CB8P Module Datasheet Version: 20210508 Online Version Contents Contents 1 Overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 3 2.1 Dimensions and package . 3 2.2 Pin denition . 5 2 Module interfaces 3 Electrical parameters
. 7 3.1 Absolute electrical parameters
. 7 3.2 Normal working conditions 3.3 RF power consumption . 8
. 8 3.4 Working current 4 RF parameters 4.1 Basic RF features
. 10 4.2 Wi-Fi transmission performance . 10 4.3 Wi-Fi receiving performance . 11 4.4 Bluetooth transmission performance . 12 4.5 Bluetooth receiving performance . 12 5 Antenna information 5.1 Antenna type . 12 5.2 Antenna interference reduction . 13 6 Packaging information and production instructions 6.1 Mechanical dimensions
. 14
. 16 6.2 Production instructions 6.3 Recommended oven temperature curve and temperature . 18 6.4 Storage conditions . 19 2 3 7 10 12 14 21 21 7 MOQ and packaging information 8 Appendix-Statement i Contents CB8P is a low-power-consumption embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB8P not only supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE. 1 / 23 1 OVERVIEW 1 Overview CB8P ash MCU audio and for in built is memory, instructions encoding There high-quality SPI. with and a a 32-bit 256-KB MCU specially and are 6 LED decoding. channels control. support the running speed can RAM, extended whose as so for Besides, of 32-bit to signal it has PWM be Tuya can to up cloud eectively such as a MHz, 120 connection. 2-MB The implement PWM, UART suitable the chip very processing rich output, peripherals, making the low-power 32-bit CPU, which can also function as an application 1.1 Features in with Built processor The clock Working Peripherals:
Wi-Fi 120 rate:
voltage:
5 3.0 PWMs, MHz to 1 3.6V UART and 1 ADC connectivity 802.11 Channels b/g/n 1 to 14@2.4 GHz Support Up to Support Support and iOS Onboard Working WEP,
+16 dBm WPA/WPA2, output STA/AP/STA+AP SmartCong devices antenna PCB temperature:
and power WPA/WPA2 in 802.11b mode working network AP and PSK mode a with
-40 gain to of 105 2.3 dBi
(AES) security modes conguration manners for Android Bluetooth connectivity Support Complete the transmit Bluetooth of 6 power coexistence in dBm interface the Bluetooth mode Onboard PCB antenna with a gain of 2.3 dBi 1.2 Applications Intelligent building 2 / 23 2 MODULE INTERFACES Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update 04/14/2021 04/15/2021 This is the rst release. Updated the test data. V1.0.0 V1.0.1 2 Module interfaces 2.1 Dimensions and package The dimensions of CB8P are 13.50.35 mm (W)24.80.35 mm (L) 3.50.17 mm
(H). The dimensions of CB8P are as follows:
3 / 23 2 MODULE INTERFACES 4 / 23 2 MODULE INTERFACES Pin number Symbol I/O type Function 2.2 Pin definition 1 2 3 4 3V3 GND P7 P8 Power supply pin
(3.3V) Ground pin Support hardware PWM Support hardware PWM P P I/O I/O 5 / 23 Pin number Symbol I/O type Function 2 MODULE INTERFACES 5 6 7 8 9 P9 P24 P26 ADC TX1 I/O I/O I/O AI I/O 10 RX1 I/O Support hardware PWM Support hardware PWM Support hardware PWM ADC pin, which corresponds to P23 of the IC User serial interface UART_TX, which corresponds to P11 of the IC User serial interface UART_RX, which corresponds to P10 of the IC Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input interface. 6 / 23 3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Storage temperature Power supply voltage
-55
-0.3 TAMB-25
-4 125 3.9 4 Unit V KV TAMB-25
-200 200 V Ts VBAT Static electricity discharge voltage
(human body model) Static electricity discharge voltage
(machine model) 3.2 Normal working conditions Parameter Description Minimum value Typical value Maximum value Ta
-40
105 Unit VBAT 3 3.3 3.6 V Working tempera-
ture Power supply voltage 7 / 23 3 ELECTRICAL PARAMETERS Parameter Description Minimum value Typical value Maximum value Unit VSS VSS+0.3 V VBAT-0. 3 VBAT V Imax
20 mA VOL VOH I/O low level output I/O high level output I/O drive current 3.3 RF power consumption
6 Working status Mode Rate Transmit power/re-
ceive Average value Peak value
(Typical value)) Transmit 11b 11Mbps
+16dBm 270 Transmit 11g 54Mbps
+15dBm 260 Transmit 11n MCS7
+14dBm 253 Receive 11b 11Mbps Receive 11g 54Mbps Receive 11n MCS 7 Constantly receive Constantly receive Constantly receive 73 75 75 300 280 273 82 82 82 Unit mA mA mA mA mA mA 3.4 Working current 8 / 23 3 ELECTRICAL PARAMETERS Working status, Ta =
25C Average value Maximum value (Typical value) 70 270 Unit mA Working mode Quick network connection state
(Bluetooth ) Quick network connection state (AP) Quick network connection state (EZ) Network connected state Network disconnected state The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is in the hotspot network connection state and the Wi-Fi indicator ashes slowly The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is connected to the network and the Wi-Fi indicator is always on The module is disconnected and the Wi-Fi indicator is always o 80 305 mA 87 380 mA 39 355 mA 70 270 mA 9 / 23 4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.412 to 2.484 GHz Wi-Fi standard IEEE 802.11 b/g/n
