CB3S Module Datasheet Version: 20210506 Online Version Contents Contents 1 Product overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 3 2.1 Dimensions and package . 3 2 Module interfaces 3 Electrical parameters
. 8 3.1 Absolute electrical parameters 3.2 Normal working conditions
. 8 3.3 RF power consumption . 9
. 9 3.4 Working current 4 RF parameters
. 11 4.1 Basic RF features 4.2 Wi-Fi transmission performance . 11 4.3 Wi-Fi receiving performance . 12 4.4 Bluetooth transmission performance . 13 4.5 Bluetooth receiving performance . 13 5 Antenna information 5.1 Antenna type . 13 5.2 Antenna interference reduction . 14 6 Packaging information and production instructions
. 17 6.1 Mechanical dimensions 6.2 Production instructions
. 21 6.3 Recommended oven temperature curve . 22 6.4 Storage conditions . 24 2 3 8 11 13 17 25 25 7 MOQ and packaging information 8 Appendix-Statement i Contents CB3S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB3S not only supports the Wi-Fi AP and STA modes but also supports the Bluetooth LE. 1 / 27 1 PRODUCT OVERVIEW 1 Product overview CB3S is built in with a 32-bit MCU whose running speed can be up to 120 MHz, a 2-MB ash memory, and a 256-KB RAM, to support the Tuya cloud connection. The MCU instructions specially extended for signal processing can eectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM and UART. There are 5 channels of 32-bit PWM output, making the chip very suitable for high-quality LED control. Built in with the low-power 32-bit CPU, which can also function as an application 1.1 Features processor The clock rate: 120 MHz Working voltage: 3.0 to 3.6V Peripherals: 5 PWMs and 1 UART Wi-Fi connectivity 802.11 b/g/n Channels 1 to 14@2.4 GHz Support WEP, WPA/WPA2, and WPA/WPA2 PSK (AES) security modes Up to +16 dBm output power in 802.11b mode Support STA/AP/STA+AP working mode Support SmartCong and AP network conguration manners for Android and iOS devices Onboard PCB antenna with a gain of 1.3 dBi Working temperature: -40 to 85 Bluetooth connectivity Support the transmit power of 6 dBm in the Bluetooth mode Complete Bluetooth coexistence interface Onboard PCB antenna with a gain of 1.3 dBi 1.2 Applications Intelligent building Smart household and home appliances 2 / 27 2 MODULE INTERFACES Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history 2 Module interfaces 2.1 Dimensions and package Update date Updated content Version after update 04/15/2021 This is the rst release. V1.0.0 The dimensions of CB3S are 16.000.35 mm (W)24.000.35 mm (L) 2.80.15 mm (H). The dimensions of CB3S are as follows:
The packaging drawing of CB3S is:
3 / 27 2 MODULE INTERFACES Pin number Symbol I/O type Function RST I 1 2 ADC3 AI 4 / 27 Low-level reset, high level active
(the pin has been pulled high internally), correspond to CEN of the IC ADC pin, which corresponds to P23 of the IC 2 MODULE INTERFACES Pin number Symbol I/O type Function CEN I Enabling pin, which is pulled high internally to be compatible with other modules A common GPIO interface, which corresponds to P14 of the IC GPIOP_26, which corresponds to P26 of the IC, PWM 5 GPIOP_24, which corresponds to P24 of the IC, PWM 4 GPIOP_6which corresponds to P6 of the IC, PWM 0 Power supply pin
(3.3V) Power supply reference ground GPIOP_9, which corresponds to P9 of the IC, PWM 3 3 4 5 6 7 8 9 10 P14 P26 P24 P6 VCC GND P9 I/O I/O I/O I/O P P I/O 5 / 27 2 MODULE INTERFACES Pin number Symbol I/O type Function 11 TXD2 I/O UART2_TXD (used to display the module internal information), which corresponds to P0 of the IC Production test control pin. Not recommended for use. High level by default. Not allowed to pull down before power on. GPIOP_8, which corresponds to P8 of the IC, PWM 2 GPIOP_7, which corresponds to P7 of the IC, PWM 1 UART1_RXD (user serial interface), which corresponds to P10 of the IC UART1_TXD (user serial interface), which corresponds to P11 of the IC 12 CSN I/O 13 14 15 16 P8 P7 RXD1 I/O I/O I/O TXD1 I/O 6 / 27 2 MODULE INTERFACES ADC pin, which corresponds to P23 of the IC GPIOP_22, which corresponds to P22 of the IC Production test control pin. Not recommended for use. High level by default. Not allowed to pull down before power on. GPIOP_20, which corresponds to P20 of the IC Pin number Symbol I/O type Function 17 18 19 20 21 22 ADC3 P22 CSN NC NC P20 I/O AI I/O I/O 7 / 27 Note: P indicates a power supply pin and I/O indicates an input/output pin. 3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Storage temperature Power supply voltage
-55
-0.3 TAMB-25
-4 125 3.9 4 Unit V KV TAMB-25
-200 200 V Ts VBAT Static electricity discharge voltage
(human body model) Static electricity discharge voltage
(machine model) 3.2 Normal working conditions Parameter Description Minimum value Typical value Maximum value Ta
-40
85 Unit VBAT 3 3.3 3.6 V Working tempera-
ture Power supply voltage 8 / 27 3 ELECTRICAL PARAMETERS Parameter Description Minimum value Typical value Maximum value Unit VSS VSS+0.3 V VBAT-0. 3 VBAT V Imax
20 mA VOL VOH I/O low level output I/O high level output I/O drive current 3.3 RF power consumption
6 Working status Mode Rate Transmit power/re-
ceive Average value Peak value
(Typical value)) Transmit 11b 11Mbps
+16dBm 81 Transmit 11g 54Mbps
