FCC ID: 2A5EY-GSUB-0002 UWB SiP Module

<GSUB-0002>

UWB+BLE Combo SiP Module Pb-free, halogen-free and RoHS compliant Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 1 / 19 Restricted 1. Security warning The information contained in this document is the exclusive property of Goertek Microelectronics Co., Ltd. and should not be disclosed to any third party without the written consent of Goertek Microelectronics Co., Ltd. 2. Publication history Version Date Description Author Approved V0.1 V0.2 V0.3 V0.4 V0.5 2021/10/18 First release 2021/12/18 Update DC/RF Characteristics 2022/02/26 Update Tape and Reel Packing 2022/03/10 Update DC / RF Characteristics 2022/03/14 Update Tape and Reel Packing V0.6 2022/03/25 Update Module Internal Connection Update Recommend Footprint Pattern V0.7 2022/05/11 Update FCC Certification Information Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 2 / 19 Content Restricted...................................................................................................................................... 2 Content ......................................................................................................................................... 3 Introduction ....................................................................................................................... 4 1.1 Functional Description ......................................................................................................................... 4 1.2 Hardware Features .............................................................................................................................. 4 1.3 Applications ......................................................................................................................................... 5 Part Number ...................................................................................................................... 5 Block Diagram ................................................................................................................... 6 Certification Information ................................................................................................. 6 Structure, Dimensions, Marking and Terminal Configurations.................................. 6 5.1 Structure .............................................................................................................................................. 6 5.2 Dimensions .......................................................................................................................................... 7 5.3 Terminal Configurations ...................................................................................................................... 7 5.4 Module Internal Connection ............................................................................................................. 10 5.5 Marking .............................................................................................................................................. 10 Absolute Maximum Ratings .......................................................................................... 11 Operating Condition ....................................................................................................... 11 Power Up Sequence ........................................................................................................ 11 DC / RF Characteristics ................................................................................................... 11 9.1 Current Consumption ........................................................................................................................ 12 9.2 Receiver Characteristics (UWB) ......................................................................................................... 12 9.3 Transmitter Characteristics (UWB) .................................................................................................... 13 9.4 DC/RF Characteristics for Bluetooth (LE) ........................................................................................... 13 10. Recommend Footprint Pattern ..................................................................................... 15 11. Reference Circuit ............................................................................................................. 16 12. Soldering Conditions ...................................................................................................... 16 13. Tape and Reel Packing .................................................................................................... 17 13.1 Dimension of Tape ........................................................................................................................... 17 13.2 Dimensions of Reel .......................................................................................................................... 18 13.3 Packing Explain ................................................................................................................................ 18 Appendix .................................................................................................................................... 19 1. 2. 3. 4. 5. 6. 7. 8. 9. Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 3 / 19 1. Introduction 1.1 Functional Description GSUB-0002 module is based on System-in-Package (SiP) technology which consists of a NORDIC nRF52840 Bluetooth SoC, a QORVO DW3120 UWB transceiver, a ST LIS2DW12TR 3-

axis accelerometer, a 1.6V step-down switching voltage regulator and the matched passive components. All these components are integrated in a tiny 97-pins 10.5x8.3x1.2 mm LGA package with sputter technology to achieve EMI shielding. GSUB-0002 can be used to scheme location application for IOT devices. The DW3120 is an Ultra Wide Band(UWB) low-power and low-cost transceiver IC compliant to IEEE802.15.4-2015 and IEEE802.15.4z (BPRF mode). It can be used in 2-way ranging, TDoA and PDoA systems to locate assets to an accuracy of 10 cm; meanwhile, it supports 850 kbps, 6.8 Mbps and 27 Mbps data rates. The nRF52840 is a Bluetooth 5, IEEE 802.15.4-2006, 2.4 GHz transceiver and contains a 32-

bit ARM Cortex-M4 processor with FPU running at 64MHz, 1 MB internal flash and 256 kB RAM; It has numerous digital peripherals and interfaces such as high speed SPI and QSPI for interfacing to external flash and displays, and a full speed USB device for data transfer and power supply for battery recharging. The LIS2DW12TR is a high-performance ultra-low-power 3-axis accelerometer, connected to Bluetooth nRF52840 through I2C and could be used as motion detection to save power consumption. This module will be installed in End Product by a professional in accordance with SOP 1.2 Hardware Features BLE

