CB3S-NL Module Datasheet Version: 20220210 Online Version Contents Contents 1 Product overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 3
. 4 2.1 Dimensions and footprint 2.2 Pin definition . 4 2 Module interfaces 3 Electrical parameters
. 8 3.1 Absolute electrical parameters 3.2 Normal working conditions
. 9 3.3 RF power consumption . 9
. 10 3.4 Operating current 4 RF parameters
. 12 4.1 Basic RF features 4.2 Wi-Fi transmission performance . 12 4.3 Wi-Fi receiving performance . 13 4.4 Bluetooth transmission performance . 13 4.5 Bluetooth receiving performance . 14 5 Antenna information 5.1 Antenna type . 15 5.2 Interference reduction . 15 6 Packaging information and production instructions
. 18 6.1 Mechanical dimensions 6.2 Production instructions
. 21 6.3 Recommended oven temperature curve . 23 6.4 Storage conditions . 25 7 MOQ and packaging information 2 4 8 12 15 18 26 I 8 Appendix: Statement 8.1 Industry Canada Statement
. 29 Contents 27 II Contents CB3S-NL is an embedded low-power Wi-Fi module that Tuya has developed. It con-
sists of a highly integrated RF chip BK7231NL and a few peripherals. CB3S-NL not only supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE. 1 / 30 1 Product overview 1 Product overview CB3S-NL is built in with a 32-bit MCU whose running speed can be up to 120 MHz, 2-MB flash memory, and 256-KB RAM, to connect to the Tuya IoT cloud. The MCU in-
structions specially extended for signal processing can effectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM and UART. There are six 32-bit PWM outputs, making the chip very suitable for high-quality LED control. Built in with the low-power 32-bit CPU, which can also function as an application 1.1 Features processor Clock rate: 120 MHz Operating voltage: 3.0 to 3.6V Peripherals: 6 PWMs and 1 UART Wi-Fi connectivity 802.11 b/g/n Channels 1 to 14@2.4 GHz Support WEP, WPA/WPA2, and WPA/WPA2 PSK (AES) security modes Up to +16 dBm output power in 802.11b mode Support STA, AP, and STA+AP modes Support SmartConfig and AP network configuration manners for Android and iOS devices Onboard PCB antenna with a gain of 1.37 dBi Operating temperature: -40 to 85 Bluetooth connectivity Support the transmit power of 6 dBm in the Bluetooth mode Complete Bluetooth coexistence interface Onboard PCB antenna with a gain of 1.37 dBi 1.2 Applications Intelligent buildings Smart household and home appliances 2 / 30 1 Product overview Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update Jan. 25, 2022 This is the first release. V1.0.0 3 / 30 2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint The dimensions of CB3S-NL are 16.000.35 mm (W)24.000.35 mm (L) 2.80.15 mm (H). The dimensions of CB3S-NL are as follows:
2.2 Pin definition Pin number Symbol II/O type Function RST I 1 2 ADC3 AI 4 / 30 Low level reset, high level active
(the pin has been pulled high internally), correspond to CEN of the IC ADC pin, which corresponds to P23 of the IC 2 Module interfaces Enabling pin, which is pulled high internally to be compatible with other modules A common GPIO, which corresponds to P14 of the IC GPIOP_26, which corresponds to P26 of the IC, PWM 5 GPIOP_24, which corresponds to P24 of the IC, PWM 4 GPIOP_6which corresponds to P6 of the IC, PWM 0 Power supply pin
(3.3V) Power supply reference ground GPIOP_9, which corresponds to P9 of the IC, PWM 3 UART2_TXD (used to display the module internal information), which corresponds to P0 of the IC Pin number Symbol II/O type Function CEN I 3 4 5 6 7 8 9 10 11 P14 P26 P24 P6 VCC GND P9 TXD2 I/O I/O I/O I/O P P I/O I/O 5 / 30 Pin number Symbol II/O type Function 12 CSN I/O 13 14 15 P8 P7 RXD1 I/O I/O I/O 2 Module interfaces Pin for control production tests If it is used as a port, the level must be pulled up externally and cannot be pulled down before powering on. GPIOP_8, which corresponds to P8 of the IC, PWM 2 GPIOP_7, which corresponds to P7 of the IC, PWM 1 UART1_RXD (User serial port), which corresponds to P10 of the IC Do not pull it up. By default, the docking serial port of the MCU needs to be in low-level state or high-impedance state. 6 / 30 Pin number Symbol II/O type Function 16 TXD1 I/O 17 ADC3 AI 18 P22 I/O 19 CSN I/O 7 / 30 2 Module interfaces UART1_TXD (User serial port), which corresponds to P11 of the IC Do not pull it up. By default, the docking serial port of the MCU needs to be in low-level state or high-impedance state.
