Global Intelligent Platform Product Manual Tuya WB3L Wi-Fi Module Version: 1.0.0 Date: 2019-11-17 No.: 0000000004 1. Product Overview WB3L is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB3L is embedded with a low-power Arm Cortex-M4 microcontroller unit (MCU), 2 MB flash memory, 256 KB static random-access memory (SRAM), and extensive peripherals. WB3L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Embedded low-power 32-bit CPU, which can also function as an application 1.1 Features processor Clock rate: 120 MHz Working voltage: 3.0 V to 3.6 V Peripherals: eight GPIOs Wi-Fi connectivity 802.11b/g/n Channels 1 to 14 at 2.4 GHz WPA and WPA2 security modes Up to +20dBm output power in 802.11b mode STA, AP, and STA+AP working modes WB3L Datasheet EZ and AP net pairing modes for Android and iOS devices Onboard PCB antenna with a gain of 1.2 dBi Working temperature: 20C to +105C Bluetooth Support for Bluetooth 4.0 Maximum output power of +10 dBm Onboard PCB antenna with a gain of 1.2 dBi 1.2 Application Scenarios Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus Hangzhou Tuya Information Technology Co., Ltd. 2 V1.0.0 WB3L Datasheet Change History No. Date Change Description Version After Change 1 2019-11-17 This is the first release. 1.0.0 Hangzhou Tuya Information Technology Co., Ltd. 3 V1.0.0 WB3L Datasheet Contents 1. Product Overview ............................................................................................................ 1 1.1 Features.................................................................................................................. 1 1.2 Application Scenarios ............................................................................................. 2 2. Module Interfaces ............................................................................................................ 6 2.1 Dimensions and Footprint ...................................................................................... 6 2.2 Interface Pin Definition ........................................................................................... 6 2.3 Test Pin Definition ................................................................................................... 8 3. Electrical Parameters ....................................................................................................... 8 3.1 Absolute Electrical Parameters .............................................................................. 8 3.2 Working Conditions ................................................................................................ 9 3.3 RF Current Consumption ..................................................................................... 10 3.4 Working Current ................................................................................................... 10 4. RF Features ................................................................................................................... 11 4.1 Basic RF Features ................................................................................................ 11 4.2 TX Performance ................................................................................................... 11 4.3 RX Performance ................................................................................................... 12 5. Antenna Information ....................................................................................................... 12 5.1 Antenna Type ........................................................................................................ 12 5.2 Antenna Interference Reduction ........................................................................... 12 6. Packaging Information and Production Instructions ...................................................... 13 6.1 Mechanical Dimensions ....................................................................................... 13 6.2 Recommended PCB Layout ................................................................................. 14 6.3 Production Instructions ......................................................................................... 16 6.4 Recommended Oven Temperature Curve ........................................................... 17 6.5 Storage Conditions ............................................................................................... 19 7. MOQ and Packing Information ...................................................................................... 20 8. Appendix: Statement ........................................................................... !
