BPU Module Datasheet Version: 20211229 Online Version Contents Contents 1 Product overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 2
. 3 2.1 Dimensions and footprint 2.2 Pin definition . 6 2 Module interfaces 3 Electrical parameters 3.1 Absolute electrical parameters
. 11 3.2 Operating conditions . 11 3.3 Power consumption in operating mode . 12 4 RF parameters 4.1 Basic RF features
. 13 4.2 RF output power . 13 4.3 RF receiving sensitivity . 13 5 Antenna information 5.1 Antenna type . 15 5.2 Antenna interference reduction . 15 6 Packaging information and production instructions 6.1 Mechanical dimensions and dimensions of the back of the pad . 18 6.2 Production instructions
. 23 6.3 Recommended oven temperature curve . 25 6.4 Storage conditions . 28 7 MOQ and packaging information 8 Appendix: Statement 2 3 11 13 15 18 29 30 I Contents BPU is a low-power-consumption embedded Bluetooth module that Tuya has devel-
oped. Embedded with the Bluetooth communication protocol stack and rich library functions, it mainly consists of a highly integrated Bluetooth chip (PHY6222) and a few peripheral circuits. 1 / 32 1 Product overview BPU includes a low-power-consumption 32-bit MCU, a Bluetooth LE 5.1/2.4-G Radio, 128-KB to 8-MB flash memory, 64-KB SRAM, and 18 reusable I/O pins. 1 Product overview 1.1 Features Embedded with a low-power 32-bit MCU, which can also function as an appli-
cation processor. Working voltage: 1.8 to 3.6V Peripherals: 5 PWMs, 2 ADCs, 3 GPIOs, and 1 SPI Bluetooth RF features Bluetooth LE 5.1 The RF data rate can be up to 1 Mbps. TX power: +6 dBm RX sensitivity: -97 dBm@ 1 Mbps Embedded hardware meets the AES Onboard antenna with a gain of 2.19 dBi Operating temperature: -40 to +105 1.2 Applications Smart LED Smart home 1.3 Change history Update date Updated content Version after update 11/25/2021 This is the first release. V1.0.0 2 / 32 2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint BPU has 3 lines, 21 pins in total. The spacing of pins at the two sides is 1.40.1 mm, and the spacing of pins at the bottom is 1.80.1 mm. The dimensions of BPU are 20.30.35 mm (L)15.80.35 mm (W) 3.00.15 mm (H). The thickness of the PCB is 1.00.1 mm, which are shown below:
3 / 32 2 Module interfaces 4 / 32 2 Module interfaces 5 / 32 2 Module interfaces Common I/O interface, which can be used as SCK of the SPI interface and corresponds to P3 of the IC chip Common I/O pin, which can be used as MOSI of the SPI interface and corresponds to P7 of the IC Common I/O interface, which corresponds to P15 of the IC chip Common I/O interface, which corresponds to P16 of the IC chip ADC port, 12 bit/s, which can also be used as a common I/O pin and corresponds to P11 of the IC chip 2.2 Pin definition The definitions of pins are shown in the following table:
Pin number Symbol Pin type Function P3 I/O 1 2 3 4 5 P7 I/O P15 P16 P11 I/O I/O I/O 6 / 32 2 Module interfaces Serial port UART2_RX, which can also be used a common I/O pin and corresponds to P0 of the IC chip Serial port UART2_TX, which can also be used a common I/O pin and corresponds to P2 of the IC chip. It can used to output logs. Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P26 of the IC chip Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P31 of the IC chip Pin number Symbol Pin type Function RXD2 I/O 6 7 8 9 TXD2 I/O P26 I/O P31 I/O 7 / 32 2 Module interfaces Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P32 of the IC chip Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P33 of the IC chip Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P34 of the IC chip Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P26 of the IC Power supply pin
(Typical value:
3.3V) Pin number Symbol Pin type Function 10 P32 I/O 11 P33 I/O 12 P34 I/O 13 GND I/O 14 VCC P 8 / 32 2 Module interfaces UART1_TX, which can also be used a common I/O pin and corresponds to P9 of the IC chip UART1_RX, which can also be used a common I/O pin and corresponds to P10 of the IC chip ADC port, 12 bit/s, which can also be used as a common I/O interface and corresponds to P14 of the IC chip Reset pin (low active), correspond to RESET_N of the IC chip. Common I/O interface, which corresponds to P17 of the IC chip Common I/O interface, which can be used as MISO of the SPI interface and corresponds to P20 of the IC chip Pin number Symbol Pin type Function TXD1 I/O 15 16 17 18 19 20 RXD1 I/O P14 I/O RESET_N I/O P17 P20 I/O I/O 9 / 32 Pin number Symbol Pin type Function 21 P18 I/O Test pin TM I 2 Module interfaces Common I/O interface, which can be used as CS of the SPI interface and corresponds to P18 of the IC chip Mode selection pin, which is pulled high in burning mode, but pulled down or not connected to anything in other modes. Note:
P indicates a power supply pin and I/O indicates an input/output pin. If you have any special requirements on the light colour controlled by the PWM output, please contact Tuya business personnel. 10 / 32 Parameter Description Minimum value Maximum value Unit 3 Electrical parameters 150 3.9 2 0.5 V kV kV 3 Electrical parameters 3.1 Absolute electrical parameters Storage temperature Power supply voltage TAMB-25 TAMB-25
