WBRG1 Module Datasheet Device Development > Cloud Module > Wi-Fi & BLE Dual Mode Module Version: 20201104 Online Version Contents Contents 1 Product overview 1.1 Features . 1 1.2 Applications . 1 1.3 Change history . 2 2.1 Dimensions and package . 2 2.2 Pin denition . 4 2 Module interfaces 3 Electrical parameters
. 9 3.1 Absolute electrical parameters
. 9 3.2 Normal working conditions 3.3 TX power consumption . 10 3.4 RX power consumption . 11 3.5 Power consumption in working mode . 11 4.1 Basic RF features
. 14 4.2 TX performance . 14 4.3 RX performance . 15 4 RF parameters 5 Antenna 5.1 Antenna type . 17 5.2 Antenna interference reduction . 17 5.3 U.FL RF connector . 19 6 Packaging information and production instructions 6.1 Mechanical dimensions
. 21 6.2 The diagram of PCB packaging . 22 6.3 Mounting requirements . 22 6.4 Storage conditions . 23 6.5 Baking requirements . 24 6.6 Baking settings
. 24 6.7 Recommended oven temperature curve . 25 1 2 9 14 17 21 i 6.8 Storage conditions . 26 7 MOQ and packaging information 8 Appendix: Statement 8.1 Federal Communications Commission (FCC) Declaration of Conformity . 27 8.2 Declaration of Conformity European notice . 29 Contents 27 27 ii 1 PRODUCT OVERVIEW 1 Product overview WBRG1 is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated wireless RF chip (RTL8721CSM) and an external ash chip, with an embedded Wi-Fi network protocol stack and varied library functions. With the maximum CPU clock rate of 200 MHz, WBRG1 also contains a KM4 microcon-
troller unit (MCU), a low-power KM0 MCU, a WLAN MAC, a 1T1R WLAN module, a 4-MB pseudo-static random-access memory (PSRAM), 8-MB ash memory, and rich extensive peripherals. WBRG1 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required. 1.1 Features Embedded low-power 32-bit Cortex-M33 CPU, which can also function as an application processor The maximum clock rate: 200 MHz Working voltage: 3.0V to 3.6V Peripherals: 6 pulse width modulations (PWM), 3 universal asynchronous re-
ceiver/transmitters (UART), 1 inter-IC sound (I2S), 1 packet trac arbitration
(PTA), and 1 audio Wi-Fi/BT connectivity 802.11 b/g/n20/n40 Channels 1 to 14@2.4 GHzCH 1 to 11 for US/CA, and CH 1 to 13 for EU/CN Support WEP, WPA, WPA2, and WPA2 PSK (AES) security modes Support BLE (Bluetooth Low Energy) 5.0 Up to + 20dBm output power in 802.11b mode Support SmartCong and AP network conguration modes for Android and IOS devices Onboard PC antenna and external antenna IPEX connector Working temperature: -20 to 85 1.2 Applications Intelligent building 1 / 29 2 MODULE INTERFACES Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update 10/10/2020 The rst release. V1.0.0 2 Module interfaces 2.1 Dimensions and package WBRG1 has 3 rows of pins with a 1.5 mm pin spacing. As shown in the following g-
ures, the dimensions of WBRG1 are 190.35 mm (W)25.70.35 mm (L) 2.90.1 mm (H). The thickness of the PCB is 0.80.1 mm. 2 / 29 2 MODULE INTERFACES 3 / 29 2 MODULE INTERFACES 2.2 Pin definition 4 / 29 Symbol RTS0 RX0 PA28 I2C_SCL I2C_SDA PB7 PB4 2 MODULE INTERFACES I/O type Function PA 16, which corresponds to Pin 29 and is a serial port Uart0 ow control request-to-send pin PA 19, which corresponds to Pin 32 and Uart0_RX and is the docking serial port of a users MCU PA 28, which corresponds to Pin 38, is a hardware PWM and can be congured as a GPIO PB 5, which corresponds to Pin 45 and can be congured as an I2C or GPIO PB 6, which corresponds to Pin 46 and can be congured as an I2C or GPIO PB7, which corresponds to Pin 47, is a hardware PWM and can be congured as a GPIO PB4, which corresponds to Pin 44, is a hardware PWM and can be congured as a GPIO I/O I/O I/O I/O I/O I/O I/O 5 / 29 Symbol EN GND PRI REQ GNT TX0 CTS0 RX1 TX1 3V3 2 MODULE INTERFACES I/O type Function Enabling pin, which works at the voltage of 3.3V and is pulled up Power supply reference ground PB1, which corresponds to Pin 41 and has the PTA_PRI function PA26, which corresponds to Pin 39 and has the PTA_REQ function PA27, which corresponds to Pin 33 and has the PTA_GNT function PA18, which corresponds to Pin 31 and Uart0_TX and is the docking serial port of a users MCU PA17, which corresponds to Pin 30 and is a serial port Uart0 ow control clear-to-send pin PA13, which corresponds to Pin 26 and Uart1_RX and is the docking serial port of a users MCU PA12, which corresponds to Pin 25 and Uart1_TX and is the docking serial port of a users MCU Power supply pin (3.3V) P P I/O I/O I/O I/O I/O I/O I/O P 6 / 29 AOUTP_L I/O Symbol PA25 PB22 MIC