FCC ID: QIPBGS12 GSM/GPRS Wireless Module

 

1 CINTERION BGS12 Hardware Interface Description Version:

DocId:

00.915 BGS12_HID_V00.915 M2M.GEMALTO.COM BGS1-E HID_V02.000 Confidential / Released 2017-07-13 CINTERION BGS12 Hardware Interface Description Contents 2 of 109 Page Document Name: Cinterion BGS12 Hardware Interface Description Version:

00.915 Date:

DocId:

Status 2019-01-07 BGS12 HID_V00.915 Confidential / Released GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION

(THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANS-

LATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFOR-

MATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORD-

ING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibit-

ed. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2017, Gemalto M2M GmbH, a Gemalto Company Trademark Notice Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trade-

marks or trademarks mentioned in this document are property of their respective owners. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Hardware Interface Description ............................................................................................. 1 3 of 109 Page 1 2 3 Introduction ................................................................................................................. 9 Related Documents ............................................................................................ 9 1.1 1.2 Terms and Abbreviations..................................................................................... 9 1.3 Regulatory and Type Approval Information ......................................................... 12 1.3.1 Directives and Standards ..................................................................................... 12 1.3.2 SAR requirements specific to portable mobiles .................................................... 15 1.3.3 Safety Precautions .............................................................................................. 16 Product Concept .......................................................................................................... 18 Key Features at a Glance ................................................................................... 18 2.1 BGS12 System Overview .................................................................................... 21 2.2 2.3 Circuit Concept ................................................................................................... 22 Application Interface .................................................................................................... 23 3.1 Operating Modes ................................................................................................ 24 3.2 Power Supply ..................................................................................................... 25 3.2.1 Minimizing Power Losses .................................................................................... 25 3.2.2 Measuring the Supply Voltage (VBATT+) ............................................................. 26 3.2.3 Monitoring Power Supply by AT Command .......................................................... 26 3.3 Power Up/Power down Scenarios ....................................................................... 26 3.3.1 Turn on BGS12 ................................................................................................... 26 3.3.1.1 Switch on BGS12 Using ON Signal ........................................................ 26 3.3.1.2 Suppressing Unintentional Pulses on ON Signal Line ............................. 28 3.3.2 Restart BGS12 ................................................................................................... 29 3.3.2.1 Restart BGS12 via AT+CFUN Command ................................................ 29 3.3.2.2 Turn off or restart BGS12 Using EMERG_RST ...................................... 29 3.3.3 Signal States after Startup ................................................................................... 30 3.3.4 Turn off BGS12 ................................................................................................... 32 3.3.4.1 Switch off BGS12 Using AT Command ................................................... 32 3.3.5 Automatic Shutdown ........................................................................................... 33 3.3.5.1 Thermal Shutdown ................................................................................. 33 3.3.5.2 Undervoltage Shutdown ......................................................................... 34 3.3.5.3 Overvoltage Shutdown ........................................................................... 34 3.4 Power Saving ..................................................................................................... 35 3.4.1 No Power Saving (AT+CFUN=1) ......................................................................... 35 3.4.2 NON-CYCLIC SLEEP Mode (AT+CFUN=0) ......................................................... 35 3.4.3 CYCLIC SLEEP Mode AT+CFUN=7 .................................................................... 35 3.4.4 CYCLIC SLEEP Mode AT+CFUN=9 .................................................................... 36 3.4.5 Timing of the CTS Signal in CYCLIC SLEEP Modes............................................ 37 3.4.6 Power Saving in OFF-state ................................................................................. 38 3.4.7 Wake up BGS12 from SLEEP Mode ................................................................... 39 3.4.7.1 Wake-up via RTS0 and RTS2 (if AT+CFUN=0 or AT+CFUN=9) ............. 39 Summary of State Transitions (except SLEEP Mode) ......................................... 40 RTC Backup ....................................................................................................... 40 3.5 3.6 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 4 of 109 Page SIM/USIM Interface ............................................................................................ 40 3.7 3.7.1 Single SIM/USIM Card Application ..................................................................... 40 3.7.2 Dual SIM/USIM Card Application ........................................................................ 42 3.8 Serial Interface ASC0 ......................................................................................... 42 3.9 Serial Interface ASC1 ......................................................................................... 46 3.10 Serial Interface ASC2 ......................................................................................... 47 3.11 Analog Audio Interface ........................................................................................ 49 3.11.1 Microphone Inputs and Supply ................................................................ 49 3.11.2 Loudspeaker Output ............................................................................... 50 I2S Interface ........................................................................................................ 52 3.12 3.13 GPIO Interface .................................................................................................... 52 I2C Interface ....................................................................................................... 54 3.14.1 I2C Interface on DSB75 ......................................................................... 55 3.15 Jamming Indicator .............................................................................................. 58 3.16 Status LED ......................................................................................................... 58 3.17 Behavior of the RING0 Line (ASC0 Interface only) .............................................. 58 3.18 Power Indication Circuit ...................................................................................... 59 3.19 Fast Shutdown .................................................................................................... 61 3.14 Antenna Interface ........................................................................................................ 62 4.1 Antenna Installation ............................................................................................ 62 4.2 RF Line Routing Design ...................................................................................... 63 4.2.1 Line Arrangement Examples ............................................................................... 63 4.2.1.1 Embedded Stripline ................................................................................ 63 4.2.1.2 Micro-Stripline ........................................................................................ 64 4.2.2 Routing Example ................................................................................................ 68 Interface to RF Connector ...................................................................... 68 4.2.2.1 Electrical Reliability and Radio Characteristics ........................................................ 69 5.1 Absolute Maximum Ratings ................................................................................ 69 5.2 Operating Temperatures ..................................................................................... 69 Reliability Characteristics .................................................................................... 70 5.3 Pad Assignment and Signal Description .............................................................. 71 5.4 5.5 Power Supply Ratings ......................................................................................... 79 5.6 Electrical Characteristics of the Voiceband Part................................................... 81 5.6.1 Setting Audio Parameters by AT Commands ....................................................... 81 5.6.2 Audio Programming Model .................................................................................. 82 5.6.3 Characteristics of Audio Modes ........................................................................... 83 5.6.4 Voiceband Receive Path .................................................................................... 84 5.6.5 Voiceband Transmit Path.................................................................................... 85 Antenna Interface Specification .......................................................................... 86 5.7 5.8 Electrostatic Discharge ....................................................................................... 87 4 5 6 Mechanics, Mounting and Packaging ........................................................................ 88 6.1 Mechanical Dimensions of BGS12 ...................................................................... 88 6.2 Mounting BGS12 onto the Application Platform ................................................... 90 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 5 of 109 Page 6.2.1 SMT PCB Assembly............................................................................................ 90 6.2.1.1 Land Pattern and Stencil ........................................................................ 90 6.2.1.2 Board Level Characterization ................................................................. 92 6.2.2 Moisture Sensitivity Level .................................................................................... 92 6.2.3 Soldering Conditions and Temperature ................................................................ 93 6.2.3.1 Reflow Profile ......................................................................................... 93 6.2.3.2 Maximum Temperature and Duration ..................................................... 94 6.2.4 Durability and Mechanical Handling ..................................................................... 94 6.2.4.1 Storage Conditions ................................................................................. 94 6.2.4.2 Processing Life ....................................................................................... 95 6.2.4.3 Baking .................................................................................................... 95 6.2.4.4 Electrostatic Discharge ........................................................................... 95 6.3 Packaging ........................................................................................................... 95 6.3.1 Tape and Reel ..................................................................................................... 95 6.3.1.1 Orientation ............................................................................................. 96 6.3.2 Shipping Materials............................................................................................... 97 6.3.2.1 Moisture Barrier Bag .............................................................................. 97 6.3.2.2 Transportation Box ................................................................................. 99 7 8 9 Sample Application ..................................................................................................... 100 7.1 Blocking against RF on Interface Lines .................................................................... 102 Reference Approval ..................................................................................................... 104 8.1 Reference Equipment for Type Approval ................................................................. 104 Appendix ...................................................................................................................... 105 9.1 List of Parts and Accessories ................................................................................... 105 9.2 FCC statement ........................................................................................................ 107 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Tables 6 of 109 Page Table 1: Directives ............................................................................................................. 12 Table 2: Standards of European type approval .................................................................. 13 Table 3: Requirements of quality........................................................................................ 13 Table 4: Standards of the Ministry of Information Industry of the Peoples Republic of China14 Table 5: Toxic or hazardous substances or elements with defined concentration limits ..... 14 Table 6: Overview of operating modes ............................................................................... 24 Table 7: Signal states ........................................................................................................ 31 Table 8: Temperature dependent behavior ........................................................................ 34 Table 9: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes ............................ 39 Table 10: State transitions of BGS12 (except SLEEP mode) ............................................. 40 Table 11: Signals of the SIM interface (SMT application interface) .................................... 41 Table 12: DCE-DTE wiring of ASC0 ................................................................................... 44 Table 13: DCE-DTE wiring of ASC1 ................................................................................... 46 Table 14: DCE-DTE wiring of ASC2 ................................................................................... 48 Table 15: GPIO assignment .............................................................................................. 52 Table 16: Return loss in the active band ............................................................................ 62 Table 17: Absolute maximum ratings ................................................................................. 69 Table 18: Board temperature ............................................................................................. 69 Table 19: Summary of reliability test conditions ................................................................. 70 Table 20: Pad assignments ................................................................................................ 72 Table 21: Electrical description of application interface ...................................................... 73 Table 22: Electrical description of application interface ...................................................... 75 Table 23: Electrical description of application interface ...................................................... 76 Table 24: Electrical description of application interface ...................................................... 76 Table 25: Electrical description of application interface ...................................................... 77 Table 26: Electrical description of application interface ...................................................... 78 Table 27: Power supply ratings1 ......................................................................................... 79 Table 28:Power supply ratings1 .......................................................................................... 80 Table 29: Audio parameters adjustable by AT command ................................................... 81 Table 30: Voiceband characteristics (typical) ..................................................................... 83 Table 31: Voiceband receive path ...................................................................................... 84 Table 32: Voiceband transmit path ..................................................................................... 85 Table 33: Antenna interface specifications ......................................................................... 86 Table 34: Measured electrostatic values ............................................................................ 87 Table 35: Reflow temperature ratings ................................................................................ 93 Table 36: Storage conditions ............................................................................................. 94 Table 37: EMI measures on the application interface ....................................................... 103 Table 38: List of parts and accessories ............................................................................ 105 Table 39: Molex sales contacts (subject to change) ......................................................... 106 Table 40: Manufacturer address DBG Holdings Limited ................................................... 106 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 7 of 109 Page Figures Figure 1: BGS12 system overview ..................................................................................... 21 Figure 2: BGS12 block diagram ......................................................................................... 22 Figure 3: Power supply limits during transmit burst ............................................................ 25 Figure 4: Position of reference points BATT+ and GND ..................................................... 26 Figure 5: ON circuit sample ................................................................................................ 27 Figure 6: ON timing ............................................................................................................ 28 Figure 7: Sample circuit to suppress spikes or glitches on ON signal line .......................... 29 Figure 8: Emergency shutdown/restart timing .................................................................... 30 Figure 9: Switch off behavior .............................................................................................. 33 Figure 10: Timing of CTS signal (example for a 2.12 s paging cycle) ................................. 37 Figure 11: Beginning of power saving if CFUN=7 ............................................................... 38 Figure 12: Power Saving in OFF-state ............................................................................... 38 Figure 13: External SIM card holder circuit......................................................................... 41 Figure 14: VDIG power supply domain ............................................................................... 43 Figure 15: Serial interface ASC0 ........................................................................................ 43 Figure 16: ASC0 startup behavior ...................................................................................... 45 Figure 17: Serial interface ASC1 ........................................................................................ 46 Figure 18: ASC1 startup behavior ...................................................................................... 47 Figure 19: Serial interface ASC2 ........................................................................................ 47 Figure 20: ASC1 startup behavior ...................................................................................... 48 Figure 21: Single ended microphone connection ............................................................... 49 Figure 22: Differential Microphone connection ................................................................... 50 Figure 23: Line Input .......................................................................................................... 50 Figure 24: Differential loudspeaker connection .................................................................. 51 Figure 25: Line output connection ...................................................................................... 51 Figure 26: GPIO startup behavior ...................................................................................... 53 Figure 27: I2C interface connected to VCC of application .................................................. 54 Figure 28: I2C interface connected to VDIG ....................................................................... 54 Figure 29: I2C startup behavior .......................................................................................... 55 Figure 30: Additional EEPROM to enable usage of I2C interface on DSB75 ...................... 56 Figure 31: Jumper settings to enable usage of I2C interface on DSB75 ............................. 57 Figure 32: Status signalling with LED driver ....................................................................... 58 Figure 33: Incoming voice call ............................................................................................ 59 Figure 34: incoming data receive ....................................................................................... 59 Figure 35: URC transmission ............................................................................................. 59 Figure 36: Power indication circuit ..................................................................................... 60 Figure 37: Fast Shutdown timing ........................................................................................ 61 Figure 38: Antenna pads (bottom view) .............................................................................. 62 Figure 39: Embedded Stripline with 65m prepreg (1080) and 710m core ....................... 63 Figure 40: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ..................... 64 Figure 41: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 ................................ 65 Figure 42: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 ................................ 66 Figure 43: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 ................................ 67 Figure 44: Pouting to applications RF connector - top view ............................................... 68 Figure 45: Numbering plan for connecting pads (bottom view) ........................................... 71 Figure 46: Audio programming model ................................................................................ 82 Figure 47: BGS12 top and bottom view ........................................................................... 88 Figure 48: Dimensions of BGS12 (all dimensions in mm) (to be replaced) ......................... 89 Figure 49: Land pattern (top view) (to be replaced) ............................................................ 90 Figure 50: Recommended design for 110 micron thick stencil (top view) ........................... 91 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 8 of 109 Page Figure 51: Recommended design for 150 micron thick stencil (top view) (to be replaced).. 91 Figure 52: Reflow Profile .................................................................................................... 93 Figure 53: Carrier tape ....................................................................................................... 96 Figure 54: Reel direction .................................................................................................... 96 Figure 55: Barcode label on tape reel ................................................................................ 97 Figure 56: Moisture barrier bag (MBB) ............................................................................... 97 Figure 57: Moisture Sensitivity Label.................................................................................. 98 Figure 58: Humidity Indicator Card HIC ........................................................................... 99 Figure 59: Schematic diagram of BGS12 sample application(to be repaced) ................... 101 Figure 60: EMI circuits ..................................................................................................... 102 Figure 61: Reference equipment for Type Approval ......................................................... 104 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 9 of 109 Page 1 Introduction This document describes the hardware of the Cinterion BGS12 module that connects to the cellular device application and the air interface. It helps you quickly retrieve interface specifi-

cations, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.1 Related Documents

