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Cinterion ELS31-US/ELS51-US Hardware Interface Overview Version:

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01.000a 2016-12-28 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-

UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NON-

EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIV-

ERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-

tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2016, Gemalto M2M GmbH, a Gemalto Company Trademark Notice Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corpora-

tion in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview Contents 46 Page 3 of 46 Contents 1 2 3 4 5 Introduction ................................................................................................................. 7 Key Features at a Glance .................................................................................. 7 1.1 1.2 ELS31-US/ELS51-US System Overview ......................................................... 10 Interface Characteristics .......................................................................................... 11 Application Interface ........................................................................................ 11 2.1 2.1.1 USB Interface...................................................................................... 11 2.1.2 Serial Interface ASC0 ......................................................................... 12 2.1.3 Serial Interface ASC1 ......................................................................... 13 2.1.4 UICC/SIM/USIM Interface................................................................... 14 2.1.5 GPIO Interface .................................................................................... 16 I2C Interface ........................................................................................ 17 2.1.6 SPI Interface ....................................................................................... 17 2.1.7 2.1.8 Pulse Counter ..................................................................................... 17 2.1.9 HSIC Interface (ELS51-US Only)........................................................ 17 2.1.10 SDIO Interface (ELS51-US Only) ....................................................... 18 2.1.11 Control Signals.................................................................................... 19 2.1.11.1 Status LED .......................................................................... 19 2.1.11.2 Fast Shutdown .................................................................... 19 RF Antenna Interface....................................................................................... 20 2.2.1 Antenna Installation ............................................................................ 21 2.2.2 RF Line Routing Design...................................................................... 22 2.2.2.1 RF Interface Signals Circuit Diagram Example................... 22 2.2.2.2 Line Arrangement Examples ............................................... 23 Sample Application .......................................................................................... 28 2.2 2.3 Operating Characteristics ........................................................................................ 30 3.1 Operating Modes ............................................................................................. 30 Power Supply................................................................................................... 30 3.2 Mechanical Dimensions, Mounting and Packaging............................................... 31 4.1 Mechanical Dimensions of ELS31-US/ELS51-US ........................................... 31 Regulatory and Type Approval Information ........................................................... 33 Directives and Standards................................................................................. 33 5.1 5.2 SAR requirements specific to portable mobiles ............................................... 35 Reference Equipment for Type Approval......................................................... 36 5.3 5.4 Compliance with FCC and IC Rules and Regulations ..................................... 37 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview Contents 46 Page 4 of 46 6 7 Document Information.............................................................................................. 39 Revision History ............................................................................................... 39 6.1 6.2 Related Documents ......................................................................................... 39 Terms and Abbreviations ................................................................................. 39 6.3 6.4 Safety Precaution Notes .................................................................................. 43 Appendix.................................................................................................................... 44 List of Parts and Accessories........................................................................... 44 7.1 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview Tables 46 Page 5 of 46 Tables Table 1:

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Signals of the SIM interface (SMT application interface) ............................... 14 GPIO lines and possible alternative assignment............................................ 16 SDIO interface features.................................................................................. 18 SDIO interface lines ....................................................................................... 18 Return loss in the active band........................................................................ 20 Overview of operating modes ........................................................................ 30 Directives ....................................................................................................... 33 Standards of North American type approval .................................................. 33 Standards of GCF type approval.................................................................... 33 Requirements of quality ................................................................................. 33 Standards of the Ministry of Information Industry of the Peoples Republic of China............................................................................ 34 Toxic or hazardous substances or elements with defined concentration limits............................................................................................................... 34 Antenna gain limits for FCC and IC (TBD)..................................................... 37 List of parts and accessories.......................................................................... 44 Molex sales contacts (subject to change) ...................................................... 45 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview Figures 46 Page 6 of 46 Figures Figure 1:

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ELS31-US/ELS51-US system overview......................................................... 10 USB circuit ..................................................................................................... 11 Serial interface ASC0..................................................................................... 12 Serial interface ASC1..................................................................................... 13 External UICC/SIM/USIM card holder circuit ................................................. 15 RF interface signals example......................................................................... 22 Embedded Stripline with 65m prepreg (1080) and 710m core .................. 23 Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ................ 24 Micro-Stripline on 1.0mm Standard FR4 PCB - example 2............................ 25 Micro-Stripline on 1.5mm Standard FR4 PCB - example 1............................ 26 Micro-Stripline on 1.5mm Standard FR4 PCB - example 2............................ 27 Schematic diagram of ELS31-US/ELS51-US sample application.................. 29 ELS31-US/ELS51-US top and bottom view................................................. 31 Dimensions of ELS31-US/ELS51-US (all dimensions in mm) ....................... 32 Dimensions of ELS31-US/ELS51-US (all dimensions in mm) - bottom view. 32 Reference equipment for Type Approval ....................................................... 36 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 1 Introduction 10 Page 7 of 46 1 Introduction This document1 describes the hardware of the Cinterion ELS31-US and ELS51-US modules. It helps you quickly retrieve interface specifications, electrical and mechanical details and in-

formation on the requirements to be considered for integrating further components. The ELS31-US and ELS51-US modules include a baseband, a complete dual band RF front-

end, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Re-

lease 10 set of specifications). The module variants differentiate a follows:

