i w e v r e v O e c a f r e n t MC55i-W Version:
DocId:
01.301 MC55i-W_HIO_v01.301 I e r a w d r a H MC55-W Hardware Interface Overview 2 Document Name:
Version:
Date:
DocId:
Status Supported Products:
MC55-W Hardware Interface Overview 01.301 2011-3-8 MC55i-W_HIO_v01.301 Confidential / Released MC55i-W GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-
UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CON-
TAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS;
DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN
"AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, CINTERION WIRELESS MODULES GMBH DIS-
CLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PRO-
VIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-
tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2011, Cinterion Wireless Modules GmbH Trademark Notice Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. MC55i-W_HIO_v01.301 Confidential / Released Page 2 of 30 2011-3-8 MC55i-W Hardware Interface Overview Contents 30 Contents 1 2 3 4 5 6 7 Introduction ................................................................................................................. 6 Related documents ............................................................................................ 6 1.1 Terms and Abbreviations ................................................................................... 7 1.2 Regulatory and Type Approval Information ..................................................... 10 1.3 1.3.1 Directives and Standards.................................................................... 10 SAR Requirements Specific to Portable Mobiles................................ 13 1.3.2 1.3.3 Safety Precautions.............................................................................. 14 Product Concept ....................................................................................................... 15 2.1 MC55i-W Key Features at a Glance ................................................................ 15 Application Interface................................................................................................. 17 Operating Modes ............................................................................................. 18 3.1 Antenna Interface...................................................................................................... 19 Electrical, Reliability and Radio Characteristics.................................................... 20 Absolute Maximum Ratings ............................................................................. 20 5.1 5.2 Operating Temperatures.................................................................................. 21 Storage Conditions .......................................................................................... 22 5.3 Reliability Characteristics................................................................................. 23 5.4 Electrical Specifications of the Application Interface........................................ 24 5.5 5.6 Power Supply Ratings...................................................................................... 25 Mechanics.................................................................................................................. 26 Mechanical Dimensions of MC55i-W ............................................................... 26 6.1 6.2 Board-to-Board Connector............................................................................... 27 6.2.1 Mechanical Dimensions of the Hirose DF12 Connector ..................... 28 Reference Approval .................................................................................................. 29 Reference Equipment for Type Approval......................................................... 29 7.1 7.2 Compliance with FCC Rules and Regulations ................................................. 30 MC55i-W_HIO_v01.301 Confidential / Released Page 3 of 30 2011-3-8 MC55i-W Hardware Interface Overview Tables 92 Tables Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Directives ....................................................................................................... 10 Standards of North American type approval .................................................. 10 Standards of European type approval............................................................ 10 Requirements of quality ................................................................................. 11 Standards of the Ministry of Information Industry of the Peoples Republic of China............................................................................ 