FCC ID: QIPHC25 GSM/GPRS/EDGE/UMTS/HSDPA Module

s i w e v r e v O e c a f r e n t HC25 Siemens Cellular Engine Version:

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00.220 HC25_HO_v00.220 I e r a w d r a H HC25 Hardware Interface Overview 2 s Document Name:

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HC25 Hardware Interface Overview 00.220 2007-03-20 HC25_HO_v00.220 Confidential / Preliminary Status:

Supported Products: HC25 General Notes Product is deemed accepted by Recipient and is provided without interface to Recipients products. The Product constitutes pre-release version and code and may be changed substantially before commercial release. The Product is provided on an as is basis only and may contain deficiencies or inadequacies. The Product is provided without warranty of any kind, express or implied. To the maximum extent per-

mitted by applicable law, Siemens further disclaims all warranties, including without limitation any implied warranties of merchantability, fitness for a particular purpose and noninfringement of third-party rights. The entire risk arising out of the use or performance of the Product and documentation remains with Recipient. This Product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Applications incor-

porating the described product must be designed to be in accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required procedures can result in malfunc-

tions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also apply to cellular phones must be followed. Sie-

mens AG customers using or selling this product for use in any applications do so at their own risk and agree to fully indemnify Siemens for any damages resulting from illegal use or resale. To the maximum extent permitted by applicable law, in no event shall Siemens or its suppliers be liable for any conse-

quential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation, damages for loss of business profits, business interruption, loss of business information or data, or other pecuniary loss) arising out the use of or inability to use the Product, even if Siemens has been advised of the possibility of such damages. Subject to change without notice at any time. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-

tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright Siemens AG 2007 HC25_HO_v00.220 Confidential / Preliminary Page 2 of 39 2007-03-20 HC25 Hardware Interface Overview Contents 39 Contents s 1 2 3 4 5 6 7 8 Introduction ................................................................................................................. 6 Related Documents ........................................................................................... 6 1.1 Terms and Abbreviations ................................................................................... 6 1.2 1.3 Regulatory and Type Approval Information ....................................................... 9 1.3.1 Directives and Standards...................................................................... 9 SAR requirements specific to portable mobiles ............................................... 11 1.4.1 SELV Requirements ........................................................................... 11 Safety Precautions........................................................................................... 12 1.5 1.4 Product Concept ....................................................................................................... 13 2.1 Key Features at a Glance ................................................................................ 13 Application Interface................................................................................................. 16 3.1 Operating Modes ............................................................................................. 16 Antenna Interface...................................................................................................... 17 Antenna Installation ......................................................................................... 17 4.1 Antenna Pad .................................................................................................... 18 4.2 4.3 Antenna Connector .......................................................................................... 19 Electrical, Reliability and Radio Characteristics.................................................... 23 5.1 Absolute Maximum Ratings ............................................................................. 23 Operating Temperatures.................................................................................. 24 5.2 Storage Conditions .......................................................................................... 25 5.3 5.4 Reliability Characteristics................................................................................. 26 Mechanics.................................................................................................................. 27 Mechanical Dimensions of HC25..................................................................... 27 6.1 Mounting HC25 to the Application Platform ..................................................... 29 6.2 6.3 Board-to-Board Application Connector ............................................................ 29 Reference Approval .................................................................................................. 31 7.1 Reference Equipment for Type Approval......................................................... 31 Compliance with FCC Rules and Regulations ................................................. 32 7.2 Appendix.................................................................................................................... 33 8.1 List of Parts and Accessories........................................................................... 33 Fasteners and Fixings for Electronic Equipment ............................................. 35 8.2 8.2.1 Fasteners from German Supplier ETTINGER GmbH ......................... 35 Mounting Advice Sheet .................................................................................... 38 8.3 HC25_HO_v00.220 Confidential / Preliminary Page 3 of 39 2007-03-20 HC25 Hardware Interface Overview Tables 4 s Tables Table 1:

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Directives ......................................................................................................... 9 Standards of North American type approval .................................................... 9 Standards of European type approval.............................................................. 9 Requirements of quality ................................................................................. 10 Overview of operating modes ........................................................................ 16 Return loss in the active band........................................................................ 17 Product specifications of U.FL-R-SMT connector.......................................... 19 Material and finish of U.FL-R-SMT connector and recommended plugs ....... 20 Ordering information for Hirose U.FL Series.................................................. 22 Absolute maximum ratings............................................................................. 23 Board temperature ......................................................................................... 24 Sample operating conditions without forced air circulation

(according to IEC 60068-2)............................................................................ 24 Sample operating conditions with forced air circulation (air speed 0.9m/s) ... 24 Storage conditions ......................................................................................... 25 Summary of reliability test conditions............................................................. 26 Electrical and mechanical characteristics of the board-to-board connector... 29 List of parts and accessories.......................................................................... 33 Molex sales contacts (subject to change) ...................................................... 34 Hirose sales contacts (subject to change) ..................................................... 34 HC25_HO_v00.220 Confidential / Preliminary Page 4 of 39 2007-03-20 HC25 Hardware Interface Overview Figures 5 s Figures Figure 1:

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Restricted area around antenna pad (side and bottom view) ......................... 18 Mechanical dimensions of U.FL-R-SMT connector......................................... 19 U.FL-R-SMT connector with U.FL-LP-040 plug .............................................. 20 U.FL-R-SMT connector with U.FL-LP-066 plug .............................................. 20 Specifications of U.FL-LP-(V)-040(01) plug .................................................... 21 HC25 Top and bottom view.......................................................................... 27 Dimensions of HC25 (all dimensions in mm) .................................................. 28 Mechanical dimensions of the board-to-board connector ............................... 30 Reference equipment for Type Approval ........................................................ 31 HC25_HO_v00.220 Confidential / Preliminary Page 5 of 39 2007-03-20 HC25 Hardware Interface Overview 1 Introduction 12 1 Introduction s This document describes the hardware of the Siemens HC25 module that connects to the cel-

lular device application and the air interface. It helps you quickly retrieve interface specifica-

tions, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.1 Related Documents

[1] HC25 AT Command Set 00.220

[2] HC25 Release Notes 00.220 1.2 Terms and Abbreviations Abbreviation ANSI AMR ARP B2B BB BEP BTS CB or CBM CE CS CS CSD DAC dBm0 DCS DL DRX DSB DSP DTMF DTX EDGE EFR EGSM Description American National Standards Institute Adaptive Multirate Antenna Reference Point Board-to-board connector Baseband Bit Error Probability Base Transceiver Station Cell Broadcast Message Conformit Europene (European Conformity) Coding Scheme Circuit Switched Circuit Switched Data Digital-to-Analog Converter Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Digital Cellular System Download Discontinuous Reception Development Support Board Digital Signal Processor Dual Tone Multi Frequency Discontinuous Transmission Enhanced Data rates for GSM Evolution Enhanced Full Rate Enhanced GSM HC25_HO_v00.220 Confidential / Preliminary Page 6 of 39 2007-03-20 HC25 Hardware Interface Overview 1.2 Terms and Abbreviations 12 s Abbreviation EMC ERP ESD ETS ETSI FCC FDD FDMA FR GPRS GSM HiZ HSDPA HR I/O IF IMEI ISO ITU kbps LED Mbps MCS MO MS MT NTC PBCCH PCB PCL PCM PCS PS PDU PSK R&TTE Description Electromagnetic Compatibility Effective Radiated Power Electrostatic Discharge European Telecommunication Standard European Telecommunications Standards Institute Federal Communications Commission (U.S.) Frequency Division Duplex Frequency Division Multiple Access Full Rate General Packet Radio Service Global Standard for Mobile Communications High Impedance High Speed Downlink Packed Access Half Rate Input/Output Intermediate Frequency International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Mbits per second Modulation and Coding Scheme Mobile Originated Mobile Station, also referred to as TE Mobile Terminated Negative Temperature Coefficient Packet Switched Broadcast Control Channel Printed Circuit Board Power Control Level Pulse Code Modulation Personal Communication System, also referred to as GSM 1900 Packet Switched Protocol Data Unit Phase Shift Keying Radio and Telecommunication Terminal Equipment HC25_HO_v00.220 Confidential / Preliminary Page 7 of 39 2007-03-20 HC25 Hardware Interface Overview 1.2 Terms and Abbreviations 12 s Abbreviation RACH RF RTC Rx SAR SELV SIM SLIC SMS SRAM SRB TA TDMA TE TS Tx UL UMTS URC USB UICC USIM WCDMA Description Random Access Channel Radio Frequency Real Time Clock Receive Direction Specific Absorption Rate Safety Extra Low Voltage Subscriber Identification Module Subscriber Line Interface Circuit Short Message Service Static Random Access Memory Signalling Radio Bearer Terminal adapter (e.g. GSM engine) Time Division Multiple Access Terminal Equipment Technical Specification Transmit Direction Upload Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus USIM Integrated Circuit Card UMTS Subscriber Identification Module Wideband Code Division Multiple Access HC25_HO_v00.220 Confidential / Preliminary Page 8 of 39 2007-03-20 HC25 Hardware Interface Overview 1.3 Regulatory and Type Approval Information 12 s 1.3 Regulatory and Type Approval Information 1.3.1 Directives and Standards HC25 has been designed to comply with the directives and standards listed below. Table 1: Directives 99/05/EC 2002/95/EC Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Direc-

tive 1999/5/EC). The product is labeled with the CE conformity mark Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equip-

ment (RoHS) Table 2: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCC Product Safety Certification (Safety requirements) UL 60 950 NAPRD.03 V3.9.1 RSS132, RSS133 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) Canadian Standard Table 3: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station

(MS) conformance specification GCF-CC V3.23.1 ETSI EN 301 489-1 V1.4.1 ETSI EN 301 511 V9.0.2 Candidate Harmonized European Standard (Telecommunications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essen-

tial requirements under article 3.2 of the R&TTE directive (1999/5/EC)

