Hardware Product Development > Network Modules > Wi-Fi & BLE CB2S Module Datasheet Dual Mode Module > CB Series Module Version: 20210408 Online Version Contents Contents 1 Overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 3 2.1 Dimensions and package . 3 2.2 Pin denition . 4 2 Module interfaces 3 Electrical parameters
. 7 3.1 Absolute electrical parameters
. 7 3.2 Normal working conditions 3.3 RF power consumption . 8
. 8 3.4 Working current 4 RF parameters 4.1 Basic RF features
. 9 4.2 Wi-Fi transmission performance . 10 4.3 Wi-Fi receiving performance . 11 4.4 Bluetooth LE transmission performance . 11 4.5 Bluetooth LE receiving performance . 12 5 Antenna information 5.1 Antenna type . 12 5.2 Antenna interference reduction . 12 6 Packaging information and production instructions 6.1 Mechanical dimensions
. 13
. 15 6.2 Production instructions 6.3 Recommended oven temperature curve and temperature . 17 6.4 Storage conditions . 18 2 3 7 9 12 13 20 20 7 MOQ and packaging information 8 Appendix: Statement i Contents a is consistsof CB2S It only BluetoothLE a sup-ports low-power highly the AP network embedded integrated and connection STA Wi-Fi -
chip RF manner. Bluetooth module that Tuya has developed. and dual-network-connection BK7231N few a manner peripherals, and not but supports the 1 / 22 1 OVERVIEW a with support running the Tuya MCU 32-bit a to RAM, as so instructions decoding. PWM for Besides, output 32-bit processing it has makes speed IoT signals of cloud can peripherals, very chip rich the eectively such suitable as for to 120 up connection. MHz, 2Mbyte MCUs The implement au-
UART, PWM, high-quality 1 Overview built-in with 256-KB extended is and CB2S ash, specially dio and LED encoding SPI. The control. and six 1.1 Features low-power 32-bit CPU, which can also function as an application Embedded processor The clock Working Peripherals:
ceiver/transmitter Wi-Fi connectivity rate:
voltage:
5 120 3.0V MHz to width
(UART), pulse 3.6V modulations and serial 2
(PWM), peripheral 1 universal interface
(SPI) asynchronous re-
GHz dBm 802.11 Channels Support Up
to Support Support and iOS Onboard Working b/g/n 1 14@2.4 to WPA/WPA2, WEP, 16 output STA/AP/STA+AP SmartCong devices PCB antenna temperature:
and WPA/WPA2 and in power 802.11b mode working network AP PSK mode a with
-40 gain to 0 of 105 dBi
(AES) security modes conguration manners for Android Bluetooth LE connectivity dBm 6 Complete Onboard transmit power in Bluetooth Bluetooth coexistence PCB antenna with a gain mode interface 0 dBi of 1.2 Applications Intelligent building 2 / 22 2 MODULE INTERFACES Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update 04/06/2021 This is the rst release. V1.0.0 04/06/2021 Updated test data V1.0.1 2 Module interfaces 2.1 Dimensions and package The CB2S dimensions are 17.90.35 mm (L)14.90.35 mm (W) 2.80.1 mm (H). The dimensions of CB2S are as follows:
3 / 22 2 MODULE INTERFACES 2.2 Pin definition 4 / 22 Pin number Symbol I/O type Function 2 MODULE INTERFACES 1 2 3 4 5 6 7 8 9 10 3V3 P8 GND P7 RX1 P6 TX1 ADC P24 CEN P I/O P I/O I/O I/O I/O I/O I/O I/O 5 / 22 Power supply 3V3 Support hardware PWM Power supply reference ground Support hardware PWM UART_RX1, which is used for receiving user data and corresponds to P10 of the internal IC Support hardware PWM UART_TX1, which is used for transmitting user data and corresponds to P11 of the internal IC ADC, which corresponds to P23 on the internal IC Support hardware PWM Reset pin Pin number Symbol I/O type Function 11 Test point P26 RX2 I/O I/O Test point TX2 I/O Test point CSN I/O 2 MODULE INTERFACES Support hardware PWMC UART_RX2, which corresponds to P1 on the internal IC prohibition of use this pin UART_TX2, which is used for outputting logs and corresponds to P0 of the internal IC Mode selection pin. If connected to the ground before powered on, enter the rmware test mode. If not connected or connected to VCC before powered on, enter the rmware application mode Correspond to P21 on the internal IC. Note: P indicates a power supply pin and I/O indicates an input/output pin. 6 / 22 3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Storage temperature Power supply voltage
-55
-0.3 TAMB-25
-4 125 3.9 4 Unit V KV TAMB-25
-200 200 V Ts VBAT Static electricity discharge voltage
(human body model) Static electricity discharge voltage
(machine model) 3.2 Normal working conditions Parameter Description Minimum value Typical value Maximum value Ta
-40 85 Unit VBAT 3.0 3.3 3.6 V Working tempera-
ture Power supply voltage 7 / 22 3 ELECTRICAL PARAMETERS Parameter Description Minimum value Typical value Maximum value Unit VSS VSS+0.3 V VBAT-0. 3 VBAT V Imax
20 mA VOL VOH I/O low level output I/O high level output I/O drive current 3.3 RF power consumption
6 Working status Mode Rate Transmit power/re-
ceive Average value Peak value
(Typical value)) Transmit 11b 11Mbps
+16dBm 81 Transmit 11g 54Mbps
+15dBm 82 Transmit 11n MCS7
+14dBm 85 Receive 11b 11 Mbps Unit mA mA mA mA mA mA 240 238 234 82 82 82 Receive 11g 54 Mbps Receive 11n MCS 7 3.4 Working current Constantly receive Constantly receive Constantly receive 73 75 75 8 / 22 4 RF PARAMETERS Working status, Ta =
25C Average value Maximum value (Typical value) 63 245 Unit mA Working mode Quick network connection state
(Bluetooth ) Quick network connection state (AP) Quick network connection state (EZ) Network connection state The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is in the hotspot network connection state and the Wi-Fi indicator ashes slowly The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is connected to the network and the Wi-Fi indicator is always on 4 RF parameters 4.1 Basic RF features 80 270 mA 78 246 mA 25 342 mA 9 / 22 4 RF PARAMETERS Parameter Description Working frequency 2.412 to 2.480 GHz Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14) Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps);
11g: 6, 9, 12, 18, 24, 36, 48, 54
(Mbps);
11n:
HT20 MCS0~7;
11n:
HT40 MCS 0 to 7 Antenna type PCB 4.2 Wi-Fi transmission performance Parameter Typical value Minimum value Maximum value Unit dBm dBm dBm
Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 54M Average RF output power, 802.11n OFDM Mode MCS7 Frequency error 16 15 14