-95 dBm sensitivity in 1 Mbps Bluetooth low energy mode

-103 dBm sensitivity in 125 kbps Bluetooth low energy mode (long range)

-20 to +8 dBm TX power, configurable in 4 dB steps Supported data rates:

Bluetooth 5 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps IEEE 802.15.4-2006 250 kbps Proprietary 2.4 GHz 2 Mbps, 1 Mbps Fast wake-up using 64 MHz internal oscillator Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 4 / 19 USB 2.0 full speed (12 Mbps) controller QSPI 32 MHz interface High-speed 32 MHz SPI UWB IEEE802.15.4-2015 UWB IEEE802.15.4Z (BPRF mode) Supports channels 5 & 9 (6489.6MHz & 7987.2 MHz) Supports 2-way ranging, TDOA and PDOA location schemes Worldwide UWB Radio Regulatory compliance Low power consumption Data rates of 850 kbps, 6.8 Mbps and 27Mbps Integrated HW AES 256 Precision real time location systems (RTLS) using two-way ranging, TDoA or PDoA schemes 1.3 Applications in a variety of markets:

Healthcare Consumer Industrial Automotive 2. Part Number Part Number GSUB-0002 Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 5 / 19 4. Certification Information FCC ID: 2A5EY-GSUB-0002

*Please follow installation manual of Appendix This module is only FCC authorized for the specific rule FCC 15.247 and 15.519 listed on the grant, and that the host manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification, final host product requires Part 15 Subpart B compliance testing with the modular transmitter installed. The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: 2A5EY-GSUB-0002 In any case the end product must be labeled exterior with Contains FCC ID: 2A5EY-GSUB-0002 ANTENNA WARNING:

This device is tested with a standard SMA connector and with the antenna listed in Below Table . When integrated in the OEMs product, these fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions. Table Trace antenna specifications Item 24002500 MHz Frequency range Peak gain 2.0-dBi Antenna Type PCB Antenna Frequency range 62508250 MHz Peak Gain 3.71-dBi Antenna Type Chip Antenna Description 5. Structure, Dimensions, Marking and Terminal Configurations 5.1 Structure EMI shielding Crystal RLC 3-Axis BLE SOC UWB IC RLC FEM Substrate Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 6 / 19 Pin NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 5.2 Dimensions Transistor 5.3 Terminal Configurations Name of pin NO. Function Recommended usage Connection to IC terminal GND_1 GND Ground P0.05/AIN3 P0.05/AIN3 GPIO/Analog input P0.04/AIN2 P0.04/AIN2 GPIO/Analog input P0.27 P0.26 P0.27 P0.26 GPIO GPIO P0.30/AIN6 P0.30/AIN6 GPIO/Analog input Standard drive, low frequency I/O only P0.28/AIN4 P0.28/AIN4 GPIO/Analog input Standard drive, low frequency I/O only P0.02/AIN0 P0.02/AIN0 GPIO/Analog input Standard drive, low frequency I/O only P0.03/AIN1 P0.03/AIN1 GPIO/Analog input Standard drive, low frequency I/O only P1.13 P1.12 P1.11 P1.10 P1.13 P1.12 P1.11 P1.10 GPIO GPIO GPIO GPIO Standard drive, low frequency I/O only Standard drive, low frequency I/O only Standard drive, low frequency I/O only Standard drive, low frequency I/O only P0.10/NFC2 P0.10/NFC2 Standard drive, low frequency I/O only P0.09/NFC1 P0.09/NFC1 Standard drive, low frequency I/O only GPIO/ NFC antenna connection GPIO/ NFC antenna connection GND_2 BT_ANT GND Ground BT_ANT RF port for BT antenna Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 7 / 19 Standard drive, low frequency I/O only Standard drive, low frequency I/O only Standard drive, low frequency I/O only 24 SWDCLK SWDCLK clock input for debug 25 SWDIO SWDIO GND_6 GND Ground RF port for UWB PDoA option, in non PDoA application, it should be grounded with 50 18 19 20 21 22 23 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 GND_3 GND_4 P1.07 P1.06 P1.05 GND_5 ANT2 GND_7 P0.22 P0.19 GND_8 P0.24 P0.21 GND GND P1.07 P1.06 P1.05 GND ANT2 GND P0.22 P0.19 GND P0.24 P0.21 GND_9 GND ANT1 ANT1 GND_10 GND USB_D+