11 Toxic or hazardous substances or elements with defined concentration limits 12 Overview of operating modes ........................................................................ 18 Return loss..................................................................................................... 19 Absolute maximum ratings............................................................................. 20 Board temperature ......................................................................................... 21 Ambient temperature according to IEC 60068-2 (w/o forced air circulation).. 21 Ambient temperature with forced air circulation (air speed 0.9m/s)............... 21 Storage conditions ......................................................................................... 22 Summary of reliability test conditions............................................................. 23 Power supply ratings...................................................................................... 25 Ordering information DF12 series.................................................................. 27 Electrical and mechanical characteristics of the Hirose DF12C connector.... 27 MC55i-W_HIO_v01.301 Confidential / Released Page 4 of 92 2011-3-8 MC55i-W Hardware Interface Overview Figures 92 Figures Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Pin assignment .............................................................................................. 24 MC55i-W top view....................................................................................... 26 Hirose DF12C receptacle on MC55i-W.......................................................... 27 Header Hirose DF12 series............................................................................ 27 Mechanical dimensions of Hirose DF12 connector........................................ 28 Reference equipment for approval................................................................. 29 MC55i-W_HIO_v01.301 Confidential / Released Page 5 of 92 2011-3-8 MC55i-W Hardware Interface Overview 1 Introduction 14 1 Introduction This document1 describes the hardware of the MC55i-W module that connects to the cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for in-
tegrating further components. 1.1 Related documents
[1] MC55i-W AT Command Set
[2] MC55i-W Release Notes Prior to using the MC55i-W modules or upgrading to a new firmware release, please carefully read the latest product information. For further information visit the Cinterion Wireless Modules Website:
http://www.cinterion.com 1. The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Cinterion Wireless Modules product. MC55i-W_HIO_v01.301 Confidential / Released Page 6 of 30 2011-3-8 MC55i-W Hardware Interface Overview 1.2 Terms and Abbreviations 14 1.2 Terms and Abbreviations Abbreviation Description ADC AFC AGC ANSI ARFCN ARP ASC0 / ASC1 Asynchronous Serial Controller. Abbreviations used for first and second serial inter-
Analog-to-Digital Converter Automatic Frequency Control Automatic Gain Control American National Standards Institute Absolute Radio Frequency Channel Number Antenna Reference Point ASIC B B2B BER BTS CB or CBM CE CHAP CPU CS CSD CTS DAC DAI dBm0 DCE DCS 1800 DRX DSB DSP DSR DTE DTR DTX EFR EGSM face of MC55i-W Application Specific Integrated Circuit Thermistor Constant Board-to-board connector Bit Error Rate Base Transceiver Station Cell Broadcast Message Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Digital Audio Interface Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. GSM module) Digital Cellular System, also referred to as PCN Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM MC55i-W_HIO_v01.301 Confidential / Released Page 7 of 30 2011-3-8 MC55i-W Hardware Interface Overview 1.2 Terms and Abbreviations 14 Abbreviation Description EMC ESD ETS FCC FDMA FR GMSK GPRS GSM HiZ HR I/O IC IMEI ISO ITU kbps LED Li-Ion Mbps MMI MO MS MSISDN MT MTTF NTC OEM PA PAP PBCCH PCB PCL PCM PCN PCS Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Packet Radio Service Global Standard for Mobile Communications High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Mbits per second Man Machine Interface Mobile Originated Mobile Station (GSM module), also referred to as TE Mobile Station International ISDN number Mobile Terminated Mean time to failure Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Power Control Level Pulse Code Modulation Personal Communications Network, also referred to as DCS 1800 Personal Communication System, also referred to as GSM 1900 MC55i-W_HIO_v01.301 Confidential / Released Page 8 of 30 2011-3-8 MC55i-W Hardware Interface Overview 1.2 Terms and Abbreviations 