- ELS31-US provides LTE connectivity with IP Services

- ELS51-US adds a Linux execution environment available for customer applications 1.1 Key Features at a Glance Feature General Frequency bands Output power Power supply Operating temperature

(board temperature) Physical RoHS LTE features 3GPP Release 9 SMS Software AT commands SIM Application Toolkit Firmware update Implementation LTE Triband: B2, B4, B12 Class 3 (+23dBm +-2dB) for LTE 1900, LTE FDD B2 Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4 Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B12 3.3V to 4.5V Normal operation: -30C to +80C Extended operation: -40C to +90C Dimensions: 27.60mm x 18.80mm x 2.05mm Weight: approx. 3g All hardware components fully compliant with EU RoHS Directive DL 10Mbps, UL 5Mbps LTE Cat. 1 data rates Point-to-point MT and MO Text mode Storage in mobile equipment Hayes, 3GPP TS 27.007, TS 27.005, product specific SAT Release 99 Generic update from host application over ASC0 or USB modem OTA over ASC0 and over USB 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Gemalto M2M product. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 1.1 Key Features at a Glance 10 Page 8 of 46 Feature Interfaces Module interface Implementation Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-

ability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4]. This application note comprises chapters on module mounting and application layout issues as well as on SMT application development equipment. USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s) compliant 2 serial interfaces ASC0:

8-wire modem interface with status and control lines, unbalanced, asyn-

chronous Default baud rate: 115,200 baud Adjustable baud rates: 4,800 to 921,600, no autobauding support Supports RTS0/CTS0 hardware flow control. Indication of incoming data/SMS on RING0 (can be used to wake up host from power down modes) 4-wire, unbalanced asynchronous interface ASC1 (shared with GPIO lines):

Default baud rate: 115,200 baud Adjustable baud rates: 4,800bps to 921,600bps Supports RTS1/CTS1 hardware flow control UICC interface Supported SIM/USIM cards: 3V, 1.8V Embedded UICC Module is prepared for an embedded UICC GPIO interface 20 pads of the application interface programmable as GPIO pads (17) or GPO pads (3):

GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, and SPI signal lines Programming is done via AT commands I2C interface Supports I2C serial interface SPI interface Supports SPI interface SDIO HSIC ELS51-US only:

4 wire interface. ELS51-US only:

High Speed Interchip Communication interface. ADC Digitial audio interface Antenna interface pads Analog-to-Digital Converter with one unbalanced analog input. Hardware prepared for future use. 50 LTE main antenna, 50LTE diversity antenna ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 1.1 Key Features at a Glance 10 Page 9 of 46 Feature Power on/off, Reset Power on/off Reset Evaluation kit Evaluation module DSB75 Implementation Switch-on by hardware signal ON Switch-off by AT command Switch off by hardware signal GPIO4/FST_SHDN instead of AT command Automatic switch-off in case of critical temperature and voltage conditions Orderly shutdown and reset by AT command Emergency reset by hardware signal EMERG_RST ELS31-US/ELS51-US module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75. DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the ELS31-US/ELS51-

US evaluation module to the DSB75. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 1.2 ELS31-US/ELS51-US System Overview 10 1.2 ELS31-US/ELS51-US System Overview Page 10 of 46 Module GPIO interface Status FST_SHDN ASC0 ASC1 GPIOs COUNTER SPI ASC0 I2C SPI USB HSIC SDIO SIM interface

(with SIM detection) CONTROL ADC POWER ANTENNA

(LTE dual band) Application LED Fast shutdown Serial modem interface Serial interface GP(I)Os Pulse counter SPI Serial modem interface I2C SPI USB HSIC SDIO SIM card ON Emergency reset ADC Power supply Antenna /

div. Antenna 1 1 4 4 7 1 2 4 2 3 3 3 4 1 5 1 1 1 2 2 Figure 1: ELS31-US/ELS51-US system overview ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2 Interface Characteristics 29 Page 11 of 46 2 Interface Characteristics ELS31-US/ELS51-US is equipped with an SMT application interface that connects to the ex-

ternal application. The SMT application interface incorporates the various application interfac-

es as well as the RF antenna interfaces. 2.1 Application Interface 2.1.1 USB Interface ELS31-US/ELS51-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The VUSB line is used for cable detection only, this is to be supplied by the external device. The USB circuitry in the ELS31-US/ELS51-US is designed to meet the USB 2.0 specification for self-power.2.01. Module VREG (3V075) lin. reg. SMT USB part1) VBUS DP DN Detection only Host wakeup BATT+