(GSM 13.11 version 7.0.1 Release 1998) Global Certification Forum - Certification Criteria Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-

tro Magnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common Technical Requirements Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-

tro Magnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems

(GSM and DCS) Safety of information technology equipment (2000) ETSI EN 301 489-7 V1.2.1 (2000-09) IEC/EN 60950-1 (2001) HC25_HO_v00.220 Confidential / Preliminary Page 9 of 39 2007-03-20 HC25 Hardware Interface Overview 1.3 Regulatory and Type Approval Information 12 s Table 3: Standards of European type approval EN 301 489-24 V1.2.1 EN 301 908-01 V2.2.1 EN 301 908-02 V2.2.1 3GPP TS 34.124 3GPP TS 34.121 3GPP TS 34.123-1 3GPP TS 34.123-3 Electromagnetic compatibility and Radio Spectrum Matters (ERM); Elec-

tromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread

(UTRA) for Mobile and portable (UE) radio and ancillary equipment Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 1: Harmonized EN for IMT-2000, introduction and common requirements of article 3.2 of the R&TTE Directive Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Technical Specification Group Radio Access Network; Terminal conform-

ance specification; Radio transmission and reception (FDD) User Equipment (UE) conformance specification; Part 1: Protocol con-

formance specification. User Equipment (UE) conformance specification; Part 3: Abstract Test Suites. Table 4: Requirements of quality IEC 60068 DIN EN 60529 Environmental testing IP codes HC25_HO_v00.220 Confidential / Preliminary Page 10 of 39 2007-03-20 HC25 Hardware Interface Overview 1.4 SAR requirements specific to portable mobiles 12 s 1.4 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable HC25 based applications to be evalu-

ated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) IMPORTANT:

Manufacturers of portable applications based on HC25 modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. See also Section 7.2. 1.4.1 SELV Requirements The power supply connected to the HC25 module shall be in compliance with the SELV requirements defined in EN 60950-1. HC25_HO_v00.220 Confidential / Preliminary Page 11 of 39 2007-03-20 HC25 Hardware Interface Overview 1.5 Safety Precautions 12 1.5 Safety Precautions s The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating HC25. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-

ure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Siemens AG assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electri-

cal equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-

ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-

tion can constitute a safety hazard. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. HC25_HO_v00.220 Confidential / Preliminary Page 12 of 39 2007-03-20 HC25 Hardware Interface Overview 2 Product Concept 15 2 2.1 Product Concept Key Features at a Glance s Feature General Frequency bands GSM class Output power

(according to Release 99) Implementation UMTS/HSDPA: Triple band, 850//1900/2100MHz GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz Small MS Class 4 (+33dBm 2dB) for EGSM850 Class 4 (+33dBm 2dB) for EGSM900 Class 1 (+30dBm 2dB) for GSM1800 Class 1 (+30dBm 2dB) for GSM1900 Class E2 (+27dBm 3dB) for GSM 850 8-PSK Class E2 (+27dBm 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Power supply Physical 3.2V < VBATT+ < 4.2V Dimensions: 50mm x 34mm x 4.5mm Weight: approx. 10g RoHS All hardware components fully compliant with EU RoHS Directive HSDPA features 3GPP Release 5 3.6 Mbps, UL 384 kbps UE CAT. [1-6], 11, 12 supported Compressed mode (CM) supported according to 3GPP TS25.212 UMTS features Release 99, June 2004, W-

CDMA FDD standard PS data rate 384 kbps DL / 384 kbps UL CS data rate 64 kbps DL / 64 kbps UL HC25_HO_v00.220 Confidential / Preliminary Page 13 of 39 2007-03-20 HC25 Hardware Interface Overview 2.1 Key Features at a Glance 15 s Feature GSM / GPRS / EGPRS features Data transfer Implementation GPRS Multislot Class 10 Full PBCCH support Mobile Station Class B Coding Scheme 1 4 EGPRS Multislot Class 10 EDGE E2 power class for 8 PSK Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 BEP reporting SRB loopback and test mode B PBCCH support NACC, extended UL TBF Mobile Station Class B CSD V.110, RLP, non-transparent 1 phase/2 phase access procedures Link adaptation and IR 8-bit, 11-bit RACH 9.6 kbps SMS Fax Audio Point-to-point MT and MO Cell broadcast Text and PDU mode Group 3; Class 1 Audio speech codecs GSM: AMR, EFR, FR, HR 3GPP: AMR One ringing melody supported CEPT supervisory tones supported DTMF supported 6 audio modes: Approval, Router, Handset, Headset, Speakerphone and Transparent mode TTY support selecting a dedicated audio mode Download of audio parameters Gains and volumes can be controlled by AT commands Several additional ringing melodies CEPT and ANSI supervisory tones supported Software AT commands AT-Hayes GSM 07.05 and 07.07, Siemens AT commands for RIL compatibility (NDIS/RIL) MicrosoftTM compatibility SIM Application Toolkit Firmware update RIL / NDIS for Windows MobileTM SAT Class C Firmware update from host application over USB. HC25_HO_v00.220 Confidential / Preliminary Page 14 of 39 2007-03-20 HC25 Hardware Interface Overview 2.1 Key Features at a Glance 15 s Feature Interfaces USB Wakeup Control Status Audio UICC interface Antenna Module interface Power on/off, Reset Power on/off Reset Emergency off Evaluation kit DSB Implementation Supports a USB 2.0 Full Speed (12Mbit/s) device interface. Signal pin to wake up an inactive USB Host into an active state. Signal pins to indicate network connectivity status. 1 analog interface Supported chip cards: SIM / UICC 3V, 1.8V 50Ohms. External antenna can be connected via antenna connector or antenna pad (spring contact). 50-pin board-to-board connector Switch-on by hardware pin IGT Switch-off by hardware pin IGT Switch-off by AT command Orderly shutdown and reset by AT command Emergency off by hardware pin EMERG_OFF and restart with hardware pin IGT Emergency off by hardware pin EMERG_OFF DSB75 Evaluation Board designed to test and type approve Siemens cel-