USB_D-

D+

D-

GND_11 GND Reserved 1_vdd3

DW_GPIO7 DW3120 GPIO7 GPIO of DW3120 P0.18/nRESET P0.18/nRESET GPIO/Configurable as USB USB Must be open 43 VDD2 DW3120 VDD2

(2.5~3.6V) for 44 VDD1 DW3120 VDD1 Ground Ground GPIO GPIO GPIO Ground Serial wire debug and programming Serial wire debug I/O for debug and programming antenna 2 Ground GPIO GPIO Ground GPIO GPIO pin reset Ground Ground USB_D+

USB_D-

Ground NC RF port for UWB antenna 1 Power Supply DW3120 Main Power Supply

(2.5~3.6V) for DW3120, should be always ON Power Supply USB 3.3 V regulator 45 VUSB VBUS

(4.4~5.5V) for BLE Left open if USB interface is not used. Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 8 / 19 46 VDDMCU VDD and VDDH Supply(2.5~3.6V) for 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 P1.09/TRACEDAT GPIO/Trace buffer TRACEDATA[3]

P0.07/TRACECLK GPIO/Trace buffer UART_RX UART_TX Main Power BLE Ground GPIO GPIO clock GPIO GND GND_12 P1.08 P1.09 P0.08 P0.07 P0.06 P0.12 P0.11 P0.13 P0.14 GND_13 P1.15 P1.14 GND_14 GND P1.08 A3 P0.08 P0.06 GND A1 A2 P0.13 P0.14 P1.15 P1.14 GND P0.12/TRACEDAT GPIO/Trace buffer P0.11/TRACEDAT GPIO/Trace buffer TRACEDATA[1]

TRACEDATA[2]

GPIO GPIO P0.31/AIN7 P0.31/AIN7 GPIO/Analog input P0.29/AIN5 P0.29/AIN5 GPIO/Analog input DW_GPIO0 DW3120 GPIO0 GPIO of DW3120 DW_GPIO1 DW3120 GPIO1 GPIO of DW3120 DW_GPIO2 DW3120 GPIO2 GPIO of DW3120 DW_GPIO3 DW3120 GPIO3 GPIO of DW3120 DW_GPIO4 DW3120 GPIO4 GPIO of DW3120 DW_GPIO5 DW3120 GPIO5 GPIO of DW3120 DW_GPIO6 DW3120 GPIO6 GPIO of DW3120 GPIO GPIO Ground Standard drive, low frequency I/O only Standard drive, low frequency I/O only Reserved Reserved

Left open Left open 72~97 GND_15~40 GND Ground

*Note:

1. For more information on standard drive, see GPIO General purpose input/output in nRF52840 datasheet. Low frequency I/O is signals with a frequency up to 10 kHz. 2. GPIO pins should be left OPEN if not used. Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 9 / 19 5.4 Module Internal Connection

*Note:

1. About DW3120 reset: The P1.01 pin of nRF52840 outputs a high level, which will be pulled down by the conversion circuit to control pin RSTn of DW3120. 5.5 Marking Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 10 / 19 nRF52840P0.17(J6)P1.00(J3)P0.15(K7)P0.16(H6)P0.25(K2)P1.02(G3)P1.01(J1)DW3120SPICLK(A8)SPICSn(B5)SPIMISO(A6)SPIMOSI(B7)WAKEUP(B9)IRQ(B1)RSTn(A10)SPICLKSPICSnSPIMISOSPIMOSIDW_WAKEUPDW_IRQDW_RSTn LIS2DW12P0.23(H5)P0.20(J5)P1.03(F3)P1.04(H1)SCL/SPC(1)SDA/SDI/SDO(4)INT1(12)INT2(11)SCLSDAINT1INT2 6. Absolute Maximum Ratings Parameter Storage Temperature Supply Voltage VDD1 VDD2 VUSB Min

-40

-0.3

-0.3

-0.3 Max 85 4.0 4.0 5.8 Unit V V V VDDMCU

-0.3

*Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition. 3.9 V 7. Operating Condition Parameter Operating Temperature Supply Voltage VDD1 VDD2 VUSB VDDMCU Min.