GND VUSB_IN USB_DP2) USB_DN2) RING0 1) It is recommended to add EMI suppression filter (see section 2.1.3.1) 2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90Ohm for proper signal integrity. Figure 2: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compat-

ible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with ELS31-US/ELS51-US needs to be installed. 1. The specification is ready for download on http://www.usb.org/developers/docs/

ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.1 Application Interface 29 Page 12 of 46 2.1.2 Serial Interface ASC0 ELS31-US/ELS51-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). ELS31-US/ELS51-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 3: Serial interface ASC0 Features:

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. Configured for 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 4800bps up to 921600bps. Supports RTS0/CTS0 hardware flow control. Communication is possible by using only RXD and TXD lines, if RTS0 is pulled low. Wake up from SLEEP mode by RTS0 activation. The ASC0 interface is dedicated to signaling via AT commands (3GPP standard 27.007 + mod-

ule specific AT commands). ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.1 Application Interface 29 Page 13 of 46 2.1.3 Serial Interface ASC1 ELS31-US/ELS51-US provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows: GPIO16 --> RXD1, GPIO17 --> TXD1, GPIO18 -->

RTS1 and GPIO19 --> CTS1. Configuration is done by AT command (see [1]: AT^SCFG). The configuration is non-volatile and becomes active after a module restart. ELS51-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 4: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake. On ASC1 no RING line is available. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 4800 bps to 921600 bps. Supports RTS1/CTS1 hardware flow control. Communication is possible by using only RXD and TXD lines, if RTS1 is pulled low. Wake up from SLEEP mode by RTS0 activation. AT commands for signaling are not supported on ASC1 interface. ASC1 is intended only for data transfer in a Linux environment. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.1 Application Interface 29 Page 14 of 46 2.1.4 UICC/SIM/USIM Interface ELS31-US/ELS51-US has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. The CCIN signal must be connected to V180 for the detection to work on the module. Other-

wise the SIM card can never be detected by the module. Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during oper-

ation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test-

ed to operate with ELS31-US/ELS51-US and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers. Description Separate ground connection for SIM card to improve EMC. Chipcard clock Table 1: Signals of the SIM interface (SMT application interface) Signal GND CCCLK CCVCC SIM supply voltage. CCIO CCRST CCIN Serial data line, input and output. Chipcard reset Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCIN signal is by default low and will change to high level if a SIM card is inserted. The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of ELS31-US/ELS51-US. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart ELS31-US/ELS51-US. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.1 Application Interface 29 Page 15 of 46 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC CCRST CCIO CCCLK SIM 220nF 1nF Figure 5: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on ELS31-US/ELS51-US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line. The ELS31-US/ELS51-US includes embedded ESD protection for the SIM interface that com-

plies to ETSI EN 301 489-1/7: Contact discharge: 4kV, air discharge: 8kV. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.1 Application Interface 29 Page 16 of 46 2.1.5 GPIO Interface ELS31-US/ELS51-US offers a GPIO interface with 17 GPIO and 3 GPO lines. The lines are shared with other interfaces or functions: Fast shutdown (see Section 2.1.11.2), status LED

(see Section 2.1.11.1), a pulse counter (see Section 2.1.8), ASC0 (see Section 2.1.2), ASC1

(see Section 2.1.3), SPI (see Section 2.1.7), and HSIC (see Section 2.1.9). The following table shows the configuration variants for the GPIO pads. All variants are mutu-

ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage. Table 2: GPIO lines and possible alternative assignment GPIO ASC0 Fast Shutdown Status LED Pulse Counter FST_SHDN LED COUNTER DTR0 DCD0 DSR0 RING0 GPIO1 GPIO2 GPIO3 GPIO4 GPO5 GPIO6 GPIO7 GPIO8 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO22 GPO23 GPIO24 GPIO25 GPO26 GPIO27 ASC1 SPI HSIC RXD1 TXD1 RTS1 CTS1 AP_WAKEUP HOST_ACTIVE CP_WAKEUP SUSPEND SPI_CS1 SPI_CS2 After startup, the above mentioned alternative GPIO line assignments can be configured using AT commands (see [1]). The configuration is non-volatile and available after module restart. Notes:

GPO5, GPO23 and GPO26 are GPOs only. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.1 Application Interface 29 Page 17 of 46 I2C Interface 2.1.6 I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 100kbps. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single mas-

ter device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line. Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relationships exist at all times. The module operates as master-transmitter or as master-receiver. The customer application transmits or receives data only on request of the module. The I2C interface can be powered via the V180 line of ELS31-US/ELS51-US. If connected to the V180 line, the I2C interface will properly shut down when the module enters the Power Down mode. Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. SPI Interface 2.1.7 The ELS31-US/ELS51-US GPIO interface lines can be configured as Serial Peripheral Inter-

face (SPI). The SPI is a synchronous serial interface for control and data transfer between ELS31-US/ELS51-US and the external application. Only one application can be connected to the SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/

s. The SPI interface comprises the two data lines SPI_MOSI and SPI_MISO, the clock line SPI_CLK a well as the chip select lines SPI_CS1 and SPI_CS2. 2.1.8 Pulse Counter The GPIO8 line can be configured as pulse counter line COUNTER (for GPIOs see Section 2.1.5). The pulse counter interface can be used, for example, as a clock - it is designed to mea-

sure signals from 0 to 1000 pulses per second. Note that the pulse counter works in batches of 8 pulses, i.e., the URC indicates the number of pulses counted in batches of 8 pulses. For more information on how to use this feature see [1]. 2.1.9 HSIC Interface (ELS51-US Only) The (USB) High Speed Inter Chip (HSIC) interface can be used between the module and an external application processor, and is compliant to the High Speed USB 2.0 interface with 480Mbit/s. The maximum distance between module processor and external application proces-

sor should not exceed 100mm. The HSIC interface comprises two signal lines (strobe - HSIC_STRB - and data - HSIC_DATA) used in a source synchronous serial interface with a 240MHz clock to provide a 480Mbps USB interface. The HSIC_STRB and HSIC_DATA lines are high-speed signals and should be rout-

ed as 50Ohm impedance traces. The trace length of these signals should be balanced to min-

imize timing skew and be no longer than 100mm. The HSIC interface implementation complies with the USB HSIC standard High-Speed Inter-

Chip USB Electrical Specification, Version 1, September 23, 20071. 1. The USB specifications are ready for download on http://www.usb.org/developers/docs/usb20_docs/

ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.1 Application Interface 29 Page 18 of 46 2.1.10 SDIO Interface (ELS51-US Only) The Secure Digital Input Output (SDIO) interface can be used to for instance connect an SD card. The SDIO interface has the following features:

Table 3: SDIO interface features Feature Interface Type Voltage DMA Mode Number of SLOTs Implement DDR mode Card inserted status SDIOCLK frequency Max block length SDIO interrupt support Description/Value SDIO/SD1 (1 data line), SDIO/SD4 (4 data lines), MMC4 (4 data lines) 1.8 V SDMA / ADMA1 / ADMA2 1 Yes Yes Default Mode: 23 MHz maximum High Speed Mode: 46 MHz maximum UHS-I Mode: 92 MHz 2048 bytes Yes, support SDIO/SD1, SDIO/SD4 mode interrupts Table 4 lists the six SDIO interface lines:

Table 4: SDIO interface lines Signal SDIOCLK SDIOCMD SDIO0 SDIO1 SDIO2 SDIO3 Direction Out I/O I/O I/O I/O I/O Description SD master clock output to SD/MMC/SDIO device. Command line. Data lines. Only SDIO0 carries data in 1-bit SD mode, SDIO0..3 carry data in 4-bits mode. SDIO interrupt is multiplexed with SDIO1. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.1 Application Interface 29 Page 19 of 46 2.1.11 Control Signals Status LED 2.1.11.1 The LED line can also be configured as GPO5 line, and can be used to drive a status LED that indicates different operating modes of the module (for GPOs see Section 2.1.5). LED and GPO functionality are mutually exclusive. Fast Shutdown 2.1.11.2 The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-

figured FST_SHDN line is an active low control signal. If enabled, a low impulse of 10 millisec-

onds on the FST_SHDN line starts the fast shutdown procedure.The fast shutdown procedure still finishes any data activities on the modules flash file system, thus ensuring data integrity, but the module will no longer deregister gracefully from the network. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.2 RF Antenna Interface 29 Page 20 of 46 2.2 RF Antenna Interface The RF interface has an impedance of 50. ELS31-US/ELS51-US is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the ELS31-US/ELS51-US module and should be placed in the host application if the antenna does not have an impedance of 50. Regarding the return loss ELS31-US/ELS51-US provides the following values in the active band:

