FCC ID: QIPMC75 Quadband GSM/GPRS/EGPRS Module

s MC75 Siemens Cellular Engine Version:

DocID:

00.190a MC75_V00.190a n o i t p i r c s e D e c a f r e n t I e r a w d r a H MC75 Hardware Interface Description Strictly confidential / Draft s Document Name: MC75 Hardware Interface Description Version:

Date:

DocId:

Status:

00.190a February 15, 2005 MC75_V00.190a Strictly confidential / Draft General note Product is deemed accepted by Recipient and is provided without interface to Recipients products. The Product constitutes pre-release version and code and may be changed substantially before commercial release. The Product is provided on an as is basis only and may contain deficiencies or inadequacies. The Product is provided without warranty of any kind, express or implied. To the maximum extent permitted by applicable law, Siemens further disclaims all warranties, including without limitation any implied warranties of merchantability, fitness for a particular purpose and noninfringement of third-party rights. The entire risk arising out of the use or performance of the Product and documentation remains with Recipient. This Product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Applications incorporating the described product must be designed to be in accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required procedures can result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also apply to cellular phones must be followed. Siemens AG customers using or selling this product for use in any applications do so at their own risk and agree to fully indemnify Siemens for any damages resulting from illegal use or resale. To the maximum extent permitted by applicable law, in no event shall Siemens or its suppliers be liable for any consequential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation, damages for loss of business profits, business interruption, loss of business information or data, or other pecuniary loss) arising out the use of or inability to use the Product, even if Siemens has been advised of the possibility of such damages. Subject to change without notice at any time. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright Siemens AG 2005 MC75_V00.190a Page 2 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Contents 0 1 2 3 Document History .........................................................................................................6 Introduction ...................................................................................................................8 1.1 Related Documents ...............................................................................................8 1.2 Terms and Abbreviations.......................................................................................9 1.3 Type Approval......................................................................................................12 1.4 Safety Precautions...............................................................................................14 Product Concept .........................................................................................................16 2.1 Key Features at a Glance ....................................................................................16 2.2 MC75 System Overview ......................................................................................19 2.3 Circuit Concept ....................................................................................................20 Application Interface...................................................................................................21 3.1 Power Supply.......................................................................................................22 3.1.1 Minimizing Power Losses ......................................................................22 3.1.2 Measuring the Supply Voltage VBATT+ ....................................................23 3.1.3 Monitoring Power Supply by AT Command ...........................................23 3.2 Power Up / Power Down Scenarios.....................................................................24 3.2.1 Turn on MC75........................................................................................24 3.2.1.1 Turn on MC75 Using Ignition Line IGT ..................................................24 3.2.1.2 Turn on MC75 Using the VCHARGE Signal ..........................................26 3.2.1.3 Reset MC75 via AT+CFUN Command ..................................................27 3.2.1.4 Reset MC75 in Case of Emergency via EMERG_RST..........................27 3.2.2 Turn off MC75........................................................................................28 3.2.2.1 Turn off MC75 Using AT Command.......................................................28 3.2.2.2 Leakage Current in Power Down Mode.................................................29 3.2.3 Automatic Shutdown..............................................................................30 3.2.3.1 Temperature Dependent Shutdown.......................................................30 3.2.3.2 Temperature Control during Emergency call .........................................31 3.2.3.3 Undervoltage Shutdown if Battery NTC is Present ................................31 3.2.3.4 Undervoltage Shutdown if no Battery NTC is Present ...........................32 3.2.3.5 Overvoltage Shutdown...........................................................................32 3.3 Automatic EGPRS/GPRS Multislot Class Change ..............................................33 3.4 Charging Control..................................................................................................34 3.4.1 Battery Pack Requirements ...................................................................34 3.4.2 Batteries Recommended for Use with MC75.........................................35 3.4.3 Charger Requirements...........................................................................36 3.4.4 Implemented Charging Technique.........................................................36 3.4.5 Operating Modes during Charging.........................................................37 3.5 RTC Backup ........................................................................................................38 3.6 SIM Interface .......................................................................................................39 3.7 Serial Interface ASC0 ..........................................................................................40 3.8 Serial Interface ASC1 ..........................................................................................42 3.9 USB Interface ......................................................................................................43 Installing the USB Modem Driver...........................................................44 3.10 I2C Interface.........................................................................................................46 3.11 SD Memory Card Interface ..................................................................................47 3.12 Audio Interfaces...................................................................................................49 3.12.1 Speech Processing................................................................................50 3.12.2 Microphone Circuit.................................................................................50 3.12.2.1 Single-ended Microphone Input.............................................................50 3.9.1 MC75_V00.190a Page 3 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 4 5 6 7 8 9 4.2.1 3.12.2.2 Differential Microphone Input.................................................................51 3.12.2.3 Line Input Configuration with OpAmp ....................................................52 3.12.3 Loudspeaker Circuit...............................................................................53 3.12.4 Digital Audio Interface DAI.....................................................................54 3.13 Control Signals ....................................................................................................56 3.13.1 Synchronization Signal ..........................................................................56 3.13.2 Using the SYNC Pin to Control a Status LED........................................57 Antenna Interface........................................................................................................58 4.1 Antenna Installation .............................................................................................58 4.2 Antenna Pad ........................................................................................................60 Suitable Cable Types.............................................................................60 4.3 Antenna Connector..............................................................................................61 Electrical, Reliability and Radio Characteristics......................................................65 5.1 Absolute Maximum Ratings .................................................................................65 5.2 Operating Temperatures......................................................................................65 5.3 Pin Assignment and Signal Description...............................................................66 5.4 Electrostatic Discharge ........................................................................................72 5.5 Reliability Characteristics.....................................................................................73 Mechanics....................................................................................................................74 6.1 Mechanical Dimensions of MC75 ........................................................................74 6.2 Mounting MC75 to the Application Platform ........................................................76 6.3 Board-to-Board Application Connector ................................................................77 Sample Application.....................................................................................................80 Reference Approval ....................................................................................................82 8.1 Reference Equipment for Type Approval.............................................................82 8.2 Compliance with FCC Rules and Regulations.....................................................83 Appendix......................................................................................................................84 9.1 List of Parts and Accessories ..............................................................................84 9.2 Fasteners and Fixings for Electronic Equipment .................................................86 Fasteners from German Supplier ETTINGER GmbH ............................86 9.3 Data Sheets of Recommended Batteries ............................................................89 9.2.1 Tables Table 1: Temperature dependent behavior............................................................................31 Table 2: Specifications of battery packs suitable for use with MC75 .....................................35 Table 3: Comparison Charge-only and Charge mode............................................................37 Table 4: AT commands available in Charge-only mode.........................................................37 Table 5: Signals of the SIM interface (board-to-board connector) .........................................39 Table 6: DCE-DTE wiring of ASC0.........................................................................................41 Table 7: DCE-DTE wiring of ASC1.........................................................................................42 Table 8: SD card interface......................................................................................................47 Table 9: Overview of USC pin functions.................................................................................54 Table 10: Return loss in the active band................................................................................58 Table 11: Product specifications of U.FL-R-SMT connector ..................................................61 Table 12: Material and finish of U.FL-R-SMT connector and recommended plugs ...............62 Table 13: Ordering information for Hirose U.FL Series ..........................................................64 Table 14: Absolute maximum ratings .....................................................................................65 Table 15: Operating temperatures .........................................................................................65 MC75_V00.190a Page 4 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Table 16: Signal description...................................................................................................67 Table 17: Measured electrostatic values................................................................................72 Table 18: Summary of reliability test conditions .....................................................................73 Table 19: Technical specifications of Molex board-to-board connector .................................77 Table 20: List of parts and accessories..................................................................................84 Table 21: Molex sales contacts (subject to change) ..............................................................85 Table 22: Hirose sales contacts (subject to change)..............................................................85 Figures Figure 1: MC75 system overview ...........................................................................................19 Figure 2: MC75 block diagram ...............................................................................................20 Figure 3: Power supply limits during transmit burst................................................................22 Figure 4: Position of the reference points BATT+ and GND ..................................................23 Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT..............25 Figure 6: Power-on with IGT held low before switching on operating voltage at BATT+ .......26 Figure 7: Signal states during turn-off procedure...................................................................29 Figure 8: Battery pack circuit diagram....................................................................................35 Figure 9: RTC supply from capacitor......................................................................................38 Figure 10: RTC supply from rechargeable battery .................................................................38 Figure 11: RTC supply from non-chargeable battery .............................................................38 Figure 12: Serial interface ASC0............................................................................................40 Figure 13: Serial interface ASC1............................................................................................42 Figure 14: USB circuit ............................................................................................................43 Figure 15: I2C interface connected to VCC of application .....................................................46 Figure 16: I2C interface connected to VEXT line of MC75.....................................................46 Figure 17: SD card interface (example with power supply from modules VEXT line) ...........48 Figure 18: Audio block diagram..............................................................................................49 Figure 19: Single ended microphone input.............................................................................50 Figure 20: Differential microphone input ................................................................................51 Figure 21: Line input configuration with OpAmp ....................................................................52 Figure 22: Differential loudspeaker configuration...................................................................53 Figure 23: Single ended loudspeaker configuration...............................................................53 Figure 24: PCM interface application .....................................................................................54 Figure 25: PCM timing............................................................................................................55 Figure 26: SYNC signal during transmit burst........................................................................56 Figure 27: LED Circuit (Example)...........................................................................................57 Figure 28: Never use antenna connector and antenna pad at the same time .......................59 Figure 29: Restricted area around antenna pad.....................................................................59 Figure 30: Mechanical dimensions of U.FL-R-SMT connector...............................................61 Figure 31: U.FL-R-SMT connector with U.FL-LP-040 plug ....................................................62 Figure 32: U.FL-R-SMT connector with U.FL-LP-066 plug ....................................................62 Figure 33: Specifications of U.FL-LP-(V)-040(01) plug ..........................................................63 Figure 34: Pin assignment (component side of MC75) ..........................................................66 Figure 35: MC75 top view ...................................................................................................74 Figure 36: Dimensions of MC75.............................................................................................75 Figure 37: Molex board-to-board connector 52991-0808 on MC75 .......................................78 Figure 38: Mating board-to-board connector 53748-0808 on application ..............................79 Figure 39: MC75 sample application (draft) ...........................................................................81 Figure 40: Reference equipment for Type Approval ..............................................................82 Figure 41: Lithium Ion battery from VARTA ...........................................................................90 Figure 42: Lithium Polymer battery from VARTA ...................................................................91 MC75_V00.190a Page 5 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Document History 0 Preceding document: "MC75 Hardware Interface Description" Version 00.111 New document: "MC75 Hardware Interface Description" Version 00.190a Chapter 2.3 8.2 What is new Updated Figure 2 Added notes regarding FCC regulations Preceding document: "MC75 Hardware Interface Description" Version 00.111 New document: "MC75 Hardware Interface Description" Version 00.190 Chapter 3.4.5 3.12.2 3.13 8.2 What is new Described effect of AT^SMSO during Charge-only mode. Corrected several parameters in figures. More detailed description of AT^SSYNC command. Changed antenna gain and FCC identifier. Preceding document: "MC75 Hardware Interface Description" Version 00.02 New document: "MC75 Hardware Interface Description" Version 00.111 What is new Chapter 3.1.2 / 3.1.3 Added description of how to measure VBATT+. 3.2.3.5 3.4.1 / 3.4.2 9.3 3.9.1 3.12.2 3.12.3 Orderly shutdown in case of overvoltage (description is preliminary) Updated battery requirements. Added description of VARTA batteries. Added data sheets of VARTA batteries. Added info about usbser.sys file. Added filter in microphone circuit figures. Added figures Differential loudspeaker configuration and Single ended loudspeaker configuration. More detailed description of how to connect the I2C interface. Updated Table 14: Absolute maximum ratings. Updated Figure 36. 3.10 5.1 6.1 MC75_V00.190a Page 6 of 91 15.02.2005 Chapter

Throughout manual 2.1 / 5.3 3.2.2.2 3.4 MC75 Hardware Interface Description Strictly confidential / Draft s Preceding document: "MC75 Hardware Interface Description" Version 00.02 New document: "MC75 Hardware Interface Description" Version 00.65 What is new Deleted section about limitations of MC75 Preview Release. Supply voltage range now 3.2V 4.3V (instead of 3.2V 4.2V) Operating temperature specified. Added section Leakage Current in Power Down Mode. Added Lithium Polymer batteries. Updated recommended battery specifications. More detailed description of trickle charging. Use CCGND as separate ground line for the SIM interface. Corrected description and figure of USB interface. Described driver installation. 3.6 3.9 3.12.4 / 5.3 USC4 pin marked as input. 5.3 5.4 6.1 Added specifications of USB interface. Table 17: Added electrostatic values of USB and SD card interfaces. Updated Figure 36. Preceding document: "MC75 Hardware Interface Description" Version 00.02 New document: "MC75 Hardware Interface Description" Version 00.30 What is new Chapter Completely revised and updated all chapters and technical specifications. Added new chapters and appendix. Preceding document: "MC75 Hardware Interface Description" Version 00.01 New document: "MC75 Hardware Interface Description" Version 00.02 Chapter 5 3.11 7 What is new Changed description of VEXT pin. Changed description of pin 55 and renamed pin from EMERGOFF to EMERG_RST. Corrected Figure 17: SD card interface. Changed sample application. MC75_V00.190a Page 7 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Introduction 1 This document describes the hardware of the Siemens MC75 module that connects to the cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.1 Related Documents