-20 2.5 2.5 4.35 2.5 Typ. Max. Unit 25 3.0 3.0 5.0 3.0 85 3.6 3.6 5.5 3.6 V V V V 8. Power Up Sequence 9. DC / RF Characteristics Conditions : 25, VDD1,VDD2 and VDDMCU = 3.0V. Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 11 / 19 9.1 Current Consumption Items Status Min. Typ. Max. Unit 1 DEEP Sleep mode DW3120: Deep sleep IDLE-RC mode INIT mode Current consumption@

continuous TX/RX DW3120: Deep sleep nRF52840 :System OFF nRF52840: System ON, RTC and Sensor are disabled DW3120: IDLE-RC mode nRF52840: a wake DW3120: INIT-RC mode nRF52840: a wake TX CH5(nominal power@

-41.3dBm/MHz) TX CH5(maximum power@

-33dBm/MHz) TX CH9(nominal power@

-41.3dBm/MHz) TX CH9(maximum power@

-35dBm/MHz) RX CH5 RX CH9 TBD 7.1 5.7 41.2 54.2 48.3 59.8 49.7 61.0 uA uA mA mA mA mA mA mA mA mA 9.2 Receiver Characteristics (UWB) Min. 6240 Max. 6739.2 Items Frequency range Center Frequency Channel 5 Channel bandwidths Minimum Input Level Sensitivity Data Rate 850 kbps (PER < 1%) Data Rate 6.8 Mbps (PER < 1%) Data Rate 27 Mbps (PER < 1%) Items Frequency range Center Frequency Channel 9 Channel bandwidths Minimum Input Level Sensitivity Data Rate 850 kbps (PER < 1%) Data Rate 6.8 Mbps (PER < 1%) Data Rate 27 Mbps (PER < 1%) Typ. 6489.6 499.2

-100

-92 TBD Typ. 7987.2 499.2

-99

-91 TBD dBm/500MHz dBm/500MHz dBm/500MHz Unit MHz MHz MHz Unit MHz MHz MHz dBm/500MHz dBm/500MHz dBm/500MHz Min. 7737.6 Max. 8236.8 Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 12 / 19 9.3 Transmitter Characteristics (UWB)

-41.3 dBm/MHz

*Using the pre-loaded embedded firmware of the module, otherwise see the DW3000 datasheet. 9.4 DC/RF Characteristics for Bluetooth (LE) Items Frequency range Center Frequency Channel 5 Center Frequency Channel 9 Channel bandwidths Output Power spectral density

(programmable)*1 Output Chanel Power Items Bluetooth specification (power class) Channel frequency (spacing) Number of RF Channel Data Rate Item / Condition Center Frequency Channel Spacing Number of RF channel Output power Modulation Characteristics 1) f1avg 2) f2max (at 99.9%) 3) f2avg / f1avg 1) Frequency offset 2) Frequency drift 3) Drift rate Carrier frequency offset and drift Unit MHz MHz dBm Unit MHz MHz

dBm kHz kHz

kHz kHz kHz dBm dBm

Min. 6250 Min. 2402

-20 450 370 0.8

0 Min. 2402

Contents Version 5.0(LE) 2402 to 2480 MHz (2MHz) 40 2Mbps Max. 8250 Max. 2480

8

550 150 50 20

TBD Typ. 6489.6 7987.2 499.2

-18.5 Typ.

2 40

-92 Typ.

