

-100

-99

-102

-97.3

-100

-96.3

-96.3

-96.3

-96.8

-96.8

-99

-96.8

-97.8

-99.3

-99.3

-102

-102

-100

+21

+21

+21

+21

+21

+21

+21

+21

+21

-107

-106

-107

-107

-108

-106

-107

-106

-108

-108

-108

-108

-108

-108

-106

-106

-104

-106

-108

-105

-107

-107

+23

+23

+23

+23

+23

+23

+23

+23

+23

+25

+25

+25

+25

+25

+25

+25

+25

+25 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm LTE 1800 Band 3 LTE 1700 Band 4 LTE 850 Band 5 LTE 2600 Band 7 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 850 Band 18 LTE 850 Band 19 LTE 800 Band 20 LTE 850 Band 26 LTE 700 Band 28 LTE 2000 Band 34 LTE 2600 Band 38 LTE 1900 Band 39 LTE 2300 Band 40 LTE 2300 Band 41 LTE 2100 Band 1 LTE 1900 Band 2 LTE 1800 Band 3 LTE 1700 Band 4 LTE 850 Band 5 LTE 2600 Band 7 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 2600 Band 66

-101.5 RF Power @ ARP with 50 Load PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 47 of 125 Table 14: RF Antenna interface GSM/UMTS/LTE (at operating temperature range1) Parameter Conditions RF Power @ ARP with 50 Load LTE 850 Band 18 Min.

+21 Typical Max.

+23

+25 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

-106

-104

-103

-106

-103

-104

-104

-104

-106

-104

-103

-106

-103

-104

-104

-104

+21

+21

+21

+21

+21

+21

+21

+21

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

-110

-109

-111

-111

-112

-111

-111

-111

-112

-111

-111

-112

-112

-113

-113

-113

+24

+24

+24

+24

+24

+24

+24

+24

+25

+25

+25

+25

+25

+25

+25

+25

+25

+25

+25

+25

+25

+25

+25

+25

+25

+25 LTE 850 Band 19 LTE 800 Band 20 LTE 850 Band 26 LTE 700 Band 28 LTE 2000 Band 34 LTE 2600 Band 38 LTE 1900 Band 39 LTE 2300 Band 40 LTE 2300 Band 41 LTE 2600 Band 66 UMTS 1800 Band III UMTS 1700 Band IV UMTS 900 Band VIII UMTS 850 Band V UMTS 850 Band VI UMTS 850 Band XIX UMTS 1800 Band III UMTS 1700 Band IV UMTS 900 Band VIII UMTS 850 Band V UMTS 850 Band VI UMTS 850 Band XIX UMTS 2100 Band I UMTS 1900 Band II UMTS 1800 Band III UMTS 1700 Band IV UMTS 900 Band VIII UMTS 850 Band V UMTS 850 Band VI UMTS 850 Band XIX UMTS/HSPA connectivity Band I, II, III, IV, V, VI, VIII, XIX Receiver Input Sensitivity @

ARP Main path (TRX1) UMTS 2100 Band I UMTS 1900 Band II Receiver Input Sensitivity @

ARP Diversity path (TRX2) UMTS 2100 Band I UMTS 1900 Band II RF Power @ ARP with 50 Load PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 48 of 125 Table 14: RF Antenna interface GSM/UMTS/LTE (at operating temperature range1) Parameter Conditions Min. Typical Max. Unit GPRS coding schemes Class 12, CS1 to CS4 EGPRS GSM Class Static Receiver input Sensi-

tivity @ ARP RF Power @ ARP with 50 Load GSM Class 12, MCS1 to MCS9 Small MS GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 RF Power @

ARP with 50 Load

(ROPR=4, i.e., no reduction) GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900

-110

-109

-102

-102 31 28 35 32 33 30 33 30 27 26 33 30 27 26 33 30 27 26 33 30 27 26 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 49 of 125 Table 14: RF Antenna interface GSM/UMTS/LTE (at operating temperature range1) Conditions Min. Typical Max. Parameter RF Power @

ARP with 50 Load

(ROPR=5) RF Power @

ARP with 50 Load

(ROPR=6) GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 32.2 29.2 33 30 27 26 33 30 27 26 27 26 31 28 27 26 33 30 27 26 31 28 27 26 27 26 29 26 27 26 30.2 27.2 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 50 of 125 Table 14: RF Antenna interface GSM/UMTS/LTE (at operating temperature range1) Conditions Min. Typical Max. Parameter RF Power @

ARP with 50 Load

(ROPR=7) RF Power @

ARP with 50 Load

(ROPR=8, i.e., max. reduction) GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 28.2 25.2 33 30 27 26 30 27 27 26 27 26 27 24 27 26 33 30 27 26 30 27 24 23 28.2 25.2 22.2 21.2 27 24 21 20 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm 1. At restricted temperature range no active power reduction is implemented - any deviations are hardware related. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 51 of 125 2.2.2 Antenna Installation The antennas are connected by soldering the antenna pads (ANT_TRX1, ANT_TRX2, ANT_RX3, ANT_RX4; ANT_GNSS) and their neighboring ground pads directly to the applica-

tions PCB. 21 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 T R P N M L K J H G F E D C A GND GND GND ANT_ TRX1 GND GND GND GND GND ANT_ TRX2 GND GND B GN D GND GND GND GND GND GND GND GND GND GND ANT_ GNSS GND GND ANT_ RX4 GND GND GND ANT_ RX3 Figure 17: Antenna pads (top view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application PCB.The wiring of the antenna connection, starting from the antenna pad to the applications antenna must result in a 50 line impedance. Line width and distance to the GND plane need to be optimized with regard to the PCBs layer stack. Related instruc-

tions are given in Section 2.2.3. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-

nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-

tion 2.2.3 for instructions of how to design the antenna connection in order to achieve the required 50 line impedance. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 52 of 125 For type approval purposes(i.e., FCC KDB 996369 related to modular approval requirements), an external application must connect the RF signal in one of the following ways:

Via 50 coaxial antenna connector (common connectors are U-FL or SMA) placed as close as possible to the module's antenna pad. By soldering the antenna to the antenna connection line on the applications PCB (without the use of any connector) as close as possible to the modules antenna pad. By routing the application PCBs antenna to the modules antenna pad in the shortest pos-

sible way. 2.2.3 RF Line Routing Design 2.2.3.1 Line Arrangement Instructions Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software). Embedded Stripline This below figure shows line arrangement examples for embedded stripline. Figure 18: Embedded Stripline line arrangement PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 53 of 125 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Figure 19: Micro-Stripline line arrangement samples PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 54 of 125 2.2.3.2 Routing Examples Interface to RF Connector Figure 20 and Figure 21 show a sample connection of a modules antenna pad at the bottom layer of the module PCB with an application PCBs coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.50mm/0.75mm and the spaces of 0.35mm/0.3mm are only recommended for an application with a PCB layer stack resembling the one of the PLPS9 eval-

uation board, and with layer 2 as well as layer 3 cut clear. For different layer stacks the stripline width will have to follow stripline routing rules, avoiding 90 degree corners and using the short-

est distance to the PCBs coaxial antenna connector. G N D G N D e.g. ANT_ TRX1 Stripline (50 ohms) on top layer of evaluation board from antenna pad to module edge Width = 0.50 mm Ground connection Edge of module PCB 50 ohms microstrip line E.g., U.FL antenna connector G N D G N D Figure 20: Routing to applications RF connector RF track under module:

Line/space: 500/350m Module RF track outside module:

Line/space: 750/300m Figure 21: Routing detail PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 2.2.4 RF Antenna Diagnostic Page 55 of 125 RF antenna (GSM/UMTS/LTE) diagnosis requires the implementation of an external antenna detection circuit. An example for such a circuit is illustrated in Figure 23. It allows to check the presence and the connection status of RF antennas. To properly detect the antenna and verify its connection status the antenna feed point must have a DC resistance RANT of 9k (3k). A positive or negative voltage drop (referred to as Vdisturb) on the ground line may occur without having any impact on the measuring procedure and the measuring result. A peak deviation

(Vdisturb ) of < 0.8V from ground is acceptable. Vdisturb (peak) = 0.8V (maximum); fdisturb = 0Hz 5kHz Waveform: DC, sinus, square-pulse, peak-pulse (width = 100s) Rdisturb = 5 To make sure that the antenna detection operates reliably, the capacitance at the modules an-

tenna pad (i.e., the cable capacitance plus the antenna capacitance (CANT)) should not be greater than 1000pF. Some types of antennas (for example "inverted F antenna" or "half loop antenna") need an RF short circuit between the antenna structure and ground to work properly. In this case the RF short circuit has to be realized via a capacitance (CANT) . For CANT we rec-

ommend a capacitance lower than 100pF (see Figure 22). Antenna SC1 SC2 ANT k 2 1

. k 6 RA 8...36V

-0.8V...+0.8V 0...5kHz 1.6Vpp Ri=5Ohm Figure 22: Resistor measurement used for antenna detection PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 56 of 125 Figure 23 shows the basic principles of an antenna detection circuit that is able to detect an-

tennas and verify their connection status. The GPIO pads can be employed to enable the an-

tenna detection, the ADCx_IN pads can be used to measure the voltage of external devices connected to these ADC input pads - thus determining RANT values. The AT^SRADC write com-

mand configures the parameters required for ADC measurement and returns the measurement result(s) - for command details see [1]. Antenna1..4 8..36V

-0.8V..+0.8V 0..5 kHz 1.6 Vpp Ri = 5 Ohm SC1 SC2 ANT1..4 R1 RAnt 6k..12k L1 S1 R2 appr. 0.7V + VBATT+

R3 VADC GPIOx BATT+

ADCx_IN ANT_TRX1/2

.. ANT_RX3/4 Module Figure 23: Basic circuit for antenna detection The following Table 15 lists possible signal states for the GPIOx signal lines in case these lines are configured and used for antenna detection. Table 15: Possible GPIOx signal states if used for antenna diagnosis Signal state GPIOx:

Meaning Input Pull down or Output low Output high Off (diagnostic measurement is off) On (diagnostic measurement is on) Antenna detection control (S1 in above figure):

PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.2 GSM/UMTS/LTE Antenna Interface 68 Page 57 of 125 Table 16 lists assured antenna diagnostic states depending on the measured RANT values. Note that the RANT ranges not mentioned in the below table, i.e., 1k...6k and 12k...40k are tol-

erance ranges. Within these tolerance ranges a decision threshold for a diagnostic application may be located. For more details and a combined sample RF/GNSS antenna detection circuit please refer to Section 2.4.3. Table 16: Assured antenna diagnostic states Antenna state Normal operation, antenna connected (resistance at feed point as required) Antenna pad short-circuited to GND Antenna not properly connected, or resistance at antenna feed point wrong or not present RANT range RANT = 6k12k RANT = 01k RANT = 40k Antenna pad is short-circuited to the supply voltage of the host application, for example the vehicles on-board power supply voltage max. 36V Measuring procedure for the basic circuit given in Figure 23:

The battery current flows through R1 and RA. The voltage drop on RA is divided by R3/(R3+R2) and measured by the ADCx_IN input. For the ADCx_IN voltage VADCx (monitored using AT^SRADC)and the BATT+ supply voltage VBATT+ (monitored using AT^SBV) several measur-

ing samples should be taken for averaging. The measured and averaged value VADCx will then be compared to three decision thresholds. The decision thresholds depend on BATT+:

Table 17: GSM/UMTS/LTE antenna diagnostic decision threshold Decision threshold1 Short to GND No antenna Short to power Appr. 0,176*VBATT+

(580mV738mV) Appr. 0,337*VBATT+

(1111mV1414mV) 0.146+0.405*VBATT+

(1482mV1888mV)