14 Abbreviation Description PDU PLL PPP PSU R&TTE RAM RF RMS ROM RTC Rx SAR SELV SIM card SMS SRAM TA TDMA TE Tx UART UICC UMTS URC USIM USSD VSWR Phonebook abbreviations FD LD MC ME ON RC SM Protocol Data Unit Phase Locked Loop Point-to-point protocol Power Supply Unit Radio and Telecommunication Terminal Equipment Random Access Memory Radio Frequency Root Mean Square (value) Read-only Memory Real Time Clock Receive Direction Specific Absorption Rate Safety Extra Low Voltage Subscriber Identification Module card; specifies a UICC with SIM application Short Message Service Static Random Access Memory Terminal adapter (e.g. GSM module) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transmit Direction Universal asynchronous receiver-transmitter USIM Integrated Circuit Card Universal Mobile Telecommunications System Unsolicited Result Code UMTS Subscriber Identification Module Unstructured Supplementary Service Data Voltage Standing Wave Ratio SIM fixdialing phonebook SIM last dialling phonebook (list of numbers most recently dialled) Mobile Equipment list of unanswered MT calls (missed calls) Mobile Equipment phonebook Own numbers (MSISDNs) stored on SIM or ME Mobile Equipment list of received calls SIM phonebook MC55i-W_HIO_v01.301 Confidential / Released Page 9 of 30 2011-3-8 MC55i-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 1.3 Regulatory and Type Approval Information 1.3.1 Directives and Standards MC55i-W has been designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "MC55i-W Hardware Interface Description".2 Table 1: Directives 99/05/EC 2002/95/EC Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Direc-
tive 1999/5/EC). The product is labeled with the CE conformity mark Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equip-
ment (RoHS) Table 2: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCC Product Safety Certification (Safety requirements) Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) Canadian Standard UL 60 950 NAPRD.03 V5.4 RSS132 (Issue2) RSS133 (Issue5) Table 3: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Phase 2); Mobile Station (MS) conformance specification ETSI EN 301 511 V9.0.2 Candidate Harmonized European Standard (Telecommunications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essen-
tial requirements under article 3.2 of the R&TTE directive (1999/5/EC)
(GSM 13.11 version 7.0.1 Release 1998) Global Certification Forum - Certification Criteria Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-
tro Magnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 1: Common Technical Requirements GCF-CC V3.40 ETSI EN 301 489-1 V1.8.1 2. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. MC55i-W_HIO_v01.301 Confidential / Released Page 10 of 30 2011-3-8 MC55i-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 Table 3: Standards of European type approval ETSI EN 301 489-7 V1.3.1 Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-
tro Magnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS) Safety of information technology equipment EN 60950-1:2006 Table 4: Requirements of quality IEC 60068 DIN EN 60529 Environmental testing IP codes Table 5: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 Requirements for Concentration Limits for Certain Hazardous Sub-
stances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). SJ/T 11364-2006 According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products
(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Cin-
terion Wireless Modules Hardware Interface Description. Please see Table 6 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. MC55i-W_HIO_v01.301 Confidential / Released Page 11 of 30 2011-3-8 MC55i-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 Table 6: Toxic or hazardous substances or elements with defined concentration limits MC55i-W_HIO_v01.301 Confidential / Released Page 12 of 30 2011-3-8 MC55i-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 1.3.2 SAR Requirements Specific to Portable Mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable MC55i-W based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electro-
magnetic Fields (EMFs) from Mobile Telecommunication Equipment
(MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360:
Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electro-
magnetic fields (300MHz - 3GHz) MC55i-W_HIO_v01.301 Confidential / Released Page 13 of 30 2011-3-8 MC55i-W Hardware Interface Overview 1.3 Regulatory and Type Approval Information 14 1.3.3 Safety Precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating MC55i-W. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-
