WBRU Module Datasheet Version: 20210525 Online Version Contents Contents 1.1 Features . 2 1.2 Applications . 2 2.1 Dimensions and package . 3 2.2 Pin denition . 4
. 9 3.1 Absolute electrical parameters 3.2 Working conditions
. 9 3.3 RF power consumption . 10 3.4 Working power consumption . 11
. 12 4.1 Basic RF features 4.2 TX performance . 13 1 Overview 2 Module interfaces 3 Electrical parameters 4 RF parameters 5 Antenna information 5.1 Antenna type . 15 5.2 Antenna interference reduction . 15 6 Packaging information and production instructions 6.1 Mechanical dimensions
. 16 6.2 Recommended PCB packaging . 20
. 21 6.3 Production instructions 6.4 Recommended oven temperature curve . 23 6.5 Storage conditions . 26 7 MOQ and packaging information 8 Appendix: Statement 2 3 9 12 15 16 27 27 i Contents WBRU is a low-power-consumption embedded Wi-Fi+Bluetooth module that Tuya has developed. Embedded with the Wi-Fi network protocol stack and rich library functions, it consists of a highly integrated RF chip (W701H-VT2-CG). 1 / 29 1 OVERVIEW With the maximum CPU clock rate of 100 MHz, WBRU also contains a low-power-
consumption KM4 MCU, a WLAN MAC, a 1T1R WLAN, a 256-KB SRAM, a 2-MB ash memory, and extensive peripherals. WBRU is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocol. You can develop embedded Wi-Fi products as required. 1 Overview 1.1 Features Embedded low-power-consumption KM4 MCU, which can also function as an application processor Main clock rate: 100 MHz Working voltage: 3.0 to 3.6 V Peripherals: 14 GPIOs, 1 UART, and 1 log transmitter Wi-Fi and Bluetooth connectivity 802.11 b/g/n20 Channels 1 to 14@2.4 GHz (CH1 to 11 for US/CA and CH1 to 13 for EU/CN) Support WEP, WPA, WPA2, and WPA2 PSK (AES) security modes Support Bluetooth Low Energy 4.2 Up to + 20 dBm output power in 802.11b mode Support the SmartCong function for Android and iOS devices Onboard PCB antenna Passed CE and FCC certications Working temperature: -20 to 85 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 / 29 2 MODULE INTERFACES 2 Module interfaces 2.1 Dimensions and package WBRU has 3 rows of pins. The spacing of pins at the two sides is 1.4 mm, and the spacing of pins at the bottom is 1.8 mm. The dimensions of WBRU are 15.80.35 mm (W)20.30.35 mm (L) 2.70.15 mm (H). The dimensions of WBRU are as follows:
3 / 29 2 MODULE INTERFACES 2.2 Pin definition 4 / 29 2 MODULE INTERFACES Pin number Symbol II/O type Function PA8 I/O 1 2 3 4 5 6 GPIOA_8, common GPIO, which can be reused as SPI_SCK and corresponds to Pin 22 of the IC GPIOA_9, common GPIO, which can be reused as SPI_MOSI and corresponds to Pin 23 of the IC GPIOA_2, hardware PWM, correspond to Pin 18 of the IC GPIOA_3, hardware PWM, correspond to Pin 19 of the IC GPIOA_4, hardware PWM, correspond to Pin 20 of the IC GPIOA_15, UART_Log_RXD
(used to receive the external logs of the module), which can be congured as a common GPIO PA9 I/O PA2 PA3 PA4 L_RX I/O I/O I/O I/O 5 / 29 2 MODULE INTERFACES Pin number Symbol II/O type Function L_TX I/O 7 8 9 10 11 12 13 14 PA11 I/O PA12 I/O PA17 I/O PA18 I/O PA19 I/O GND VCC P P 6 / 29 GPIOA_16, UART_Log_TXD
(used to send the internal logs of the module), which can be congured as a common GPIO GPIOA_11, hardware PWM, correspond to Pin 25 of the IC GPIOA_12, hardware PWM, correspond to Pin 26 of the IC GPIOA_17, hardware PWM, correspond to Pin 38 of the IC GPIOA_18, hardware PWM, correspond to Pin 39 of the IC GPIOA_19, hardware PWM, correspond to Pin 40 of the IC Power supply reference ground Power supply pin
(3.3V) Pin number Symbol II/O type Function 2 MODULE INTERFACES GPIOA_14, UART0_TXD (user serial interface) GPIOA_13, UART0_RXD (user serial interface) GPIOA_20, common GPIO, correspond to Pin 1 of the IC Enabling pin, active at the high level. The module has been pulled to the high level and the user can control the pin externally GPIOA_0, not recommend to pull it to the high level. If it is pulled to a high level, it will enter the test mode. Correspond to Pin 15 of the IC 15 16 17 18 TX RX PA20 EN I/O I/O I/O I/O 19 PA0 I/O 7 / 29 Pin number Symbol II/O type Function 20 PA10 I/O 21 PA7 I/O 2 MODULE INTERFACES GPIOA_10, common GPIO, which can be reused as SPI_MISO and corresponds to Pin 24 of the IC GPIOA_7, hardware PWM, which can be reused as SPI_CS and corresponds to Pin 21 of the IC Note: P indicates a power supply pin and I/O indicates an input/output pin. 8 / 29 3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Storage temperature Power supply voltage
-40
-0.3 TAMB-25
125 3.6 2 Unit V KV TAMB-25
0.5 KV Ts VDD Static electricity discharge voltage
(human body model) Static electricity discharge voltage
(machine model) 3.2 Working conditions Parameter Description Minimum value Typical value Maximum value Ta VDD Working tempera-
ture Working voltage
-20 3.0
Unit 85 3.6 V 9 / 29 Parameter Description Minimum value Typical value Maximum value Unit 3 ELECTRICAL PARAMETERS
2 0.8
16 V V 0.4 mA pF VIL VIH VOL VOH Imax Cpad 2.0 2.4
I/O low level input I/O high level input I/O low level output I/O high level output I/O drive current Input pin capaci-
tance 3.3 RF power consumption TX power consumption:
Symbol Mode Power Average value Peak value
(Typical value) IRF IRF IRF 11b 11Mbps 11b 11Mbps 11g 54Mbps 17 dBm 217 18 dBm 231 268 283 15 dBm 159 188 10 / 29 V V Unit mA mA mA 3 ELECTRICAL PARAMETERS Symbol Mode Power Average value Peak value
(Typical value) Unit mA mA mA Unit mA mA mA Unit mA IRF IRF IRF IRF IRF IRF 11g 54Mbps 11n BW20 MCS7 11n BW20 MCS7 17.5 dBm 177 13 dBm 145 16.5 dBm 165 213 167 193 RX power consumption:
Symbol Mode Average value Peak value
(Typical value) 11B 11M 11G 54M 11N HT20 MCS7 63 65 65 65 67 67 Working status, TA =
25C Average value Peak value
(Typical value) 75 324 3.4 Working power consumption Working mode Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi indicator ashes fast 11 / 29 4 RF PARAMETERS Working status, TA =