lular engines and provide a sample configuration for application engineer-

ing. A special adapter is required to connect the module to the DSB75. HC25_HO_v00.220 Confidential / Preliminary Page 15 of 39 2007-03-20 HC25 Hardware Interface Overview 3 Application Interface 16 3 Application Interface s HC25 is equipped with a 50-pin board-to-board connector that connects to the external appli-

cation and incorporates several sub-interfaces: power supply, USB interface, UICC/SIM inter-

face, analog audio interface, as well as various status and control lines (see also Chapter 2). 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 5: Overview of operating modes Mode Normal operation Function GSM /

GPRS / UMTS /

HSDPA SLEEP GSM IDLE Power saving mode set automatically when no call is in progress and the USB connection is suspended by host or not present. Software is active. Once registered to the GSM network, paging with BTS is carried out in order to achieve synchrony with the GSM network. The repetition rate depends on the parameter BSPA_Multiframe. The module is ready to send and receive. Connection between two subscribers is in progress. Power consump-

tion depends on the GSM network coverage and several connection settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be mea-

sured in TALK_GSM mode: DTX off, FR and no frequency hopping, otherwise same as for IDLE measurements. Module is attached and ready for GPRS data transfer, but no data is currently sent or received. GPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). EGPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings). Module is attached and ready for UMTS / HSDPA data transfer, but no data is currently sent or received. UMTS data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. HSDPA data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. GSM TALK/

GSM DATA GPRS IDLE GPRS DATA EGPRS DATA UMTS /

HSDPA IDLE UMTS TALK/

UMTS DATA HSDPA DATA Power Down The internal power section is shut down. The SW on the module is not active. The interfaces are not accessible. HC25_HO_v00.220 Confidential / Preliminary Page 16 of 39 2007-03-20 HC25 Hardware Interface Overview 4 Antenna Interface 22 4 Antenna Interface s The RF interface has an impedance of 50. HC25 is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-

ated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the HC25 PCB and should be placed in the host application. Regarding the return loss HC25 provides the following values in the active band:

Table 6: Return loss in the active band State of module Receive Transmit Idle Return loss of module

> 8dB not applicable

< 5dB Recommended return loss of application

> 12dB

> 12dB not applicable The connection of the antenna or other equipment must be decoupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. Note: The antenna must be isolated for ESD protection (to withstand a voltage resistance up to 8kV air discharge). 4.1 Antenna Installation To suit the physical design of individual applications HC25 offers two alternative approaches to connecting the antenna:

Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on the top side of the PCB. See Section 4.3 for connector details. Antenna pad and grounding plane placed on the bottom side. See Section 4.2. The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Sie-

mens reference equipment submitted to type approve HC25. All RF data specified throughout this manual are related to the ARP. IMPORTANT: Both solutions can only be applied alternatively. This means, whenever an antenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if the antenna is connected to the pad, then the Hirose connector must be left empty. HC25_HO_v00.220 Confidential / Preliminary Page 17 of 39 2007-03-20 HC25 Hardware Interface Overview 4.2 Antenna Pad 22 s No matter which option you choose, ensure that the antenna pad does not come into contact with the holding device or any other components of the host application. It needs to be sur-

rounded by a restricted area filled with air, which must also be reserved 1.4mm in height. Figure 1: Restricted area around antenna pad (side and bottom view) 4.2 Antenna Pad The antenna can be attached via contact springs. If you decide to use the antenna pad take into account that the pad has not been intended as antenna reference point (ARP) for the Siemens HC25 type approval. The antenna pad is pro-

vided only as an alternative option which can be used, for example, if the recommended Hirose connection does not fit into your antenna design. Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a 50 connector is mandatory for type approval measurements. This requires GSM devices with an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable with adapter. HC25 material properties:

HC25 PCB: FR4 Antenna pad: Gold plated pad HC25_HO_v00.220 Confidential / Preliminary Page 18 of 39 2007-03-20 HC25 Hardware Interface Overview 4.3 Antenna Connector 22 4.3 Antenna Connector s HC25 uses an ultra-miniature SMT antenna connector supplied from Hirose Ltd. The product name is:

U.FL-R-SMT Figure 2: Mechanical dimensions of U.FL-R-SMT connector Table 7: Product specifications of U.FL-R-SMT connector Item Ratings Nominal impedance 50 Specification Conditions Operating temp:-40C to + 90C Operating humidity: max. 90%

DC to 3GHz Rated frequency Mechanical characteristics Female contact holding force Repetitive operation Contact resistance:

0.15N min Vibration Shock Center 25m Outside 15m No momentary disconnections of 1s;

No damage, cracks and looseness of parts No momentary disconnections of 1s. No damage, cracks and looseness of parts. Environmental characteristics Humidity resistance No damage, cracks and looseness of parts. Insulation resistance:

100M min. at high humidity 500M min. when dry Measured with a 0.475 pin gauge 30 cycles of insertion and disengage-

ment Frequency of 10 to 100Hz, single amplitude of 1.5mm, acceleration of 59m/s2, for 5 cycles in the direction of each of the 3 axes Acceleration of 735m/s2, 11ms duration for 6 cycles in the direction of each of the 3 axes Exposure to 40C, humidity of 95% for a total of 96 hours HC25_HO_v00.220 Confidential / Preliminary Page 19 of 39 2007-03-20 HC25 Hardware Interface Overview 4.3 Antenna Connector 22 s Table 7: Product specifications of U.FL-R-SMT connector Item Temperature cycle Specification No damage, cracks and looseness of parts. Contact resistance:

Center 25m Outside 15m No excessive corrosion Conditions Temperature: +40C 5 to 35C

+90C 5 to 35C Time: 30min within 5min 30min within 5min 48 hours continuous exposure to 5%

salt water Salt spray test Material Phosphor bronze Table 8: Material and finish of U.FL-R-SMT connector and recommended plugs Part Shell Male center contact Brass Female center con-

tact Insulator Finish Silver plating Gold plating Gold plating Phosphor bronze Plug: PBT Receptacle: LCP Black Beige Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown below and listed in Table 9. For latest product information please contact your Hirose dealer or visit the Hirose home page, for example http://www.hirose.com. Figure 3: U.FL-R-SMT connector with U.FL-LP-040 plug Figure 4: U.FL-R-SMT connector with U.FL-LP-066 plug HC25_HO_v00.220 Confidential / Preliminary Page 20 of 39 2007-03-20 HC25 Hardware Interface Overview 4.3 Antenna Connector 22 s In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as an extremely space saving solution. This plug is intended for use with extra fine cable (up to 0.81mm) and minimizes the mating height to 2mm. See Figure 5 which shows the Hirose datasheet. Figure 5: Specifications of U.FL-LP-(V)-040(01) plug HC25_HO_v00.220 Confidential / Preliminary Page 21 of 39 2007-03-20 HC25 Hardware Interface Overview 4.3 Antenna Connector 22 s Part number U.FL-R-SMT U.FL-LP-040 Table 9: Ordering information for Hirose U.FL Series Item Connector on HC25 Right-angle plug shell for 0.81mm cable Right-angle plug for 0.81mm cable Right-angle plug for 1.13mm cable Right-angle plug for 1.32mm cable Extraction jig U.FL-LP-068 U.FL-LP-066 E.FL-LP-N U.FL-LP(V)-040 (01) HRS number CL331-0471-0-10 CL331-0451-2 CL331-053-8-01 CL331-0452-5 CL331-0452-5 CL331-04441-9 HC25_HO_v00.220 Confidential / Preliminary Page 22 of 39 2007-03-20 HC25 Hardware Interface Overview 5 Electrical, Reliability and Radio Characteristics 26 s 5 5.1 Electrical, Reliability and Radio Characteristics Absolute Maximum Ratings The absolute maximum ratings stated in Table 10 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to HC25. Table 10: Absolute maximum ratings Parameter Supply voltage BATT+

Voltage at digital pins in POWER DOWN mode Voltage at digital pins in normal operation Voltage at analog pins in POWER DOWN mode Voltage at analog pins in normal operation Voltage at STATSUSx pins VUSB USB_DP, USB_DN PWR_IND VDDLP Min

-0.3

-0.3

-0.3

-0.3

-0.3

-0.5

-0.3

-0.3

-0.3

-0.3 Max 4.5 0.3 2.8 0.3 2.5 7.5 7.5 7.5 10 3.25 Unit V V V V V V V V V V HC25_HO_v00.220 Confidential / Preliminary Page 23 of 39 2007-03-20 HC25 Hardware Interface Overview 5.2 Operating Temperatures 26 5.2 Operating Temperatures s The values stated below are in compliance with GSM recommendation TS 51.010-01. Table 11: Board temperature Parameter Operating temperature range Automatic shutdown1 Temperature measured on HC25 board Min

-20 Typ

+25 Max

+85 Unit C

< -30

>+85 C 1. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may occur. The possible deviation is in the range of 3C at the overtemperature limit and 5C at the undertem-

perature limit. Table 11 shows the temperatures for automatic shutdown as measured by the on-board mea-

suring element NTC. The maximum allowable ambient temperature that causes the module to shut down depends on various conditions. The following tables Table 12 and Table 13 show sample lab environment conditions. Please be aware that the operating duration and the max-

imum ambient temperature will vary significantly for your application. Table 12: Sample operating conditions without forced air circulation (according to IEC 60068-2) Mode RF Power Voltage GSM, GPRS/EDGE Class 8 WCDMA WCDMA GRPS/EDGE Class10 WCDMA GSM, GPRS/EDGE Class 8 WCDMA WCDMA GRPS/EDGE Class 10 WCDMA Ambient Temperature