Hangzhou Tuya Information Technology Co., Ltd. 4 V1.0.0 WB3L Datasheet Tables Table 2-1 WB3L interface pins.............................................................................................. 7 Table 2-2 WB3L test pins ...................................................................................................... 8 Table 3-1 Absolute electrical parameters ............................................................................ 8 Table 3-2 Normal working conditions .................................................................................. 9 Table 3-3 Current consumption during constant transmission and receiving .............. 10 Table 3-4 WB3L working current ........................................................................................ 10 Table 4-1 Basic RF features ............................................................................................... 11 Table 4-2 Performance during constant transmission..................................................... 11 Table 4-3 RX sensitivity ....................................................................................................... 12 Figures Figure 2-1 WB3L front and rear views................................................................................. 6 Figure 6-1 WB3L mechanical dimensions ........................................................................ 14 Figure 6-2 Side view ............................................................................................................ 14 Figure 6-3 WB3L pins .......................................................................................................... 14 Figure 6-4 WB3L pin header dimensions ......................................................................... 15 Figure 6-5 Layout of the PCB to which WB3L applies .................................................... 15 Figure 6-6 HIC for WB3L ..................................................................................................... 16 Figure 6-7 Oven temperature curve .................................................................................. 18 Hangzhou Tuya Information Technology Co., Ltd. 5 V1.0.0 WB3L Datasheet 2. Module Interfaces 2.1 Dimensions and Footprint WB3L has two rows of pins with a 20.1 mm pin spacing. The WB3L dimensions (H x W x D) are 2.80.15 mm x 160.35 mm x 240.35 mm. Figure 2-1 shows the WB3L front and rear views. Figure 2-1 WB3L front and rear views 2.2 Interface Pin Definition Hangzhou Tuya Information Technology Co., Ltd. 6 V1.0.0 WB3L Datasheet Table 2-1 WB3L interface pins Pin No. Symbol I/O Type Function RST ADC I/O AI Reset pin, which is disconnected ADC pin, which is connected to the P23 pin on the internal IC EN Input Module enabling pin, which is connected to 3.3 V for normal use P14 I/O Common I/O pin, which is connected to the P14 pin on the internal IC PWM5 I/O Hardware PWM pin, which is connected to the P26 pin on the internal IC PWM4 I/O Hardware PWM pin, which is connected to the P24 pin on the internal IC Hardware PWM pin, which is connected to the P6 pin on the internal IC PWM0 I/O VCC GND P P Power supply pin (3.3 V) Ground pin 10 PWM3 I/O Hardware PWM pin, which is connected to the P9 pin on the internal IC 11 TXD2 I/O UART2_TX, which is connected to the P0 pin on the internal IC 12 P16 I/O Common I/O pin, which is connected to the P16 pin on the internal IC 13 PWM2 I/O Hardware PWM pin, which is connected to the P8 pin on the internal IC 14 PWM1 I/O Hardware PWM pin, which is connected to the P7 pin on the internal IC 15 RXD1 I/O Serial interface receiving pin (UART_RX), which is connected to the P10 pin on the internal IC 16 TXD1 I/O Serial interface transmission pin (UART_TX), which is connected to the P11 pin on the internal IC 1 2 3 4 5 6 7 8 9 Hangzhou Tuya Information Technology Co., Ltd. 7 V1.0.0 Note:
WB3L Datasheet P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin. 2.3 Test Pin Definition Table 2-2 WB3L test pins Pin No. Symbol I/O Type Function TP6 U2_RXD I/O UART2_RX, which is connected to the P1 pin on the internal IC TP2 F_SCK I/O TP3 F_CSN I/O TP4 F_SI I/O TP5 F_SO I/O Clock pin when data is downloaded from the flash memory, which is connected to the P20 pin on the internal IC Command enabling pin when data is downloaded from the flash memory, which is connected to the P21 pin on the internal IC Data input pin when data is downloaded from the flash memory, which is connected to the P22 pin on the internal IC Data output pin when data is downloaded from the flash memory, which is connected to the P23 pin on the internal IC Note:
Test pins are not recommended. 3. Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Value Value Ts Storage 40 105 C Hangzhou Tuya Information Technology Co., Ltd. 8 V1.0.0 WB3L Datasheet Parameter Description Minimum Maximum Unit Value Value temperature Power supply voltage VBAT 3.0 3.6 V Static electricity voltage
(human body model) Static electricity voltage