25C Average value Peak value
(Typical value) 64 314 Unit mA 66 305 mA 66 309 mA Working mode No operation during network connection Operations are being performed during network connection Disconnected state The module is connected to the network and the Wi-Fi indicator is always on The module is connected to the network and the Wi-Fi indicator is always on The module is disconnected and the Wi-Fi indicator is o 4 RF parameters 4.1 Basic RF features Parameter Description Frequency range Wi-Fi standard 2.400 to 2.4835 GHz IEEE 802.11b/g/n (channels 1 to 14) Bluetooth standard Bluetooth 4.2 Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps) Data transmission rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) Data transmission rate 11n: HT20 MCS0 to 7 12 / 29 4 RF PARAMETERS Parameter Description Antenna type PCB antenna with a gain of 1.2 dBi Parameter Typical value Minimum value Maximum value 4.2 TX performance TX performance:
Average RF output power, 802.11b CCK Mode 1M Average RF output power, 802.11g OFDM Mode 54M Average RF output power, 802.11n OFDM Mode MCS7 Average RF output power, Bluetooth 4.2 1M
Frequency error
-20 EVM@802.11b CCK 11 Mbps Mode 17.5 dBm 13.5 dBm Unit dBm dBm dBm ppm dB
20
-10 17.5 14.5 6.5
13 / 29 Parameter Typical value Minimum value Parameter Typical Value Minimum Value Maximum Value 4 RF PARAMETERS Maximum value
-29 Unit dB
-30 dB
-97
-75
-72 Unit dBm dBm dBm
-93 dBm 14 / 29
EVM@802.11g OFDM 54 Mbps Mode 14.5 dBm EVM@802.11n OFDM MCS7 Mode 13.5 dBm RX Performance:
PER<8%, RX sensitivity, 802.11b CCK Mode 1M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 PER<10%, RX sensitivity, Bluetooth 4.2 1M 5 ANTENNA INFORMATION 5 Antenna information 5.1 Antenna type WBRU uses only the onboard PCB antenna with a gain of 1.2 dBi. 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. 15 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions The mechanical dimensions of the PCB of WBRU are 15.80.35 mm (W)20.30.35 mm (L) 1.00.1 mm (H). The following gure shows the mechanical dimensions of WBRU:
16 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 17 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 18 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Note: The default dimensional tolerance is 0.35 mm. If customers have spe-
cic requirements on dimensions, they should make them clear in the module datasheet after communication. 19 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 Recommended PCB packaging The following gure is the schematic diagram of WBRU:
The following gure is the diagram of PCB packaging:
20 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.3 Production instructions 1. For the modules that can be packaged with the SMT or in the in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Other-
wise, it needs to be put into the drying cupboard where the relative humidity is 21 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
(SMT process) SMT devices:
Mounter SPI Reow soldering machine Thermal proler Automated optical inspection (AOI) equipment
(Wave soldering process) Wave soldering devices:
Wave soldering equipment Wave soldering xture Constant-temperature soldering iron Tin bar, tin wire, and ux Thermal proler Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the tem-
perature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag. 3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. 22 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months have passed since the sealing of the bag. 4. Baking settings:
Temperature: 60C and 5% RH for reel package and 125C and 5%
RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the reow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 6.4 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some dierences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements. Manner 1: SMT process (Recommended oven temperature curve of reow soldering) Set oven temperatures according to the following curve. 23 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s perature: 150 to 200C F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s E: Duration of constant temperature: 60 to 120s; the range of constant tem-
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specications. Manner 2: Wave soldering process (Oven temperature curve of wave sol-
dering) Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260C5C. 24 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
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Suggestions on oven temperature curve of wave soldering Preheat temperature Suggestions on manual soldering temperature Soldering temperature 80 to 130 C 36020C Preheat time 75 to 100s Soldering time 3s/point Peak contact time 3 to 5s Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA NA NA 25 / 29 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.5 Storage conditions 26 / 29 7 MOQ and packaging information 8 APPENDIX: STATEMENT Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton WBRU 4400 Tape reel 1100 4 8 Appendix: Statement FCC Caution: Any changes or modications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device o and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled 27 / 29 8 APPENDIX: STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specic channels and/or operational frequency bands are country dependent and are rmware programmed at the factory to match the in-
tended destination. The rmware setting is not accessible by the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
cation. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-WBRU. The end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-
WBRU. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions 28 / 29 of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 8 APPENDIX: STATEMENT This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 29 / 29