GND MIC1_P Log TX Log Rx PB23 2 MODULE INTERFACES I/O type Function PA 25, which corresponds to Pin 40, is a hardware PWM and can be congured as a GPIO PB 22, which corresponds to Pin 60, is a hardware PWM and can be congured as a GPIO PB31, which corresponds to Pin 65, audios analog output positive electrode (left channel) MIC_GND PA4, which corresponds to Pin 3, the input positive electrode of MIC1, main MIC PA7, which corresponds to Pin 7 and is used to print system logs PA8, which corresponds to Pin8 and is used to print system logs PB23, which corresponds to Pin 61, is a hardware PWM and can be congured as a GPIO I/O I/O I/O I/O I/O I/O I/O 7 / 29 Note: P indicates a power supply pin and I/O indicates an input/output pin. 2 MODULE INTERFACES 8 / 29 3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Storage temperature Power supply voltage
-40
-0.3 TAMB-25
105 3.6 2 Unit V KV TAMB-25
0.5 KV Ts VBAT Static electricity discharge voltage
(human body model) Static electricity discharge voltage
(machine model) 3.2 Normal working conditions Parameter Description Minimum value Typical value Maximum value
-20
85 Unit Ta VCC Working tempera-
ture Power supply voltage 3.0 3.3 3.6 V 9 / 29 Parameter Description Minimum value Typical value Maximum value 3 ELECTRICAL PARAMETERS VIL VIH VOL VOH Imax Cpad IRF IRF IRF IRF
2.4 I/O low level input 2.0 I/O high-level input I/O low level output I/O high level output I/O drive current Input pin capaci-
tance
2 Unit 0.8 V V mA mA
0.4 16 3.3 TX power consumption Symbol Mode Power Average value Peak value
(Typical value) 11b 11Mbps 11b 11Mbps 11g 54Mbps 11g 54Mbps 17 dBm 247 18 dBm 252 15 dBm 177 17.5 dBm 202 10 / 29 272 285 238 280 V V Unit mA mA mA mA 3 ELECTRICAL PARAMETERS Symbol Mode Power Average value Peak value
(Typical value) IRF IRF IRF IRF IRF IRF IRF 11n BW20 MCS7 11n BW20 MCS7 11n BW40 MCS7 11n BW40 MCS7 13 dBm 165 16.5 dBm 192 13 dBm 144 16.5 dBm 166 240 269 236 266 3.4 RX power consumption Symbol Mode Average Value Peak Value
(Typical Value) 11B 11M 11G 54M 11N HT20 MCS7 61 61 61 77 75 77 3.5 Power consumption in working mode Unit mA mA mA mA Unit mA mA mA 11 / 29 3 ELECTRICAL PARAMETERS Working status, TA =
25C Average value Peak value
(Typical value) 57 284 Unit mA 203 392 mA 55 298 mA Working mode Quick network connection state
(Bluetooth ) Quick network connection state (AP) Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is in the fast network connection state and the Wi-Fi indicator ashes slowly The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is connected to the network and the-
indicator is always on Idle state 53 259 mA 12 / 29 3 ELECTRICAL PARAMETERS Working status, TA =
25C Average value Peak value
(Typical value) 56 293 Unit mA Working mode Operation state The module is connected to the network and the WiFi indicator is always on Disconnected state The module is disconnected 58 287 mA Note: The above parameters vary with rmware functions. 13 / 29 4 RF parameters 4.1 Basic RF features 4 RF PARAMETERS Parameter Description Frequency range 2.400 to 2.4835 GHz Wi-Fi standard BLE standard IEEE 802.11b/g/n (channels 1 to 14) BLE 5.0 Data transmission rate 11b: 1, 2, 5.5, and 11 (Mbps) Data transmission rate 11g: 6, 9, 12, 18, 24, 36, 48, and 54
(Mbps) Data transmission rate 11n: HT20 MCS 0 to 7 Data transmission rate 11n: HT40 MCS 0 to 7 Antenna type PCB antenna with a gain of 1.05 dBi 4.2 TX performance TX performance
Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 54M Parameter Typical value Minimum value Maximum value Unit dBm dBm 17.5 14.5
14 / 29 Parameter Typical value Minimum value Maximum value 4 RF PARAMETERS Frequency error
-20
Average RF output power, 802.11n HT20 Mode MCS7 Average RF output power, 802.11n HT40 Mode MCS7 Average RF output power, BLE5.0 EVM@802.11b CCK 11 Mbps Mode 17.5 dBm EVM@802.11g OFDM 54 Mbps Mode 14.5 dBm EVM@802.11n OFDM MCS7 Mode 13.5 dBm 4.3 RX performance RX sensitivity Unit dBm dBm dBm ppm dB
20
-10
-29 dB
-30 dB 13.5 13.5 6.5
15 / 29 Parameter Typical value Minimum value Maximum value 4 RF PARAMETERS
-92
-76
-73
Unit dBm dBm dBm
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 16 / 29 5 ANTENNA 5 Antenna 5.1 Antenna type WBRG1 supports two types of antennas: onboard PCB antenna and external an-
tenna. By default, the onboard PCB antenna is preferred. 5.2 Antenna interference reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. 17 / 29 5 ANTENNA 18 / 29 5 ANTENNA 5.3 U.FL RF connector Parameters of the U.FL RF connector are as below:
19 / 29 5 ANTENNA 20 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions The PCB dimensions are 190.35 mm (W)25.70.35 mm (L) 0.80.15 mm (H). Note: For the PCB frame, the dimensional tolerance is 0.35 mm, and for the thickness of the PCB, the dimensional tolerance is 0.1 mm. 21 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 The diagram of PCB packaging 6.3 Mounting requirements Use an SMT machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the rmware is burned. If not, pack the module again in a vacuum. Note:
Bake the module before mounting components to the module. 22 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Before using SMT, take electrostatic discharge (ESD) protective measures. Do not use SMT to process modules that have been unpacked for more than 3 months, unless they will be seriously oxidized because electroless nickel/im-
mersion gold (ENIG) is used for PCBs. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and consequences. To reduce the reow defect rate, draw 10% of the products for visual inspection and AOI before the rst mounting, to determine the rationality of oven temper-
ature control and component attachment and placement manners. Draw 5 to 10 modules from subsequent batches each hour for visual inspection and AOI. The following equipment or instrument is required:
Instrument/device Description SMT machine Reow soldering machine Automated optical inspection (AOI) equipment Nozzle with a 6 to 8 mm diameter Cabinet oven Anti-static heat-resistant trays Anti-static heat-resistant gloves Baking devices 6.4 Storage conditions Storage conditions for a delivered module are as follows:
23 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS The moisture-proof bag must be placed in an environment where the temper-
ature is below 30C and the relative humidity is lower than 70%. The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed. The package contains a humidity indicator card (HIC). 6.5 Baking requirements Bake a module based on HIC status as follows when you unpack the module pack-
age:
Value read from the HIC Color circle color Operation 30%, 40%, and 50%
All circles are blue 30%
Pink 30% and 40%
All circles are pink 30%, 40%, and 50%
All circles are pink Bake the module for 2 consecutive hours Bake the module for 4 consecutive hours Bake the module for 6 consecutive hours Bake the module for 12 consecutive hours 6.6 Baking settings Parameter Description Baking temperature 1255C 24 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Parameter Description Alarm temperature 130C SMT ready temperature Naturally cooling temperature: < 36C The number of drying times 1 Note: If the module is not soldered within 12 hours after being baked, you need to bake it again. 6.7 Recommended oven temperature curve Perform SMT based on the following reow oven temperature curve. The highest temperature is 245C. The reow oven temperature curve is as below:
25 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.8 Storage conditions 26 / 29 7 MOQ and packaging information 8 APPENDIX: STATEMENT Product Number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton WBRG1 3600 Tape reel 900 4 8 Appendix: Statement 8.1 Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modications not expressly approved by the party responsible for compliance could void the users authority to operate this equip-
ment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are de-
signed to provide reasonable protection against harmful interference in a residen-
tial installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment o and on, the user is encouraged to try to correct the inter-
ference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 27 / 29 8 APPENDIX: STATEMENT Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncon-
trolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be re-
quired to operate simultaneously with other radio. The availability of some specic channels and/or operational frequency bands are country dependent and are rmware programmed at the factory to match the in-
tended destination. The rmware setting is not accessible by the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
cation. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-WBRG1. The nal end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-
WBRG1. This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. 28 / 29 8.2 Declaration of Conformity European notice 8 APPENDIX: STATEMENT Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 29 / 29