ure to comply with these precautions violates safety standards of design, manufacture and in-
tended use of the product. Cinterion Wireless Modules GmbH assumes no liability for customer failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-
lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-
turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-
not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electri-
cal equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-
ing a vehicle, unless it is securely mounted in a holder for handsfree operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Handsfree devices must be installed by qualified personnel. Faulty installation or oper-
ation can constitute a safety hazard. IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential commu-
nications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialling etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-
nal or mobile. SOS MC55i-W_HIO_v01.301 Confidential / Released Page 14 of 30 2011-3-8 MC55i-W Hardware Interface Overview 2 Product Concept 16 2 2.1 Product Concept MC55i-W Key Features at a Glance Feature General Frequency bands GSM class Implementation Quad band: GSM 850/900/1800/1900MHz Small MS Output power (according to Release 99, V5) Class 4 (+33dBm 2dB) for EGSM850 Class 4 (+33dBm 2dB) for EGSM900 Class 1 (+30dBm 2dB) for GSM1800 Class 1 (+30dBm 2dB) for GSM1900 Power supply Operating temperature
(board temperature) Physical RoHS GSM / GPRS features Data transfer SMS Fax Audio 3.3V < VBATT+ < 4.8V Normal operation: -30C to +85C Restricted operation: -40C to -30C and +85C to +90C Dimensions: 32.5mm x 35mm x max. 3.1mm Weight: approx. 6g All hardware components fully compliant with EU RoHS Directive Full PBCCH support V.110, RLP, non-transparent 2.4, 4.8, 9.6, 14.4kbps GPRS:
Multislot Class 10 Mobile Station Class B Coding Scheme 1 4 CSD:
USSD PPP-stack for GPRS data transfer Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus 25 SMS locations in mobile equipment Transmission of SMS alternatively over CSD or GPRS. Preferred mode can be user defined. Group 3; Class 2 Speech codecs:
Half Rate (ETS 06.20) Full Rate (ETS 06.10) Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) Adaptive Multi Rate AMR Handsfree operation, echo cancellation, noise reduction, 7 different ringing tones / melodies MC55i-W_HIO_v01.301 Confidential / Released Page 15 of 30 2011-3-8 MC55i-W Hardware Interface Overview 2.1 MC55i-W Key Features at a Glance 16 Feature Software AT commands SIM Application Toolkit TCP/IP stack Firmware update Interfaces 2 serial interfaces Implementation Hayes 3GPP TS 27.007, TS 27.005, Cinterion Wireless Modules AT commands for RIL compatibility Supports SAT class 3, GSM 11.14 Release 99, support of letter class c Protocols: TCP, UDP, HTTP, FTP, SMTP, POP3 Access by AT commands Windows executable for update over serial interface ASC0 ASC0:
8-wire modem interface with status and control lines, unbalanced, asyn-
chronous Fixed bit rates: 300bps to 230,000bps Autobauding: 1,200bps to 230,000bps Supports RTS0/CTS0 hardware handshake and software XON/XOFF flow control. Multiplex ability according to GSM 07.10 Multiplexer Protocol. ASC1:
4-wire, unbalanced asynchronous interface Fixed bit rates: 300bps to 230,000bps Supports RTS1/CTS1 hardware handshake and software XON/XOFF flow control 1 analog interface 1 digital interface (PCM) Supported SIM cards: 3V, 1.8V External SIM card reader has to be connected via interface connector (note that card reader is not part of MC55i-W) 50. External antenna can be connected via antenna connector or solder-
able pad. 50-pin board-to-board connector Switch-on by hardware pin IGT Switch-off by AT command (AT^SMSO) Automatic switch-off in case of critical temperature and voltage conditions Orderly shutdown and reset by AT command Timer functions via AT commands SIM and phone Integrated CTM modem DSB75 Evaluation board designed to test and type approve Cinterion Wire-
less Module and provide a sample configuration for application engineer-
ing. A special adapter is required to connect the module to the DSB75. Audio SIM interface Antenna Module interface Power on/off, Reset Power on/off Reset Special features Real time clock Phonebook TTY/CTM support Evaluation kit DSB75 MC55i-W_HIO_v01.301 Confidential / Released Page 16 of 30 2011-3-8 MC55i-W Hardware Interface Overview 3 Application Interface 18 3 Application Interface MC55i-W is equipped with a 50-pin board-to-board connector that connects to the external ap-
plication. The host interface incorporates several sub-interfaces: power supply, SIM interface, serial interface ASC0, serial interface ASC1, analog audio interface, and DAI/PCM interface