[1] MC75 AT Command Set

[2] MC75 Release Notes 00.190

[3] DSB75 Support Box - Evaluation Kit for Siemens Cellular Engines

[4] Application 07: Rechargeable Lithium Batteries in GSM Applications (not yet available)

[5] Multiplexer User's Guide (not yet available) MC75_V00.190a Page 8 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 1.2 Terms and Abbreviations s Abbreviation Description ADC AGC ANSI ARFCN ARP ASC0 / ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of Analog-to-Digital Converter Automatic Gain Control American National Standards Institute Absolute Radio Frequency Channel Number Antenna Reference Point B B2B BER BTS CB or CBM CE CHAP CPU CS CSD CTS DAC DAI dBm0 DCE DCS 1800 DRX DSB DSP DSR DTE DTR DTX EDGE EFR EGSM EGPRS EMC MC75 Thermistor Constant Board-to-board connector Bit Error Rate Base Transceiver Station Cell Broadcast Message Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Digital Audio Interface Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Siemens GSM engine) Digital Cellular System, also referred to as PCN Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) Data Terminal Ready Discontinuous Transmission Enhanced Data Rates for Global Evolution Enhanced Full Rate Enhanced GSM Enhanced General Packet Radio Service Electromagnetic Compatibility MC75_V00.190a Page 9 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Abbreviation Description ESD ETS FCC FDMA FR GMSK GPRS GSM HiZ HR I/O IC IMEI ISO ITU kbps LED Li-Ion / Li+

Li battery Mbps MMI MO MS MSISDN MT NTC OEM PA PAP PBCCH PCB PCL PCM PCN PCS PDU PLL PPP Electrostatic Discharge European Telecommunication Standard Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Packet Radio Service Global Standard for Mobile Communications High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Rechargeable Lithium Ion or Lithium Polymer battery Mbits per second Man Machine Interface Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Station International ISDN number Mobile Terminated Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Power Control Level Pulse Code Modulation Personal Communications Network, also referred to as DCS 1800 Personal Communication System, also referred to as GSM 1900 Protocol Data Unit Phase Locked Loop Point-to-point protocol MC75_V00.190a Page 10 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Phase Shift Keying Power Supply Unit Radio and Telecommunication Terminal Equipment Random Access Memory Radio Frequency Root Mean Square (value) Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate Secure Digital Safety Extra Low Voltage Subscriber Identification Module Short Message Service Static Random Access Memory Terminal adapter (e.g. GSM engine) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transmit Direction Universal asynchronous receiver-transmitter Unsolicited Result Code Universal Serial Bus Unstructured Supplementary Service Data Voltage Standing Wave Ratio Abbreviation Description PSK PSU R&TTE RAM RF RMS ROM RTC RTS Rx SAR SD SELV SIM SMS SRAM TA TDMA TE Tx UART URC USB USSD VSWR Phonebook abbreviations FD LD MC ME ON RC SM SIM fixdialing phonebook SIM last dialing phonebook (list of numbers most recently dialed) Mobile Equipment list of unanswered MT calls (missed calls) Mobile Equipment phonebook Own numbers (MSISDNs) stored on SIM or ME Mobile Equipment list of received calls SIM phonebook MC75_V00.190a Page 11 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 1.3 Type Approval s MC75 is designed to comply with the directives and standards listed below. Please note that the product is still in a pre-release state and, therefore, type approval and testing procedures have not yet been completed. European directives 99/05/EC telecommunications radio equipment and Directive of the European Parliament and of the council of 9 March 1999 on terminal equipment and the mutual recognition of their conformity, in short referred to as R&TTE Directive 1999/5/EC Directive on electromagnetic compatibility Directive on electrical equipment designed for use within certain voltage limits (Low Voltage Directive) 89/336/EC 73/23/EC Standards of North American Type Approval CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommuni-

cations, PCS); US Equipment Authorization FCC Product Safety Certification (Safety requirements) UL 60 950 Overview of PCS Type certification review board NAPRD.03 Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB), Version 3.1.0 RSS133 (Issue2) Canadian Standard Standards of European Type Approval 3GPP TS 51.010-1 ETSI EN 301 511 GCF-CC ETSI EN 301 489-1 ETSI EN 301 489-7 EN 60 950 series) Global System Digital cellular telecommunications system (Phase 2); Mobile Station (MS) conformance specification V7.0.1 (2000-12) Candidate Harmonized European Standard

(Telecommunications for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998) Global Certification Forum - Certification Criteria V3.16.0 V1.2.1 Standard

(Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility

(EMC) standard for radio equipment and services; Part 1: Common Technical Requirements V1.1.1 Standard

(Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility

(EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS) Safety of information technology equipment (2000) Harmonized Harmonized Candidate Candidate European European MC75_V00.190a Page 12 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s IP codes Environmental testing Requirements of quality IEC 60068 DIN EN 60529 Compliance with international rules and regulations Manufacturers of mobile or fixed devices incorporating MC75 modules are advised to have their completed product tested and approved for compliance with all applicable national and international regulations. As a quad-band GSM/GPRS engine designed for use on any GSM network in the world, MC75 is required to pass all approvals relevant to operation on the European and North American markets. For the North American market this includes the Rules and Regulations of the Federal Communications Commission (FCC) and PTCRB, for the European market the R&TTE Directives and GCF Certification Criteria must be fully satisfied. The FCC Equipment Authorization granted to the MC75 Siemens reference application is valid only for the equipment described in Section 8.1. SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable MC75 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz evaluation exposure human for of Products intended for sale on European markets EN 50360 Product standard to demonstrate the compliance of mobile phones with to electromagnetic fields (300 MHz - 3 GHz) to human exposure restrictions the basic related Note: Usage of MC75 in a fixed, mobile or portable application is not allowed without a new FCC certification. MC75_V00.190a Page 13 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 1.4 Safety Precautions s The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating MC75. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Siemens AG assumes no liability for customers failure to comply with these precautions. is forbidden to prevent in an aircraft When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard. MC75_V00.190a Page 14 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. SOS MC75_V00.190a Page 15 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 2 Product Concept 2.1 Key Features at a Glance s Feature General Frequency bands GSM class Output power

(according to Release 99, V5) Power supply Power consumption Operating temperature Physical Implementation Quad band: GSM 850/900/1800/1900 MHz Small MS Class 4 (+33 dBm 2 dB) for EGSM850 Class 4 (+33 dBm 2 dB) for EGSM900 Class 1 (+30 dBm 2 dB) for GSM1800 Class 1 (+30 dBm 2 dB) for GSM1900 Class E2 (+27 dBm 3 dB) for GSM 850 8-PSK Class E2 (+27 dBm 3 dB) for GSM 900 8-PSK Class E2 (+26 dBm +3 /-4 dB) for GSM 1800 8-PSK Class E2 (+26 dBm +3 /-4 dB) for GSM 1900 8-PSK The values stated above are maximum limits. According to Release 99, Version 5, the maximum output power in a multislot configuration may be lower. The nominal reduction of maximum output power varies with the number of uplink timeslots used and amounts to 3.0 dB for 2 Tx, 4.8 dB for 3 Tx and 6.0 dB for 4 Tx. 3.2V to 4.3V Sleep mode: max. TBD Power down mode: typically 50A

-30C to +65C ambient temperature Auto switch-off at +90C board temperature (preliminary) Dimensions: 33.9mm x 44.6mm x max. 3.5mm Weight: approx. 10g GSM / GPRS/ EGPRS features GPRS Data transfer Multislot Class 12 Full PBCCH support Mobile Station Class B Coding Scheme 1 4 EGPRS Multislot Class 10 Mobile Station Class B Modulation and Coding Scheme MCS 1 9 MC75_V00.190a Page 16 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Feature SMS Fax Audio Software AT commands Implementation CSD V.110, RLP, non-transparent 2.4, 4.8, 9.6, 14.4 kbps USSD PPP-stack for GPRS data transfer Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus 25 SMS locations in mobile equipment Transmission of SMS alternatively over CSD or GPRS. Preferred mode can be user defined. Group 3; Class 1 Speech codecs:

Half rate HR (ETS 06.20) Full rate FR (ETS 06.10) Enhanced full rate EFR (ETS 06.50/06.60/06.80) Adaptive Multi Rate AMR Speakerphone operation Echo cancellation, noise suppression DTMF 7 ringing tones AT-Hayes GSM 07.05 and 07.07, Siemens AT commands for RIL compatibility (NDIS/RIL) MicrosoftTM compatibility RIL / NDIS for Pocket PC and Smartphone SIM Application Toolkit SAT Release 99 TCP/IP stack IP adresses Firmware update Access by AT commands IP version 6 Download over serial interface ASC0 Download over SIM interface Download over USB Interfaces 2 serial interfaces ASC0 8-wire modem unbalanced, asynchronous interface with status and control lines, 1.2 kbps to 460 kbps Autobauding TBD Supports RTS0/CTS0 hardware handshake and software XON/XOFF flow control. Multiplex ability according to GSM 07.10 Multiplexer Protocol. MC75_V00.190a Page 17 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Feature USB I2C SD card interface Audio SIM interface Antenna Module interface Power on/off, Reset Power on/off Reset Special features Charging Real time clock Phonebook Evaluation kit DSB75 Implementation ASC1 4-wire, unbalanced asynchronous interface 1.2 kbps to 460 kbps Autobauding TBD Supports RTS1/CTS1 hardware handshake and software XON/XOFF flow control Supports a USB 2.0 Full Speed (12 Mbit/s) slave interface. I2C bus for transmission rates up to 400 kbps Interface for SD memory card or multimedia card 2 analog interfaces 1 digital interface (PCM) Supported SIM cards: 3V, 1.8V 50 Ohms. External antenna can be connected via antenna connector or solderable pad. 80-pin board-to-board connector Switch-on by hardware pin IGT Switch-off by AT command (AT^SMSO) Automatic switch-off in case of critical temperature and voltage conditions. Orderly shutdown and reset by AT command Emergency reset by hardware pin EMERG_RST Supports management of rechargeable Lithium Ion and Lithium Polymer batteries Timer functions via AT commands SIM and phone DSB75 Evaluation Board designed to test and type approve Siemens cellular engines and provide a sample configuration for application engineering. MC75_V00.190a Page 18 of 91 15.02.2005 s MC75 Hardware Interface Description Strictly confidential / Draft 2.2 MC75 System Overview Antenna Interface MC75 Application Interface SD interface USB I2C SIM Serial 1

(Modem) Serial 2 Digital Audio Analog Audio Charge Power Supply SD memory card d r a c M S I USB Host I2C Slave UART Audio Codec Headphones or Headset Charging circuit Charger User Application Figure 1: MC75 system overview MC75_V00.190a Page 19 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 2.3 Circuit Concept s Figure 2 shows a block diagram of the MC75 module and illustrates the major functional components:

Baseband Block:

Digital baseband processor with DSP Analog processor with power supply unit (PSU) Flash / SRAM (stacked) Application interface (board-to-board connector) RF section:

RF transceiver RF power amplifier RF front end Antenna connector D(0:15) A (0 :24) RD; WR; CS ; WAIT SRAM Flash Front End t r a P F R RF Power Amplifier Transceiver 3 26MHz 26MHz Digital Baseband Processor with DSP 32.768kHz RTC Interface RF - Baseband CCIN CCRST CCIO CCCLK CCV CC 5 t e s e R RF Control B us 4 I / Q Analog Controller with PSU NTC Measuring Network RE FCHG TE M P2 B ATT YP E RE SE T 10 8 4 2 3 8 ASC(0) ASC(1) I2C USB SD Card 7 DAI SYNC 6 SIM Interface PWR_IND VEX T EM ERG_RS T Audio analog IGT VDDLP CHARGEGATE VCHA RGE ISENSE VSE NSE BATT_TEM P BATT+

GND i

) s n p 0 8

e c a f r e t n I n o i t a c i l p p A MC75 Figure 2: MC75 block diagram MC75_V00.190a Page 20 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Application Interface 3 MC75 is equipped with an 80-pin board-to-board connector that connects to the external application. The host interface incorporates several sub-interfaces described in the following chapters:

Power supply - see Section 3.1 Charger interface Section 3.4 SIM interface - see Section 3.6 Serial interface ASC0 - see Section 3.7 Serial interface ASC1 - see Section 3.8 Serial interface USB - see Section 3.9. Serial interface IC - see Section 3.10 SD card interface - see Section 3.11 Two analog audio interfaces - see Section 3.12 Digital audio interface (DAI) - see Section 3.12 and 3.12.4 Status and control lines: IGT, EMERG_RST, PWR_IND, SYNC - see Table 16 MC75_V00.190a Page 21 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.1 Power Supply s MC75 needs to be connected to a power supply at the B2B connector (5 pins each BATT+

and GND). The power supply of MC75 has to be a single voltage source at BATT+. It must be able to provide the peak current during the uplink transmission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:

Stabilizes the supply voltages for the GSM baseband using low drop linear voltage regulators. Switches the module's power voltages for the power up and down procedures. Delivers, across the VEXT pin, a regulated voltage for an external application. This voltage is not available in Power-down mode. SIM switch to provide SIM power supply. 3.1.1 Minimizing Power Losses When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.2 V on the MC75 board, not even in a transmit burst where current consumption can rise to typical peaks of 2A. It should be noted that MC75 switches off when exceeding these limits. Any voltage drops that may occur in a transmit burst should not exceed 400mV. The best approach to reducing voltage drops is to use a board-to-board connection as recommended, and a low impedance power source. The resistance of the power supply lines on the host board and of a battery pack should also be considered. Note:

If the application design requires an adapter cable between both board-to-board connectors, use a flex cable as short as possible in order to minimize power losses. Example:

If the length of the flex cable reaches the maximum length of 100mm, this connection may cause, for example, a resistance of 30m in the BATT+ line and 30m in the GND line. As a result, a 2A transmit burst would add up to a total voltage drop of 120mV. Plus, if a battery pack is involved, further losses may occur due to the resistance across the battery lines and the internal resistance of the battery including its protection circuit. Transmit burst 2A Transmit burst 2A BATT+

min. 3.2V Ripple Drop Figure 3: Power supply limits during transmit burst MC75_V00.190a Page 22 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Reference point BATT+

3.1.2 Measuring the Supply Voltage VBATT+

The reference points for measuring the supply voltage VBATT+ on the module are BATT+ and GND, both accessible at a capacitor located close to the board-to-board connector of the module. Reference point GND Figure 4: Position of the reference points BATT+ and GND 3.1.3 Monitoring Power Supply by AT Command To monitor the supply voltage you can also use the AT^SBV command which returns the value related to the reference points BATT+ and GND. The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s when MC75 is in IDLE mode or Limited Service (deregistered). The displayed voltage

(in mV) is averaged over the last measuring period before the AT^SBV command was executed. MC75_V00.190a Page 23 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 3.2 Power Up / Power Down Scenarios In general, be sure not to turn on MC75 while it is beyond the safety limits of voltage and temperature stated in Chapter 5. MC75 would immediately switch off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module. 3.2.1 Turn on MC75 MC75 can be started in a variety of ways as described in the following sections:

Hardware driven start-up by IGT line: starts normal operating state (see Section 3.2.1.1) Software controlled reset by AT+CFUN command: starts normal operating state (see Hardware driven start-up by VCHARGE line: starts charging algorithm and charge-only Section 3.2.1.3) mode (see Section 3.2.1.2) Wake-up from Power-down mode by using RTC interrupt: starts Alarm mode 3.2.1.1 Turn on MC75 Using Ignition Line IGT When the MC75 module is in Power-down mode, it can be started to normal operation by driving the IGT (ignition) line to ground. This must be accomplished with an open drain/collector driver to avoid current flowing into this pin. The module will start up when both of the following two conditions are met:

The supply voltage applied at BATT+ must be in the operating range. The IGT line needs to be driven low for at least 300ms. Considering different strategies of host application design the figures below show two approaches to meet this requirement: The example in Figure 5 assumes that IGT is activated after BATT+ has already been applied. The example in Figure 6 assumes that IGT is held low before BATT+ is switched on. In either case, to power on the module, ensure that low state of IGT takes at least 300ms from the moment the voltage at BATT+ is available. MC75_V00.190a Page 24 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s If configured to a fix baud rate (AT+IPR0), the module will send the URC ^SYSSTART to notify that it is ready to operate. If autobauding is enabled (AT+IPR=0) there will be no notification. t min

= 300ms HiZ BATT+

IGT PWR_IND EMERG_RST 120ms VEXT TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application) CTS0/CTS1/DSR0/DCD0 Serial interfaces ASC0 and ASC1 Undefined ca. 500 ms Active Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT MC75_V00.190a Page 25 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s t min

= 300ms HiZ BATT+

IGT PWR_IND EMERG_RST 120ms VEXT TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application) CTS0/CTS1/DSR0/DCD0 Serial interfaces ASC0 and ASC1 Undefined ca. 500 ms Active Figure 6: Power-on with IGT held low before switching on operating voltage at BATT+

Turn on MC75 Using the VCHARGE Signal 3.2.1.2 As detailed in Section 3.4.5, the charging adapter can be connected regardless of the modules operating mode. If the charger is connected to the charger input of the external charging circuit and the modules VCHARGE pin while MC75 is off, and the battery voltage is above the undervoltage lockout threshold, processor controlled fast charging starts (see Section 3.4.4). MC75 enters a restricted mode, referred to as Charge-only mode where only the charging algorithm will be launched. During the Charge-only mode MC75 is neither logged on to the GSM network nor are the serial interfaces fully accessible. To switch to normal operation and log on to the GSM network, the IGT line needs to be activated as described in Section 3.2.1. MC75_V00.190a Page 26 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 3.2.1.3 Reset MC75 via AT+CFUN Command To reset and restart the MC75 module use the command AT+CFUN. You can enter AT+CFUN=,1 or AT+CFUN=x,1, where x may be in the range from 0 to 9. See [1] for details. If configured to a fix baud rate (AT+IPR0), the module will send the URC ^SYSSTART to notify that it is ready to operate. If autobauding is enabled (AT+IPR=0) there will be no notification. To register to the network SIM PIN authentication is necessary after restart. 3.2.1.4 Reset MC75 in Case of Emergency via EMERG_RST Caution: Use the EMERG_RST pin only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST pin causes the loss of all information stored in the volatile memory since the processor restarts immediately. Therefore, this procedure is intended only for use in case of emergency, e.g. if MC75 does not respond, if reset or shutdown via AT command fails. The EMERG_RST signal is available on the application interface. To control the EMERG_RST line it is recommended to use an open drain / collector driver. To actually reset the MC75 module, the EMERG_RST line must be pulled to ground for 10ms. After releasing the line MC75 will start again. After hardware driven restart, notification via ^SYSSTART URC is the same as in case of restart by IGT or AT command. To register to the network SIM PIN authentication is necessary after restart. MC75_V00.190a Page 27 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.2.2 Turn off MC75 s MC75 can be turned off as follows:

Normal shutdown: Software controlled by AT^SMSO command Automatic shutdown: Takes effect if board or battery temperature is out of range or if undervoltage or overvoltage conditions occur. Turn off MC75 Using AT Command 3.2.2.1 The best and safest approach to powering down MC75 is to issue the AT^SMSO command. This procedure lets MC75 log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is referred to as Power-down mode. In this mode, only the RTC stays active. Before switching off the device sends the following response:

After sending AT^SMSO do not enter any other AT commands. There are two ways to verify when the module turns off:

Wait for the URC ^SHUTDOWN. It indicates that data have been stored non-volatile OK

^SHUTDOWN

^SMSO: MS OFF and the module turns off in less than 1 second. Also, you can monitor the PWR_IND pin. High state of PWR_IND definitely indicates that the module is switched off. Be sure not to disconnect the supply voltage VBATT+ before the URC ^SHUTDOWN has been issued and the PWR_IND signal has gone high. Otherwise you run the risk of losing data. Signal states during turn-off are shown in Figure 7. While MC75 is in Power-down mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital pins of the application interface, especially of the serial interfaces. No special care is required for the USB interface which is protected from reverse current. MC75_V00.190a Page 28 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s PWR_IND VEXT CTS0/CTS1/DSR0/DTR0 See note 1 TXD0/TXD1/RTS0/RTS1/DTR0 (driven by the application) Active Undefined Serial interfaces ASC0 and ASC1 Figure 7: Signal states during turn-off procedure Note 1: Depending on capacitance load from host application 3.2.2.2 Leakage Current in Power Down Mode The leakage current in Power Down mode varies depending on the following conditions:

If the supply voltage at BATT+ was disconnected and then applied again without starting up the MC75 module, the leakage current ranges between 90A and 100A. If the MC75 module is started and afterwards powered down with AT^SMSO, then the leakage current is only 50A. Therefore, in order to minimize the leakage current take care to start up the module at least once before it is powered down. MC75_V00.190a Page 29 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.2.3 Automatic Shutdown s the MC75 board is exceeding the critical limits of overtemperature or undertemperature the battery is exceeding the critical limits of overtemperature or undertemperature Automatic shutdown takes effect if undervoltage or overvoltage is detected The automatic shutdown procedure is equivalent to the Power-down initiated with the AT^SMSO command, i.e. MC75 logs off from the network and the software enters a secure state avoiding loss of data. Alert messages transmitted before the device switches off are implemented as Unsolicited Result Codes (URCs). The presentation of these URCs can be enabled or disabled with the two AT commands AT^SBC and AT^SCTM. The URC presentation mode varies with the condition, please see Chapters 3.2.3.1 to 3.2.3.4 for details. For further instructions on AT commands refer to [1]. Temperature Dependent Shutdown 3.2.3.1 The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The NTC that detects the battery temperature must be part of the battery pack circuit as described in 3.4.1 The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature. Each time the board or battery temperature goes out of range or back to normal, MC75 instantly displays an alert (if enabled). URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command:

AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled for 15 seconds time after start-up of MC75. After 15 seconds operation, the presentation will be disabled, i.e. no alert messages can be generated. URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The presentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0 was never changed. The maximum temperature ratings are stated in Table 15. Refer to Table 1 for the associated URCs. All statements are based on test conditions according to IEC 60068-2-2 (still air). MC75_V00.190a Page 30 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft Table 1: Temperature dependent behavior s Sending temperature alert (15 s after MC75 start-up, otherwise only if URC presentation enabled)

^SCTM_A: 1

^SCTM_B: 1

^SCTM_A: -1

^SCTM_B: -1

^SCTM_A: 0

^SCTM_B: 0 Automatic shutdown (URC appears no matter whether or not presentation was enabled)

^SCTM_A: 2 Caution: Tamb of battery close to overtemperature limit. Caution: Tamb of board close to overtemperature limit. Caution: Tamb of battery close to undertemperature limit. Caution: Tamb of board close to undertemperature limit. Battery back to uncritical temperature range. Board back to uncritical temperature range. Alert: Tamb of battery equal or beyond overtemperature limit. MC75 switches off. Alert: Tamb of board equal or beyond overtemperature limit. MC75 switches off. Alert: Tamb of battery equal or below undertemperature limit. MC75 switches off. Alert: Tamb of board equal or below undertemperature limit. MC75 switches off.

^SCTM_B: 2

^SCTM_A: -2

^SCTM_B: -2 Temperature Control during Emergency call 3.2.3.2 If the temperature limit is exceeded while an emergency call is in progress the engine continues to measure the temperature, but deactivates the shutdown functionality. If the temperature is still out of range when the call ends, the module switches off immediately

(without another alert message).

^SBC: Undervoltage. 3.2.3.3 Undervoltage Shutdown if Battery NTC is Present In applications where the modules charging technique is used and an NTC is connected to the BATT_TEMP terminal, the software constantly monitors the applied voltage. If the measured battery voltage is no more sufficient to set up a call the following URC will be presented:

The message will be reported, for example, when you attempt to make a call while the voltage is close to the critical limit and further power loss is caused during the transmit burst. To remind you that the battery needs to be charged soon, the URC appears several times before the module switches off. To enable or disable the URC use the AT^SBC command. The URC will be enabled when you enter the write command and specify the current consumption of your host application. Step by step instructions are provided in [1]. MC75_V00.190a Page 31 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 3.2.3.4 Undervoltage Shutdown if no Battery NTC is Present The undervoltage protection is also effective in applications, where no NTC connects to the BATT_TEMP terminal. Thus, you can take advantage of this feature even though the application handles the charging process or MC75 is fed by a fixed supply voltage. All you need to do is executing the write command AT^SBC=<current> which automatically enables the presentation of URCs. You do not need to specify <current>. Whenever the supply voltage falls below the specified value (see table TBD.) the URC appears several times before the module switches off.

