BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C General Description Datasheet BD2564CN is a Bluetooth 5.1 BR/EDR & LE dual mode transceiver module. The module integrates Bluetooth classic and Bluetooth Low Energy radio TIs CC2564C, a 26-MHz crystal oscillator, a band pass filter and all the passive components at a very affordable cost. The module provides the best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-
low-energy-only solutions. The power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation. The certified and royalty free Dual-mode Bluetooth 4.2 protocol stack software provides a complete Bluetooth BR/EDR, and Bluetooth Low Energy sample applications that reduce design effort and ensure a faster time to market. The module has a very small form factor with the dimensions of 7 mm x 7 mm x 1.55 mm. Key Features Bluetooth 5.1 dual mode Bluetooth Basic Rate (BR) Enhanced Data Rate (EDR) Low Energy (LE) BR and EDR features include:
Up to seven active devices Scatternet: Up to three piconets simultaneously, one as master and two as slaves affecting BR or EDR performance Built-In coexistence and prioritization handling for BR, EDR, and Low Energy Capabilities of link layer topology, Scatternet -
can act concurrently as peripheral and central Network support for up to 10 devices Time line optimization algorithms to achieve maximum channel utilization Up to two Synchronous Connection Oriented Best-in-Class Bluetooth (RF) performance (TX power,
(SCO) links on the same piconet Support for all voice air-coding continuously Variable Slope Delta (CVSD), A-Law, -Law, modified Subband Coding
(mSBC), and transparent (Uncoded) Provide an assisted mode for HFP 1.6 Wideband Speech (WBS) profile or A2DP profile to reduce host processing and power Support of multiple Bluetooth profiles with enhanced QoS RX sensitivity, blocking) Class 1 TX power up to +12 dBm detection temperature and Internal compensation to ensure minimal variation in RF performance over temperature, no external calibration required Improved Adaptive Frequency Hopping (AFH) Algorithm with minimum adaptation time Longer range, including twice the range of other Low-Energy-Only solutions Low Energy features include:
Multiple sniff instances tightly coupled to achieve minimum power consumption Independent buffering for Low Energy allows large numbers of multiple connections without Advanced power management for extended battery life and ease of design On-Chip power management, including direct connection to battery Low power consumption for active, standby, BDE Technology Inc. 1 / 14 info@bdecomm.com BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C Datasheet and scan Bluetooth modes Shutdown and sleep modes to minimize powe consumption into MCUs and MPUs HCI tester tool to evaluate RF performance of the device and configure service pack Physical interfaces:
UART Interface with support for maximum Bluetooth data rates UART transport layer (H4) with maximum rate of 4 Mbps Three-Wire UART transport layer (H5) with maximum rate of 4 Mbps Fully Modulation (PCM) - I2S codec interface programmable Digital Pulse-Code Flexibility for easy stack integration and validation Antenna: without antenna Size: 7 mm x 7 mm x 1.55 mm (With Shield) Standards Conformance Bluetooth SIG CE-RED (Europe) FCC (US) ISED (Canada) Japan (Telec) BDE Technology Inc. 2 / 14 info@bdecomm.com BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C Applications Datasheet Sports and Fitness Applications Mobile Accessories Wireless Audio Solutions Wireless Sensors Automotive Aftermarket Wellness and Health Set-Top Boxes and Remote Controls Toys Test and Measurement Industrial: Cable Replacement BDE Technology Inc. 3 / 14 info@bdecomm.com BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C Datasheet Contents 4.1. 4.2. General Description .............................................................................................................................................................. 1 Key Features .......................................................................................................................................................................... 1 Applications .......................................................................................................................................................................... 3 Contents ................................................................................................................................................................................ 4 Block Diagram ............................................................................................................................................................... 5 1. Pinout ........................................................................................................................................................................... 6 2. 3. Characteristics .............................................................................................................................................................. 7 Absolute Maximum Ratings ............................................................................................................................. 7 3.1. 3.2. Recommended Operating Conditions .............................................................................................................. 8 4. Mechanical Specifications ............................................................................................................................................ 9 Dimensions ...................................................................................................................................................... 9 PCB Footprint ................................................................................................................................................. 