BS24-U Module Datasheet Version: 20230911 Online Version Contents Contents 1 Overview 2 1.1 Features . 2 1.2 Applications . 2 1.3 New updates . 2 2 Module interfaces 4
. 4 2.1 Dimensions and footprint 2.2 Pin definition . 7 3 Electrical parameters 11
. 11 3.1 Absolute electrical parameters 3.2 Working conditions
. 11 3.3 Power consumption in working mode . 12 4 RF parameters 14 4.1 Basic RF features
. 14 4.2 Transmitter (TX) performance . 14 4.3 Receiver (RX) performance . 14 5 Antenna information 16 5.1 Antenna type . 16 5.2 Antenna interference reduction . 16 6 Packing and production instructions 19 6.1 Mechanical dimensions
. 19 6.2 Side view . 20 6.3 Schematic diagram . 21 6.4 Recommended footprint . 22 6.5 Production instructions
. 22 6.6 Recommended oven temperature curve . 25 6.7 Storage conditions . 28 7 MOQ and packaging information 8 Appendix: Statement 29 30 I Contents This topic describes Tuyas proprietary BS24-U Bluetooth low energy (LE) module. It consists of a highly integrated wireless RF chip EFR32BG24 and a few peripheral components, with a built-in Bluetooth protocol stack and various library functions. 1 / 32 1 Overview 1 Overview BS24-U comes with a low-power 32-bit ARM Cortex-M33 core, 1024 KB of flash mem-
ory, 128 KB of RAM, and configurable GPIOs that can function as digital peripherals for various applications. This module integrates all MAC and TCP/IP libraries. All these resources can help develop your own embedded Bluetooth LE products. 1.1 Features Built-in low-power 32-bit CPU, ARM Cortex-M33 processor with DSP instruction and floating-point unit can act as an application processor. Clock rate of 78 MHz. Wide operating voltage range: 2.0V to 3.8V. Peripherals: nine GPIO pins, one UART pin, two ADC pins, and five PWM pins. Bluetooth LE radio frequency (RF) features Bluetooth LE 5.3 RF data rate of up to 2 Mbit/s Transmitter power: +17dBm Receiver sensitivity: -96 dBm@Bluetooth LE 1 Mbit/s Embedded hardware Advanced Encryption Standard (AES) encryption Onboard PCB antenna with a gain of 1.2 dBi Operating temperature: -40C to +105C 1.2 Applications Smart building Smart home and electrical appliance Smart socket and light Industrial wireless control Baby monitor IP camera Smart bus 1.3 New updates 2 / 32 1 Overview Update date Update content Version June 28, 2023 The first release. v1.0.0 3 / 32 2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint BS24-U has three rows of pins. The pin spacing is 1.40.1 mm on both sides and 1.80.1 mm at the bottom. The BS24-U dimensions are 20.30.35 mm (L) 15.80.35 mm (W) 2.50.15 mm (H). The following figure shows the dimensions and packaging design of the BS24-U mod-
ule. 4 / 32 2 Module interfaces 5 / 32 2 Module interfaces 6 / 32 2.2 Pin definition 2 Module interfaces Pin No. Symbol I/O type Feature 1 2 PB4 PB3 A normal I/O pin, corresponding to PB04 on the IC. A normal I/O pin, corresponding to PB03 on the IC. I/O I/O 7 / 32 Pin No. Symbol I/O type Feature 2 Module interfaces 3 4 5 6 7 8 9 10 11 PA2 PA1 PB2 PA0 PB0 PC2 PC1 PA4 PA5 I/O I/O I I/O I/O I/O I/O I/O I/O 8 / 32 Used for firmware flashing, SWDIO, corresponding to PA02 on the IC. Used for firmware flashing, SWCLK, corresponding to PA01 on the IC. ADC pin, corresponding to PB02 on the IC. A normal I/O pin, corresponding to PA00 on the IC. A normal I/O pin, corresponding to PB00 on the IC. Support hardware PWM, corresponding to PC02 on the IC. Support hardware PWM, corresponding to PC01 on the IC. Support hardware PWM, corresponding to PA04 on the IC. Support hardware PWM, corresponding to PA05 on the IC. Pin No. Symbol I/O type Feature 2 Module interfaces 12 13 14 15 PA6 GND VCC TX0 I/O P P I/O 16 RX0 I/O 17 18 19 20 PA8 RST PA7 PA3 I I/O I/O I/O 9 / 32 Support hardware PWM, corresponding to PA06 on the IC. Ground pin. Power supply pin
(3.3V). UART_TXD0, used to flash the firmware and authorize the module, corresponding to PD03 on the IC. UART_RXD0, used to flash the firmware and authorize the module, corresponding to PD02 on the IC. ADC pin, corresponding to PA08 on the IC. A reset pin, corresponding to RESETn on the IC. It is effective when pulled down. A normal I/O pin, corresponding to PA07 on the IC. A normal I/O pin, corresponding to PA03 on the IC. 2 Module interfaces Pin No. Symbol I/O type Feature 21 PB1 I/O A normal I/O pin, corresponding to PB01 on the IC.