^SBC: Undervoltage 3.2.3.5 Overvoltage Shutdown In the event of the voltage rising above the maximum voltage (see Table TBD) the module sends a URC and then performs an orderly shutdown. Further details: TBD Keep in mind that several MC75 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of MC75, even if the module is switched off. Especially the power amplifier is very sensitive to high voltage and might even be destroyed. MC75_V00.190a Page 32 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Automatic EGPRS/GPRS Multislot Class Change from EGPRS Multislot Class 10 (2 Tx slots) to EGPRS Multislot Class 8 (1Tx), from GPRS Multislot Class 12 (4 Tx slots) to GPRS Multislot Class 8 (1Tx), from GPRS Multislot Class 10 (2 Tx slots) to GPRS Multislot Class 8 (1Tx) 3.3 Temperature control is also effective for operation in EGPRS Multislot Class 10 and GPRS Multislot Class 12. If the board temperature increases to the limit specified for restricted operation1) while data are transmitted over EGPRS or GPRS, the module automatically reverts This reduces the power consumption and, consequently, causes the boards temperature to decrease. Once the temperature drops to a value of 5 degrees below the limit of restricted operation, MC75 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, MC75 will not switch back to the higher class. After a transition from EGPRS Multislot Class 10 to EGPRS Multislot Class 8 a possible switchback to EGPRS Multislot Class 10 is blocked for one minute. The same applies when a transition occurs from GPRS Multislot Class 12 or 10 to GPRS Multislot Class 8. Please note that there is not one single cause of switching over to a lower Multislot Class. Rather it is the result of an interaction of several factors, such as the board temperature that depends largely on the ambient temperature, the operating mode and the transmit power. Furthermore, take into account that there is a delay until the network proceeds to a lower or, accordingly, higher Multislot Class. The delay time is network dependent. In extreme cases, if it takes too much time for the network and the temperature cannot drop due to this delay, the module may even switch off as described in Section 3.2.3.1. 1) See Table 15 for temperature limits known as restricted operation. MC75_V00.190a Page 33 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.4 Charging Control s MC75 integrates a charging management for rechargeable Lithium Ion and Lithium Polymer batteries. You can skip this chapter if charging is not your concern, or if you are not using the implemented charging algorithm. MC75 has no on-board charging circuit. To benefit from the implemented charging management you are required to install a charging circuit within your application according to the Figure 39. The following sections contain an overview of charging and battery specifications. Please refer to [4] for greater detail, especially regarding requirements for batteries and chargers, appropriate charging circuits, recommended batteries and an analysis of operational issues typical of battery powered GSM/GPRS applications. 3.4.1 Battery Pack Requirements The charging algorithm has been optimized for rechargeable Lithium batteries that meet the characteristics listed below and in Table 2. It is recommended that the battery pack you want to integrate into your MC75 application is compliant with these specifications. This ensures reliable operation, proper charging and, particularly, allows you to monitor the battery capacity using the AT^SBC command (see [1] for details). Failure to comply with these specifications might cause AT^SBC to deliver incorrect battery capacity values. Li-Ion or Lithium Polymer battery pack specified for a maximum charging voltage of 4.2 V and a recommended capacity of 1000 to 1200 mAh. Since charging and discharging largely depend on the battery temperature, the battery pack should include an NTC resistor. If the NTC is not inside the battery it must be in thermal contact with the battery. The NTC resistor must be connected between BATT_TEMP and GND. The B value of the NTC should be in the range: 10 k +5% @ 25C, B25/85 = 3423K to B

=3435K 3% (alternatively acceptable: 10 k +2% @ 25C, B25/50 = 3370K +3%). Please note that the NTC is indispensable for proper charging, i.e. the charging process will not start if no NTC is present. Ensure that the pack incorporates a protection circuit capable of detecting overvoltage

(protection against overcharging), undervoltage (protection against deep discharging) and overcurrent. Due to the discharge current profile typical of GSM applications, the circuit must be insensitive to pulsed current. On the MC75 module, a built-in measuring circuit constantly monitors the supply voltage. In the event of undervoltage, it causes MC75 to power down. Undervoltage thresholds are specific to the battery pack and must be evaluated for the intended model. When you evaluate undervoltage thresholds, consider both the current consumption of MC75 and of the application circuit. The internal resistance of the battery and the protection should be as low as possible. It is recommended not to exceed 150m, even in extreme conditions at low temperature. The battery cell must be insensitive to rupture, fire and gassing under extreme conditions of temperature and charging (voltage, current). The battery pack must be protected from reverse pole connection. For example, the casing should be designed to prevent the user from mounting the battery in reverse orientation. It is recommended that the battery pack be approved to satisfy the requirements of CE conformity. MC75_V00.190a Page 34 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft to BATT+

Figure 8 shows the circuit diagram of a typical battery pack design that includes the protection elements described above. Figure 8: Battery pack circuit diagram Table 2: Specifications of battery packs suitable for use with MC75 s to BATT_TEMP to GND NTC Protection Circuit

Battery cell Polyfuse Battery type Nominal voltage Capacity NTC Overcharge detection voltage Overdischarge detection voltage Overcurrent detection Overcurrent detection delay time Short detection delay time Internal resistance Rechargeable Lithium Ion or Lithium Polymer battery 3.6V / 3.7V Recommended: 1000mAh to 1200mAh Minimum: 500mAh 10k 5% @ 25C B value range: B (25/85)=3423K to B =3435K 3%

4.325 0.025V 2.5 0.05V 3 0.5A 4ms 50s

<130m Note: A maximum internal resistance of 150m should not be exceeded even after 500 cycles and under extreme conditions. 3.4.2 Batteries Recommended for Use with MC75 When you choose a battery for your MC75 application you can take advantage of one of the following two batteries offered by VARTA Microbattery GmbH. Both batteries meet all requirements listed above. They have been thoroughly tested by Siemens and proved to be equally suited for MC75. LIP 633450A1B PCM.STB, type Lithium Ion This battery is listed in the standard product range of VARTA. Incorporated in a shrink sleeve, the battery is CE approved. Therefore it has been chosen for integration into the reference setup submitted for Type Approval of Siemens GSM modules. LPP 503759CA PCM.NTC.LT50, type Lithium Polymer This battery has been especially designed by VARTA for use with Siemens GSM modules. It has the same properties as the above Li-Ion battery, except that it is type Polymer, is smaller, comes without casing and is not CE approved. Specifications, construction drawings and sales contacts for both VARTA batteries can be found in Section 9.3. MC75_V00.190a Page 35 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.4.3 Charger Requirements s the implemented charging algorithm and For using recommended in [4] and in Figure 39, the charger has to meet the following requirements:

Output voltage:

Output current:

5.2Volts 0.2V (stabilized voltage) 500mA Chargers with a higher output current are acceptable, but please consider that only 500mA will be applied when a 0.3 Ohms shunt resistor is connected between VSENSE and ISENSE. See [4] for further details. the reference charging circuit 3.4.4 Implemented Charging Technique If the external charging circuit of your application and the charger meet the requirements listed above, charging is enabled in various stages depending on the battery condition:

Trickle charging:

Trickle charge current flows over the VCHARGE line. Trickle charging is done when a charger is present (connected to VCHARGE) and the battery is deeply discharged or has undervoltage. If deeply discharged (Deep Discharge Lockout at VBATT+= 02.5V) the battery is charged with 5mA, in case of undervoltage

(Undervoltage Lockout at VBATT+= 2.53.2V) it is charged with 25mA Software controlled charging:

Controlled over the CHARGEGATE. Temperature conditions: 0C to 45C Software controlled charging is done when the charger is present (connected to VCHARGE) and the battery voltage is at least above the undervoltage threshold. Software controlled charging passes the following stages:

- Power ramp: Depending on the discharge level of the battery (i.e. the measured battery voltage VBATT+) the software adjusts the maximum charge current for charging the battery. The duration of power ramp charging is very short (less than 30 seconds).

- Fast charging: Battery is charged with constant current (approx. 500mA) until the battery voltage reaches 4.2V (approx. 70% of the battery capacity).

- Top-up charging: The battery is charged with constant voltage of 4.2V at stepwise reducing charge current until full battery capacity is reached. The duration of software controlled charging depends on the battery capacity and the level of discharge. MC75_V00.190a Page 36 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.4.5 Operating Modes during Charging s Of course, the battery can be charged regardless of the engine's operating mode. When the GSM module is in Normal mode (SLEEP, IDLE, TALK, GPRS IDLE or GPRS DATA mode), it remains operational while charging is in progress (provided that sufficient voltage is applied). The charging process during the Normal mode is referred to as Charge mode. If the charger is connected to the charger input of the external charging circuit and the modules VCHARGE pin while MC75 is in Power-down mode, MC75 goes into Charge-only mode. Table 3: Comparison Charge-only and Charge mode Description of mode Battery can be charged while GSM module remains operational and registered to the GSM network. In IDLE and TALK mode, the serial interfaces are accessible. All AT commands can be used to full extent. NOTE: If the module operates at maximum power level (PCL5) and GPRS Class 12 at the same time current consumption is higher than the current supplied by the charger. Battery can be charged while GSM engine is deregistered from GSM network. Charging runs smoothly due current consumption. to constant The AT interface is accessible and allows to use the commands listed below. e d o m e g r a h C l e d o m y n o

e g r a h C How to activate mode Connect charger to charger input of host application charging circuit and modules VCHARGE pin while MC75 is operating, e.g. in IDLE or TALK mode in SLEEP mode Connect charger to charger input of host application charging circuit and modules VCHARGE pin while MC75 is in Power-down mode in Normal mode: Connect charger to the VCHARGE pin, then enter AT^SMSO. trickle charging is switched off. in NOTE: While the host progress, be sure application the application is fed from the trickle charge current the module might be prevented from proceeding to software controlled charging since the current would not be sufficient. that is If Table 4: AT commands available in Charge-only mode AT command Use AT+CALA AT+CCLK AT^SBC AT^SCTM AT^SMSO Set alarm time Set date and time of RTC Query status of charger connection. Enable / disable ^SBC URCs. Query temperature range, enable/disable URCs to report critical temperature ranges AT^SMSO shuts down the module, but if the charger remains connected the module will automatically restart into Charge-only mode. MC75_V00.190a Page 37 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.5 RTC Backup s The internal Real Time Clock of MC75 is supplied from a separate voltage regulator in the analog controller which is also active when MC75 is in POWER DOWN status. An alarm function is provided that allows to wake up MC75 without logging on to the GSM network. In addition, you can use the VDDLP pin on the board-to-board connector to backup the RTC from an external capacitor or a battery (rechargeable or non-chargeable). The capacitor is charged by the BATT+ line of MC75. If the voltage supply at BATT+ is disconnected the RTC can be powered by the capacitor. The size of the capacitor determines the duration of buffering when no voltage is applied to MC75, i.e. the larger the capacitor the longer MC75 will save the date and time. A serial 1k resistor placed on the board next to VDDLP limits the charge current of an empty capacitor or battery. The following figures show various sample configurations. Please refer to Table 16 for the parameters required. Baseband processor RTC PSU B2B 1k BATT+

VDDLP

Figure 9: RTC supply from capacitor Baseband processor RTC BATT+

PSU B2B 1k VDDLP

Figure 10: RTC supply from rechargeable battery Baseband processor RTC PSU B2B 1k BATT+

VDDLP

Figure 11: RTC supply from non-chargeable battery MC75_V00.190a Page 38 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.6 SIM Interface s The baseband processor has an integrated SIM interface compatible with the ISO 7816 IC Card standard. This is wired to the host interface (board-to-board connector) in order to be connected to an external SIM card holder. Six pins on the board-to-board connector are reserved for the SIM interface. The SIM interface supports 3V and 1.8V SIM cards. Please refer to Table 16 for electrical specifications of the SIM interface lines depending on whether a 3V or 1.8V SIM card is used. The CCIN pin serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCIN pin is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with MC75 and is part of the Siemens reference equipment submitted for type approval. See Chapter 8 for Molex ordering numbers. Table 5: Signals of the SIM interface (board-to-board connector) Description Signal CCGND Separate ground connection for SIM card to improve EMC. Be sure to use this ground line for the SIM interface rather than any other ground pin or plane on the module. A design example for grounding the SIM interface is shown in Figure 39. CCCLK Chipcard clock, various clock rates can be set in the baseband processor. CCVCC SIM supply voltage. CCIO CCRST Chipcard reset, provided by baseband processor. CCIN Serial data line, input and output. Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruction of the SIM. The CCIN pin is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN pin is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of MC75. The total cable length between the board-to-board connector pins on MC75 and the pins of the external SIM card holder must not exceed 100 mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using the CCGND line to shield the CCIO line from the CCCLK line. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializing any SIM card that the user inserts after having removed a SIM card during operation. In this case, the application must restart MC75. MC75_V00.190a Page 39 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.7 Serial Interface ASC0 s MC75 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table 16. MC75 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line GSM module (DCE) Application (DTE) TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 TXD RXD RTS CTS DTR DSR DCD RING Figure 12: Serial interface ASC0 Features Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. ASC0 is primarily designed for controlling voice calls, transferring CSD, fax and GPRS data and for controlling the GSM engine with AT commands. Full Multiplex capability allows the interface to be partitioned into three virtual channels, yet with CSD and fax services only available on the first logical channel. Please note that when the ASC0 interface runs in Multiplex mode, ASC1 cannot be used. For more details on Multiplex mode see [5]. The DTR0 signal will only be polled once per second from the internal firmware of MC75. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. See [1] for details on how to configure the RING0 line by AT^SCFG. By default, configured for 8 data bits, no parity and 1 stop bit. The setting can be changed using the AT command AT+ICF and, if required, AT^STPB. For details see [1]. ASC0 can be operated at bit rates from 300bps to 460800 bps. Autobauding supports the following bit rates: TBD. Autobauding is not compatible with multiplex mode. Supports RTS0/CTS0 hardware flow control and XON/XOFF software flow control. MC75_V00.190a Page 40 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft Table 6: DCE-DTE wiring of ASC0 s Pin function TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 DCE Signal direction Input Output Input Output Input Output Output Output Pin function TXD RXD RTS CTS DTR DSR DCD