[1] Cinterion BGS12 AT Command Set2

[2] Cinterion BGS12 Release Note

[3] Application Note 48: SMT Module integration for BGS12

[4]

[5] Upgrading BGS12 Firmware

[6] BGS12 migration guide

[7] BGS12 Dual SIM/USIM Card Application Note Jamming Detection 1.2 Terms and Abbreviations Abbreviation Description Analog-to-digital converter ADC Automatic Gain Control AGC American National Standards Institute ANSI Absolute Radio Frequency Channel Number ARFCN Antenna Reference Point ARP Asynchronous Controller. Abbreviations used for first and second and third ASC0/ASC1/

serial interface of BGS12 ASC2 Thermistor Constant B Bit Error Rate BER BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE CHAP CPU CS CSD CTS DAC Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 10 of 109 Page Abbreviation Description DAI dBm0 DCE DCS 1800 DRX DSB DSP DSR DTE DTR DTX EFR EGSM EIRP EMC ERP ESD ETS FCC FDMA FR GMSK GPIO GPRS GSM HiZ HR I/O IC IMEI ISO ITU kbps LED Li-Ion/Li+

Li battery Mbps Digital Audio Interface Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. a Gemalto M2M module) Digital Cellular System, also referred to as PCN Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Equivalent Isotropic Radiated Power Electromagnetic Compatibility Effective Radiated Power Electrostatic Discharge European Telecommunication Standard Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Purpose Input/Output General Packet Radio Service Global Standard for Mobile Communications High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Rechargeable Lithium Ion or Lithium Polymer battery Mbits per second BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 11 of 109 Page Abbreviation Description MMI MO MS MSISDN MT NTC OEM PA PAP PBCCH PCB PCL PCM PCN PCS PDU PLL PPP PSK PSU PWM R&TTE RAM RF RMS RoHS Man Machine Interface Mobile Originated Mobile Station (GSM module), also referred to as TE Mobile Station International ISDN number Mobile Terminated Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Power Control Level Pulse Code Modulation Personal Communications Network, also referred to as DCS 1800 Personal Communication System, also referred to as GSM 1900 Protocol Data Unit Phase Locked Loop Point-to-point protocol Phase Shift Keying Power Supply Unit Pulse Width Modulation Radio and Telecommunication Terminal Equipment Random Access Memory Radio Frequency Root Mean Square (value) Restriction of the use of certain hazardous substances in electrical and electronic equipment. Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate Surface Acoustic Wave Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology ROM RTC RTS Rx SAR SAW SELV SIM SMD SMS SMT BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 12 of 109 Page Abbreviation Description SRAM TA TDMA TE Tx UART URC USSD VSWR Static Random Access Memory Terminal adapter (e.g. GSM module) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transmit Direction Universal asynchronous receiver-transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio 1.3 Regulatory and Type Approval Information 1.3.1 Directives and Standards BGS12 is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "BGS12 Hardware Interface Description"

Table 1: Directives RED2014/53/EU Directive 2014/53/EU of the European Parliament and of the Council of 16 April 2014 on the harmonisation of the laws of the Member States relating to the making available on the market of radio equipment and repealing Directive 1999/5/EC Text with EEA relevance. Applicable as of 13 June 2016. OJ L 153, 22.5.2014 The product is labeled with the CE conformity mark. Directive of the European Parliament and of the Council of 27 Jan-

uary 2003 on the restriction of the use of certain hazardous sub-

stances in electrical and electronic equipment (RoHS) 2002/05/EC FCC ID QIPBGS12 US Federal Communications Commission set up according to Communications Act in 1934. The FCC control the radio, TV, telecom, satellite and cable to coordinate domestic and international communication. BGS12 HID_V00.915 Confidential / Released 2019-01-07 ETSI EN 301 511 V12.5.1 GCF-CC V3.73.0 ETSI EN 301 489-1 V.2.1.1 ETSI EN 301 489-52 V1.1.0 13 of 109 Page CINTERION BGS12 Hardware Interface Description Contents NOTE: Hereby, Gemalto M2M GmbH declares that this GSM/GPRS Wireless Module (Model No.:BGS12) is in compliance with the essential requirements and other relevant provisions of RED 2014/53/EU. This product can be used across EU member states. The full text of the EU declaration of conformity is available at the following internet address: https://www.gemalto.com/m2m RF exposure information: The Maximum Permissible Exposure (MPE) level has been calculated based on a distance of d=20 cm between the device and the human body. To maintain compliance with RF exposure requirement, use product that maintain a 20cm distance between the device and human body. Table 2: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Phase 2); Mobile Station (MS) conformance specification Global System for Mobile communications (GSM);

Mobile Stations (MS) equipment;

Harmonised Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU Global Certification Forum Electromagnetic compatibility and Radio spectrum Matters (ERM);

Electro Magnetic Compatibility (EMC) standard for radio equipment and services Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matt-

ers (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mo-

bile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS) Table 3: Requirements of quality IEC 60068 DIN EN 60529 Environmental testing IP codes BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Table 4: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 14 of 109 Page Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). SJ/T 11364-2006 According to the Chinese Administration on the Control of Pollution caused by Electronic Infor-

mation Products (ACPEIP) i.e., Environmental Protection Use Period, of this pro-

duct is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description. the EPUP, Please see Table5 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 5: Toxic or hazardous substances or elements with defined concentration limits BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 15 of 109 Page 1.3.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable BGS12 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommend-

ations or directives are in force outside these areas. Products intended for sale on European markets EN 62311:2008 Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz - 300 Ghz) The device complies with RF specifications when the device used at 20 cm form your body. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 16 of 109 Page 1.3.3 Safety Precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating BGS12. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Gemalto M2M assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other im-

planted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advis-

ed to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless applian-

ces in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol sta-

tions, fuel depots, chemical plants or where blasting operations are in pro-

gress. Operation of any electrical equipment in potentially explosive atmo-

spheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency en-

ergy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause inter-

ference or danger. Road safety comes first! Do not use a handheld cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for speaker-

phone operation. Before making a call with a handheld terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 17 of 109 Page IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular net-

works. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. Use careful with the earphone maybe possible excessive sound pressure from earphones and headphones can cause hearing loss. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 18 of 109 Page 2 Product Concept 2.1 Key Features at a Glance Feature General Frequency bands GSM class Output power

(according to Release 99, V5) Power supply1 Operating temperature

(board temperature) Physical RoHS GSM/GPRS features Data transfer SMS Audio Implementation Quad band : GSM 850/900/1800/1900MHz Small MS GSM850 824.2MHz~848.8MHz GSM:31.51dBm GPRS:31.51dBm PCS1900 1850.2MHz~1909.8MHz GSM:27.51dBm GPRS:27.51dBm EGSM900:880~915MHz GSM:32.8dBm GPRS:27.3dBm DCS18001710MHz~1785MHz GSM:30.4dBm GPRS:24.1dBm 3.4V to 4.2V

-10C to +55C Dimensions: 27.6mm x 18.8mm x 2.7mm Weight: approx. 2.2 g All hardware components fully compliant with EU RoHS Directive GPRS:

Multislot Class 12 Mobile Station Class B Coding Scheme 1 4 PPP-stack for GPRS data transfer Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus 50 SMS locations in mobile equipment Speech codecs:

Half rate HR (ETS 06.20) Full rate FR (ETS 06.10) Enhanced full rate EFR (ETS 06.50/06.60/06.80) Handsfree operation, echo cancellation, noise suppression, 7 different ringing tones/melodies 1. The module operates within a voltage level range from 3.4V up to 4.2V without restrictions. It is suggested to supply 3.4V to 4.35V on module. Please add at least 3700uF capacitor to VBAT signal line against GSM burst current while 3.2V to 3.4V supply for BGS12 module. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 19 of 109 Page Feature Software AT commands TCP/IP stack Implementation Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M Protocols: TCP server/client, UDP, HTTP, FTP Access by AT commands Firmware update Generic update from host application over ASC1. Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket. For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equipment. 3 serial interfaces ASC0:

8-wire modem interface with status and control lines, unbalanced, asynchronous Adjustable baud rates: 4,800bps to 230,400bps Autobauding: 4,800bps to 230,400bps Supports RTS0/CTS0 hardware handshake Multiplex ability according to GSM 07.10 Multiplexer Protocol. ASC1:

2-wire, unbalanced asynchronous interface ASC1 operated at Fixed Bit rate 921,600 bps For firmware upgrade and tracing purpose ASC2:

4-wire, unbalanced asynchronous interface ASC2 operated at Fixed Bit rates from 4,800 bps to 230,400 bps Supports RTS2/CTS2 hardware handshake 1 analog interface (with microphone feeding) Supported SIM/USIM cards: 3V, 1.8V External SIM card reader has to be connected via interface connector

(note that card reader is not part of BGS12) GPIO interface with 6 GPIO lines. The GPIO interface is shared with an I2C interface and LED signalling functionality as well as a jamm- ing indicator. 50 Audio UICC interface GPIO interface Antenna Power on/off, Reset Power on/off Switch-on by hardware signal ON Switch-off by AT command (AT^SMSO) Automatic switch-off in case of critical temperature and voltage conditions Fast power shutdown by GPIO Fast power shutdown by AT command UpgradingReset Orderly shutdown and reset by AT command Special features Real time clock Timer functions via AT commands BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 20 of 109 Page Feature Evaluation kit Phonebook Implementation SIM and phone SSL security TLS 1.2 RLS monitoring Jamming detection Evaluation module DSB75 BGS12 module soldered onto a dedicated PCB that can be con-

nected to an adapter in order to be mounted onto the DSB75. DSB75 Development Support Board designed to test and type app-

rove Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter setup is required to con-

nect the evaluation module to the DSB75. For more information on how to setup such a connection please refer to Chapter 9. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 21 of 109 Page 2.2 BGS12 System Overview

-6-

-2-

-1-

-1-

-1-

-2-

-1-

-2-

-8-

-2-

-4-

-5-

-1-

-1-

-1-

-1-

-1-

-1-

-62-

Figure 1: BGS12 system overview BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 22 of 109 Page 2.3 Circuit Concept Figure 2 shows a block diagram of the BGS12 module and illustrates the major functional components:

Baseband block:

GSM baseband processor and power management Stacked flash/PSRAM memory Application interface (SMT with connecting pads) GSM RF section:

RF transceiver (part of baseband processor IC) RF power amplifier/front-end module inc. harmonics filtering Receive Balun Figure 2: BGS12 block diagram BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 23 of 109 Page 3 Application Interface BGS12 is equipped with an SMT application interface that connects to the external applica-

tion. The host interface incorporates several subinterfaces described in the following sections:

Power supply - see Section 3.2 SIM/USIM interface - see Section 3.7 Serial interface ASC0 - see Section 3.8 Serial interface ASC1 - see Section 3.9 Serial interface ASC2 - see Section 3.10 Analog audio interface - see Section 3.11 Digital audio interface - see Section 3.12 GPIO interface - see Section 3.13 Jamming indicator - Section 3.15 Status Control - LED: Section 3.16, RING line: Section 3.17, Power indication: Section 3.18 Fast shutdown - Section 3.19 I2C interface - Section 3.14 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 24 of 109 Page 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 6: Overview of operating modes Normal operation GSM/GPRS SLEEP GSM IDLE GSM TALK GPRS IDLE GPRS DATA Various power save modes set with AT+CFUN command. Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mo-

de, too. Power saving can be chosen at different le-

vels: The NON-CYCLIC SLEEP mode

(AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP modes AT+CFUN=7 and 9 al-

ternatingly activate and deactivate the AT interfaces to allow permanent access to all AT commands. Software is active. Once registered to the GSM net-

work, paging with BTS is carried out. The module is ready to send and receive. Connection between two subscribers is in progress. Power consumption depends on network coverage individual settings,such as DTX off/on,FR/EFR/HR, hopping sequences, antenna. Module is ready for GPRS data transfer, but no data is currently sent or received. Power consumption de-

pends on network settings and GPRS configuration

(e.g. multislot settings). GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control le-

vel), uplink/downlink data rates, GPRS configuration

(e.g. used multislot settings) and reduction of max-

imum output power. Power Down Normal shutdown after sending the AT^SMSO command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied. See the following sections for the various options of waking up BGS12 and proceeding from one mode to another. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 3.2 Power Supply 25 of 109 Page BGS12 needs to be connected to a power supply at the SMT application interface - 3 lines each BATT+BB, BATT+RF and GND. BATT+BB is for the general power management and BATT+RF is for the GSM power amplifier supply. The power supply of BGS12 has to be a single voltage source at BATT+BB and BATT+RF. It must be able to provide the peak current during the uplink transmission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:

Stabilizes the supply voltages for the GSM baseband using low drop linear voltage regulat-

ors and a DC-DC step down switching regulator. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. When power supply is provided on BATT+BB and BATT+RF pins and BGS12 has not been powered on, please make sure to avoid that current is flowing from any other source into the module circuit (for example reverse current from high state external control lines). The controlling application must be designed to prevent reverse current flow, otherwise there is the risk of damaging the module. 3.2.1 Minimizing Power Losses When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.3V on the BGS12 board, not even in a GSM transmit burst where current consumption can rise (for peaks values see the power supply ratings listed in Section 5.5). It should be noted that BGS12 switches off when exceeding these limits. Any voltage drops that may occur in a transmit burst should not exceed 400mV. The module switches off if the minimum battery voltage (VBattMin) is reached. Example:

VBattLowLimit = 3.3V DDropMax = 0.4V VBattMin = VBattLowLimit + DDropMax VBattMin = 3.3V + 0.4V = 3.7V Figure 3: Power supply limits during transmit burst BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 3.2.2 Measuring the Supply Voltage (VBATT+) 26 of 109 Page To measure the supply voltage VBATT+ it is possible to define two reference points GND and BATT+. GND should be the modules shielding, while BATT+ should be a test pad on the external application the module is mounted on. The external BATT+ reference point has to be connected to and positioned close to the SMT application interfaces BATT+ pads 5 or 53 as shown in Figure 4. Figure 4: Position of reference points BATT+ and GND 3.2.3 Monitoring Power Supply by AT Command To monitor the supply voltage you can also use the AT^SBV command which returns the value related to the reference points BATT+ and GND. The module continuously measures the voltage at intervals. The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed. If the measured average voltage drops below or rises above the specified voltage shutdown thresholds, the module will send an "^SBC" URC and shut down. (for details see Section 3.3.5) 3.3 Power Up/Power down Scenarios In general, be sure not to turn on BGS12 while it is beyond the safety limits of voltage and tem-

perature stated in Chapter 5. BGS12 will immediately switch off after having started and de-

tected these inappropriate conditions. In extreme cases this can cause permanent damage to the module. 3.3.1 Turn on BGS12 BGS12 can be started as described in the following sections:

Hardware driven switch on by ON line: Starts Normal mode (see Section 3.3.1.1). 3.3.1.1 Switch on BGS12 Using ON Signal BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents When the operating voltage BATT+BB/BATT+RF is applied, BGS12 can be switched on by means of the ON signal. 27 of 109 Page If the operating voltage BATT+BB/BATT+RF is applied while the ON signal is present for at least 2s, the BGS12 will be switched on automatically. The startup time is about 4s. Please also note that if there is no ON signal present right after applying BATT+BB/BATT+RF, BGS12 will instead of switching on perform a switch on/off sequence that cannot be avoided. The switch on/off sequence is about 3.7s. The ON signal is a high active signal and only allows the input voltage level of the VDDLP signal. The following Figure 5 shows an example for a switch-on circuit (an alternative switch-

on possibility is shown in Figure 59). Figure 5: ON circuit sample It is recommended to set a serial 1kOhm resistor between the ON circuit and the external capacitor or battery at the VDDLP power supply. This serial resistor protection is necessary in case the capacitor or battery has low power (is empty). Please note that the ON signal is an edge triggered signal. This implies that a micro-second high pulse on the signal line suffices to almost immediately switch on the module, as shown in Figure 6. The following Section 3.3.1.2 describes a sample circuit that may be implemented to prevent possible spikes or glitches on the ON signal line from unintentionally switching on the module. Please also note that if the state of the ON signal is coupled to the state of the VDDLP line or that if the ON signal otherwise remains active high after switch on, it is no longer possible to switch off BGS12 using the AT command AT^SMSO. Using this command will instead automatically restart the module. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 28 of 109 Page BATT+BB BATT+RF VDDLP ON EMERG_RST VDIG A high impulse starts the module up Figure 6: ON timing If configured to a fixed bit rate (AT+IPR0), the module will send the URC ^SYSSTART which notifies the host application that the first AT command can be sent to the module. The duration until this URC is output varies with the SIM card and may take a couple of seconds, particularly if the request for the SIM PIN is deactivated on the SIM card. Please note that no ^SYSSTART URC will be generated if autobauding (AT+IPR=0) is enabled. To allow the application to detect the ready state of the module we recommend using hardware flow control which can be set with AT\Q (see [1] for details). The default setting is AT\Q0 (no flow control) which shall be altered to AT\Q3 (RTS/CTS handshake). If the application design does not integrate RTS/CTS lines the host application shall wait at least for the ^SYSSTART URC. However, if the URC is not available (due to autobauding), you will simply have to wait for a period of time (at least 2 seconds) before assuming the module to be in ready state and before entering any data. Please note that no data must be sent over the ASC0 interface before the interface is active and ready to receive data. 3.3.1.2 Suppressing Unintentional Pulses on ON Signal Line Since the ON signal is edge triggered and a high pulse on the signal line suffices to almost im-

mediately switch on the module, it might be necessary to implement a circuit on the external application that prevents possible spikes or glitches on the signal line from unintentionally switching on the module. Figure 7 shows an example for such a circuit. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 29 of 109 Page Figure 7: Sample circuit to suppress spikes or glitches on ON signal line 3.3.2 Restart BGS12 After startup BGS12 can be restarted as described in the following sections:

Software controlled reset by AT+CFUN command: Starts Normal mode (see Section 3.3.2.1). Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.3.2.2) 3.3.2.1 Restart BGS12 via AT+CFUN Command To reset and restart the BGS12 module use the command AT+CFUN. You can enter the com-

mand AT+CFUN=,1 or 1,1 or 7,1 or 9,1. See [1] for details. If configured to a fix baud rate (AT+IPR0) the module will send the URC "^SYSSTART" to notify that it is ready to operate. If autobauding is enabled (AT+IPR=0) there will be no notifi-

cation. To register to the network SIM PIN authentication is necessary after restart. 3.3.2.2 Turn off or restart BGS12 Using EMERG_RST The EMERG_RST signal is internally connected to the central GSM processor. Abrupt hardware shutdown will accur when A low level for more than 1ms is applied to EMERG_RST pin. BGS12 can be switched on by mean of ON signal after releasing EMERG_RST. Note: EMERG_RST is controlled solely cannot restart BGS12, it can only turn BGS12 off at the hardware aspect. If want to achieve restart module like RESET behaver, it should control ON signal at the same time as described by following paragraph. For the other solution that high level has always been applied to ON pin, triggering EMERG_RST will set the processor and with it all the other signal pads to their respective BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents reset state. The reset state is described in Section 3.3.3 as well as in the figures showing the startup behavior of an interface. 30 of 109 Page After releasing the EMERG_RST line, i.e., with a change of the signal level from low to high, the module restarts. The other signals continue from their reset state as the module was switched on by the ON signal. Figure 8: Emergency shutdown/restart timing It is recommended to control this EMERG_RST line with an open collector transistor or an open drain field-effect transistor. Caution: Use the EMERG_RST line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all information stored in the volatile memory. Therefore, this procedure is intend-

ed only for use in case of emergency, e.g. if BGS12 does not respond, if reset or shutdown via AT command fails. 3.3.3 Signal States after Startup Table 7 lists three states each interface signal passes through during reset and firmware in-

itialization:

1) At reset: BGS12 begins to startup and performs the reset action. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 2) After reset: BGS12 has finished the reset action and has not entered the firmware initiali-

zation state. 3) Firmware initialization: The software has taken the control right of hardware, and begins to initialize the firmware. 31 of 109 Page At reset state is reached with the rising edge of the EMERG_RST signal - either after a nor-

mal module startup (see Section 3.3.1.1) or after a reset (see Section 3.3.2.2). When BGS12 passes through at reset state and after reset state, the firmware initialization state begins. The firmware initialization is completed as soon as the ASC0 interface lines CTS0, DSR0 and RING0 as well as the ASC1 interface line CTS1 have turned high (see Section 3.7 and Section 3.8). At that time, the module is ready to receive and transmit data. Table 7: Signal states Signal name At reset After reset CCIN CCRST CCIO CCCLK RXD0 TXD0 CTS0 RTS0 RING0 DTR0 DCD0 DSR0 RXD1 TXD1 RXD2 TXD2 CTS2 RTS2 FAST_SHTDWN GPIO5 / LED GPIO6 Jamming Indicator GPIO7 GPIO8 GPIO9 / I2CCLK GPIO10 / I2CDAT

/

I / 166K PD L L L I / 166K PD I / 166K PD I / 166K PD I / 166K PD I / 166K PD I / 166K PD I / 166K PD I / 166K PD O / 166K PU I / 166K PU I / 166K PD I / 166K PD I / 33K PD I / 33K PD I / 166K PD O / L I / 166K PD I / 166K PD I / 166K PD O / L O / L Firmware initialization I /166K PD O / L I O / L O / L O / H I O / H I / 166K PU O / H I / 166K PU O / 166K PU O / 166K PU O / H I O / H I O / H I / 33K PU I / 166K PU O / 33K PU I / 166K PD L L L I / 166K PD I / 166K PD I / 166K PD I / 166K PD I / 166K PD I / 166K PD I / 166K PD I / 166K PD O / 166K PU I / 166K PU I / 166K PD I / 166K PD I / 33K PD I / 33K PD I / 166K PD O / L I / 166K PD I O / 166K PU I / 166K PD I / 166K PD O / L O / L I O / 166K PU I O / 166K PU O / 33K PU I O / 33K PU BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 32 of 109 Page Abbreviations used in above Table 7:

L = Low level H =High level L/H = Low or High level T = Tristate I = Input O = Output IO=Input or Output OD = Open Drain PD = Pull Down PU = Pull Up 3.3.4 Turn off BGS12 To switch the module off the following procedures may be used:

Software controlled shutdown procedure: See Section 3.3.4.1. Software controlled by sending the AT^SMSO command over the serial application interface. Automatic shutdown of BGS12 due to safety precautions: See Section 3.3.5 Fast shutdown (Hardware line): See Section 3.19 3.3.4.1 Switch off BGS12 Using AT Command The best and safest approach to powering down BGS12 is to issue the AT^SMSO com-

mand. This procedure lets BGS12 log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is re-

ferred to as Power Down mode. In this mode, only the RTC stays active. Before switching off the device sends the following response:

^SMSO: MS OFF OK

^SHUTDOWN After sending AT^SMSO do not enter any other AT commands. There are two ways to verify when the module turns off:

Wait for the URC ^SHUTDOWN. It indicates that data have been stored non-volatile and the module turns off in less than 1 second. Also, you can monitor the VDIG pad. The low state of this pad definitely indicates that the module is switched off. Be sure not to disconnect the operating voltage VBATT+ before the URC ^SHUTDOWN has been issued and the VDIG pads have gone low. Otherwise you run the risk of losing data. While BGS12 is in Power Down mode the application interface is switched off and must not be fed from any other voltage source. Therefore, your application must be designed to avoid any current flow into any digital pads of the application interface. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 33 of 109 Page Figure 9: Switch off behavior 3.3.5 Automatic Shutdown Automatic shutdown takes effect if any of the following events occurs:

the BGS12 board is exceeding the critical limits of overtemperature or undertemperature

(see Section 3.3.5.1) undervoltage or overvoltage is detected (see Section 3.3.5.2 and Section 3.3.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with the AT^SMSO command, i.e. BGS12 logs off from the network and the software enters a secure state avoiding loss of data. 3.3.5.1 Thermal Shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by the NTC resistor are measured directly on the board and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, BGS12 instantly displays an alert (if enabled). URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command (for details see [1]):

AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 15 second guard period after start-up of BGS12. After expiry of the 15 second guard period, the presentation will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated. URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The pre-

sentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0 was never changed. The maximum temperature ratings are stated in Section 5.2. Refer to Table 8 for the associated URCs. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 34 of 109 Page Table 8: Temperature dependent behavior Sending temperature alert (15s after BGS12 startup, otherwise only if URC presentation enabled)

^SCTM_B: 1

^SCTM_B: -1

^SCTM_B: 0 Automatic shutdown (URC appears no matter whether or not presentation was enabled)

^SCTM_B: 2

^SCTM_B: -2 Board close to overtemperature limit. Board close to undertemperature limit. Board back to non-critical temperature range. Alert: Board equal or beyond overtemperature limit. BGS12 switches off. Alert: Board equal or below undertemperature limit. BGS12 switches off. 3.3.5.2 Undervoltage Shutdown The undervoltage shutdown threshold is 3.2V, i.e., it is 50mV below the specified minimum supply voltage VBATT+ given in Table 21 When the average supply voltage measured by BGS12 drops below the undervoltage shut-

down threshold the module will send the following URC:

^SBC: Undervoltage This alert is sent only once before the module shuts down cleanly without sending any further messages. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. 3.3.5.3 Overvoltage Shutdown The overvoltage shutdown threshold is equal to the maximum supply voltage VBATT+ spe-

cified in Table 21. When the supply voltage approaches the overvoltage shutdown threshold the module will send the following URC:

^SBC: Overvoltage This alert is sent once. When the overvoltage shutdown threshold is exceeded the module will shut down cleanly. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Keep in mind that several BGS12 components are directly linked to BATT+BB and BATT+RF, therefore, the supply voltage remains applied at major parts of BGS12. Especially the power amplifier linked to BATT+RF is very sensitive to high voltage and might even be destroyed. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 35 of 109 Page 3.4 Power Saving SLEEP mode reduces the functionality of the BGS12 module to a minimum and, thus, minimizes the current consumption to the lowest level. Settings can be made using the AT+CFUN command. For details see below and [1]. SLEEP mode falls into two categories:

NON-CYCLIC SLEEP mode AT+CFUN=0 CYCLIC SLEEP modes, selectable with AT+CFUN=7 or 9. IMPORTANT: Please keep in mind that power saving works properly only when PIN au-

thentication has been done. If you attempt to activate power saving while the SIM card is not inserted or the PIN not correctly entered (Limited Service), the selected <fun> level will be set, though power saving does not take effect. To check whether power saving is on, you can query the status of AT+CFUN if you have chosen CYCLIC SLEEP mode. The wake-up procedures are quite different depending on the selected SLEEP mode. Table 9 compares the wake-up events that can occur in NON-CYCLIC and CYCLIC SLEEP modes. 3.4.1 No Power Saving (AT+CFUN=1) The functionality level <fun>=1 is where power saving is switched off. This is the default after startup. 3.4.2 NON-CYCLIC SLEEP Mode (AT+CFUN=0) If level 0 has been selected (AT+CFUN=0), the serial interface is blocked. The module shortly deactivates power saving to listen to a paging message sent from the base station and then immediately resumes power saving. Level 0 is called NON-CYCLIC SLEEP mode, since the serial interface is not alternatingly made accessible as in CYCLIC SLEEP mode. The first wake-up event fully activates the module, enables the serial interface and terminates the power saving mode. In short, it takes BGS12 back to the highest level of functionality

<fun>=1. In NON-CYCLIC mode, the falling edge of the RTS0 or RTS1 lines wakes up the module to

<fun>=1. To efficiently use this feature it is recommended to enable hardware flow control

(RTS/CTS handshake) as in this case the CTS line notifies the application when the module is ready to send or receive characters. See Section 3.4.7.1 for details. 3.4.3 CYCLIC SLEEP Mode AT+CFUN=7 The functionality level AT+CFUN=7 is referred to as CYCLIC SLEEP modes. The major benefit of all CYCLIC SLEEP modes is that the serial interface remains accessible, and that, in inter-

mittent wake-up periods, characters can be sent or received without terminating the selected mode. The CYCLIC SLEEP modes give you greater flexibility regarding the wake-up procedures. For example, in all CYCLIC SLEEP modes, you can enter AT+CFUN=1 to permanently wake up the module. In mode CFUN=7, BGS12 automatically resumes power saving, after you have sent or received a short message, made a call or completed a GPRS transfer. Please refer to BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Table 9 for a summary of all modes. 36 of 109 Page The CYCLIC SLEEP mode is a dynamic process which alternatingly enables and disables the serial interface. By setting/resetting the CTS signal, the module indicates to the application whether or not the UART is active. The timing of CTS is described below. Both the application and the module must be configured to use hardware flow control (RTS/

CTS handshake). The default setting of BGS12 is AT\Q0 (no flow control) which must be altered to AT\Q3. See [1] for details. Note: If both serial interfaces ASC0 and ASC1 are connected, both are synchronized. This means that SLEEP mode takes effect on both, no matter on which interface the AT command was issued. Although not explicitly stated, all explanations given in this section refer equally to ASC0 and ASC1, and accordingly to CTS0 and CTS1. 3.4.4 CYCLIC SLEEP Mode AT+CFUN=9 Mode AT+CFUN=9 is similar to AT+CFUN=7, but provides two additional features:

The time the module stays active after RTS was asserted or after the last character was sent or received, can be configured individually using the command AT^SCFG. Default setting is 2 seconds like in AT+CFUN=7. The entire range is from 0.5 seconds to 1 hour, selectable in tenths of seconds. For details see [1]. RTS0 and RTS1 are not only used for flow control (as in mode AT+CFUN=7), but also cause the module to wake up temporarily. See Section 3.4.7.1 for details. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 3.4.5 Timing of the CTS Signal in CYCLIC SLEEP Modes 37 of 109 Page The CTS signal is enabled in synchrony with the modules paging cycle. It goes active low each time when the module starts listening to a paging message block from the base station. The timing of the paging cycle varies with the base station. The duration of a paging interval can be calculated from the following formula:

4.616 ms (TDMA frame duration) * 51 (number of frames) * DRX value. DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals from 0.47 to 2.12 seconds. The DRX value of the base station is assigned by the network operator. Each listening period causes the CTS signal to go active low: If DRX is 2, the CTS signal is activated every 0.47 seconds, if DRX is 3, the CTS signal is activated every 0.71 seconds and if DRX is 9, the CTS signal is activated every 2.1 seconds. The CTS signal is active low for 5ms. This is followed by another 5ms UART activity. If the start bit of a received character is detected within these 10ms, CTS will be activated and the pro-

per reception of the character will be guaranteed. CTS will also be activated if any character is to be sent. After the last character was sent or received the interface will remain active for another 2 seconds, if AT+CFUN=7 or for an individual time defined with AT^SCFG, if AT+CFUN=9. Assertion of RTS has the same effect. In the pauses between listening to paging messages, while CTS is high, the module resumes power saving and the AT interface is not accessible. See Figure 10 and Figure 11. Figure 10: Timing of CTS signal (example for a 2.12 s paging cycle) Figure 11 illustrates the CFUN=7 modes, which reset the CTS signal 2 seconds after the last character was sent or received. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 38 of 109 Page Figure 11: Beginning of power saving if CFUN=7 3.4.6 Power Saving in OFF-state When the BGS12 is powered off, and the BATT+BB, BATT+RF lines are supplied, the OFF-

current can be lesser than 100uA (VBATT+ =4.2V). Detail power off state supply current of IBATT+ is shown in Table 27. If the power-off current is a concern, it is suggested to use a MOSFET as a switch to reduce the 100uA (VBATT+ =4.2V) current to the quiescence current of the MOS- FET. The figure below shows an external application circuit that provides the possibility to dis-

connect the modules BATT+ lines from the external applications power supply. The MOSFET transistor (T8) should have an RDS_ON value < 50m in order to minimize voltage drops. This circuit can also be used to reset the module in case it becomes unresponsive, or to completely switch off and restart the module after a firmware update. Afterwards the module can be restarted using the ON signal as described in Section 3.3.1.1. Figure 12: Power Saving in OFF-state BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 3.4.7 Wake up BGS12 from SLEEP Mode 39 of 109 Page A wake-up event is any event that causes the module to draw current. Depending on the selected mode the wake-up event either switches SLEEP mode off and takes BGS12 back to AT+CFUN=1, or activates BGS12 temporarily without leaving the current SLEEP mode.

= BGS12 exits SLEEP mode and returns to AT+CFUN=1. Definitions of the state transitions described in Table 9:

Quit Temporary = BGS12 becomes active temporarily for the duration of the event and the mode specific follow-up time after the last character was sent or received on the serial interface. No effect = Event is not relevant in the selected SLEEP mode. BGS12 does not wake up. Table 9: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes Event Selected mode AT+CFUN=0 No effect Quit + flow control Selected mode AT+CFUN=7 or 9 No effect Mode 7: No effect, RTS is only used for flow control Mode 9: Tem-

porary + flow control Ignition line RTS0 or RTS11)

(falling edge) Unsolicited Result Code (URC) Incoming voice or data call Any AT command

(incl. outgoing voice or data call, outgoing SMS) Incoming SMS depending on mode sel-

ected by AT+CNMI:

AT+CNMI=0,0 (= default, no indication of received SMS) Quit Quit Not possible

(UART disabled) No effect Quit Temporary Temporary Temporary No effect Temporary AT+CNMI=1,1 (= displays URC upon re-

ceipt of SMS) GPRS data transfer AT+CFUN=1 Not possible

(UART disabled) Not possible

(UART disabled) Temporary Quit 1. See Section Section 3.4.7.1 on wake-up via RTS. 3.4.7.1 Wake-up via RTS0 and RTS2 (if AT+CFUN=0 or AT+CFUN=9) During the CYCLIC SLEEP mode 7, the RTS0 and RTS2 lines are conventionally used for flow control: The assertion of RTS0 or RTS2 indicates that the application is ready to receive data without waking up the module. If the module is in CFUN=0 mode the assertion of RTS0 and RTS2 serves as a wake-up event, giving the application the possibility to intentionally terminate power saving. If the module is in CFUN=9 mode, the assertion of RTS0 or RTS2 can be used to temporarily wake up BGS12 for the time specified with the AT^SCFG command (default = 2s). In both cases, if RTS0 or RTS2 is asserted while AT+CFUN=0 or AT+CFUN=9 is set, there may be a short delay until BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents the module is able to receive data again. This delay depends on the current module activities (e.g. paging cycle) and may be up to 60ms. The ability to receive data is signalized by CTS0 and CTS2. It is therefore recommended to enable RTS/CTS flow control, not only in CYCLIC SLEEP mode, but also in NON-CYCLIC SLEEP mode. 40 of 109 Page 3.5 Summary of State Transitions (except SLEEP Mode) The table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes) Table 10: State transitions of BGS12 (except SLEEP mode) Further mode Power Down Normal mode Present mode Power Down mode

---

ON >2s at VDDLP level Normal mode AT^SMSO

---

Normal mode EMERG_RST > 1ms EMERG_RST > 1ms And ON has always been at VDDLP level 3.6 RTC Backup The internal Real Time Clock of BGS12 is supplied from a separate voltage regulator in the power supply component which is also active when BGS12 is in Power Down mode and BATT+ is available. In addition, you can use the VDDLP pad to backup the RTC from an external capacitor. The capacitor is charged from the internal LDO of BGS12. If the voltage supply at BATT+ is dis-

connected the RTC can be powered by the capacitor. The size of the capacitor determines the duration of buffering when no voltage is applied to BGS12, i.e. the greater the capacitor the longer BGS12 will save the date and time. The RTC can also be supplied from an external battery (rechargeable or non-chargeable). In this case the electrical specification of the VDDLP pad (see Section 5.4) has to be taken in to account. 3.7 SIM/USIM Interface The baseband processor has an integrated SIM/USIM card interface compatible with the ISO/

IEC 7816 IC Card standard. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads are reserved for the SIM interface. BGS12 supports and automatically detects 3.0V as well as 1.8V SIM cards. 3.7.1 Single SIM/USIM Card Application The CCIN pad serves to detect whether a tray is present in the card holder. Using the CCIN pad is mandatory for compliance with the 3GPP TS 11.11 (Rel.99) recommendation if the me-

chanical design of the host application allows the user to remove the SIM card during operation. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Table 11: Signals of the SIM interface (SMT application interface) Signal CCCLK Chipcard clock, various clock rates can be set in the baseband processor. 41 of 109 Page Description The total capacitors on CCCLK should be less than 12pF. Some device which connect with CCCLK, have the equivalent capacitors, such as the ESD com-

ponent and analogue switch IC. When selecting such component, one should calculate equivalent capacitors of all device, and make sure they are less than 12pF. CCVCC SIM supply voltage from PSU-ASIC CCIO CCRST Chipcard reset, provided by baseband processor CCIN Serial data line, input and output. Input on the baseband processor for detecting a SIM card tray in the holder. The default level of CCIN is low (internal pull down resistor, no card inserted). It will change to high level when the card is inserted. To take advantage of this feature, an appropriate contact is required on the cardholder. Ensure that the cardholder on your application platform is wired to output a high signal when the SIM card is present. The CCIN pad is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN pad is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of BGS12. The figure below shows a circuit to connect an external SIM card holder. Figure 13: External SIM card holder circuit It is recommended that the total cable length between SMT application interface pads on BGS12 and the connector of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC com-

BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents pliance. To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach would be to use a separate SIM card ground connection to shield the CCIO line from the CCCLK line. A GND line may be employed for such a case. 42 of 109 Page Notes: The total capacitors on CCCLK should be less than 12pF. Some device which connect with CCCLK, have the equivalent capacitors, such as the ESD component and analogue switch IC. When selecting such component, one should calculate equivalent capacitors of all device, and make sure they are less than 12pF. No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initialising any SIM card that the user inserts after having removed a SIM card during operation. In this case, the application must restart BGS12. If using a SIM card holder without detecting contact please be sure to switch off the module before removing the SIM Card or inserting a new one. 3.7.2 Dual SIM/USIM Card Application BGS12 can support dual SIM card by add a dual SIM card analog switch IC (for details see

[7]). 3.8 Serial Interface ASC0 BGS12 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITUT V.28. The voltage level of the ASC0 interface is at 2.8V. As the 2.8V voltage level is not supported by Gemalto M2M 3G modules, it is recommended to use the 1.8V level convertor in case a migration to these modules is intended. For electrical characteristics of the interface signals please refer to Section 5.4. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 43 of 109 Page Module Voltage domain VDIG(2.8V) r o t c e n n o c d r a o b

-

o t

-

d r a o B ASC0 ASC1 ASC2 GPIOs Serial inrterface ASC0 Serial inrterface ASC1 Serial inrterface ASC2 GPIOs Figure 14: VDIG power supply domain BGS12 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 15: Serial interface ASC0 BGS12 HID_V00.915 Confidential / Released 2019-01-07 44 of 109 Page CINTERION BGS12 Hardware Interface Description Contents Features:

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. ASC0 is primarily designed for controlling voice calls, GPRS data and for controlling the GSM module with AT commands. The DTR0 signal will only be polled once per second from the internal firmware of BGS12. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. See [1] for details on how to configure the RING0 line by AT^SCFG. Configured for 8 data bits, no parity and 1 stop bit. Autobauding supports bit rates from 4,800 bps to 230,400 bps. Supports RTS0/CTS0 hardware flow control. Table 12: DCE-DTE wiring of ASC0 V.24 circuit DCE DTE Pad function Signal direction Pad function Signal direction 103 104 105 106 108/2 107 109 125 The following figure shows the startup behavior of the asynchronous serial interface ASC0. TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 Output Input Output Input Output Input Input Input Input Output Input Output Input Output Output Output TXD RXD RTS CTS DTR DSR DCD RING BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 45 of 109 Page For output and input states see Table 7 Figure 16: ASC0 startup behavior Please note that no data must be sent over the ASC0 interface before the interface is active and ready to receive data (see Section 3.3.1.1). BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 46 of 109 Page 3.9 Serial Interface ASC1 BGS12 offers a 2-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-

