WBR3T Module Datasheet Device Development > Cloud Module > WiFi&BT Dual Mode Module Version: 20200812 Online Version Contents Contents 1 Product Overview 1.1 Features . 1 1.2 Applications . 2
. 2 1.3 Change History 2 Information about Labels of WBR3T 3 Module Interfaces
. 4 3.1 Dimensions and Footprint 3.2 Pin Denition . 6
. 9 3.3 Denitions on Test points 4 Electrical Parameters 4.1 Absolute Electrical Parameters
. 10 4.2 Normal Working Conditions . 10
. 11 4.3 TX and RX Power Consumption:
4.4 Working Current . 12 5 RF Parameters 5.1 Basic RF Features . 13 5.2 TX Performance . 14 5.3 RX Performance . 15 6 Antenna Information 6.1 Antenna Type . 17 6.2 Antenna Interference Reduction . 17
. 18 6.3 Treatment of GPIO Pins 7 Packaging Information and Production Instructions 7.1 Mechanical Dimensions . 20 7.2 Side View . 21 7.3 The Schematic Diagram of Packaging . 21 7.4 The Diagram of PCB Packaging-Pin . 22 7.5 The Diagram of PCB Packaging-SMT . 22 1 3 4 10 13 17 20 i
. 23 7.6 Production Instructions 7.7 Recommended Oven Temperature Curve . 24 7.8 Storage conditions . 25 8 MOQ and Packaging Information 9 Appendix-Statement Contents 26 26 ii 1 PRODUCT OVERVIEW 1 Product Overview WBR3T is a low-power embedded WiFi+BLE module that Tuya has developed. It consists of a highly integrated wireless RF chip (RTL8720DN), a few peripherals, an embedded WiFi network protocol stack, the BT network protocol, and varied library functions. WBR3T has an embedded low-power 32-bit CPU, 512-KB static random-
access memory (SRAM), 4-MB ash memory, and rich peripherals. WBR3T is an RTOS platform that integrates all function libraries of the WiFi MAC and TCP/IP pro-
tocols. You can develop embedded WiFi products as required. The functional block diagram of WBR3T is shown as belows:
1.1 Features processor Embedded low-power 32-bit CPU, which can also function as an application The maxium clock rate: 200 MHz Working voltage: 3.30.3V Peripherals: 8 GPIOs, 1 universal asynchronous receiver/transmitter (UART), and 1 analog to digital converter (ADC) WiFi connectivity 802.11 a/b/g/n 1x1, 2.4 G&5 G 1 / 28 1 PRODUCT OVERVIEW Channels 1 to 14 at 2.4 Ghz; channels 36 to 177 at 5 Ghz Support WPA and WPA 2 security modes Up to +17 dBm output power in 802.11b mode; Up to +15 dBm output power in 802.11a mode Support STA/AP/STA+AP working mode Support SmartCong and AP network conguration manners for Android and iOS devices Onboard PCB antenna with a gain of 0 dBi at 2.4G; onboard PCB antenna with a gain of 0.7 dBi at 5.0 G Working temperature: -20 to 105 BLE connectivity Support BLE (V5.0) and the rates of 1 M and 2 M Up to +9 dbm output power PCB antenna with a gain of 0 dBi at 2.4 G, which is shared with WiFi. Working temperature: -20 to 105 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change History Serial Number Update Date Updated Content Version after Update 1 7/13/2020 This is the rst release. V1.0.0 2 / 28 2 INFORMATION ABOUT LABELS OF WBR3T 2 Information about Labels of WBR3T P/N: Module Number Model: Product material code: WBR3T S/N: Production serial number CE: CE certication logo RoHS: RoHS certication logo 3 / 28 3 MODULE INTERFACES 3 Module Interfaces 3.1 Dimensions and Footprint WBR3T has two rows of pins with a 20.1 mm pin spacing. The WBR3T dimensions are 16 mm (W)24 mm (L) 3 mm (H). Diagram of dimensions of WBR3T 4 / 28 3 MODULE INTERFACES Note: The general shape tolerance is 0.3 mm, the position tolerance related to the plug-in assembly is reduced to 0.1 mm, and the tolerance of the 1-mm-thick plate is 0.1 mm. 5 / 28 3.2 Pin Definition 3 MODULE INTERFACES Pin Number Symbol I/O Type Function 1 2 3 RST ADC EN I/O AI I Reset pin ADC(1), which corresponds to PB 3 of IC Enabling pin, which needs to be connected to the voltage of 3.3 V when normally used, and corresponds to CHIP_EN of IC 6 / 28 Pin Number Symbol I/O Type Function 3 MODULE INTERFACES Common IO pin, which corresponds to PA 15 of IC Need to support hardware PWM, which corresponds to PA 13 of IC Need to support hardware PWM, which corresponds to PA 12 of IC Need to support hardware PWM, which corresponds to PA 26 of IC Power supply pin