VADCx Result Short-circuited to ground Antenna connected Antenna nor properly connected Short-circuited to power 1. The decision thresholds depends on BATT+ and has to be calculated separately for each decision (the BATT+ voltage level VBATT+ is known to the system: 3.3V < VBATT+ < 4.2V). PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.3 GNSS Antenna Interface 68 2.3 GNSS Antenna Interface Page 58 of 125 In addition to the RF antenna interface PLPS9 also has a GNSS antenna interface. See Section 2.1.1 to find out where the GNSS antenna pad is located. The GNSS pads shape is the same as for the RF antenna interface (see Section 2.2.2). It is possible to connect active or passive GNSS antennas. In either case they must have 50 impedance. The simultaneous operation of GSM/UMTS/LTE and GNSS is implemented. For electrical characteristics see Section 2.2. PLPS9 provides the signal GNSS_EN to enable an active GNSS antenna power supply. Figure 24 shows the flexibility in realizing the power supply for an active GNSS antenna by giving a sample circuit realizing the supply voltage for an active GNSS antenna. For more details and a combined sample RF/GNSS antenna detection circuit please refer to Section 2.4.3. Module Application:

GNSS Receiver Antenna Matching ANT_GNSS RF DC DC LNA Active GNSS Antenna ANT_GNSS_DC BATT+

VGNSS

(3.2V) GNSS_EN IN OUT LDO EN LP3985IM5-3.2 Rs Is 1R0 Rv 100

Io Current Sensor FAN4010 Io Rg 3k3 ADCx_IN Si1023X_1 10k 1u ESD Protection Si1023X_2 10k Ug Figure 24: Supply voltage for active GNSS antenna PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.3 GNSS Antenna Interface 68 Page 59 of 125 Figure 25 shows a sample circuit realizing ESD protection for a passive GNSS antenna. Con-

necting the input ANT_GNSS_DC to GND prevents ESD from coupling into the module. Module SMT interface GNSS _EN Not used 100nF ANT_GNSS _DC 10nH ANT_GNSS To GNSS receiver

(Optional) ESD protection 0R Passive GNSS antenna Figure 25: ESD protection for passive GNSS antenna 2.3.1 GNSS Antenna Diagnostic GNSS antenna diagnosis does require an external detection circuit. The antenna DC supply current can be measured via ADCx_IN. The ADCx_IN input voltage (Ug) may be generated by a sample circuit shown in Figure 24. The circuit allows to check the presence and the connec-

tion status of an active GNSS antenna. Passive GNSS antennas cannot be detected. There-

fore, GNSS antenna detection is only available in active GNSS antenna mode. This mode is configured by the AT command: AT^SGPSC (for details see [1]) Having enabled the active GNSS antenna mode the presence and connection status of an ac-

tive GNSS antenna can be checked using the AT command AT^SRADC to monitor ADCx_IN. The following table lists sample current ranges for possible antenna states as well as sample voltage ranges as possible decision thresholds to distinguish between the antenna connection states. Please refer to [1] for more information on the command AT^SRADC. Table 18: Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning Antenna connection status Antenna not connected Decision threshold Antenna connected Decision threshold Current ranges (IS)1

<1.4mA Voltage ranges (UG) 2.2mA...20mA 59mV 20%

825mV 20%

Antenna short circuited to ground

>30mA GNSS antenna detection is not possible because GNSS antenna power supply is switched off.

1. Please note that the mA ranges 1.4mA...2.2mA and 20mA...30mAare tolerance ranges. The decision threshold should be defined within these ranges. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.4 Sample Application 68 Page 60 of 125 2.4 Sample Application Figure 26 shows a typical example of how to integrate an PLPS9 module with an application. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply VCC C of the microcontroller. Low state of the open collector pulls the PWR_IND signal low and indicates that the PLPS9 module is active, high level notifies the Power Down mode. If the module is in Power Down mode avoid current flowing from any other source into the mod-

ule circuit, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse flow. While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [3]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. Some LGA pads are connected to clocks or high speed data streams that might interfere with the modules antenna. The RF receiver would then be blocked at certain frequencies (self in-

terference). The external applications PCB tracks connected to these pads should therefore be well shielded or kept away from the antenna. This applies especially to the USB and UICC/

SIM interfaces. Depending on the micro controller used by an external application PLPS9s digital input and output lines may require level conversion. Section 2.4.2 shows a possible sample level conver-

sion circuit. The analog-to-digital converter (ADCx_IN lines) can be used for antenna diagnosis. A sample antenna detection circuit can be found in Figure 28 and Figure 29. Disclaimer:

No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 26 and the information detailed in this section. As functionality and compliance with na-

tional regulations depend to a great amount on the used electronic components and the indi-

vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using PLPS9 modules. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.4 Sample Application 68 Page 61 of 125 47k 47k 100k VCC C VDD

(1.8V) VCC C GSM/UMTS/LTE GSM/UMTS/LTE UMTS/LTE UMTS/LTE GNSS IGT ANT_TRX1 EMERG _OFF ANT_TRX2 PWR_IND ANT_RX4 VEXT (1.8V) ANT_GNSS ANT_RX3 GND GND GND GND GND GND GND GND GND GND OE VCCB V CCA 4 Level Controller PCM interface lines 4 PCM2_... BATT+

2 2 BATT+_RF Module 47F Ultra low ESR Rechargeable Lithium battery

NTC 4 x 47F Ultra low ESR Serial interface ASC0 RXD0, TXD0, ... USB 2.0 HS Mode Or Mode USB 3.0 SS VUSB_IN USB_DP, USB_DN USB_SS... 8 2 4 Optional low capacitance ESD protection**

CCIN CCVCC CCRST CCIO CCCLK GND SIM 220nF 1nF All SIM components should be close to card holder. Keep SIM wires low capacitive.

** See Section 2.1.7.1 for de-

tails on enhanced ESD protec-

tion Figure 26: PLPS9 sample application 2.4.1 Prevent Back Powering Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided in any case, for example reverse current from high state external control lines while the module is powered down. Therefore, the external application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module. A simple solution preventing back powering is the usage of VEXT for level shifters, as Figure 27 shows. If level shifters are not really required, it is also possible to employ buffers. While the module is in power down mode, VEXT must have a level lower than 0.3V after a cer-

tain time. If this is not the case the module is fed back by the application interface - recognizing such a fault state is possible by VEXT. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.4 Sample Application 68 2.4.2 Sample Level Conversion Circuit Page 62 of 125 Depending on the micro controller used by an external application PLPS9s digital input and output lines (i.e., ASC0 lines) may require level conversion. The following Figure 27 shows sample circuits with recommended level shifters for an external applications micro controller

(with VLOGIC between 3.0V...3.6V). The level shifters can be used for digital input and output lines with VOHmax=1.85V or VIHmax =1.85V. The circuits recommend below would also be suit-

able for back powering protection. External application VLOGIC

(3.0V...3.6V) Input lines, e.g., RXD, CTS VCC Low level input Low level input Low level input VCC Micro controller E.g., 74VHC1GT50 74LV1T34 Output lines, e.g., TXD, RTS Wireless module Digital output lines, e.g., RXD0, CTS0 VEXT (1.8V) Digital input lines, e.g., TXD0, RTS0 5V tolerarant 5V tolerant E.g., 74LVC2G34 NC7WZ16 External Application Wireless module

+3.0V VEXT (1.8V) VCCA VCCB D N G D N G TXD0D RTS0D RXD0D CTS0D 1 2 3 4 5 6 7 8 1DIR 2DIR 1A1 1A2 2A1 2A2 G N D

+3.0V k 0 0 1 PWR_IND TXD0 RTS0 RXD0 CTS0 16 15 14 13 12 11 10 9 1OE 2OE 1B1 1B2 2B1 2B2 GND1 GND2 GND E.g., 74AVC4T245 GND Figure 27: Sample level conversion circuits PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.4 Sample Application 68 Page 63 of 125 2.4.3 Sample Circuit for Antenna Detection The following figures explain how an RF antenna detection circuit may be implemented for PLPS9 to be able to detect connected antennas (for basic circuit and diagnostic principles - in-

cluding usage of GPIO and ADCx_IN pads - please refer to Section 2.2.4). Figure 28 gives a general overview, Figure 29 depicts the actual antenna detection layout and shows how ESD protection, i.e., the RF/DC bridge, will have to be handled. Properties for the components mentioned in Figure 28 and Figure 29 are given in Table 19 -

parts list. GNSS Antenna RX4 Antenna RX3 Antenna TRX2 Antenna TRX1 Antenna 1 T N A 2 T N A 3 T N A 4 T N A 5 T N A Antenna Detection Circuit ADC4 ADC3 BATT+

GPIOx ADC5 Mux ADC2 ADC1 BATT+

Module LGA ADC1_IN ADC2_IN GPIOy ADC4_IN ADC5_IN GPIOx BATT+

GND BATT+

ANT_TRX1 ANT_TRX2 ANT_RX3 ANT_RX4 ANT_GNSS TRX1 antenna pad TRX2 antenna pad RX3 antenna pad RX4 antenna pad GNSS antenna pad Separate single GND pin which is not used for modules power supply Figure 28: Antenna detection circuit sample - overview PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.4 Sample Application 68 Page 64 of 125 1 T N A 2 T N A 3 T N A 4 T N A L1 C1 C3 L2 C2 Low pass filter

(DC insertion ) C4 ESD protection L3 C7 C9 L4 C8 C10 R13 R14 R15 R16 Coupling resistor R1 R2 Negative voltage limitation R17 R18 V1 V2 V8 V9 Overvoltage limitation BATT+

R19 V10 BATT+

R3 V3 R5 C5 R7 R4 V4 R6 C6 R8 R20 V11 R22 C12 R24 Level adaption to ADC inputs ADC2 ADC3 R21 C11 R23 BATT+

R11 V6 V5 GPIOx R9 R12 R10 Switching on /off of BATT+

For component values see parts list V7 Overvoltage limitation Figure 29: Antenna detection circuit sample - schematic ADC1 ADC4 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 2.4 Sample Application 68 Page 65 of 125 Table 19: Antenna detection reference circuit - parts list Reference Part Value Tolerance Conditions Size R1,2,17,18 Resistor R3,4,19,20 Resistor R5,6,21,22 Resistor R7,8,23,24 Resistor R9,10 R11,12 Resistor Resistor R13,14,15,16 Resistor C1,2,7,8 Capacitor C3,4,9,10 Capacitor C5,6,11,12 Capacitor 22R 10k 140k 100k 100k 10k 22p 100n 100n 1%

1%

4k4

(e.g., 2x2k2 or 4x1k1) 1%

V1,2,8,9 Schottky diode RB520-40 V3,4,6,7,10,1 1 Transistor BC857 V5 Transistor BC847

> 125mW

> 125mW

> 300mW 50V 50V 10V 40V

< 0402 L1,2,3,4 Inductor 39nH Wire wound High Q 0402 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 3 GNSS Interface 68 Page 66 of 125 3 GNSS Interface PLPS9 integrates a GNSS receiver that offers the full performance of GPS/GLONASS technol-

ogy. The GNSS receiver is able to continuously track all satellites in view, thus providing accu-

rate satellite position data. The integrated GNSS receiver supports the NMEA protocol via USB or ASC0 interface. NMEA is a combined electrical and data specification for communication between various (marine) electronic devices including GNSS receivers. It has been defined and controlled by the US based National Marine Electronics Association. For more information on the NMEA Standard please refer to http://www.nmea.org. Depending on the receivers knowledge of last position, current time and ephemeris data, the receivers startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowl-

edge of its last position or time, a startup takes considerably longer than if the receiver has still knowledge of its last position, time and almanac or has still access to valid ephemeris data and the precise time. For more information see Section 3.1. By default, the GNSS receiver is switched off. It has to be switched on and configured using AT commands. For more information on how to control the GNSS interface via the AT commands see [1]. Dead Reckoning Sync Line:

Dead reckoning solutions are used in (automotive) platforms to determine the (vehicles) loca-

tion even when there is no GNSS signal available (e.g. in tunnels, basement garages or even between high buildings in cities). In addition to dead reckoning related NMEA sentences(for details see [1]: GNSS sentences), PLPS9 provides a dead reckoning synchronization line (DR_SYNC line) to be employed in external dead reckoning applications. DR_SYNC is derived from the GNSS signal clock as 1 pulse per second (1PPS) signal, with a frequency of 1Hz, an accuracy of +/-5 ms, and a high state pulse of 1ms. The DR_SYNC signal is provided as long as synchronized with the GNSS satellite clock, and continues after GNSS signal loss. DR_SYNC can be configured for the GPIO1 pad. DR_SYNC can be activated using the AT command AT^SGPSC. For more information on the command please refer to [1],For electrical characteristics see Table 4. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 3.1 GNSS Interface Characteristics 68 3.1 GNSS Interface Characteristics The following tables list general characteristics of the GNSS interface. Page 67 of 125 Table 20: GNSS properties Parameter Frequency Conditions GPS GLONASS Beidou1 Galileo Min. 1575 1597

Typical Max. 1575.42 1585 1602 1607

1597 1575.42 1585 Tracking Sensitivity Open sky Active antenna or LNA2 Passive antenna:

GPS GLONASS Beidou1 Galileo GPS GLONASS Beidou1 Galileo Acquisition Sensitivity Open sky Active antenna or LNA2 Passive antenna:

Cold Start sensitivity GPS GLONASS Beidou1 Galileo Cold Warm Time-to-First-Fix (TTFF) 1. Conditions and measurements not yet finalized. 2. Only measured for GPS. Unit MHz dBm dBm dBm

-159

-156

-154

-150

-149

-145

-140

-140

-145

-140

-140 25 10 32 29 s s PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 3.1 GNSS Interface Characteristics 68 Page 68 of 125 Through the external GNSS antenna DC feeding the module is able to supply an active GNSS antenna. The supply voltage level at the GNSS antenna interface depends on the GNSS con-

figurationdone with AT command as shown in Table 21. Table 21: Power supply for active GNSS antenna Function Setting samples IO Signal form and level GNSS active antenna supply Supply voltage with:

GNSS receiver off Active antenna off Supply voltage with:

GNSS receiver on Active antenna on SLEEP mode Supply voltage with:

GNSS receiver on Active antenna auto O O O GNSS supply voltage level G NSS supply voltage level GNSS supply voltage level PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4 Operating Characteristics 98 4 Operating Characteristics 4.1 Operating Modes Page 69 of 125 The table below briefly summarizes the various operating modes referred to throughout the document. Table 22: Overview of operating modes Mode Function Normal operation GSM / GPRS /

UMTS / HSPA /

LTE SLEEP Power saving set automatically when no call is in progress and the USB connection is detached and no active communication via ASC0. Also, the GNSS active antenna mode has to be turned off or set to "auto"

GSM / GPRS /

UMTS / HSPA /

LTE IDLE GSM TALK/

GSM DATA GPRS DATA EGPRS DATA UMTS TALK/

UMTS DATA HSPA DATA LTE DATA Power saving disabled or an USB connection active, but no data trans-

fer in progress. Connection between two subscribers is in progress. Power consump-

tion depends on the GSM network coverage and several connection settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be mea-

sured in TALK_GSM mode: DTX off, FR and no frequency hopping. GPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). EGPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings). UMTS data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. HSPA data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. LTE data transfer in progress. Power consumption depends on network settings, data transfer rates, and carrier aggregation/MIMO configura-

tion. Power Down Normal shutdownafter sending the AT^SMSO command. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied. Only a volt-

age regulator is active for powering the RTC, as long as operating voltage applied at BATT+

does not drop below approx. 1.4V. Airplane mode Airplane mode shuts down the radio part of the module, causes the module to log off from the GSM/GPRS network and disables allAT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see [1]). PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 4.2 Power Up/Power Down Scenarios Page 70 of 125 In general, be sure not to turn on PLPS9 while it is beyond the safety limits of voltage (see Sec-

tion 2.1.2.1) and temperature (see Section 4.5). PLPS9 immediately switches off after having started and detected these inappropriate conditions. In extreme cases this can cause perma-

nent damage to the module. 4.2.1 Turn on PLPS9 When the PLPS9 module is in Power Down mode, it can be started to Normal mode by driving the IGT (ignition) line to ground. It is required to use an open drain/collector driver to avoid cur-

rent flowing into this signal line. Pulling this signal low triggers a power-on sequence. To turn on PLPS9, it is strongly recommended to keep IGT active low for at least 100 milliseconds, even though under certain conditions a period of less than 100 milliseconds might be sufficient. After turning on PLPS9, IGT should be set inactive to prevent the module from turning on again after a shut down by AT command or EMERG_OFF. For details on signal states during startup see also Section 4.2.2. IGT Systemstartup ,commandInterfaceinitialization Functionactive BATT+

IGT PWR_IND VEXT EMERGOFF ASC0 CTS0 ASC1 CTS1 USB

>100ms InitialState InitialState InitialState InitialState InitialState Figure 30: Power-on with IGT Note: After power up IGT should remain high. Also note that with a USB connection the USB host may take some seconds to set up the virtual COM port connection. After startup or mode change the following URCs are sent to every port able to receive AT com-

mands indicating the modules ready state (this may take up to approx. 36s):

"^SYSSTART" indicates that the module has entered Normal mode.

"^SYSSTART AIRPLANE MODE" indicates that the module has entered Airplane mode. These URCs notify the external application that the first ATcommand can be sent to the mod-

ule. If these URCs are not used to detect then the only way of checking the modules ready state can be checked by polling, e.g., send characters (e.g. "at")until the module is responding. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 Page 71 of 125 Please note that on USB ports these URCs are only sent if the USB interface is in state 'con-

figured', and with AT^SCFG= "MEopMode/ExpectDTR being enabled (see also Section 4.3) the connected USB host has signaled being ready to receive data. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 4.2.2 Signal States after First Startup Page 72 of 125 Table 23 describes the various states each interface signal passes through after startup until the system is active. Signals are in an initial state while the module is initializing. Once the startup initialization has completed, i.e. when the software is running, all signals are in a defined state. The state of some signals may change again once a respective interface is activated or configured by AT command. Table 23: Signal states Signal name Pad no. Hardware init Firmware init System active N19 L19 J19 M19 F18 H19 G19 G20 R9 R8 R7 R6 N9 N10 N7 N8 M9 M10 M11 M12 F16 R11 CCIN1 CCRST1 CCIO1 CCCLK1 RXD0 TXD0 CTS0 RTS0 RXD1 TXD1 CTS1 RTS1 DIN2 BCLK2 FSC2 DOUT2 I2CDAT1 I2CCLK1 I2CDAT2 I2CCLK2 EMERG_OFF PCIE_HOST_ RST PCIE_HOST_ WAKE PCIE_CLK_ REQ R14 PCIE_CLK_P P16 R10 Reset phase

(ignition) 0 - 100ms PD L L L Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri PD Tri 100ms - 5s PD/PU L L L PD --> PU PD --> PU PD --> PU PD --> PU PD --> PU PD --> PU PD --> PU PD --> PU PU --> PD PD PD PD PD --> PU PD --> PU PD --> PU PD --> PU PU PD --> L Tri PD Tri Tri/PCIe PD Tri/PCIe PCIE_CLK_M P17 Tri/PCIe Tri/PCIe PCIE_RX_P Tri/PCIe Tri/PCIe PCIE_RX_M Tri/PCIe Tri/PCIe PCIE_TX_P Tri/PCIe Tri/PCIe PCIE_TX_M Tri/PCIe Tri/PCIe T12 T13 T15 T16 5s - 36s PD/PU --> PU 1.8V/3V Data 1.8V/3V Data 1.8V/3V CLK PU --> Tri PU --> Tri PU --> Tri PU --> Tri PU --> Tri PU --> Tri PU --> Tri PU --> Tri PD PD PD PD PU PU PU PU PU 2 packets activity

(11s and 13s) PD --> Tri PD --> L 2 packets activity

(11s and 13s) 2 packets activity

(11s and 13s) 2 packets activity

(11s and 13s) 2 packets activity

(11s and 13s) 2 packets activity

(11s and 13s) 2 packets activity

(11s and 13s)

>36s PU L L L Tri Tri Tri Tri Tri Tri Tri Tri PD 512kHz clock 16kHz clock L PU PU PU PU PU L Tri L Tri/PCIe Tri/PCIe Tri/PCIe Tri/PCIe Tri/PCIe Tri/PCIe PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 Page 73 of 125 Signal name Pad no. Hardware init Firmware init System active Reset phase

(ignition) 0 - 100ms Tri Tri Tri L PD Tri Tri Tri Tri Tri 100ms - 5s PD PD PD L PD Tri Tri Tri Tri PD

>36s 5s - 36s L PD L PD L PD L L PD PD Tri Tri Tri Tri Tri Tri Tri Tri PD --> H (after 24s) H Table 23: Signal states E12 ANT_SW1 E11 ANT_SW2 ANT_SW3 E10 ANT_GNSS_ DC A17 D13 GNSS_EN D10 ADC1_IN ADC2_IN D11 D8 ADC4_IN D9 ADC5_IN JTAG_WD_ M8 DISABLE JTAG_TCK JTAG_TMS JTAG_TRST JTAG_TDI JTAG_SRST JTAG_TDO JTAG_PS_ HOLD EMMC_D0 C18 D14 D15 D16 D17 D18 E13 N15 EMMC_D1 EMMC_D2 EMMC_D3 EMMC_D4 EMMC_D5 EMMC_D6 EMMC_D7 EMMC_CLK EMMC_CMD P13 EMMC_DETECT L7 EMMC_PWR L15 M14 N14 P14 N12 N13 M13 P12 P15 E8 T7 L20 P6 H18 E9 M20 T10 T8 D12 GPIO1 GPIO2 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 L L Tri L L L Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri L Tri Tri Tri Tri Tri Tri Tri Tri Tri Tri H H PD H H H H PD PD PD PD PD PD PD L PD --> L PD PD --> PU L PD PD PD PD PU --> PD PD PD PD PD PD H H PD H H H H H H PD H H H H 50ms PU and 950ms PD 50ms PU and 950ms PD 50ms PU and 950ms PD 50ms PU and 950ms PD PD PD PD L 50ms CLK and 950ms PD 50ms PU and 950ms PD PU 50ms 2.85V and 950ms L (after 3s) PD --> L PD PD PD PD PD PD PD --> H PD --> Tri PD 50ms PU and 950ms PD 50ms PU and 950ms PD 50ms PU and 950ms PD 50ms PU and 950ms PD PD PD PD L 50ms CLK and 950ms PD 50ms PU and 950ms PD PU 50ms 2.85V and 950ms L L PD PD PD PD PD PD Data/H Tri PD PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 Page 74 of 125 Signal name Pad no. Hardware init Firmware init System active Table 23: Signal states GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO22 HEART_BEAT USB_SSTX_P USB_SSTX_N USB_SSRX_P USB_SSRX_N USB_DP USB_DN VUSB_IN IGT PWR_IND VEXT T9 R17 M7 F17 J20 G18 F19 M15 C17 H16 H17 K16 K17 M16 M17 P18 D19 R5 E18 Reset phase

(ignition) 0 - 100ms Tri Tri Tri PD Tri Tri Tri Tri Tri 100ms - 5s PD PD PD PD PD --> PU PU PD PD PD Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB L (no value) L (no value) PU Tri L PU L 1.8V

>36s H 5s - 36s PD --> H (after 6s) PD --> PU (after 28s) PU PD --> H (after 24s) H PD PU --> PD PD PD PD H --> L with 0.1Hz frequency) Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB L (no value) PU L 1.8V PD PD PD PD PD H --> L with 0.1Hz frequency) Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB Tri/USB L (no value) PU L 1.8V L = Low level in Push-Pull configuration H = High level in Push-Pull configuration Tri = Tristate configuration PD = Pull down configuration PU = Pull up configuration PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 4.2.3 Turn off or Restart PLPS9 Page 75 of 125 To switch off or restart the module the following procedures may be used:

Software controlled shutdown procedure: Software controlledby sending an AT command over the serial application interface. See Section 4.2.3.1. Software controlled restart procedure: Software controlled by sending an AT command over the serial application interface. See Section 4.2.3.2. Hardware controlled shutdown procedure: Hardware controlled shutdown by IGT line. See Section 4.2.3.3. Hardware controlled shutdown or restart procedure: Hardware controlled shutdown or restart by EMERG_OFF line. See Section 4.2.3.4. Automatic shutdown (software controlled): See Section 4.2.4

- Takes effect if PLPS9 board temperature exceeds a critical limit In case the dedicated software or hardware controlled shutdown procedures described in the section below fail or hang for some reason, it may become necessary to disconnect BATT+ in order to shut down the module. Please refer to Section 4.2.3.5 for a description of this context. 4.2.3.1 Switch off PLPS9 Using ATShutdown Command The best and safest approach to powering down PLPS9 is to issue the AT^SMSOshutdown command. This procedure lets PLPS9 log off from the network and allows the software to enter into a secure state and save data before disconnecting the power supply. The mode is referred to as Power Down mode. After sending AT^SMSO do not enter any other AT commands.While powering down the module may still send some URCs. The shutdown commands OK re-

sponse indicates that the data has been stored non-volatile and the module will turn down in a few seconds. The complete power down procedure may take approx. 20s. To verify that the module definitely turned off, it is possible to monitor the PWR_IND signal. A high state of the PWR_IND signal line indicates that the module is being switched off as shown in Figure 31. Be sure not to disconnect the supply voltage VBATT+ before the modules switch off procedure has been completed. Otherwise you run the risk of losing data. Signal states during switch off are shown in Figure 31. While PLPS9 is in Power Down mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital signal lines of the application interface. No special care is required for the USB interface which is protected from reverse current. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 Page 76 of 125 Start shutdown approx. 20s Deregister from network, system shut down PWR_IND Digital outputs VEXT Inputs driven by application BATT + driven by application Figure 31: Signal states during turn-off procedure Note 1:

Note 2:

VEXT can be used in solutions to prevent back powering (see also Section 2.4.1). It should have a level lower than 0.3V after module shutdown. After module shutdown by means of AT command, i.e., after the VEXT level went below 0.3V, please allow for a time period of at least 1 second before restarting the module. 4.2.3.2 Restart PLPS9 Using Restart Command The best and safest approach to restart PLPS9 is by AT command. For more information on the AT^CFUN command please refer to is described in detail in [1]. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 4.2.3.3 Turn off PLPS9 Using IGT Line Page 77 of 125 The IGT line can be configured for use in two different switching modes: You can configure the IGT line to switch on the module only, or to switch it on and off. This approach is useful for ex-

ternal application manufacturers who wish to have an ON/OFF switch installed on the host de-

vice. The switching mode is determined by the parameter "MEShutdown/OnIgnition" of the AT^SCFG command. By factory default, the ON/OFF switch mode of IGT is disabled. AT^SCFG=MEShutdown/OnIgnition

^SCFG: "MEShutdown/OnIgnition","off"

OK

# Query the current status of IGT.

# IGT can be used only to switch on PLPS9. IGT works as described in Section 4.2.1. To configure IGT for use as ON/OFF switch:

AT^SCFG=MEShutdown/OnIgnition,on

^SCFG: "MEShutdown/OnIgnition","on"

OK

# Enable the ON/OFF switch mode of IGT.

# IGT can be used to switch on and off PLPS9. Take great care before changing the switching mode of the IGT line. To ensure that the IGT line works properly as ON/OFF switch it is of vital importance that the following conditions are met:

Switch-on condition:

If the PLPS9 is off, the IGT line must be asserted for at least 100 millisec-

onds before being released. Switch-off condition: If the PLPS9 is on, the IGT line must be asserted for at least 2.1 seconds before being released. The module switches off after the line is released. The switch-off routine is identical with the procedure initiated by AT^SMSO, i.e. the software performs an orderly shutdown as described in Section 4.2.3.1. Before switching off the module wait at least 36 seconds after startup. 1 IGT

> 100ms

> 36s 2

> 2.1s 1 TriggersswitchONroutine 2 TriggersswitchOFFroutine Figure 32: Timing of IGT if used as ON/OFF switch PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 Page 78 of 125 4.2.3.4 Turn off or Restart PLPS9 in Case of Emergency Caution: Use the EMERG_OFF line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_OFF line causes the loss of all infor-

mation stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if PLPS9 does not respond, if reset or shutdown via AT command fails. The EMERG_OFF line is available on the application interface and can be used to turn off or to restart the module. In any case the EMERG_OFF line must be pulled to ground until the Pow-

er Down mode is reached, as indicated by PWR_IND=high. To control the EMERG_OFF line it is required to use an open drain / collector driver. EMERG_OFF is pulled high internally. Now, to permanently turn off the module, the IGT line has to be set to high (inactive) before the EMERG_OFF line is released. The module will then switch off and needs to be restarted at a later time. This switch off behavior is shown in Figure 33. IGT 1) tPD EMERG_OFF PWR_IND BATT+

2) 1) The time to Power Down mode (tPD) depends on the operating state and can be up to 2000ms. PWR_IND should be monitored by the external application. Note that a low impulse at EMERG_OFF for more than 2000ms will reset the modules RTC. 2) The power supply voltage (BATT+) may be disconnected only after having reached Power Down mode as indicated by the PWR_IND signal going high. The power supply has to be available

(again) before the module is restarted. Figure 33: Shutdown by EMERG_OFF signal To simply restart the module, the IGT line has to continue to be driven low (active) for at least 100ms after having released the EMERG_OFF line. The module will then switch off and restart automatically. This restart behavior is shown in Figure 34. IGT EMERG_OFF BATT+

1) tRESET Module off PWR_IND Module on Module on 1) The time to module reset (tRESET) must be > 100ms Figure 34: Restart by EMERG_OFF signal PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 4.2.3.5 Overall Shutdown Sequence Page 79 of 125 In case the above described dedicated software or hardware controlled shutdown procedures fail or hang for some reason, it may become necessary to disconnect BATT+ in order to ulti-

mately shut down the module. Figure 35 shows a flow chart that illustrates how an overall shut-

down sequence might be implemented. Moduleswitchoff... SWcontrolled:EnterAT^SMSO HWcontrolled:TurnoffusingIGTline Waitforatleast25seconds Switchedoff?

(PWR_IND=High?) Yes OK, finished No ActivateEMERG_OFFline Waitforatleast1second Switchedoff?

Yes

(PWR_IND=High?) OK, finished No DisconnectBATT+

OK, finished Figure 35: Overall shutdown sequence PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 Page 80 of 125 4.2.4 Automatic Shutdown Automatic shutdown takes effect if:

The PLPS9 board is exceeding the critical limits of overtemperature or undertemperature Undervoltage or overvoltage is detected The automatic shutdown procedure is equivalent to the power down initiated with the AT^SMSO command, i.e. PLPS9 logs off from the network and the software enters a secure state avoiding loss of data. Alert messages transmitted before the device switches off are implemented as Unsolicited Re-

sult Codes (URCs). The presentation of the temperature URCs can be enabled or disabled with the command AT^SCTM. The URC presentation mode varies with the condition, please see Section 4.2.4.1 to Section 4.2.4.4 for details. For further instructions on AT commands refer to

[1]. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 Page 81 of 125 4.2.4.1 Thermal Shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by the NTC resistor are measured directly on the board and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, PLPS9 instantly displays an alert (if enabled). URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on settings selected with the AT^SCTM command. AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minutes guard period after start-up of PLPS9. After expiry of the 2 minutes guard period, the presentation will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated. URCs indicating the level "2" or -2 are instantly followed by an orderly shutdown, except in cases described in Section 4.2.4.2. The presentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0was never changed. The (maximum) temperature ratings are stated in Section 4.5. Temperature limits and associ-

ated URCs are listed in the below Table 24. Table 24: Board temperature warning and switch off level Parameter Temperature URC Notes High temperature switch off active

> +97C

^SCTM_B: 2 High temperature switch off release < +96C

^SCTM_B: 1 High temperature warning active

> +86C

^SCTM_B: 1 High temperature warning release

< +85C

^SCTM_B: 0 Operating temperature range

-30C...+85C ---

Low temperature warning release

> -30C

^SCTM_B: 0 Low temperature warning active

< -31C

^SCTM_B: -1 Low temperature switch off release

> -40C

^SCTM_B: -1 Low temperature switch off active

< -42C

^SCTM_B: -2 Possible deviation is typically 2C. Possible deviation is typically 2C. The AT^SCTM command can also be used to check the present status of the board. Depending on the selected mode, the read command returns the current board temperature in degrees Celsius or only a value that indicates whether the board is within the safe or critical temperature range. See [1] for further instructions. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 Page 82 of 125 4.2.4.2 Deferred Shutdown at Extreme Temperature Conditions In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex-

ceeded:

While an emergency call is in progress. During a two minute guard period after power-up. This guard period has been introduced in order to allow for the user to make an emergency call. The start of any one of these calls extends the guard period until the end of the call. Any other network activity may be termi-

nated by shutdown upon expiry of the guard time. While in a "deferred shutdown" situation, PLPS9 continues to measure the temperature and to deliver alert messages, but deactivates the shutdown functionality. Once the 2 minute guard period is expired or the call is terminated, full temperature control will be resumed. If the tem-

perature is still out of range, PLPS9 switches off immediately (without another alert message). Caution: Automatic shutdown is a safety feature intended to prevent damage to the module. Extended usage of the deferred shutdown facilities provided may result in damage to the mod-

ule, and possibly other severe consequences. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.2 Power Up/Power Down Scenarios 98 4.2.4.3 Undervoltage Shutdown Page 83 of 125 If the measured battery voltage is no more sufficient to set up a call the following URC will be presented:

^SBC: Undervoltage. The URC indicates that the module is close to the undervoltage threshold. If undervoltage per-

sists the module keeps sending the URC several times before switching off automatically. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. 4.2.4.4 Overvoltage Shutdown The overvoltage shutdown threshold is 100mV above the maximum supply voltage VBATT+

specified in Table 4. When the supply voltage approaches the overvoltage shutdown threshold the module will send the following URC:

^SBC: Overvoltage warning This alert is sent once.

^SBC: Overvoltage shutdown before it shuts down cleanly. When the overvoltage shutdown threshold is exceeded the module will send the following URC This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Keep in mind that several PLPS9 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of PLPS9, even if the module is switched off. Es-

pecially the power amplifier is very sensitive to high voltage and might even be destroyed. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.3 Power Saving 98 Page 84 of 125 4.3 Power Saving PLPS9 is able to reduce its functionality to a minimum (during the so-called SLEEP mode) in order to minimize its current consumption. The following sections explain the modules network dependent power saving behavior. The power saving behavior is further configurable by AT command:

AT^SCFG= "MEopMode/PwrSave": The power save mode is by default enabled. While inactive, the module stays in power save (SLEEP) state, waking up only upon any of the following events:

- Cyclically to meet basic technical demands, e.g. network requirements (such as regularly listening to paging messages from the base station as described in Section 4.3.1, Section 4.3.2 and Section 4.3.3.

- Cyclically after expiry of a configured power saving period.