2 Receiver sensitivity (PER < 30.8%) Maximum received signal strength

(PER< 0.1%) PER Report Integrity (-30dBm input) TBD Items Bluetooth specification (power class) Channel frequency (spacing) Number of RF Channel Data Rate Item / Condition Center Frequency Channel Spacing Contents Version 5.0(LE) 2402 to 2480 MHz (2MHz) 40 1Mbps Max. 2480

Unit MHz MHz Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 13 / 19 PER Report Integrity (-30dBm input) TBD Number of RF channel Output power Modulation Characteristics 1) f1avg 2) f2max (at 99.9%) 3) f2avg / f1avg 1) Frequency offset 2) Frequency drift 3) Drift rate Carrier frequency offset and drift Receiver sensitivity (PER < 30.8%) Maximum received signal strength

(PER< 0.1%) Items Bluetooth specification (power class) Channel frequency (spacing) Number of RF Channel Data Rate Item / Condition Center Frequency Channel Spacing Number of RF channel Output power Modulation Characteristics Carrier frequency offset and drift 1) f1avg 2) f2max (at 99.9%) 3) f2avg / f1avg 1) Frequency offset 2) Frequency drift 3) Drift rate Receiver sensitivity (PER < 30.8%) Maximum received signal strength

(PER< 0.1%) Items Bluetooth specification (power class) Channel frequency (spacing) Number of RF Channel Data Rate Item / Condition Center Frequency Channel Spacing

-20 225 185 0.8

0 Min 2402

-20

0 Contents Version 5.0(LE) 2402 to 2480 MHz (2MHz) 40 500Kbps Max 2480 40

-95

Typ

2 40

-98

8

275 150 50 20

TBD

8

dBm kHz kHz

kHz kHz kHz dBm dBm

Unit MHz MHz

dBm kHz kHz

kHz kHz kHz dBm dBm

Contents Version 5.0(LE) 2402 to 2480 MHz (2MHz) 40 125Kbps Min 2402

Typ

2 Max 2480

Unit MHz MHz PER Report Integrity (-30dBm input) TBD TBD Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 14 / 19 Number of RF channel Output power Modulation Characteristics 1) f1avg 2) f2max (at 99.9%) 3) f2avg / f1avg 1) Frequency offset 2) Frequency drift 3) Drift rate Carrier frequency offset and drift Receiver sensitivity (PER < 30.8%) Maximum received signal strength

(PER< 0.1%)

-20 225 185

0 40

-103

8

275 150 50 19.2

TBD

dBm kHz kHz

kHz kHz kHz dBm dBm

PER Report Integrity (-30dBm input) TBD 10. Recommend Footprint Pattern

*Note:

This land pattern is for reference purpose only. Consult your manufacturing group to ensure your companys manufacturing guidelines are met.

(unit : mm) Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 15 / 19 12. Soldering Conditions The recommendation conditions of soldering are as in the following figure. Soldering must be carried out by the mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 C. Contact Goertek Microelectronics before use if concerning other soldering conditions. Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 16 / 19 Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 13. Tape and Reel Packing 13.1 Dimension of Tape Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 17 / 19 13.2 Dimensions of Reel Unitmm Pin1 13.3 Packing Explain Carrier Tape Reel Sprocket Holes Feeding Direction Roll up carrier tape with reel, 3000pcs/reel. Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 18 / 19 Appendix FCC ID:2A5EY-GSUB-0002 FCC statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Label This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. CAUTION: Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment. RF exposure warning This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment may only be operated indoors. Operation outdoors is in violation of 47 U.S.C. 301 and could subject the operator to serious legal penalties. Version0.7 Confidential in Goermicro, shall not be spread if not be privileged Page 19 / 19

Pin1Index 10.50 0 0

. 1 2Dcode 1.00

0 2

. 1 0 1

. 1 1.10 0 3

. 8 1.00 TopView (ChipSideView ) Marking Logo ProjcetName Version ConfigName Content Goermicro GSUB-0002 E02 XXX Height Font Type Arial Laser 0.7 0.6 0.6 0.6 2D :G+1+YWWD+S+SSS+EEEE+X+SSSS+CCRR

G+1+2044+K+001+UB02+2+00FB+010A G:Goermicro 1:ProductionLine 2044: DateCode--YWWD K:Substrate Vendor Code 001: 001~ZZZ(exculdeI&O) , stripcountinoneday.Resetto001atthestartofanewday UB02:ProductionName 2:BuildPhaseNo. 00FB:SubstrateLotNo 010A:Column(01~20)+Row(0A~0K,exculdeI&O) Confidential UNLESSOTHERWISESPECIFIED DIMENSIONSAREINMILIMETERS TOLERANCESARE:

DRAWINGNAME MARKINGSPECIFICATIONDRAWING TITLE PROJECTNAME GAIA PKGSIZE:10.50MMX8.30MM DRAWINGNO. GSUB-0002-MK-001 UNIT mm VERSION E02 SHEET 22

Goermicro GT PIN:

VD P/N: 118000400193 U0 VD CODE L/N 3418577-UP2 1.00 A D/C 220712 PLL LNVD: 3418577-UP2-220712 VID MM |

QTY: 115 INN SPN: 220712-0002 MD) M0 fj; Goermicro UWB SIP GSUB-0002 HF FCC ID:2A5EY-GSUB-0002

GOERTEK MICROELECTRONICS INC. Date (11/7/2022) Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Modular Approval Request FCC ID: 2A5EY-GSUB-0002 The following attestation addresses the requirements to support modular approval:

Modular approval requirement Yes (provide brief statement) No *

(a) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly

(b) The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal

(c) The module must contain power supply regulation on the module

(d) The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b)

(e) The module must demonstrate compliance in a stand-alone configuration

(f) The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements)

(g) The module must comply with all specific rules applicable to the transmitter. The grantee must provide comprehensive instructions to explain compliance requirements Modular approval requirement Yes (provide brief statement)

(h) The module must comply with RF exposure requirements

* Please provide a detailed explanation if the answer is No. Sincerely, No *

Signed:

Printed name: Hui Fu Title: Software Engineer

GOERTEK MICROELECTRONICS INC. 7/11/2022 Nemko North America, Inc. 303 River Road Ottawa, Ontario, Canada K1V 1H2 AUTHORITY TO ACT AS AGENT - FCC On our behalf, I appoint DEKRA Testing and Certification (Suzhou) Co., Ltd/ No. 99 Hongye Road, Industrial Park, Suzhou, China, to act as our agent in the preparation of this application for equipment certification. I certify that submitted documents properly describe the device or system for which equipment certification is sought. I also certify that each unit manufactured, imported or marketed, as defined in FCC regulations will have affixed to it a label identical to that submitted for approval with this application. In signing this letter, Applicant certifies that neither the applicant nor any party to the application is not subject to a denial of Federal benefits, that include FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862 because of a conviction for possession or distribution of a controlled substance. See 47 CFR 1.2002(b) for the definition of a "party" for these purposes. For instances where our authorized agent signs the application for certification on our behalf, I acknowledge that all responsibility for complying with the terms and conditions for certification, as specified by Nemko North America Inc., still resides still resides with us. Sincerely, Printed name: Hui Fu Contact Position: Software Engineer

GOERTEK MICROELECTRONICS INC. 7/11/2022 Nemko North America, Inc. 303 River Road Ottawa, Ontario, Canada K1V 1H2 REQUEST FOR CONFIDENTIALITY - FCC FCC ID: 2A5EY-GSUB-0002 Pursuant to Sections 0.457(d)(1)(ii) and 0.459 of the Commissions Rules and FCC Guidance document 726920, we hereby request confidential treatment of information accompanying this application as outlined below:

PERMANENT LONG-TERM CONFIDENTIALITY:

Schematics Block Diagrams Operation Description BOM PCB Layout When the device is marketed before the requested number of days listed above, the grantee will inform the TCB to release the Short-Term Confidentiality information withheld on the FCC equipment authorization website. The above information contains trade secrets and proprietary information not customarily released to the public. The public disclosure of this information might be harmful to the applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457(d)(1)(ii), disclosure of this Application and all accompanying materials will not be made before the date of the Grant for this Application. Sincerely, Signed:

Printed name: Hui Fu Title: Software Engineer

We GOERTEK MICROELECTRONICS INC. declare that the device is so small that it is impractical to label it with the FCC Identifier in a font that is four-point or larger, and the device does not have a display that can show electronic labeling, therefore the FCC Identifier is in the user manual and on the device packaging or on a removable label attached to the device. Sincerely, Signed:

Printed name: Hui Fu Title: Software Engineer