Table 5: Return loss in the active band State of module Receive Transmit Return loss of module

> 8dB not applicable Recommended return loss of application

> 12dB

> 12dB ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.2 RF Antenna Interface 29 Page 21 of 46 2.2.1 Antenna Installation The antenna is connected by soldering the antenna pads (RF_OUT, pad #59 and DIV_ANT, pad 56) its neighboring ground pads (GND, i.e., pads #55, #57, #58 and #60) directly to the applications PCB. The antenna pad is the antenna reference point (ARP) for ELS31-US/ELS51-

US. All RF data specified throughout this document is related to the ARP. The distance between the antenna RF pads and its neighboring GND pads has been optimized for best possible impedance. On the application PCB, special attention should be paid to these 3 pads, in order to prevent mismatch. The wiring of the antenna connection line, starting from the antenna pad to the application an-

tenna should result in a 50 line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCBs layer stack. Some examples are given in Section 2.2.2. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. Please see Section 2.2.2.2 for an example. For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to ELS31-US/ELS51-USs antenna pad. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.2 RF Antenna Interface 29 Page 22 of 46 2.2.2 RF Line Routing Design RF Interface Signals Circuit Diagram Example 2.2.2.1 Figure 6 is a topology reference, and it is recommended not to deviate from this circuit for your external application. The RF inter-connects called RF Port 1 and RF Port 2 are examples only. Depending on the RF antenna, the interfacing system will dictate the RF inter-connects. Figure 6: RF interface signals example Please be also aware of ESD protection required on the RF interface lines. ESD protection might be utilized through the above pi-network (primarily intended for managing any additional RF optimization needs), or by additional components in series with the pi-network illustrated above. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.2 RF Antenna Interface 29 Page 23 of 46 2.2.2.2 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software). Embedded Stripline This figure below shows a line arrangement example for embedded stripline with 65m FR4 prepreg (type: 1080) and 710m FR4 core (4-layer PCB). Figure 7: Embedded Stripline with 65m prepreg (1080) and 710m core ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.2 RF Antenna Interface 29 Page 24 of 46 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 8: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.2 RF Antenna Interface 29 Page 25 of 46 Application board Ground line Antenna line Ground line Figure 9: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.2 RF Antenna Interface 29 Page 26 of 46 Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 10: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.2 RF Antenna Interface 29 Page 27 of 46 Application board Ground line Antenna line Ground line Figure 11: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.3 Sample Application 29 Page 28 of 46 2.3 Sample Application Figure 12 shows a typical example of how to integrate a ELS31-US/ELS51-US module with an application. Usage of the various host interfaces depends on the desired features of the appli-

cation. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The potential interferers may be minimized by placing small capacitors (47pF) at suspected lines

(e.g. RXD0, or ON). While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [4]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. Note: ELS31-US/ELS51-US is not intended for use with cables longer than 3m. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 12 and the information detailed in this section. As functionality and compliance with na-

tional regulations depend to a great amount on the used electronic components and the indi-

vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using ELS31-US/ELS51-US modules. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 2.3 Sample Application 29 Page 29 of 46 ELS31/ELS51 Main Antenna Div. Antenna BATT+RF BATT+BB SDIO HSIC ON Power Supply FST_SHUTDOWN 33pF 33pF

+ 150F Low ESR!

ASC0 ASC1 USB V180 CCIN CCVCC CCIO CCRST CCCLK GPIOs LED COUNTER I2CCLK I2CDAT GND i g n k c o B l V180 2k2 2k2 WiFi USB C SIM 220nF 10pF 1nF 10pF Interfaces available only on ELS51 Figure 12: Schematic diagram of ELS31-US/ELS51-US sample application ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 3 Operating Characteristics 30 Page 30 of 46 3 3.1 Operating Characteristics Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 6: Overview of operating modes Mode Normal opera-

tion Function LTE IDLE LTE DATA No data transfer is in progress and the USB connection is suspended by host (or is not present) and no active communication via ASC0/

ASC1. In IDLE mode, the software can be active or in SLEEP state. LTE data transfer in progress. Power consumption depends on network settings and data transfer rate. Power Down Airplane mode Normal shutdown after sending the power down command. Software is not active. Inter-

faces are not accessible. Operating voltage remains applied. Airplane mode shuts down the radio part of the module, causes the module to log off from the LTE network and disables all AT commands whose execution requires a radio connec-

tion. Airplane mode can be controlled by AT command (see [1]). In Airplane mode, the software can be active or in SLEEP state. Power Supply 3.2 ELS31-US/ELS51-US needs to be connected to a power supply at the SMT application inter-

face - 2 BATT lines and GND. There are two separate voltage domains for BATT:

BATT_BB with a line mainly for the baseband power supply. BATT_RF with a line for the RF power amplifier supply. Please note that throughout the document BATT refers to both voltage domains and power supply lines - BATT_BB and BATT_RF. The power supply of ELS31-US/ELS51-US has to be a single voltage source at BATT_BB and BATT_RF. It must be able to provide the current for all operation modes of the module. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:

Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and a DC-DC step down switching regulator. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 4 Mechanical Dimensions, Mounting and Packaging 32 Page 31 of 46 4 Mechanical Dimensions, Mounting and Packaging The following sections describe the mechanical dimensions of ELS31-US/ELS51-US and give recommendations for integrating ELS31-US/ELS51-US into the host application. 4.1 Mechanical Dimensions of ELS31-US/ELS51-US Figure 13 shows the top and bottom view of ELS31-US/ELS51-US and provides an overview of the board's mechanical dimensions. For further details see Figure 14. Product label Top view Bottom view Figure 13: ELS31-US/ELS51-US top and bottom view ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 4.1 Mechanical Dimensions of ELS31-US/ELS51-US 32 Page 32 of 46 18.8 0.1 2.05 0.1(TOTAL) 0.31 0.04(PCB) 1

. 0 6

. 7 2 Figure 14: Dimensions of ELS31-US/ELS51-US (all dimensions in mm) TOP VIEW 18.8 1.05 0.9 1.1 1.2 0.8 0.4 4 6 1

. 1

. 1 0.15 1.05 0.4

. 6 7 2 6 1 0

. 6 2

. 5 4 1

. 4 0

. 0.55 0.55

Figure 15: Dimensions of ELS31-US/ELS51-US (all dimensions in mm) - bottom view ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 5 Regulatory and Type Approval Information 38 Page 33 of 46 5 5.1 Regulatory and Type Approval Information Directives and Standards ELS31-US/ELS51-US is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "ELS31-US/ELS51-US Hardware Interface Description". Table 7: Directives 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Table 8: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCC Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields Product Safety Certification (Safety requirements) OET Bulletin 65

(Edition 97-01) UL 60 950-1 California Leadfree Man-

date RSS132 (Issue2) RSS133 (Issue5) Covered by European RoHS requirements Canadian Standard Table 9: Standards of GCF type approval 3GPP TS 51.010-1 GCF-CC V3.58 Digital cellular telecommunications system (Release 10); Mobile Station

(MS) conformance specification;

Global Certification Forum - Certification Criteria Table 10: Requirements of quality IEC 60068 DIN EN 60529 Environmental testing IP codes ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 5.1 Directives and Standards 38 Page 34 of 46 Table 11: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 Requirements for Concentration Limits for Certain Hazardous Sub-

stances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). SJ/T 11364-2006 According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products

(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description. Please see Table 12 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 12: Toxic or hazardous substances or elements with defined concentration limits ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 5.2 SAR requirements specific to portable mobiles 38 Page 35 of 46 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable ELS31-US/ELS51-US based applica-

tions to be evaluated and approved for compliance with national and/or international regula-

tions. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:

Portable device:

Mobile device:

A portable device is defined as a transmitting device designed to be used so that the radi-

ating structure(s) of the device is/are within 20 centimeters of the body of the user. A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 5.3 Reference Equipment for Type Approval 38 5.3 Reference Equipment for Type Approval Page 36 of 46 The Gemalto M2M reference setup submitted to type approve ELS31-US/ELS51-US (including a special approval adapter for the DSB75) is shown in the following figure1:

Antenna LTE Base station PC USB ASC0 ASC1 Power supply DSB75 GSM / GPRS / UMTS Antenna with 1m cable Evaluation module ELS31 ELS51 Bottom view Approval adapter for DSB75 SIM card SMA USB Evaluation module ELS31 ELS51 Top view Figure 16: Reference equipment for Type Approval 1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-

sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employing the SMA antenna connectors on the ELS31-US/ELS51-US-DSB75 adapter as shown in Figure 16. The following products are recommended:

Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)

(for details see see http://www.hirose-connectors.com/ or http://www.farnell.com/

Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T

(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf) ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 5.4 Compliance with FCC and IC Rules and Regulations 38 Page 37 of 46 5.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application de-

scribed in Section 5.3 will be registered under the following identifiers:

ELS31-US:

FCC Identifier: QIPELS31-US Industry Canada Certification Number: 7830A-ELS31US Granted to Gemalto M2M GmbH ELS51-US:

FCC Identifier: QIPELS51-US (not yet granted) Industry Canada Certification Number: 7830A-ELS51US (not yet granted) Granted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating ELS31-US/ELS51-US modules are au-

thorized to use the FCC Grants and Industry Canada Certificates of the ELS31-US/ELS51-US modules for their own final products according to the conditions referenced in these docu-

ments. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPELS31-US" / "Contains FCC ID:

QIPELS51-US", and accordingly Contains IC: 7830A-ELS31US / Contains IC: 7830A-

ELS51US. The integration is limited to fixed or mobile categorized host devices, where a sep-

aration distance between the antenna and any person of min. 20cm can be assured during nor-

mal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits in the following Table 9 for FCC and IC. Table 13: Antenna gain limits for FCC and IC (TBD) Operating band Maximum gain in lower operating bands with f< 1GHz

(LTE Bd12) Maximum gain in higher operating bands with f=1700MHz

(LTE Bd4) Maximum gain in higher operating bands with f=1900MHz

(LTE Bd2) FCC limit 8.72 IC limit 6.10 5.00 8.01 5.00 8.01 Unit dBi dBi dBi IMPORTANT:

Manufacturers of portable applications incorporating ELS31-US/ELS51-US modules are re-

quired to have their final product certified and apply for their own FCC Grant and Industry Can-

ada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter-

ference in a residential installation. This equipment generates, uses and can radiate radio fre-

ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 5.4 Compliance with FCC and IC Rules and Regulations 38 Page 38 of 46 quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. If Canadian approval is requested for devices incorporating ELS31US / ELS51-US modules the above note will have to be provided in the English and French language in the final user docu-

mentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product. Notes (IC):

(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-

tion is subject to the following two conditions: (1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device.

(FR) Cet appareil numrique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interfrence et (2) cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement.

(EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Industry Canada (IC) radio fre-

quency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized. This device has also been evaluated and shown compliant with the IC RF Exposure limits un-

der mobile exposure conditions (antennas at least 20cm from a persons body).

(FR) Informations concernant l'exposltion aux frquences radio (RF) La puissance de sortie mise par l'appareil de sans fiI est infrieure la limite d'exposition aux frquences radio dIndustry Canada (IC). Utilisez l'appareil de sans fil de faon minimiser les contacts humains lors du fonctionnement normal. Ce priphrique a galement t valu et dmontr conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition des appareils mobiles (les antennes se situent moins de 20cm du corps d'une personne). ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 6 Document Information 43 Page 39 of 46 6 Document Information Revision History 6.1 New document: "Cinterion ELS31-/ELS51-US Hardware Interface Overview" v01.000a Chapter

--

What is new Initial document setup. 6.2 Related Documents

[1] ELS31-US/ELS51-US AT Command Set

[2] ELS31-US/ELS51-US Release Note

[3] Application Note 40: Thermal Solutions

[4] Application Note 48: SMT Module Integration

[5] Universal Serial Bus Specification Revision 2.0, April 27, 2000 6.3 Terms and Abbreviations Abbreviation Description ADC AGC ANSI ARFCN ARP ASC0/ASC1 Analog-to-digital converter Automatic Gain Control American National Standards Institute Absolute Radio Frequency Channel Number Antenna Reference Point Asynchronous Controller. Abbreviations used for first and second serial interface of the module Thermistor Constant Bit Error Rate Base Transceiver Station Cell Broadcast Message Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Digital Audio Interface B BER BTS CB or CBM CE CHAP CPU CS CSD CTS DAC DAI ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 6.3 Terms and Abbreviations 43 Page 40 of 46 Abbreviation Description dBm0 DCE DCS 1800 DRX DSB DSP DSR DTE Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Gemalto M2M module) Digital Cellular System, also referred to as PCN Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Equivalent Isotropic Radiated Power Electromagnetic Compatibility Effective Radiated Power Electrostatic Discharge European Telecommunication Standard Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Purpose Input/Output General Packet Radio Service Global Standard for Mobile Communications High Impedance Half Rate High-Speed Inter-Chip Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Rechargeable Lithium Ion or Lithium Polymer battery Long Term Evolution DTR DTX EFR EGSM EIRP EMC ERP ESD ETS FCC FDMA FR GMSK GPIO GPRS GSM HiZ HR HSIC I/O IC IMEI ISO ITU kbps LED Li-Ion/Li+