(3.3 V) Power supply reference ground Common IO pin, which corresponds to PA 25 of IC 4 5 6 7 8 9 10 PA15 I/O PA13 P PA12 I/O PA26 I/O VCC GND PA25 P P O 7 / 28 3 MODULE INTERFACES Pin Number Symbol I/O Type Function 11 LOG_TX O UART0_TXD (used to display the internal information of the module), which corresponds to UART_TXD of IC A common IO pin, which corresponds to PB 20 of IC Need to support hardware PWM and correspond to PB 21 of IC Need to support hardware PWM and correspond to PA 28 of IC UART0_RXD(2), which corresponds to PB 2 of IC UART0_TXD(2), which corresponds to PB 1 of IC 12 13 14 15 16 PB20 I/O PB21 I/O PA28 I/O RXD/PB2 I/O TXD/PB1 I/O 8 / 28 Note: P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. RST is only a reset pin of a module and cannot be used for clearing information about WiFi network conguration.
(1): The pin can only be used as an ADC interface but cannot be used as a common IO 3 MODULE INTERFACES interface. Once not used, it needs to be pulled up. As an ADC input interface, the input voltage range is 0 to 1.0 V. (2): UART0 is a user-side serial interface pin. When a module is enabled, there is information output from the user-side serial interface pin, which can be neglected. 3.3 Definitions on Test points Pin Number Symbol I/O Type Function
TEST I Be used to the production test of the module Note: Test pins are not recommended. 9 / 28 4 ELECTRICAL PARAMETERS 4 Electrical Parameters 4.1 Absolute Electrical Parameters Parameter Description Minimum value Maximum Value Storage temperature Power supply voltage
-20 3.0 TAMB-25
105 3.6 2 Unit V KV TAMB-25
0.5 KV Ts VBAT Static electricity discharge voltage
(human body model) Static electricity discharge voltage
(machine model) 4.2 Normal Working Conditions Parameter Description Minimum value Typical Value Maximum Value Ta
-20
105 Unit VBAT 3.0 3.3 3.6 V Working tempera-
ture Power supply voltage 10 / 28 4 ELECTRICAL PARAMETERS Parameter Description Minimum value Typical Value Maximum Value Unit VCC*0.75 VCC VCC*0.8 VCC VIL VIH VOL VOH Imax IO low-level input
-0.3 IO high-level input IO low-level output IO high-level output IO drive current
4.3 TX and RX Power Consumption:
4.3.1 Transmission and Receiving at 2.4G VCC*0.25 VCC*0.1 V V V V 12 mA Working Status Mode Rate Transmit Power/Re-
ceive Typical Value Transmit 11b 11 Mbps +18 dBm 250 Transmit 11g 54 Mbps +17 dBm 180 Transmit 11n-HT20 MCS 7
+16 dBm 170 Transmit 11n-HT40 MCS 7
+16 dBm 150 Receive 11b 11 Mbps Receive 11g 54 Mbps Constantly receive Constantly receive 70 72 Unit mA mA mA mA mA mA 11 / 28 4 ELECTRICAL PARAMETERS Working Status Mode Rate Receive 11n-HT20 MCS 7 Receive 11n-HT40 MCS 7 Transmit Power/Re-
ceive Typical Value Constantly receive Constantly receive 70 73 4.3.2 Transmission and Receiving at 5G Working Status Mode Rate Transmit Power/Re-
ceive Typical Value Transmit 11a 54 Mbps +15 dBm 300 Transmit 11n-HT20 MCS 7
+15 dBm 230 Transmit 11n-HT40 MCS 7
+14 dBm 220 Receive 11a 54 Mbps Constantly receive Constantly receive Constantly receive 71 72 76 Receive 11n-HT20 MCS 7 Receive 11n-HT40 MCS 7 4.4 Working Current Unit 80 80 Unit mA mA mA mA 80 80 mA mA mA mA 12 / 28 5 RF PARAMETERS Working Status, Ta =
25 Average Value Maximum Value (Typical Value) 57 184 Unit mA Working Mode Quick connection network state Hotspot network conguration state Network connection operation state Disconnected state The module is in the fast network connection state and the WiFi indicator always ashes The module is in the hotspot network conguration state and the WiFi indicator ashes slowly The module is connected to the network and the WiFi indicator is always on The module is disconnected and the WiFi indicator is dark 5 RF Parameters 5.1 Basic RF Features 203 392 mA 55 98 mA 53 59 mA 13 / 28 5 RF PARAMETERS Parameter Description Working frequency 2.412 to 2.484 GHz; 5.180 to 5.885 Antenna type PCB antenna with a gain of 0 dBi at 2.4 GHz BT2.4000 to 2.4835GHZ IEEE 802.11 a/b/g/n (Channels 1 to 14;