(Not recommended. If needed, please use Pin 2) ADC port, which corresponds to P23 of the IC. SPI burning pin
(Not recommended) GPIOP_22, which corresponds to P22 of the IC. SPI burning pin. A customer needs to use the pull-up resistor which cannot be pulled down before powering on and corresponds to P21 of the IC Pin number Symbol II/O type Function 20 P20 I/O 3 Electrical parameters
(Not recommended) GPIOP_20, which corresponds to P20 of the IC. SPI burning pin Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin. For the MCU solution, please refer to CBx Module. 21 22 NC NC 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Storage temperature
-55 Supply voltage -0.3 TAMB-25
-4 125 3.9 4 TAMB-25
-200 200 Ts VBAT ESD voltage
(human body model) ESD voltage
(machine model) Unit V KV V 8 / 30 3 Electrical parameters 3.2 Normal working conditions Parameter Description Minimum value Typical value Maximum value
-40 85 2.3 3.3 3.6 Low voltage output VSS VSS+0.3 VBAT-0. 3 VBAT Ta VBAT VOL VOH Operating tempera-
ture Power supply voltage High voltage output Drive current
6 Imax
20 mA 3.3 RF power consumption Operating status Mode Rate Transmit power/re-
ceive Average value Transmit 11b 11Mbps
+16dBm 267 Transmit 11g 54Mbps
+14dBm 258 Transmit 11n MCS7
+13dBm 253 Receive 11b 11Mbps Receive 11g 54Mbps Peak value
(Typical value) 412 412 304 82 82 Unit V V V Unit mA mA mA mA mA Constantly receive Constantly receive 73 75 9 / 30 3 Electrical parameters Operating status Mode Rate Receive 11n MCS7 Transmit power/re-
ceive Average value Constantly receive 75 Peak value
(Typical value) 82 Unit mA Note: The requirement for testing the current in transmission state is that the module must constantly send packets. 3.4 Operating current Operating mode Quick network connection state
(Bluetooth ) Quick network connection state (AP) Quick network connection state (EZ) Operating status, Ta =
25C The module is connecting to the network and the Wi-Fi indicator flashes fast The module is connecting to the network and the Wi-Fi indicator flashes slowly The module is connecting to the network and the Wi-Fi indicator flashes fast Maximum value (Typical value) Average value 63 404 Unit mA 74 356 mA 74 404 mA 10 / 30 3 Electrical parameters Maximum value (Typical value) Average value 25 404 Unit mA 205 407 mA Operating mode Connected Weakly connected Operating status, Ta =
25C The module is connected to the network and the Wi-Fi indicator is always on The module and the hotspot are weakly connected and the Wi-Fi indicator is always on The module is disconnected and the Wi-Fi indicator is always off The CEN pin of the module is connected to the ground. Disconnected 63 404 mA Module disabled 330
uA 11 / 30 4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency Wi-Fi standard 2.412 to 2.484 GHz IEEE 802.11 b/g/n (channels 1 to 14) Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps);
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps);
11n: HT20 MCS 0 to 7;
Antenna type PCB antenna 4.2 Wi-Fi transmission performance Parameter Typical value Minimum value Maximum value Unit dBm dBm dBm
Average output power, 802.11b CCK Mode 11M Average output power, 802.11g OFDM Mode 54M Average output power, 802.11n OFDM Mode MCS7 Frequency error 16 14 13
12 / 30
-20
20 ppm 4 RF parameters 4.3 Wi-Fi receiving performance Parameter Typical value Minimum value Maximum value
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 PER<10%, RX sensitivity, Bluetooth LE 1M Parameter Working frequency Air rate Transmit power Frequency error 2402
-20
-150
Maximum value 2480
20 150 Unit dBm dBm dBm dBm Unit MHz Mbps dBm KHz
-88
-74
-73
-96
1 6
13 / 30 4.4 Bluetooth transmission performance Minimum value Typical value 4 RF parameters 4.5 Bluetooth receiving performance Parameter Typical value Minimum value Maximum value
-10
RX sensitivity Maximum RF signal input Inter-
modulation Co-channel suppression ratio
-96
10