T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITUT V.28. The electrical level of the ASC1 interface is set to 2.8V. For electrical characteristics please refer to Table 20. BGS12 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 17: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1. For firmware upgrading and tracing purpose. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rate at 921,600 bps. Autobauding is not supported on ASC1. Table 13: DCE-DTE wiring of ASC1 V.24 circuit 103 104 The following figure shows the startup behavior of the asynchronous serial interface ASC1. Signal direction Input Output DTE Line function Signal direction TXD RXD Output Input DCE Line function TXD1 RXD1 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 47 of 109 Page For output and input states see Table 7 Figure 18: ASC1 startup behavior 3.10 Serial Interface ASC2 BGS12 offers a 4-wire unbalanced, asynchronous modem interface ASC2 conforming to ITU-

T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITUT V.28. The electrical level of the ASC2 interface is set to 2.8V. For electrical characteristics please refer to Table 20. BGS12 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD2 signal line Port RXD @ application receives data from the modules RXD2 signal line Figure 19: Serial interface ASC2 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 48 of 109 Page Features Includes only the data lines TXD2 and RXD2 plus RTS2 and CTS2 for hardware hand-

shake. On ASC2 no RING line is available. The indication of URCs on the second interface depends on the settings made with the AT^SCFG command. For details refer to [1]. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC2 can be operated at fixed bit rates from 4,800 bps to 230,400 bps. Autobauding is not supported on ASC2. Supports RTS2/CTS2 hardware flow control. Table 14: DCE-DTE wiring of ASC2 V.24 circuit 103 104 105 106 The following figure shows the startup behavior of the asynchronous serial interface ASC2. DTE Line function Signal direction TXD RXD RTS CTS Output Input Output Input DCE Line function TXD2 RXD2 RTS2 CTS2 Signal direction Input Output Input Output For output and input states see Table 7 Figure 20: ASC2 startup behavior BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 49 of 109 Page 3.11 Analog Audio Interface BGS12 has an analog audio interface with a balanced analog microphone input and a ba-

lanced analog earpiece output. A supply voltage is provided at dedicated pad. BGS12 offers four audio modes which can be selected with the AT^SNFS command. The electrical characteristics of the voice band part vary with the audio mode. For example, sending and receiving amplification, side tone paths, noise suppression etc. depend on the selected mode and can be altered with AT commands. Please refer to Section 5.6 for specifications of the audio interface and an overview of the audio parameters. Detailed instructions on using AT commands are presented in [1]. Table 30 summarizes the characteristics of the various audio modes and shows what parameters are supported in each mode. When shipped from factory, all audio parameters of BGS12 are set to default audio mode. 3.11.1 Microphone Inputs and Supply The differential microphone inputs MICP and MICN present an impedance of 2kOhm and must be decoupled by capacitors (typical 100nF). A regulated power supply for electret micro-

phones is available at VMIC. The voltage at VMIC is rated at 1.8V and available while audio is active (e.g., during a call). It can also be controlled by AT^SNFM. It is recommended to use an additional RC-filter if a high microphone gain is necessary. The following figures show possible microphone and line connections. Figure 21: Single ended microphone connection BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 50 of 109 Page Figure 22: Differential Microphone connection Figure 23: Line Input 3.11.2 Loudspeaker Output BGS12 provides a differential loudspeaker output EPP/EPN. If it is used as line output (see Figure 25), the application should provide a capacitor decoupled differential input to elimi-

nate GSM humming. A first order low pass filter above 4 kHz may be useful to improve the out-

of-band signal attenuation. A single ended connection to a speaker or a line input should not be realized. The following figures show the typical output configurations. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Figure 24: Differential loudspeaker connection 51 of 109 Page Figure 25: Line output connection BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 52 of 109 Page 3.12 I2S Interface BGS12 offers a I2S interface with 4 lines. These signals are shared with IISDO, IISLRCK, IISDI, IISCLK pads. Normal I2S master mode supports:

16 bits word, linear. Mono interface. Sample:<I2S_sample_rate>parameter. I2S runs in normal I2S long alignment mode. I2S word alignment signal always runs at the <I2S_sample_rate> and synchronizes 2 channel (timeslots on word alignment high, word alignment low). I2S transmit data is composed of 16 bit words, dual mono (the words are written on both channels). Data are in 2s complement notation. MSB is transmitted first. The bits are written on I2S clock rising or falling edge (configurable). I2S receive data is read as 16 bit words, mono (words are read only on the timeslot with WA high). Data is read in 2s complement notation. MSB is read first. The bits are read on the I2S clock edge opposite to I2S transmit data writing edge (configurable). I2S clock frequency is 16 bits x 2 channels x <I2S_sample_rate>. MSB can be 1 bit delayed or non-delayed on I2S word alignment edge. I2S transmit data can change on rising or falling edge of I2S clock signal. I2S receive data are read on the opposite front of I2S clock signal. 3.13 GPIO Interface BGS12 offers a GPIO interface with 6 GPIO lines. Some GPIO lines are shared with other interfaces, such as I2C interface (see Section 3.14), Status LED (see Section 3.16), and the jamming indicator (see Section 3.15). All functions are controlled by dedicated AT commands. The following table shows the configuration variants of the GPIO pads. All variants are mutually exclusive, i.e. a pad configured as GPIO is locked for alternative use. Table 15: GPIO assignment GPIO GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 I2C I2CCLK I2CDAT Status LED Status LED Jamming indicator Voltage domain VDIG(=2.8V) VDIG(=2.8V) VDIG(=2.8V) VDIG(=2.8V) VDIG(=2.8V) VDIG(=2.8V) Each GPIO line can be configured for use as input or output. The default function is reserved in present software, the GPIO related AT commands will be developed in the future, please pay attention to the newest released note. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents When the BGS12 starts up, all GPIO lines states are described in Section 3.3.3. Therefore, it is recommended to connect external pull-up or pull-down resistors to all GPIO lines you want to use as output. 53 of 109 Page The power supply domain voltage level for GPIO5 to GPIO10 is 2.8V. I2CCLK (GPIO9) and I2CDAT (GPIO10) require an external pull-up resistor. The following figure shows the startup behavior of the GPIO interface. For output and input states see Table 7 Figure 26: GPIO startup behavior BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 54 of 109 Page 3.14 I2C Interface The signal lines of the I2C interface are shared with the GPIO9 and GPIO10 signal pads. The power supply domain voltage level for 2.8V, the I2C interface pads voltage level (see Figure 14). I2C is a serial data transfer bus. Only normal (100kbps) and fast modes (400kbps) are supported. It consists of two lines, the serial data line I2CDAT (GPIO10) and the serial clock line I2CCLK (GPIO9). The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bidirectional line. Each device connected to the bus is software addressable by a unique 7- bit address, and simple master/slave relationships exist at all times. The module operates as master- transmitter or as master receiver. The customer application transmits or receives data only on request of the module. In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage via a pull-

up resistor. For electrical characteristics please refer to Table 22. Figure 27: I2C interface connected to VCC of application Figure 28: I2C interface connected to VDIG BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. The timing of TSU:STO and SHD:STA has deviation from the I2C specification but the I2C interface do work properly with slave devices as verified. The deviation cannot be changed due to limitation on the chipset. 55 of 109 Page The following figure shows the startup behavior of the I2C interface. 3.14.1 I2C Interface on DSB75 Figure 29: I2C startup behavior To evaluate the I2C interface employing the DSB75, some modifications are required on the AH6-DSB75 adapter mentioned in Section 9.1. Four components will have to be populated on the adapter: D305 (I2C EEPROM, SOIC-8, 1V8; a suitable EEPROM type would for example be "AT24C1024BN-SH-T" from ATMEL), C300 (decoupling capacitor, 0402 package), R301, R302 (I2C pull-up resistors, 0402 package). For details see Figure 30. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 56 of 109 Page 1.8V 2K I2C EEPROM VI2C 1 A0 2 A1 3 A2 4 GND VCC 8 NC 7 SCL 6 SDA 5 C300 100n I2CCLK_A I2CDAT_A R302 4K7 R301 4K7 VI2C Capacitor Resistors EEPROM Figure 30: Additional EEPROM to enable usage of I2C interface on DSB75 Furthermore, two jumpers (X171, for pins 7&8, 9&10) must be set in order to connect the module's I2C signals with the memory device's input pins. For details see Figure 31. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 57 of 109 Page X171 1 2 3 4 5 6 7 8 9 10 11 12 13 14 R100 1K IGT DCD0 I2CCL I2CCK I2CD I2CD RESE VSIM CCIO CCCLK CCRST X170 CCVCC CCVPP CCIO CCCLK CCRST GND CCDET1 CCDET2 1 5 6 3 2 4 7 8 C110 220n C111 1n Jumper settings Figure 31: Jumper settings to enable usage of I2C interface on DSB75 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 58 of 109 Page 3.15 Jamming Indicator The GPIO6 interface line can be configured as a jamming indicator by AT command. When possible jamming is detected by the module, GPIO6 is set to high level. This state lasts as long as possible jamming is detected. By default, the jamming indicator feature is disabled. It has to be enabled using the AT com-

mand AT^SCFG "MEopMode/JamDet/If". For details see [1]. 3.16 Status LED The GPIO5 line at the SMT application interface can be configured to drive a status LED which indicates different operating modes of the module (for GPIOs see Section 3.13). GPIO and LED functionality are mutually exclusive. To take advantage of this function connect an LED to the GPIO5/LED line as shown in Figure 32. The LED can be enabled/disabled by AT command. For details refer to [1]: AT^SSYNC. Figure 32: Status signalling with LED driver 3.17 Behavior of the RING0 Line (ASC0 Interface only) The RING0 line is available on the first serial interface (ASC0). The signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). Although not mandatory for use in a host application, it is strongly suggested that you connect the RING0 line to an interrupt line of your application. In this case, the application can be de-

signed to receive an interrupt when a falling edge on RING0 occurs. This solution is most effective, particularly, for waking up an application from power saving. Note that if the RING0 line is not wired, the application would be required to permanently poll the data and status lines of the serial interface at the expense of a higher current consumption. Therefore, uti-

lizing the RING0 line provides an option to significantly reduce the overall current consump-

tion of your application. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 59 of 109 Page The behavior of the RING0 line varies with the type of event:

When a voice call comes in the RING0 line goes low for 1s and high for another 4s. Every 5 seconds the ring string is generated and sent over the RXD0 line. If there is a call in progress and call waiting is activated for a connected handset device, the RING0 line switches to ground in order to generate acoustic signals that indicate the waiting call. Figure 33: Incoming voice call Likewise, when a data is received, RING0 goes low. However, in contrast to voice calls, the line remains low. Every 5 seconds the ring string is generated and sent over the RXD0 line. Figure 34: incoming data receive All other types of Unsolicited Result Codes (URCs) also cause the RING0 line to go low, however for 1 second only. Figure 35: URC transmission 3.18 Power Indication Circuit In Power Down mode the maximum voltage at any digital or analog interface line must not exceed +0.3V (see also Section 5.1). Exceeding this limit for any length of time might cause permanent damage to the module. It is therefore recommended to implement a power indication signal that reports the modules power state and shows whether it is active or in Power Down mode. While the module is in Power Down mode all signals with a high level from an external application need to be set to BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 60 of 109 Page low state or high impedance state. The sample power indication circuit illustrated in Figure 36 denotes the modules active state with a low signal and the modules Power Down mode with a high signal or high impedance state. Figure 36: Power indication circuit BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 61 of 109 Page 3.19 Fast Shutdown BGS12 provides a dedicated fast shutdown signal. The FAST_SHTDWN line is an active low control signal and it is recommended to be applied for at least 10 milliseconds. If unused this pin can be left open because of a configured internal pull-up resistor. By default, the fast shutdown feature is disabled. It has to be enabled using the AT command AT^SCFG "MEShutdown/Fso". For details see [1]. If enabled, a low impulse >10 milliseconds on the FAST_SHTDWN line starts the fast shut-

down. The fast shutdown procedure still finishes any data activities on the module's flash file system, thus ensuring data integrity, but will no longer deregister gracefully from the network, thus saving the time required for network deregistration. Please note that if enabled, the normal software controlled shutdown using AT^SMSO will also be a fast shutdown, i.e., without network deregistration. However, in this case no URCs including shutdown URCs will be provided by the AT^SMSO command. System shutdown BATT+BB BATT+RF VDDLP FST_SHDN ON EMERG_RST VDIG 200ms Figure 37: Fast Shutdown timing BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 62 of 109 Page 4 Antenna Interface The RF interface has an impedance of 50. BGS12 is capable of sustaining a total mismatch at the antenna lines without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiat-

ed power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the BGS12 module and should be placed in the host application if the an-

tenna does not have an impendance of 50. Regarding the return loss BGS12 provides the following values in the active band:

Table 16: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit

> 8dB not applicable 4.1 Antenna Installation

> 12dB

> 12dB 53 54 55 56 57 58 59 60 61 62 63 64 65 66 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 GND 250 100 101 102 103 104 105 106 249 RF_OUT 251 93 94 95 96 97 98 99 248 GND 89 85 81 90 86 82 91 87 83 92 88 84 252 74 75 245 67 68 76 69 77 70 78 71 79 72 80 247 73 246 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 33 32 31 30 29 28 27 26 25 24 23 22 21 20 The antenna is connected by soldering the antenna pad (RF_OUT, i.e., pad #59) and its neigh-

boring ground pads (GND, i.e., pads #58 and #60) directly to the applications PCB. The an-

tenna pad is the antenna reference point (ARP) for BGS12. All RF data specified throughout this document is related to the ARP. Figure 38: Antenna pads (bottom view) BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 63 of 109 Page The distance between the antenna RF_OUT pad (#59) and its neighboring GND pads (#58,