/RING DTE Signal direction Output Input Output Input Output Input Input Input V.24 circuit 103 104 105 106 108/2 107 109 125 MC75_V00.190a Page 41 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.8 Serial Interface ASC1 s MC75 offers a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-

T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or inactive state). For electrical characteristics please refer to Table 16. MC75 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line GSM module (DCE) Application (DTE) TXD1 RXD1 RTS1 CTS1 TXD RXD RTS CTS Figure 13: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware handshake. On ASC1 no RING line is available. The indication of URCs on the second interface depends on the settings made with the AT^SCFG command. For details refer to [1]. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at bit rates from 300bps to 460800 bps. Autobauding TBD. Supports RTS1/CTS1 hardware flow control and XON/XOFF software flow control. Table 7: DCE-DTE wiring of ASC1 Pin function TXD1 RXD1 RTS1 CTS1 DCE Signal direction Input Output Input Output Pin function TXD RXD RTS CTS DTE Signal direction Output Input Output Input V.24 circuit 103 104 105 106 MC75_V00.190a Page 42 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.9 USB Interface s MC75 supports a USB 2.0 Full Speed (12 Mbit/s) device interface. It is primarily intended for use as command and data interface and for downloading firmware. The USB I/O-pins are capable of driving the signal at min 3.0V. They are 5V I/O compliant. To properly connect the modules USB interface to the host a USB 2.0 compatible connector is required. Furthermore, the USB modem driver delivered with MC75 must be installed as described below. The USB host is responsible for supplying, across the VUSB_IN line, power to the modules USB interface, but not to other MC75 interfaces. This is because MC75 is designed as a self-

powered device compliant with the Universal Serial Bus Specification Revision 2.01. 3V lin. Regulator 5V VUSB_IN PSU 1.5kOhms 22Ohms 22Ohms USB_DP USB_DN r o t c e n n o c d r a o b

o t

d r a o b e o p 0 8 l VBUS GND D+

D-

Host GSM module Figure 14: USB circuit MCU USB Transceiver Baseband controller 1 The specification is ready for download on http://www.usb.org/developers/docs/

MC75_V00.190a Page 43 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 3.9.1 Installing the USB Modem Driver This section assumes you are familiar with installing and configuring a modem under Windows 2000 and Windows XP. As both operating systems use multiple methods to access modem settings this section provides only a brief summary of the most important steps. Take care that the usbmodem.inf file delivered with MC75 is at hand. Connect the USB cable to the MC75 host application (for example the evaluation board DSB75) and the PC. Windows detects MC75 as a new USB modem, opens the Found New Hardware Wizard and reports that it is searching for the Siemens AG WM USB Modem driver. Follow the instructions on the screen and specify the path where the usbmodem.inf file is located. Windows will copy the required software to your computer and configure the modem by assigning a free COM port. If you are already using more than one COM port then the next free one will be allocated. Click Finish to complete the installation. Notes for Windows 2000 only:

During the installation procedure you will be prompted for the usbser.sys driver. Make sure the file is present before you start installing the above inf file. The usbser.sys file is not delivered as a single file, but must be extracted from a Windows 2000 cabinet file. This is either the file driver.cab located in the I386 folder of the original Windows 2000 CD or a later cabinet file inside the Service Pack. SP4 for example includes the sp4.cab file which can be found in its I386 folder. The usbser.sys driver from the Service Pack has priority over one provided with the standard Windows 2000 install CD. It is necessary to restart Windows 2000 to make the changes take effect. MC75_V00.190a Page 44 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s You can find the Siemens AG WM USB Modem listed under Control Panel | Phone and Modem Options |

Modems. Troubleshooting for installation problems to If Windows assign free COM port to MC75 and, for example, allocates a COM port already used by another modem you can manually select a free port as follows:

Open the Windows Device Manager, select the installed Siemens AG WM USB Modem, click Properties, select the Advanced tab and click Advanced Port settings. the listbox Port Number choose a free the port. To make changes effect disconnect re-

connect the USB cable. If not yet successful, also restart Windows. fails the next From COM take and MC75_V00.190a Page 45 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s I2C Interface 3.10 I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400 kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The MC75 module acts as a single master device, e.g. the clock I2CCLK is driven by module. I2CDAT is a bi-directional line. Each device connected to the bus is software addressable by a unique address, and simple master/slave relationships exist at all times. The module operates as master-transmitter or as master-receiver. The customer application transmits or receives data only on request of the module. To configure and activate the I2C interface use the AT^SSPI command described in

[1]. The I2C interface can be powered from an external supply or via the VEXT line of MC75. If connected to the VEXT line the I2C interface will be properly shut down when the module enters the Power-down mode. If you prefer to connect the I2C interface to an external power supply, take care that VCC of the application is in the range of VVEXT and that the interface is shut down when the PWR_IND signal goes high. See figures below as well as Section 7 and Figure 39. In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage via a pull-up resistor. For electrical characteristics please refer to Table 16. GSM module I2DAT I2CCLK GND GSM module VEXT I2DAT I2CCLK GND Rp Rp Application VCC w VEXT I2DAT I2CCLK GND Figure 15: I2C interface connected to VCC of application Application Rp Rp I2DAT I2CCLK GND Figure 16: I2C interface connected to VEXT line of MC75 Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. MC75_V00.190a Page 46 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.11 SD Memory Card Interface s The SD card interface is compliant with the SD Memory Card Specifications / Part 1 Physical Layer Specification, Version 1.01. The interface supports the following features:

Data rates up to 3250 kByte/s. The read/write data rate depends on the clock rate. SD card insertion detection (at SD_D3-line) or via SD_DET line as option (CD switch in SD card holder required) Write protect detection via SD_WP line is optional (WP switch in SD card holder required) Maximum capacity of SD cards compliant with the above SD Memory Card Specification The SD memory card interface can be powered from an external supply or via the VEXT line of MC75. If connected to the VEXT line the SD memory card interface will be properly shut down when the module enters the Power-down mode. If you prefer to connect the SD card interface to an external power supply, take care that the interface is shut down when the PWR_IND signal goes high. See also Section 7 and Figure 39. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SD memory card during operation. is 4 GByte. Table 8: SD card interface Signal SD_D0 SD_D1 SD_D2 SD_D3 SD_CMD SD_CLK SD_WP SD_DET I/O I/O I/O I/O I/O O O I I Description 4 bit data bus Command / Response Clock Remark

Card detect at power on:

0 or open 1 or 50k pullup Note: This is no removal detection during card operation!

25.4kHz 13MHz Clock rise and fall time: max. 10ns

= Card removed

= Card inserted Write protect detection 0= unlocked Card detection

(optional) 1= locked

(External pull-up resistor required) 0= card inserted 1= card removed Power supply from external source or from VEXT line Required power supply: min. 2.7V, max. 3.6V. Note: Good care should be taken when creating the PCB layout of the host application: The traces of SD_CLK, SD_CMD, and SD_D(0..3) should be equal in length and as short as possible. MC75_V00.190a Page 47 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s SD_WP SD_DET SD_D1 SD_D0 SD_CLK VEXT SD_CMD SD_D3 SD_D2 r o t c e n n o c d r a o b

o t

d r a o b e o p 0 8 l 47k 8 7 6 5 4 3 2 1 9 Write protect slide Card detect k c o l 1) 50k k c o n u l DAT1 DAT0 GND CLK VDD GND CMD CD/DAT3 DAT2 SD card GSM module SD card holder 1) Internal switch is closed after power-up and open during regular data transfer. Used for card detection. Baseband controller Analog controller Figure 17: SD card interface (example with power supply from modules VEXT line) MC75_V00.190a Page 48 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.12 Audio Interfaces s MC75 comprises three audio interfaces available on the board-to-board connector:

Two analog audio interfaces, both with balanced or single-ended inputs/outputs. Serial digital audio interface (DAI) designed for PCM (Pulse Code Modulation). This means you can connect up to three different audio devices, although only one interface can be operated at a time. Using the AT^SAIC command you can easily switch back and forth. MICP1 MUX A D D A DSP Air Interface MUX MUX h c t i w s g o a n A l Digital Audio Interface MICN1 MICP2 MICN2 EPP1 EPN1 EPP2 EPN2 VMIC AGND USC0 USC1 USC2 USC3 USC4 USC5 USC6 Figure 18: Audio block diagram To suit different types of accessories the audio interfaces can be configured for different audio modes via the AT^SNFS command. The electrical characteristics of the voiceband part vary with the audio mode. For example, sending and receiving amplification, sidetone paths, noise suppression etc. depend on the selected mode and can be altered with AT commands

(except for mode 1). Both analog audio interfaces can be used to connect headsets with microphones or speakerphones. Headsets can be operated in audio mode 3, speakerphones in audio mode 2. Audio mode 5 can be used for a speech coder without signal pre or post processing. When shipped from factory, all audio parameters of MC75 are set to interface 1 and audio mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Siemens reference configuration. Audio mode 1 has fix parameters which cannot be modified. To adjust the settings of the Votronic handset simply change to another audio mode. MC75_V00.190a Page 49 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.12.1 Speech Processing s The speech samples from the ADC or DAI are handled by the DSP of the baseband controller to calculate e.g. amplifications, sidetone, echo cancellation or noise suppression depending on the configuration of the active audio mode. These processed samples are passed to the speech encoder. Received samples from the speech decoder are passed to the DAC or DAI after post processing (frequency response correction, adding sidetone etc.). Full rate, half rate, enhanced full rate, adaptive multi rate (AMR), speech and channel encoding including voice activity detection (VAD) and discontinuous transmission (DTX) and digital GMSK modulation are also performed on the GSM baseband processor. 3.12.2 Microphone Circuit MC75 has two identical analog microphone inputs. There is no on-board microphone supply circuit, except for the internal voltage supply VMIC and the dedicated audio ground line AGND. Both lines are well suited to feed a balanced audio application or a single-ended audio application. The AGND line on the MC75 board is especially provided to achieve best grounding conditions for your audio application. As there is less current flowing than through other GND lines of the module or the application, this solution will avoid hum and buzz problems. Single-ended Microphone Input 3.12.2.1 Figure 19 as well as Figure 39 show an example of how to integrate a single-ended microphone input. VMIC RVMIC RA RA CF RB CK MICPx MICNx AGND VBias GSM module RA = typ. 2k RB = typ. 5k RVMIC = typ. 470Ohm Ck = typ. 100nF CF = typ. 22F VMIC = typ. 2.5V Vbias = 1.0V 1.6V, typ. 1.5V Figure 19: Single ended microphone input RA has to be chosen so that the DC voltage across the microphone falls into the bias voltage range of 1.0V to 1.6V and the microphone feeding current meets its specification. The MICNx input is automatically self biased to the MICPx DC level. It is AC coupled via CK to a resistive divider which is used to optimize supply noise cancellation by the differential microphone amplifier in the module. MC75_V00.190a Page 50 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be attached as a simple first order RC-network (RVMIC and CF). This circuit is well suited if the distance between microphone and module is kept short. Due to good grounding the microphone can be easily ESD protected as its housing usually connects to the negative terminal. Differential Microphone Input 3.12.2.2 Figure 20 shows a differential solution for connecting an electret microphone. RA = typ. 1k RVMIC = 470Ohm CK = typ. 100nF CF = typ. 22F VMIC = typ. 2.5V Vbias = 1.0V 1.6V, typ. 1.5V VMIC RVMIC RA CF VBias RA CK MICPx MICNx AGND GSM module Figure 20: Differential microphone input The resulting DC voltage between MICPx and AGND should be in the range of 1.0V to 1.6V to bias the input amplifier. MICNx is automatically self biased to the MICPx DC level. The resulting AC differential voltage is then amplified in the GSM module. The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be attached as a simple first order RC-network (RVMIC and CF). The advantage of this circuit is that it can be used if the application involves longer lines between microphone and module. MC75_V00.190a Page 51 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Line Input Configuration with OpAmp 3.12.2.3 Figure 21 shows an example of how to connect an opamp into the microphone circuit.