channels 36 to 177) 11b: 1, 2, 5.5, 11 (Mbps); 11 a/g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n:
HT20 MCS 0 to 7; HT40 MCS 0 to 7 G &BT; PCB antenna with a gain of 0.7 dBi at 5 G Parameter Typical Value Minimum Value Maximum Value WiFi standard Data transmission rate 5.2 TX Performance 2.4 G TX Performance
Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 54M Average RF output power, 802.11n HT20 Mode MCS7 Unit dBm dBm dBm 17 16 15
14 / 28 Unit dBm Unit dBm dBm dBm Parameter Typical Value Minimum Value Maximum Value 5 RF PARAMETERS
-10
10 ppm Parameter Typical Value Minimum Value Maximum Value
Average RF output power, 802.11n HT40 Mode MCS7 Frequency error 5G-TX Performance Average RF output power, 802.11a OFDM Mode 54M Average RF output power, 802.11n HT20 Mode MCS7 Average RF output power, 802.11n HT40 Mode MCS7 Frequency error 5.3 RX Performance RX sensitivity 14 15 14 13
15 / 28
-10
10 ppm Parameter Typical Value Minimum Value Maximum Value 5 RF PARAMETERS
-91
-75
-72
Unit dBm dBm dBm
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M PER<10%, RX sensitivity, 802.11a/g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode HT20-MCS7 16 / 28 6 ANTENNA INFORMATION 6 Antenna Information 6.1 Antenna Type WB8P uses only an onboard PCB antenna. 6.2 Antenna Interference Reduction To ensure optimal WiFi performance when the WiFi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To ensure the antenna performance, the PCB should not be routed or clad with copper in the antenna area. The main points of the layout: 1. Make sure that there is no substrate medium directly below or above the printed antenna. 2. Make sure that the area around the printed antenna is far away from the metal copper skin, so as to ensure the radiation eect of the antenna to the greatest extent. 17 / 28 6 ANTENNA INFORMATION For the antenna area of the PCB of the module, refer to Diagram of Mechanical Dimensions. 6.3 Treatment of GPIO Pins A few pins (PA 12, PA 13, PA 15, PA 25, PA 28, and PA 26) of the module will have instantaneous high-level pulses before the chip fully works, and everything will be normal after the chip works. For these pins, if they are directly used as driving light sources or relays, in order to avoid the eect of burrs at the moment of powering on, refer to the following processing methods: Pull down a 1-K resistor at an output port of a pin, and then connect a diode in series. At this time, the voltage of a GPIO 18 / 28 6 ANTENNA INFORMATION will drop to about 2.7V after passing through the diode. The red box represents the original drive tube on the customers baseboard. A diode D1 and pull-down 1-K resistor need to be added. If a lamp is directly driven, pull down a 10-K resistor on the grid of the positive Mos. If a lamp is not directly driven and a PWM signal will not be sent until the module is ocially launched, there is no need to add a pull-down resistor and diode. If a relay is driven, you can change the diode to a resistor of 0 ohm according to the actual situation. 19 / 28 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 7 Packaging Information and Production Instructions 7.1 Mechanical Dimensions The WBR3T dimensions are 16 mm (W)24 mm (L) 2.8 mm (H). 20 / 28 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 7.2 Side View Note: The default dimensional tolerance is 0.3 mm. ments on dimensions, make them clear in the datasheet after communication. If you have specic require-
