YLB1 Module Datasheet Hardware Product Development > Network Modules > BLE Module >
BK Series Version: 20210311 Online Version Contents Contents 1 Overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 2 2.1 Dimensions and package . 3 2.2 Pin denition . 4
. 9 3.1 Absolute electrical parameters
. 9 3.2 Working conditions 3.3 Power consumption in working mode . 10
. 11 4.1 Basic RF features 4.2 RF output power . 11 4.3 RF receiving sensitivity . 11 2 Module interfaces 3 Electrical parameters 4 RF parameters 5 Antenna 5.1 Antenna type . 12 5.2 Antenna interference reduction . 12 6 Packaging information and production instructions 6.1 Mechanical dimensions and dimensions of the back of the pad . 13
. 13 6.2 Production instructions 6.3 Recommended oven temperature curve . 15 6.4 Storage conditions . 17 7 MOQ and packaging information 8 Appendix: Statement 2 3 9 11 12 13 18 18 i Contents YLB1 is a low-power embedded Bluetooth module that Tuya has developed. Em-
bedded with the Bluetooth network communication protocol stack and rich library functions 1 / 20 1 OVERVIEW YLB1 consists of a highly integrated Bluetooth chip (BK3432) and a few peripheral circuits. YLB1 further consists of a low-power 32-bit MCU, a Bluetooth 2.4G-radio, a 160-KB ash memory, and a 20-KB static random-access memory (SRAM). Embedded low-power 32-bit MCU, which can also function as an application Built-in high-precision 10-bit ADC Working voltage: 1.61 to 3.6V Support interfaces such as UART, GPIO, I2C, PWM, ADC, SPI and JTAG Bluetooth LE RF features Compatible with the Bluetooth LE 4.2 The RF data rate can be up to 1 Mbps. TX power:+3 dBm RX sensitivity: -92 dBm@Bluetooth LE 1 Mbps Onboard PCB antenna with a gain of 0.2 dBi Working temperature: -20 to +85 1 Overview 1.1 Features processor. 1.2 Applications Smart LED Smart home Health products 1.3 Change history Date Updated content Version after update 2021-2-22 This is the rst release. V1.0.0 2 / 20 2 MODULE INTERFACES 2 Module interfaces 2.1 Dimensions and package YLB1 has 3 rows of pins with a spacing of 1.25 mm. The YLB1 dimensions are 120.35 mm (W)180.35 mm (L) 2.80.15 mm (H). The thickness of the PCB is 0.8 mm0.1 mm. 3 / 20 2 MODULE INTERFACES 2.2 Pin definition The denition of interface pins is shown in the following table:
Pin No. Symbol I/O type Function 1, 3, 4, 9, 18 and 26 G 2 5 ANT 31 Power supply reference ground Connected to the external antenna if needed Common I/O interface, which can work as ADC input and correspond to P<31> of the IC P I/O I/O 4 / 20 2 MODULE INTERFACES Pin No. Symbol I/O type Function 32 I/O 6 7 8 10 11 14 I/O V RST TX1 P I I/O 5 / 20 12 RX1 I/O Common I/O interface, which can work as ADC input and correspond to P<32> of the IC Common I/O interface, which can output PWM as the drive of LED and correspond to P<14> of the IC Power supply pin Reset pin, active low Common I/O interface, the interface for communication between UART_TXD1 and MCU Common I/O interface, the interface for communication between UART_RXD1 and MCU Pin No. Symbol I/O type Function 2 MODULE INTERFACES Common I/O interface, UART_RXD2, correspond to P<17> of the IC Common I/O interface, UART_TXD2, correspond to P<16> of the IC Common I/O interface, which can output PWM as the drive of LED and correspond to P<13> of the IC Common I/O interface, which can work as ADC input and correspond to P<33> of the IC Common I/O interface, which can output PWM as the drive of LED and correspond to P<12> of the IC 13 14 15 17 16 13 I/O I/O I/O 16 33 I/O 17 12 I/O 6 / 20 2 MODULE INTERFACES Pin No. Symbol I/O type Function 19 10 I/O Common I/O interface, which can output PWM as the drive of LED and correspond to P<10> of the IC Common I/O interface, PWM/SPI_NSS/JTAG_TMS, correspond to P<07> of the IC Common I/O interface, SPI_MISO/PWM/JTAG_TCK, correspond to P<06> of the IC Common I/O interface, SPI_MOSI/JTAG_TDO, correspond to P<05> of the IC Common I/O interface, SPI_SCK/JTAG_TDI, correspond to P<04> of the IC Common I/O interface, I2C_SDA/JTAG_NTRST, correspond to P<03> of the IC 20 21 22 23 24 07 06 05 04 03 I/O I/O I/O I/O I/O 7 / 20 Pin No. Symbol I/O type Function 25 02 I/O 2 MODULE INTERFACES Common I/O interface, I2C_SCL, correspond to P<02> of the IC Note: P indicates a power supply pin and I/O indicates an input/output pin. If you have your own requirements on the light color controlled by the PWM output, please contact your account manager in Tuya. 8 / 20 3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Storage temperature Power supply voltage
-65
-0.9 TAMB-25
150 3.6 2 Unit V KV TAMB-25
0.2 KV Ts VCC Static electricity discharge voltage
(human body model) Static electricity discharge voltage
(machine model) Parameter Description Minimum value Typical value Maximum value
-20
85 Unit 3.2 Working conditions Ta VCC Working tempera-
ture Working voltage 1.61 3.3 3.6 V 9 / 20 3 ELECTRICAL PARAMETERS VIL VIH VOL VOH Itx Irx IDC IDC Parameter Description Minimum value Typical value Maximum value Unit VSS VSS+0.3 V
VCC-0.3 VCC+0.3 V VSS VSS+0.3 V VCC-0. 3 VCC V I/O low level input I/O high level input I/O low level output I/O high level output 3.3 Power consumption in working mode Symbol Conditions Maximum value