(for details see Chapter 2 and Section 5.5). MC55i-W_HIO_v01.301 Confidential / Released Page 17 of 30 2011-3-8 MC55i-W Hardware Interface Overview 3.1 Operating Modes 18 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to in the following sections. Table 7: Overview of operating modes Mode Normal operation GSM / GPRS Function SLEEP GSM IDLE GSM TALK GPRS IDLE GPRS DATA Various powersave modes set with AT+CFUN command. Software is active to minimum extent. If the module was reg-
istered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too. Power saving can be chosen at different levels: The NON-CYCLIC SLEEP mode
(AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP modes AT+CFUN= 7 and 9 alternatingly activate and deacti-
vate the AT interfaces to allow permanent access to all AT commands. Software is active. Once registered to the GSM network, pag-
ing with BTS is carried out. The module is ready to send and receive. Connection between two subscribers is in progress. Power consumption depends on network coverage individual set-
tings, such as DTX off/on, FR/EFR/HR, hopping sequences, antenna. Module is ready for GPRS data transfer, but no data is cur-
rently sent or received. Power consumption depends on net-
work settings and GPRS configuration (e.g. multislot settings). GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / down-
link data rates and GPRS configuration (e.g. used multislot settings). Power Down Alarm mode Normal shutdown after sending the AT^SMSO command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessi-
ble. Operating voltage (connected to BATT+) remains applied. Restricted operation launched by RTC alert function while the module is in Power Down mode. Module will not be registered to GSM network. Limited number of AT commands is accessible. MC55i-W_HIO_v01.301 Confidential / Released Page 18 of 30 2011-3-8 MC55i-W Hardware Interface Overview 4 Antenna Interface 19 4 Antenna Interface The RF interface has an impedance of 50. MC55i-W is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-
ated power, DC-power consumption and harmonic suppression. Matching networks are not in-
cluded on the MC55i-W PCB and should be placed in the host application. Regarding the return loss MC55i-W provides the following values:
Table 8: Return loss State of module Receive Transmit Idle Return loss of module
> 8dB not applicable
< 5dB Recommended return loss of application
> 12dB
> 12dB not applicable The connection of the antenna or other equipment must be decoupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. MC55i-W_HIO_v01.301 Confidential / Released Page 19 of 30 2011-3-8 MC55i-W Hardware Interface Overview 5 Electrical, Reliability and Radio Characteristics 25 5 5.1 Electrical, Reliability and Radio Characteristics Absolute Maximum Ratings Absolute maximum ratings for supply voltage and voltages on digital and analog pins of MC55i-
W are listed in Table 9. Exceeding these values will cause permanent damage to MC55i-W. Table 9: Absolute maximum ratings Parameter Min
-0.3 Supply voltage BATT+
-0.3 Voltage at digital pins in normal operation
-0.3 Voltage at all digital pins in Power Down mode Voltage at SIM interface, CCVCC 1.8V in normal Operation
-0.3 Voltage at SIM interface, CCVCC 2.85V in normal Operation -0.3
-0.3 Voltage at analogue pins in normal operation
-0.3 Voltage at analogue pins in Power Down mode VDDLP
-0.3 Max
+6.0
+3.3
+0.3
+2.2
+3.3
+3.0
+0.3
+2.5 Unit V V V V V V V V MC55i-W_HIO_v01.301 Confidential / Released Page 20 of 30 2011-3-8 MC55i-W Hardware Interface Overview 5.2 Operating Temperatures 25 5.2 Operating Temperatures Please note that the modules lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the restriced temperature range. A special URC reports whether the module enters or leaves the restriced temperature range (see [1]; AT^SCTM). Table 10: Board temperature Parameter Normal operation Restricted operation Automatic shutdown1 Unit Max
+85 C
+85 to +90 C Min
-30
-40 to -30 Typ
+25 Temperature measured on MC55i-W board
<-40
>+90 C 1. Due to temperature measurement uncertainty, a tolerance of 3C on the thresholds may occur. Table 11: Ambient temperature according to IEC 60068-2 (w/o forced air circulation) Parameter GSM Call @ max. RF-Power GPRS Class 8 @ max. RF-Power GPRS Class 10 @ max. RF-Power (quad band only) Min
-40
-40
-40 Typ Table 12: Ambient temperature with forced air circulation (air speed 0.9m/s) Parameter GSM Call @ max. RF-Power GPRS Class 8 @ max. RF-Power GPRS Class 10 @ max. RF-Power (quad band only) Min
-40
-40
-40 Typ Max
+75
+75
+60 Max
+80
+80
