FCC ID: 2ANDL-CB3L Wi-Fi and Bluetooth Module

CB3L Module Datasheet Version: 20210507 Online Version Contents Contents 1 Product overview 2 1.1 Features................................................................................................... 2 1.2 Applications......................................................................................................... 3 2 Module interfaces 4 2.1 Dimensions and package............................................................................. 4 2.2 Pin denition........................................................................................................4 3 Electrical parameters 7 3.1 Absolute electrical parameters.....................................................................7 3.2 Normal working conditions.................................................................................7 3.3 RF power consumption....................................................................................... 8 3.4 Working current...........................................................................................8 4 RF parameters 10 4.1 Basic RF features.......................................................................................10 4.2 Wi-Fi transmission performance.......................................................................10 4.3 Wi-Fi receiving performance............................................................................ 11 4.4 Bluetooth transmission performance......................................................... 12 4.5 Bluetooth receiving performance.............................................................. 12 5 Antenna information 12 5.1 Antenna type..............................................................................................12 5.2 Antenna interference reduction................................................................. 13 6 Packaging information and production instructions 14 6.1 Mechanical dimensions............................................................................. 14 6.2 Side view............................................................................................................15 6.3 The schematic diagram of packaging........................................................ 16 6.4 The diagram of PCB packaging-pin header..................................................... 16 6.5 Production instructions.............................................................................. 17 6.6 Recommended oven temperature curve.................................................... 19 6.7 Storage conditions..................................................................................... 22 i 7 MOQ and packaging information 8 Appendix-Statement Contents 23 23 ii Contents CB3L is an embedded low-power Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB3L not only supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE. 1 / 25 1 PRODUCT OVERVIEW 1 Product overview CB3L is built in with a 32-bit MCU whose running speed can be up to 120 MHz, a 2-MB ash memory, and a 256-KB RAM, so as to support the Tuya cloud connection. The MCU instructions specially extended for signal processing can eectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM, UART and SPI. There are six 32-bit PWM outputs, making the chip very suitable for high-

quality LED control. Built in with the low-power 32-bit CPU, which can also function as an application 1.1 Features processor The clock rate: 120 MHz Working voltage: 3.0 to 3.6V Peripherals: 7 GPIOs, 1 UART, and 1 ADC Wi-Fi connectivity 802.11 b/g/n Channels 1 to 14@2.4 GHz Support WEP, WPA/WPA2, and WPA/WPA2 PSK (AES) security modes Up to +16 dBm output power in 802.11b mode Support STA/AP/STA+AP working mode Support Wi-Fi and hotspot network conguration manners for Android and iOS devices Onboard PCB antenna with a gain of 2.4 dBi Working temperature: -40 to 105 Bluetooth connectivity Support the Bluetooth LE V5.1 Support the transmit power of 6 dBm in Bluetooth mode Complete Bluetooth coexistence interface Onboard PCB antenna with a gain of 2.4 dBi 2 / 25 1 PRODUCT OVERVIEW 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 3 / 25 2 MODULE INTERFACES 2 Module interfaces 2.1 Dimensions and package CB3L has two rows of pins with a spacing of 20.1 mm. The CB3L dimensions are 160.35 mm (W)240.35 mm (L) 2.80.15 mm (H). Pin number Symbol I/O type Function 2.2 Pin definition 1 2 RST ADC Reset pin, eective currently ADC, which corresponds to P23 of the IC I/O AI 4 / 25 Pin number Symbol I/O type Function 2 MODULE INTERFACES Enabling pin, the module has been pulled up General I/O pin Support hardware PWM and correspond to P26 on the internal IC Support hardware PWM and correspond to P24 on the internal IC Support hardware PWM and correspond to P6 on the internal IC Power supply pin

(3.3V) Power supply reference ground Support hardware PWM and correspond to P9 on the internal IC UART2_TX, debug_log_Uart corresponds to P0 of the IC 3 4 5 6 7 8 9 10 11 EN P14 P26 P24 P6 VCC GND P9 TXD2 I I/O I/O I/O I/O P P I/O I/O 5 / 25 2 MODULE INTERFACES Pin number Symbol I/O type Function 12 CSN I/O It is not recommended for customers. If you need to use it, make sure that the level of the CSN pin remains high before powering on. The pin corresponds to P21 of the IC. Support hardware PWM and correspond to P8 on the internal IC Support hardware PWM and correspond to P7 on the internal IC User serial interface UART_RX, which corresponds to P10 of the IC User serial interface UART_TX, which corresponds to P11 of the IC 13 14 15 16 P8 P7 RXD1 I/O I/O I/O TXD1 I/O Note: P indicates a power supply pin and I/O indicates an input/output pin. 6 / 25 3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Storage temperature Power supply voltage

-55

-0.3 TAMB-25

-4 125 3.9 4 Unit V KV TAMB-25

-200 200 V Ts VBAT Static electricity discharge voltage

(human body model) Static electricity discharge voltage

(machine model) 3.2 Normal working conditions Parameter Description Minimum value Typical value Maximum value Ta