-23 Unit dBm dBm dBm dB 14 / 30 5 Antenna information 5 Antenna information 5.1 Antenna type 5.2 Interference reduction CB3S-NL uses the PCB antenna with a gain of 1.37 dBi. To ensure the optimal Wi-Fi performance when the Wi-Fi module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB. PCB Antenna 15 / 30 5 Antenna information PCB Antenna PCB Antenna 16 / 30 5 Antenna information Do not place metal in the red area above the antenna
(Arc size is recommended to be more than 3cm in diameter) 17 / 30 6 Packaging information and production instructions 6 Packaging information and production instructions 6.1 Mechanical dimensions 18 / 30 6 Packaging information and production instructions 19 / 30 6 Packaging information and production instructions 20 / 30 6 Packaging information and production instructions 6.2 Production instructions 1. The Tuya SMT module should be mounted by the SMT device. After being un-
packed, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded
(the total exposure time cannot exceed 168 hours). SMT devices:
21 / 30 6 Packaging information and production instructions Mounter SPI Reflow soldering machine Thermal profilter Automated optical inspection (AOI) equipment Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in the environment where the tem-
perature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag.
![HIC -SMT module .png ]( https :// airtake -public -data -1254153901. cos.ap 1 2 -shanghai . myqcloud .com/goat /20210410/48793 a0e11ea40d4839db36535e47bf 3 5. png) 3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months has passed since sealing of the bag. 4. Baking settings: -Temperature: 60C and 5%RH for reel package and 125C and 5%RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. 22 / 30 6 Packaging information and production instructions If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level 3 moisture-
sensitive devices, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 6.3 Recommended oven temperature curve Set temperatures according to the following curve. 245C. The peak temperature is A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s 23 / 30 6 Packaging information and production instructions E: Duration of constant temperature: 60 to 120s; the range of constant tem-
perature: 150 to 200C F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications. 24 / 30 6 Packaging information and production instructions 6.4 Storage conditions 25 / 30 7 MOQ and packaging information 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton CB3S-NL 3600 Tape reel 900 4 26 / 30 8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are country-dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user. 27 / 30 8 Appendix: Statement host that The rules fication. with the product apply to final The modular manufacturer host not product the host is covered still installed. transmitter responsible for compliance with any by requires the Part modular transmitter B grant compliance 15 Subpart FCC other certi-
of testing The shown a end-user this in manual manual, shall including include minimum distance of 20 cm all This between required product regulatory must be and radiator the installed user and body. information/warnings operated as with device This in visible a 2ANDL-CB3S-
has area got with NL. an the FCC ID:
following:
2ANDL-CB3S-NL. Contains end Transmitter The product Module must FCC be ID:
labelled This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. long As quired. for any 2 the as However, additional conditions the OEM compliance above integrator met, still are is requirements further transmitter tests will responsible required for with testing this their module be not re-
end-product installed. 28 / 30 Declaration of Conformity European Notice 8 Appendix: Statement Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Direc-
tive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. The device could be used with a separation distance of 20cm to the human body. 29 / 30 8 Appendix: Statement This product must not be disposed of as normal household waste, following the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point. 30 / 30