CK CK CF R R VMIC RVMIC MICPx MICNx VBias AGND GSM module RA = typ. 47k RVMIC = 470Ohm Ck = typ. 100nF CF = typ. 22F VMIC = typ. 2.5V Vbias = typ. VMIC = 1.25V Figure 21: Line input configuration with OpAmp The AC source (e.g. an opamp) and its reference potential have to be AC coupled to the MICPx resp. MICNx input terminals. The voltage divider between VMIC and AGND is necessary to bias the input amplifier. MICNx is automatically self biased to the MICPx DC level. The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be attached as a simple first order RC-network (RVMIC and CF). If a high input level and a lower gain are applied the filter is not necessary. If desired, MICNx via CK can also be connected to the inverse output of the AC source instead of connecting it to the reference potential for differential line input. MC75_V00.190a Page 52 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.12.3 Loudspeaker Circuit s The GSM module comprises two analog speaker outputs: EP1 and EP2. Output EP1 is able to drive a load of 8Ohms while the output EP2 can drive a load of 32Ohms. Each interface can be connected in differential and in single ended configuration. See examples in Figure 22 and Figure 23. Loudspeaker impedance EPP1/EPN1 ZL = typ. 8Ohm EPP2/EPN2 ZL = typ. 32Ohm Loudspeaker impedance EPP1/EPN1 ZL = typ. 8Ohm Ck = 220F EPP2/EPN2 ZL = typ. 32Ohm Ck = 47F GSM module EPPx EPNx AGND Figure 22: Differential loudspeaker configuration GSM module EPPx EPNx AGND

Ck Figure 23: Single ended loudspeaker configuration MC75_V00.190a Page 53 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.12.4 Digital Audio Interface DAI s The DAI can be used to connect audio devices capable of PCM (Pulse Code Modulation), for example a codec. Table 9: Overview of USC pin functions Signal name on B2B connector USC0 (DAI0) USC1 (DAI1) USC2 (DAI2) USC3 (DAI3) USC4 (DAI4) USC5 (DAI5) USC6 (DAI6) Function for PCM Interface Input/Output REF_CLK_13M Reserved for future use REF_CLK_8K (Bit clock slave) BITCLK FS_IN (Frame sync slave) RXDAI TXDAI O I O I I I O To clock input and output PCM samples the PCM interface requires a clock (BITCLK) which is synchronous to the 26 MHz system clock. The customer application must be designed to generate this bit clock by a PLL circuit or a divider controlled by one of the two following reference clock signals:

REF_CLK_13M that is equal to the system clock of 13 MHz. REF_CLK_8K that is an 8 kHz signal divided from the system clock. The frequency of the bit clock can vary from 256 kHz to 2048 kHz. The PCM interface is slave for the bit clock and the frame sync signals generated by the external codec. PCM interface of the GSM module BITCLK FS_IN TXDAI RXDAI REF_CLK8 REF_CLK13 e.g. 256kHz Codec bitclk frame sync RX_data TX_data PLL or divider

frame sync logic Figure 24: PCM interface application MC75_V00.190a Page 54 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s The timing of a PCM short frame is shown in Figure 25. In PCM mode, 16-bit data are transferred in both directions at the same time. The duration of a frame sync pulse is one BITCLK period, starting at the rising edge of BITCLK. TXDAI data is shifted out at the next rising edge of BITCLK. The most significant bit is transferred first. Data transmitted from RXDAI of the internal application is sampled at the falling edge of BITCLK. 125s BITCLK FS_IN TXDAI RXDAI 1 MSB 16 LSB Figure 25: PCM timing MC75_V00.190a Page 55 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 3.13 Control Signals 3.13.1 Synchronization Signal s The synchronization signal serves to indicate growing power consumption during the transmit burst. The signal is generated by the SYNC pin (pin number 32). Please note that this pin can adopt three different operating modes which you can select by using the AT^SSYNC command: the mode AT^SSYNC=0 described below, and the two LED modes AT^SSYNC=1 or AT^SSYNC=2 described in [1] and Section 3.13.2. The first function (factory default AT^SSYNC=0) is recommended if you want your application to use the synchronization signal for better power supply control. Your platform design must be such that the incoming signal accommodates sufficient power supply to the MC75 module if required. This can be achieved by lowering the current drawn from other components installed in your application. The timing of the synchronization signal is shown below. High level of the SYNC pin indicates increased power consumption during transmission. 1 Tx 577 s every 4.616 ms 2 Tx 1154 s every 4.616 ms 1 Tx 577 s every 4.616 ms 2 Tx 1154 s every 4.616 ms Transmit burst Transmit burst SYNC signal*) SYNC signal*) t = TBD 300 s Figure 26: SYNC signal during transmit burst

*) The duration of the SYNC signal is always equal, no matter whether the traffic or the access burst are active. MC75_V00.190a Page 56 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 3.13.2 Using the SYNC Pin to Control a Status LED As an alternative to generating the synchronization signal, the SYNC pin can be configured to drive a status LED that indicates different operating modes of the MC75 module. To take advantage of this function the LED mode must be activated with the AT^SSYNC command and the LED must be connected to the host application. The connected LED can be operated in two different display modes (AT^SSYNC=1 or AT^SSYNC=2). For details please refer to

[1]. Especially in the development and test phase of an application, system integrators are advised to use the LED mode of the SYNC pin in order to evaluate their product design and identify the source of errors. To operate the LED a buffer, e.g. a transistor or gate, must be included in your application. A sample cicuit is shown in Figure 27. Power consumption in the LED mode is the same as for the synchronization signal mode. For details see Table 16, SYNC pin. Figure 27: LED Circuit (Example) MC75_V00.190a Page 57 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Antenna Interface 4 The RF interface has an impedance of 50. MC75 is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Matching networks are not included on the MC75 PCB and should be placed in the host application. Regarding the return loss MC75 provides the following values in the active band:

Table 10: Return loss in the active band State of module Return loss of module Receive Transmit Idle

> 8dB not applicable

< 5dB Recommended return loss of application

> 12dB

> 12dB not applicable The connection of the antenna or other equipment must be decoupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. 4.1 Antenna Installation To suit the physical design of individual applications MC75 offers two alternative approaches to connecting the antenna:

Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on the component side of the PCB (top view on MC75). See Section 4.3 for details. Antenna pad and grounding plane placed on the bottom side. See Section 4.2. The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Siemens reference equipment submitted to type approve MC75. All RF data specified throughout this manual are related to the ARP. For compliance with the test results of the Siemens type approval you are advised to give priority to the connector, rather than using the antenna pad. IMPORTANT: Both solutions can only be applied alternatively. This means, whenever an antenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if the antenna is connected to the pad, then the Hirose connector must be left empty. MC75_V00.190a Page 58 of 91 15.02.2005 s MC75 Hardware Interface Description Strictly confidential / Draft Antenna connected to Hirose connector:

Antenna connected to pad:

Module PAD U.FL Antenna or measurement equipment Module PAD U.FL 50Ohm 50Ohm 50Ohm Z Z Antenna or measurement equipment 50Ohm Figure 28: Never use antenna connector and antenna pad at the same time No matter which option you choose, ensure that the antenna pad does not come into contact with the holding device or any other components of the host application. It needs to be surrounded by a restricted area filled with air, which must also be reserved 0.8 mm in height. U.FL antenna connector PCB RF section Antenna pad Restricted area Figure 29: Restricted area around antenna pad MC75_V00.190a Page 59 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 4.2 Antenna Pad s The antenna can be soldered to the pad, or attached via contact springs. For proper grounding connect the antenna to the ground plane on the bottom of MC75 which must be connected to the ground plane of the application. When you decide to use the antenna pad take into account that the pad has not been intended as antenna reference point (ARP) for the Siemens MC75 type approval. The antenna pad is provided only as an alternative option which can be used, for example, if the recommended Hirose connection does not fit into your antenna design. Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a 50 connector is mandatory for type approval measurements. This requires GSM devices with an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable with adapter. To prevent damage to the module and to obtain long-term solder joint properties you are advised to maintain the standards of good engineering practice for soldering. MC75 material properties:

MC75 PCB:

Antenna pad:

4.2.1 Suitable Cable Types FR4 Gold plated pad For direct solder attachment, we suggest to use the following cable types:

RG316/U 50 Ohm coaxial cable 1671A 50 Ohm coaxial cable Suitable cables are offered, for example, by IMS Connector Systems. For further details and other cable types please contact http://www.imscs.com. MC75_V00.190a Page 60 of 91 15.02.2005 s MC75 Hardware Interface Description Strictly confidential / Draft 4.3 Antenna Connector U.FL-R-SMT MC75 uses an ultra-miniature SMT antenna connector supplied from Hirose Ltd. The product name is:

The position of the antenna connector on the MC75 board can be seen in Figure 30. Figure 30: Mechanical dimensions of U.FL-R-SMT connector Table 11: Product specifications of U.FL-R-SMT connector Item Ratings Nominal impedance Rated frequency Mechanical characteristics Female contact holding force Repetitive operation Vibration Shock Environmental characteristics Humidity resistance Temperature cycle Salt spray test Specification 50 DC to 3 GHz 0.15 N min Contact resistance:

Center 25 m Outside 15m No momentary disconnections of 1 s;

No damage, cracks and looseness of parts No momentary disconnections of 1 s. No damage, cracks and looseness of parts. No damage, cracks and looseness of parts. Insulation resistance:

100 M min. at high humidity 500 M min when dry No damage, cracks and looseness of parts. Contact resistance:

Center 25 m Outside 15m No excessive corrosion Conditions Operating temp:-40c to + 90C Operating humidity: max. 90%

Measured with a 0.475 pin gauge 30 cycles of insertion and disengagement Frequency of 10 to 100 Hz, single amplitude of 1.5 mm, acceleration of 59 m/s2, for 5 cycles in the direction of each of the 3 axes Acceleration of 735 m/s2, 11 ms duration for 6 cycles in the direction of each of the 3 axes Exposure to 40C, humidity of 95% for a total of 96 hours Temperature: +40C 5 to 35C

+90C 5 to 35C Time: 30 min. within 5 min. 30 min. within 5 min 48 hours continuous exposure to 5% salt water MC75_V00.190a Page 61 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Table 12: Material and finish of U.FL-R-SMT connector and recommended plugs Part Shell Male center contact Female center contact Insulator Material Phosphor bronze Brass Phosphor bronze Plug:

Receptacle:

PBT LCP Finish Silver plating Gold plating Gold plating Black Beige Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown below and listed in Table 13. For latest product information please contact your Hirose dealer or visit the Hirose home page, for example http://www.hirose.com. Figure 31: U.FL-R-SMT connector with U.FL-LP-040 plug Figure 32: U.FL-R-SMT connector with U.FL-LP-066 plug MC75_V00.190a Page 62 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as an extremely space saving solution. This plug is intended for use with extra fine cable (up to 0.81 mm) and minimizes the mating height to 2 mm. See Figure 33 which shows the Hirose datasheet. Figure 33: Specifications of U.FL-LP-(V)-040(01) plug MC75_V00.190a Page 63 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft Table 13: Ordering information for Hirose U.FL Series s Item Connector on MC75 Right-angle plug shell for 0.81 mm cable Right-angle plug for 0.81 mm cable Right-angle plug for 1.13 mm cable Right-angle plug for 1.32 mm cable Extraction jig Part number U.FL-R-SMT U.FL-LP-040 HRS number CL331-0471-0-10 CL331-0451-2 U.FL-LP(V)-040 (01) CL331-053-8-01 U.FL-LP-068 U.FL-LP-066 E.FL-LP-N CL331-0452-5 CL331-0452-5 CL331-04441-9 MC75_V00.190a Page 64 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 5 Electrical, Reliability and Radio Characteristics Absolute Maximum Ratings 5.1 The absolute maximum ratings stated in Table 14 are stress ratings. Stresses beyond any of these limits will cause permanent damage to MC75. Table 14: Absolute maximum ratings Parameter Supply voltage BATT+

Voltage at digital pins Voltage at analog pins Voltage at digital / analog pins in Power-down mode Voltage at VCHARGE pin Voltage at CHARGEGATE pin VUSB_IN VSENSE ISENSE Min

-0.3

-0.3

-0.3 TBD

-0.3

-0.3

-0.3 Max 5.5 3.05 3.0 TBD 5.5 5.5 5.5 5.5 5.5 Unit V V V V V V V V V Operating Temperatures 5.2 Test conditions were specified in accordance with IEC 60068-2 (still air). The values stated below are in compliance with GSM recommendation TS 51.010-01. Table 15: Operating temperatures Parameter Ambient temperature (according to GSM 11.10) Automatic shutdown Ambient temperature for charging (software controlled fast charging) MC75 board temperature Battery temperature Min