+70 Unit C C C Unit C C C Note that within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and current supply voltage. When data are transmitted over GPRS the quad band module variant automatically reverts to a lower Multislot Class if the temperature rises to the limit specified for normal operation and, vice versa, returns to the higher Multislot Class if the temperature is back to normal. MC55i-W_HIO_v01.301 Confidential / Released Page 21 of 30 2011-3-8 MC55i-W Hardware Interface Overview 5.3 Storage Conditions 25 5.3 Storage Conditions The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. Table 13: Storage conditions Type Air temperature:
Low High Humidity relative:
Low High Condens. Air pressure:
Low High Condition Unit Reference
-40
+85 10 90 at 30C 90-100 at 30C C
ETS 300 019-2-1: T1.2, IEC 60068-2-1 Ab ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
ETS 300 019-2-1: T1.2, IEC 60068-2-56 Cb ETS 300 019-2-1: T1.2, IEC 60068-2-30 Db 70 106 1.0 Movement of surrounding air Water:
rain, dripping, icing and frosting Not allowed Radiation:
Solar Heat Chemically active substances 1120 600 Not recom-
mended kPa m/s IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4
W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb IEC TR 60271-3-1: 1C1L Mechanically active substances Not recom-
mended IEC TR 60271-3-1: 1S1 Vibration sinusoidal:
Displacement Acceleration Frequency range Shocks:
Shock spectrum Duration Acceleration 1.5 5 2-9 9-200 semi-sinusoidal 1 50 mm m/s2 Hz ms m/s2 IEC TR 60271-3-1: 1M2 IEC 60068-2-27 Ea MC55i-W_HIO_v01.301 Confidential / Released Page 22 of 30 2011-3-8 MC55i-W Hardware Interface Overview 5.4 Reliability Characteristics 25 5.4 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 14: Summary of reliability test conditions Type of test Vibration Conditions Frequency range: 10-20 Hz; acceleration: 3.1mm amplitude Frequency range: 20-500 Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes Acceleration: 500g Shock duration: 1msec 1 shock per axis 6 positions ( x, y and z) Temperature: +70 2C Test duration: 16 h Humidity in the test chamber: < 50%
Low temperature: -40C 2C High temperature: +85C 2C Changeover time: < 30s (dual chamber system) Test duration: 1 h Number of repetitions: 100 High temperature: +55C 2C Low temperature: +25C 2C Humidity: 93% 3%
Number of repetitions: 6 Test duration: 12h + 12h Temperature: -40 2C Test duration: 16 h Standard DIN IEC 60068-2-6 DIN IEC 60068-2-27 EN 60068-2-2 Bb ETS 300019-2-7 DIN IEC 60068-2-14 Na ETS 300019-2-7 DIN IEC 60068-2-30 Db ETS 300019-2-5 DIN IEC 60068-2-1 Shock half-sinus Dry heat Temperature change (shock) Damp heat cyclic Cold (constant exposure) MC55i-W_HIO_v01.301 Confidential / Released Page 23 of 30 2011-3-8 MC55i-W Hardware Interface Overview 5.5 Electrical Specifications of the Application Interface 25 5.5 Electrical Specifications of the Application Interface The Hirose DF12C board-to-board connector on MC55i-W is a 50-pin double-row receptacle. The names and the positions of the pins can be seen from Figure 2 which shows the top view of MC55i-W. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 CCCLK CCVCC CCIO CCRST CCIN CCGND RXDDAI TFSDAI SCLK TXDDAI RFSDAI Do not use STATUS RXD1 RXD0 TXD1 TXD0 VDDLP Not connected Not connected GND GND GND GND GND Not connected Not connected EPP EPN VMICN VMICP MICP MICN AGND IGT EMERG_RST DCD0 CTS1 CTS0 RTS1 DTR0 RTS0 DSR0 RING0 VDD BATT+
BATT+
BATT+
BATT+
BATT+
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 Figure 1: Pin assignment MC55i-W_HIO_v01.301 Confidential / Released Page 24 of 30 2011-3-8 MC55i-W Hardware Interface Overview 5.6 Power Supply Ratings 25 5.6 Power Supply Ratings Table 15: Power supply ratings Description Supply voltage BATT+
Maximum allowed voltage drop during transmit burst Voltage ripple IVDDLP IBATT+
1 OFF state supply current OFF state supply current Average supply current Peak current during GSM transmission burst Conditions Directly measured at module. Voltage must stay within the min/
max values, including voltage drop, ripple and spikes. Normal condition, power control level for Pout max Normal condition, power control level for Pout max
@ f<250kHz