Li battery LTE ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 6.3 Terms and Abbreviations 43 Page 41 of 46 Abbreviation Description Mbps MMI MO MS MSISDN MT NTC OEM PA PAP PBCCH PCB PCL PCM PCN PCS PLL PPP PSK PSU R&TTE RAM RF RLS RoHS Mbits per second Man Machine Interface Mobile Originated Mobile Station (GSM module), also referred to as TE Mobile Station International ISDN number Mobile Terminated Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Power Control Level Pulse Code Modulation Personal Communications Network, also referred to as DCS 1800 Personal Communication System, also referred to as GSM 1900 Phase Locked Loop Point-to-point protocol Phase Shift Keying Power Supply Unit Radio and Telecommunication Terminal Equipment Random Access Memory Radio Frequency Radio Link Stability Restriction of the use of certain hazardous substances in electrical and electronic equipment. Request to Send Receive Direction Specific Absorption Rate Surface Acoustic Wave Secure Digital Input Output Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Static Random Access Memory Terminal adapter (e.g. GSM module) RTS Rx SAR SAW SDIO SELV SIM SMD SMS SMT SRAM TA ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 6.3 Terms and Abbreviations 43 Page 42 of 46 Abbreviation Description TDMA TE TLS Tx UART URC USSD VSWR Time Division Multiple Access Terminal Equipment, also referred to as DTE Transport Layer Security Transmit Direction Universal asynchronous receiver-transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 6.4 Safety Precaution Notes 43 Page 43 of 46 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS31-US/ELS51-US. Manu-

facturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manu-

facture and intended use of the product. Gemalto M2M assumes no liability for customers fail-

ure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-

ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-

tion can constitute a safety hazard. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 7 Appendix 45 Page 44 of 46 7 Appendix List of Parts and Accessories 7.1 Table 14: List of parts and accessories Description ELS31-US Supplier Gemalto M2M Standard module Ordering information Gemalto M2M IMEI:

Packaging unit (ordering) number:

L30960-N4520-A200 Module label number:

S30960-S4520-A200-11 Customer IMEI module Packaging unit (ordering) number:

L30960-N4525-A200 Module label number:

S30960-S4520-A200-11 Gemalto M2M Standard module Gemalto M2M IMEI:

Packaging unit (ordering) number:

L30960-N4550-A200 Module label number:

S30960-S4550-A200-11 Customer IMEI module Packaging unit (ordering) number:

L30960-N4555-A200 Module label number:

S30960-S4555-A200-11 Gemalto M2M Ordering number:

L30960-N4521-A200 Gemalto M2M Ordering number:

L30960-N4551-A200 Gemalto M2M Ordering number: L36880-N8811-A100 Gemalto M2M Ordering number: L30960-N0030-A100 Gemalto M2M Ordering Number L30960-N0040-A100 Gemalto M2M Ordering number: L30960-N0010-A100 Gemalto M2M Ordering number: L30960-N2301-A100 Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 15. ELS51-US ELS31-US Evaluation Mod-

ule ELS51-US Evaluation Mod-

ule DSB75 Evaluation Kit DSB Mini Compact Evaluation Board Starter Kit B80 Multi-Adapter R1 for mount-

ing ELS31-US/ELS51-US evaluation modules onto DSB75 Approval adapter for mount-

ing ELS31-US/ELS51-US evaluation modules onto DSB75 SIM card holder incl. push button ejector and slide-in tray 1. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 Cinterion ELS31-/ELS51-US Hardware Interface Overview 7.1 List of Parts and Accessories 45 Page 45 of 46 Table 15: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 ELS31-US_ELS51-US_HIO_v01.000a Confidential / Preliminary 2016-12-28 46 About Gemalto Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2015 annual revenues of 3.1 billion and blue-chip customers in over 180 countries. Our 14,000+ employees operate out of 118 offices, 45 personalization and data centers, and 27 research and software development centers located in 49 countries. We are at the heart of the rapidly evolving digital society. Billions of people worldwide increasingly want the freedom to communicate, travel, shop, bank, entertain and work - anytime, everywhere

- in ways that are enjoyable and safe. Gemalto delivers on their expanding needs for personal mobile services, payment security, authenticated cloud access, identity and privacy protection, eHealthcare and eGovernment efficiency, convenient ticketing and dependable machine-to-

machine (M2M) applications. Gemalto develops secure embedded software and secure products which we design and personalize. Our platforms and services manage these secure products, the confidential data they contain and the trusted end-user services they enable. Our innovations enable our clients to offer trusted and convenient digital services to billions of individuals. Gemalto thrives with the growing number of people using its solutions to interact with the digital and wireless world. For more information please visit m2m.gemalto.com, www.facebook.com/gemalto, or Follow@gemaltom2m on twitter. Gemalto M2M GmbH Werinherstrasse 81 81541 Munich Germany M2M.GEMALTO.COM 3 1 0 2 l i r p A

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