(channels 1 to 14) Data transmission rate 11b:
1, 2, 5.5, 11
(Mbps);
Bluetooth LE 5.1 11g:
6, 9, 12, 18, 24, 36, 48, 54
(Mbps);
11n:
HT20 MCS 0 to 7;
11n:
HT40 MCS 0 to 7 Bluetooth LE : 1Mbps Antenna type Onboard PCB antenna 4.2 Wi-Fi transmission performance Parameter Typical value Minimum value Maximum value Unit dBm dBm
Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 54M 16 15
10 / 23 4 RF PARAMETERS Parameter Typical value Minimum value Maximum value 14
-20
20 ppm 4.3 Wi-Fi receiving performance Parameter Typical value Minimum value Maximum value
Average RF output power, 802.11n OFDM Mode MCS7 Frequency error PER<8%, RX sensitivity, 802.11b DSSS Mode 11M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 PER<10%, RX sensitivity, Bluetooth 1M
-88
-74
-72
-93 11 / 23 Unit dBm Unit dBm dBm dBm dBm 5 ANTENNA INFORMATION 4.4 Bluetooth transmission performance Minimum value Typical value Maximum value 150 KHz Unit MHz Mbps dBm Unit dBm dBm dBm dB 2480
20
-23 4.5 Bluetooth receiving performance Parameter Typical value Minimum value Maximum value Parameter Working frequency Air rate Transmit power Frequency error 2402
-20
-150 RX sensitivity
Maximum RF signal input
-10
Inter-
modulation Co-channel suppression ratio
1 6
-93
10 5 Antenna information 5.1 Antenna type CB8P uses the Onboard PCB antenna. 12 / 23 5 ANTENNA INFORMATION 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB. 13 / 23 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions 14 / 23 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 15 / 23 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 Production instructions 1. For the Tuya in-line module, wave soldering is most preferred and manual sol-
dering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours). 2. Wave soldering devices and materials:
16 / 23 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Wave soldering equipment Wave soldering xture Constant-temperature soldering iron Tin bar, tin wire, and ux Thermal proler 3. Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 4. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months have passed since the sealing of the bag. 5. Baking settings:
Temperature: 60C and 5% RH for reel package and 125C and 5%
RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 6. In the whole production process, take electrostatic discharge (ESD) protective measures. 7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering ux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, 17 / 23 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS whether the window and thickness of the wave soldering xture are appropri-
ate, and whether the wave soldering oven temperature curve is appropriate. 6.3 Recommended oven temperature curve and temperature Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260C5C.
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Recommended soldering temperature:
Suggestions on oven temperature curve of wave soldering Preheat temperature 80 to 130 C 36020C Preheat time 75 to 100s Soldering time 3s/point Peak contact time 3 to 5s NA NA Suggestions on manual soldering temperature Soldering temperature 18 / 23 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA 6.4 Storage conditions Storage conditions for a delivered module:
The moisture-proof bag is placed in an environment where the temperature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag. 19 / 23 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 20 / 23 7 MOQ and packaging information 8 APPENDIX-STATEMENT Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton CB8P 4400 Tape reel 1100 4 8 Appendix-Statement FCC Caution: Any changes or modications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device o and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled 21 / 23 8 APPENDIX-STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specic channels and/or operational frequency bands are country dependent and are rmware programmed at the factory to match the in-
tended destination. The rmware setting is not accessible by the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
cation. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-CB8P. The end product must be labeled in a vis-
ible area with the following: Contains Transmitter Module FCC ID: 2ANDL-CB8P. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions 22 / 23 of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 8 APPENDIX-STATEMENT This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 23 / 23