- Data at any interface port, e.g., URCs for incoming calls. AT^SCFG= "MEopMode/ExpectDTR": Power saving will take effect only if there is no trans-

mission data pending on any of the modules USB ports. The expect DTR AT command ensures that data becoming pending on any USB port before an external application has signaled its readiness to receive the data is discarded. By default this behavior is enabled for all available USB CDC ACM and CDC ECM ports. AT^SCFG="Radio/OutputPowerReduction": Output power reduction is possible for the module in GPRS multislot scenarios to reduce its output power according to 3GPP 45.005 section. Please refer to [1] for more information on the above AT commands used to configure the mod-

ules power saving behavior. The implementation of the USB host interface also influences the modules power saving behavior and therefore its current consumption. For more information see Section 2.1.3. Another feature influencing the current consumption is the configuration of the GNSS antenna interface. For details see Section 3.1. Also note that the module does not wake up from SLEEP mode just to measure the supply volt-

age, and that the command AT^SBV reports an average over the values it was able to measure last (see also Section 4.4.3). Therefore, the shorter the power saving periods are, the faster and more precisely will the reported average adjust to possible voltage changes. 4.3.1 Power Saving while Attached to GSM Networks The power saving possibilities while attached to a GSM network depend on the paging timing cycle of the base station. The duration of a paging timing cycle can be calculated using the fol-

lowing formula:

t = 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value. DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging timing cycles between 0.47 and 2.12 seconds. The DRX value of the base station is assigned by the GSM network operator. Now, a paging timing cycle consists of the actual fixed length paging plus a variable length PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.3 Power Saving 98 Page 85 of 125 pause before the next paging. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 36. Figure 36: Power saving and paging in GSM networks The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed. Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.47 sec-

onds or longer than 2.12 seconds. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.3 Power Saving 98 Page 86 of 125 4.3.2 Power Saving while Attached to WCDMA Networks The power saving possibilities while attached to a WCDMA network depend on the paging tim-

ing cycle of the base station. During normal WCDMA operation, i.e., the module is connected to a WCDMA network, the duration of a paging timing cycle varies. It may be calculated using the following formula:

t = 2DRX value * 10 ms (WCDMA frame duration). DRX (Discontinuous Reception) in WCDMA networks is a value between 6 and 9, thus result-

ing in paging timing cycles between 0.64 and 5.12 seconds. The DRX value of the base station is assigned by the WCDMA network operator. Now, a paging timing cycle consists of the actual fixed length paging plus a variable length pause before the next paging. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 37. Figure 37: Power saving and paging in WCDMA networks The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed. Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.64 sec-

onds or longer than 5.12 seconds. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.3 Power Saving 98 Page 87 of 125 4.3.3 Power Saving while Attached to LTE Networks The power saving possibilities while attached to an LTE network depend on the paging timing cycle of the base station. During normal LTE operation, i.e., the module is connected to an LTE network, the duration of a paging timing cycle varies. It may be calculated using the following formula:

t = DRX Cycle Value * 10 ms DRX cycle value in LTE networks is any of the four values: 32, 64, 128 and 256, thus resulting in paging timing cycles between 0.32 and 2.56 seconds. The DRX cycle value of the base sta-

tion is assigned by the LTE network operator. Now, a paging timing cycle consists of the actual fixed length paging plus a variable length pause before the next paging. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 38. Figure 38: Power saving and paging in LTE networks The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed. Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.32 sec-

onds or longer than 2.56 seconds. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.4 Power Supply 98 Page 88 of 125 4.4 Power Supply PLPS9 needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+:

BATT+_RF with 2 lines for the RF power amplifier supply BATT+ with 2 lines for the general power management The main power supply from an external application has to be a single voltage source and has to be expanded to two sub paths (star structure). Each voltage domain must be decoupled by application with low ESR capacitors (> 47F MLCC @ BATT+; > 4x47F MLCC @ BATT+_RF) as close as possible to LGA pads. Figure 39 shows a sample circuit for decoupling capacitors for BATT+. Module SMT interface BATT+

BATT+_RF 2 2 1x 4x Decoupling capacitors e.g. 47F X5R MLCC Figure 39: Decoupling capacitor(s) for BATT+

BATT+

GND The power supply of PLPS9 must be able to provide the peak current during the uplink trans-

mission. All key functions for supplying power to the device are handled by the power management IC. It provides the following features:

Stabilizes the supply voltages for the baseband using switching regulators and low drop lin-

ear voltage regulators. Switches the module's power voltages for the power-up and -down procedures. Delivers, across the VEXT line, a regulated voltage for an external application. LDO to provide SIM power supply. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.4 Power Supply 98 4.4.1 Power Supply Ratings Page 89 of 125 Table 25 and Table 26 assemble various voltage supply and current consumption ratings for the supported modules. Possible ratings are preliminary and will have to be confirmed. Table 25: Voltage supply ratings Description Conditions BATT+ Supply voltage Min Typ Max Unit 3.3 3.8 4.2 V Maximum allowed voltage drop during transmit burst Voltage ripple Directly measured at Module. Voltage must stay within the min/max values, including voltage drop, ripple, spikes Normal condition, power control level for Pout max Normal condition, power control level for Pout max

@ f <= 250 kHz

@ f > 250 kHz 400 mV 120 90 mVpp mVpp PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.4 Power Supply 98 Page 90 of 125 Table 26: Current consumption ratings Description IBATT+

1 OFF State supply current Conditions Power Down RTC off USB disconnected Typical rating Unit Average GSM supply current USB connected RTC on USB disconnected SLEEP2 @ DRX=9

(no communication with the module) SLEEP2 @ DRX=5

(no communication with the module) SLEEP2 @ DRX=2

(no communication with the module) IDLE3 @ DRX=2

(UART/USB active, but no communication with the module) USB connected USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB active Voice call GSM850/900;

PCL=5

@ 50 GPRS Data transfer GSM850/900; PCL=5;

1Tx/4Rx GPRS Data transfer GSM850/900; PCL=5;

2Tx/3Rx GPRS Data transfer GSM850/900; PCL=5;

4Tx/1Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) A mA mA mA mA mA mA mA mA 30 60 90 120 1.7 13.2 1.9 13.4 2.5 14 60 70 330 320 430 540 650 980

@ total mismatch 1200 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.4 Power Supply 98 Page 91 of 125 Table 26: Current consumption ratings Description Conditions IBATT+

1 Average GSM supply current EDGE Data transfer GSM850/900; PCL=5;

1Tx/4Rx Typical rating Unit 220 mA EDGE Data transfer GSM850/900; PCL=5;

2Tx/3Rx EDGE Data transfer GSM850/900; PCL=5;

4Tx/1Rx Voice call GSM1800/

1900; PCL=0 GPRS Data transfer GSM1800/1900;

PCL=0; 1Tx/4Rx GPRS Data transfer GSM1800/1900;

PCL=0; 2Tx/3Rx GPRS Data transfer GSM1800/1900;

PCL=0; 4Tx/1Rx EDGE Data transfer GSM1800/1900;

PCL=0; 1Tx/4Rx EDGE Data transfer GSM1800/1900;

PCL=0; 2Tx/3Rx EDGE Data transfer GSM1800/1900;

PCL=0; 4Tx/1Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction)

@ 50 ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) 340 360 600 630 240 230 340 390 500 690 190 300 330 470 630 2.2 2.9 1.5 1.7 80 80 mA mA mA mA mA mA mA mA mA A A mA mA Peak current during GSM transmit burst IBATT+

1 Average GSM supply current

(GNSS on) Voice call GSM850/900;

PCL=5

@ 50

@ total mismatch Voice call GSM1800/

1900; PCL=0

@ 50

@ total mismatch GSM active (UART/USB active); @ DRX=2 &

GNSS NMEA output off GSM active (UART/USB active); @ DRX=2 &

GNSS NMEA output on4 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.4 Power Supply 98 Page 92 of 125 Table 26: Current consumption ratings Description IBATT+

1 Average UMTS supply current Voice calls and Data transfers measured

@ maximum Pout Conditions SLEEP2 @ DRX=9

(no communication with the module) SLEEP2 @ DRX=8

(no communication with the module) SLEEP2 @ DRX=6

(no communication with the module) IDLE3 @ DRX=6

(UART/USB active, but no communication with the module) UMTS Data transfer Band I UMTS Data transfer Band II UMTS Data transfer Band III UMTS Data transfer Band IV UMTS Data transfer Band V/VI/XIX UMTS Data transfer Band VIII USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB active

@ total mismatch

@ total mismatch

@ total mismatch

@ total mismatch

@ total mismatch

@ 50

@ 50

@ 50

@ 50

@ 50

@ 50

@ total mismatch Typical rating Unit 1.6 13.1 1.8 13.3 2.3 13.8 60 70 600 810 600 890 640 820 640 790 590 690 530 620 80 80 mA mA mA mA mA mA mA mA mA mA mA mA IBATT+

1 Average UMTS supply current

(GNSS on) WCDMA active (UART / USB active);

@ DRX=6 & GNSS NMEA output off WCDMA active (UART / USB active);

@ DRX=6 & GNSS NMEA output on4 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.4 Power Supply 98 Page 93 of 125 Typical rating Unit Table 26: Current consumption ratings Description IBATT+

1 Average LTE sup-

ply current (FDD)5 Data transfers measured

@ maximum Pout Conditions SLEEP2 @ "Paging Occasions" = 256 SLEEP2 @ "Paging Occasions" = 128 SLEEP2 @ "Paging Occasions" = 64 SLEEP2 @ "Paging Occasions" = 32 IDLE3 (UART/USB active, but no communi-

cation with the module) USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB active

@ 50

@ total mismatch

@ 50

@ total mismatch

@ 50

@ total mismatch

@ total mismatch

@ total mismatch

@ total mismatch

@ total mismatch

@ 50

@ 50

@ 50

@ 50

@ 50

@ 50

@ 50

@ 50

@ 50

@ 50

@ total mismatch

@ total mismatch

@ total mismatch

@ total mismatch

@ total mismatch

@ total mismatch 1.9 13.5 2.3 13.9 2.9 14.5 4.0 15.2 55 65 630 790 630 880 620 690 660 750 560 590 770 800 550 600 520 590 540 600 540 620 510 570 620 690 600 680 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Data transfer Band 1 LTE Data transfer Band 2 LTE Data transfer Band 3 LTE Data transfer Band 4 LTE Data transfer Band 5, 18, 19 LTE Data transfer Band 7 LTE Data transfer Band 8 LTE Data transfer Band 12 LTE Data transfer Band 13 LTE Data transfer Band 20 LTE Data transfer Band 26 LTE Data transfer Band 28 LTE Data transfer Band 66 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.4 Power Supply 98 Page 94 of 125 Table 26: Current consumption ratings Description Conditions Typical rating Unit 1 IBATT+

Average LTE supply current

(FDD)

(GNSS on) LTE active (UART/USB active);

IDLE; NMEA output off LTE active (UART/USB active);

IDLE; NMEA output on4 IBATT+

1 Average LTE sup-

ply current (TDD)5 SLEEP2 @ "Paging Occasions" = 256 Data transfers measured

@ maximum Pout SLEEP2 @ "Paging Occasions" = 128 SLEEP2 @ "Paging Occasions" = 64 SLEEP2 @ "Paging Occasions" = 32 IDLE3 (UART/USB active, but no communi-

cation with the module) LTE Data transfer Band 34 LTE Data transfer Band 38 LTE Data transfer Band 39 LTE Data transfer Band 40 LTE Data transfer Band 41 LTE Band 34 / 39 USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB active 1 UL / 8 DL 6 UL / 2 DL 1 UL / 8 DL 6 UL / 2 DL 1 UL / 8 DL 6 UL / 2 DL 1 UL / 8 DL 6 UL / 2 DL 1 UL / 8 DL 6 UL / 2 DL

@ 50 LTE Band 38 / 40 / 41 @ 50

@ total mismatch

@ total mismatch 110 110 1.9 13.5 2.3 13.9 2.9 14.5 4.0 15.2 55 65 170 370 230 490 200 410 210 430 240 530 480 580 640 850 mA mA mA mA mA mA mA mA mA mA mA mA mA mA Peak LTE current

(TDD) PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.4 Power Supply 98 Page 95 of 125 Table 26: Current consumption ratings Description 1 Average TD-