7.3 The Schematic Diagram of Packaging 21 / 28 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 7.4 The Diagram of PCB Packaging-Pin WBR3T can use SMT. 7.5 The Diagram of PCB Packaging-SMT 22 / 28 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 7.6 Production Instructions 1. Tuyas stamp hole package module must be mounted by SMT machine within 24 hours after unpacking and programming of rmware. Otherwise, it must be packaged again under vacuum. The module must be baked before mounting. A. SMT equipment a) Reow soldering machine b) Automated optical inspection (AOI) equipment c) Nozzle with a 6 mm to 8 mm diameter B. Baking equipment d) Cabinet oven e) Anti-static heat-resistant trays f) Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows: A. The moisture-proof bag must be placed in an environment where the temperature is below 30 and the relative humidity is lower than 70%. B. The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed. C. The package contains a humidity indicator card (HIC). 3. Bake a module based on HIC status as follows when you unpack the module package: A. If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. B. If the 30% circle is pink, bake the module for 4 con-
secutive hours. C. If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. D. If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings: A. Baking temperature: 125 B. Alarm temperature: 130 C. SMT ready temperature after natural cooling: < 36 D. The number of drying times: 1 E. Rebaking condition: The module is not soldered within 12 hours after baking 5. Do not use SMT to process modules that have been unpacked for more than 3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs 23 / 28 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS and they are seriously oxidized after more than 3 months. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and consequences. 6. Before SMT, take electrostatic discharge (ESD) protective measures. 7. To reduce the reow defect rate, draw 10% of the products for visual inspection and AOI before the rst SMT mounting to determine proper methods for con-
trolling the oven temperature and attaching and placing components. Draw 5 to 10 modules from subsequent batches each hour for visual inspection and AOI. 7.7 Recommended Oven Temperature Curve Perform SMT based on the following reow oven temperature curve. The highest temperature is 245. The reow temperature curve is shown as belows:
24 / 28 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 7.8 Storage conditions 25 / 28 8 MOQ and Packaging Information 9 APPENDIX-STATEMENT Product Number MOQ(pcs) Shipping packaging method The number of modules per reel (pcs) The number of reels per carton (reel) WBR3T 4000 Tape reel 1000 4 9 Appendix-Statement FCC Caution: Any changes or modications not expressly approved by the party responsible for compliance could void the users authority to operate this equip-
ment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are de-
signed to provide reasonable protection against harmful interference in a residen-
tial installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment o and on, the user is encouraged to try to correct the inter-
ference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement 26 / 28 9 APPENDIX-STATEMENT This equipment complies with FCC radiation exposure limits set forth for an uncon-
trolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio. The availability of some specic channels and/or operational frequency bands are country dependent and are rmware programmed at the factory to match the in-
tended destination. The rmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certication. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID: 2ANDL-WBR3T. The nal end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-
WBR3T. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice 27 / 28 9 APPENDIX-STATEMENT Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20 cm to the human body. 28 / 28