@ f>250kHz RTC backup @ BATT+ = 0V POWER DOWN mode SLEEP mode2 @ DRX = 9 SLEEP mode2 @ DRX = 5 SLEEP mode2 @ DRX = 2 IDLE mode2 @ DRX = 2 Voice call GSM850/900, PCL=5 GPRS data transfer GSM850/900 PCL=5, (1Tx/ 4Rx) GPRS data transfer GSM850/900 PCL=5, (2Tx/ 3Rx) Voice call GSM1800/1900, PCL=0 GPRS data transfer GSM1800/1900 PCL=0, (1Tx/ 4Rx) GPRS data transfer GSM1800/1900 PCL=0, (2Tx/ 3Rx) Voice call GSM850, PCL=5 Voice call GSM900, PCL=5 Voice call GSM1800, PCL=0 Voice call GSM1900, PCL=0 1. With an impedance of ZLOAD=50Ohm at the antenna connector. 2. ASC0, ASC1 inactive Measurements start 6 minutes after switching on the module, Averaging times: SLEEP mode - 3 minutes; transfer modes - 1.5 minutes, Communication tester settings: no neighbour cells, no cell reselection etc., RMC (Reference Measurement Channel) 3. At total mismatch. Min 3.3 Typ 4.0 Max 4.8 Unit V 400 mV mVpp 105 30 6.0 45 1.3 1.6 2.2 9.5 180 170 310 135 130 230 1.35 1.30 0.95 0.89 A A mA mA mA mA mA mA mA mA mA mA 1.383 A 1.353 A 0.983 A 0.923 A MC55i-W_HIO_v01.301 Confidential / Released Page 25 of 30 2011-3-8 MC55i-W Hardware Interface Overview 6 Mechanics 28 6 Mechanics The following sections describe the mechanical dimensions of MC55i-W and give recommen-
dations for integrating MC55i-W into the host application. 6.1 Mechanical Dimensions of MC55i-W Figure 2 shows the top view on MC55i-W and provides an overview of the mechanical dimen-
sions of the board. Length:
Width:
Height:
35mm 32.5mm 3.1mm (including board-to-board connector), 2.9mm (excluding connector) Weight:
6g Pin 1 Pin 50 Figure 2: MC55i-W top view MC55i-W_HIO_v01.301 Confidential / Released Page 26 of 30 2011-3-8 MC55i-W Hardware Interface Overview 6.2 Board-to-Board Connector 28 6.2 Board-to-Board Connector This section provides specifications for the 50-pin board-to-board connector which serves as physical interface to the host application. The receptacle assembled on the MC55i-W PCB is type Hirose DF12C. Mating headers from Hirose are available in different stacking heights. Figure 3: Hirose DF12C receptacle on MC55i-W Figure 4: Header Hirose DF12 series Table 16: Ordering information DF12 series Item Part number Receptacle on MC55i-W DF12C(3.0)-50DS-0.5V(81) DF12E(3.0)-50DP-0.5V(81) Headers DF12 series DF12E(3.5)-50DP-0.5V(81) DF12E(4.0)-50DP-0.5V(81) DF12E(5.0)-50DP-0.5V(81) Stacking height (mm) 3 - 5 3.0 3.5 4.0 5.0 HRS number 537-0694-9-81 537-0834-6-**
537-0534-2-**
537-0559-3-**
537-0584-0-**
Note: The headers listed above are without boss and metal fitting. Please contact Hirose for details on other types of mating headers. Asterixed HRS numbers denote different types of packaging. Table 17: Electrical and mechanical characteristics of the Hirose DF12C connector Parameter Number of contacts Quantity delivered Voltage Rated current Resistance Dielectric withstanding voltage Operating temperature Contact material Insulator material Stacking height Insertion force Withdrawal force 1st Withdrawal force 50th Maximum connection cycles Specification (50 pin board-to-board connector) 50 2000 connectors per tape & reel 50V 0.3A max per contact 0.05 per contact 500V RMS min
-45C...+125C phosphor bronze (surface: gold plated) PA , beige natural 3.0 mm ; 3.5 mm ; 4.0 mm ; 5.0 mm 21.8N 10N 10N 50 MC55i-W_HIO_v01.301 Confidential / Released Page 27 of 30 2011-3-8 MC55i-W Hardware Interface Overview 6.2 Board-to-Board Connector 28 6.2.1 Mechanical Dimensions of the Hirose DF12 Connector Figure 5: Mechanical dimensions of Hirose DF12 connector MC55i-W_HIO_v01.301 Confidential / Released Page 28 of 30 2011-3-8 MC55i-W Hardware Interface Overview 7 Reference Approval 30 7 7.1 Reference Approval Reference Equipment for Type Approval The Cinterion Wireless Modules reference setup submitted to type approve MC55i-W consists of the following components:
Antenna GSM / GPRS / UMTS Base Station GSM Antenna with 1m cable ASC0 ASC1 PC Power supply DSB75 Audio Handset SMA Module Module SIM Card Module extern with flexible cable and 50-to-80 adapter to DSB75 Audio Test System Figure 6: Reference equipment for approval MC55i-W_HIO_v01.301 Confidential / Released Page 29 of 30 2011-3-8 MC55i-W Hardware Interface Overview 7.2 Compliance with FCC Rules and Regulations 30 7.2 Compliance with FCC Rules and Regulations The Equipment Authorization Certification for the Cinterion Wireless Modules reference appli-
cation described in Section 7.1 will be registered under the following identifiers:
FCC Identifier: QIPMC55I-W Industry Canada Certification Number: 7830A-MC55IW Granted to Cinterion Wireless Modules GmbH Manufacturers of mobile or fixed devices incorporating MC55i-W modules are authorized to use the FCC Grants and Industry Canada Certificates of the MC55i-W modules for their own final products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID QIPMC55I-W", and accordingly "Contains IC 7830A-MC55IW". IMPORTANT:
Manufacturers of portable applications incorporating MC55i-W modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for por-
table mobiles (see Section 1.3.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. MC55i-W_HIO_v01.301 Confidential / Released Page 30 of 30 2011-3-8