10 5. Marking ...................................................................................................................................................................... 10 6. Ordering Information ................................................................................................................................................. 11 Regulation ................................................................................................................................................................... 11 7. FCC Warning ................................................................................................................................................... 11 7.1. 7.2. FCC Statements .............................................................................................................................................. 12 7.3. Module statement ......................................................................................................................................... 12 7.4. IC Statements ................................................................................................................................................. 13 8. Revision History .......................................................................................................................................................... 14 Contacts .............................................................................................................................................................................. 14 BDE Technology Inc. 4 / 14 info@bdecomm.com BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C 1. Block Diagram Datasheet BD2564CN integrates Bluetooth classic and Bluetooth Low Energy radio TIs CC2564C, a 26-MHz crystal oscillator, a band pass filter and all the passive components at a very affordable cost. Figure 1-1 shows the block diagram of the module. Figure 1-1. The block diagram of BD2564CN (Confidential) BDE Technology Inc. 5 / 14 info@bdecomm.com BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C Datasheet 2. Pinout Table 2-1 describes the definitions of the pins. Table 2-1. Pin Description Figure 2-1. Pinout Diagram Top View Pin #
Pin Name Type 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 HCI_CTS HCI_TX HCI_RX HCI_RTS GND NC GND SLOW_CLK_IN GND NC NC VDD_IN GND BT_ANT GND nSHUTD GND VDD_IO AUD_IN AUD_OUT AUD_CLK DI(Note 1), PU(Note 2) DO, PU DI, PU DO, PU GND
DIO DI GND
Power GND AIO GND DI, PD GND Power DI, PD DO, PD DIO(Note 1), PD Description HCI UART clear-to-send. The device can send data when HCI_CTS is low HCI UART data transmit HCI UART data receive HCI UART request-to-send. Host can send data when HCI_RTS is low Power ground Not connected GPIO, Sensor Controller 32.768-kHz clock in, fail-safe Power ground Not connected Not connected Main power supply for the module (2.2 to 4.8 V) Power ground Bluetooth RF I/O Power ground Shutdown input (active low) Power ground I/O power supply (1.8 V nominal) PCM data input, fail-safe PCM data onput, fail-safe PCM clock, fail-safe BDE Technology Inc. 6 / 14 info@bdecomm.com 19 AUD_IN20 AUD_OUT21 AUD_CLK22 AUD_FSYNC23 NC24 TX_DBGGNDNCGNDHCI_RTSHCI_RXHCI_TXHCI_CTSGND3165432130VDD_IN 12NC 11NC 10GND 9SLOW_CLK_IN 8 GND 73213141516171833GNDGNDBT_ANTGNDnSHUTDGNDVDD_IOGND25GND26GND29GND27GND28GNDBottom View BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C Datasheet Pin #
22 23 24 25 26 27 28 29 30 31 32 33 Pin Name AUD_FSYNC NC TX_DBG GND GND GND GND GND GND GND GND GND Type DIO, PD
DO, PU GND GND GND GND GND GND GND GND GND Description PCM frame sync, fail-safe Not connected Internal debug messages Power ground Power ground Power ground Power ground Power ground Power ground Power ground Power ground Power ground Note 1: DI stands for Digital Input, DO stands for Digital Output, DIO stands for Digital Input-Output, AIO stands for Analog Input Ouput;
Note 2: PU stands for internal Pull-Up, PD stands for internal Pull-Down. 3. Characteristics All MIN/MAX specification limits are guaranteed by design, production testing and/or statistical characterization. Typical values are based on characterization results at default measurement conditions and are informative only. Default measurement conditions (unless otherwise specified): VDD_IN = 3.6 V, VDD_IO = 1.8V, TA = 25 . All radio measurements are performed with standard RF measurement equipment. 3.1. Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. PARAMETER VDD_IN VDD_IO Input voltage to analog pin Input voltage to all other pins Bluetooth RF pin Storage Temperature Table 3-1. Absolute Maximum Ratings MIN
-0.5
-0.5
-0.5
-0.5
-40 MAX 4.8 2.415 2.1 VDD_IO + 0.5 8 100 UNIT Notes V V V dBm C BT_ANT BDE Technology Inc. 7 / 14 info@bdecomm.com BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C 3.2. Recommended Operating Conditions Table 3-2. Recommended Operating Conditions Datasheet PARAMETER VDD_IN VDD_IO Operating Temperature MIN 2.2 1.62
-40 TYP
MAX 4.8 1.92 85 UNIT V V C BDE Technology Inc. 8 / 14 info@bdecomm.com Datasheet BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C 4. Mechanical Specifications 4.1. Dimensions The module dimensions are presented in the following figure:
Note: All dimensions are in millimeter Figure 4-1. Mechanical Drawing BDE Technology Inc. 9 / 14 info@bdecomm.com 6.26.20.42 x (0.4)20 x (0.9)28 x (0.5)4 x (0.8)4 x (0.8)5 x (1)5 x (1)4 x (1.6)28 x (0.5)3.53.51.55Top ViewBottom ViewSide View770.6 BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C 4.2. PCB Footprint The footprint for the PCB is presented in the following figure:
Datasheet Note: All dimensions are in millimeter Figure 4-2. Module Footprint Top View 5. Marking BDE Technology Inc. Figure 5-1. Module Marking 10 / 14 info@bdecomm.com 28 x (0.5)20 x (0.9)4 x (1.6)4 x (0.8)5 x (1)28 x (0.5)5 x (1)3.53.5Via774 x (0.8) BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C Ordering Information Datasheet Part Number BDE-BD2564CN Description Bluetooth 5.1 Dual Mode Transceiver Module Size (mm) 7 7 1.55 Package Tape & Reel MOQ 1000 6. Regulation 7.1. FCC Warning Trace antenna designs List of applicable FCC rules Limited module procedures Specific operational use conditions Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 1. FCC Part 15.247 2. This transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturers instruction manual. 3. Not applicable 4. It is not applicable as trace antenna which is not used on the module. 5. RF exposure considerations This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This compliance to FCC radiation exposure limits for an uncontrolled environment, and minimum of 15mm separation between antenna and body. The host product manufacturer would provide the above information to end users in their end-product manuals. 6. Antennas Antenna 1: Chip antenna; 0.5dBi; 2.402 GHz ~ 2.480GHz Antenna 2: Whip antenna; 2.5dBi; 2.402 GHz ~ 2.480GHz Antenna 3: Chip antenna; 0.8dBi; 2.402 GHz ~ 2.480GHz 7. The end product must carry a physical label or shall use e-labeling followed KDB784748D01 and KDB 784748 stating Contains Transmitter Module FCC ID: 2ABRU-2564C. 8. Information on test modes and additional testing requirements. For more information on testing, please contact the manufacturer. Label and compliance information 9. Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing BDE Technology Inc. 11 / 14 info@bdecomm.com BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C with the modular transmitter installed when contains digital circuity. 7.2. FCC Statements Datasheet
(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (15.107 and if applicable 15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in 15.101. Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating the FCC ID of the RF Module, such as "Contains FCC ID: 2ABRU-2564C
"This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation."
"Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the users authority to operate the equipment."
The Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into the host device. 7.3. Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of 15.212(a)(1) as summarized below.
(1) The radio elements have the radio frequency circuitry shielded.
(2) The module has buffered modulation/data inputs to ensure that the device will complywith Part 15 requirements with any type of input signal.
(3) The module contains power supply regulation on the module.
(4) The module contains a permanently attached antenna.
(5) The module demonstrates compliance in a stand-alone configuration.
(6) The module is labeled with its permanently affixed FCC ID label. BDE Technology Inc. 12 / 14 info@bdecomm.com BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C Datasheet
(7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee.
(8) The module complies with RF exposure requirements. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help 7.4. IC Statements The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating the IC of the RF Module, such as" Contains transmitter module IC: 25657-2564C Le priphriquehte final, danslequelce module RF estintgr "doittretiquet avec unetiquetteauxiliaireindiquant le CI du module RF, tel que" Contient le module metteur IC: 25657-2564C This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:
(1) This device may not cause interference.
(2) This device must accept any interference, including interference that may cause undesired operation of the device. Lmetteur/rcepteur exempt de licencecontenudans le prsentappareilestconforme aux CNR dInnovation, Sciences et Dveloppementconomique Canada applicables aux appareils radio exempts de licence. Lexploitationestautorise aux deux conditions suivantes :
(1) L' appareil ne doit pas produire de brouillage;
(2) L' appareildoit accepter tout brouillageradiolectriquesubi, mmesi le brouillageest susceptible d' encompromettre le fonctionnement. RF Exposure Warning Statements:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The device can be used in Portable exposure condition. This equipment shall be installed and operated with minimum distance 15mm between the radiator & body. BDE Technology Inc. 13 / 14 info@bdecomm.com BDE-BD2564CN Bluetooth 5.1 Dual Mode Transceiver Module Based on CC2564C Datasheet Radio Frequency Exposure Statement for IC:
The device has been evaluated to meet general RF exposure requirements. The device can be used in Portable exposure conditions. The min separation distance is 15mm. Dclaration d'exposition aux radiofrquences pour IC:
L'appareil a t valu pour rpondre aux exigences gnrales d'exposition aux RF. L'appareil peut tre utilis dans des conditions d'exposition portable. La distance de sparation minimale est de 15mm. This radio transmitter [IC: 25657-2564C] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Cet metteur radio [IC: 25657-2564C] a t approuv par Innovation, Sciences et Dveloppement conomique Canada pour fonctionner avec les types d'antenne numrs ci-dessous, avec le gain maximal admissible indiqu. Les types d'antenne non inclus dans cette liste qui ont un gain suprieur au gain maximum indiqu pour tout type rpertori sont strictement interdits pour une utilisation avec cet appareil. 7. Revision History Revision V1.0 V1.1 Date 17-July-2021 22-November-2021 Description Initial Release, brief Update some data, replace picture Contacts Guangzhou BDE Technology Inc. USA: 67 E Madison St, # 1603A, Chicago, IL 60603, US Tel: +1-312-379-9589 Website: http://www.bdecomm.com China: B2-403, ChuangYi Building, 162 Science Avenue, Huangpu District, Guangzhou 510663, China Tel: +86-20-28065335 Website: http://www.bdecomm.com Email: info@bdecomm.com Email: sales@bdecomm.com BDE Technology Inc. 14 / 14 info@bdecomm.com