-30

-30

-20 0 Typ Max

+25 +65

+90

+60

+45 Unit C C C MC75_V00.190a Page 65 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 5.3 Pin Assignment and Signal Description The Molex board-to-board connector on MC75 is an 80-pin double-row receptacle. The names and the positions of the pins can be seen from Figure 1 which shows the top view of MC75. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 GND nc nc GND Do not use SD_WP Do not use SD_DETECT SD_CMD SD_CLK I2CCLK VUSB_IN USC5 ISENSE USC6 CCCLK CCVCC CCIO CCRST CCIN CCGND USC4 USC3 USC2 USC1 USC0 BATT_TEMP SYNC RXD1 RXD0 TXD1 TXD0 VDDLP VCHARGE CHARGEGATE GND GND GND GND GND GND Do not use PWR_IND Do not use Do not use Do not use SD_D3 SD_D2 SD_D1 SD_D0 I2CDAT USB_DP USB_DN VSENSE VMIC EPN2 EPP2 EPP1 EPN1 MICN2 MICP2 MICP1 MICN1 AGND IGT EMERG_RST DCD0 CTS1 CTS0 RTS1 DTR0 RTS0 DSR0 RING0 VEXT BATT+

BATT+

BATT+

BATT+

BATT+

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 Figure 34: Pin assignment (component side of MC75) MC75_V00.190a Page 66 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Please note that the reference voltages listed in Table 16 are the values measured directly on the MC75 module. They do not apply to the accessories connected. Table 16: Signal description Function Power supply IO Signal form and level I Signal name BATT+

VImax = 4.3V VItyp = 3.8V VImin = 3.2V during Tx burst on board I 2A, during Tx burst n Tx = n x 577s peak current every 4.616ms Ground VImin = 1.015 * VBATT+

VImax = 5.45V Connect NTC with RNTC 10k @ 25C to ground. See Section 3.4.1 for B value of NTC. VImax = 4.65V VImax to VBATT+ = +0.3V at normal condition VImax = 4.5V Power supply Charge Interface GND VCHARGE BATT_TEMP ISENSE VSENSE I I I I CHARGEGATE O VOmax = 5.5V IOmax = 1mA VEXT External supply voltage O Normal mode:

VOmin = 2.75V VOtyp = 2.93V VOmax = 3.05V IOmax = -50mA Comment Five pins of BATT+ and GND must be connected in parallel for supply purposes because higher peak currents may occur. Minimum voltage must not fall below 3.2V including drop, ripple, spikes. Application Ground This line signalizes to the processor that the charger is connected. If unused keep pin open. Battery temperature measurement via NTC resistance. NTC should be installed inside or near battery pack to enable proper charging and deliver temperature values. If unused keep pin open. ISENSE is required for measuring the charge current. For this purpose, a shunt resistor for current measurement needs to be connected between ISENSE and VSENSE. If unused connect pin to VSENSE. VSENSE must be directly connected to BATT+ at battery connector or external power supply. Control line to the gate of charge FET If unused keep pin open. VEXT may be used for application circuits, for example to supply power for an SD Card. If unused keep pin open. Not available in Power-down mode. The external digital logic must not cause any spikes or glitches on voltage VEXT. MC75_V00.190a Page 67 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft Function Power indicator Signal name PWR_IND

[SE10]