(typical value) Unit mA mA mA mA A Constantly transmit, the output power of 3 dBm Constantly receive Average value under networking Peak value under networking 22 9 2.6 3.4 10 / 20 Ideepsleep Deep sleep mode 7 4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.4 GHz ISM band Wireless standard Bluetooth LE 4.2 Data transmission rate 1 Mbps Antenna type Onboard PCB antenna 4.2 RF output power Parameter Typical value Minimum value Maximum value 0 1000
-20
Average RF output power 20 dB modulation signal bandwidth
(1M) 4.3 RF receiving sensitivity Unit dBm KHz Unit dBm 4
Parameter Typical value Minimum value Maximum value RX sensitivity 1 Mbps
Frequency oset 1 Mbps 115
-92
+300 KHz 11 / 20 Parameter Typical value Minimum value Maximum value
7 5 ANTENNA Unit dB Co-channel interference suppression 5 Antenna 5.1 Antenna type YLB1 uses the onboard PCB antenna with a gain of 0.2 dBi. 5.2 Antenna interference reduction To ensure RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials wrap the surrounding of the an-
tenna, the wireless signal will be greatly attenuated and the RF performance will deteriorate. When designing the nished product, please leave enough space for the antenna area. 12 / 20 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions and dimensions of the back of the pad Note: The default outline dimension tolerance is 0.35 mm, and the critical dimension tolerance is 0.1 mm. 6.2 Production instructions 1. Use an SMT machine to mount components to the stamp-hole module that Tuya produces within 24 hours after the module is unpacked and the rmware is burned. If not, pack the module again in a vacuum. Bake the module before mounting components to the module 13 / 20 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS SMT equipment Reow soldering machine Automated optical inspection (AOI) equipment Nozzle with a 6 to 8 mm diameter Baking equipment Cabinet oven Anti-static heat-resistant trays Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
The moisture-proof bag must be placed in an environment where the tem-
perature is below 30C and the relative humidity is lower than 70%. The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed. The package contains a humidity indicator card (HIC). 3. Bake a module based on HIC status as follows when you unpack the module If the 30%, 40%, and 50% circles are blue, bake the module for 2 consec-
If the 30% circle is pink, bake the module for 4 consecutive hours. If the 30% and 40% circles are pink, bake the module for 6 consecutive If the 30%, 40%, and 50% circles are pink, bake the module for 12 consec-
package:
utive hours. hours. utive hours. 1. Baking settings:
Baking temperature: 1255C Alarm temperature: 130C SMT ready temperature: naturally cooling temperature: < 36C 14 / 20 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS The number of drying times: 1 Rebaking condition: The module is not soldered within 12 hours after bak-
ing 2. Do not use SMT to process modules that have been unpacked for more than 3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs and they are seriously oxidized for over 3 months. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and conse-
quences. 3. Before using SMT, take electrostatic discharge (ESD) protective measures. 4. To reduce the reow defect rate, draw 10% of the products for visual inspection and AOI before the rst mounting, to determine the rationality of oven temper-
ature control and component attachment and placement manners. Draw 5 to 10 modules from subsequent batches each hour for visual inspection and AOI. 6.3 Recommended oven temperature curve Perform SMT based on the following reow oven temperature curve. The highest temperature is 245C. The reow oven temperature curve is as below:
Refer to IPC/JEDEC standard; Peak Temperature: <245; Number of Times: 2 times 15 / 20 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 16 / 20 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.4 Storage conditions 17 / 20 7 MOQ and packaging information 8 APPENDIX: STATEMENT Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton YLB1 4800 Tape reel 1200 4 8 Appendix: Statement FCC Caution: Any changes or modications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guar-
antee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device o and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement 18 / 20 8 APPENDIX: STATEMENT This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specic channels and/or operational frequency bands are country-dependent and are rmware programmed at the factory to match the in-
tended destination. The rmware setting is not accessible by the end-user. The host product manufacturer is responsible for compliance with any other FCC rule that applies to the host not covered by the modular transmitter grant of certication. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-YLB1. The end product must be labeled in a vis-
ible area with the following: Contains Transmitter Module FCC ID: 2ANDL-YLB1. This device is intended only for OEM integrators under the following conditions: The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for test-
ing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions 19 / 20 of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 8 APPENDIX: STATEMENT This product must not be disposed of as normal household waste, in accordance with the EU directive for the waste electrical and electronic devices (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 20 / 20