#60) has been optimized for best possible impedance. On the application PCB, special atten-

tion should be paid to these 3 pads, in order to prevent mismatch. The wiring of the antenna connection line, starting from the antenna pad to the application an-

tenna should result in a 50 line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCBs layer stack. Some examples are given in Section 4.2 . To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. Please see Section 4.2.1 for an example. For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to BGS12s antenna pad. 4.2 RF Line Routing Design 4.2.1 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software). 4.2.1.1 Embedded Stripline This below figure shows a line arrangement example for embedded stripline with 65m FR4 prepreg (type: 1080) and 710m FR4 core (4-layer PCB). Figure 39: Embedded Stripline with 65m prepreg (1080) and 710m core BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 64 of 109 Page 4.2.1.2 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 40: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 65 of 109 Page Application board Ground line Antenna line Ground line Figure 41: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 66 of 109 Page Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 42: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 67 of 109 Page Application board Ground line Antenna line Ground line Figure 43: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 68 of 109 Page 4.2.2 Routing Example 4.2.2.1 Interface to RF Connector Figure 44 shows the connection of the modules antenna pad with an application PCBs coaxial antenna connector. Please note that the BGS12 bottom plane appears mirrored, since it is viewed from BGS12 top side. By definition the top of customer's board shall mate with the bottom of the BGS12 module. Figure 44: Pouting to applications RF connector - top view BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 69 of 109 Page 5 Electrical Reliability and Radio Characteristics 5.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 17 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to BGS12. Table 17: Absolute maximum ratings Parameter Supply voltage BATT+BB, BATT+RF Voltage at all digital lines in Power Down mode Voltage at digital lines VDIG domain (2.8V) in normal operation Voltage at SIM interface, CCVCC 1.8V in normal Operation Voltage at SIM interface, CCVCC 3.0V in normal Operation Voltage at analog lines in normal operation Voltage at analog lines in Power Down mode VDDLP Min

-0.3

-0.3

-0.3

-0.3

-0.3

-0.3

-0.3

-0.3 5.2 Operating Temperatures Max

+5

+0.3

+3.3

+2.2

+3.3

+3.0

+0.3

+3.6 Unit V V V V V V V V Please note that the modules lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the restricted temperature range. A special URC reports whether the module enters or leaves the restricted temperature range (see [1]; AT^SCTM). Table 18: Board temperature Parameter Normal operation Extended operation Automatic shutdown1 Temperature measured on BGS12 board Min

-20

-40

<-40 Typ

+25

---

Max

+85

+90

>+95 Unit C C C 1. Due to temperature measurement uncertainty, a tolerance of 3C on the thresholds may occur. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 70 of 109 Page See also Section 3.3.5.1 for information about the NTC for on-board temperature measure-

ment, automatic thermal shutdown and alert messages. Note that within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and current supply voltage. 5.3 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Standard EN 60068-2-2 Bb ETS 300 019-2-7 DIN IEC 60068-2-30 Db ETS 300 019-2-5 DIN IEC 60068-2-1 Table 19: Summary of reliability test conditions Type of test Vibration Conditions Frequency range: 10 - 20 Hz Acceleration: 5g;

Frequency range: 20 - 500 Hz Acceleration: 5g; Duration:20h per axis; 3 axes Shock half-sinus Acceleration: 25g Shock duration:

6msec 5 shock per axis 6 positions(x, y and z) Temperature: +70 2C Test duration:

16h Humidity in the test chamber: < 50%

Low temperature: -40C 2C High temperature:+85 2C Changeover time:< 30s(dual chamber system) Test duration: 1h Number of repetitions: 24 High temperature: +55C 2C Low temperature: +25C 2C Humidity: 93% 3%

Number of repetitions: 6 Test duration: 12h + 12h Temperature: -40 2C Test duration: 16h Dry heat Temperature change

(shock) Damp heat cyclic Cold (constant exposure) BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 71 of 109 Page 5.4 Pad Assignment and Signal Description The SMT application interface on the BGS12 provides connecting pads to integrate the mod-

ule into external applications. Figure 45 shows the connecting pads numbering plan, the following Table 20 lists the pads assignments. Figure 45: Numbering plan for connecting pads (bottom view) BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Table 20: Pad assignments Signal name Pad no. Signal name Pad no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 VMIC EPN EPP GND BATT+BB GND Do not use ON GND VDIG RXD0 CTS0 TXD0 RING0 RTS0 VDDLP CCRST CCIN CCIO CCVCC CCCLK NC IISDO IISLRCK IISDI IISCLK 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 GPIO10/I2CDAT GPIO9/I2CCLK TXD1 RXD1 Do not use Do not use EMERG_RST GND NC GPIO8 GPIO7 GPIO6/

Jamming Indicator GPIO5/LED FAST_SHTDWN DSR0 DCD0 DTR0 Do not use Do not use Do not use GND GND GND GND GND GND 72 of 109 Page Pad no. Signal name 53 54 55 56 57 58 59 60 61 62 63 64 BATT+RF GND GND GND GND GND RF_OUT GND GND GND GND AGND 65 66 67-97 98 99-106 245 246 247 248 249 250 251 252 MICP MICN GND Do not use GND GND RTS2 CTS2 RXD2 TXD2 GND GND GND 1. The pads 67-106 are centrally located and should be connected to Ground except for pad 98 that is not used. Pad 98 should not be connected to the external appli- cation, but should be left open. Signal pads that are not used should not be connected to an external application. Please note that the reference voltages listed in Table 21 are the values measured directly on the BGS12 module. They do not apply to the accessories connected. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Table 21: Electrical description of application interface IO Signal form and level Function Signal BATT+BB Power supply BATT+RF I VImax = 4.35V VInorm

= 3.8V VImin = 3.2V1 during Tx burst on board GND VDIG Power External supply voltage C C=0 C=2200uF C=4400uF I 2.1A 0.92A 0.62A O C is the capacitor connecting with VBAT pins. I is the peak current of Tx burst at EGSM network. Ground Normal operation: VOnorm

= 2.80V 3%

IOmax = -50mA SLEEP mode Operation:

VOSleep = 2.80V 5%

IOmax = -50mA 73 of 109 Page Comment Lines of BATT+BB or BATT+RF and GND must be connected in parallel for supply purposes because higher peak currents may occur. Minimum voltage must not fall below 3.2V includ-

ing drop, ripple, spikes. Application Ground VDIG may be used for application circuits. If unused keep line open. Not available in Power Down mode. The exter-

nal digital logic must not cause any spikes or glitches on VDIG. Ignition ON I Emergency shutdown EMERG_ RST I RI 1M 15%

VIHmax = VDDLP + 0.5V VIHmin = 1.2V at ~12A VILmax = 0.2V

| _ _ _ _ high impulse VIH max = VBAT VIH min =1.2V VILmax =0.2V

~~|

|~~ low impulse width > 1ms Fast shutdown FAST_S HTDWN I VILmax = 0.84V VIHmin = 1.96V VIHmax = 3.1V

~~|

|~~ low impulse width = 10ms RTC backup VDDLP I/O VOnorm = 3.0V 10%

IOmax = 1.6mA VImax = 3.3V VImin = 2.6V IItyp = 170A This signal switches the module ON. This line must be driven high by an open drain or open collector driver connected to VDDLP. See Section 3.3. This line must be driven low by an open drain or open collector driver con-

nected to GND. If unused keep line open. This line must be driven low. If unused keep line open. It is recommended to use a serial resistor between VDDLP and a possible capacitor. See 3.3.1.1. If unused keep line open. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents SIM card detection CCIN I VIHmin = 1.96V VIHmax= 3.1V VILmax = 0.84V 74 of 109 Page CCIN = High, SIM card inserted. If unused keep line open. 1. The module operates within a voltage level range from 3.4V up to 4.2V without restrictions. It is suggested to supply 3.4V to 4.35V on module. Please add at least 3700uF capacitor to VBAT signal line against GSM burst current while 3.2V to 3.4V supply for BGS12 module. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Table 22: Electrical description of application interface Function Signal CCRST IO Signal form and level O VOLmax = 0.30V VOHmin = 2.40V VOHmax = 3.2V 3V SIM Card Inter-

face 1.8V SIM Card Inter-

face CCIO I/O CCCLK CCVCC CCRST CCIO CCCLK CCVCC O O O I/O O O VILmax = 0.60V VIHmin=1.95V VIHmax = 3.2V VOLmax = 0.30V VOHmin = 2.40V VOHmax = 3.2V VOLmax = 0.30V VOHmin = 2.40V VOHmax = 3.2V VOmin = 2.59V VOtyp = 3.00V VOmax = 3.2V IOmax = 150mA VOLmax = 0.19V VOHmin = 1.5V VOHmax = 2.05V VILmax = 0.57V VIHmin = 1.33V VIHmax = 2.05V VOLmax = 0.19V VOHmin = 1.5V VOHmax = 2.05V VOLmax = 0.19V VOHmin = 1.5V VOHmax = 2.05V VOmin = 1.73V VOtyp = 1.90V VOmax = 2.05V IOmax = 110mA 75 of 109 Page Comment Maximum cable length or copper track to SIM card holder should not exceed 100mm. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Table 23: Electrical description of application interface Function Signal Serial RXD0 Interface ASC0 Signal form and level VOLmax = 0.19V VOHmin = 2.78V VOHmax = 3.1V IO O TXD0 I CTS0 RTS0 RING0 DTR0 DSR0 DCD0 RXD1 TXD1 RXD2 TXD2 RTS2 CTS2 O I O I O O O I O I I O VILmax = 0.84V VIHmin = 1.96V VIHmax = 3.3V VOLmax = 0.19V VOHmin = 2.78V VOHmax = 3.1V VILmax = 0.84V VIHmin = 1.96V VIHmax = 3.3V VOLmax = 0.19V VOHmin = 2.78V VOHmax = 3.1V VILmax = 0.84V VIHmin = 1.96V VIHmax = 3.3V Serial Interface ASC1 Serial Interface ASC2 Table 24: Electrical description of application interface Function Signal I2CCLK I2C I2CDAT Signal form and level VILmax = 0.84V VIHmin = 1.96V VIHmax = 3.1V IO O IO 76 of 109 Page Comment If unused keep line open. If unused keep line open. Comment I2C is configured as pull-up internal and needs a pull-up resistor in the host application. If lines are unused keep lines open. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Table 25: Electrical description of application interface Function Signal GPIO interface IO Signal form and level IO VOLmax = 0.19V GPIO5 IO VOHmin = 1.5V VOHmax = 2.05V GPIO6 IO IO IO GPIO7 GPIO8 GPIO10, i.e., I2CDAT GPIO9, i.e., I2CCLK IO VILmax = 0.57V VIHmin = 1.53V VIHmax = 2.05V Input, Open Drain Output (no Pull up) VILmax = 0.84V VIHmin = 1.96V VIHmax = 3.1V Input, Open Drain Output (no Pull up) VOHmax = 3.1V 77 of 109 Page Comment If unused keep line open. Please note that some GPIO lines can be used for functions other than GPIO:

Status LED line: GPIO5 Jamming Indicator:

GPIO6 I2C: GPIO9/GPIO10. For further details see Section 3.14, Section 3.15, Section 3.16. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents Table 26: Electrical description of application interface Function Analog audio interfac e Signal form and level VOtyp =

1.8V Imax

=0.5 mA Signal VMIC IO O 78 of 109 Page Comment Microphone supply for customer feeding circuits If unused keep line open. EPP EPN MICP MICN O O I I Differential, max 1.3Vrms at 32 load 0.95kHz sine wave Balanced output for earphone or balance output for line out If unused keep line open. ZItyp = 2k Vinmax = 0.3Vrms

(@0dB gain) Balanced differential microphone with external feeding circuit (using VMIC and AGND) or balanced differential line input. Use coupling capacitors. If unused keep lines open. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 79 of 109 Page 5.5 Power Supply Ratings Table 27: Power supply ratings1 Parameter Description BATT+BB BATT+RF Supply voltage IVDDLP Voltage drop during transmit burst OFF state supply current IBATT+

Average supply current Conditions Voltage must stay within the min/ max values, including voltage drop, ripple and spikes. Normal condition, power control level for Pout max RTC backup

@ BATT+ = 0V

@ VDDLP = 3.3V

@ VDDLP = 3.0V

@ VDDLP = 2.8V

@ VDDLP = 2.6V

@ VDDLP = 2.3V

@ VDDLP = 2.0V

@ VDDLP = 1.8V Power Down mode

@ BATT+ =3.8V

@ VDDLP = 3.3V

@ VDDLP = 3.0V

@ VDDLP = 2.8V

@ VDDLP = 2.6V

@ VDDLP = 2.3V

@ VDDLP = 2.0V

@ VDDLP = 1.8V SLEEP mode, GSM1

@ DRX = 2

@ DRX = 9 IDLE mode1 GSM TALK mode GSM GSM 8502 GSM 9002 DCS 18003 PCS 19003 DATA mode GPRS 1 TX, 4 Rx GSM 8502 EGSM 9002 DCS 18003 PCS 19003 DATA mode GPRS 4 TX, 1Rx GSM 8502 EGSM 9002 DCS 18003 PCS 19003 Unit V mV A A mA mA mA mA mA Min Typ Max 3.2 3.8 4.35 400 171 170 169 169 168 167 164 25