IO Signal form and level O VIHmax = 10V VOLmax = 0.4V at Imax = 2mA Ignition IGT I EMERG_RST I Emergency reset RI 30k, CI 10nF VILmax = 0.8V at Imax = -150A VOHmax = 4.5V (VBATT+) ON

~~~|____|~~~ Active Low 300ms RI 5k VILmax = 0.2V at Imax = -0.5mA VOHmin = 1.75V VOHmax = 3.05V Signal ~~~|______|~~~ Pull down 10ms Falling edge resets module. Synchroni-

zation SYNC O VOLmax = 0.3V at I = 0.1mA VOHmin = 2.3V at I = -0.1mA VOHmax = 0.05V n Tx = n x 577s impulse each 4.616ms, with ___s forward time. RTC backup VDDLP I/O RI 1k VOmax = 4.5V VBATT+ = 4.3V:

VO = 3.2V at IO = -500A VBATT+ = 0V:

VI = 2.7V4.5V at Imax= 15A s Comment PWR_IND (Power Indicator) notifies the modules on/off state. PWR_IND is an open collector that needs to be connected to an external pull-

up resistor. Low state of the open collector indicates that the module is on. Vice versa, high level notifies the Power-

down mode. Therefore, the pin may be used to enable external voltage regulators which supply an external logic for communication with the module, e.g. level converters. This signal switches the mobile on. This line must be driven low by an open drain or open collector driver. Reset function in case of emergency: Pull down and release EMERG_RST. Falling edge will reset the module. Data stored in the volatile memory will be lost. For orderly software controlled reset rather use the AT+CFUN command (e.g. AT+CFUN=,1). This line must be driven by open drain or open collector. If unused keep pin open. There are two alternative options for using the SYNC pin:

a) Indicating increased current consumption during uplink transmission burst. Note that the timing of the signal is different during handover. b) Driving a status LED to indicate different operating modes of MC75. The LED must be installed in the host application. If unused keep pin open. If unused keep pin open. MC75_V00.190a Page 68 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft Function SIM interface specified for use with 3V SIM card Signal name CCIN CCRST CCIO CCCLK CCVCC IO Signal form and level I RI 100k VILmax = 0.6V at I = -25A VIHmin = 2.1V at I = -10A, VOmax= 3.05V O RO 47 VOLmax = 0.25V at I = +1mA VOHmin = 2.5V at I = -0.5mA VOHmax = 2.95V I/O RI 4.7k VILmax = 0.75V VILmin = -0.3V VIHmin = 2.1V VIHmax = CCVCCmin + 0.3V = 3.05V RO 100 VOLmax = 0.3V at I = +1mA VOHmin = 2.5V at I = -0.5mA VOHmax = 2.95V O RO 100 VOLmax = 0.3V at I = +1mA VOHmin = 2.5V at I = -0.5mA VOHmax = 2.95V O VOmin = 2.75V, VOtyp = 2.85V VOmax = 2.95V IOmax = -20mA Ground RI 100k VILmax = 0.6V at I = -25A VIHmin = 2.1V at I = -10A, VOmax= 3.05V SIM interface specified for use with 1.8V SIM card ASC0 Serial interface CCGND CCIN I CCRST CCIO CCCLK CCVCC CCGND RXD0 TXD0 CTS0 RTS0 DTR0 DCD0 DSR0 RING0 O RO 47 VOLmax = 0.25V at I = +1mA VOHmin = 1.45V at I = -0.5mA VOHmax = 1.90V I/O RI 4.7k VILmax = 0.45V VIHmin = 1.35V VIHmax = CCVCCmin + 0.3V = 2.00V RO 100 VOLmax = 0.3V at I = +1mA VOHmin = 1.45V at I = -0.5mA VOHmax = 1.90V O RO 100 VOLmax = 0.3V at I = +1mA VOHmin = 1.45V at I = -0.5mA VOHmax = 1.90V O VOmin = 1.70V, VOtyp = 1.80V VOmax = 1.90V IOmax = -20mA Ground VOLmax = 0.2V at I = 2mA VOHmin = 2.55V at I = -0.5mA VOHmax = 3.05V VILmax = 0.8V VIHmin = 2.0V, VIHmax = VEXTmin + 0.3V = 3.05V O I O I I O O O s Comment CCIN = Low, SIM card holder closed Maximum cable length or copper track 100mm to SIM card holder. All signals of SIM interface are protected against ESD with a special diode array. Usage of CCGND is mandatory. CCIN = Low, SIM card holder closed Maximum cable length or copper track 100mm to SIM card holder. All signals of SIM interface are protected against ESD with a special diode array. Usage of CCGND is mandatory. Serial interface for AT commands or data stream. If lines are unused keep pins open. MC75_V00.190a Page 69 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft Function ASC1 Serial interface Signal name RXD1 TXD1 CTS1 RTS1 I2C interface I2CCLK I2CDAT IO Signal form and level O I O I VOLmax = 0.2V at I = 2mA VOHmin = 2.55V at I = -0.5mA VOHmax = 3.05V VILmax = 0.8V VIHmin = 2.0V VIHmax = VEXTmin + 0.3V = 3.05V O VOLmax = 0.2V at I = 2mA VOHmin = 2.55V at I = -0.5mA VOHmax = 3.05V I/O VOLmax = 0.2V at I = 2mA VILmax = 0.8V VIHmin = 2.0V VIHmax = VEXTmin + 0.3V = 3.05V USB VUSB_IN USB_DN USB_DP SD card interface Digital Audio interface SD_D0 SD_D1 SD_D2 SD_D3 SD_CLK SD_WP SD_CMD SD_DETECT USC0 (DAI0) USC1 (DAI1) USC2 (DAI2) USC3 (DAI3) USC4 (DAI4) USC5 (DAI5) USC6 (DAI6) I I/O I/O I/O O I O I O I O I I I O VINmin = 4.0V VINmax = 5.25V Differential Output Crossover voltage Range VCRSmin = 1.5V, VCRSmax = 2.0V Driver Output Resistance ZDRVtyp = 32 Ohm VOLmax = 0.2V at I = 2mA VOHmin = 2.55V at I = -0.5mA VOHmax = 3.05V VILmax = 0.8V VIHmin = 2.0V VIHmax = VEXTmin + 0.3V = 3.05V VOLmax = 0.2V at I = 2mA VOHmin = 2.55V at I = -0.5mA VOHmax = 3.05V VILmax = 0.8V VIHmin = 2.0V VIHmax = VEXTmin + 0.3V = 3.05V s Comment Serial interface for AT commands or data stream. If lines are unused keep pins open. I2CDAT is configured as Open Drain and needs a pull-

up resistor in the host application. According to the I2C Bus Specification Version 2.1 for the fast mode a rise time of max. 300ns is permitted. There is also a maximum VOL=0.4V at 3mA specified. The value of the pull-up depends on the capacitive load of the whole system

(I2C Slave + lines). The maximum sink current of I2CDAT and I2CCLK is 4mA. If lines are unused keep pins open. If lines are unused keep pins open. SD card interface can be connected to VEXT of MC75 or to external power supply. Rise and fall time of SD_CLK signal: max. 10ns. If lines are unused keep pins open. See Table 9 for details. If unused keep pins open. MC75_V00.190a Page 70 of 91 15.02.2005

MC75 Hardware Interface Description Strictly confidential / Draft Function Analog Audio interface Signal name VMIC EPP2 EPN2 EPP1 EPN1 MICP1 MICN1 MICP2 MICN2 AGND O O IO Signal form and level O VOmin = 2.4V VOtyp = 2.5V VOmax = 2.6V Imax = 2mA 1.0954Vpp (differential) typical 3.4Vpp differential maximal Audio mode TBD Measurement conditions TBD Minimum differential resp. single ended load 27 Ohms 1.0954Vpp (differential) typical 6.0 Vp-p differential maximal Audio mode TBD Measurement conditions TBD Minimum differential resp. single ended load 7.5 Ohms Full Scale Input Voltage 1.578 Vpp 0dBm0 Input Voltage 1.0954 Vpp At MICNx, apply external bias from 1.0V to 1.6V. Audio mode TBD Measurement conditions TBD Analog Ground I I I I O O s Comment Microphone supply for customer feeding circuits The audio output can directly operate a 32-Ohm-

loudspeaker. If unused keep pins open. The audio output can directly operate an 8-Ohm-

loudspeaker. If unused keep pins open. Balanced or single ended microphone or line inputs with external feeding circuit (using VMIC and AGND). If unused keep pins open. GND level for external audio circuits MC75_V00.190a Page 71 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Electrostatic Discharge 5.4 The GSM engine is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a MC75 module. Special ESD protection provided on MC75:

Antenna interface: one spark discharge line (spark gap) SIM interface: clamp diodes for protection against overvoltage. The remaining ports of MC75 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the Human Body Model requirements. MC75 has been tested according to the EN 61000-4-2 standard. The measured values can be gathered from the following table. Table 17: Measured electrostatic values Contact discharge Air discharge Specification / Requirements ETSI EN 301 489-7 ESD at SIM port ESD at antenna port 4kV 4kV Human Body Model (Test conditions: 1.5 k, 100 pF) ESD at USB interface ESD at SD card interface ESD at all other interfaces 1kV 1kV 1kV 8kV 8kV 1kV 1kV 1kV Note: Please note that the values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Siemens reference application described in Chapter 8. MC75_V00.190a Page 72 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Reliability Characteristics 5.5 The test conditions stated below are an extract of the complete test specifications. Table 18: Summary of reliability test conditions Type of test Vibration Shock half-sinus Dry heat Temperature change (shock) Conditions Frequency range: 10-20 Hz; acceleration: 3.1mm amplitude Frequency range: 20-500 Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes Acceleration: 500g Shock duration: 1msec 1 shock per axis 6 positions ( x, y and z) Temperature: +70 2C Test duration: 16 h Humidity in the test chamber: < 50%

Low temperature: -40C 2C High temperature: +85C 2C Changeover time: < 30s (dual chamber system) Test duration: 1 h Number of repetitions: 100 Damp heat cyclic High temperature: +55C 2C Low temperature: +25C 2C Humidity: 93% 3%

Number of repetitions: 6 Test duration: 12h + 12h Temperature: -40 2C Test duration: 16 h Cold (constant exposure) Standard DIN IEC 68-2-6 DIN IEC 68-2-27 EN 60068-2-2 Bb ETS 300019-2-7 DIN IEC 68-2-14 Na ETS 300019-2-7 DIN IEC 68-2-30 Db ETS 300019-2-5 DIN IEC 68-2-1 MC75_V00.190a Page 73 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 6 Mechanics 6.1 Mechanical Dimensions of MC75 s Figure 35 shows the top view of MC75 and provides an overview of the board's mechanical dimensions. For further details see Figure 36. Pin 1 Pin 80 Figure 35: MC75 top view MC75_V00.190a Page 74 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s All dimensions in mm Figure 36: Dimensions of MC75 MC75_V00.190a Page 75 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 6.2 Mounting MC75 to the Application Platform There are many ways to properly install MC75 in the host device. An efficient approach is to mount the MC75 PCB to a frame, plate, rack or chassis. Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized to achieve better support. To help you find appropriate spacers a list of selected screws and distance sleeves for 3mm stacking height can be found in Section 9.2. When using the two small holes take care that the screws are inserted with the screw head on the bottom of the MC75 PCB. Screws for the large holes can be inserted from top or bottom. For proper grounding it is strongly recommended to use large ground plane on the bottom of board in addition to the five GND pins of the board-to-board connector. The ground plane may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape. To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device. All the information you need to install an antenna is summarized in Chapter 4. Note that the antenna pad on the bottom of the MC75 PCB must not be influenced by any other PCBs, components or by the housing of the host device. It needs to be surrounded by a restricted space as described in Section 4.1. MC75_V00.190a Page 76 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 6.3 Board-to-Board Application Connector s This section provides the specifications of the 80-pin board-to-board connector used to connect MC75 to the external application. Connector mounted on the MC75 module:

Type:

Supplier: Molex Table 19: Technical specifications of Molex board-to-board connector 52991-0808 SlimStack Receptacle 80 pins, 0.50mm pitch, for stacking heights from 3.0 to 4.0mm, see Figure 37 for details. www.molex.com Parameter Electrical Number of Contacts Contact spacing Voltage Rated current Contact resistance Insulation resistance Dielectric Withstanding Voltage Physical Insulator material (housing) Contact material Insertion force 1st Insertion force 30th Withdrawal force 1st Maximum connection cycles Specification (80-pin B2B connector) 80 0.5mm (.020") 50V 0.5 A max per contact 50m max per contact

> 100 M 500 V AC (for 1 minute) White glass-filled LCP plastic, flammability UL 94V 0 Plating: Gold over nickel

< 74.4 N

< 65.6 N

> 10.8 N 30 (@ 70m max per contact) Mating connector types for the customer's application offered by Molex:

53748-0808 SlimStack Plug, 3mm stacking height, see Figure 38 for details. 53916-0808 SlimStack Plug, 4mm stacking height MC75_V00.190a Page 77 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Figure 37: Molex board-to-board connector 52991-0808 on MC75 MC75_V00.190a Page 78 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Figure 38: Mating board-to-board connector 53748-0808 on application MC75_V00.190a Page 79 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Sample Application 7 Figure 39 shows a typical example of how to integrate a MC75 module into the GSM part of a mobile application. Usage of the various host interfaces depends on the desired features of the application. Audio interface 1 demonstrates the balanced connection of microphone and earpiece. This solution is particularly well suited for internal transducers. Audio interface 2 uses an unbalanced microphone and earpiece connection typically found in headset applications. The charging circuit is optimized for the charging stages (trickle charging and software controlled charging) as well as the battery and charger specifications described in Section 3.4. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply of the microcontroller VCC C. Low state of the open collector pulls the PWR_IND signal low and indicates that the MC75 module is active, high level notifies the Power-down mode. If the module is in Power-down mode avoid current flowing from any other source into the module circuit, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse or return flow. This is not necessary for the USB interface. The SD memory card interface can be powered from an external supply or via the VEXT line of MC75. Figure 39 uses the VEXT line. The advantage of this solution is that when the module enters the Power-down mode, the SD memory card interface is shut down as well. If you prefer to connect an SD card to an external power supply, take care that the interface is shut down when the PWR_IND signal goes high in Power-down mode. The same applies to the I2C interface. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the position of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. However, when connecting cables to the modules interfaces it is strongly recommended to add appropriate ferrite beads for reducing RF radiation. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 39 and the information detailed in this section. As functionality and compliance with national regulations depend to a great amount on the used electronic components and the individual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using MC75 modules. MC75_V00.190a Page 80 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft MC75 Application

(Draft) *) VCC C BC847 BC847 47k 47k 100k Serial Interface ASC0 Serial Interface ASC1

*) I2C 2 x RP SD memory card

*) USB

(Slave) 8 4 2 8 3 SIM 200nF 1nF 27pF VCHARGE BATT+

IGT EMERG_RST PWR_IND BATTEMP VSENSE ISENSE CHARGEGATE VMIC (2.5V) MC75 VEXT (2.9V) SYNC CCIN CCVCC CCRST CCIO CCCLK CCGND 0R (not mounted) GND MICP1 MICN1 MICP2 MICN2 EPN1 EPP1 EPP2 EPN2 AGND s 0.3R SI3441DV CRS04 ESD protection V ch ar ge 5.2V 0.2V

Rechargeable Lithium battery NTC Charger Digital Audio 2.7k 7 22F

*)depends on final specification 470R 100nF 1k 1k 2.2k 2.2k 100nF

>8R 5.6k 100F

>32R All SIM components shall be close to card holder. Figure 39: MC75 sample application (draft) MC75_V00.190a Page 81 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft 8 Reference Approval s Reference Equipment for Type Approval 8.1 The Siemens reference setup submitted to type approve MC75 consists of the following components:

Siemens MC75 cellular engine Development Support Box DSB75 SIM card reader integrated on DSB75 U.FL-R-SMT antenna connector and U.FL-LP antenna cable Handset type Votronic HH-SI-30.3/V1.1/0 Li-Ion battery PC as MMI RS-232 DSB75 B 2 B GSM engine 50 antenna connector (ARP) PC Power supply SIM Li-Ion battery Handset Figure 40: Reference equipment for Type Approval MC75_V00.190a Page 82 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 8.2 Compliance with FCC Rules and Regulations FCC identifier QIPMC75 IC: 267W-MC75 granted to Siemens AG. The FCC Equipment Authorization Certification for the MC75 reference application described in Section 8.1 is listed under the The MC75 reference application registered under the above identifier is certified to be in accordance with the following Rules and Regulations of the Federal Communications Commission (FCC). Power listed is ERP for Part 22 and EIRP for Part 24 This device contains GSM, GPRS Class12 and EGPRS Class 10 functions in the 900 and 1800MHz Band which are not operational in U.S. Territories. This device is to be used only for mobile and fixed applications. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure com-

pliance. Antennas used for this OEM module must not exceed 8.4dBi gain (GSM 1900) and 2.9dBi (GSM 850) for mobile and fixed operating configurations. This device is approved as a module to be installed in other devices. The FCC label of the module must be visible from the outside. If not, the host device is required to bear a second label stating, Contains FCC ID QIPMC75. IMPORTANT: Manufacturers of mobile or fixed devices incorporating MC75 modules are advised to clarify any regulatory questions, have their completed product tested, have product approved for FCC compliance, and include instructions according to above mentioned RF exposure statements in end product user manual. Please note that changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. MC75_V00.190a Page 83 of 91 15.02.2005 s MC75 Hardware Interface Description Strictly confidential / Draft 9 Appendix 9.1 List of Parts and Accessories Table 20: List of parts and accessories Description MC75 Supplier Siemens Ordering information Siemens ordering number: L36880-N8810-N100 Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117 DSB75 Support Box Siemens Siemens ordering number:

Votronic Handset VOTRONIC SIM card holder incl. push button ejector and slide-in tray Board-to-board connector U.FL-R-SMT antenna connector Molex Molex Hirose Votronic HH-SI-30.3/V1.1/0 VOTRONIC Entwicklungs- und Produktionsgesellschaft fr elektronische Gerte mbH Saarbrcker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0

+49-(0)6 89 4 / 92 55-88 Fax:

e-mail:

contact@votronic.com Ordering numbers: 91228 91236 Sales contacts are listed in Table 21. Sales contacts are listed in Table 21. See Section 4.3 connector, mating plugs and cables. Sales contacts are listed in Table 22. for details on U.FL-R-SMT MC75_V00.190a Page 84 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Table 21: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com/

Molex Deutschland GmbH Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany Phone: +49-7066-9555 0 Fax:

+49-7066-9555 29 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. Jurong, Singapore Phone: +65-268-6868

+65-265-6044 Fax:

Molex China Distributors Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Phone: +86-10-6526-9728 Phone: +86-10-6526-9731 Fax:

+86-10-6526-9730 Table 22: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click:

http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax:

+1-805-522-3217 Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Phone: +81-03-3491-9741 Fax:

+81-03-3493-2933 Hirose Electric UK, Ltd Crownhill Business Centre 22 Vincent Avenue, Crownhill Milton Keynes, MK8 OAB Great Britain Phone: +44-1908-305400 Fax: +44-1908-305401 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax:

+1-630-969-1352 Molex Japan Co. Ltd. Yamato, Kanagawa, Japan Phone: +81-462-65-2324 Fax:

+81-462-65-2366 Hirose Electric GmbH Zeppelinstrasse 42 73760 Ostfildern Kemnat 4 Germany Phone: +49-711-4560-021 Fax

+49-711-4560-729 E-mail info@hirose.de Hirose Electric Co., Ltd. European Branche First class Building 4F Beechavenue 46 1119PV Schiphol-Rijk Netherlands Phone: +31-20-6557-460 Fax:

+31-20-6557-469 MC75_V00.190a Page 85 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s 9.2 Fasteners and Fixings for Electronic Equipment This section provides a list of suppliers and manufacturers offering fasteners and fixings for electronic equipment and PCB mounting. The content of this section is designed to offer basic guidance to various mounting solutions with no warranty on the accuracy and sufficiency of the information supplied. Please note that the list remains preliminary although it is going to be updated in later versions of this document. 9.2.1 Fasteners from German Supplier ETTINGER GmbH ETTINGER GmbH http://www.ettinger.de/main.cfm Phone:

+4981 04 66 23 0

+4981 04 66 23 0 Fax:

Sales contact:

The following tables contain only article numbers and basic parameters of the listed components. For further detail and ordering information please contact Ettinger GmbH. Please note that some of the listed screws, spacers and nuts are delivered with the DSB75 Support Board. See comments below. Article number: 05.71.038 Spacer - Aluminum /

Wall thickness = 0.8mm Length Material For internal diameter Internal diameter External diameter Vogt AG No. 3.0 mm AlMgSi-0,5 M2=2.0-2.3 d = 2.4 mm 4.0 mm x40030080.10 MC75_V00.190a Page 86 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Article number: 07.51.403 Length Material Surface Internal diameter External diameter Flammability rating Insulating Spacer for M2 Self-gripping *) 3.0 mm Polyamide 6.6 Black 2.2 mm 4.0 mm UL94-HB

*) 2 spacers are delivered with DSB75 Support Board Article number: 05.11.209 Length Material Thread 1 / Length Thread 2 / Length Width across flats Recess Type Threaded Stud M2.5 - M2 Type E /

External thread at both ends 3.0 mm Stainless steel X12CrMoS17 M2.5 / 6.0 mm M2 / 8.0 mm 5 yes External / External MC75_V00.190a Page 87 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Screw M2 *) DIN 84 - ISO 1207 8.0 mm Steel 4.8 Zinced A2K M2 D = 3.8 mm 1.30 mm Slotted cheese head screw

*) 2 screws are delivered with DSB75 Support Board Screw M2 DIN 84 - ISO 1207 10.0 mm Steel 4.8 Zinced A2K M2 D = 3.8 mm 1.30 mm Slotted cheese head screw Article number: 01.14.131 Length Material Surface Thread Head diameter Head height Type Article number: 01.14.141 Length Material Surface Thread Head diameter Head height Type MC75_V00.190a Page 88 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Article number: 02.10.011 Material Surface Thread Wrench size /

Thickness / L Type Hexagon Nut *) DIN 934 - ISO 4032 Steel 4.8 Zinced A2K M2 4 1.6 mm Nut DIN/UNC, DIN934

*) 2 nuts are delivered with DSB75 Support Board 9.3 Data Sheets of Recommended Batteries The following two data sheets have been provided by VARTA Microbattery GmbH. Click here for sales contacts and further information: http://www.varta-microbattery.com MC75_V00.190a Page 89 of 91 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft MC75_V00.190a Page 90 of 91 s Figure 41: Lithium Ion battery from VARTA 15.02.2005 MC75 Hardware Interface Description Strictly confidential / Draft s Figure 42: Lithium Polymer battery from VARTA MC75_V00.190a Page 91 of 91 15.02.2005