+15dBm 82 Transmit 11n MCS7
+14dBm 85 Receive 11b 11Mbps Receive 11g 54Mbps Receive 11n MCS7 Constantly receive Constantly receive Constantly receive 73 75 75 3.4 Working current Unit mA mA mA mA mA mA 240 238 234 82 82 82 9 / 27 3 ELECTRICAL PARAMETERS Working status, Ta =
25C Average value Maximum value (Typical value) 63 245 Unit mA Working mode Quick network connection state
(Bluetooth) Quick network connection state (AP) Quick network connection state (EZ) Network connected state Network disconnected state The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is in the hotspot network connection state and the Wi-Fi indicator ashes slowly The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is connected to the network and the Wi-Fi indicator is always on The module is disconnected and the Wi-Fi indicator is always o 80 270 mA 78 246 mA 25 342 mA 63 242 mA 10 / 27 4 RF parameters 4.1 Basic RF features 4 RF PARAMETERS Parameter Description Working frequency 2.412 to 2.484 GHzIEEE 802.11 Standard b/g/n
(channels 1 to 14) Datatransmissionrate 11b:
1, 2, 5.5, 11
(Mbps);
Bluetooth LE 5.1 11g:
6, 9, 12, 18, 24, 36, 48, 54(Mbps 11n:HT20/HT40 MCS 0 to 7;
Bluetooth LE1Mbps onboard PCB antenna Antenna type 4.2 Wi-Fi transmission performance Parameter Typical value Minimum value Maximum value 16 15
Unit dBm dBm
Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 54M 11 / 27 4 RF PARAMETERS Parameter Typical value Minimum value Maximum value 14
-20
20 ppm 4.3 Wi-Fi receiving performance Parameter Typical value Minimum value Maximum value
Average RF output power, 802.11n OFDM Mode MCS7 Frequency error PER<8%, RX sensitivity, 802.11b DSSS Mode 11M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 PER<10%, RX sensitivity, Bluetooth LE 1M
-88
-74
-73
-96 12 / 27 Unit dBm Unit dBm dBm dBm dBm 5 ANTENNA INFORMATION 4.4 Bluetooth transmission performance Minimum value Typical value Maximum value 150 KHz Unit MHz Mbps dBm Unit dBm dBm dBm dB 2480
20
-23 4.5 Bluetooth receiving performance Parameter Typical value Minimum value Maximum value
1 6
-96
10 Parameter Working frequency Air rate Transmit power Frequency error 2402
-20
-150 RX sensitivity
Maximum RF signal input
-10
Inter-
modulation Co-channel suppression ratio 5 Antenna information 5.1 Antenna type CB3S uses the onboard PCB antenna with a gain of 1.3 dBi. 13 / 27 5 ANTENNA INFORMATION 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB. 14 / 27 5 ANTENNA INFORMATION 15 / 27 5 ANTENNA INFORMATION 16 / 27 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions 17 / 27 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 18 / 27 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 19 / 27 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 20 / 27 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 Production instructions 1. The Tuya SMT module should be mounted by the SMT device. After being un-
packed, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded
(the total exposure time cannot exceed 168 hours). SMT devices:
Mounter SPI Reow soldering machine Thermal proler Automated optical inspection (AOI) equipment Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the tem-
perature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag. 3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. There is no HIC in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. 21 / 27 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS More than 12 months have passed since the sealing of the bag. 4. Baking settings:
Temperature: 60C and 5% RH for reel package and 125C and 5%
RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the reow soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 6.3 Recommended oven temperature curve Set oven temperatures according to the following temperature curve of reow sol-
dering. The peak temperature is 245C. 22 / 27 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s perature: 150 to 200C F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s E: Duration of constant temperature: 60 to 120s; the range of constant tem-
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specications. 23 / 27 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.4 Storage conditions 24 / 27 7 MOQ and packaging information 8 APPENDIX-STATEMENT Product number MOQ (pcs) Packaging method Qty of modules per reel Qty of reels per carton CB3S 3600 Tape reel 900 4 8 Appendix-Statement FCC Caution: Any changes or modications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device o and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled 25 / 27 8 APPENDIX-STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specic channels and/or operational frequency bands are country-dependent and are rmware programmed at the factory to match the in-
tended destination. The rmware setting is not accessible by the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
cation. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-CB3S. The end product must be labelled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-
CB3S. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Direc-
26 / 27 tive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 8 APPENDIX-STATEMENT This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 27 / 27