-65
-0.3
Ts VCC ESD voltage
(human body model) ESD voltage
(machine model) 3.2 Operating conditions Parameter Description Minimum value Typical value Maximum value
-40 105 Ta VCC VIL VIH VOL Operating tempera-
ture Operating voltage Voltage input low Voltage input high Voltage output low 1.8 3.3 3.6 VSS VCC*0.3 VCC*0.7 VCC VSS VCC*0.1
11 / 32 Unit V V V V 3 Electrical parameters Parameter Description Minimum value Typical value Maximum value Unit VOH VCC*0.9
VCC V Voltage output high 3.3 Power consumption in operating mode Symbol Conditions Maximum value
(Typical value) Itx Irx IDC IDC Ideepsleep Constantly receive 5.0 Constantly transmit with the output power of 6 dBm Average value in mesh networking state Peak value in mesh networking state Average value at common sleep mode 10.9 9.4 11.4 1 Unit mA mA mA mA uA 12 / 32 4 RF parameters 4 RF parameters 4.1 Basic RF features Operating frequency Wireless standard Data transmission rate Antenna type 4.2 RF output power Minimum value
-20
Average RF output power Bandwidth of 20-dB modulation signal (1M) 4.3 RF receiving sensitivity RX sensitivity 1 Mbps
-250 Frequency offset error 1 Mbps Parameter Description 2.4 GHz ISM band Bluetooth LE 5.1 1 Mbps PCB antenna Parameter Typical value Maximum value Unit dBm KHz Unit dBm 7
6 2500
-97
13 / 32 Parameter Typical value Minimum value Maximum value
+300 KHz 4 RF parameters Minimum value Typical value Maximum value
-10
Unit dB Parameter Co-channel interference suppression 14 / 32 5 Antenna information 5 Antenna information 5.1 Antenna type BPU uses the PCB antenna with a gain of 2.19 dBi. 5.2 Antenna interference reduction To ensure the best RF performance, it is recommended that the antenna be at least If metal materials are wrapped around the 15 mm away from other metal parts. antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna. 15 / 32 5 Antenna information 16 / 32 5 Antenna information 17 / 32 6 Packaging information and production instructions 6 Packaging information and production instructions 6.1 Mechanical dimensions and dimensions of the back of the pad 18 / 32 6 Packaging information and production instructions 19 / 32 6 Packaging information and production instructions The following figure is a schematic diagram of BPU:
20 / 32 6 Packaging information and production instructions Recommended PCB footprint 21 / 32 6 Packaging information and production instructions The default outline dimension tolerance is 0.35 mm, and the critical dimension tolerance is 0.1 mm. If you have specific requirements on dimensions, specify them clearly in the datasheet after communication. 22 / 32 6 Packaging information and production instructions 6.2 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
(SMT process) SMT devices:
Mounter SPI Reflow soldering machine Thermal profiler Automated optical inspection (AOI) equipment
(Wave soldering process) Wave soldering devices Wave soldering equipment Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire and flux Thermal profiler Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment in which the temperature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag. 23 / 32 6 Packaging information and production instructions 3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months has passed since sealing of the bag. 4. Baking settings:
Temperature: 60C and 5% RH for reel package and 125C and 5%
RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective 24 / 32 6 Packaging information and production instructions measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 6.3 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements. Manner 1: SMT process (Recommended oven temperature curve of reflow soldering) Set oven temperatures according to the following curve. A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C 25 / 32 6 Packaging information and production instructions E: Duration of constant temperature: 60 to 120s; the range of constant tem-
D: Ramp-up slope: 1 to 3C/s perature: 150 to 200C F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications. Manner 2: Wave soldering process (Oven temperature curve of wave sol-
dering) Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260C5C. 26 / 32 6 Packaging information and production instructions Suggestions on oven temperature curve of wave soldering Preheat temperature Suggestions on manual soldering temperature Soldering temperature 80 to 130 C 36020C Preheat time 75 to 100s Soldering time 3s/point Peak contact time 3 to 5s Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA NA NA 27 / 32 6 Packaging information and production instructions 6.4 Storage conditions 28 / 32 7 MOQ and packaging information 7 MOQ and packaging information Product model MOQ (pcs) Packing method Modules per reel Reels per carton BPU 4400 Tape reel 1100 4 29 / 32 8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user. 30 / 32 8 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-BPU. The end product must be labelled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-BPU
. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 31 / 32 8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 32 / 32