:::info P indicates the power pin, and I/O indicates the input and output pin. Pins 3, 4, 13, 14, and 18 used for firmware flashing do not need to break out by default. Motherboard tracing shall keep away from these pins.
10 / 32 3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Min value Max value Unit Storage temperature Supply voltage
-50 2.0 TAMB -25C
150 3.8 2 C V kV TAMB -25C
0.5 kV Ts VBAT Electrostatic discharge voltage
(human body model) Electrostatic discharge voltage
(machine model) 3.2 Working conditions Parameter Description Min value Typical value Max value Unit Ta VCC VIL Operating tempera-
ture Operating voltage I/O low-level input
-40
105 C 2.0
3.3
3.6 IOVDD 0.3 V V 11 / 32 Parameter Description Min value Typical value Max value Unit 3 Electrical parameters VIH VOL VOH I/O high-level input I/O low-level input I/O high-level output IOVDD 0.7
IOVDD 0.8
3.3 Power consumption in working mode
IOVDD 0.2
V V V Symbol Condition Typical value Max value Unit Itx Itx Irx IDC 110 186 mA 38 59 mA 7.3 6.8 9.7 210 mA mA Continuous transmission, with an output power of 19.5 dBm Continuous transmission, with an output power of 10 dBm Continuous reception Connected over Bluetooth mesh 12 / 32 3 Electrical parameters Symbol Condition Typical value Max value Unit IEM2 Deep sleep mode (RAM reserved) 1.8 1.8 A 13 / 32 4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Operating frequency Wireless standard 2.4 GHz ISM band Bluetooth LE 5.3 Data transmission rate 1 Mbit/s and 2 Mbit/s Antenna type Onboard PCB antenna 4.2 Transmitter (TX) performance TX continuous transmission performance Parameter Min value Typical value Max value Unit 17 2500 20
dBm KHz
RF average output power Bandwidth of 20 dB modulation signal (1 Mbit/s) 4.3 Receiver (RX) performance RX sensitivity 14 / 32 4 RF parameters Max value Unit
dBm dBm
+300 KHz
-10 dB dB Typical value
-96
-93.5
Parameter Min value
-250
RX sensitivity 1 Mbit/s RX sensitivity 2 Mbit/s Frequency offset error 1 Mbit/s Co-channel interfer-
ence suppres-
sion 15 / 32 5 Antenna information 5 Antenna information 5.1 Antenna type PCB antenna is the default type of antenna. 5.2 Antenna interference reduction When a PCB antenna is used on the module, we recommend that the module an-
tenna is at least 15 mm away from other metal components. This can optimize the RF performance. Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded. 16 / 32 5 Antenna information 17 / 32 5 Antenna information 18 / 32 6 Packing and production instructions 6 Packing and production instructions 6.1 Mechanical dimensions The PCB dimensions are 20.30.35 mm (W) 15.80.35 mm (L) 1.00.1 mm
(H). 19 / 32 6.2 Side view 6 Packing and production instructions 20 / 32 6.3 Schematic diagram 6 Packing and production instructions 21 / 32 6.4 Recommended footprint 6 Packing and production instructions 6.5 Production instructions 1. For the modules that can be packaged with the surface-mount technology
(SMT) or in in-line form, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, pack-
age the module with the SMT. If a PCB is designed to use an in-line package, use wave soldering. Complete soldering within 24 hours after the module is 22 / 32 6 Packing and production instructions unpacked. Otherwise, we recommend that you place the module in a moisture-
proof box with a relative humidity level below 10%, or pack the module in vac-
uum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours. Instruments or devices required for the SMT process:
Surface mount system SPI Reflow soldering Thermal profiler Automated optical inspection (AOI) equipment Instruments or devices required for the wave soldering process:
Wave soldering equipment Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire, and flux Thermal profiler Instruments or devices required for the baking process:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. A delivered module must meet the following storage requirements:
The moisture-proof bag must be placed in an environment where the tem-
perature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. A humidity indication card (HIC) is put in the sealed package. 23 / 32 6 Packing and production instructions Figure 1: img 3. The module needs to be baked in the following cases:
The vacuum packaging bag is damaged before unpacking. After unpacking, no HIC is found in the packaging bag. After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months have passed since the first sealing of the bag. 4. The baking parameter settings are described below:
Baking temperature: 40C for reel packaging with relative humidity 5%. And 125C for tray packaging with relative humidity 5% (use the heat-
resistant tray, rather than plastic containers). Baking time: 168 hours for reel packaging and 12 hours for tray packaging. Temperature for triggering an alert: 50C for reel packaging and 135C for tray packaging. Production can begin after a module has cooled below 36C under natural conditions. If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked after exposure for more than 168 hours, 24 / 32 6 Packing and production instructions do not use reflow soldering or wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 7. With a built-in crystal oscillator, this product can generally be cleaned with an ordinary detergent or ultrasonic wave. However, in some cases, vibrations gen-
erated by an ultrasonic cleaner can damage the internal structure of the crystal oscillator. If you use an ultrasonic cleaner, you need to verify in advance that the crystal oscillator inside the module is protected from any possible damage. 8. During product installation or processing, ultrasonic soldering is not recom-
mended, because it might lead to excessive internal vibration or even failure of the crystal oscillator in the module. 6.6 Recommended oven temperature curve Select a proper soldering technique according to the process. For the SMT process, refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, refer to the recommended oven temperature curve of wave soldering. The set temperatures might deviate from the actual temperature mea-
surements. All temperatures shown in this module datasheet are obtained through actual measurements. Technique 1: SMT process (recommended oven temperature curve of re-
flow soldering) Set the oven temperatures according to the following curve. 25 / 32 6 Packing and production instructions A: temperature axis B: time axis C: alloy liquidus temperature from 217C to 220C D: ramp-up slope from 1C/s to 3C/s E: keep a constant temperature from 150C to 200C for a time period of 60s to 120s F: temperature above liquidus temperature for 50s to 70s G: peak temperature from 235C to 245C H: ramp-down slope from 1C/s to 4C/s
:::important The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the spec-
ified solder paste specifications.
Technique 2: Wave soldering process (oven temperature curve of wave soldering) 26 / 32 6 Packing and production instructions Set the oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260C5C. Suggestions on manual soldering Suggestions on wave soldering Preheat temperature Soldering temperature 80C to 130C 360C 20C Preheat duration 75s to 100s Soldering duration Less than 3s/point Contact duration at the peak 3s to 5s Solder tank temperature 260 5C Ramp-up slope 2C/s N/A N/A N/A 27 / 32 N/A N/A N/A 6 Packing and production instructions Suggestions on wave soldering Suggestions on manual soldering Ramp-down slope 6C/s N/A N/A 6.7 Storage conditions 28 / 32 7 MOQ and packaging information 7 MOQ and packaging information Product model MOQ (pcs) Shipping packaging Modules per reel (pcs) Reels per carton BS24-U 4400 Tape and reel 1100 4 29 / 32 8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. The module is limited to installation in mobile or fixed applications. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause un-
desired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device to an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. The OEM integrator is re-
sponsible for ensuring that the end-user has no manual instructions to remove or install the module. Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter prod-
uct procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. 30 / 32 8 Appendix: Statement The availability of some specific channels and/or operational frequency bands are country-dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible to the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Separate approval is required for all other op-
erating configurations including portable configurations with respect to Part 2.1093 and different antenna configurations. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-BS24-U. The end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-BS24-
U. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com. 31 / 32 8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm from the hu-
man body. 32 / 32