10 / 22
-20
20 ppm 4 RF PARAMETERS 4.3 Wi-Fi receiving performance Parameter Typical value Minimum value Maximum value
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 PER<10%, RX sensitivity, Bluetooth LE 1M Parameter Working frequency Air rate TX power 2402
-20
-88
-74
-73
-96
1 6 4.4 Bluetooth LE transmission performance Minimum value Typical value Maximum value 2480
20 11 / 22 Unit dBm dBm dBm dBm Unit MHz Mbps dBm 5 ANTENNA INFORMATION Minimum value
-150 Parameter Frequency error Typical value Maximum value 150 Unit kHz 4.5 Bluetooth LE receiving performance Parameter Typical value Minimum value Maximum value RX sensitivity
-96 Unit dBm dBm dBm dB
-23
10 Maximum RF signal input
-10
Inter-
modulation Co-channel suppression ratio 5 Antenna information 5.1 Antenna type The CB2S select the PCB antenna. 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB. 12 / 22 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions 13 / 22 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 14 / 22 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 Production instructions For the in-line module developed by Tuya, the wave soldering equipment is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and record the exposure time (the total expo-
sure time cannot exceed 168 hours). Soldering equipment and materials:
Wave soldering equipment Wave soldering xture Constant-temperature soldering iron 15 / 22 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Tin bar, tin wire, and ux Oven temperature tester Baking equipment:
Cabinet oven Anti-static heat-resistant pallets Anti-static heat-resistant gloves The module needs to be baked in the following cases:
The vacuum packing bag was found to be damaged before being unpacked. There is no humidity indicator card (HIC) in the vacuum packing bag. After being unpacked, 10% and above circles on the HIC become pink. The total exposure time has been more than 168 hours since unpacking. More than 12 months have passed since the sealing date of the bag. Baking settings:
Temperature: 60C and 5%RH for reelizing and 125C and 5%RH for palletizing (please use heat-resistant pallet rather than plastic pallet) Time: 48 hours for reelizing and 12 hours for palletizing Alarm temperature: 65C for reelizing and 135C for palletizing Production ready temperature after natural cooling: < 36C The number of drying times: 1 Re-baking requirement: If a module remains unused for 168 hours after being unpacked, it must be baked again. Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because the modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering. In the whole production process, take electrostatic discharge (ESD) protective To guarantee the quality of products, you must pay attention to the following measures. items:
16 / 22 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS The amount of soldering ux. The height of the wave peak. Whether the tin slag and copper content in the wave soldering tank exceed Whether the window and thickness of the wave soldering xture are ap-
standards. propriate. Whether the wave soldering oven temperature curve is reasonable. 6.3 Recommended oven temperature curve and temperature For oven temperature setting, refer to oven temperatures for wave soldering. The peak temperature is 260C5C. The wave soldering temperature curve is shown below:
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Recommended soldering temperature:
17 / 22 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Recommended wave soldering oven temperature Preheat temperature Recommended manual soldering temperature Soldering temperature 80 to 130 C 36020C Preheat time 75 to 100s Soldering time 3s/point Peak contact time 3 to 5s Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA NA NA 6.4 Storage conditions Storage conditions for a delivered module are as follows:
The moisture-proof bag is placed in an environment where the temperature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. The package contains a humidity indicator card (HIC). 18 / 22 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 19 / 22 7 MOQ and packaging information 8 APPENDIX: STATEMENT Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton CB2S 3600 Tape reel 900 4 8 Appendix: Statement FCC Caution: Any changes or modications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device o and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled 20 / 22 8 APPENDIX: STATEMENT rolled distance environment. of 20cm This between device the should radiator be and installed your body. and operated with a minimum Important Note radio other module radios This with procedures. simultaneously must the in Additional with other radios. installed to except not host testing be system and device co-locate following authorization and FCC operating multi-transmitter to simultaneously product operate required be may The availability of some specic channels and/or operational frequency bands are country dependent and are rmware programmed at the factory to match the in-
tended destination. The rmware setting is not accessible by the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
cation. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. end-user this in The shown a minimum manual manual, of include shall including 20 all This between required product the regulatory be and must radiator cm distance installed user and body. information/warnings operated as with This device has got an FCC ID:
2ANDL-CB2S. The end product must be labeled in a visible area with the following:
Contains Transmitter Module FCC ID:
2ANDL-CB2S. This device is intended only for OEM integrators under the following conditions:The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. long As quired. for any 2 the as However, additional conditions the OEM compliance above integrator met, still are is requirements further transmitter tests will responsible required for with testing this their module be not re-
end-product installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions 21 / 22 of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 8 APPENDIX: STATEMENT This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 22 / 22