+65C

+55C

+65C

+65C

+65C

+60C

+70C

+65C

+60C Ambient Temperature

+75C VBATT+ < 3.8V Max. VBATT+ < 3.4V VBATT+ < 3.4V VBATT+ < 3.8V VBATT+ < 3.8V

< 10dBm

< 0dBm Max. Max. VBATT+ < 3.8V Max. VBATT+ < 3.4V VBATT+ < 3.4V VBATT+ < 3.8V VBATT+ < 3.4V

< 10dBm

< 0dBm Max. Max. Table 13: Sample operating conditions with forced air circulation (air speed 0.9m/s) Mode RF Power Voltage Operating Duration

< 2min

< 2min Operating Duration Note: Generally it is strongly recommended to implement additional measures to lead the heat out of the application, especially at maximum transmission power levels of WCDMA (24dBm), e.g. use of ground area for a heat sink or convection (see Section 6.1 for the ground area that may be used for a heat sink). HC25_HO_v00.220 Confidential / Preliminary Page 24 of 39 2007-03-20 HC25 Hardware Interface Overview 5.3 Storage Conditions 26 5.3 Storage Conditions s The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. Table 14: Storage conditions Type Air temperature: Low High Humidity relative: Low High Condens. Air pressure: Low High Movement of surrounding air Water: rain, dripping, icing and frosting Radiation:

Solar Heat Chemically active substances Mechanically active substances Vibration sinusoidal:

Displacement Acceleration Frequency range Shocks:

Shock spectrum Duration Acceleration Condition

-40

+85 10 90 at 30C 90-100 at 30C 70 106 1.0 Not allowed Unit C

kPa m/s

Reference ETS 300 019-2-1: T1.2, IEC 68-2-1 Ab ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb

ETS 300 019-2-1: T1.2, IEC 68-2-56 Cb ETS 300 019-2-1: T1.2, IEC 68-2-30 Db IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4

1120 600 Not recom-

mended Not recom-

mended 1.5 5 2-9 9-200 semi-sinusoidal 1 50 W/m2 ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb ETS 300 019-2-1: T1.2, IEC 68-2-2 Bb IEC TR 60271-3-1: 1C1L IEC TR 60271-3-1: 1S1 IEC TR 60271-3-1: 1M2 IEC 68-2-27 Ea mm m/s2 Hz ms m/s2 HC25_HO_v00.220 Confidential / Preliminary Page 25 of 39 2007-03-20 HC25 Hardware Interface Overview 5.4 Reliability Characteristics 26 5.4 Reliability Characteristics s The test conditions stated below are an extract of the complete test specifications. Table 15: Summary of reliability test conditions Type of test Vibration Conditions Frequency range: 10-20Hz; acceleration: 3.1mm amplitude Frequency range: 20-500Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes Standard DIN IEC 68-2-6 Shock half-sinus Dry heat Temperature change (shock) Damp heat cyclic Cold (constant exposure) Acceleration: 500g Shock duration: 1msec 1 shock per axis 6 positions ( x, y and z) Temperature: +70 2C Test duration: 16h Humidity in the test chamber: < 50%

Low temperature: -40C 2C High temperature: +85C 2C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100 High temperature: +55C 2C Low temperature: +25C 2C Humidity: 93% 3%

Number of repetitions: 6 Test duration: 12h + 12h Temperature: -40 2C Test duration: 16h DIN IEC 68-2-27 EN 60068-2-2 Bb ETS 300 019-2-7 DIN IEC 68-2-14 Na ETS 300 019-2-7 DIN IEC 68-2-30 Db ETS 300 019-2-5 DIN IEC 68-2-1 HC25_HO_v00.220 Confidential / Preliminary Page 26 of 39 2007-03-20 s HC25 Hardware Interface Overview 6 Mechanics 30 6 6.1 Mechanics Mechanical Dimensions of HC25 Length:50.00mm Width: 34.00mm Height:4.5mm RF Antenna Connector Ground Pin 1 Pin 25 Pin 50 Pin 26 Ground