IBATT+

SCDMA supply current

(GNSS off) Data transfers measured

@ maximum Pout Conditions SLEEP2 @ DRX=9

(no communication with the module) SLEEP2 @ DRX=8

(no communication with the module) SLEEP2 @ DRX=6

(no communication with the module) IDLE3

(UART/USB active, but no communication with the module) USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB suspend USB disconnected USB active TD-SCDMA Data transfer Band 34 (Band A) TD-SCDMA Data transfer Band 39 (Band F) Typical rating Unit mA mA mA mA mA mA mA 1.6 13.1 1.8 13.3 2.3 13.8 60 70 210 210 80 80 IBATT+

1 Average TD-

SCDMA supply current

(GNSS on) TD-SCDMA active (UART / USB active) IDLE @ DRX=6, NMEA output off TD-SCDMA active (UART / USB active) IDLE @ DRX=6, NMEA output on4 IVUSB_IN USB typical and maximum ratings are mentioned in Table 4: VUSB_IN. 1. With an impedance of ZLOAD=50 at the antenna pads. Measured at 25C and 4.2V - except for Power Down ratings that were measured at 3.4V. 2. Measurements start 6 minutes after switching ON the module, Averaging times: SLEEP mode - 3 minutes, transfer modes - 1.5 minutes Communication tester settings:no neighbor cells, no cell reselection etc, RMC (Reference Measurement Channel) 3. The power save mode is disabled via configuration command 4. One fix per second. 5. Communication tester settings:

- Channel Bandwidth: 5MHz

- Number of Resource Blocks: 25 (DL), 1 (UL)

- Modulation: QPSK PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.4 Power Supply 98 4.4.2 Minimizing Power Losses Page 96 of 125 When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.3V on the PLPS9 board, not even in a transmit burst where current consumption can rise to typical peaks of 2A. It should be noted that PLPS9 switches off when exceeding these limits. Any voltage drops that may oc-

cur in a transmit burst should not exceed 400mV to ensure the expected RF performance in 2G networks. The module switches off if the minimum battery voltage (VBATTmin) is reached. Example:

VImin = 3.3V Dmax = 0.4V VBATTmin = VImin + Dmax VBATTmin = 3.3V + 0.4V = 3.7V Figure 40: Power supply limits during transmit burst 4.4.3 Monitoring Power Supply by AT Command To monitor the supply voltage you can use the AT^SBV command which returns the averaged value related to BATT+ and GND at the SMT application interface. As long as not in SLEEP mode, the module measures the voltage periodically every 110 milli-

seconds. The maximum time the module remains in SLEEP mode can be limited with a the AT command AT^SCFG=MeOpMode/PwrSave (see [1]). The displayed voltage (in mV) is an av-

erage of the last eight measurement results before the power supply query. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.5 Operating Temperatures 98 4.5 Operating Temperatures Page 97 of 125 Table 27: Board temperature Parameter Operating temperature range Restricted temperature range1 Automatic shutdown2 Min

-30

-40 Typ

+25 Max

+85

+95 Unit C C C Temperature measured on PLPS9 board

<-40

>+95 1. Restricted operation allows normal mode data transmissions for limited time until automatic thermal shutdown takes effect. Within the restricted temperature range (outside the operating temperature range) the specified electrical characteristics may be in- or decreased. 2. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may oc-

cur. The possible deviation is in the range of 2C at the overtemperature limit. See also Section 4.2.4.1 for information about the NTC for on-board temperature measure-

ment, automatic thermal shutdown and alert messages. Note that within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and current supply voltage. Note also the differences and dependencies that usually exist between board (PCB) temperature and ambient temperature as shown in the following Figure 41. The possible ambient temperature range depends on the mechanical application design including the module and the PCB with its size and layout. A thermal solution will have to take these dif-

ferences into account and should therefore be an integral part of application design. Heat source Reference point PCB temperature Component LGA mounting Air gap Module Shielding Module PCB LGA mounting Application PCB Thermal conducting gap filler Heat sink Reference point ambient temperature Heat dissipation Figure 41: Board and ambient temperature differences PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 4.6 Electrostatic Discharge 98 4.6 Electrostatic Discharge Page 98 of 125 The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a PLPS9 module. Special ESD protection provided on PLPS9:

BATT+: Inductor/capacitor An example for an enhanced ESD protection for the SIM interface is shown in Section 2.1.7.1. The remaining interfaces of PLPS9 with the exception of the antenna interface are not acces-

sible to the user of the final product (since they are installed within the device) and are therefore only protected according to the ANSI/ESDA/JEDEC JS-001-2014 requirements. PLPS9 has been tested according to the following standards. Electrostatic values can be gath-

ered from the following table. Specification / Requirements Contact discharge Air discharge Table 28: Electrostatic values ANSI/ESDA/JEDEC JS-001-2014 ANSI/ESDA/JEDEC JS-002-2014 ETSI EN 301 489-1/7 All SMT interfaces 1kV Human Body Model n.a. All SMT interfaces 250V Charged Device Model (CDM) n.a. Antenna pads n.a. 8kV Note: The values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment. Reliability Characteristics 4.7 TBD. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5 Mechanical Dimensions and Mounting 109 Page 99 of 125 5 Mechanical Dimensions and Mounting 5.1 Mechanical Dimensions of PLPS9 Figure 42 shows a 3D view1 of PLPS9 and provides an overview of the board's mechanical di-

mensions2. For further details see Figure 43. Length:

Width:

Height:

48mm 36mm 3mm Top view Bottom view Figure 42: PLPS9 top and bottom view 1. The coloring of the 3D view does not reflect the modules real color. 2. Note: The holes in the shielding (top view) are significantly smaller than the radiated wavelength from the module. Gemalto guarantees that there will be no emissions outside the limits from these. The RF circuitry of the module is fully shielded. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.1 Mechanical Dimensions of PLPS9 109

Page 100 of 125

Figure 43: Dimensions of PLPS9 (all dimensions in mm) PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.2 Mounting PLPS9 onto the Application Platform 109 Page 101 of 125 5.2 Mounting PLPS9 onto the Application Platform This section describes how to mount PLPS9 onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [3]. Note: Gemalto strongly recommends to solder all connecting pads for mechanical stability and heat dissipation. Not only must all supply pads and signals be connected appropriately, but all pads denoted as Do not use should also be soldered (but not electrically connected). Note also that in order to avoid short circuits between signal tracks on an external application's PCB and various markings at the bottom side of the module, it is recommended not to route the sig-

nal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist. 5.2.1 SMT PCB Assembly 5.2.1.1 Land Pattern and Stencil The land pattern and stencil design as shown below is based on Gemalto M2M characteriza-

tions for lead-free solder paste on a four-layer test PCB and a 110 micron-thick stencil. The land pattern given in Figure 44 reflects the modules pad layout, including signal pads and ground pads (for pad assignment see Section 2.1.1). Besides these pads there are ground areas on the module's bottom side that must not be soldered, e.g., the position marker. To prevent short circuits, it has to be ensured that there are no wires on the external application side that may connect to these module ground areas.

Figure 44: Land pattern (top layer) PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.2 Mounting PLPS9 onto the Application Platform 109 Page 102 of 125 The stencil design illustrated in Figure 45 is recommended by Gemalto M2M as a result of ex-

tensive tests with Gemalto M2M Daisy Chain modules.

Figure 45: Recommended design for 110 micron thick stencil (top layer) 5.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT pro-

cess. It is recommended to characterize land patterns before an actual PCB production, taking indi-

vidual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 5.2.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-

der voids, and to increase board level reliability. Daisy chain modules for SMT characterization are available on request. For details refer to [3]. Generally, solder paste manufacturer recommendations for screen printing process parame-

ters and reflow profile conditions should be followed. Maximum ratings are described in Section 5.2.3. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.2 Mounting PLPS9 onto the Application Platform 109 5.2.2 Moisture Sensitivity Level Page 103 of 125 PLPS9 comprises components that are susceptible to damage induced by absorbed moisture. Gemalto M2Ms PLPS9 module complies with the latest revision of the IPC/JEDEC J-STD-020 Standard for moisture sensitive surface mount devices and is classified as MSL 4. For additional moisture sensitivity level (MSL) related information see Section 5.2.4. 5.2.3 Soldering Conditions and Temperature 5.2.3.1 Reflow Profile Figure 46: Reflow Profile PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.2 Mounting PLPS9 onto the Application Platform 109 Page 104 of 125 Table 29: Reflow temperature recommendations1 Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) Average ramp up rate (TL to TP) Liquidous temperature (TL) Time at liquidous (tL) 150C 200C 60-120 seconds 3K/second max. 2 217C 60-90 seconds 245C +0/-5C 30 seconds max. Peak package body temperature (TP) Time (tP) within 5 C of the peak package body temperature (TP) Average ramp-down rate

- Limited ramp-down rate between 225C and 200C 6K/second max.2 3K/second max.2 Time 25C to maximum temperature 8 minutes max. 1. Please note that the listed reflow profile features and ratings are based on the joint industry standard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more information on re-

flow profiles and their optimization please refer to [3]. 2. Temperatures measured on shielding at each corner. See also [3]. Module 1 3 2 4 Temperature sensors (1-4) 5.2.3.2 Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module:

A maximum module temperature of 245C. This specifies the temperature as measured at the modules top side. A maximum duration of 30 seconds at this temperature. Ramp-down rate from TP to 200C should be controlled in order to reduce thermally induced stress during the solder solidification phase (see Table 29 - limited ramp-down rate). There-

fore, a cool-down step in the ovens temperature program between 200C and 180C should be considered. For more information on reflow profiles and their optimization see [3]. Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded. PLPS9 is specified for one soldering cycle only. Once PLPS9 is removed from the application, the module will very likely be destroyed and cannot be soldered onto another application. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.2 Mounting PLPS9 onto the Application Platform 109 5.2.4 Durability and Mechanical Handling 5.2.4.1 Storage Conditions Page 105 of 125 PLPS9 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. Table 30: Storage conditions Type Ait temperature:

Low High

-25

+40 Condition Unit Reference C IPC/JEDEC J-STD-033A Humidity relative: Low High 10 90 at 40C

IPC/JEDEC J-STD-033A Air pressure:

Low High 70 106 kPa IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4 Water: rain, dripping, icing and frosting Not allowed

Radiation:

Solar Heat 1120 600 W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb Chemically active substances Not recom-

IEC TR 60271-3-1: 1C1L Mechanically active sub-

stances Vibration sinusoidal:

Displacement Acceleration Frequency range Shocks:

Shock spectrum Duration Acceleration mended Not recom-

mended 1.5 5 2-9 9-200 mm m/s2 Hz Semi-sinusoidal 1 50 ms m/s2 IEC TR 60271-3-1: 1S1 IEC TR 60271-3-1: 1M2 IEC 60068-2-27 Ea 5.2.4.2 Processing Life PLPS9 must be soldered to an application within 72 hours after opening the moisture barrier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30C and a relative humidity below 60%. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.2 Mounting PLPS9 onto the Application Platform 109 Page 106 of 125 5.2.4.3 Baking Baking conditions are specified on the moisture sensitivity label attached to each MBB:

It is not necessary to bake PLPS9, if the conditions specified in Section 5.2.4.1 and Section 5.2.4.2 were not exceeded. It is necessary to bake PLPS9, if any condition specified in Section 5.2.4.1 and Section 5.2.4.2 was exceeded. If baking is necessary, the modules must be put into trays that can be baked to at least 125C. Devices should not be baked in tape and reel carriers at any temperature. 5.2.4.4 Electrostatic Discharge Electrostatic discharge (ESD) may lead to irreversible damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites. Please refer to Section 4.6 for further information on electrostatic discharge. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.3 Packaging 109 Page 107 of 125 5.3 Packaging 5.3.1 Trays PLPS9 is shipped in 6x3 trays as illustrated in Figure 47. The figure also shows the proper module orientation in the trays: The small round hole marking pad A1 is furthest away from the beveled corner of the tray. Figure 47: Shipping tray dimensions 5.3.2 Shipping Materials The shipping trays are normally stacked as units of 10 trays plus one extra as a cover, and se-

cured with packaging tape. All trays have the beveled corner aligned in the same orientation. A stacking unit (10 x 18 modules = 180 modules) together with a foam protection makes up the content of a moisture barrier bag (MBB). 5.3.2.1 Moisture Barrier Bag The foam protected stacking units are stored inside of a MBB, together with a humidity indicator card and desiccant pouches. The bag is ESD protected and delimits moisture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag pro-

tects the PLPS9 modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. The label shown in Figure 48 summarizes requirements regarding moisture sensitivity, includ-

ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.3 Packaging 109 Page 108 of 125 Figure 48: Moisture Sensitivity Label PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 5.3 Packaging 109 Page 109 of 125 MBBs contains two desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-

proximate relative humidity level within the bag. A sample humidity card is shown in Figure 49. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked. Figure 49: Humidity Indicator Card - HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. 5.3.2.2 Transportation Boxes Stacked tray units are distributed in over boxes, so-called VP boxes, containing up to two MBBs. Thus, a VP box may contain up to 360 (180x2) modules. The VP boxes in turn may be placed in master boxes for up to two layers with six VP boxes. Thus, a master box packaging unit may contain up to 4320 (180x2x12) modules. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 6 Regulatory and Type Approval Information 117 Page 110 of 125 6 Regulatory and Type Approval Information 6.1 Directives and Standards PLPS9 has been designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "PLPS9 Hardware Interface Description".1 Table 31: Directives 2014/53/EU 2002/95/EC (RoHS 1) 2011/65/EU (RoHS 2) 2015/863/EU (RoHS 3) Directive of the European Parliament and of the council of 16 April 2014 on the harmonization of the laws of the Member States relating to the making available on the market of radio equipment and repealing Directive 1999/

05/EC. The product is labeled with the CE conformity mark. Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain haz-

ardous substances in electrical and electronic equipment

(RoHS). Revised on 8 June 2011. Further revision on 31 March 2015 - amending Annex II to Directive 2011/65/EU of the European Parliament and of the Council as regards the list of restricted substances. Table 32: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22, Part 24, Part 27, and Part 90; US Equipment Authorization FCC OET Bulletin 65

(Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields UL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V5.40 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132, RSS133, RSS139 Canadian Standard Table 33: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station

(MS) conformance specification;

ETSI EN 301 511 V12.5.1 Global System for Mobile communications (GSM); Mobile Stations (MS) equipment; Harmonized Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU GCF-CC V3.74 Global Certification Forum - Certification Criteria 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 6.1 Directives and Standards 117 Table 33: Standards of European type approval Page 111 of 125 ETSI EN 301 489-01 V2.1.1 Draft ETSI EN 301 489-19 V2.1.0 Draft ETSI EN 301 489-52 V1.1.0 Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common technical requirements; Harmonized Standard cov-

ering the essential requirements of article 3.1(b) of Directive 2014/53/EU and the essential requirements of article 6 of Directive 2014/30/EU Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 19: Specific conditions for Receive Only Mobile Earth Stations

(ROMES) operating in the 1,5 GHz band providing data communications and GNSS receivers operating in the RNSS band (ROGNSS) providing positioning, navigation, and timing data; Harmonized Standard covering the essential requirements of article 3.1(b) of Directive 2014/53/EU Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 52: Specific conditions for Cellular Communication Mobile and portable (UE) radio and ancillary equipment; Harmonized Standard cover-

ing the essential requirements of article 3.1(b) of Directive 2014/53/EU ETSI EN 301 908-01 V11.1.1 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and common requirements ETSI EN 301 908-02 V11.1.2 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 2: CDMA Direct Spread (UTRA FDD) User Equipment (UE) ETSI EN 301 908-13 V11.1.2 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 13: Evolved Universal Terrestrial Radio Access (E-UTRA) User Equipment (UE) EN 60950-1:2006/

A11:2009+A1:2010+A1 2:2011+A2:2013 Safety of information technology equipment Table 34: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 6.1 Directives and Standards 117 Page 112 of 125 Table 35: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 SJ/T 11364-2006 Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products

(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Hardware Interface Description. Please see Table 36 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 36: Toxic or hazardous substances or elements with defined concentration limits PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 6.2 SAR requirements specific to portable mobiles 117 Page 113 of 125 6.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable PLPS9 based applications to be eval-

uated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US and European markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagnetic fields (EMFs) from mobile telecommunication equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 EN 62311:2008 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz - 300 GHz) IMPORTANT:

Manufacturers of portable applications based on PLPS9 modules are required to have their fi-

nal product certified and apply for their own FCC Grant and ISED Certificate related to the spe-

cific portable mobile. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 6.3 Reference Equipment for Type Approval 117 Page 114 of 125 6.3 Reference Equipment for Type Approval The Gemalto M2M general reference setup submitted to type approve PLPS9 is shown in the figure below: Figure 50 illustrates the setup for general tests and evaluation purposes. The evaluation module can be plugged directly onto an Audio Adapter. The GSM/UMTS/LTE/

GNSS test equipment is still connected via SMA connectors on the evaluation module. The PC is connected via USB interface on the evaluation module, and the audio test equipment via au-

dio jack on the Audio Adapter. TRX 1 TRX 2 PLPS 9 r o t i c a p a C k n a B S S N G R X 3 RX4 i o d u A A udio T e ste quipm e nt 0

. 0 / 3

. 2 B S U PC T e ste quipm e nt 4 .0 V Pow e r Supply G N SS T e ste quipm e nt G SM /W CD M A /LT E T e ste quipm e nt Figure 50: Reference equipment for type approval Please note that for EMC and RF performance tests, slightly different reference equipment con-

figurations are used. If necessary, please contact Gemalto for further details. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 6.4 Compliance with FCC and ISED Rules and Regulations 117 Page 115 of 125 6.4 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M modules reference application described in Section 6.3 will be registered under the following identifiers:

PLPS9-W:

FCC Identifier QIPPLPS9-W Granted to Gemalto M2M GmbH PLPS9-X:

FCC Identifier QIPPLPS9-X ISED Certification Number: 7830A-PLPS9X Granted to Gemalto M2M GmbH Note1: Manufacturers of mobile or fixed devices incorporating PLPS9-W/-X modules are autho-

rized to use the FCC Grants and ISED Certificates of the PLPS9-W/-X modules for their own final products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPPLPS9-W" or "Contains FCC ID: QIPPLPS9-X", and accordingly Contains IC: 7830A-PLPS9X. The integration is limited to fixed or mobile categorized host de-

vices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 37 and Table 38 for FCC and/or ISED. Table 37: Antenna gain limits for FCC for PLPS9-W Maximum gain in operating band FCC limit 850MHz (GSM) 1900MHZ (GSM) Band V (UMTS) Band 5 (LTE-FDD) Band 7 (LTE-FDD) CA_7C (LTE-FDD) Band 26 (LTE-FDD) 3.4 2.6 8.5 9.4 6.3 4.3 9.8 Unit dBi dBi dBi dBi dBi dBi dBi 1. Label note in French for ISED: Les fabricants d'quipement mobile ou fixe intgrant le module PLPS9-

W/-X sont autoriss utiliser les accords FCC et certificats d'Innovation, Sciences et Dveloppement conomique Canada (ISED) du module PLPS9-W/-X pour leur propre produit final suivant les conditions rfrences dans ces documents. Dans ce cas, le label FCC du module doit tre visible de l'extrieur, sinon l'quipement hte doit disposer d'un second label avec la dclaration suivante " Contains FCC ID

: QIPALPLPS9-W ", ou " Contains FCC ID : QIPPLPS9-X " et en consquence " Contains IC : 7830A-

PLPS9X ". L'intgration est limite aux catgories d'quipement hte mobile ou fixe, respectant une dis-

tance minimum de 20 centimtres entre l'antenne et toute personne avoisinante pour des conditions d'utilisation normale. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 6.4 Compliance with FCC and ISED Rules and Regulations 117 Page 116 of 125 Table 38: Antenna gain limits for FCC and ISED for PLPS9-X Maximum gain in operating band FCC limit ISED limit All limits Unit 850MHz (GSM) 1900MHZ (GSM) Band II (UMTS) Band IV (UMTS) Band V (UMTS) Band 2 (LTE-FDD) Band 4 (LTE-FDD) Band 5 (LTE-FDD) CA_5A_7A Pcc (LTE-FDD) CA_5A_7A Scc (LTE-FDD) Band 7 (LTE-FDD) CA_7C (LTE-FDD) Band 12 (LTE-FDD) Band 13 (LTE-FDD) Band 66(LTE-FDD) 3.4 2.0 7.5 4.7 8.4 9.1 6.5 9.4 8.7 7.4 6.5 4.3 8.7 9.2 6.4 0.1 2.5 7.5 7.3 5.1 8.5 8.3 6.1 5.4 8.5 8.7 5.6 5.9 8.3 11.8 0.1 2.0 7.5 4.7 5.1 8.5 6.5 6.1 5.4 7.4 6.5 4.3 5.6 5.9 6.4 dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi IMPORTANT:

Manufacturers of portable applications incorporating PLPS9-W/-X modules are required to have their final product certified and apply for their own FCC Grant and/or ISED Certificate re-

lated to the specific portable mobile. This is mandatory to meet the SAR requirements for por-

table mobiles (see Section 6.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with ISED license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interfer-

ence to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or televi-

sion reception, which can be determined by turning the equipment off and on, the user is en-

couraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver Increase the separation between the equipment and receiver. is connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 6.4 Compliance with FCC and ISED Rules and Regulations 117 Page 117 of 125 If Canadian approval is requested for devices incorporating PLPS9 modules the above note will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not con-

tain any information on how to install or remove the module from the final product. Notes (ISED):

(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-GEN. Opera-

tion is subject to the following two conditions: (1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device.

(FR) Cet appareil numrique de classe B est conforme aux normes canadiennes ICES-003 et RSS-GEN. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interfrence et (2) cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement.

(EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Innovation, Science and Eco-

nomic Development Canada (ISED) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal op-

eration is minimized. This device has also been evaluated and shown compliant with the ISED RF Exposure limits under mobile exposure conditions. (antennas are greater than 20cm from a persons body).