(machine model) Tamb = 25C N/A 2 Tamb = 25C N/A 0.5 kV kV 3.2 Working Conditions Table 3-2 Normal working conditions Parameter Description Minimum Maximum Unit Value Value Typical Value 40 N/A 105 C Ta VBAT VIL VIH VOL VOH Imax Working temperature Power supply voltage I/O low-level input 3.0 3.3 3.6 0.3 N/A VCC x 0.25 VCC x 0.1 I/O high-level input VCC x 0.75 N/A VCC I/O low-level output N/A N/A I/O high-level output VCC x 0.8 N/A VCC V V V V V I/O drive current N/A N/A 12 mA Hangzhou Tuya Information Technology Co., Ltd. 9 V1.0.0 WB3L Datasheet 3.3 RF Current Consumption Table 3-3 Current consumption during constant transmission and receiving Working Status Parameter Mode Rate TX Power/Receiving 802.11b 11 Mbit/s
+17 dBm TX 802.11g 54 Mbit/s
+13.5 dBm 802.11n MCS7
+13 dBm 802.11b 11 Mbit/s Typical Value Maximum Value Unit 295 266 260 98 354 300 290 100 mA mA mA mA RX 802.11g 54 Mbit/s 98 100 mA 802.11n MCS7 98 100 mA Constant receiving Constant receiving Constant receiving 3.4 Working Current Table 3-4 Working current Working Status (Ta = 25C) Average Maximum Unit Value Value 98 53 60 100 mA 125 mA 170 mA Working Mode Connected EZ AP The module is in EZ mode, and the Wi-Fi indicator blinks quickly. The module is in AP mode, and the Wi-Fi indicator blinks slowly. The module is connected to the network, and the Wi-Fi indicator is steady on. The module is disconnected from the network, and the Wi-Fi indicator is steady off. Disconnected 40 88 mA Hangzhou Tuya Information Technology Co., Ltd. 10 V1.0.0 WB3L Datasheet 4. RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band BT:2.400 GHz to 2.4835 GHz WIFI:2.412 GHz to 2.484 GHz Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14Ch1-11 for US/CA,Ch1-13 for EU/CN) BT standard BT 4.0 Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 HT40 MCS0 to MCS7 Antenna type PCB antenna with a gain of 1.2 dBi 4.2 TX Performance Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Value Maximum Unit 11 Mbit/s N/A 16 N/A dBm 54 Mbit/s N/A 14 N/A dBm MCS7 N/A 12 N/A dBm Frequency error 10 N/A
+10 ppm Hangzhou Tuya Information Technology Co., Ltd. 11 V1.0.0 WB3L Datasheet 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit 11 Mbit/s N/A 85 N/A dBm 54 Mbit/s N/A 72 N/A dBm MCS7 N/A 68 N/A dBm PER < 8%, 802.11b DSSS mode PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode 5. Antenna Information 5.1 Antenna Type WB3L uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. For details about the onboard PCB antenna area on WB3L, see Figure 6-1. Hangzhou Tuya Information Technology Co., Ltd. 12 V1.0.0 WB3L Datasheet 6. Packaging Information and Production Instructions 6.1 Mechanical Dimensions The PCB dimensions (H x W x D) are 2.80.15 mm x 160.35 mm x 240.35 mm. Hangzhou Tuya Information Technology Co., Ltd. 13 V1.0.0 WB3L Datasheet Figure 6-1 WB3L mechanical dimensions Figure 6-2 Side view 6.2 Recommended PCB Layout Figure 6-3 WB3L pins Hangzhou Tuya Information Technology Co., Ltd. 14 V1.0.0 WB3L Datasheet WB3L can be mounted onto a PCB by using an SMT placement machine or through-hole mounted onto the PCB through a pin header. Figure 6-4 shows the pin header dimensions. Figure 6-4 WB3L pin header dimensions Figure 6-5 Layout of the PCB to which WB3L applies Hangzhou Tuya Information Technology Co., Ltd. 15 V1.0.0 WB3L Datasheet 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 6-6 HIC for WB3L package:
hours. 3. Bake a module based on HIC status as follows when you unpack the module
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive Hangzhou Tuya Information Technology Co., Ltd. 16 V1.0.0 WB3L Datasheet
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Hangzhou Tuya Information Technology Co., Ltd. 17 V1.0.0 WB3L Datasheet Figure 6-7 Oven temperature curve Hangzhou Tuya Information Technology Co., Ltd. 18 V1.0.0 WB3L Datasheet 6.5 Storage Conditions Hangzhou Tuya Information Technology Co., Ltd. 19 V1.0.0 WB3L Datasheet 7. MOQ and Packing Information MOQ and packing information Product Model MOQ Packing Method Number of Modules in Number of Reel Each Reel Pack Packs in Each Box WB3L 4000 Carrier tape and reel packing 1000 4 Hangzhou Tuya Information Technology Co., Ltd. 20 V1.0.0 WB3L Datasheet Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional to operating simultaneously with other radio. testing and equipment authorization may be required The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. Hangzhou Tuya Information Technology Co., Ltd. 21 V1.0.0 WB3L Datasheet The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-WB3L.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID:2ANDL-WB3L This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Insteadit should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. Hangzhou Tuya Information Technology Co., Ltd. 22 V1.0.0