(for Heat Sink) Ground Figure 6: HC25 Top and bottom view HC25_HO_v00.220 Confidential / Preliminary Page 27 of 39 2007-03-20 HC25 Hardware Interface Overview 6.1 Mechanical Dimensions of HC25 30 s Figure 7: Dimensions of HC25 (all dimensions in mm) HC25_HO_v00.220 Confidential / Preliminary Page 28 of 39 2007-03-20 HC25 Hardware Interface Overview 6.2 Mounting HC25 to the Application Platform 30 s 6.2 Mounting HC25 to the Application Platform There are many ways to properly install HC25 in the host device. An efficient approach is to mount the HC25 PCB to a frame, plate, rack or chassis. Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized to achieve better support. To help you find appropriate spacers a list of selected screws and dis-

tance sleeves for 3mm stacking height can be found in Section 8.2. When using the holes the screws can be inserted from top or bottom. For proper grounding it is strongly recommended to use the large ground plane on the bottom of board in addition to the five GND pins of the board-to-board connector. The ground plane may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape. Please take care that attached cooling elements do not touch the antenna pads on the mod-

ules bottom side, as this may lead a short-circuit. To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device (see also Section 8.3 with mounting advice sheet). 6.3 Board-to-Board Application Connector This section provides specifications for the 50-pin board-to-board (B2B) connector used to con-

nect HC25 to the host application. For the modules external interface the following connector series has been chosen:

Supplier: Hirose ( www.hirose.com ) Type:

Height:

DF12C (3.0)-50DS-0.5V (SlimStack Receptacle) 3.0 mm Table 16: Electrical and mechanical characteristics of the board-to-board connector Parameter Number of Contacts Quantity delivered Voltage Current Rating Resistance Dielectric Withstanding Voltage Operating Temperature Contact Material Insulator Material FFC/FPC Thickness Maximum connection cycles Cable Specification (50-way connector) 50 2000 Connectors per Tape & Reel 50V 0.4A max per contact 0.05 Ohm per contact 150V RMS AC for 1min

-40C...+85C phosphor bronze finish: solder plating PPS, deep brown / Polyamide, beige 0.3mm 0.05mm (0.012" 0.002") 20 (@ 50mOhm max) FFC (Flat Flexible Cable), max. length 150mm from SIM interface HC25_HO_v00.220 Confidential / Preliminary Page 29 of 39 2007-03-20 HC25 Hardware Interface Overview 6.3 Board-to-Board Application Connector 30 s A recommended corresponding board-to-board connector series for external applications is:

Supplier: Hirose ( www.hirose.com ) Type:

Height:

DF12x-50DP-0.5V (SlimStack Header) 3.0 5.0 mm For Hirose sales contacts see Chapter 8. Note: There is no inverse polarity protection for the board-to-board connector. It is therefore very important that the board-to-board connector is connected correctly to the host application, i.e., pin1 must be connected to pin1, pin2 to pin 2, etc. Pin assignments are listed in Section 5.5, pin locations are shown in Figure 6. Figure 8: Mechanical dimensions of the board-to-board connector HC25_HO_v00.220 Confidential / Preliminary Page 30 of 39 2007-03-20 HC25 Hardware Interface Overview 7 Reference Approval 32 s 7 7.1 Reference Approval Reference Equipment for Type Approval The Siemens reference setup submitted to type approve HC25 consists of the following com-

ponents:

Siemens HC25 cellular engine Development Support Box DSB75 and HC15/HC25-DSB75-Adapter for mounting the HC25 module SIM card reader integrated on DSB75 U.FL-LP antenna cable Handset type Votronic HH-SI-30.3/V1.1/0 PC as MMI Figure 9: Reference equipment for Type Approval HC25_HO_v00.220 Confidential / Preliminary Page 31 of 39 2007-03-20 HC25 Hardware Interface Overview 7.2 Compliance with FCC Rules and Regulations 32 s 7.2 Compliance with FCC Rules and Regulations The Equipment Authorization Certification for the Siemens reference application described in Section 7.1 will be registered under the following identifiers:

FCC Identifier: QIPHC25 Industry Canada Certification Number: 267W-HC25 Granted to Siemens AG Manufacturers of mobile or fixed devices incorporating HC25 modules are authorized to use the FCC Grants and Industry Canada Certificates of the HC25 modules for their own final prod-

ucts according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating

"Contains FCC ID QIPHC25". IMPORTANT:

Manufacturers of portable applications incorporating HC25 modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for por-

table mobiles (see Section 1.4 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. HC25_HO_v00.220 Confidential / Preliminary Page 32 of 39 2007-03-20 HC25 Hardware Interface Overview 8 Appendix 39 8 Appendix s List of Parts and Accessories 8.1 Table 17: List of parts and accessories Description HC25 Supplier Siemens Ordering information Standard module (Siemens IMEI) Siemens ordering number: L30960-N1050-A100 Customer IMEI mode:

Siemens Ordering number: L30960-N1060-A100 Siemens ordering number: L36880-N3015-A117 Siemens ordering number: L36880-N8811-A100 Siemens ordering number: L30960-N1001-A100 Votronic HH-SI-30.3/V1.1/0 VOTRONIC Entwicklungs- und Produktionsgesellschaft fr elek-