(FR) Informations concernant l'exposltion aux frquences radio (RF) La puissance de sortie mise par l'appareil de sans fiI est infrieure la limite d'exposition aux frquences radio dInnovation, Sciences et Dveloppement conomique Canada (ISDE). Utili-

sez l'appareil de sans fil de faon minimiser les contacts humains lors du fonctionnement nor-

mal. Ce priphrique a galement t valu et dmontr conforme aux limites d'exposition aux RF d'ISDE dans des conditions d'exposition des appareils mobiles (les antennes se situent moins de 20cm du corps d'une personne). PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Page 118 of 125 Cinterion PLPS9 Hardware Interface Description 7 Document Information 122 7 Document Information 7.1 Revision History Preceding document: "Cinterion PLPS9 Hardware Interface Description" v00.052 New document: "Cinterion PLPS9 Hardware Interface Description" v00.052a Chapter What is new 4.2.2 6.1 Revised signal states for GPIO11 and GPIO19. Updated NAPRD and GCF standard versions in Table 32 and Table 33. New document: "Cinterion PLPS9 Hardware Interface Description" v00.052 Chapter What is new

Initial document setup. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 7.2 Related Documents 122 Page 119 of 125 7.2 Related Documents

[1] PLPS9 AT Command Set

[2] PLPS9 Release Note

[3] Application Note 48: SMT Module Integration

[4] Universal Serial Bus Specification Revision 3.0

[5] Universal Serial Bus Specification Revision 2.0 7.3 Terms and Abbreviations Abbreviation Description American National Standards Institute Antenna Reference Point Carrier Aggregation Conformit Europene (European Conformity) Coding Scheme Circuit Switched Circuit Switched Data Download Do not use Discontinuous Reception Development Support Board Discontinuous Transmission Enhanced Data rates for GSM Evolution Extended GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard European Telecommunications Standards Institute Federal Communications Commission (U.S.) Frequency Division Duplex General Packet Radio Service Global Standard for Mobile Communications High Impedance Input/Output High Speed Downlink Packet Access International Mobile Equipment Identity Innovation, Science and Economic Development Canada ANSI ARP CA CE CS CS CSD DL dnu DRX DSB DTX EDGE EGSM EMC ESD ETS ETSI FCC FDD GPRS GSM HiZ HSDPA I/O IMEI ISED PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 7.3 Terms and Abbreviations 122 Page 120 of 125 Abbreviation Description International Standards Organization International Telecommunications Union ISO ITU kbps LED LGA LTE MBB Mbps MCS MFBI MIMO MLCC eMMC MO MS MSL MT nc NTC PCB PCIe PCL PCS PD PDU PS PSK PU QAM RF rfu ROPR RTC Rx SAR kbits per second Light Emitting Diode Land Grid Array Long term evolution Moisture barrier bag Mbits per second Modulation and Coding Scheme Multiple Frequency Band Indicator Multiple Input Multiple Output Multi Layer Ceramic Capacitor Embedded MultiMediaCard Mobile Originated Mobile Station, also referred to as TE Moisture Sensitivity Level Mobile Terminated Not connected Negative Temperature Coefficient Printed Circuit Board Pull Down resistor Protocol Data Unit Packet Switched Phase Shift Keying Pull Up resistor Radio Frequency Reserved for future use Radio Output Power Reduction Real Time Clock Receive Direction Specific Absorption Rate Peripheral Component Interconnect Express Power Control Level Personal Communication System, also referred to as GSM 1900 Quadrature Amplitude Modulation R&TTE Radio and Telecommunication Terminal Equipment PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 7.3 Terms and Abbreviations 122 Page 121 of 125 Abbreviation Description SELV SIM SMD SMS SMT SRAM SRB TE TPC TS Tx UL UMTS URC USB UICC USIM Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Static Random Access Memory Signalling Radio Bearer Terminal Equipment Transmit Power Control Technical Specification Transmit Direction Upload Unsolicited Result Code Universal Serial Bus USIM Integrated Circuit Card Universal Mobile Telecommunications System UMTS Subscriber Identification Module WCDMA Wideband Code Division Multiple Access PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 7.4 Safety Precaution Notes 122 7.4 Safety Precaution Notes Page 122 of 125 The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLPS9. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-

ure to comply with these precautions violates safety standards of design, manufacture and in-

tended use of the product. Gemalto M2M assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 8 Appendix 124 Page 123 of 125 8 Appendix 8.1 List of Parts and Accessories Table 39: List of parts and accessories Description PLPS9 Supplier Ordering information Gemalto M2M Standard module Gemalto M2M IMEI:

Packaging unit (ordering) number:

L30960-N5060-A100 (PLPS9-W) L30960-N5070-A100 (PLPS9-X) Module label number:

S30960-S5060-A100-11 (PLPS9-W) S30960-S5070-A100-11 (PLPS9-X) L30960-N5061-A100 (PLPS9-W) L30960-N5071-A100 (PLPS9-X) PLPS9 Evaluation module Gemalto M2M Ordering number:

Audio Adapter for PLPS9 Evaluation modules Votronic Handset Gemalto M2M On request. VOTRONIC /

Gemalto M2M Votronic ordering number: HH-SI-30.3/V1.1/0 Votronic Entwicklungs- und Produktionsgesellschaft fr elek-

tronische Gerte mbH Saarbrcker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 Email: contact@votronic.com Ordering numbers: 91228 91236 Sales contacts are listed in Table 40. Sales contacts are listed in Table 40 and Table 41. SIM card holder incl. push button ejector and slide-in tray U.FL antenna connector Molex Molex or Hirose 1. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 Cinterion PLPS9 Hardware Interface Description 8.1 List of Parts and Accessories 124 Page 124 of 125 Table 40: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 Table 41: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click:

http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217 Hirose Electric Europe B.V. UK Branch:

First Floor, St. Andrews House, Caldecotte Lake Business Park, Milton Keynes MK7 8LE Great Britain Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Hirose Electric Europe B.V. German Branch:

Herzog-Carl-Strasse 4 73760 Ostfildern Germany Phone: +49-711-456002-1 Fax: +49-711-456002-299 Email: info@hirose.de Hirose Electric Europe B.V. Hogehillweg 8 1101 CC Amsterdam Z-O Netherlands Phone: +44-1908-369060 Fax: +44-1908-369078 Phone: +81-03-3491-9741 Fax: +81-03-3493-2933 Phone: +31-20-6557-460 Fax: +31-20-6557-469 PLPS9_HID_v00.052a Confidential / Preliminary 2019-07-25 About Gemalto Since 1996, Gemalto has been pioneering groundbreaking M2M and IoT products that keep our customers on the leading edge of innovation. We work closely with global mobile network operators to ensure that Cinterion modules evolve in sync with wireless networks, providing a seamless migration path to protect your IoT technology investment. Cinterion products integrate seamlessly with Gemalto identity modules, security solutions and licensing and monetization solutions, to streamline development timelines and provide cost efficiencies that improve the bottom line. As an experienced software provider, we help customers manage connectivity, security and quality of service for the long lifecycle of IoT solutions. For more information please visit www.gemalto.com/m2m, www.facebook.com/gemalto, or Follow@gemaltoIoT on Twitter. 125 Gemalto M2M GmbH Werinherstrasse 81 81541 Munich Germany GEMALTO.COM/M2M

. s e i r t n u o c i n a t r e c n i i d e r e t s g e r e r a d n a o t l a m e G f o s k r a m e c v r e s i d n a s k r a m e d a r t e r a

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PLPS9-W - Label Information FCC ID: QIPPLPS9-W

 

 

gerflaltO To whom it may concern THALES Name Department Axel Heike System Test - Certifications Phone Fax E-Mail

+49 30 31102-8146

+49 30 31102-8305 axel heikethalesgrouicom Your letter of Our reference Date O3June2Ol9 Authorization Letter for FCC certification The company 7layers GmbH has been contracted by Gemalto M2M GmbH to obtain FCC certification for the following electronic component manufactured and/or released by Gemalto M2M GmbH:

Model:

FCCID: QIPPLPS9-W PLPS9-W The following person at 7Layers GmbH will be authorized:

- Andreas Tbel Unless future correspondence from Gemalto M2M GmbH directs otherwise, please extend your full cooperation to 7layers regarding matters to the above mentioned products for the period beginning 8t May 2019 through end of the project date. Thank you. Sincerely, iMAxel Heike Certification Manager

/

Lars Wehmeier Head of System Test wwwgemalto.com www.thalesgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Directors: Andreas Haegele, Sbastien Gallois Registered seat: Munich; commercial register Munich, reg.no.: HRB 172715, WEEE-Reg.-Nr. DE58893809

 

 

gerrlall:O Th! cman Telefication B.V., Dept. FCC TB Edisonstraat 1 2A 6902 PK ZEVENAAR The Netherlands THALES Name Department Axel Heike System Test - Certifications Phone Fax E-Mail

+49 30 31102-8146

+49 30 31102-8305 axel. heikethalesqroup.com Your letter of Our reference Date O3June2Ol9 Ref: Confidentiality request for FCC ID: QIPPLPS9-W To whom it may concern:

Pursuant to 0.457(d)(1)(ii) and 0.459 of the Commssions Rules (47 C.F.R.) and 552 (b)(4) of the Freedom of Information Act, Gemalto M2M GmbH hereby request requests that a part of the subject FCC application be held confidential to avoid release of sensitive Information of the producttothe public. For the product stated above, we request that the following information be withheld from public disclose:

Permanent Type of Confidentiality Reguested El Short Term Short Term Short Term El Short Term EI Short Term Short Term El Short Term Short Term Short Term Permanent Permanent Permanent Permanent Exhibit Block Diagrams External Photos Internal Photos Operation Description Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual Permanent Confidentiality:

The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to us and provide unjustified benefits to our competitors. Short-Term Confidentiality:

We hereby request short-term confidentiality for the product stated above to avoid premature release of sensitive information prior to marketing or release of the product to the public. www.gemalto.com www.thalesgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Directors: Andreas Haegele, Sbastien Gallois Registered seat: Munich: commercial register Munich. reg.no.: HRB 172715, WEEE-Reg.-Nr. DE58893809 gemalto a Thales company THALES Release date of short term confidentiality is:

45 days from grant date marked D 90 days from grant date marked D 135 days from grant date marked D 180 days from grant date marked Specific date:

We are also aware that we are responsible to notify Telefication in the event information regarding the product or the product is made available to the public. Telefication will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1 705. Sincerely, Axel Heike Certification Manager Lars Wehmeier Head of System Test www.gemalto.com www.thalesgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Direciors: Andreas Haegele, Sbastien Gallois Registered seat: Munich; commercial register Munich, reg.no: HRB 172715, WEEE-Reg.-Nr. DE58893809

 

 

gemail:o les company Telefication B.V., Dept. FCC TB Edisonstraat 1 2A 6902 PK ZEVENAAR The Netherlands THALES Name Department Axel Heike System Test - Certifications Phone Fax E-Mail

+493031102-8146

+493031102-8305 axel. heikethaIesgrourj.com Your letter of Our reference Date O3June2Ol9 Ref: FCC Modular approval letter for FCC ID: QIPPLPS9-W To whom it may concern:

The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:

Modular approval requirement

(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(ii) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure thatthe module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(iii) The modular transmitter must have its own power supply regulation.

(iv) The modular transmitter must comply with the antenna and transmission system requirements of 1 5.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 1 5.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 1 5.207. AC or DC power lines and data inputloutput lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment Yes No*

X X X X wwwgemaIto.com www.thalesgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Directors: Andreas Haegele, S8bastien Gallois Registered seat: Munich; commercial register Munich, reg.no.: HRB 172715, WEEE-Reg.-Nr. DE58893809 gemalto*

Thaes company THALES connected to the module during testing shall be unmodified and commercially available (see 15.31(i)).

(vi) The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(vii) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RE exposure requirements in its final configuration.

* ShaII provide a detailed explanation if the answer is No. X If you have any questions, please feel free to contact us at the address shown above. Sincerely, Certification M Lars Wehmeier Head of System Test wwwgemaltocom www.thalesgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Directors: Andreas Haegele, Sbastien Gallois Registered seat: Munich; commercial register Munich, regno.: HRB 172715, WEEE-Reg.-Nr. D858893809

 

 

gemaIt6 a Thales company THALES Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Subject: Change in ID Request FCC Certification Number: QIPALAS66A-W Name Department Axel Heike System Test - Certifications Phone Fax E-Mail

+493031102-8146

+493031102-8305 axel.heikethaIesgroup,com Your letter of Our reference Date 29 JuIy 2019 TO WHOM lT MAY CONCERN We hereby request a Change in ID in accordance to CFR 47 Part 2.933 of the FCC. The original identification of the equipment for which we seek a change in ID is FCC ID: QIPALAS66A-W granted on 07/17/2019 and The new ID is:

FCC ID: QIPPLPS9-W There are no changes in design, circuitry or construction. Therefore all data of original grant on file remain applicable to the equipment bearing the changed identification. Best Regards, Gemalto M2M GmbH Axel Heike Certification Mana Lars Wehmeier Head of System Test wwwqemalto.corn www.thalesgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Directors: Andreas Haegete, Sbastien Gallois Registered seat: Munich; commercial register Munich, reg.no.: HRB 172715, WEEE-Reg.-Nr. DE58893809