-40

105 Unit VBAT 3 3.3 3.6 V Working tempera-

ture Power supply voltage 7 / 25 3 ELECTRICAL PARAMETERS Parameter Description Minimum value Typical value Maximum value Unit VSS VSS+0.3 V VBAT-0. 3 VBAT V Imax

20 mA VOL VOH I/O low level output I/O high level output I/O drive current 3.3 RF power consumption

6 Working status Mode Rate Transmit power/re-

ceive Average value Peak value

(Typical value)) Transmit 11b 11Mbps

+16dBm 270 Transmit 11g 54Mbps

+15dBm 260 Transmit 11n MCS7

+14dBm 253 Receive 11b 11Mbps Receive 11g 54Mbps Receive 11n MCS7 Constantly receive Constantly receive Constantly receive 73 75 75 300 280 273 82 82 82 Unit mA mA mA mA mA mA 3.4 Working current 8 / 25 3 ELECTRICAL PARAMETERS Working status, Ta =

25C Average value Maximum value (Typical value) 70 270 Unit mA Working mode Quick network connection state

(Bluetooth ) Quick network connection state (AP) Quick network connection state (EZ) Network connected state Network disconnected state The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is in the hotspot network connection state and the Wi-Fi indicator ashes slowly The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is connected to the network and the Wi-Fi indicator is always on The module is disconnected and the Wi-Fi indicator is always o 80 305 mA 87 380 mA 39 355 mA 70 270 mA 9 / 25 4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.412 to 2.484 GHz Standard Bluetooth LE 5.1 Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps);

IEEE 802.11 b/g/n (channels 1 to 14) 11g: 6, 9, 12, 18, 24, 36, 48, 54

(Mbps);

11n: HT20 MCS 0 to 7;

11n: HT40 MCS 0 to 7 Bluetooth LE 1Mbps Antenna type onboard PCB antenna 4.2 Wi-Fi transmission performance Parameter Typical value Minimum value Maximum value

Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 54M 16 15

10 / 25 Unit dBm dBm 4 RF PARAMETERS Parameter Typical value Minimum value Maximum value 14

-20

20 ppm 4.3 Wi-Fi receiving performance Parameter Typical value Minimum value Maximum value

Average RF output power, 802.11n OFDM Mode MCS7 Frequency error PER<8%, RX sensitivity, 802.11b DSSS Mode 11M PER<10%, RX -

sensitivity, 802.11g OFDM Mode 54M PER<10%, RX -

sensitivity, 802.11n OFDM Mode MCS7 PER<10%, RX -

sensitivity, Bluetooth 1M

-88

-74

-72

-93 11 / 25 Unit dBm Unit dBm dBm dBm dBm 5 ANTENNA INFORMATION 4.4 Bluetooth transmission performance Minimum value Typical value Maximum value 150 KHz Unit MHz Mbps dBm Unit dBm dBm dBm dB 2480

20

-23 4.5 Bluetooth receiving performance Parameter Typical value Minimum value Maximum value Parameter Working frequency Air rate Transmit power Frequency error 2402

-20

-150 RX sensitivity

Maximum RF signal input

-10

Inter-

modulation Co-channel suppression ratio

1 6

-93

10 5 Antenna information 5.1 Antenna type CB3L may use the onboard PCB antenna. 12 / 25 5 ANTENNA INFORMATION 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB. 13 / 25 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions The PCB dimensions are 160.35 mm (W)240.35 mm (L) 0.80.1 mm (H). 14 / 25 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 Side view 15 / 25 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.3 The schematic diagram of packaging 6.4 The diagram of PCB packaging-pin header CB3L can be packaged with the SMT or pin header. The dimensions of the plug-in are as follows:

16 / 25 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.5 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

(SMT process) SMT devices:

Mounter SPI Reow soldering machine Thermal proler Automated optical inspection (AOI) equipment

(Wave soldering process) Wave soldering devices Wave soldering equipment 17 / 25 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Wave soldering xture Constant-temperature soldering iron Tin bar, tin wire and ux Thermal proler Baking devices:

Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:

The moisture-proof bag must be placed in an environment in which the temperature is below 40C and the relative humidity is lower than90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag. 3. The module needs to be baked in the following cases:

The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months has passed since the sealing of the bag. 4. Baking settings:

Temperature: 60C and 5% RH for reel package and 125C and 5%

RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C 18 / 25 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the reow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 6.6 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some dierences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements. Manner 1: SMT process (Recommended oven temperature curve of reow soldering) Set oven temperatures according to the followingcurve. 19 / 25 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s perature: 150 to 200C F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s E: Duration of constant temperature: 60 to 120s; the range of constant tem-

Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specications. Manner 2: Wave soldering process (Oven temperature curve of wave sol-

dering) Set oven temperatures according to the following temperature curve of wave sol-

dering. The peak temperature is 260C5C. 20 / 25 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