tronische Gerte mbH Saarbrcker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 e-mail: contact@votronic.com Ordering numbers: 91228 91236 Sales contacts are listed in Table 18. Sales contacts are listed in Table 18. Sales contacts are listed in Table 19. Siemens Siemens Car Kit Portable DSB75 Support Box Siemens HC15/HC25-DSB75-Adapter Siemens Votronic Handset VOTRONIC SIM card holder incl. push button ejector and slide-in tray Board-to-board connector Antenna connector Molex Molex Hirose HC25_HO_v00.220 Confidential / Preliminary Page 33 of 39 2007-03-20 HC25 Hardware Interface Overview 8.1 List of Parts and Accessories 39 Table 18: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Phone: +86-10-6526-972 Phone: +86-10-6526-9731 Fax: +86-10-6526-9730 s American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. Yamato, Kanagawa, Japan Phone: +81-462-65-2324 Fax: +81-462-65-2366 Molex Deutschland GmbH Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Mail: mxgermany@molex.com Molex Singapore Pte. Ltd. Jurong, Singapore Phone: +65-268-6868 Fax: +65-265-6044 Table 19: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click:

http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217 Hirose Electric UK, Ltd Crownhill Business Centre 22 Vincent Avenue, Crownhill Milton Keynes, MK8 OAB Great Britain Phone: +44-1908-305400 Fax: +44-1908-305401 Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Phone: +81-03-3491-9741 Fax: +81-03-3493-2933 Hirose Electric GmbH Herzog-Carl-Strasse 4 73760 Ostfildern Germany Phone: +49-711-456002-1 Fax: +49-711-456002-299 Email info@hirose.de Hirose Electric Co., Ltd. European Branch First class Building 4F Beechavenue 46 1119PV Schiphol-Rijk Netherlands Phone: +31-20-6557-460 Fax: +31-20-6557-469 HC25_HO_v00.220 Confidential / Preliminary Page 34 of 39 2007-03-20 HC25 Hardware Interface Overview 8.2 Fasteners and Fixings for Electronic Equipment 39 s 8.2 Fasteners and Fixings for Electronic Equipment This section provides a list of suppliers and manufacturers offering fasteners and fixings for electronic equipment and PCB mounting. The content of this section is designed to offer basic guidance to various mounting solutions with no warranty on the accuracy and sufficiency of the information supplied. Please note that the list remains preliminary although it is going to be updated in later versions of this document. 8.2.1 Fasteners from German Supplier ETTINGER GmbH Sales contact:

ETTINGER GmbH http://www.ettinger.de/main.cfm Phone: +49-81-046623-0 Fax: +49-81-046623-99 The following tables contain only article numbers and basic parameters of the listed compo-

nents. For further detail and ordering information please contact Ettinger GmbH. Please note that some of the listed screws, spacers and nuts are delivered with the DSB75 Support Board. See comments below. Article number: 05.71.038 Length Material For internal diameter Internal diameter External diameter Vogt AG No. Spacer - Aluminum /

Wall thickness = 0.8mm 3.0mm AlMgSi-0,5 M2=2.0-2.3 d = 2.4mm 4.0mm x40030080.10 HC25_HO_v00.220 Confidential / Preliminary Page 35 of 39 2007-03-20 HC25 Hardware Interface Overview 8.2 Fasteners and Fixings for Electronic Equipment 39 s Article number: 07.51.403 Length Material Surface Internal diameter External diameter Flammability rating Insulating Spacer for M2 Self-gripping1 3.0mm Polyamide 6.6 Black 2.2mm 4.0mm UL94-HB 1. 2 spacers are delivered with DSB75 Support Board Article number: 05.11.209 Length Material Thread 1 / Length Thread 2 / Length Width across flats Recess Type Threaded Stud M2.5 - M2 Type E /

External thread at both ends 3.0mm Stainless steel X12CrMoS17 M2.5 / 6.0mm M2 / 8.0mm 5 yes External / External HC25_HO_v00.220 Confidential / Preliminary Page 36 of 39 2007-03-20 HC25 Hardware Interface Overview 8.2 Fasteners and Fixings for Electronic Equipment 39 s Article number: 01.14.131 Length Material Surface Thread Head diameter Head height Type Screw M21 DIN 84 - ISO 1207 8.0mm Steel 4.8 Zinced A2K M2 D = 3.8mm 1.30mm Slotted cheese head screw 1. 2 screws are delivered with DSB75 Support Board Article number: 01.14.141 Length Material Surface Thread Head diameter Head height Type Screw M2 DIN 84 - ISO 1207 10.0mm Steel 4.8 Zinced A2K M2 D = 3.8mm 1.30mm Slotted cheese head screw HC25_HO_v00.220 Confidential / Preliminary Page 37 of 39 2007-03-20 HC25 Hardware Interface Overview 8.3 Mounting Advice Sheet 39 s Article number: 02.10.011 Material Surface Thread Wrench size /

Thickness / L Type Hexagon Nut1 DIN 934 - ISO 4032 Steel 4.8 Zinced A2K M2 4 1.6mm Nut DIN/UNC, DIN934 1. 2 nuts are delivered with DSB75 Support Board 8.3 Mounting Advice Sheet To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device. The advice sheet on the next page shows a number of examples for the kind of bending that may lead to mechanical damage of the module. HC25_HO_v00.220 Confidential / Preliminary Page 38 of 39 2007-03-20 HC25 Hardware Interface Overview 8.3 Mounting Advice Sheet 39 s HC25_HO_v00.220 Confidential / Preliminary Page 39 of 39 2007-03-20