-223

-3148

-3144

-3152

-3152

-3152 1.6 0.9 12.6 211.3 210.3 151.7 137.9 201.5 196.4 140.6 127.1 408.5 412.9 300.1 267.2 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents DATA mode GPRS 3 TX, 2Rx GSM 8502 EGSM 9002 DCS 18003 PCS 19003 DATA mode GPRS 2 Tx, 3 Rx GSM 8502 EGSM 9002 DCS 18003 PCS 19003 Table 28:Power supply ratings1 Parameter Description Peak supply IBATT+

current

(during transmission slot every 4.6ms) OFF state supply current Conditions Power Control Level GSM 8502 EGSM 9002 DCS 18003 PCS 19003 80 of 109 Page mA mA 318.4 320.2 238.8 212.7 283.1 284.2 210.8 186.5 Min Typ Max Unit 2.10 2.06 1.18 1.24 A uA 38 1. Measurements start 3 minutes after the module was switched ON,

@ BATT+ =3.8V Power Down mode Averaging times: SLEEP mode 10minutes; TALK mode and DATA mode 5 minutes, IDLE mode 1.5 minutes. Communication tester settings: no neighbour cells, no cell reselection, etc. 2. Power control level PCL 5 3. Power control level PCL 0 BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 81 of 109 Page 5.6 Electrical Characteristics of the Voiceband Part 5.6.1 Setting Audio Parameters by AT Commands The audio modes 1 to 3 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters. Table 29: Audio parameters adjustable by AT command Parameter inBbcGain Range 0...8 Influence to MICP/MICN analog amplifier gain of baseband controller before ADC Digital attenuation of input signal after ADC inCalibrate Gain 0...24dB Calculation 3dB steps

-13...16

-13...16dB outBbcGain EPP/EPN analog output gain of baseband controller after DAC 0...21

-6....15dB 1dB steps outCalibrate[n

] n = 0...4 sideTone Digital attenuation of output signal after speech decoder, before summation of sidetone and DAC present for each volume step[n]

Digital attenuation of sidetone is corrected internally by outBbcGain to obtain a constant sidetone independent of output volume

-26...5

-26...5dB 0...32767

-128dB BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 82 of 109 Page 5.6.2 Audio Programming Model The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The parameters <inBbcGain> and <inCalibrate> can be set with AT^SNFI. All the other para-

meters are adjusted with AT^SNFO. Figure 46: Audio programming model BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 83 of 109 Page 5.6.3 Characteristics of Audio Modes The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. Table 30: Voiceband characteristics (typical) Audio mode no. AT^SNFS=

1 2 Name Purpose User Handset DSB with individual handset Basic Handsfree Car Kit 3 Headset Headset Gain setting via AT command. Defaults:

inBbcGain outBbcGain Sidetone Volume control Echo control

(send) Sidetone gain at default settings Adjustable Adjustable Adjustable 0-24dB

-6-15dB 0-24dB

-6-15dB 0-24dB

-6-15dB Adjustable Adjustable Cancellation Adjustable Adjustable Cancellation Adjustable Adjustable Cancellation

-128dB

-128dB

-128dB Note: With regard to acoustic shock, the cellular application must be designed to avoid sending false AT commands that might increase amplification, e.g. for a high sensitive earpiece. A protection circuit should be implemented in the cellular application. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 84 of 109 Page 5.6.4 Voiceband Receive Path Test conditions:

The values specified below were tested to 0.95kHz and 0dB gain stage, unless otherwise stated. Table 31: Voiceband receive path Parameter Differential output volt-

age (peak to peak) Min Typ 1.3

-6

-26 1.2 16 Differential output gain settings (gs) at 6dB stages (outBbcGain) Fine scaling by DSP

(outCalibrate) Output differential DC offset Differential output load resistance Allowed single ended load capacitance gs = gain setting Max Unit Vrms Test condition/remark 32Ohm, from EPPx to EPNx

+15 dB Set with AT^SNFO

+5 dB Set with AT^SNFO 1.2 32 V gs = 0dB, outBbcGain = 0 and -

6dB from EPP to EPN 100 pF from EPP or EPN to GND BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 85 of 109 Page 5.6.5 Voiceband Transmit Path Test conditions:

The values specified below were tested to 0.95kHz and 0dB gain stage, unless otherwise stated. Table 32: Voiceband transmit path Parameter Min 0

-13 Input voltage (peak to peak) MICP to MICN Input amplifier gain in 6dB steps (inBbcGain)1 Fine scaling by DSP

(inCalibrate) Input impedance MIC Microphone supply voltage Microphone supply current Typ Max Unit Test condition/Remark 0.3 Vrms (@0dB gain) 24 dB Set with AT^SNFI 16 dB Set with AT^SNFI 2 1.8 0.5 k V mA BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 86 of 109 Page 5.7 Antenna Interface Specification Measurement conditions: Tamb= 25C, VBATT+ nom = 4.1V. Table 33: Antenna interface specifications Parameter Min Typ Max Frequency range Uplink

(MS BTS) Frequency range Downlink

(BTS MS) Receiver input sensitivity @ ARP Under all propagation conditions according to GSM specification Receiver input sensitivity @ ARP BER Class II <= 2.43% @ static input level (no fading) RF power @ ARP with 50 load RF Gain 849 915 1785 1910 894 960 1880 1990 34 34 31 31 824 880 1710 1850 869 925 1805 1930

-102

-102

-102

-102 31 31 28 28 GSM 850 E-GSM 900 DCS 1800 PCS 1900 GSM 850 E-GSM 900 DCS 1800 PCS 1900 GSM 850 E-GSM 900 DCS 1800 PCS 1900 GSM 850 E-GSM 900 DCS 1800 PCS 1900 GSM 850 E-GSM 900 DCS 1800 PCS 1900 GSM 850 E-GSM 900 DCS 1800 PCS 1900

-107

-107

-107

-107 32.5 32.5 29.5 29.5 1.0 1.2 2.1 2.7 Unit MHz MHz MHz MHz MHz MHz MHz MHz dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBi dBi dBi dBi BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 87 of 109 Page 5.8 Electrostatic Discharge The GSM module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied through-

out the processing, handling and operation of any application that incorporates a BGS12 module. Special ESD protection provided on BGS12:

SIM interface: Serial resistor and ESD protection diode BGS12 has been tested according to group standard ETSI EN 301 489-1 (see Table 2) and test standard EN 61000-4-2. The measured values can be gathered from the following table. Table 34: Measured electrostatic values Specification/Requirements Contact discharge EN 61000-4-2 SIM interface Antenna interface JEDEC JESD22-A114D (Human Body Model, Test conditions: 1.5 k, 100 pF) ESD at the module 4kV 4kV 8kV 8kV Air discharge 1kV n.a. Note: Please note that the values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Gemalto M2M reference app-

lication described in Chapter 8. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 88 of 109 Page 6 Mechanics, Mounting and Packaging The following sections describe the mechanical dimensions of BGS12 and give recom-

mendation for integrating BGS12 into the host application. Also, a number of files containing product model data in STEP format as well as Gerber data for the external application foot-

print are attached to this PDF. Please open the attachments navigation panel to view and save these files. 6.1 Mechanical Dimensions of BGS12 Figure 47 shows the top and bottom view of BGS12 and provides an overview of the board's mechanical dimensions. For further details see Figure 48. Product label Top view Bottom view Figure 47: BGS12 top and bottom view BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 89 of 109 Page Figure 48: Dimensions of BGS12 (all dimensions in mm) BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 90 of 109 Page 6.2 Mounting BGS12 onto the Application Platform This section describes how to mount BGS12 onto the PCBs (=printed circuit boards), in-

cluding land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integ-

ration see also [3]. 6.2.1 SMT PCB Assembly 6.2.1.1 Land Pattern and Stencil The land pattern and stencil design as shown below is based on Gemalto M2M characterizations for lead-free solder paste on a four-layer test PCB and a 120 respectively 150 micron thick stencil. The land pattern given in Figure 49 reflects the modules pad layout, including signal pads and ground pads (for pad assignment see Section 5.4). Figure 49: Land pattern (top view) The stencil design illustrated in Figure 50 and Figure 51 is recommended by Gemalto M2M as a result of extensive tests with Gemalto M2M Daisy Chain modules. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 91 of 109 Page Note that depending on coplanarity or other properties of the external PCB, it could be that all of the central ground pads may have to be soldered. Figure 50: Recommended design for 120 micron thick stencil (top view) Figure 51: Recommended design for 150 micron thick stencil (top view) BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 92 of 109 Page 6.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT process. Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface mount checks are described in [3]. It is recommended to characterize land patterns before an actual PCB production, taking individual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 6.2.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to de-

crease solder voids, and to increase board level reliability. Daisy chain modules for SMT characterization are available on request. For details refer to

[3]. Generally, solder paste manufacturer recommendations for screen printing process para-

meters and reflow profile conditions should be followed. Maximum ratings are described in Section 6.2.3. 6.2.2 Moisture Sensitivity Level BGS12 comprises components that are susceptible to damage induced by absorbed moisture. Gemalto M2Ms BGS12module complies with the latest revision of the IPC/JEDEC J-STD-

020 Standard for moisture sensitive surface mount devices and is classified as MSL 4. For additional MSL (=moisture sensitivity level) related information see Section 6.2.4 and Section 6.3.2. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 93 of 109 Page 6.2.3 Soldering Conditions and Temperature 6.2.3.1 Reflow Profile Figure 52: Reflow Profile Table 35: Reflow temperature ratings Profile Feature Initial temperature (TI) Average temperature slope (TI to TSmin) Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) Average ramp up rate (TSmax to TP) Liquidous temperature (TL1) Time at liquidous (tR) Peak package body temperature (TP) Time (tP) within 5 C of the peak package body temperature (TP) Average ramp-down rate (TP to TSmax) Time of cold-down (TP to TL2) Time TI to maximum (TI to TP) Pb-Free Assembly 25 C 0.5-2.0 C /second 150C 210C 90-120 seconds 3K/second max. 217C 30-90 seconds 245C +0/-5C 30 seconds max. 6K/second max. 0-60 seconds 8 min max. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 94 of 109 Page 6.2.3.2 Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module:

A maximum module temperature of 245C. This specifies the temperature as measured at the modules top side. A maximum duration of 30 seconds at this temperature. Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded. BGS12 is specified for one soldering cycle only. Once BGS12 is removed from the applica-

tion, the module will very likely be destroyed and cannot be soldered onto another application. 6.2.4 Durability and Mechanical Handling 6.2.4.1 Storage Conditions BGS12 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. Humidity relative: Low Table 36: Storage conditions Type Air temperature: Low High Condition

-25

+40 10 90 at 40C 70 106 Movement of surrounding air 1.0 Water: rain, dripping, icing and frosting Radiation:

High Air pressure: Low High Not allowed Solar Heat 1120 600 Chemically active substances Not Mechanically active substances Vibration sinusoidal:

Displacement Acceleration Frequency range Shocks:

Shock spectrum Duration Acceleration recommended Not recommended 1.5 5 2-9 9-200 mm m/s2 Hz semi-sinusoidal 1 50 ms m/s2 Unit C Reference IPC/JEDEC J-STD-033A

%

kPa m/s

---

IPC/JEDEC J-STD-033A IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4

---

W/m2 ETS 300 019-2-1: T1.2, ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb IEC TR 60271-3-1: 1C1L IEC TR 60271-3-1: 1S1 IEC TR 60271-3-1: 1M2 IEC 60068-2-27 Ea BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 95 of 109 Page 6.2.4.2 Processing Life BGS12 must be soldered to an application within 72 hours after opening the MBB (=mois-

ture barrier bag) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30C and a relative humidity below 60%. 6.2.4.3 Baking Baking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 55 for details):

It is not necessary to bake BGS12, if the conditions specified in Section 6.2.4.1 and Sec-

tion 6.2.4.2 were not exceeded. It is necessary to bake BGS12, if any condition specified in Section 6.2.4.1 and Section 6.2.4.2 was exceeded. If baking is necessary, the modules must be put into trays that can be baked to at least 125C. Devices should not be baked in tape and reel carriers at any temperature. 6.2.4.4 Electrostatic Discharge ESD (=electrostatic discharge) may lead to irreversable damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites. Please refer to Section 5.8 for further information on electrostatic discharge. 6.3 Packaging 6.3.1 Tape and Reel The single-feed tape carrier for BGS12 is illustrated in Figure 53. The figure also shows the proper part orientation. The tape width is 44 mm and the BGS12 modules are placed on the tape with a 28-mm pitch. The reels are 330 mm in diameter with a core diameter of 180 mm. Each reel contains 500 modules. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 96 of 109 Page 6.3.1.1 Orientation Figure 53: Carrier tape Figure 54: Reel direction BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 97 of 109 Page Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 55: Barcode label on tape reel 6.3.2 Shipping Materials BGS12 is distributed in tape and reel carriers. The tape and reel carriers used to distribute BGS12 are packed as described below, including the following required shipping materials:

Moisture barrier bag, including desiccant and humidity indicator card Transportation box 6.3.2.1 Moisture Barrier Bag The tape reels are stored inside an MBB (=moisture barrier bag), together with a humidity indicator card and desiccant pouches - see Figure 56. The bag is ESD protected and delimits moisture transmission. It is vacuum-sealed and should be handled carefully to avoid punctur-

ing or tearing. The bag protects the BGS12 modules from moisture exposure. It should not be opened until the devices are ready to be s oldered onto the application. Figure 56: Moisture barrier bag (MBB) BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 98 of 109 Page The label shown in Figure 57 summarizes requirements regarding moisture sensitivity, includ-

ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. Figure 57: Moisture Sensitivity Label MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-

proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 58. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 99 of 109 Page Figure 58: Humidity Indicator Card HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. 6.3.2.2 Transportation Box Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains 4 reels with 500 modules each. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 100 of 109 Page 7 Sample Application Figure 59 shows a typical example of how to integrate a BGS12 module with an application. Usage of the various host interfaces depends on the desired features of the application. The audio interface demonstrates the balanced connection of microphone and earpiece. This solution is particularly well suited for internal transducers. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The potential interferers may be minimized by placing small capacitors (47pF) at suspected lines

(e.g. RXD0, RXT0, VDDLP, and ON). While developing SMT applications it is strongly recommended to provide test points for certain signals resp. lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [3]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the position of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. Please note that BGS12 is not intended for use with cables longer than 3m. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 59 and the information detailed in this section. As functionality and compliance with national regulations depend to a great amount on the used electronic components and the individual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using BGS12 modules. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 101 of 109 Page Figure 59: Schematic diagram of BGS12 sample application BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 7.1 Blocking against RF on Interface Lines 102 of 109 Page To reduce EMI issues there are serial resistors implemented on the module for the ignition, UART0, UART1 and UART2 lines (cp. Section 5.8). There are 560Ohm serial resist- ors on UART0, UART1 andUART2 lines. However, all other signal lines have no EMI measures on the module and there are no blocking measures at the modules interface to an external applica- tion. Dependent on the specific application design, it might be useful to implement further EMI measures on some signal lines at the interface between module and application. These mea-

sures are described below. There are five possible variants of EMI measures (A-E) that may be implemented between module and external application depending on the signal line (see Figure 60 and Table 37). Pay attention not to exceed the maximum input voltages and prevent voltage overshots if using inductive EMC measures. The maximum value of the serial resistor should be lower than 1kOhm on the signal line. The maximum value of the capacitor should be lower than 50pF on the signal line. Please observe the electrical specification of the module interface and the application interface. Figure 60: EMI circuits BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 103 of 109 Page The following table lists for each signal line at the SMT application interface the EMI measures that may be implemented. Table 37: EMI measures on the application interface Signal name Remark EMI measures A B C x x x CCIN CCRST CCIO CCCLK x x x x x x x RXD0 TXD0 CTS0 RTS0 RING0 DTR0 DCD0 DSR0 RXD1 TXD1 CTS1 RTS1 GPIO5/LED GPIO6/PWM2 GPIO7 GPIO8 GPIO9/I2CCLK GPIO10/I2CDAT V180 V285 VDIG x x x x x x x x x x x x x x x x x x x x x x x x x x x The external capacitor should be not higher than 30pF on CCIO and CCRST signal rail. The total capacitance of external capacitor and TVS diode should be not higher than 12pF on CCCLK signal rail. The value of the capacitor depends on the external application. The serial resistor should be not higher than 33Ohm The rising signal edge is reduced with an additional capacitor. D x x x x x x x x x x x x x x x x x x x x x x E x x x x x x x x x x x x x x x x x BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 104 of 109 Page 8 Reference Approval 8.1 Reference Equipment for Type Approval The Gemalto M2M reference setup submitted to type approve BGS12 is shown in the following figure:

Figure 61: Reference equipment for Type Approva BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 105 of 109 Page 9 Appendix 9.1 List of Parts and Accessories Table 38: List of parts and accessories Description BGS12 Supplier Gemalto M2M DSB75 Evaluation Kit DSB75 adapter for mounting BGS12 evaluation modules BGS12 Evaluation Module Gemalto Gemalto M2M Gemalto M2M M2M Ordering information Standard module Gemalto M2M IMEI:

Ordering number: L30960-N4810-A200 Ordering number: L36880-N8811-A100 Ordering number: L30960-N1801-A100 Ordering number: L30960-N4801-A200 Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0 VOTRONIC Entwicklungsund Produktionsgesellschaft fr elektronische Gerte mbH Saarbrcker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 Email: contact@votronic.com SIM card holder incl. push button ejector and slide-in tray Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 39. BGS12 HID_V00.915 Confidential / Released 2019-01-07 CINTERION BGS12 Hardware Interface Description Contents 106 of 109 Page Table 39: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Email:

mxgermany@molex.com Molex Singapore Pte. Ltd. Molex Japan Co. Ltd. Jurong, Singapore Yamato, Kanagawa, Japan Phone: +65-268-6868 Phone: +81-462-65-2324 Fax: +81-462-65-2366 Molex China Distributors Beijing, Room 1319, Tower B, COFCO No. 8, Jian Guo Men Nei Street, Fax: +65-265-6044 100005 Beijing P.R. China Phone: +86-10-6526-9628 Phone: +86-10-6526-9728 Phone: +86-10-6526-9731 Fax: +86-10-6526-9730 Table 40: Manufacturer address DBG Holdings Limited No.5, Yongda Road, Xiangshui River Industrial Area, Daya Bay, Huizhou, Guangdong, China CINTERION BGS12 Hardware Interface Description Contents 107 of 109 Page 9.2 FCC statement FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: QIPBGS12 Or Contains FCC ID:

QIPBGS12 When the module is installed inside another device, the user manual of the host must contain below warning statements;

2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. 108 of 109 Page 109 of 109 About Gemalto Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2011 annual revenues of 2 billion and more than 10,000 employees operating out of 74 offices and 14 Research & Development centers, located in 43 countries. We are at the heart of the rapidly evolving digital society. Billions of people worldwide increasingly want the freedom to communicate, travel, shop, bank, entertain and work - anytime, everywhere - in ways that are enjoyable and safe. Gemalto delivers on their expanding needs for personal mobile services, payment security, authenticated cloud access, identity and privacy protection, eHealthcare and eGovernment efficiency, convenient ticketing and dependable machine-to- machine (M2M) applications. Gemalto develops secure embedded software and secure products which we design and personalize. Our platforms and services manage these secure products, the confidential data they contain and the trusted end-user services they enable. Our inovations enable our clients to offer trusted and convenient digital services to billions of individuals. Gemalto thrives with the growing number of people using its solutions to interact with the digital and wire-

less world. For more information please visit m2m.gemalto.com, www.facebook.com/gemalto, or Follow@gemaltom2m on twitter. Gemalto M2M GmbH St.-Martin-Str. 60 81541 Munich Germany M2M.GEMALTO.COM

 

 

 

 

 

 

 

 

 

 

CINTERION wassincina Gemalto M2M GmbH

$30960-S5500-A100-1 GSM/GPRS Wireless Module Model: BGS12 mo 5 FCC ID: QIPBGS12 7 CMIIT ID:

XXXXXXXAXK ANATEL:XXXX-XX~ woo ) 12345678 123456 1 DC Be a | bp sald aa lic. 0 3/0 410 5'g 60 710 80 90 a be a LG une ie ie a ta ah a ry a Hi ;

SM intial Ls a YY jm aa OT oT oi x mere ae Mh

 

 

genial[Ox a Thales company Gemalto M2M GmbH . Siemensdamm 50 3629 Berlin . Gerniany Telefication B.V., Dept. FCC TCB Edisonstraat 12A 6902 PK ZEVENAAR The Netherlands THALES Name Axel Heike Department System Test - CerUfications Phone

+49 3031102-8146 Fax +493031102-8305 E-Mail Axel.Heike@gemalto.com Your letter of Our reference Date lOApril2Ol9 Authority to Act as Agent To Whom It May Concern:

BTL Inc. / Abby Lu is authorized to act on our behalf, until otherwise notified, for applications to Telefication B.V. We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862. Further, no party, as defined in 47 CFR 1 .2002 (b), to the application is subject to denial of federal benefits, that includes FCC benefits. Agency Agreement Expiration Date: 12 months Sincerely, Axel Heike Certification Manager Lars Wehmeier Head of System Test www.gemalto.com www.thalesgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Directors: Andreas Haegele, Sbastien Gallois Registered seat: Munich: commercial register Munich, reg.no.: HRB 172715, WEEE-Reg.-Nr. DE58893809

 

 

TECHNICAL COMPLIANCE STATEMENT This is to certify that the product listed in follows was (were) tested in the BTL EMC Laboratory to comply with below FCC official limits. Equipment GSM/GPRS Wireless Module Model Name BGS12 Brand Name CINTERION Applicant Gemalto M2M GmbH Address Gemalto M2M GmbH, Siemensdamm 50 Berlin Germany Standard(s) FCC Part 15, Subpart B ANSI C63.4-2014 BTL-FCCE-1-1902H007 Report No The test data, data evaluation, and equipment configuration contained in our test report(s) above was (were) obtained utilizing the test procedures, test instruments, test sites that has been accredited by the Authority of A2LA according to the ISO/IEC 17025 quality assessment standard and technical standard(s). The test data contained in the referenced test report relate only to the EUT sample and item(s) tested. Vic Chiu Authorized Signatory BTL INC. No. 29, Jintang Road, Tangzhen Industry Park, Pudong New Area, Shanghai 201210,China TEL: +86-021-61765666

 

 

geflialtOx THALES Gemalto M2M GmbH Siemensdamm 50 13629 Berlin . Germany Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 USA Name Axel Heike Department System Test - Certifications Phone +493031102-8146 Fax +493031102-8305 E-Mail Axel.Heike@gemalto.com Your letter of Our reference Date 10 April2019 LONG-TERM CONFIDENTIALITY REQUEST TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, Gemalto M2M GmbH requests confidentiality for the following product:

For the product stated above, we request that the following information be held confidential:

FCC ID Number Product QIPBGSI2 Title/Model BGSI2 1. 2. 3. 4. Block Diagram Schematic Diagram Part List / Tune Up Procedure Operational Description These items contain detailed system and equipment description and related information about the product which Gemalto M2M GmbH considers to be proprietary, confidential and a custom design which otherwise would only be released to qualified tech and is not released to the general public. Since this design is a basis from which future technological product will evolve, Gemalto M2M GmbH also feels that this information would be of benefit to its competitors, and that the disclosure of the information in these exhibits would give our competitors an unfair advantage in the market. Sincerely, Axel Heike Certification Mnager

www.gemalto.com

Lars Wehmeier Head of System Test www.thalesgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Directors: Andreas Haegele, Sbastien Gallois Registered seat: Munich; commercial register Munich, reg.no.: HRB 172715, WEEE-Reg.-Nr. DE58893809

 

 

gemaltO THALES Gemalto M2M GmbH Siemensdamm 50 1 3629 Berlin Gemiany Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 USA Name Axel Heike Department System Test - Certifications Phone +493031102-8146 Fax +493031102-8305 E-Mail Axel.Heike@gemalto.com Your letter of Our reference Date 10 April 2019 SHORT-TERM CONFIDENTIALITY REQUEST TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of term confidentiality for the following product:

Information Act, Gemalto M2M GmbH requests short the Freedom of For the product stated above, we request that the following information be held confidential:

FCC ID Number Product QIPBGSI2 Title/Model BGSI2 1. 2. 3. External and Internal Photographs Test Setup Photos User Manual Gemalto M2M GmbH requests this confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device, which is planned for 30th0f Jul 2019. If you have any questions, please feel free to contact us at the address shown above. Sincerely, Axel Heike Certification Manager Lars Wehmeier Head of System Test www.gemalto.com www.th&esgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Directors: Andreas Haegele, Sebastien Gallois Registered seat: Munich; commercial register Munich, reg.no.: HRB 172715, WEEE-Reg.-Nr. DE58893809

 

 

geiTlaltO Thales company THALES Gemalto M2M GmbH . Siemensdamm 50 13629 Berlin. Germany Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 USA Name Axel Heike Department System Test - Certifications Phone +4930 31102-8146 Fax +493031702-8305 E-Mail Axel.Heike@gemalto.com Your letter of Our reference Date 10 April 2019 Modular Approval Statement FCC Certification Number: QIPBGSJ2 Request for Modular Approval X 47 CFR 15.212 - Modular Transmitters Request for Limited Modular Approval I EUT Conditions Comply (YIN) Requirements Single Modular Approval Requirements The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. The modular transmitter must have its own power supply regulation. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b) and 15.204(c). The antenna 2 3 4 must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of The modular transmitter has its own RE shielding. Please refer to external photos. The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. The modular transmitter has its own power supply regulation. Please refer to PMD9635 in Schematic. The requirements of antenna connector and spurious emissions have been fulfilled. Please refer to Test Report. Y Y Y www.gemaito.com www.thalesgroup.com THALES Gemalto M2M GmbH Werinherstr. 81, 81541 Munich - Germany Managing Directors: Andreas Haegele, Sbastien Gallois Registered seat: Munich; commercial register Munich, reg.no.: HRB 172715, WEEE-Reg.-Nr. DE58893809 gemal[ox 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 15.207. AC or DC power lines and data input/output lines connected to the module must not contain fetrites, unless they will be marketed with the module

(see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see 15.31(i)). The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(A) If using a permanently affixed label, the modular transmitter must be labeled with its own FCC identification number, and, if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL 1 or Contains FCC ID:

XYZMODEL 1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along 5 6 www.gemalto.comlm2m The modular transmitter is tested in a stand-alone configuration. Please refer to Setup Photo. The modular transmitter is labelled with its own FCC ID. Labelling instructions for host devices are stated in the user manual under chapter Compliance with FCC and IC Rules and Regulations Y Y gemal to with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization.

(B) If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the 7 manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. The modular transmitter must comply

. 8 with any applicable RE exposure

. requirements in its final configuration. The modular transmitter complies with any specific rules or operating requirements. Instructions are provided in the user manual. The modular transmitter complies with RF exposure requirements. Please refer to MPE calculation for the exposure information. Y Y If you have any questions, please feel free to contact us at the address shown above. Sincerely Axel Heike Certification Manager Lars Wehmeier Head of System Test www.gemalto.comim2m