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Suggestions on oven temperature curve of wave soldering Preheat temperature Suggestions on manual soldering temperature Soldering temperature 80 to 130 C 36020C Preheat time 75 to 100s Soldering time 3s/point Peak contact time 3 to 5s Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA NA NA 21 / 25 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.7 Storage conditions 22 / 25 8 APPENDIX-STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton CB3L 3600 Tape reel 900 4 8 Appendix-Statement FCC Caution: Any changes or modications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-

lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device o and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled 23 / 25 8 APPENDIX-STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specic channels and/or operational frequency bands are country dependent and are rmware programmed at the factory to match the in-

tended destination. The rmware setting is not accessible by the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-

cation. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-CB3L. The end product must be labelled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-

CB3L. This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-

mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-

quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this moduleinstalled. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions 24 / 25 of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 8 APPENDIX-STATEMENT This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 25 / 25

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (01/03/2020) TUV SUD BABT UNLIMITED TCB Octagon House, Segensworth North, Fareham, Hampshire, PO15 5RL, United Kingdom Dear Sir or Madam, We, (Hangzhou Tuya Information Technology Co.,Ltd Room701,Building3,More Center,No.87 GuDun Road, Hangzhou, Zhejiang, China), hereby authorize Jiaxi XU from TV SD Certification and Testing (China) Co., Ltd. Shanghai Branch 3-13, No.151 Heng Tong Road Shanghai 201108 P.R. China to act as our agent in all matters relating to applications for equipment authorization, including the signing of all documents relating to these matters. This authorization expires on (Dec. 31, 2021). Sincerely, Company Officer:

Telephone Number:

Email:

Shou XiaoDong 86-571-86581786 mikeshou@tuya.com

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (03/05/2021) TUV SUD BABT UNLIMITED TCB Octagon House, Segensworth North, Fareham, Hampshire, PO15 5RL, United Kingdom Confidentiality Request FCC ID: 2ANDL-CB3L Pursuant to Sections 0.457(d)(1)(ii) and 0.459 of the Commissions Rules, (Hangzhou Tuya Information Technology Co.,Ltd) hereby requests permanent confidential treatment of information accompanying this application as outlined below:

Schematics Block Diagrams Theory of Operation The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457(d)(1)(ii), disclosure of this Application and all accompanying materials will not be made before the date of the Grant for this Application. Yours sincerely, Company Officer:

Telephone Number:

Email:

86-571-86581786 mikeshou@tuya.com

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 WIFI Channel 12 ,13 and 14 Declaration Letter We declare the equipment identified below with regards to Channel 12,13 and 14 capabilities for FCC ID: 2ANDL-CB3L Declaration Product hardware does not have the capability to operate on Channel 12,13 and 14. Product hardware has the capability to operate on Channel 12 ,13 and 14. However, these three channels will be disabled via software and will not be accessible to user. Product hardware has the capability to operate on Channel 12 ,13 and 14. However, all the operated channels cant be changed in the RF parameter via software. All channels have complied with all of the requirements sets out in FCC Part 15.247. Product hardware has the capability to operate on WiFi Channel 12 ,13 and 14, and meets the requirements of KDB 594280 D01 v02r01. Please note:

1.) By default, this device operates in a mode that is compliant with the U.S. requirements. 2.) This device will also use supplemental information such as geo-location data to determine that it is operating outside the U.S., if necessary, to change its power. Such supplemental data will be derived from the following:

Global Navigation Satellite System (GNSS)7 sensors in the device Mobile Country Code (MCC),8 or MCC with a Mobile Network code (MNC), received from a CMRS9 carrier and received directly by a receiver on the device Country information derived from multiple adjacent access points (for example using IEEE Std 802.11d provisions) may be permitted on case-by-case basis Other suitable geo-location data based on IP addresses or other reliable source. Name / Title: / General Manager Signature:

Phone: 86-571-86581786 Email: mikeshou@tuya.com Date: Dec 18,2019

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (03/05/2021) Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Modular Approval Request FCC ID: 2ANDL-CB3L The following attestation addresses the requirements to support modular approval:

Modular approval requirement Yes (provide brief statement) No *

(a) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly The module has a metal shied. Refer to the external photo of EUT.

(b) The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal Data to the modulation circuit is buffered as described in the operational description provided with the application.

(c) The module must contain power supply regulation on the module The module contains its own power supply regulation. Please refer to schematic filed with this application.

(d) The module must contain a permanently attached antenna, or The module has a PCB antenna and which permanently attached Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b)

(e) The module must demonstrate compliance in a stand-alone configuration

(f) The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements)

(g) The module must comply with all specific rules applicable to the transmitter. The grantee must provide comprehensive instructions to explain compliance requirements the module. Refer to the photo of EUT. The module was tested stand-

alone as shown in test setup photographs filed with this application. The FCC ID is printed on the label of the module. Refer to the label of EUT. The module complied with all specific rules. Refer to the datasheet. Modular approval requirement Yes (provide brief statement) No *

(h) The module must comply with RF exposure requirements Please refer exhibition RF Exposure for the compliance of MPE RF exposure rule.

* Please provide a detailed explanation if the answer is No. Yours sincerely, Name:

Title:

General Manager